JP2013206228A - Non-contact ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact IC card for reliably preventing the dysfunction of an IC chip due to a spot pressure load, and for maintaining printing quality by cancelling the generation of a small difference in level on the surface of an IC card.SOLUTION: A non-contact IC card with a multi-layer laminate structure is configured by laminating a plurality of core sheets 2, 3 and 4 and outer sheets 6 and 7 on both front and back surfaces of an inlet 1. The inlet 1 is configured by fixing an IC chip 12 to an antenna coil 11 of an antenna sheet 10, and disposing a reinforcement board 13 on the surface side of the IC chip 12. The IC chip 12 and the reinforcement board 13 are stored in a chip embedding hole 8 formed in the second core sheet 3 laminated on the surface side of the inlet 1. Thickness C3 of the third core sheet 4 laminated on the back face of the antenna sheet 10 is set so as to be smaller than thickness C1 of the first core sheet 2 laminated on the surface side of the second core sheet 3, and the IC chip 12 is disposed at a position deviated to the side of the third core sheet 4 from a central position P of the whole thickness of the IC card.

Description

  The present invention relates to a non-contact IC card having a multilayer laminate structure in which a plurality of core sheets and an exterior sheet are laminated on both front and back surfaces of an inlet. The inlet is configured by mounting an IC chip on an antenna sheet and further fixing a reinforcing plate on the surface of the IC chip.

  An IC card of this type of multilayer laminate structure is known from Patent Document 1, for example. There, an antenna pattern is formed on the upper surface of an insulating substrate (PET film) having a thickness of 50 μm, and an IC chip is mounted on the end of the pattern via a conductive film (chip adhesive). Further, after the sealing agent is applied to the upper surface of the IC chip, the reinforcing plate is pressed against the sealing agent to flow, and the sealing agent is thermally cured with the periphery of the IC chip covered with the sealing agent. A card sheet having a thickness of 250 μm is laminated on the upper and lower surfaces of a card blank (hereinafter referred to as an inlet) in this state, and an outer sheet having a thickness of 100 μm is further laminated on the upper and lower surfaces of the core sheet. The whole sheet is pressed and integrated while being heated by a press. In addition to the above-described reinforcing plate, Patent Document 1 also proposes an IC card in which a sealing agent is applied to the back side of the insulating substrate facing the IC chip mounting position and the reinforcing plate is fixed to the back side. .

  In the IC card according to the proposal of the present applicant, an IC card is configured by further stacking a large number of sheets (Patent Document 2). There, the antenna sheet, the inner sheet, and the clear sheet are laminated on the upper surface side of the base sheet, and the balance sheet and the clear sheet are laminated on the lower surface side of the base sheet, and then heat and pressure are applied to the entire laminated sheet. Is added and integrated. The obtained laminate is cut to form a loading recess, and an IC module is fitted into this loading recess and bonded and fixed. The IC module is configured by fixing an IC chip on the inner surface of the terminal substrate and fixing a contact terminal on the surface of the terminal substrate, and is in a non-contact state with respect to the card reader and in a state in which the contact is made via the contact terminal. In any state, communication can be performed.

Japanese Patent Laying-Open No. 2004-192568 (paragraph numbers 0057 to 0060, FIG. 2) JP 2004-005093 A (paragraph number 0021, FIG. 1)

  According to the IC card in which one side of the IC chip of Patent Document 1 is reinforced with a reinforcing plate, the point pressure strength of the IC card can be improved by adding the reinforcing plate. However, when a point pressure acts on the back side of the card in which the IC chip is embedded (the side on which the IC chip is not fixed), the load tends to concentrate on the IC chip, causing a malfunction.

  On the other hand, in the case of the IC card of Patent Document 1 in which both sides of the IC chip are reinforced with a pair of reinforcing plates, the point pressure load is dispersed with the reinforcing plates even if the point pressure acts on the embedded portion of the IC chip. Therefore, it is possible to well prevent the IC chip from being cracked. However, since the thickness of the inlet increases as much as the reinforcing plates are arranged on both the front and back sides of the IC chip, it is inevitable that a small step is formed on the card surface of the embedded portion of the IC chip, and printing is performed on the surface of the IC card. In such a case, it is inevitable that the print quality will deteriorate due to the distortion of characters and pictures.

