JP2013207228A - Circuit board for high power monitoring device of plant equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent cracking at a base end of a cantilever-like part caused by a slit formed for securing a creepage distance, in a circuit board for a high power monitoring device of plant equipment.SOLUTION: A support part of a cantilever flat plate part 30 surrounded by a slit 26 is provided with a low-rigidity part 32 from which copper foil 3 is removed. The copper foil 3 exists between the row-rigidity part 32 and the cantilever flat plate part 30 continuing to the copper foil 3 at the cantilever flat plate part 30. This structure does not concentrate stress caused by deflection of the cantilever flat plate part 30 by vibration thereof only to the base end but disperses the stress also to the low-rigidity part 32. Therefore, cracking and/or breaking at the base end of the cantilever flat plate part 30 can be prevented for long period of time.

Description

  The present invention relates to a board of a high power monitoring device that monitors power consumption of factory equipment.

In a high power monitoring device that monitors power of factory equipment, for example, a programmable logic controller (PLC), power consumption is calculated based on the voltage detected by the voltage detection unit and the current detected by the current detection unit. In the voltage detector, the input high voltage is stepped down by a resistor, and the input voltage is measured by detecting the stepped down voltage by a detection circuit.
A high voltage conductive path and a low voltage conductive path are formed on the substrate used for the voltage detection unit, and the high voltage conductive path is connected to a high voltage terminal and a resistance of a terminal block to which a high voltage power source wire is connected. The low-voltage conductive path connects between the other connection terminal of the resistor and the detection circuit.

  There is a large potential difference between the high-voltage conductive path and the low-voltage conductive path, and a predetermined spatial distance and a predetermined creepage distance are ensured for electrical insulation therebetween. In this case, the creeping distance is ensured by surrounding the resistor side portion of the low-voltage conductive path with a slit, and an increase in the size of the substrate is avoided.

  Patent Document 1 discloses a force sensor chip having a field different from that of the present invention, including an action part on which an external force acts, a support part that supports the action part, and a connecting part that connects the action part and the support part. It is disclosed that a chip is formed by providing a slit.

JP 2008-58106 A

  In the substrate of the voltage detection unit, when the resistor side portion of the low voltage conductive path is surrounded by a slit, the portion surrounded by the slit becomes a cantilever shape. In a factory where a PLC is installed, various mechanical devices are installed in addition to the mechanical device controlled by the PLC. Therefore, it is inevitable that the PLC is affected by vibrations of the mechanical devices.

  When the vibration of the mechanical device is transmitted to the PLC, the resistor vibrates together with the cantilever-shaped portion surrounded by the slit in the above-described substrate. Because of this vibration, the cantilevered part bends in the front and back direction with the base as a fulcrum, so if you use it for a long time, the base end of the cantilevered part where stress is concentrated may crack. The cantilevered part breaks at the base end. As a result, a crack occurs in the middle of the low-voltage conductive path and accurate voltage detection cannot be performed, or the middle of the low-voltage conductive path is cut off, resulting in a disconnection state and voltage detection cannot be performed.

  In addition, in Patent Document 1, when an external force is applied to the action portion, the support portion and the connection portion that connects the action portion and the support portion bend, but this bending causes a crack at the base end of the connection portion. No mention is made of any means for avoiding cracks.

  The present invention has been made in view of the above circumstances, and its purpose is to provide a substrate for a high-power monitoring device of a factory facility that can prevent cracks from entering the base end of a cantilevered portion by forming a slit. Is to provide.

  According to the first aspect of the present invention, the metal conductive layer is removed at a portion supporting the cantilever-shaped portion surrounded by the formation of the slit, and the portion between the base end of the cantilever-shaped portion is the cantilever-shaped portion. Since the low rigidity portion separated by the metal conductive layer continuous to the metal conductive layer is provided, the bending of the portion due to the vibration of the cantilevered portion occurs not only at the base end but also at the low rigidity portion. For this reason, the stress due to bending caused by vibration is not concentrated only at the base end of the cantilevered part, but also distributed to the low-rigidity part. It is possible to prevent the base end from cracking and the cantilever-like portion from being broken at the base end.

