JP2013197160A - Cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling device capable of preventing reduction in cooling performance due to air bubbles entering an airtight case when cooling water is replenished or replaced.SOLUTION: A cooling type cooling device 1 includes: a box-shaped airtight case 11 in which an introduction port 11a and a discharge port 11b of cooling water opened downward in the vertical direction are provided and an internal space connecting the introduction port and discharge port are used as a cooling water passage 11c; and a cooling fin 12 which is provided in the cooling water passage. Air reservoirs 13 are provided on internal wall surfaces opposite to the introduction port and discharge port out of the internal wall surface 11d of the airtight case.

Description

 The present invention relates to a cooling device.

  Conventionally, for example, a water-cooled heat sink is often used as a cooling device for cooling a heating element such as a power semiconductor element (see Patent Document 1 below). In general, this water-cooled heat sink is provided with a cooling water introduction port and a discharge port, and a box-shaped sealing case having an internal space connecting the introduction port and the discharge port as a cooling water channel, and the inside of the sealing case. It is comprised from the plate-shaped cooling fin provided in the cooling water channel.

 In the water-cooled heat sink having such a configuration, the heating element is disposed on the outer wall surface of the sealed case (the outer wall surface facing the inner wall surface provided with the cooling fin) via an intermediate heat transfer layer made of a substrate, a thermal compound, or the like. When the cooling water is circulated through the cooling water channel in the sealed case, the heat generated by the heating element is transferred to the outside through the path of intermediate heat transfer layer → sealed case → cooling fin → cooling water. .

JP 2006-156711 A

  In the water-cooled heat sink having the above configuration, when the cooling water introduction port and the discharge port are opened downward in the vertical direction of the sealed case, that is, the cooling water is introduced into the sealed case from below in the vertical direction and sealed. When cooling water is discharged downward in the vertical direction from the case, air (bubbles) that has entered the sealed case during replenishment or replacement of the cooling water may remain between the cooling fins, resulting in reduced cooling performance. There is sex.

 The present invention has been made in view of the above-described circumstances, and an object thereof is to provide a cooling device capable of preventing a decrease in cooling performance due to air bubbles that enter a sealed case during replenishment or replacement of cooling water. To do.

 In order to achieve the above object, in the present invention, as a first solving means related to the cooling device, an inlet and an outlet for cooling water that open downward in the vertical direction are provided, and the inlet and the outlet are provided. In a water-cooled cooling device comprising a box-shaped sealed case having an internal space connecting the two as cooling water channels, and cooling fins provided in the cooling water channel, the inlet port and the exhaust port are formed in the inner wall surface of the sealed case. A means is adopted in which an air pocket is provided on the inner wall surface facing the outlet.

 Further, in the present invention, as a second solving means related to the cooling device, in the first solving means, the cooling fin is provided on the inner wall surface of the sealed case facing the inlet and the outlet. The air reservoir is provided at a position away from the cooling fin on the inner wall surface facing the inlet and outlet of the sealed case and at a downstream end of the cooling water channel. Adopt means.

 Further, in the present invention, as a third solving means relating to the cooling device, in the second solving means, an inner wall surface of the sealed case facing the inlet and the outlet is the vertical wall toward the air reservoir. Adopting a means that is inclined upward in the direction.

 Further, in the present invention, as a fourth solving means relating to the cooling device, in the first solving means, the cooling fin is provided on the inner wall surface of the sealed case facing the inlet and the outlet. The air reservoir is provided at a position away from the cooling fin on the inner wall surface of the sealed case facing the inlet and outlet, and at an upstream end and a downstream end of the cooling water channel. Adopt the means of being.

  Further, according to the present invention, as a fifth solving means relating to the cooling device, in the first solving means, the inner wall surface of the sealed case is perpendicular to the inner wall surface facing the introduction port and the discharge port. Means that the cooling fins are provided on an inner wall surface that is in contact with each other, and the air pool is provided at a position at a downstream end of the cooling water channel on an inner wall surface facing the introduction port and the discharge port of the sealed case. Is adopted.

  In the present invention, as a sixth solving means relating to the cooling device, in the fifth solving means, the cooling fin is inclined upward in the vertical direction toward the air reservoir. adopt.

  Further, in the present invention, as a seventh solving means relating to the cooling device, in the first solving means, the inner wall surface of the sealed case is perpendicular to the inner wall surface facing the introduction port and the discharge port. The cooling fins are provided on the inner wall surface in contact therewith, and the air pool is provided at positions of the upstream end and the downstream end of the cooling water channel on the inner wall surface facing the introduction port and the discharge port of the sealed case. , Is adopted.