  In the IC card of Patent Document 2, since the IC chip is fixed to the inner surface side of the terminal substrate, the front surface side of the IC chip can be reinforced with the terminal substrate and the contact terminal, and the back surface side of the IC chip can be reinforced with the laminate. Therefore, it is possible to prevent the IC chip from being malfunctioned due to the point pressure load. However, it is necessary to cut the laminate to form a loading recess, and it is necessary to prepare an IC module separately from the antenna sheet, so that the structure of the entire card is complicated and the cost is increased. I can't.

  It is an object of the present invention to reliably prevent malfunction of an IC chip due to a point pressure load, to eliminate the occurrence of a small step on the surface of an IC card, to maintain print quality, and to simplify the card structure. An object of the present invention is to provide a contactless IC card that can reduce the overall cost.

  The non-contact IC card according to the present invention is constructed by laminating a plurality of core sheets 2, 3, 4 and exterior sheets 6, 7 on both the front and back surfaces of the inlet 1 to form a multilayer laminate structure. The inlet 1 is configured by fixing the IC chip 12 to the antenna coil 11 of the antenna sheet 10 and further arranging the reinforcing plate 13 on the surface side of the IC chip 12. The IC chip 12 and the reinforcing plate 13 are accommodated in a chip embedding hole 8 provided in the second core sheet 3 laminated on the surface side of the inlet 1. The thickness C3 of the third core sheet 4 laminated on the back of the antenna sheet 10 is set to be smaller than the thickness C1 of the first core sheet 2 laminated on the front side of the second core sheet 3, so that the IC chip 12 It arrange | positions in the position deviated from the center position P of the thickness to the 3rd core sheet | seat 4 side, It is characterized by the above-mentioned.

  The thickness C2 of the second core sheet 3 is set to be the same as or slightly larger than the total thickness T of the IC chip 12 and the reinforcing plate 13 mounted on the antenna sheet 10.

  When the thickness of the IC chip 12 is B, the thickness C1 of the first core sheet 2 is set to be equal to or larger than twice the thickness B of the IC chip 12 (2 × B <= C1). The thickness C3 of the third core sheet 4 is set to be equal to or larger than half the thickness B of the IC chip 12 and smaller than three times the thickness B of the IC chip 12 (0. 5 × B <= C3 <3 × B).

  When the thickness of the IC chip 12 is B and the thickness of the reinforcing plate 13 is G, the thickness G of the reinforcing plate 13 is set to be equal to or larger than the thickness B of the IC chip 12 (B <= G).

  When the total thickness of the IC chip 12 and the reinforcing plate 13 mounted on the antenna sheet 10 is T, the thickness C3 of the third core sheet 4 is set to be equal to or greater than half the total thickness T. (0.5 × T <= C3).

  In the present invention, a plurality of core sheets 2, 3, 4 and exterior sheets 6, 7 are laminated on both the front and back surfaces of the inlet 1 to form a non-contact IC card in a multilayer laminate structure. Further, the thickness C3 of the third core sheet 4 laminated on the back side of the antenna sheet 10 is set smaller than the thickness C1 of the first core sheet 2 laminated on the front side of the second core sheet 3, so that the IC chip 12 is integrated with the IC card. It was arranged at a position deviated from the central position P of the total thickness toward the third core sheet 4 side.

  According to the non-contact IC card of the present invention configured as described above, not only when a point pressure load acts on the reinforcing plate 13 side, but also when a point pressure load acts on the IC chip 12 side, It is possible to improve the durability of the IC card by eliminating the failure of the IC chip 12 due to the point pressure load. Further, since the IC chip 12 is biased toward the third core sheet 4 side from the central position P of the entire thickness of the IC card, it is possible to avoid the complexity of the structure for protecting the IC chip 12. The overall cost can be reduced by simplifying the structure of the contact IC card.

  When the thickness C2 of the second core sheet 3 is set to be equal to or slightly larger than the total thickness T of the IC chip 12 and the reinforcing plate 13 mounted on the antenna sheet 10, the second core sheet 3 is set to the inlet 1. In the laminated state, the reinforcing plate 13 can be prevented from protruding from the chip embedding hole 8. Therefore, in the state where the exterior sheets 6 and 7 are laminated, it is possible to prevent a small step from occurring on the surface of the exterior sheet 6, to wipe out the distortion of characters and patterns printed on the card surface, and to achieve an appropriate print quality. Can be retained.