  According to a second aspect of the present invention, the resistor land of the cantilevered portion is located away from the direction perpendicular to the straight line connecting both ends of the slit existing on both sides of the base end of the cantilevered portion. In this case, the torsional moment acts on the base end of the cantilevered portion due to vibration, but the low-rigidity portion is formed so that the side where the resistor land is located is longer than the opposite side. The low-rigidity part effectively absorbs the torsional moment and effectively prevents the base end of the cantilevered part from being damaged. Further, since the low-rigidity portion is rectangular and the side where the resistor land is located is longer than the opposite side, the vertical width can be shortened instead of increasing the lateral width of the low-rigidity portion. For this reason, it is possible to secure a wide area on the opposite side of the cantilevered portion of the metal conductive layer around the low-rigidity portion, and to provide a conductive path required for the substrate using the metal conductive layer in that area. It becomes possible to form.

The top view of the principal part of the board | substrate which shows the 1st Embodiment of this invention Partial cross-sectional view of the board with terminal block and resistors attached Plan view of substrate Top view of the board with terminal block and resistors attached FIG. 1 equivalent diagram showing a second embodiment of the present invention FIG. 1 equivalent view showing a third embodiment of the present invention FIG. 1 equivalent view showing a fourth embodiment of the present invention FIG. 1 equivalent view showing a fifth embodiment of the present invention

Hereinafter, the present invention will be described with reference to embodiments.
(First embodiment)
A first embodiment of the present invention will be described with reference to FIGS. FIG. 3 shows a substrate 1 mounted inside a programmable logic controller (PLC) as factory equipment. The substrate 1 is used as a substrate of a voltage detection unit of a high power monitoring device that monitors power supplied to a machine device that is a PLC control target.

  The substrate 1 is formed by attaching a copper foil 3 as a metal conductive layer on the surface of an insulating plate 2 made of, for example, glass epoxy, and an unnecessary portion of the copper foil 3 is removed by, for example, etching to form a required wiring pattern. Formed. In the following description, the four sides of the substrate 1 are referred to as a first side a, a second side b, a third side c, and a fourth side d in the clockwise direction from the upper side in the drawing.

  In the present embodiment, as the wiring pattern of the substrate 1, the four high voltage conductive paths 4 to 7 provided in the portion near the central first side a and the third side from the portion near the central third side c Four low voltage conductive paths 8 to 11 extending to near c and one ground conductive path 12 extending from the central portion near the first side a to near the third side c are formed. Further, a copper foil 3 having a predetermined width is left in an L shape from the third side c of the substrate 1 to the adjacent fourth side d, and this copper foil 3 is used as a ground.

  Among these wiring patterns, the high-voltage conductive paths 4 to 7 have a “<” shape with a relatively short length, one end of which is a terminal block land 4a to 7a, and the other end is a resistor land 4b. To 7b. One end of the ground conductive path 12 is a terminal block land 12a, and the other end is a circuit land 12b.

  The low voltage conductive paths 8 to 11 are formed apart from the high voltage conductive paths 4 to 7 by a predetermined distance (space distance necessary for safety) or more. One ends of the low voltage conductive paths 8 to 11 on the high voltage conductive paths 4 to 7 side are resistor lands 8a to 11a, and the other ends on the third side c side are circuit lands 8b to 11b. . The terminal block lands 4a to 7a and resistor lands 4b to 7b of the high voltage conductive paths 4 to 7, the terminal block lands 12a and circuit lands 12b of the ground conductive path 12, and the low voltage conductive paths 8 to 11 As shown in FIG. 2, through holes 13 are formed in the resistor lands 8a to 11a and the circuit lands 8b to 11b, respectively. Copper plating 14 is applied to the inner surface of each through hole 13 and the periphery of the through hole 13 on the back side of the substrate 1. In FIG. 2, a portion including the high voltage conductive path 4 and the low voltage conductive path 8 is shown, but is shown in an expanded state.