  In the present invention, as an eighth solving means related to the cooling device, an inlet and an outlet for cooling water that open downward in the vertical direction are provided, and an internal space connecting the inlet and the outlet is cooled. In a water-cooled cooling device comprising a box-shaped sealed case serving as a water channel and cooling fins provided in the cooling water channel, a wall portion facing the introduction port and the discharge port among the wall portions of the sealed case A means is provided that includes a water storage tank that is connected at a position of the downstream end of the cooling water passage and has an internal space communicating with the cooling water passage as an air reservoir.

  Further, in the present invention, as a ninth solving means relating to the cooling device, in the eighth solving means, the inner wall surface of the sealed case is perpendicular to the inner wall surface facing the inlet and the outlet. The said cooling fin is provided in the inner wall surface which touches, The said cooling fin is employ | adopted as the said inclination in the said perpendicular direction toward the connection position of the said water storage tank is employ | adopted.

 According to the present invention, since air bubbles that have entered the sealed case at the time of replenishment or replacement of the cooling water are trapped in the air pool by the water flow in the sealed case, it is possible to avoid the bubbles from staying between the cooling fins. As a result, it is possible to prevent the cooling performance from being lowered due to the bubbles.

It is a figure which shows the structure of the water cooling type heat sink 1 which concerns on 1st Embodiment of this invention. It is a figure which shows the structure of the water cooling type heat sink 2 which concerns on 2nd Embodiment of this invention. It is a figure which shows the structure of the water cooling type heat sink 3 which concerns on 3rd Embodiment of this invention. It is a figure which shows the structure of the water cooling type heat sink 4 which concerns on 4th Embodiment of this invention. It is a figure which shows the structure of the water cooling type heat sink 5 which concerns on 5th Embodiment of this invention. It is a figure which shows the structure of the water cooling type heat sink 6 which concerns on 6th Embodiment of this invention. It is a figure which shows the structure of the general water-cooling type heat sink 10, and its subject.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
First, in order to facilitate understanding of the cooling device according to the present embodiment, a general configuration of a cooling device (water-cooled heat sink) that cools, for example, a power semiconductor element as a heating element and its problems will be described with reference to FIG. explain.

  As shown in FIGS. 7A and 7B, a general water-cooled heat sink 10 is provided with an inlet 11a and an outlet 11b for cooling water, and an internal space connecting the inlet 11a and the outlet 11b. Is formed of a box-shaped airtight case 11 having a cooling water channel 11 c and plate-like cooling fins 12 provided in the cooling water channel 11 c in the airtight case 11.

  The cooling water introduction port 11a and the discharge port 11b open downward in the vertical direction (Z-axis direction in the figure) of the sealed case 11. That is, the cooling water is introduced from the lower side in the vertical direction to the introduction port 11a of the sealed case 11, and the cooling water is discharged from the discharge port 11b of the sealed case 11 toward the lower side in the vertical direction.

  The cooling fins 12 are erected on the inner wall surface 11d of the sealed case 11 so that the long sides thereof are parallel to the cooling water flow direction (X-axis direction in the drawing). A plurality of cooling fins 12 are provided at regular intervals along a direction (Y-axis direction in the drawing) orthogonal to the flow direction of the cooling water.

  In the water-cooled heat sink 10 having such a configuration, a semiconductor module including, for example, three power semiconductor elements 33 on the outer wall surface 11e of the sealed case 11 (an outer wall surface facing the inner wall surface 11d provided with the cooling fins 12). 30 is installed via a thermal compound 40. This semiconductor module 30 is one of the module components that constitute an inverter mounted on, for example, a hybrid vehicle, and is provided with a plate-like base member 31 and three on the upper surface thereof at regular intervals along the X-axis direction. An insulating substrate 32 and a power semiconductor element 33 mounted on each of these three insulating substrates 32 are provided.

  In this semiconductor module 30, the insulating substrate 32 and the power semiconductor element 33 are covered with a resin case 34 installed on the base member 31 in a sealed state and are exposed outside the resin case 34. The bus bar 35 as an electrode member and the aluminum wire 36 are electrically connected.

  As described above, the power semiconductor element 33 is sealed on the outer wall surface 11e of the sealed case 11 of the water-cooled heat sink 10 through the intermediate heat transfer layer including the insulating substrate 32, the base member 31, the thermal compound 40, and the like. When the cooling water is circulated in the case 11, the heat generated in the power semiconductor element 33 is transmitted through the path of the intermediate heat transfer layer → the sealed case 11 → the cooling fin 12 → the cooling water and released to the outside.

