JP2013206486A - Substrate for suspension, suspension, element equipping suspension, hard disc drive, and manufacturing method of substrate for suspension - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for a suspension capable of surely insulating a via part connected to a wiring layer from a metal support substrate and being downsized.SOLUTION: A substrate for a suspension includes a metal support substrate 1, an isolation layer 2, and a wiring layer 3. The wiring layer 3 is connected to a via part 6 formed in an opening of the isolation layer 2. The via part 6 is insulated from the metal support substrate 1. A bottom face 61 of the via part is located inside of a bottom face 21 of the isolation layer 2 in a thickness direction.

Description

  The present invention relates to a suspension substrate that can reliably insulate a via portion connected to a wiring layer and a metal support substrate and can be downsized.

  In recent years, due to the spread of the Internet and the like, there has been a demand for an increase in the amount of information processing of personal computers and an increase in information processing speed. Increasing information transmission speed is required.

  A suspension substrate (flexure) used in an HDD is usually formed at one end portion, formed at a recording / reproducing element mounting area for mounting a recording / reproducing element such as a magnetic head slider, and at the other end portion. It has an external circuit board connection area for connecting to the external circuit board, and a wiring layer for connecting the recording / reproducing element mounting area and the external circuit board connection area. The suspension substrate usually has a basic structure in which a metal support substrate, an insulating layer, and a wiring layer are laminated in this order.

  For example, it is known that a plated portion is provided on the surface of the terminal portion of the wiring layer for the purpose of preventing deterioration and improving connection reliability. Conventionally, it is known to use a part of a wiring layer as a plating wire in order to form a plating portion. (For example, FIG. 3 described later). On the other hand, a member (intermediate member described later) in which the wiring layer and the metal supporting board are connected by a via portion penetrating the insulating layer is manufactured, and then the surface of the wiring layer is plated by feeding from the metal supporting board. A technique is known in which a portion is formed, and then the metal support substrate is etched to make the wiring layer (and via portion) independent from the metal support substrate. For example, Patent Document 1 discloses that after the electroplating, a first opening is provided in the metal support layer so that the metal thin film is exposed, and the conductor layer is made independent. Patent Document 2 discloses that a covering portion (insulated metal support layer) is provided to prevent the metal thin film from being exposed.

  Although it is a technique using electroless plating, Patent Document 3 has a wiring pattern formed on the base insulating layer so as to be electrically connected to the metal support substrate in the first ground portion, A printed circuit board in which a first grounding portion is provided in a separation portion of a metal support substrate is disclosed, and the separation of the separation portion from the main body portion after electroless plating makes the wiring pattern independent. Has been.

Japanese Patent Laid-Open No. 2005-1000048 JP 2009-259315 A JP 2010-171040 A

  When the wiring layer is made independent, it is necessary to reliably insulate the via portion connected to the wiring layer and the metal supporting board. The etching of the metal support substrate is usually performed on the metal support substrate exposed from a resist pattern such as a dry film resist (DFR). Since a slight alignment error occurs in the production of the resist pattern, the via portion and the metal support substrate are normally reliably insulated by increasing the size of the opening of the metal support substrate. When the size of the opening of the metal support substrate is increased, there is a problem in that the design is restricted and the suspension substrate cannot be reduced in size.

  The present invention has been made in view of the above circumstances, and provides a suspension substrate that can reliably insulate a via portion connected to a wiring layer and a metal support substrate and can be downsized. The main purpose.

  In order to solve the above-described problems, the present invention includes a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer and having a plating portion on the surface. A suspension substrate, wherein the wiring layer is connected to a via portion formed in an opening portion of an insulating layer, the via portion is insulated from the metal support substrate, and the metal of the via portion in the opening portion is provided. The suspension substrate is characterized in that the surface on the support substrate side is inside the surface of the insulating layer on the metal support substrate side around the opening in the thickness direction.

  According to the present invention, since the surface of the via portion on the side of the metal support substrate is inside the surface of the insulating layer on the side of the metal support substrate, the via portion and the metal support substrate can be reliably insulated, and the size can be reduced. Can be achieved.

  In the above invention, the difference in the thickness direction between the surface of the via portion on the metal support substrate side and the surface of the insulating layer on the metal support substrate side is preferably 1 μm or more. This is because the via portion and the metal supporting board can be reliably insulated even when the variation in the etching amount of the via portion is taken into consideration.

  In the above invention, the via portion is preferably a via portion that does not have material continuity with the wiring layer. This is because the range of material selection for the via portion is widened.

  The present invention also provides a suspension comprising the above-described suspension substrate and a load beam provided on the surface of the metal support substrate.

  According to the present invention, by using the above-described suspension substrate, the via portion connected to the wiring layer and the metal support substrate can be reliably insulated, and the suspension can be downsized.

  The present invention also provides an element-equipped suspension comprising the above-described suspension and a recording / reproducing element disposed on the suspension.

  According to the present invention, by using the above-described suspension, it is possible to reliably insulate the via portion connected to the wiring layer and the metal support substrate, and it is possible to provide a miniaturized suspension with an element.

  The present invention also provides a hard disk drive having the above-described suspension with an element.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described suspension with an element.

