JP2013206122A - Ic module and ic card loaded with the same - Google Patents

Ic module and ic card loaded with the same Download PDF

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Publication number
JP2013206122A
JP2013206122A JP2012074340A JP2012074340A JP2013206122A JP 2013206122 A JP2013206122 A JP 2013206122A JP 2012074340 A JP2012074340 A JP 2012074340A JP 2012074340 A JP2012074340 A JP 2012074340A JP 2013206122 A JP2013206122 A JP 2013206122A
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module
chip
sealing resin
card
protrusion
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Masahito Tsujii
雅人 辻井
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Toppan Inc
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Toppan Printing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable IC module and a card for which the IC module is used by reducing the influence of an external force to be imposed on sealing resin in the IC module.SOLUTION: A small protrusion 4 which is smaller in width than IC module sealing resin 7 is formed on the bottom face of an opening 2a of a module base material 2 faced to the bottom face of the IC module sealing resin 7. When an external force is added, and peeling is almost generated between the module base material 2 and the sealing resin 7 due to a shear force caused by flexure deformation generated in an IC module 8, the peeling is stopped by the protrusion 4 to be hardly generated. Thus, it is possible to suppress the generation of a defective mode in which the breaking of a bonding wire 6 is generated.

Description

本発明は、ＩＣチップを内蔵したＩＣモジュールの構造及びＩＣモジュールを搭載したＩＣカードの構造に関するものである。   The present invention relates to the structure of an IC module incorporating an IC chip and the structure of an IC card on which the IC module is mounted.

中央処理装置や半導体メモリー等のＩＣチップを内蔵するＩＣカードは、従来の磁気カードに比べて、高度な暗号化による高いセキュリティを有し、記憶できるデータ容量が大きいため、磁気カードに代わって普及し、広く利用されている。
接触型ＩＣカードは合成樹脂などを基材とするカード本体にＩＣチップが内蔵され、カード表面に露出した電気伝導素子である接触端子が設けられている。読み書き装置のカードスロットにＩＣカードを挿入し、ＩＣカードの接触端子と読み書き装置の端子を接触させることでデータの送受信を行なう。接触式ＩＣカードは、大量データ交換や決済業務等交信の安全性が求められる用途である、キャッシュカードやクレジットカード等で利用されている。 IC cards with built-in IC chips, such as central processing units and semiconductor memories, have a higher level of security due to advanced encryption and a larger data capacity than conventional magnetic cards. And widely used.
In the contact type IC card, an IC chip is built in a card body having a synthetic resin or the like as a base material, and a contact terminal which is an electrically conductive element exposed on the card surface is provided. Data is transmitted and received by inserting an IC card into the card slot of the read / write device and bringing the contact terminal of the IC card into contact with the terminal of the read / write device. Contact type IC cards are used in cash cards, credit cards, and the like, which are uses that require safety in communication such as large-volume data exchange and settlement operations.

図５に、一例として、従来の接触型のＩＣモジュールの断面構造を示す。図５では、モジュール基材２を挟んでＩＣチップ５と外部端子１を配置し、該ＩＣチップ５と外部端子１とがモジュール基板開口部２ａを介してボンディングワイヤ６で接続し、該ＩＣチップ５周囲に、これとボンディングワイヤ６とを埋め込むように封止樹脂７を形成することで、ＩＣモジュール８が形成されている。   FIG. 5 shows a cross-sectional structure of a conventional contact type IC module as an example. In FIG. 5, the IC chip 5 and the external terminal 1 are arranged with the module base 2 interposed therebetween, and the IC chip 5 and the external terminal 1 are connected by the bonding wire 6 through the module substrate opening 2a. An IC module 8 is formed by forming a sealing resin 7 so as to embed this and the bonding wire 6 around 5.

ＩＣカードにおけるＩＣモジュール８の破壊モードの一つに、外部端子１側から物体で押込まれるなどの外力を受けた際に、ＩＣモジュール８に生じた曲げ変形による剪断力によって、モジュール基材２と封止樹脂７間が剥離し、これに伴ってボンディングワイヤ６が断線する不良モードがある。
外力による前記の曲げ変形を回避する方法としては、ＩＣチップを球状にすることで、ＩＣチップ自体が曲げによって破壊しないＩＣモジュール構造が提案されている（特許文献１参照）。 One of the destruction modes of the IC module 8 in the IC card is the module base material 2 due to a shearing force caused by bending deformation generated in the IC module 8 when receiving an external force such as being pushed by an object from the external terminal 1 side. There is a failure mode in which the sealing resin 7 is peeled off and the bonding wire 6 is disconnected accordingly.
As a method of avoiding the bending deformation due to external force, an IC module structure has been proposed in which the IC chip itself is made spherical so that the IC chip itself is not broken by bending (see Patent Document 1).