In the present embodiment, a three-phase five-wire AC power supply is used as a voltage detection target power supply. The three-phase five-wire AC power supply has five wires of a three-phase three-wire, a neutral wire, and a ground conductor, and these five wires are attached to the terminal block 15 shown in FIG.
The terminal block 15 has five terminal receivers 16a to 16e on one side surface and five output terminals (high voltage terminals) 17a to 17e protruding in an L shape from the other side surface. 17a to 17e are electrically connected to the terminal receivers 16a to 16e.

The terminal block 15 is arranged on the first side a side of the surface of the substrate 1 and is fixed to the first side a side of the substrate 1 by two fixing screws 18 and a fixing nut 19 shown in FIG. As shown in FIG. 3, the substrate 1 is formed with two through holes 1a through which the fixing screws 18 are passed. A fixing nut 19 is screwed into the fixing screws 18 passed through the through holes 1a. It is worn.
When the terminal block 15 is arranged on the surface of the substrate 1, its output terminals 17 a to 17 e are through holes 13 of the terminal block lands 4 a to 7 a of the high voltage conductive paths 4 to 7 and the terminal block lands 12 a of the ground conductive path 12. Passed through. The front end portions of the output terminals 17 a to 17 e protruding to the back side of the substrate 1 are electrically and mechanically connected to the copper plating 14 around the through hole 13 by solder 20 on the back surface of the substrate 1.

  And in each terminal receptacle 6a-6e of the terminal block 15, the three-phase 3 wire of an AC power supply, a neutral wire, and a grounding conductor are each fixed by the terminal screw 15a. At this time, a three-phase three-wire is fixed to the three terminal receivers 16a to 16c on the left side of the figure, a neutral wire is fixed to the second terminal receiver 16d from the right side, and a ground conductor is connected to the rightmost terminal receiver 16e. Each is fixed. Accordingly, the three high-voltage conductive paths 4 to 7 of the substrate 1 are connected to the three-phase three-wires and the neutral lines of the AC power supply, respectively, and the ground conductors 12 are connected to the ground conductor of the AC power supply. It is in a state.

The high voltage conductive paths 4 to 7 and the low voltage conductive paths 8 to 11 are connected by resistors 22 respectively. That is, as shown in FIG. 2, one connection terminal 22a of the three resistors 22 is inserted into the through hole 13 of the resistor lands 4b to 7b of the high voltage conductive paths 4 to 7 and the other connection terminal. 22 b is inserted into the through holes 13 of the resistor lands 8 a to 11 a of the low voltage conductive paths 8 to 11, and the tip portions of the connection terminals 22 a and 22 b protruding to the back side of the substrate 1 are formed in the through holes 13 on the back surface of the substrate 1. Are fixed to the copper plating 14 around the periphery of the substrate with solder 23. Accordingly, the voltages of the three-phase three-wire and the neutral wire of the three-phase AC power supply are stepped down by the resistor 22 and applied to the low-voltage conductive paths 8-11.
The circuit lands 8b to 11b of the low voltage conductive paths 8 to 11 and the circuit land 12b of the ground conductive path 12 are connected to a voltage detection circuit (not shown) so that the voltage of the three-phase AC power supply is detected. Yes.

  By the way, in the board | substrate 1, since a high potential difference arises between the high voltage conductive paths 4-7 between the high voltage conductive paths 7 and the ground conductive paths 12, for safety, the creepage distance according to the potential difference Need. Of these, regarding the spatial distance between the high-voltage conductive paths 4 to 7 and the spatial distance between the high-voltage conductive path 7 and the ground conductive path 12, by setting their distances to be larger than the required dimensions, Necessary clearance is secured. Regarding the creepage distance between the high-voltage conductive paths 4 to 7 and the creepage distance between the high-voltage conductive path 7 and the ground conductive path 12, the substrate 1 is connected to the high-voltage conductive paths 4 to 7 and the high voltage. By forming slits 24a to 24d positioned between the conductive path 7 and the ground conductive path 12, a creeping distance necessary for safety is secured.