  Further, in the present invention, a method for manufacturing a suspension substrate having a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer and having a plated portion on a surface thereof. A step of preparing an intermediate member formed in the opening of the insulating layer and including a via portion for connecting the wiring layer and the metal support member; and by supplying power from the metal support member, A metal support substrate forming step including forming a plating portion on the surface and forming a metal support substrate by etching the metal support member to form the metal support substrate insulated from the via portion. In the step, the surface on the metal support substrate side of the via portion in the opening is the surface on the metal support substrate side of the insulating layer around the opening in the thickness direction. To provide a method for manufacturing a suspension substrate, characterized in that the remote interior.

  According to the present invention, since the surface of the via portion on the side of the metal support substrate is inside the surface of the insulating layer on the side of the metal support substrate, the via portion and the metal support substrate can be reliably insulated, and the size can be reduced. Can be achieved.

  The suspension substrate according to the present invention has an effect that the via portion connected to the wiring layer and the metal support substrate can be reliably insulated, and the size can be reduced.

It is a schematic diagram which shows an example of the board | substrate for suspensions of this invention. It is a schematic diagram explaining the board | substrate for suspensions of this invention. It is a schematic plan view illustrating a conventional suspension substrate. It is a schematic sectional drawing explaining the conventional board | substrate for suspensions. It is a schematic sectional drawing explaining the via part in this invention. It is a schematic sectional drawing explaining the via part in this invention. It is a schematic sectional drawing explaining the via part in this invention. It is a schematic diagram explaining the opening part of the metal support substrate in this invention. It is a schematic diagram explaining the opening part of the metal support substrate in this invention. It is a schematic diagram explaining the opening part of the metal support substrate in this invention. It is a schematic diagram explaining the board | substrate for suspensions of this invention. It is a schematic plan view which shows an example of the suspension of this invention. It is a schematic plan view which shows an example of the suspension with an element of this invention. It is a schematic plan view which shows an example of the hard disk drive of this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the board | substrate for suspensions of this invention. It is a schematic sectional drawing which shows the other example of the manufacturing method of the board | substrate for suspensions of this invention.

  Hereinafter, the suspension substrate, suspension, suspension with element, hard disk drive, and manufacturing method of the suspension substrate of the present invention will be described in detail.

A. Suspension substrate The suspension substrate of the present invention is a suspension substrate having a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer and having a plating portion on the surface. The wiring layer is connected to a via portion formed in an opening portion of an insulating layer, the via portion is insulated from the metal support substrate, and the metal support substrate of the via portion in the opening portion. The surface on the side is inside the surface on the metal support substrate side of the insulating layer around the opening in the thickness direction.

  FIG. 1 is a schematic view showing an example of a suspension substrate of the present invention. FIG. 1A is a schematic plan view of a suspension substrate, and FIG. 1B is a cross-sectional view taken along line AA in FIG. In FIG. 1A, illustration of the insulating layer and the cover layer is omitted for convenience. A suspension substrate 100 shown in FIG. 1A includes a recording / reproducing element mounting region 101 formed at one tip portion, an external circuit board connection region 102 formed at the other tip portion, and a recording / playback device. A plurality of wiring layers 103a to 103d for electrically connecting the element mounting region 101 and the external circuit board connection region 102 are provided. The wiring layer 103a and the wiring layer 103b are a pair of wiring layers. Similarly, the wiring layer 103c and the wiring layer 103d are also a pair of wiring layers. One of the pair of wiring layers is a writing wiring layer, and the other is a reading wiring layer. As shown in FIG. 1B, the suspension substrate 100 includes a metal support substrate 1, an insulating layer 2 formed on the metal support substrate 1, and a wiring layer 3 formed on the insulating layer 2. And a cover layer 4 formed so as to cover the wiring layer 3.

  FIG. 2 is a schematic diagram for explaining the suspension substrate of the present invention. 2A is a schematic plan view showing an external circuit board connection region in the present invention, FIG. 2B is a cross-sectional view taken along the line AA in FIG. 2A, and FIG. It is BB sectional drawing of 2 (a). In FIG. 2A, the cover layer and the plating part are not shown for convenience. As shown in FIG. 2A, the wiring layer 3 includes a routing portion 3a connected to an element connection terminal portion (not shown) and a terminal portion 3b connected to the routing portion 3a (for example, an external circuit board connection). Terminal portion) and a plated wire portion 3c connected to the terminal portion 3b. Further, as shown in FIG. 2B, the plated portion 5 is formed on the surface of the terminal portion 3 b, and the plated wire portion 3 c is connected to the via portion 6 formed in the opening of the insulating layer 2. In the present invention, as shown in FIGS. 2 (b) and 2 (c), the bottom surface (surface on the metal support substrate 1 side) 61 of the via portion 6 is the bottom surface (metal support substrate) of the insulating layer 2 in the thickness direction. It is a great feature that it is on the inner side (wiring layer side) 21 (surface on the one side) 21. In the present invention, when there are a plurality of via portions 6, it is sufficient that the bottom surface of at least one via portion 6 is inside the bottom surface 21 of the insulating layer 2 in the thickness direction.