しかしながら、特許文献１に示された構造では、外力によってＩＣモジュール８に曲げによる剪断力が生じた際に、モジュール基材２と封止樹脂７間に生じる剥離によってボンディングワイヤ断線が生じてしまうという不良モードは解決されていない。   However, in the structure shown in Patent Document 1, when a shearing force due to bending is generated in the IC module 8 by an external force, the bonding wire breakage occurs due to peeling between the module base 2 and the sealing resin 7. Bad mode has not been resolved.

特開２００１−３２５５７６号公報JP 2001-325576 A

本発明は、上述の問題を解決するためになされたものであり、ＩＣカード内のボンディングワイヤの断線不良発生率を低減し、信頼性の高いＩＣカードを提供することを目的とする。   The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a highly reliable IC card by reducing the occurrence rate of defective bonding wires in the IC card.

本発明の第一の態様は、モジュール基材の一方の面にＩＣチップを配置するとともに、前記ＩＣチップを封止樹脂で覆い、さらに前記モジュール基材の他方の面に外部端子を配置した接触型ＩＣカード用のＩＣモジュールであって、前記モジュール基板の前記ＩＣチップを有する面における前記ＩＣチップの周囲に、前記封止樹脂内に埋設される突起を形成したことを特徴とする。   The first aspect of the present invention is a contact in which an IC chip is arranged on one surface of a module substrate, the IC chip is covered with a sealing resin, and an external terminal is arranged on the other surface of the module substrate. An IC module for a type IC card, wherein a protrusion embedded in the sealing resin is formed around the IC chip on the surface of the module substrate having the IC chip.

本発明の第二の態様は、前記第一の態様において、前記突起を前記ＩＣチップの周囲を一周させて連続形成したことを特徴とする。
本発明の第三の態様は、前記第一の態様において、前記突起を前記ＩＣチップの周囲を一周させる方向に断続させて複数形成したことを特徴とする。
本発明の第四の態様は、前記第一ないし第三の態様のいずれか１態様において、前記ＩＣモジュールが前記ＩＣチップと前記外部端子をボンディングワイヤにより接続されている形式のものであって、前記ボンディングワイヤを通過させるためにモジュール基材に設けられた開口部よりも前記ＩＣチップから離れた側に前記突起を設けたことを特徴とする。
本発明の第五の態様は、前記第一ないし第四の態様のいずれか１態様に記載のＩＣモジュールを搭載したことを特徴とするＩＣカードである。 According to a second aspect of the present invention, in the first aspect, the protrusion is formed continuously around the circumference of the IC chip.
A third aspect of the present invention is characterized in that, in the first aspect, a plurality of the protrusions are formed intermittently in a direction of making a round around the IC chip.
According to a fourth aspect of the present invention, in any one of the first to third aspects, the IC module is of a type in which the IC chip and the external terminal are connected by a bonding wire, The protrusion is provided on a side farther from the IC chip than an opening provided in the module base material for allowing the bonding wire to pass therethrough.
According to a fifth aspect of the present invention, there is provided an IC card comprising the IC module according to any one of the first to fourth aspects.

本発明は、ＩＣモジュールに外部端子側から物体で押込まれるなどの外力を受けた際に、ＩＣモジュールに生じた曲げ変形による剪断力によってモジュール基材と封止樹脂間に剥離が生じようとしても、その剥離は突起により止められて生じにくくなり、その結果ボンディングワイヤの断線が生じるという不良モードの発生を抑制することができる。   In the present invention, when an external force such as an object is pushed into the IC module from the external terminal side, peeling is likely to occur between the module base material and the sealing resin due to a shearing force caused by bending deformation generated in the IC module. However, the peeling is stopped by the protrusions and hardly occurs, and as a result, the occurrence of a failure mode in which the bonding wire is disconnected can be suppressed.