Further, in the substrate 1, since a high potential difference is generated between the high voltage conductive paths 4 to 7 and the low voltage conductive paths 8 to 11, the high voltage conductive paths 4 to 7 and the low voltage conductive paths 8 to 11 A safety clearance and creepage distance are required between the two.
In the present embodiment, the resistor lands 4b to 7b of the high voltage conductive paths 4 to 7 are provided closer to the first side a of the substrate 1 than the terminal block lands 4a to 7a. As a result, the distance between the high-voltage conductive paths 4 to 7 and the low-voltage conductive paths 8 to 11 is shortened so that the substrate 1 can be reduced in size. However, the connection terminals 22a at both ends of the resistor 22 are used. , 22b exceeds the necessary spatial distance, a safety-necessary spatial distance is ensured between the high voltage conductive paths 4-7 and the low voltage conductive paths 8-11.
About the creeping distance between the high voltage conductive paths 4 to 7 and the low voltage conductive paths 8 to 11, the slit 24 a is formed on the substrate 1 between the high voltage conductive paths 4 to 7 and the low voltage conductive paths 8 to 11. One slit 25 is formed so as to connect one end of ˜24d.

  Further, in order to ensure a necessary creepage distance between the high voltage conductive paths 4 to 7 and the low voltage conductive paths 8 to 11, the substrate 1 has a resistor land 8a to 11a of the low voltage conductive paths 8 to 11. Slits 26 to 29 are formed to surround one end side where the is formed. Here, the low voltage conductive paths 8 to 11 and the slits 26 to 29 will be described. Since the low voltage conductive paths 8 to 11 and the slits 26 to 29 have the same configuration, the low voltage conductive line on the left side is shown in FIG. The conductive path 8 and the slit 26 will be described, and the description of the other low-voltage conductive paths 9 to 11 and the slits 27 to 29 will be omitted.

First, the shape of the low-voltage conductive path 8 will be described. The portion on the side of the resistor land 8a has a “U” shape, extends linearly from the U-shaped portion toward the third side c of the substrate 1, The straight portion is bent at a right angle and extends linearly toward the fourth side d, and is bent at a right angle from the straight portion to the circuit land 8b near the third side c.
The U-shaped portion of the low voltage conductive path 8 is a U-shaped conductive path 8c, the portion extending linearly toward the next third side c is a first linear conductive path 8d, and the first linear conductive path 8d. The portion extending linearly from the second side d toward the fourth side d is the second linear conductive path 8e, and the linear portion extending from the second linear conductive path 8e to the circuit land 8b is the third linear conductive path. It shall be called 8f.

  With respect to the low voltage conductive path 8, the slit 26 is formed so as to surround a portion from the resistor land 8a through the U-shaped conductive path 8c to the tip of the first linear conductive path 8d. The slit 26 is continuous from one end to the other end, and has a branching slit 26 a that enters the inside of the U-shaped conductive path 8 c of the low voltage conductive path 8 in the middle.

  Thus, by forming the U-shaped conductive path 8 c in the low voltage conductive path 8, the length of the slit 26 surrounding the low voltage conductive path 8 is increased. Therefore, as described above, by providing the resistor land 4b closer to the first side a of the substrate 1 than the terminal block land 4a, the distance between the high voltage conductive path 4 and the low voltage conductive path 8 is increased. The shortage of creepage distance due to the miniaturization of the substrate 1 is made to be short.

  A portion surrounded by the slit 26 becomes a cantilever-like portion connected to the substrate 1 at a portion between both ends 26 b and 26 c of the slit 26. Hereinafter, this cantilever portion is referred to as a cantilever flat plate portion 30. On the surface of the cantilever flat plate portion 30, a copper foil 3 continuous with the copper foil 3 constituting the ground is stretched. And the copper foil 3 in this cantilever flat plate part 30, the copper foil 3 which comprises a ground, and the low voltage conductive path 8 are isolate | separated by the peeling part 31 formed between both. The peeling portion 31 is a narrow and narrow portion where the copper foil 3 is removed by etching or the like.