  In the water-cooled heat sink 10 having the above-described configuration, the cooling water introduction port 11a and the discharge port 11b are open downward in the vertical direction of the sealed case 11, so that the cooling water is replenished or replaced as shown in FIG. Sometimes, air (bubbles 50) that has entered the sealed case 11 stays between the cooling fins 12, and cooling performance may be reduced.

  The cooling device according to the present embodiment solves the problems of the conventional water-cooled heat sink 10 as described above, and prevents the cooling performance from being deteriorated due to the bubbles 50 that enter the sealed case 11 when the cooling water is replenished or replaced. Is. Hereinafter, the cooling device according to the first to sixth embodiments of the present invention will be described with reference to the drawings. For convenience of explanation, the same reference numerals are given to the same components as those of the conventional water-cooled heat sink 10 shown in FIG. The description is omitted.

[First Embodiment]
FIG. 1 is a diagram illustrating a configuration of a water-cooled heat sink 1 that is a cooling device according to a first embodiment of the present invention (a diagram of the water-cooled heat sink 1 viewed from the Y-axis direction). As shown in FIG. 1, the water-cooled heat sink 1 according to the first embodiment has an inner wall surface of a sealed case 11, a cooling water inlet 11 a and a drain as compared with the configuration of a conventional water-cooled heat sink 10. The difference is that a recess as an air reservoir 13 is provided on the inner wall surface facing the outlet 11b (that is, the inner wall surface 11d provided with the cooling fins 12).

  The air reservoir 13 is provided at a position away from the cooling fin 12 on the inner wall surface 11d of the sealed case 11 and at a downstream end position of the cooling water channel 11c. Thus, it is desirable to provide the air reservoir 13 at a position that does not affect the cooling performance of the water-cooled heat sink 1 (a position away from the cooling fin 12 while avoiding the position directly below the power semiconductor element 33). Moreover, the air reservoir 13 may be provided continuously along the Y-axis direction, or a plurality of air reservoirs 13 may be provided intermittently.

  According to the water-cooled heat sink 1 having such a configuration, the bubbles 50 that have entered the sealed case 11 when the coolant is replenished or replaced are trapped in the air pool 13 by the water flow in the sealed case 11. It is possible to avoid the bubbles 50 from staying between them, and as a result, it is possible to prevent the cooling performance from being deteriorated by the bubbles 50.

  The air reservoir 13 may be provided at a position away from the cooling fin 12 on the inner wall surface 11d of the sealed case 11 and at the upstream end position of the cooling water channel 11c. However, as described above, the air reservoir 13 is provided at the downstream end of the cooling water channel 11c. The air bubbles 50 can be efficiently captured in the air reservoir 13 by the cooling water flow when the air is provided at the position.

[Second Embodiment]
FIG. 2 is a diagram illustrating a configuration of a water-cooled heat sink 2 that is a cooling device according to a second embodiment of the present invention (a diagram of the water-cooled heat sink 2 viewed from the Y-axis direction). As shown in FIG. 2, the water-cooled heat sink 2 according to the second embodiment has an inner wall surface 11 d of the sealed case 11 as an air pool 13 as compared with the configuration of the water-cooled heat sink 1 according to the first embodiment. It differs in that it is inclined upward in the vertical direction (Z-axis direction).

  The water-cooled heat sink 2 having such a configuration can obtain the same operational effects as the water-cooled heat sink 1 according to the first embodiment. Further, since the inner wall surface 11d of the sealed case 11 is inclined, the air bubbles 50 can be captured in the air reservoir 13 more efficiently by the flow of the cooling water than in the first embodiment.

[Third Embodiment]
FIG. 3 is a diagram showing a configuration of a water-cooled heat sink 3 that is a cooling device according to a third embodiment of the present invention (a diagram of the water-cooled heat sink 3 viewed from the Y-axis direction). As shown in FIG. 3, the water-cooled heat sink 3 according to the third embodiment has an air pool 13 at the inner wall surface 11 d of the sealed case 11 as compared with the configuration of the water-cooled heat sink 1 according to the first embodiment. It is different in that it is provided at a position deviating from the cooling fin 12 and at both the upstream end and the downstream end of the cooling water channel 11c.

  Even the water-cooled heat sink 3 having such a configuration can obtain the same effects as the water-cooled heat sink 1 according to the first embodiment. Further, since the air reservoir 13 is increased, a larger amount of bubbles 50 can be efficiently captured in the air reservoir 13 than in the first embodiment.