  According to the present invention, since the surface of the via portion on the side of the metal support substrate is inside the surface of the insulating layer on the side of the metal support substrate, the via portion and the metal support substrate can be reliably insulated, and the size can be reduced. Can be achieved.

  Here, as shown in FIG. 3, in the conventional suspension board, a plurality of plated wire portions 3 c are formed on the plurality of terminal portions 3 b, respectively, and each plated wire portion 3 c is a conductor layer 3 d of the support frame 110. Was connected to. On the other hand, as shown in FIG. 4A, the plating wire portion 3 c and the metal support substrate 1 are connected via the via portion 6 penetrating the insulating layer 2, and plating is performed by feeding from the metal support substrate 1. When the portion 5 is formed, it is not necessary to provide the plated wire portions 3c each connected to the conductor layer 3d as shown in FIG. 3, and the suspension substrate can be downsized. On the other hand, since the plated wire portion 3 c in FIG. 4A is connected to the metal support substrate 1 via the via portion 6, it is necessary to make the wiring layer 3 independent from the metal support substrate 1.

In order to make the wiring layer independent, as shown in FIG. 4B, a method of removing the metal support substrate 1 located on the bottom surface of the via portion 6 can be used. However, in this method, the influence of the resist pattern produced when the alignment error as described above, increases the size S ₁ of the openings of the metal supporting board 1, a problem that further downsizing of the substrate for suspension can not be achieved is is there. Further, as another example of making the wiring layer independent, as shown in FIG. 4C, the metal support substrate located on the bottom surface of the via portion 6 is left as the covering portion 1a, and the periphery of the covering portion 1a is removed. Insulating method is mentioned. However, in this method, the greater the size S ₁ of the ring-shaped opening, there is a problem that further miniaturization of the suspension substrate can not be achieved.

On the other hand, in the present invention, as shown in FIGS. 2B and 2C, the bottom surface 61 of the via portion 6 is inside the bottom surface 21 of the insulating layer 2 in the thickness direction. the size S ₁ of the openings of the metal supporting board 1 can be made smaller than conventional, it is possible to achieve further miniaturization of the suspension substrate. In the present invention, since it is not necessary to provide the covering portion 1a as shown in FIG. 4C, the suspension substrate can be further reduced in size. By downsizing the suspension substrate, there is an advantage that, for example, the manufacturing efficiency (imposition number) of the suspension substrate is improved.
Hereinafter, the suspension substrate of the present invention will be described separately for the suspension substrate member and the suspension substrate configuration.

1. First, members of the suspension substrate of the present invention will be described. The suspension substrate of the present invention has at least a metal support substrate, an insulating layer, and a wiring layer.

  The metal support substrate in the present invention functions as a support for the suspension substrate. The material of the metal support substrate is preferably a metal having a spring property, and specific examples include stainless steel. Moreover, although the thickness of a metal support substrate changes with kinds of the material, it exists in the range of 10 micrometers-20 micrometers, for example.

  The insulating layer in the present invention is formed on a metal support substrate. The material of the insulating layer is not particularly limited as long as it has insulating properties, and examples thereof include a resin. Examples of the resin include polyimide resin, polybenzoxazole resin, polybenzimidazole resin, acrylic resin, polyether nitrile resin, polyether sulfone resin, polyethylene terephthalate resin, polyethylene naphthalate resin, and polyvinyl chloride resin. Of these, polyimide resin is preferred. It is because it is excellent in insulation, heat resistance and chemical resistance. In addition, the material of the insulating layer may be a photosensitive material or a non-photosensitive material. The thickness of the insulating layer is, for example, preferably in the range of 5 μm to 30 μm, more preferably in the range of 5 μm to 18 μm, and still more preferably in the range of 5 μm to 12 μm.

  The wiring layer in the present invention is formed on the insulating layer. The material of the wiring layer is not particularly limited as long as it has conductivity, but for example, a metal can be cited, and copper (Cu) is particularly preferable. Moreover, the material of the wiring layer may be rolled copper or electrolytic copper. The thickness of the wiring layer is preferably in the range of 5 μm to 18 μm, for example, and more preferably in the range of 5 μm to 12 μm.

  Examples of the wiring layer include a writing wiring layer, a reading wiring layer, a heat assist wiring layer, an actuator element wiring layer, a power supply wiring layer, a flight height control wiring layer, a ground wiring layer, and a noise shield. Examples thereof include a wiring layer and a wiring layer for preventing crosstalk.

  The plated portion in the present invention is formed on at least a part of the surface of the wiring layer. By providing the plating part, the deterioration (corrosion etc.) of the wiring layer can be prevented. In particular, in the present invention, it is preferable that a plating part is formed in the terminal part. Although the kind of plating part is not specifically limited, For example, Au plating, Ni plating, Ag plating, Cu plating etc. can be mentioned. Especially, it is preferable that Ni plating and Au plating are formed from the surface side of the wiring layer. The thickness of the plating portion is, for example, in the range of 0.1 μm to 4 μm.

  The suspension substrate in the present invention preferably has a cover layer covering the wiring layer. This is because deterioration (for example, corrosion) of the wiring layer can be prevented. Examples of the material for the cover layer include the resins described as the material for the insulating layer described above, and among these, a polyimide resin is preferable. The material of the cover layer may be a photosensitive material or a non-photosensitive material. The thickness of the cover layer on the wiring layer is preferably in the range of 2 μm to 30 μm, for example, and more preferably in the range of 2 μm to 10 μm.