  Now, in the copper foil 3 which comprises a ground, the low rigidity part 32 is formed in the site | part (support part) which supports the cantilever flat plate part 30. As shown in FIG. The low-rigidity portion 32 is a portion where the copper foil 3 is removed by etching or the like, and also functions as a part of the peeling portion 31 that separates the low-voltage conductive path 8 from the copper foil 3 in this embodiment.

  The low-rigidity portion 32 has a rectangular shape and is separated from the base end of the cantilever flat plate portion 30 (a straight line connecting both ends 26b and 26c of the slit 26) to the third side c side of the substrate 1 by a required dimension. Between the base end of the portion 30, the copper foil 3 in the cantilever plate portion 30 (including the U-shaped conductive path 8 c and the first linear conductive path 8 d of the low voltage conductive path 8) is continuous. Copper foil 3 (including the tip of first linear conductive path 8d and second linear conductive path 8e) is present. For this reason, the low-rigidity portion 32 from which the copper foil 3 is removed has rigidity compared to the base end of the cantilever flat plate portion 30 where the copper foil 3 exists (the straight portion connecting the ends 26b and 26c of the slit 26). It is a low part.

Next, the operation of the above configuration will be described. Again, since the operation of the portion (cantilever plate portion 30) surrounded by each of the slits 26 to 29 is the same, the cantilever plate portion 30 of the left low voltage conductive path 8 will be described below. Will not be described.
It is assumed that vibrations of surrounding mechanical devices are transmitted to the substrate 1 during actual use of the substrate 1. Then, the resistor 22 vibrates due to the vibration of the substrate 1, and the tip end portion (resistor land 8 a portion) of the cantilever flat plate portion 30 vibrates together with the resistor 22. Due to the vibration of the distal end portion of the cantilever flat plate portion 30, the cantilever flat plate portion 30 is repeatedly bent in the front and back direction of the substrate 1 with the base end as a fulcrum.

  At this time, if there is no low-rigidity portion 32 and the copper foil 3 is continuously present from the cantilever flat plate portion 30 to the third side c of the substrate 1, the first end of the substrate 1 from the base end of the cantilever flat plate portion 30 is assumed. The rigidity up to 3 sides c becomes uniform. For this reason, when the cantilever flat plate portion 30 vibrates, the base end of the cantilever flat plate portion 30 is repeatedly bent in the front and back directions of the substrate 1, but the bending tends to occur only at the base end of the cantilever flat plate portion 30, The stress concentrates on the base end of the cantilever flat plate portion 30 and fatigues early.

  On the other hand, in this embodiment, the low rigidity part 32 exists in the support part of the cantilever flat plate part 30, and the copper foil 3 existing between the low rigidity part 32 and the base end of the cantilever flat plate part 30 is It is continuous with the copper foil 3 of the cantilever plate portion 30. For this reason, the rigidity of the part from the cantilever flat plate part 30 to the low rigidity part 32 is higher than that of the low rigidity part 32, and the integration tendency of the part from the base end of the cantilever flat plate part 30 to the low rigidity part 32 is strong. Become. When the cantilever flat plate portion 30 bends in the front and back direction of the substrate 1 with the base end as a fulcrum in accordance with the vibration of the cantilever flat plate portion 30, a portion from the base end of the cantilever flat plate portion 30 to the low rigidity portion 32 is obtained. Bends together with the base end of the cantilever plate 30.

  Then, since the integration tendency of the part from the base end of the cantilever flat plate part 30 to the low-rigidity part 32 is strong, the deflection is not concentrated only on the base end of the cantilever flat plate part 30, but the flexure. Is transmitted to the low-rigidity portion 32, and the stress accompanying the bending is not concentrated on the proximal end of the cantilevered plate portion 30 but is distributed to the low-rigidity portion 32. For this reason, it is possible to prevent a problem that cracks or the like are generated at the base end of the cantilever flat plate portion 30 at an early stage. Rather, since there is no copper foil 3, the low rigidity portion 32 having low rigidity and low strength is more fatigued. It becomes easy to do.

