JP2013197153A - Method of manufacturing substrate for mounting electronic component and substrate for mounting electronic component - Google Patents

Method of manufacturing substrate for mounting electronic component and substrate for mounting electronic component Download PDF

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JP2013197153A
JP2013197153A JP2012060097A JP2012060097A JP2013197153A JP 2013197153 A JP2013197153 A JP 2013197153A JP 2012060097 A JP2012060097 A JP 2012060097A JP 2012060097 A JP2012060097 A JP 2012060097A JP 2013197153 A JP2013197153 A JP 2013197153A
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sided
electronic component
substrate
hole
double
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Beji Sasaki
ベジ 佐々木
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Freesia Makurosu Kk
NIPPON MULTI KK
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Freesia Makurosu Kk
NIPPON MULTI KK
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Priority to JP2012060097A priority Critical patent/JP2013197153A/en
Priority to PCT/JP2013/057229 priority patent/WO2013137401A1/en
Priority to TW102109288A priority patent/TW201401962A/en
Publication of JP2013197153A publication Critical patent/JP2013197153A/en
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    • H—ELECTRICITY
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    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate for mounting an electronic component which can achieve simplification of a manufacturing process and improve adhesion between a through hole and a heat dissipation member, and provide a substrate for mounting an electronic component.SOLUTION: A method of manufacturing a substrate for mounting an electronic component includes: a double-sided substrate forming step for forming a double-sided substrate 11 on which an electronic component 31 is mounted by providing a prepreg (an adhesion layer) 14 capable of being melted by application of pressure and heat between two single-sided plates 12a and 12b in which metal foil 13 is stuck on one face sides; a hole part processing step for forming a hole part 15 which penetrates from the one single-sided plate 12a to the other single-sided plate 12b of the double-sided substrate 11; a punching step for mounting a copper plate (a metal plate) 3 on the one single-sided plate 12a of the double-sided substrate 11 and fitting a punched copper material (a metal material) 16 into the hole part 15 by punching the copper plate 3; and a metal material pressing step for performing press processing of the copper material 16 by applying pressure and heat from at least one face side of the double-sided substrate 11 in the state where the copper material 16 is fitted into the hole part 15.

Description

本発明は、基板の両面に設けた導体層相互を放熱部材によって接続する電子部品搭載用基板の製造方法及び電子部品搭載用基板に関する。   The present invention relates to an electronic component mounting substrate manufacturing method and an electronic component mounting substrate in which conductor layers provided on both surfaces of a substrate are connected to each other by a heat dissipation member.

従来から、基板の両面に設けた導体層相互を放熱部材によって接続する電子部品搭載用基板の製造方法として、例えば、特許第３１７４３９３号公報（特許文献１）に記載された電子部品搭載用基板の製造方法が提案されている。   Conventionally, as a method for manufacturing an electronic component mounting board in which conductor layers provided on both sides of a board are connected to each other by a heat dissipation member, for example, an electronic component mounting board described in Japanese Patent No. 3174393 (Patent Document 1) Manufacturing methods have been proposed.

この電子部品搭載用基板の製造方法は、絶縁基板の両面に銅箔による導体層を設け、絶縁基板に設けた貫通穴に放熱部材を圧入することによって両面の導体層相互を接続し、電子部品搭載用基板の放熱特性を改善している。   In this method of manufacturing a substrate for mounting an electronic component, a conductor layer made of copper foil is provided on both sides of an insulating substrate, and a heat dissipation member is press-fitted into a through hole provided in the insulating substrate to connect the conductor layers on both sides to each other. The heat dissipation characteristics of the mounting board have been improved.

図１２は、特許文献１に記載された電子部品搭載用基板の製造方法で製造された電子部品搭載用基板を示す断面図である。   FIG. 12 is a cross-sectional view showing an electronic component mounting board manufactured by the electronic component mounting board manufacturing method described in Patent Document 1.

図１２に示すように、電子部品搭載用基板１００は、絶縁基板１０１と、この絶縁基板１０１の上下両面に設けられた導体層１０２と、絶縁基板１０１に形成された貫通穴１０３と、この貫通穴１０３に圧入された放熱部材１０４とで略構成されている。   As shown in FIG. 12, the electronic component mounting substrate 100 includes an insulating substrate 101, conductor layers 102 provided on both upper and lower surfaces of the insulating substrate 101, through holes 103 formed in the insulating substrate 101, and through holes The heat radiation member 104 is press-fitted into the hole 103 and is generally configured.

この電子部品搭載用基板１００は、上下両面に導体層１０２が設けられた絶縁基板１０１に放熱部材１０４に対応する形状の貫通穴１０３を形成し、その後、貫通穴１０３に放熱部材１０４を圧入する。   In this electronic component mounting board 100, a through hole 103 having a shape corresponding to the heat dissipation member 104 is formed in an insulating substrate 101 provided with conductor layers 102 on both upper and lower surfaces, and then the heat dissipation member 104 is press-fitted into the through hole 103. .