2. Next, the configuration of the suspension substrate of the present invention will be described. In the present invention, the bottom surface of the via portion in the opening portion of the insulating layer is on the inner side of the bottom surface of the insulating layer around the opening portion in the thickness direction. As shown in FIG. 5, when the difference in the thickness direction between the bottom surface 61 of the via 6 and the bottom surface 21 of the insulating layer 2 is D, D is preferably 1 μm or more, for example, and is 3 μm or more. More preferably, it is more preferably 5 μm or more. This is because the via portion and the metal supporting board can be more reliably insulated. On the other hand, D is preferably smaller than the thickness of the insulating layer 2. This is because when the via portion in the present invention does not have material continuity with the wiring layer, it is possible to prevent the wiring layer from being directly exposed and to prevent deterioration of the wiring layer. Moreover, when the pitch of the adjacent via part 6 is set to P, it is preferable that P is 200 micrometers or less, for example, and it is more preferable that it exists in the range of 100 micrometers-200 micrometers.

  Further, the via portion in the present invention may be a via portion 6 that does not have material continuity with the wiring layer 3 as shown in FIG. 6A, as shown in FIG. 6B. The via portion 6 having material continuity with the wiring layer 3 may be used.

  Here, “having no material continuity” means that the materials are different, or that the crystal size of the same material is different. On the other hand, “having material continuity” means that the material and the crystal size are the same. When the via portion and the wiring layer are formed simultaneously as in the additive method described later, the material and crystal size of the via portion and the wiring layer are the same, and both are in a material continuous state. In this case, it can be said that “it has material continuity”. On the other hand, when the via part and the wiring layer are made of different materials as in the subtractive method described later, or when the via part is formed after the wiring layer is formed even if the two materials are the same (for example, copper). Causes discontinuity at the interface between the two due to differences in material properties (crystal size, etc.). In this case, it can be said that “there is no material continuity”.

  When the via portion in the present invention is a via portion that does not have material continuity with the wiring layer, there is an advantage that the range of material selection for the via portion is widened. The material of the via portion is not particularly limited as long as it has conductivity, and examples thereof include plating. In particular, in the present invention, the material of the via portion is preferably a material having higher corrosion resistance than the material of the wiring layer. Examples of the type of plating include Ni plating. When the via portion is formed by the electrolytic Ni plating method, examples of the electrolytic Ni plating bath used include a watt bath and a sulfamic acid bath.

  On the other hand, when the via part in the present invention is a via part having material continuity with the wiring layer, the wiring layer and the via part can be formed at the same time, and the manufacturing process can be simplified. There is. In this case, as shown in FIG. 6B, the via portion 6 may have a protective portion 8 on the surface on the metal support substrate 1 side. This is because the provision of the protective portion 8 can prevent the via portion 6 from being directly exposed and prevent the via portion 6 from being deteriorated. In the present invention, when the via part has a protective part and the protective part has conductivity, the “surface of the via part on the metal support substrate side” means as shown in FIG. This refers to the bottom surface 81 (surface on the metal support substrate 1 side) of the protection unit 8. The material of the protective part is not particularly limited, but is preferably a material having higher corrosion resistance than the material of the wiring layer. Examples of the protective part include an electroless plating film and a sputtered film. If necessary, a via portion that does not have material continuity with the wiring layer may have a protective portion.

The wiring layer in the present invention is connected to a via portion formed in the opening of the insulating layer. The shape of the opening of the insulating layer in plan view is not particularly limited, and examples thereof include a circular shape, an elliptical shape, a comb shape, a cross shape, a rod shape, and an arbitrary polygonal shape. As shown in FIG. 2 (c), when the size of the opening of the insulating layer 2 and _{S 2, S 2} is in the range of, for example, 20Myuemu～60myuemu, is preferably in the range of 30μm~50μm . Moreover, the via | veer part in this invention is normally insulated from the metal support substrate. Therefore, the metal support substrate is removed at a position where the via portion is formed, and an opening is formed. The shape of the opening of the metal support substrate in plan view is not particularly limited, and examples thereof include a circle, an ellipse, a comb, a cross, a bar, and an arbitrary polygon.

In the present invention, as shown in FIG. 7A, the end of the opening of the insulating layer 2 may protrude from the end of the opening of the metal support substrate 1. If the difference between the both ends was L _1, L ₁ is preferably smaller. This is because the suspension substrate can be further reduced in size. L ₁ is preferably 30 μm or less, for example, and more preferably 15 μm or less. Further, if the size of the opening of the metal supporting board 1 was _{S 11, S 11,} for example preferably in the range of ranges from 60 m to 120 m, and more preferably in a range of 60Myuemu～80myuemu. In the present invention, as shown in FIG. 7B, the end of the opening of the insulating layer 2 and the end of the opening of the metal support substrate 1 may be substantially the same. “Substantially the same” means that the difference (absolute value) between the end of the opening of the insulating layer 2 and the end of the opening of the metal support substrate 1 is 15 μm or less (in particular, 10 μm or less, particularly less than 5 μm). Say.