  The thickness C1 of the first core sheet 2 is set to be equal to or larger than twice the thickness B of the IC chip. If the value is smaller than the double value, the IC chip 12 is biased toward the first core sheet 2 side from the central position P of the total thickness of the IC card when the thickness of the exterior sheet 6 is specified, and the point pressure strength This is because of damage. Further, if the thickness C3 of the third core sheet 4 is smaller than half the value of the thickness B of the IC chip 12, the unevenness of the portion where the antenna coil 11 is formed affects the printing and the exterior finish is deteriorated. . Further, when the thickness C3 of the third core sheet 4 is larger than three times the thickness B of the IC chip, when the thickness of the exterior sheet 7 is specified, the IC chip 12 is not less than the total thickness of the IC card. This is because the point pressure strength is lost due to the bias toward the first core sheet 2 side from the central position P of the.

  The thickness G of the reinforcing plate 13 is set equal to or larger than the thickness B of the IC chip 12 when the thickness G of the reinforcing plate 13 is smaller than the thickness B of the IC chip 12. This is because the protective function is deteriorated and weakened by a point pressure impact from the outer exterior sheet 6.

  The thickness C3 of the third core sheet 4 is set to be equal to or larger than half the total thickness T of the IC chip 12 and the reinforcing plate 13 mounted on the antenna sheet 10. This is because the IC chip 12 is likely to be biased toward the third core sheet 4 side from the central position P of the total thickness of the IC card when the thickness C3 of the IC card is smaller than half the total thickness T.

It is a longitudinal cross-sectional view of the principal part of the non-contact IC card based on an Example. It is the top view which fractured | ruptured a part of non-contact IC card. It is a disassembled perspective view of a non-contact IC card. It is a disassembled front view shown in the state which isolate | separated the sheet | seat material which comprises an IC card. It is a longitudinal cross-sectional view of the principal part of the non-contact IC card which concerns on a comparative example. It is explanatory drawing which shows the test method of a point pressure strength test. It is a graph which shows the test result of a point pressure strength test.

(Example) FIG. 1 thru | or FIG. 4 shows the Example of the IC card based on this invention. 2 and 3, the IC card forms a laminate blank 5 by laminating a plurality of core sheets 2, 3, 4 on both the front and back surfaces of the inlet 1. Next, exterior sheets 6 and 7 are laminated on the front and back of the laminate blank 5 to form a card blank having a multilayer laminate structure, and an IC card is completed by performing printing and punching on the card blank. The inlet 1 includes an antenna sheet (substrate) 10 made of a PET film, an antenna coil 11 formed on the surface (upper surface) of the antenna sheet 10, an IC chip 12 fixed to the antenna coil 11, and a surface of the IC chip 12. It is comprised by the reinforcement board 13 etc. which are adhere | attached on the side. Of the first to third core sheets 2, 3, 4, the central second core sheet 3 stacked on the surface of the inlet 1 has a chip embedding hole 8 for accommodating the IC chip 12 and the reinforcing plate 13. Is formed in a square shape.

  The antenna coil 11 is formed by etching a thin layer of copper or aluminum, and includes a coil portion 11 a formed in a spiral shape along the periphery of the rectangular antenna sheet 10. An IC chip 12 is connected to coil end portions 11b at both ends of the coil portion 11a via a chip adhesive 14 made of a conductive paste. Specifically, the chip adhesive 14 is disposed on the antenna sheet 10 so as to cover the outer surface of the coil end portion 11b of the antenna coil 11, and the IC chip 12 is pressed against the chip adhesive 14 to be heated and solidified. The chip 12 is fixed to the antenna sheet 10. The adhesive surface of the IC chip 12 in this state is separated from the antenna sheet 10 by the thickness of the coil end portion 11b of the antenna coil 11. The side dimension of the IC chip 12 is 4 mm, and the thickness B (see FIG. 4) is 50 μm. As the chip adhesive 14, a paste-like or film-like conductive adhesive can be used. The thickness of the antenna sheet 10 is 40 μm, the thickness of the antenna coil 11 is 30 μm, and the total thickness of both is 70 μm.