  As a result, when used for a long period of time, the low-rigidity portion 32 is fatigued first rather than the base end of the cantilever flat plate portion 30. Even if a crack occurs in the low-rigidity portion 32, the low-voltage conductive path 8 does not pass through the low-rigidity portion 32. Therefore, there is no possibility that the low-voltage conductive path 8 will be damaged, and the voltage detection function has no effect. There is no risk of disruption.

(Second Embodiment)
FIG. 5 shows a second embodiment of the present invention. The difference between the second embodiment and the first embodiment is that the portion of the low voltage conductive path 8 after the first linear conductive path 8d to the circuit land 8b is symmetrical. It is in place.
That is, following the first linear conductive path 8d, a “B” -shaped R-shaped conductive path 8g surrounding the low-rigidity portion 32 is formed, and the portion on the third side c side of this R-shaped conductive path 8g Is connected to the circuit land 8b by a fourth linear conductive path 8h. The same applies to the other low-voltage conductive paths 9 to 11.

(Third embodiment)
FIG. 6 shows a third embodiment of the present invention. The third embodiment is different from the first embodiment in that the low voltage conductive path 8 is not provided separately in the copper foil 3 of the cantilever plate 30 but the copper of the cantilever plate 30. The entire foil 3 is located as a low voltage conductive path 8. In addition, each part of the low-voltage conductive path 8 is attached with the reference numerals used in the first embodiment, and a specific description is omitted.

(Fourth embodiment)
FIG. 7 shows a fourth embodiment of the present invention. In the fourth embodiment, the entire copper foil 3 of the cantilever plate portion 30 is formed as a low voltage conductive path 8 as in the third embodiment. The difference from the third embodiment is that the low voltage A portion of the conductive path 8 from the base end of the cantilever flat plate portion 30 to the circuit land 8b is symmetric. In addition, each part of the low-voltage conductive path 8 is attached with the reference numerals used in the second embodiment, and a specific description is omitted.

(Fifth embodiment)
FIG. 8 shows a fifth embodiment of the present invention. In the fifth embodiment, the cantilever flat plate portion 30 is formed in an L shape, and the resistor land 8 a of the low-voltage conductive path 8 existing at the tip of the cantilever flat plate portion 30 is the base of the cantilever flat plate portion 30. Positioned away from the direction perpendicular to the straight line connecting both ends 26a, 26b of the slit 26 on both sides of the end (indicated by the vertical line H at the center in the width direction of the base end) in the lateral direction (leftward in the figure) Yes.

  When the resistor land 8a exists at a position laterally away from the vertical line H as described above, when the tip end of the cantilever plate 30 is vibrated together with the resistor 22, the base end of the cantilever plate 30 is The substrate 1 is repeatedly bent in the front and back direction around the edge, and the bending is repeated so that the moment in the direction of twisting the base end acts to twist about the vertical line H, and this twist is the resistor land 8a side. It will be greatly generated by.

  On the other hand, the low-rigidity portion 32 has a rectangular shape that extends from the base end of the cantilever flat plate portion 30 to both sides in the horizontal direction, as in the first to fourth embodiments. It is formed in a rectangular shape such that the side where the land 8a exists is longer than the opposite side. That is, the low-rigidity portion 32 extends from the vertical line H to the resistor land 8a side by L1 and extends to the opposite side by L2, but L1 is longer than L2.

  Thus, if the lateral width is the low rigidity portion 32 defined by L1> L2, even if the base end of the cantilever flat plate portion 30 is repeatedly bent so as to be twisted about the vertical line H, the twist is the low rigidity portion. Even if the twist is absorbed by the resistor land 8a in the base end of the cantilever flat plate portion 30, the relatively large twist on the resistor land 8a side is reduced. 32 can be effectively absorbed by the portion (L1 portion) on the side of the resistor land 8a which is longer, and damage to the base end due to twisting can be effectively prevented.