On the other hand, in the present invention, as shown in FIG. 7C, the end of the opening of the metal support substrate 1 may protrude from the end of the opening of the insulating layer 2. In the present invention, since the bottom surface of the via portion 6 is inside the bottom surface of the insulating layer 2 in the thickness direction, the end portion of the opening portion of the metal support substrate 1 protrudes from the end portion of the opening portion of the insulating layer 2. However, the via part 6 and the metal supporting board 1 can be reliably insulated. If the difference between the end of the opening of the metal supporting board 1 and the end portion of the opening of the insulating layer 2 was set to _{L 2, L 2} is, for example, preferably in the range of 5Myuemu～40myuemu, 10 m to 20 m It is more preferable to be within the range. Further, if the size of the opening of the metal supporting board 1 was _{S 12, S 12,} for example preferably in the range of 30Myuemu～80myuemu, and more preferably in a range of 40Myuemu～60myuemu.

  The via portion in the present invention can be provided at any position as long as it can be connected to the wiring layer. As the position of the via portion, for example, as shown in FIG. 2A, the position on the downstream side (plating wire portion 3c side) from the terminal portion 3b can be exemplified. Although not shown, a via portion may be provided on the upstream side (the routing portion side) of the terminal portion. The type of the terminal portion in the present invention is not particularly limited. For example, a test terminal portion (test pad) for contacting an external circuit board connecting terminal portion and an electrode for electrical inspection of the suspension substrate. And the like.

  8-10 is a schematic diagram explaining the opening part of the metal support substrate in this invention. FIG. 8A is a schematic plan view showing an external circuit board connection region in the present invention, and FIG. 8B is a cross-sectional view taken along line AA of FIG. Moreover, in FIG. 8A, the description of the insulating layer, the cover layer, and the plating portion is omitted for convenience. These matters are the same in FIG. 9 and FIG. As shown in FIG. 8, the metal supporting board in the present invention may have a closed opening (an opening in which the metal supporting board exists on the entire circumference), and an open opening as shown in FIG. Part (opening in which the metal support substrate does not exist on the entire circumference) may be provided. Moreover, the metal support board | substrate in this invention may be provided with the ring-shaped metal support part which has a closed opening part, as shown in FIG.

  FIG. 11 is a schematic diagram for explaining the suspension substrate of the present invention. FIG. 11A is a schematic plan view showing an external circuit board connection region in the present invention, FIG. 11B is a cross-sectional view taken along line AA of FIG. 11A, and FIG. It is BB sectional drawing of 11 (a). As shown in FIG. 11, the suspension substrate of the present invention may have a via portion 6 b connected to the metal support substrate in addition to the via portion 6 a insulated from the metal support substrate 1. The via portion 6b connected to the metal support substrate can be used, for example, in a common power supply wiring layer connected to the actuator element.

B. Suspension Next, the suspension of the present invention will be described. The suspension of the present invention includes the above-described suspension substrate and a load beam provided on the surface of the metal support substrate.

  FIG. 12 is a schematic plan view showing an example of the suspension of the present invention. A suspension 300 shown in FIG. 12 includes the suspension substrate 100 described above and a load beam 200 provided on the surface of the suspension substrate 100 on the metal support substrate side.

  According to the present invention, by using the above-described suspension substrate, the via portion connected to the wiring layer and the metal support substrate can be reliably insulated, and the suspension can be downsized.

  The suspension of the present invention includes a suspension substrate and a load beam. The suspension substrate in the present invention is the same as the content described in the above “A. Suspension substrate”, and therefore description thereof is omitted here. On the other hand, the load beam in the present invention is provided on the surface of the suspension substrate on the metal support substrate side. Although the material of the load beam is not particularly limited, for example, a metal can be used, and stainless steel is preferable.

C. Next, the suspension with an element of the present invention will be described. A suspension with an element of the present invention includes the above-described suspension and a recording / reproducing element disposed on the suspension.

  FIG. 13 is a schematic plan view showing an example of the suspension with an element of the present invention. A suspension with an element 400 shown in FIG. 13 includes the suspension 300 described above and a recording / reproducing element 301 mounted in the recording / reproducing element mounting region 101 of the suspension 300.

  According to the present invention, by using the above-described suspension, it is possible to reliably insulate the via portion connected to the wiring layer and the metal support substrate, and it is possible to provide a miniaturized suspension with an element.

  The suspension with an element of the present invention includes at least a suspension and a recording / reproducing element. The suspension according to the present invention is the same as the content described in “B. Suspension” above, and thus the description thereof is omitted here. Further, the recording / reproducing element in the present invention is not particularly limited, but an element having a magnetism generating element is preferable. Specifically, a magnetic head slider can be mentioned. The suspension with an element of the present invention may have other elements such as a thermal assist element and an actuator element.

D. Next, the hard disk drive of the present invention will be described. The hard disk drive of the present invention has the above-described suspension with an element.