  The reinforcing plate 13 is made of a thin stainless steel plate (metal thin plate) and is formed in a circular shape that is slightly larger than the IC chip 12. Specifically, a thin stainless steel plate having a thickness G of 130 μm was punched out into a circular shape having a diameter of 6.5 mm with a press machine to obtain a reinforcing plate 13. After the epoxy adhesive 17 is applied to the upper surface of the IC chip 12, the reinforcing plate 13 is pressed against the adhesive 17, whereby the reinforcing plate 13 and the IC chip 12 can be integrated to form the inlet 1. . The total thickness T (see FIG. 4) of the IC chip 12 and the reinforcing plate 13 when the adhesive 17 is solidified is 200 to 250 μm. The total thickness T has a width because the thickness when the adhesive 17 is solidified varies.

  Laminated blanks 5 are formed by laminating the first to third core sheets 2, 3, and 4 formed of a sheet material of PET-G resin on the obtained inlet 1 and laminating the sheets 2 to 4. . Specifically, the second core sheet 3 is laminated on the surface side of the inlet 1, and the IC chip 12 and the reinforcing plate 13 are accommodated in the chip embedding hole 8. Further, the first core sheet 2 is laminated on the front surface side of the second core sheet 3, and the third core sheet 4 is laminated on the back surface side of the inlet 1. The entire laminated sheet in this state is pressurized while being heated by a press, and the core sheets 2, 3, 4 are brought into close contact with each other and integrated with the inlet 1. The thickness C1 of the first core sheet 2 is 160 μm, the thickness C2 of the second core sheet 3 is 250 μm, the thickness C3 of the third core sheet 2 is 75 μm, and the total thickness of the laminated sheets before hot pressing is 555 μm. Become. As described above, the thicknesses C1, C2, and C3 of the core sheets 2, 3, and 4 are set so that the thickness of the second core sheet 3 is maximized and the first core sheet 2 and the third core sheet 4 are sequentially reduced. is there.

  Next, the exterior sheets 6 and 7 are laminated on the front and back of the laminate blank 5, and the entire laminated sheet is pressed while being heated by a press machine, so that the exterior sheets 6 and 7 are integrated with the laminate blank 5. The exterior sheets 6 and 7 are each formed of a sheet material of PET resin, and the thickness thereof is 125 μm. The obtained card blank having a multilayer laminate structure is printed, embossed as necessary, and further punched to complete a non-contact IC card.

  As described above, since the thickness of the second core sheet 3 is 250 μm, the IC chip 12 and the reinforcing plate 13 are accommodated in the chip embedding hole 8, and the second core sheet 3 is laminated in the inlet 1. The plate 13 does not protrude from the chip embedding hole 8. Therefore, in the state where the exterior sheets 6 and 7 are laminated, the surface of the exterior sheet 6, that is, the surface of the IC card is prevented from having a small step, and the distortion of characters and patterns printed on the card surface is wiped out. The print quality can be maintained in an appropriate state. In the state where the laminate blank 5 is completed, the first core sheet 2 is in close contact with the reinforcing plate 13 to completely block the upper opening surface of the chip embedding hole 8.

  According to the IC card having the multilayer laminate structure configured as described above, the IC chip 12 is offset toward the third core sheet 4 side from the center position P (see FIG. 1) of the total thickness (775 μm) of the IC card. Can be placed in position. As described above, since the thickness of the reinforcing plate 13 is 130 μm, the thickness of the first core sheet 2 is 160 μm, and the thickness of the exterior sheet 6 is 125 μm, the total of these is 130 + 160 + 125 = 415 μm. Therefore, the center position P in this embodiment is a position shifted from the back surface of the reinforcing plate 13 to the front surface side by about 28 μm.

  (Point pressure strength test) The present inventors conducted a point pressure strength test in order to confirm the point pressure strength of the IC card according to the above example. For the point pressure test, 10 IC cards according to the above embodiment are prepared, and for comparison, 10 comparison IC cards having a different laminated structure from the above embodiment are prepared. The point pressure intensity on the back side and the point pressure intensity on the surface side were confirmed.

  FIG. 5 shows the structure of a comparative IC card. The basic structure such as the total pressure dimension of the IC card for comparison is the same as that of the IC card of the embodiment described above, but the thicknesses of the first core sheet 2 and the third core sheet 4 are different from those of the previous embodiment. ing. Specifically, the thickness C4 of the first core sheet 2 of the comparative IC card was 75 μm, and the thickness C5 of the third core sheet 4 was 160 μm. The inlet 1, the second core sheet 3, and the exterior sheets 6 and 7 were the same as in the previous examples. In the case of the IC card for comparison, since the thickness C5 of the third core sheet 4 is 160 μm, the IC chip 12 has a bonding surface with the reinforcing plate 13 on the surface side from the central position P of the total thickness of the IC card. Will be located.