（ａ）本発明のＩＣモジュールの一実施形態を示す概略平面図である。（ｂ）本発明のＩＣモジュールの一実施形態を示す概略底面図である。（ｃ）本発明のＩＣモジュールの一実施形態を示す図１（ａ）中のＡ−Ａ´における概略断面図である。(A) It is a schematic plan view which shows one Embodiment of the IC module of this invention. (B) It is a schematic bottom view which shows one Embodiment of the IC module of this invention. (C) It is a schematic sectional drawing in AA 'in Fig.1 (a) which shows one Embodiment of the IC module of this invention. （ａ）本発明のＩＣカードの一実施形態を示す概略平面図である。（ｂ）本発明のＩＣカードの一実施形態を示す概略底面図である。(A) It is a schematic plan view which shows one Embodiment of the IC card of this invention. (B) It is a schematic bottom view which shows one Embodiment of the IC card of this invention. （ａ）本発明のＩＣモジュールの一実施形態を示す概略平面図である。（ｂ）本発明のＩＣモジュールの一実施形態を示す概略底面図である。（ｃ）本発明のＩＣモジュールの一実施形態を示す図１（ａ）中のＡ−Ａ´における概略断面図である。(A) It is a schematic plan view which shows one Embodiment of the IC module of this invention. (B) It is a schematic bottom view which shows one Embodiment of the IC module of this invention. (C) It is a schematic sectional drawing in AA 'in Fig.1 (a) which shows one Embodiment of the IC module of this invention. （ａ）本発明のＩＣモジュールの一実施形態を示す概略平面図である。（ｂ）本発明のＩＣモジュールの一実施形態を示す概略底面図である。（ｃ）本発明のＩＣモジュールの一実施形態を示す図１（ａ）中のＡ−Ａ´における概略断面図である。(A) It is a schematic plan view which shows one Embodiment of the IC module of this invention. (B) It is a schematic bottom view which shows one Embodiment of the IC module of this invention. (C) It is a schematic sectional drawing in AA 'in Fig.1 (a) which shows one Embodiment of the IC module of this invention. （ａ）従来のＩＣモジュールの一実施形態を示す概略平面図である。（ｂ）従来のＩＣモジュールの一実施形態を示す概略底面図である。（ｃ）従来のＩＣモジュールの一実施形態を示す図７（ａ）中のＡ−Ａ´における概略断面図である。(A) It is a schematic plan view which shows one Embodiment of the conventional IC module. (B) It is a schematic bottom view which shows one Embodiment of the conventional IC module. (C) It is a schematic sectional drawing in AA 'in FIG. 7 (a) which shows one Embodiment of the conventional IC module.

（第１の実施形態）
図１、２は本発明の第１の実施形態を示す図であり、図１はＩＣモジュール８を示し、図２は前記ＩＣモジュール８を搭載したＩＣカード１０を示している。
先ずＩＣモジュール８は、ワイヤボンディング用の開口２ａをＩＣチップ５の周囲に複数開設したモジュール基材２と、前記モジュール基材２の一方の面に接着剤（図示せず）で貼り付けられたＩＣチップ５と、前記モジュール基材２の他方の面に配置された外部端子１とを有している。前記ＩＣチップ５と外部端子１は前記モジュール基材２の開口２ａを通して、ボンディングワイヤ６で接続されている。 (First embodiment)
1 and 2 are views showing a first embodiment of the present invention. FIG. 1 shows an IC module 8, and FIG. 2 shows an IC card 10 on which the IC module 8 is mounted.
First, the IC module 8 was affixed to one surface of the module base 2 with an adhesive (not shown), and a module base 2 having a plurality of wire bonding openings 2a around the IC chip 5. It has an IC chip 5 and external terminals 1 arranged on the other surface of the module base 2. The IC chip 5 and the external terminal 1 are connected by a bonding wire 6 through the opening 2 a of the module base 2.