Further, if the low-rigidity portion 32 has a certain area, there is a dispersion effect on the low-rigidity portion 32 with respect to the bending of the cantilever flat plate portion 30. For this reason, for example, if the lateral width L of the low-rigidity portion 32 in the first embodiment is equivalent to twice L2, in this embodiment, L1> L2, so the vertical width L3 of the low-rigidity portion 32 is Can be shortened. A low-rigidity portion having a lateral width L equivalent to twice L2 is indicated by a two-dot chain line S.
Therefore, since the copper foil 3 around the low-rigidity portion 32 can ensure a wide area on the opposite side to the cantilever plate portion 30 (area between the low-rigidity portion 32 and the third side c), the area By using the copper foil 3, a necessary conductive path can be formed in the substrate 1, and the low-rigidity portion 32 can be prevented from interfering with the formation of the conductive path as much as possible.

  Incidentally, also in each of the first to fourth embodiments, the resistor land 8a of the cantilever flat plate portion 30 is also connected to the straight line connecting both ends 26a and 26b of the slit 26 on both sides of the base end of the cantilever flat plate portion 30. Although the torsional moment is applied to the base end of the cantilevered flat plate portion 30, the resistor land 8 a is a straight line connecting both ends 26 a and 26 b of the slit 26. In order to clarify that it is located away from the vertical direction in the lateral direction, the cantilever plate portion 30 is shown in an L shape.

(Other embodiments)
The present invention is not limited to the embodiment described above and shown in the drawings, and may be modified or expanded as follows.
It is not limited to a PLC power monitoring board. The present invention can be widely applied to power monitoring boards for devices installed in factories.
The insulating plate 2 is not limited to glass epoxy.
The copper foil 3 is not limited to the surface of the insulating plate 2 but may be provided on both the front and back surfaces. In this case, the high voltage conductive paths 4 to 7, the low voltage conductive paths 8 to 11, and the ground conductive path 12 may be formed on the copper foil 3 on the front surface, and the low rigidity portion 32 may be formed on the copper foil 3 on the back surface.
The copper foil 3 may be provided inside the insulating plate 2.

  In the drawings, 1 is a substrate, 2 is an insulating plate, 3 is a copper foil (metal conductive layer), 4 to 7 are high-voltage conductive paths, 4a to 7a are terminal block lands, 4b to 7b are resistor lands, 8 to 11 is a low voltage conductive path, 8a to 11a are resistor lands, 8b to 11b are circuit lands, 12 is a ground conductive path, 15 is a terminal block, 17a to 17e are output terminals (high voltage terminals), and 22 is a resistor. 22a and 22b are connection terminals, 26 to 29 are slits, 30 is a cantilever plate portion (cantilever portion), and 32 is a low rigidity portion.

Claims (2)

An insulating plate, and a metal conductive layer formed on at least the surface of the insulating plate,
In the metal conductive layer,
Terminal block lands and resistor lands at both ends, the high voltage terminal of the terminal block to which a high voltage wire is connected is connected to the terminal block land, and one terminal of the resistor is connected to the resistor terminal A high-voltage conductive path connected to
Forming a low voltage conductive path formed at a predetermined distance or more away from the high voltage conductive path and having a resistor land connecting one end of the resistor to the other connection terminal of the resistor;
On the insulating plate,
High power monitoring for factory equipment in which a slit is formed so as to surround one end of the low voltage conductive path where the resistor land is formed in order to separate the low voltage conductive path from the high voltage conductive path by a predetermined creepage distance or more. In the insulating plate device,
The metal conductive layer is removed at a portion that supports the cantilever-shaped portion surrounded by the slit, and the base end of the cantilever-shaped portion is the metal conductive layer of the cantilever-shaped portion. A substrate for a high power monitoring device of a factory facility, characterized by providing a low-rigidity portion separated by a continuous metal conductive layer. The resistor lands of the cantilevered portion are located away from a direction perpendicular to a straight line connecting both ends of the slit existing on both sides of the base end of the cantilevered portion,
The low-rigidity portion has a rectangular shape extending from the base end of the cantilevered portion to both sides in the width direction, and is formed so that the side where the resistor land is located is longer than the opposite side. The substrate for a high power monitoring device for factory equipment according to claim 1.

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