[Fourth Embodiment]
In the first to third embodiments, the horizontal-type water-cooled heat sinks 1 to 3 are illustrated, but as shown in FIGS. 4A and 4B, a vertical-type water-cooled heat sink 20 is also present. FIG. 4A is a view of a conventional vertical-type water-cooled heat sink 20 viewed from the Y-axis direction, and FIG. 4B is a cross-sectional view taken along line AA of the water-cooled heat sink 20.

  Compared with the conventional horizontal-type water-cooled heat sink 10 shown in FIG. 7, the conventional vertical-type water-cooled heat sink 20 introduces cooling water that opens downward in the vertical direction (downward in the Z-axis direction). An opening 21a and a discharge port 21b are provided, and a box-shaped sealing case 21 having an internal space connecting the introduction port 21a and the discharge port 21b as a cooling water channel 21c and a cooling water channel 21c in the sealing case 21 are provided. The cooling fins 22 coincide with each other at a right angle with respect to the inner wall surface 21d facing the introduction port 21a and the discharge port 21b in the inner wall surface of the sealed case 21. It differs in that it is provided on the inner wall surface 21e.

  The semiconductor module 30 is disposed on the outer wall surface 21 f of the sealed case 21 (the outer wall surface facing the inner wall surface 21 e provided with the cooling fins 22) via the thermal compound 40. The cooling fin 22 is erected on the inner wall surface 21e of the sealed case 21 so that the long sides thereof are parallel to the flow direction of the cooling water (X-axis direction). A plurality of cooling fins 22 are provided at regular intervals along the vertical direction (Z-axis direction).

  Even in the vertically-mounted water-cooled heat sink 20 having such a configuration, the air (bubbles 60) that has entered the sealed case 21 when the coolant is replenished or replaced, as in the horizontally-mounted water-cooled heat sink 10, is the cooling fin 22. It may stay in between, and cooling performance may fall.

  FIG. 4C is a diagram (a view of the water-cooled heat sink 4 viewed from the Y-axis direction) illustrating a configuration of a vertically-mounted water-cooled heat sink 4 that is a cooling device according to the fourth embodiment of the present invention. As shown in this figure, the vertically-mounted water-cooled heat sink 4 according to the fourth embodiment has an inner wall surface of the sealed case 21 that is cooled as compared with the configuration of a conventional vertically-mounted water-cooled heat sink 20. The difference is that a recess as an air pool 23 is provided at the downstream end of the cooling water passage 21c on the inner wall surface 21d facing the water inlet 21a and the outlet 21b.

  According to the vertical-type water-cooled heat sink 4 having such a configuration, as in the first to third embodiments, the bubbles 60 that have entered the sealed case 21 at the time of replenishment or replacement of the cooling water are contained in the sealed case 21. Therefore, it is possible to avoid the bubbles 60 from staying between the cooling fins 22, and as a result, it is possible to prevent the cooling performance from being deteriorated by the bubbles 60. The air reservoir 23 may be provided at both the upstream end and the downstream end of the cooling water passage 21c on the inner wall surface 21d of the sealed case 21 as in the third embodiment.

[Fifth Embodiment]
FIG. 5 is a diagram showing a configuration of a vertically placed water-cooled heat sink 5 that is a cooling device according to a fifth embodiment of the present invention (a diagram of the water-cooled heat sink 5 viewed from the Y-axis direction). As shown in this figure, the vertical-type water-cooled heat sink 5 according to the fifth embodiment has each cooling fin 22 compared to the configuration of the vertical-type water-cooled heat sink 4 according to the fourth embodiment. The difference is that it is inclined upward in the Z-axis direction toward the air reservoir 23.

  The vertical-type water-cooled heat sink 5 having such a configuration can also obtain the same effects as the vertical-type water-cooled heat sink 4 according to the fourth embodiment. Moreover, since each cooling fin 22 inclines, the bubble 60 can be more efficiently trapped in the air reservoir 23 by the water flow of the cooling water than in the fourth embodiment.

[Sixth Embodiment]
FIG. 6 is a diagram showing a configuration of a vertically-mounted water-cooled heat sink 6 that is a cooling device according to a sixth embodiment of the present invention (a diagram of the water-cooled heat sink 6 viewed from the Y-axis direction). As shown in this figure, the vertical-type water-cooled heat sink 6 according to the sixth embodiment is introduced in the wall portion of the sealed case 21 as compared with the configuration of the conventional vertical-type water-cooled heat sink 20. It differs in that it has a water storage tank 24 that is connected to the wall 21g facing the outlet 21a and the outlet 21b at the downstream end of the cooling water passage 21c and has an internal space that communicates with the cooling water passage 21c as an air reservoir 24a. Yes.