また前記モジュール基板２の前記ＩＣチップを有する面には、前記ＩＣチップの周囲に突起４を形成している。前記突起４は、前記複数の開口２ａにおける前記ＩＣチップ５よりも遠い側で、複数の開口２ａを囲むように、角を丸めた四角形の無端状に連続させて形成されている。また、前記モジュール基材２の前記ＩＣチップ５側の面には、前記ＩＣチップ５、各開口２ａ，ボンディングワイヤ６、突起４をいずれも埋め込んで封止するように、トランスファーモールド工程を使用して封止樹脂７を施している。図１（ｂ）は底面図であるから、封止樹脂７内に埋没している突起４は製図法からみれば破線で記載されるところであるが、この突起４が本発明の主要な構成になっていることから敢えて黒塗りで表してある。   On the surface of the module substrate 2 having the IC chip, a protrusion 4 is formed around the IC chip. The protrusions 4 are continuously formed in a square endless shape with rounded corners so as to surround the plurality of openings 2a on the side farther than the IC chip 5 in the plurality of openings 2a. Further, a transfer molding process is used so that the IC chip 5, each opening 2 a, the bonding wire 6, and the protrusion 4 are all embedded and sealed on the surface of the module base 2 on the IC chip 5 side. The sealing resin 7 is applied. Since FIG. 1B is a bottom view, the protrusion 4 embedded in the sealing resin 7 is described by a broken line when viewed from the drawing method, but this protrusion 4 is the main structure of the present invention. Because it is, it is dared to be painted black.

これにより、ＩＣモジュール８が外部端子１側から物体で押し込まれるなどの外力を受けた際に、ＩＣモジュール８に生じた曲げ変形によって生じる、モジュール基材２と封止樹脂７間の剪断力による剥離が突起４で止められることで前記剥離は生じにくくなり、その結果ボンディングワイヤ６の断線不良を抑制することができる。
上記理由を以下に説明する。 As a result, when the IC module 8 receives an external force such as being pushed by an object from the external terminal 1 side, it is caused by a shearing force between the module base 2 and the sealing resin 7 caused by bending deformation generated in the IC module 8. Since the peeling is stopped by the protrusion 4, the peeling hardly occurs, and as a result, the disconnection failure of the bonding wire 6 can be suppressed.
The reason will be described below.

まず、モジュール基材２と封止樹脂７の界面が剥離し摩擦がないＩＣモジュール構造で、これに外部端子１側から物体で外力を加えることで湾曲した状態を考える。外部端子１側にある面を上面、反対側の面を底面とすると、モジュール基材２の底面には引張力が、封止樹脂７の上面には圧縮力が働く。
実際のＩＣモジュール８では、外部端子１側から外力を受けて曲げが生じた場合、モジュール基材２と封止樹脂７の界面は結合しており、ずれることができないから、上記引張力と圧縮力の差である剪断力が界面に発生し、この剪断力がある値以上になった場合に、剥離が発生すると考えられる。 First, consider an IC module structure in which the interface between the module substrate 2 and the sealing resin 7 is peeled off and has no friction, and is curved by applying an external force from the external terminal 1 side with an object. When the surface on the external terminal 1 side is the top surface and the opposite surface is the bottom surface, a tensile force acts on the bottom surface of the module base 2 and a compressive force acts on the top surface of the sealing resin 7.
In the actual IC module 8, when an external force is applied from the external terminal 1 side and bending occurs, the interface between the module base 2 and the sealing resin 7 is bonded and cannot be displaced. It is considered that peeling occurs when a shearing force that is a difference in force is generated at the interface and the shearing force exceeds a certain value.

本発明の構造では、外力を受けてＩＣモジュール８に曲げが生じた場合、モジュール基材２の底面に生じる引張力の一部を突起４（の側面）によって封止樹脂７が担うため、封止樹脂７上面に掛かる圧縮力が軽減され、モジュール基材２と封止樹脂７の界面に生じる引張力と圧縮力の差である剪断力が低下し、剥離しにくくなる。
かかるＩＣモジュール８をカード基材９に、外部端子１を露出させて組み込んだのが、図２に示す本発明のＩＣカード１０である。このＩＣカード１は、ＩＣチップ５内の情報の送受信および書き換えなどに用いる端子を備えていてもよい。この端子は、１）電気伝導素子である接触端子、２）アンテナコイルなどの非接触端子、などが挙げられる。 In the structure of the present invention, when the IC module 8 is bent due to an external force, the sealing resin 7 bears a part of the tensile force generated on the bottom surface of the module base 2 by the projection 4 (the side thereof). The compressive force applied to the upper surface of the stop resin 7 is reduced, the shearing force that is the difference between the tensile force and the compressive force generated at the interface between the module substrate 2 and the sealing resin 7 is lowered, and it becomes difficult to peel off.
An IC card 10 according to the present invention shown in FIG. 2 is assembled in such a manner that the IC module 8 is incorporated in the card base 9 with the external terminals 1 exposed. The IC card 1 may include terminals used for transmission / reception and rewriting of information in the IC chip 5. Examples of this terminal include 1) a contact terminal which is an electrically conductive element, and 2) a non-contact terminal such as an antenna coil.