  The point pressure strength test was performed as shown in FIG. Is the IC card A placed on the upper surface of the test table 21 and fixed by the holder 22, and the test weight 23 is dropped from the upper surface of the IC card A so that the IC chip 12 of the IC card A after the drop functions properly? I confirmed it. A through hole 24 is formed in the test table 21, and the IC card A is fixed to the test table 21 so that the chip embedded portion is located in the center of the through hole 24. The test weight 23 was made of an iron ingot having a weight of 50 g, and its lower surface was formed of a hemispherical surface 25 having a spherical radius of 10 mm. The drop height H (m) of the test weight 23 from the upper surface of the IC card A was changed in five stages so that the collision energy when the test weight 23 collided with the chip embedded portion gradually increased.

  The result of the point pressure strength test is shown in the chart of FIG. In the table, surface 1 means that the IC card A is placed on the test table 21 with the IC chip 12 on the upper surface side, that is, the test weight 23 falls on the back side of the IC card A. ing. Further, in the chart, the surface 2 means a state where the reinforcing plate 13 is on the upper surface side, that is, a case where the test weight 23 falls on the surface side of the IC card A. Of the 10 test cards, 5 dropped the test weight 23 on the chip embedded portion on the surface 1 side, and the remaining 5 dropped the test weight 23 on the chip embedded portion on the surface 2 side. The circles in the chart mean that the IC chip 12 functioned properly as a result of communication between the IC card A removed from the test table 21 after the collision of the test weight 23 and the reader / writer. The X mark means that the IC chip 12 did not function properly.

  As is apparent from the chart, in the case of the IC card according to the above embodiment, nine test cards excluding the No2 test card out of the ten test cards are on the surface 1 side and the surface 2 side. It can be seen that the IC chip 12 is functioning properly even when a point pressure is applied to any surface. In the No. 2 test card, the IC chip 12 did not function properly only when the maximum collision energy was applied to the chip embedded portion on the surface 1 side. From this test result, it can be seen that the point pressure strength can be satisfied with the laminated structure of the core sheet described in the examples.

  On the other hand, in the case of the comparative IC card, when the collision energy acts on the reinforcing plate 13 side, that is, when the point pressure acts on the surface 2 side, the IC chips 12 of the five IC cards A are used. Is generally functioning properly. However, when point pressure acts on the surface 1 side, it is confirmed that the IC chip 12 does not function properly in the No1 test card and the No3 test card even when the collision energy is minimum. It was. In addition, the remaining three test cards also confirmed that the IC chip 12 did not function properly until the collision energy increased to the third highest level, and the function of the IC chip 12 was impaired by point pressure impact. It was done.

  As a precaution, the IC card A used in the point pressure test was disassembled and the state of the IC chip 12 was confirmed. However, in the case of a comparative IC card, the circuit forming surface (coil end 11b of the IC chip 12). On the side of the joint surface), traces of damage such as cracks were clearly observed. However, in the IC chip 12 according to the example, no traces such as cracks were observed on either the circuit formation surface side or the adhesion surface side with the reinforcing plate 13.

  As described above, when the thickness C3 of the third core sheet 4 is set to be smaller than the thickness C1 of the first core sheet 2 (C3 <C1), the thickness of the sheet layer on the back surface side from the IC chip 12 is reduced. Compared to the case of setting C3> = C1), it is common sense that the protective function for the IC chip 12 is reduced by the smaller thickness. However, since the reverse result is actually obtained, the present inventors examined the reason.

  One of the reasons is that the circuit forming surface side of the IC chip 12 is resistant to compressive strain, but has a characteristic that it is weak to tensile strain. Therefore, when the tensile strain acts on the circuit forming surface of the IC chip 12, it is damaged. It seems to occur easily. It should be noted that there is no difference in strength on either side of the adhesive surface of the IC chip 12 with the reinforcing plate 13 with respect to either strain. Further, it has been found that the point pressure strength of the IC chip 12 in the inlet alone is superior to the case where the core sheet 2 to 4 and the exterior sheets 6 and 7 are laminated on the inlet 1 to form a card.