  FIG. 14 is a schematic plan view showing an example of the hard disk drive of the present invention. A hard disk drive 500 shown in FIG. 14 includes the above-described suspension 400 with an element, a disk 401 on which data is written and read by the suspension 400 with an element, a spindle motor 402 that rotates the disk 401, and the elements of the suspension 400 with an element. Arm 403 and voice coil motor 404, and a case 405 for sealing the above members.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described suspension with an element.

  The hard disk drive of the present invention has at least a suspension with an element, and usually further includes a disk, a spindle motor, an arm, and a voice coil motor. Since the suspension with an element is the same as the content described in “C. Suspension with an element”, description thereof is omitted here. As other members, the same members as those used in a general hard disk drive can be used.

E. Next, a method for manufacturing a suspension substrate according to the present invention will be described. A method for manufacturing a suspension substrate according to the present invention includes a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer and having a plating portion on the surface. A method for manufacturing a substrate, comprising: a preparation step of preparing an intermediate member that is formed in an opening of the insulating layer and includes a via portion that connects the wiring layer and the metal support member; and power supply from the metal support member, A plating portion forming step for forming the plating portion on the surface of the wiring layer; and a metal supporting substrate forming step for etching the metal supporting member to form the metal supporting substrate insulated from the via portion. In the metal support substrate forming step, the surface of the via portion in the opening on the metal support substrate side in the thickness direction is the gold of the insulating layer around the opening. It is characterized in that inside the surface of the support substrate side.

  FIG. 15 is a schematic cross-sectional view showing an example of a method for manufacturing a suspension substrate according to the present invention. In FIG. 15, first, a laminated member in which the metal supporting member 1A, the insulating member 2A, and the conductor member 3A are laminated in this order is prepared (FIG. 15A). Next, wet etching is performed on the conductor member 3A to form the wiring layer 3 (FIG. 15B). At this time, wet etching may be simultaneously performed on the metal supporting member 1A to provide a jig hole or the like. Next, the cover layer 4 is formed on the wiring layer 3 (FIG. 15C), and the insulating member 2A is wet-etched to form the insulating layer 2 having an opening (FIG. 15D). . Next, via portions 6 that connect the wiring layer 3 and the metal support member 1 </ b> A are formed in the opening of the insulating layer 2 by power feeding from the metal support member 1 </ b> A. Thereby, the intermediate member 11 is obtained (FIG.15 (e)). Next, the plating part 5 is formed on the surface of the wiring layer 3 (terminal part 3b) by power feeding from the metal supporting member 1A (FIG. 15 (f)). Next, wet etching is performed on the metal support member 1A to form the metal support substrate 1 insulated from the via portion 6 (FIG. 15G). Thereafter, further etching (over-etching) is continuously performed so that the bottom surface 61 of the via portion 6 is located inside the bottom surface 21 of the insulating layer 2 in the thickness direction (FIG. 15H). Thereby, a suspension substrate is obtained.

  FIG. 16 is a schematic cross-sectional view showing another example of a method for manufacturing a suspension substrate according to the present invention. In FIG. 16, first, a metal support member 1A is prepared (FIG. 16 (a)). Next, the insulating layer 2 having an opening is formed on the surface of the metal support member 1A (FIG. 16B). Next, although not shown, a seed layer is formed on the entire surface on the insulating layer 2 side by sputtering to form a predetermined resist pattern. Next, the wiring layer 3 is formed on the surface of the seed layer exposed from the resist pattern (FIG. 16C). Next, the cover layer 4 is formed on the wiring layer 3 (FIG. 16D). Thereby, the intermediate member 11 is obtained. Next, the plating part 5 is formed on the surface of the wiring layer 3 (terminal part 3b) by power feeding from the metal support member 1A (FIG. 16E). Next, wet etching is performed on the metal support member 1A to form the metal support substrate 1 insulated from the via portion 6 (FIG. 16F). Thereafter, further etching (over-etching) is continuously performed so that the bottom surface 61 of the via portion 6 is located inside the bottom surface 21 of the insulating layer 2 in the thickness direction (FIG. 16G). Finally, a protective portion 8 (for example, an electroless Ni plating film) that protects the bottom surface 61 is formed (FIG. 16H). Thereby, a suspension substrate is obtained.

  According to the present invention, since the surface of the via portion on the side of the metal support substrate is inside the surface of the insulating layer on the side of the metal support substrate, the via portion and the metal support substrate can be reliably insulated, and the size can be reduced. Can be achieved. Moreover, the manufacturing method of the suspension substrate according to the present invention can be roughly classified into, for example, a manufacturing method by a subtractive method and a manufacturing method by an additive method.

1. Subtractive Method First, a manufacturing method using the subtractive method will be described. As an example of the manufacturing method by the subtractive method, a laminated member preparing step for preparing a laminated member in which a metal supporting member, an insulating member, and a conductor member are laminated in this order, and wiring for forming a wiring layer by etching the conductor member A layer forming step, a cover layer forming step of forming a cover layer on the wiring layer, an insulating layer forming step of etching the insulating member to form an insulating layer having an opening, and the wiring in the opening A via part forming step for forming a layer and a via part for connecting the metal support member; a plating part forming step for forming a plated part on the surface of the wiring layer by feeding from the metal support member; and the metal support member And a metal support substrate forming step for forming a metal support substrate insulated from the via portion. FIG. 15 described above is a schematic cross-sectional view showing an example of a method for manufacturing a suspension substrate by a subtractive method.
Hereinafter, a method for manufacturing a suspension substrate by the subtractive method will be described step by step.