（第２の実施形態）
以下、図３を参照して第２の実施形態について説明する。
第２の実施形態は、突起４を、複数のモジュール基材開口部２ａを囲んではいるものの、四角状の各辺の中間部には設けずに、４つの角を囲むように形成した。封止樹脂７が平面において大体四角状に形成されているため、その角の部分がモジュール基材２から剥がれやすいところであるが、特にその部分を養生するためにこのように突起４を形成したものである。また、このようにすることで突起４の材料の使用量を軽減することができる。また、他の構成と作用については第１の実施形態と同一であり、このＩＣモジュール８を使用してＩＣカードを作成する点も第１の実施形態と同一である。 (Second Embodiment)
Hereinafter, a second embodiment will be described with reference to FIG.
In the second embodiment, although the protrusion 4 surrounds the plurality of module substrate openings 2a, it is formed so as to surround four corners without being provided in the middle part of each square side. Since the sealing resin 7 is formed in a substantially square shape on a plane, the corner portion is easily peeled off from the module base material 2, and in particular, the projection 4 is formed in this way to cure the portion. It is. Moreover, the usage-amount of the material of the processus | protrusion 4 can be reduced by doing in this way. Other configurations and operations are the same as those of the first embodiment, and the point that an IC card is created using the IC module 8 is also the same as that of the first embodiment.

（第３の実施形態）
以下、図４を参照して第２の実施形態について説明する。
この実施形態の突起４は、モジュール基材２面にモジュール基材開口部２ａごとに独立して形成してある。すなわち、各開口部２ａにおいて、ＩＣチップ５から遠い側の縁を覆うように円弧状にした突起４としてある。外部端子１への入力によっては、開口部２ａのＩＣチップ５から遠い側の縁も、モジュール基材２から封止樹脂７が剥がれやすくなるから、この実施形態ではそのような場合に封止樹脂７の剥離を防止するのに好適である。また、他の構成と作用についてはこの実施形態も第１の実施形態と同一であり、このＩＣモジュール８を使用してＩＣカードを作成する点も第１の実施形態と同一である。 (Third embodiment)
Hereinafter, the second embodiment will be described with reference to FIG.
The protrusions 4 of this embodiment are formed independently on the module base 2 surface for each module base opening 2a. In other words, in each opening 2 a, the projection 4 is formed in an arc shape so as to cover the edge far from the IC chip 5. Depending on the input to the external terminal 1, the sealing resin 7 is easily peeled off from the module base 2 at the edge of the opening 2 a far from the IC chip 5. In this embodiment, the sealing resin is used in such a case. 7 is suitable for preventing peeling. The other configurations and operations are the same as those of the first embodiment, and the point that an IC card is created using the IC module 8 is also the same as that of the first embodiment.

なお、上記第１〜第３の実施形態においては、ＩＣカード１０内のＩＣモジュール８はワイヤーボンディング方式による接続機構のＩＣチップを示したが、本発明はこれに限定されるものではなく、フリップチップのバンプボンディング方式によるＩＣモジュールにおいても使用可能である。   In the first to third embodiments, the IC module 8 in the IC card 10 is an IC chip having a connection mechanism using a wire bonding method. However, the present invention is not limited to this, and flip It can also be used in an IC module using a chip bump bonding method.