  When a point load is applied to the exterior sheet 7 on the back surface side of the IC chip 12, compressive strain occurs in the third core sheet 4 and the exterior sheet 7, and tensile strain occurs in the first core sheet 2 and the exterior sheet 6. Occurs. Further, the IC chip 12 tends to bend in the same direction as the third core sheet 4 on the circuit forming surface (the side of the joint surface with the coil end portion 11 b). However, as described above, the circuit forming surface side of the IC chip 12 is resistant to compression strain, and the IC chip 12 is biased toward the third core sheet 4 side from the central position P of the entire thickness of the IC card. Therefore, it is presumed that the IC chip 12 receives a point pressure load in a state close to a single inlet. Moreover, since the thickness C1 of the 1st core sheet 2 is thicker than the thickness C3 of the 3rd core sheet 4, the 1st core sheet 2 exhibits a bigger deformation stress with respect to tensile distortion. As a result, it is considered that when the point load is applied to the exterior sheet 7 on the back side of the IC chip 12, the IC chip 12 can be prevented from cracking and malfunctioning.

  On the other hand, when a point pressure acts on the exterior sheet 6 on the surface side of the IC chip 12, the first core sheet 2 and the exterior sheet 6 are compressed and strained, and the third core sheet 4 and the exterior sheet 7 are pulled. Distortion occurs. However, since the point pressure load acting on the chip embedded portion can be dispersed by the reinforcing plate 13, the point pressure load is prevented from concentrating on the IC chip 12, and in this case, the IC chip 12 is prevented from cracking. it can. Further, tensile strain acts on the circuit forming surface side of the IC chip 12, but the first core sheet 2 is compressed by the thickness C1 of the first core sheet 2 larger than the thickness C3 of the third core sheet 4. Distortion can be reduced. Along with this, it is presumed that the fact that the tensile strain on the circuit forming surface side of the IC chip 12 can be reduced is also a factor that can prevent cracking of the IC chip 12.

The IC card according to the above embodiment can be implemented in the following form.
When the thickness of the IC chip 12 is B, the thickness C1 of the first core sheet 2 is set to be equal to or larger than twice the thickness B of the IC chip 12 (2 × B <= C1). Further, the thickness C3 of the third core sheet 4 is set to be equal to or larger than half the thickness B of the IC chip 12 and smaller than three times the thickness B of the IC chip 12 ( 0.5 × B <= C3 <3 × B).

  When the thickness C1 of the first core sheet 2 is smaller than twice the thickness B of the IC chip 12, when the thickness of the exterior sheet 6 is specified, the IC chip 12 is equal to the total thickness of the IC card. The center pressure P deviates toward the first core sheet 2 and the point pressure strength is impaired. If the thickness of the exterior sheet 6 is not specified, the exterior sheet 6 may be thickened so that the IC chip 12 is biased toward the third core sheet 4 side from the central position P of the entire thickness of the IC card. If the thickness C3 of the third core sheet 4 is smaller than half the value of the thickness B of the IC chip 12, the unevenness of the portion where the antenna coil 11 is formed affects the printing, resulting in poor exterior finish. Further, when the thickness C3 of the third core sheet 4 is larger than three times the thickness B of the IC chip 12, when the thickness of the exterior sheet 7 is prescribed, The point pressure strength is lost due to the deviation from the central position P of the thickness toward the first core sheet 2 side. When the thickness of the exterior sheet 7 is not specified, the exterior sheet 7 may be thinned so that the IC chip 12 is offset toward the third core sheet 4 side from the central position P of the total thickness of the IC card.

  When the thickness of the IC chip 12 is B and the thickness of the reinforcing plate 13 is G, the thickness G of the reinforcing plate 13 is set to be equal to or larger than the thickness B of the IC chip 12 (B <= G). When the thickness G of the reinforcing plate 13 is smaller than the thickness B of the IC chip 12, the protection function of the reinforcing plate 13 against the point pressure impact is lowered, and it becomes weak against the point pressure impact from the outer exterior sheet 6.

  When the total thickness of the IC chip 12 and the reinforcing plate 13 mounted on the antenna sheet 10 is T, the thickness C3 of the third core sheet 4 is set to be equal to or greater than half the total thickness T. (0.5 × T <= C3). When the thickness C3 of the third core sheet 4 is smaller than half of the total thickness T, the IC chip 12 is likely to be biased toward the third core sheet 4 side from the central position P of the total thickness of the IC card.