  Each cooling fin 22 is inclined upward in the Z-axis direction toward the connection position of the water storage tank 24. When the water-cooled heat sink 6 includes a reserve tank for replenishing cooling water, this reserve tank can be used as the water storage tank 24 described above.

  According to the vertical-type water-cooled heat sink 6 having such a configuration, the air bubbles 60 that have entered the sealed case 21 during replenishment or replacement of the cooling water are trapped in the air reservoir 24 a in the water storage tank 24 by the water flow in the sealed case 21. Therefore, the bubbles 60 can be prevented from staying between the cooling fins 22, and as a result, it is possible to prevent the cooling performance from being deteriorated by the bubbles 60. Further, since each cooling fin 22 is inclined, the bubbles 60 can be efficiently captured in the air reservoir 24a in the water storage tank 24 by the water flow of the cooling water as compared with the conventional case. It is not always necessary to incline each cooling fin 22.

The first to sixth embodiments of the present invention have been described above, but the present invention is not limited to this, and it is needless to say that various modifications can be made without departing from the spirit of the present invention.
For example, in the first to sixth embodiments, the water-cooled heat sinks 1 to 6 for cooling the power semiconductor element 23 used in the hybrid vehicle are exemplified as the cooling device according to the present invention. However, the cooling device according to the present invention. Can be widely applied not only to the power semiconductor element 23 but also to a system that cools a heating element that generates high-temperature heat with cooling water.

  1, 2, 3, 4, 5, 6, 10, 20 ... water-cooled heat sink (cooling device), 11, 21 ... sealed case, 12, 22 ... cooling fins, 13, 23, 24a ... air pool, 24 ... water storage Tank, 30 ... Semiconductor module, 31 ... Base member, 32 ... Insulating substrate, 33 ... Power semiconductor element (heating element), 34 ... Resin case, 35 ... Bus bar, 36 ... Aluminum wire, 40 ... Thermal compound, 50, 60 ... Bubbles

Claims (9)

A cooling water introduction port and a discharge port that open downward in the vertical direction are provided, a box-shaped hermetic case having an internal space connecting the introduction port and the discharge port as a cooling water channel, and the cooling water channel In a water-cooled cooling device provided with cooling fins,
A cooling device, wherein an air reservoir is provided on an inner wall surface of the sealed case that faces the inlet and the outlet. Of the inner wall surface of the sealed case, the cooling fin is provided on the inner wall surface facing the introduction port and the discharge port,
The air reservoir is provided at a position away from the cooling fin on the inner wall surface of the sealed case facing the inlet and outlet, and at a downstream end of the cooling water channel. 2. The cooling device according to 1.   The cooling device according to claim 2, wherein an inner wall surface of the sealed case facing the introduction port and the discharge port is inclined upward in the vertical direction toward the air reservoir. Of the inner wall surface of the sealed case, the cooling fin is provided on the inner wall surface facing the introduction port and the discharge port,
The air reservoir is provided at a position away from the cooling fin on an inner wall surface of the sealed case facing the inlet and outlet, and at an upstream end and a downstream end of the cooling water channel. The cooling device according to claim 1. Of the inner wall surface of the sealed case, the cooling fin is provided on an inner wall surface that is perpendicular to the inner wall surface facing the introduction port and the discharge port,
2. The cooling device according to claim 1, wherein the air reservoir is provided at a downstream end position of the cooling water channel on an inner wall surface of the sealed case facing the inlet and outlet.   The cooling device according to claim 5, wherein the cooling fin is inclined upward in the vertical direction toward the air reservoir. Of the inner wall surface of the sealed case, the cooling fin is provided on an inner wall surface that is perpendicular to the inner wall surface facing the introduction port and the discharge port,
2. The cooling device according to claim 1, wherein the air pool is provided at positions of an upstream end and a downstream end of the cooling water channel on an inner wall surface of the sealed case facing the introduction port and the discharge port. . A cooling water introduction port and a discharge port that open downward in the vertical direction are provided, a box-shaped hermetic case having an internal space connecting the introduction port and the discharge port as a cooling water channel, and the cooling water channel In a water-cooled cooling device provided with cooling fins,
A water storage tank that is connected to a wall portion facing the introduction port and the discharge port at a downstream end position of the cooling water channel, and has an internal space communicating with the cooling water channel as an air pool. A cooling device comprising: Of the inner wall surface of the sealed case, the cooling fin is provided on an inner wall surface that is perpendicular to the inner wall surface facing the introduction port and the discharge port,
The cooling device according to claim 8, wherein the cooling fin is inclined upward in the vertical direction toward a connection position of the water storage tank.

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