１……外部端子
２……モジュール基材
２ａ……モジュール基材開口部
３……モジュール基板
４……突起
５……ＩＣチップ
６……ボンディングワイヤ
７……封止樹脂
８……ＩＣモジュール
９……カード基材
１０……ＩＣカード DESCRIPTION OF SYMBOLS 1 ... External terminal 2 ... Module base material 2a ... Module base material opening part 3 ... Module board | substrate 4 ... Protrusion 5 ... IC chip 6 ... Bonding wire 7 ... Sealing resin 8 ... IC module 9 …… Card substrate 10 …… IC card

Claims (5)

モジュール基材の一方の面にＩＣチップを配置するとともに、前記ＩＣチップを封止樹脂で覆い、さらに前記モジュール基材の他方の面に外部端子を配置した接触型ＩＣカード用のＩＣモジュールであって、
前記モジュール基板の前記ＩＣチップを有する面における前記ＩＣチップの周囲に、前記封止樹脂内に埋設される突起を形成したことを特徴とするＩＣモジュール。 An IC module for a contact type IC card in which an IC chip is arranged on one side of a module base, the IC chip is covered with a sealing resin, and an external terminal is arranged on the other side of the module base. And
An IC module, wherein a protrusion embedded in the sealing resin is formed around the IC chip on a surface of the module substrate having the IC chip. 前記突起を前記ＩＣチップの周囲を一周させて連続形成したことを特徴とする請求項１に記載のＩＣモジュール。   2. The IC module according to claim 1, wherein the protrusion is continuously formed around the periphery of the IC chip. 3. 前記突起を前記ＩＣチップの周囲を一周させる方向に断続させて複数形成したことを特徴とする請求項１に記載のＩＣモジュール。   2. The IC module according to claim 1, wherein a plurality of the protrusions are formed by being intermittently formed in a direction in which the periphery of the IC chip makes a round. 前記ＩＣモジュールが前記ＩＣチップと前記外部端子をボンディングワイヤにより接続されている形式のものであって、前記ボンディングワイヤを通過させるためにモジュール基材に設けられた開口部よりも前記ＩＣチップから離れた側に前記突起を設けたことを特徴とする請求項１ないし請求項３のうちいずれか１項に記載のＩＣモジュール。   The IC module is of a type in which the IC chip and the external terminal are connected by a bonding wire, and is farther from the IC chip than an opening provided in the module base material for passing the bonding wire. The IC module according to any one of claims 1 to 3, wherein the protrusion is provided on an open side. 請求項1ないし請求項４のうちいずれか１項に記載のＩＣモジュールを搭載したことを特徴とするＩＣカード。   An IC card comprising the IC module according to any one of claims 1 to 4.
JP2012074340A 2012-03-28 2012-03-28 Ic module and ic card loaded with the same Pending JP2013206122A (en)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0761177A (en) * 1993-08-30 1995-03-07 Omron Corp Electronic card
WO1996032696A1 (en) * 1995-04-13 1996-10-17 Dai Nippon Printing Co., Ltd. Ic card and ic module
JPH1024686A (en) * 1996-07-10 1998-01-27 Dainippon Printing Co Ltd Ic module package and ic card
JPH11115356A (en) * 1997-10-16 1999-04-27 Citizen Watch Co Ltd Ic card
US20040169086A1 (en) * 2001-06-07 2004-09-02 Eiji Ohta Ic card
JP2004326351A (en) * 2003-04-23 2004-11-18 Sony Corp Ic card and its manufacturing method
WO2008117385A1 (en) * 2007-03-23 2008-10-02 Fujitsu Limited Electronic device, electronic apparatus with packaged electronic device, article with mounted electronic device, and method for manufacturing electronic device
JP2012043341A (en) * 2010-08-23 2012-03-01 Toppan Printing Co Ltd Ic module and ic card prepared therewith

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0761177A (en) * 1993-08-30 1995-03-07 Omron Corp Electronic card
WO1996032696A1 (en) * 1995-04-13 1996-10-17 Dai Nippon Printing Co., Ltd. Ic card and ic module
JPH1024686A (en) * 1996-07-10 1998-01-27 Dainippon Printing Co Ltd Ic module package and ic card
JPH11115356A (en) * 1997-10-16 1999-04-27 Citizen Watch Co Ltd Ic card
US20040169086A1 (en) * 2001-06-07 2004-09-02 Eiji Ohta Ic card
JP2004326351A (en) * 2003-04-23 2004-11-18 Sony Corp Ic card and its manufacturing method
WO2008117385A1 (en) * 2007-03-23 2008-10-02 Fujitsu Limited Electronic device, electronic apparatus with packaged electronic device, article with mounted electronic device, and method for manufacturing electronic device
JP2012043341A (en) * 2010-08-23 2012-03-01 Toppan Printing Co Ltd Ic module and ic card prepared therewith

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