  The size of the IC chip 12 varies in the range where the side dimension is 2 to 4 mm and the thickness B is 50 to 80 μm. The thickness G of the reinforcing plate 13 varies in the range of 100 to 150 μm. The thickness of the antenna sheet 10 varies in the range of 15 to 50 μm. The height dimension from the upper surface of the coil end portion 11 b to the lower surface of the reinforcing plate 13 varies in the range of 75 to 180 μm depending on the thickness of the IC chip 12. The first core sheet 2 and the front side exterior sheet 6 can be formed of the same sheet material, and the third core sheet 4 and the back side exterior sheet 7 can be formed of the same sheet material. The total thickness of the third core sheet 4 and the backside exterior sheet 7 may be 100 μm or more. If the total thickness is less than 100 μm, the unevenness of the portion where the antenna coil 11 is formed affects printing, The finish is poor. The thickness of each core sheet 2, 3, 4 is set to C2> C1> C3. In the point pressure strength test in the embodiment, the case where the 50 g test weight 23 is used has been described. However, the weight of the test weight 23 may be changed in the range of 50 to 100 g.

  In the above embodiment, the thickness C3 of the third core sheet 4 is set to 75 μm. However, the thickness C3 may be at least 50 μm and may be equal to or less than the thickness C1 of the first core sheet 2. The thickness C2 of the second core sheet 3 can be changed according to the total thickness T of the IC chip 12 and the reinforcing plate 13. The reinforcing plate 13 does not need to be circular, and can be formed in a polygonal shape such as a quadrangle or a hexagon, and the forming material is formed of a plastic material other than a metal plate, or FRP reinforced with glass fiber or carbon fiber. be able to. The chip embedding hole 8 can be formed in a circular shape or a polygonal shape such as a quadrangle or a hexagon.

DESCRIPTION OF SYMBOLS 1 Inlet 2 1st core sheet 3 2nd core sheet 4 3rd core sheet 5 Laminate blank 6 Exterior sheet 7 Exterior sheet 10 Antenna sheet (board | substrate)
11 Antenna coil 12 IC chip 13 Reinforcing plate

Claims (5)

A non-contact IC card having a multilayer laminate structure in which a plurality of core sheets (2, 3, 4) and an exterior sheet (6, 7) are laminated on both front and back surfaces of the inlet (1),
The inlet (1) is configured by fixing the IC chip (12) to the antenna coil (11) of the antenna sheet (10) and further arranging a reinforcing plate (13) on the surface side of the IC chip (12). ,
The IC chip (12) and the reinforcing plate (13) are accommodated in a chip embedding hole (8) provided in the second core sheet (3) laminated on the surface side of the inlet (1),
The thickness (C3) of the third core sheet (4) laminated on the back of the antenna sheet (10) is smaller than the thickness (C1) of the first core sheet (2) laminated on the front side of the second core sheet (3). A non-contact IC card which is set and arranged at a position where the IC chip (12) is biased toward the third core sheet (4) from the central position (P) of the total thickness of the IC card. .   The thickness (C2) of the second core sheet (3) is the same as or slightly larger than the total thickness (T) of the IC chip (12) and the reinforcing plate (13) mounted on the antenna sheet (10). The non-contact IC card according to claim 1, which is set. When the thickness of the IC chip (12) is (B), the thickness (C1) of the first core sheet (2) is equal to or twice the value (B) of the thickness (B) of the IC chip (12). Is set large (2 × B <= C1),
The thickness (C3) of the third core sheet (4) is set to be equal to or larger than half the thickness (B) of the IC chip (12), and the thickness (B) of the IC chip (12). The non-contact IC card according to claim 1 or 2, wherein the non-contact IC card is set to be smaller than three times (0.5 × B <= C3 <3 × B). When the thickness of the IC chip (12) is (B) and the thickness of the reinforcing plate (13) is (G),
The thickness (G) of the reinforcing plate (13) is set to be equal to or greater than the thickness (B) of the IC chip (12) (B <= G). Non-contact IC card of description. When the total thickness of the IC chip (12) and the reinforcing plate (13) mounted on the antenna sheet (10) is (T),
The thickness (C3) of the third core sheet (4) is set to be equal to or larger than a half value of the total thickness (T) (0.5 × T <= C3). The non-contact IC card according to any one of the above.

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