(1) Laminated member preparation process A laminated member preparation process is a process of preparing the laminated member by which the metal supporting member, the insulating member, and the conductor member were laminated | stacked in this order.

  In the subtractive method, a metal supporting board is obtained by etching the metal supporting member of the laminated member, an insulating layer is obtained by etching the insulating member of the laminated member, and the conductive member of the laminated member is etched. A wiring layer is obtained. The laminated member may be a commercially available three-layer material, or may be obtained by sequentially forming an insulating member and a conductor member on a metal support member.

(2) Wiring layer formation process A wiring layer formation process is a process of etching the said conductor member and forming a wiring layer.

  Examples of the method for forming the wiring layer include a method in which a resist pattern is formed on a conductive member of a laminated member using a dry film resist (DFR) or the like, and the conductive member exposed from the resist pattern is wet-etched. Can do. The type of etching solution used for wet etching is preferably selected as appropriate according to the type of conductor member. For example, when the material of the conductor member is Cu, an iron chloride-based etching solution or the like can be used.

  In the subtractive method, the metal support member may be etched simultaneously with the etching of the conductor member. Examples of the etching of the metal support member include etching for forming a jig hole. Further, if necessary, part of the processing performed in the metal support substrate forming step described later may be performed simultaneously with the etching of the conductor member.

(3) Cover layer forming step The cover layer forming step is a step of forming a cover layer on the wiring layer.

  The method for forming the cover layer is not particularly limited, and is preferably selected as appropriate according to the material of the cover layer. For example, when the material of the cover layer is a photosensitive material, a patterned cover layer can be obtained by exposing and developing the cover layer formed on the entire surface. In addition, when the cover layer material is a non-photosensitive material, a predetermined resist pattern is formed on the entire surface of the cover layer, and a portion exposed from the resist pattern is removed by wet etching. The cover layer can be obtained.

(4) Insulating layer forming step The insulating layer forming step is a step of etching the insulating member to form an insulating layer having an opening.

  Examples of the method for forming the insulating layer include a method of forming a resist pattern on the insulating member using a dry film resist (DFR) or the like, and wet etching the insulating member exposed from the resist pattern. . The type of etchant used for wet etching is preferably selected as appropriate according to the type of insulating member. For example, when the material of the insulating member is a polyimide resin, an alkaline etchant or the like can be used.

(5) Via part formation process A via part formation process is a process of forming a via part for connecting the wiring layer and the metal support member to the opening.

  The method for forming the via portion is not particularly limited as long as it can obtain a desired plated portion, and for example, an electrolytic plating method can be exemplified. In the present invention, the via portion is preferably formed by power feeding from the metal support member. In addition, for example, when forming a via portion made of Ni plating, examples of the electrolytic Ni plating bath used include a watt bath and a sulfamic acid bath. The plating conditions are not particularly limited, and desired conditions (plating time, applied voltage, etc.) may be selected.

(6) Plating part formation process A plating part formation process is a process of forming a plating part in the surface of the above-mentioned wiring layer by electric power feeding from the above-mentioned metal support member.

  The method for forming the metal plating part is not particularly limited as long as a desired plating part can be obtained, and examples thereof include an electrolytic plating method. For example, examples of the electrolytic Au plating bath include a gold cyanide bath and an acidic gold bath.

(7) Metal support substrate forming step The metal support substrate forming step is a step of etching the metal support member to form a metal support substrate insulated from the via portion. In this step, the outer shape of the metal support substrate is usually processed. Further, in this step, the surface on the metal support substrate side of the via portion in the opening is made inward of the surface on the metal support substrate side of the insulating layer around the opening in the thickness direction. .

  As a method for forming a metal support substrate, for example, a method of forming a resist pattern using a dry film resist (DFR) or the like on a conductor member of a metal support member and wet etching the metal support member exposed from the resist pattern Can be mentioned. The type of etching solution used for wet etching is preferably selected as appropriate according to the type of conductor member. For example, when the material of the metal support member is stainless steel, an iron chloride-based etching solution or the like can be used. .

2. Additive Method Next, a manufacturing method using the additive method will be described. As an example of the manufacturing method by the additive method, a metal support member preparing step for preparing a metal support member, an insulating layer forming step for forming an insulating layer having an opening on the metal support member, and wiring on the insulating layer Forming a layer and simultaneously forming a via layer connecting the wiring layer and the metal supporting member in the opening, forming a cover layer on the wiring layer, and forming a cover layer on the wiring layer; A plating portion forming step for forming a plating portion on the surface of the wiring layer by power feeding from the metal support member, and a metal support substrate forming step for etching the metal support member to form a metal support substrate insulated from the via portion. And a production method having: In addition, FIG. 16 mentioned above is a schematic sectional drawing which shows an example of the manufacturing method of the board | substrate for suspensions by an additive method.
Hereinafter, a method for manufacturing a suspension substrate by the additive method will be described step by step.

(1) Metal support member preparation process A metal support member preparation process is a process of preparing a metal support member. For example, a commercially available metal support member can be used as the metal support member.

(2) Insulating layer forming step The insulating layer forming step is a step of forming an insulating layer having an opening on the metal support member.

  The method for forming the insulating layer is not particularly limited, and it is preferable to select appropriately according to the material of the insulating layer. For example, when the material of the insulating layer is a photosensitive material, a patterned insulating layer can be obtained by exposing and developing the insulating layer formed on the entire surface. In addition, when the material of the insulating layer is a non-photosensitive material, a predetermined resist pattern is formed on the surface of the insulating layer formed on the entire surface, and a portion exposed from the resist pattern is removed by wet etching to form a pattern. Insulating layer can be obtained.

(3) Wiring Layer Forming Step The wiring layer forming step is a step of forming a wiring layer on the insulating layer and simultaneously forming a via portion connecting the wiring layer and the metal support member in the opening.

  Examples of the method for forming the wiring layer and the via portion include an electrolytic plating method. Specifically, a method of forming a resist pattern on the insulating layer using a dry film resist (DFR) or the like, and performing electrolytic plating on the surface of the insulating layer exposed from the resist pattern can be exemplified. . When the electrolytic plating method is used, it is preferable to form a seed layer on the surface of the insulating layer by sputtering or the like before forming the wiring layer.

(4) Other Steps The other steps are the same as the steps in the subtractive method described above, and a description thereof is omitted here.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described more specifically with reference to examples.

[Example 1]
First, a laminated member having SUS304 (metal support member) having a thickness of 18 μm, a polyimide resin layer (insulating member) having a thickness of 10 μm, and an electrolytic copper layer (conductor member) having a thickness of 9 μm was prepared (FIG. 15A). . Next, a dry film resist was laminated on both surfaces of the laminated member to form a resist pattern. Next, etching was performed using a ferric chloride solution, and a resist film was removed after the etching. Thereby, a wiring layer was formed from the conductor member (FIG. 15B), and a jig hole was formed in the metal support member (not shown).

  Thereafter, a polyimide precursor solution was coated on the patterned wiring layer with a die coater, and a cover layer was formed by predetermined patterning (FIG. 15C). Next, in order to pattern the insulating member, resist plate-making was performed, and the exposed polyimide resin was wet-etched to form an insulating layer having an opening (FIG. 15D). Next, via portions (electrolytic Ni plating) for connecting the wiring layer and the metal support member were formed by power feeding from the metal support member (FIG. 15E). Next, a plated portion (electrolytic Au plating) was formed on the terminal portion of the wiring layer by power feeding from the metal support member (FIG. 15 (f)). Finally, the metal support member was etched using a ferric chloride solution (FIGS. 15G and 15H). As a result, a suspension substrate was obtained. When D shown in FIG. 5 was measured, D was 1 μm.

  DESCRIPTION OF SYMBOLS 1 ... Metal support board | substrate, 1a ... Covering part, 2 ... Insulating layer, 3 ... Wiring layer, 3a ... Leading part, 3b ... Terminal part, 3c ... Plating wire part, 3d ... Conductor layer, 4 ... Cover layer, 5 ... Plating , 6 ... via part, 8 ... protection part, 21 ... bottom surface of insulating layer, 61 ... bottom surface of via part, 81 ... bottom surface of protection part, 100 ... suspension substrate, 101 ... recording / reproducing element mounting region, 102 ... external Circuit board connection region, 103 ... wiring layer

Claims (7)

A suspension substrate having a metal support substrate, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer and having a plating portion on a surface thereof,
The wiring layer is connected to a via portion formed in the opening of the insulating layer,
The via portion is insulated from the metal support substrate;
The suspension is characterized in that the surface of the via portion in the opening on the side of the metal support substrate is inside the surface of the insulating layer on the side of the metal support substrate in the thickness direction. Substrate.   2. The suspension according to claim 1, wherein a difference in a thickness direction between a surface of the via portion on the metal support substrate side and a surface of the insulating layer on the metal support substrate side is 1 μm or more. substrate.   The suspension substrate according to claim 1, wherein the via portion is a via portion that does not have material continuity with the wiring layer.   A suspension comprising: the suspension substrate according to any one of claims 1 to 3; and a load beam provided on a surface of the metal support substrate.   5. A suspension with an element, comprising: the suspension according to claim 4; and a recording / reproducing element disposed on the suspension.   A hard disk drive comprising the suspension with an element according to claim 5. A method for manufacturing a suspension substrate, comprising: a metal support substrate; an insulating layer formed on the metal support substrate; and a wiring layer formed on the insulating layer and having a plating portion on a surface thereof.
A preparatory step of preparing an intermediate member that is formed in the opening of the insulating layer and includes a via portion that connects the wiring layer and the metal support member;
A plating part forming step of forming the plating part on the surface of the wiring layer by feeding from the metal support member;
Etching the metal support member, and forming a metal support substrate forming the metal support substrate insulated from the via portion,
In the metal support substrate forming step, the surface of the via portion in the opening on the metal support substrate side in the thickness direction is inside the surface on the metal support substrate side of the insulating layer around the opening. A method for manufacturing a suspension substrate, comprising:

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