そして、放熱部材１０４を圧入した絶縁基板１０１の表面に金属層等を施し、絶縁基板１０１の上下両面にパターン導体回路１０５やダイパターン１０６を形成し、電子部品搭載用基板１００を製造する。その後、ダイパターン１０６に電子部品１０７を搭載する。   Then, a metal layer or the like is applied to the surface of the insulating substrate 101 into which the heat radiating member 104 is press-fitted, and the pattern conductor circuit 105 and the die pattern 106 are formed on the upper and lower surfaces of the insulating substrate 101 to manufacture the electronic component mounting substrate 100. Thereafter, the electronic component 107 is mounted on the die pattern 106.

特許第３１７４３９３号公報Japanese Patent No. 3174393

しかしながら、上述した電子部品搭載用基板１００では、両面に導体層１０２が設けられた絶縁基板１０１に貫通穴１０３を形成し、この貫通穴１０３に放熱部材１０４を圧入することにより絶縁基板１０１に固定している。   However, in the electronic component mounting substrate 100 described above, the through hole 103 is formed in the insulating substrate 101 provided with the conductor layer 102 on both surfaces, and the heat dissipation member 104 is press-fitted into the through hole 103 to be fixed to the insulating substrate 101. doing.

このため、絶縁基板１０１に形成した貫通穴１０３に放熱部材１０４を圧入する工程が必要となり、製造工程が煩雑化し、この煩雑化に伴い生産効率が低下するという問題が発生する。   For this reason, the process of press-fitting the heat radiating member 104 into the through-hole 103 formed in the insulating substrate 101 is necessary, and the manufacturing process becomes complicated, resulting in a problem that the production efficiency decreases with this complexity.

そこで、本発明はこのような従来の課題を解決するためになされたものであり、その目的とするところは、製造工程の簡素化を図ると共に、貫通穴と放熱部材との密着性を向上することができる電子部品搭載用基板の製造方法及び電子部品搭載用基板を提供することにある。   Therefore, the present invention has been made to solve such a conventional problem, and its object is to simplify the manufacturing process and improve the adhesion between the through hole and the heat dissipation member. An object of the present invention is to provide an electronic component mounting substrate manufacturing method and an electronic component mounting substrate.

上記目的を達成するため、本願請求項１に記載の発明は、電子部品搭載用基板の製造方法であって、金属箔が一面側に貼着された２枚の片面板の間に加圧、加熱されて溶解可能な接着層を設けて電子部品が搭載される両面基板を形成する両面基板形成工程と、前記両面基板の一方の片面板から他方の片面板まで貫通する孔部を形成する孔部加工工程と、前記両面基板の一方の片面板上に金属板を搭載して、この金属板を打ち抜いて前記孔部内に打ち抜き金属材を嵌入させる打ち抜き工程と、前記前記孔部内に金属材を嵌入させた状態で、前記両面基板の少なくとも一面側から加圧及び加熱して金属材をプレス加工する金属材プレス工程と、を含むことを特徴とする。   In order to achieve the above object, the invention described in claim 1 of the present application is a method for manufacturing an electronic component mounting board, in which a metal foil is pressed and heated between two single-sided plates bonded to one side. A double-sided substrate forming step for forming a double-sided substrate on which electronic components are mounted by providing a meltable adhesive layer, and hole processing for forming a hole penetrating from one single-sided plate to the other single-sided plate of the double-sided substrate A step of mounting a metal plate on one side plate of the double-sided substrate, punching out the metal plate and fitting a punched metal material into the hole, and fitting a metal material into the hole And a metal material pressing step of pressing and heating the metal material from at least one surface side of the double-sided substrate.

請求項２に記載の発明は、電子部品が搭載される電子部品搭載用基板であって、金属箔が一面側に貼着された２枚の片面板の間に加圧、加熱されて溶解可能な接着層が設けられた両面基板と、前記両面基板は、一方の片面板から他方の片面板まで貫通する孔部を設け、前記両面基板の一方の片面板上に金属板を搭載して、この金属板を打ち抜くことにより前記孔部内に打ち抜き金属材を嵌入させることを特徴とする。   The invention according to claim 2 is an electronic component mounting substrate on which an electronic component is mounted, and is an adhesive that can be melted by being pressed and heated between two single-sided plates having a metal foil attached to one side. The double-sided board provided with a layer and the double-sided board are provided with a hole penetrating from one single-sided board to the other single-sided board, and a metal plate is mounted on the single-sided board of the double-sided board. A punching metal material is inserted into the hole by punching a plate.

請求項３に記載の発明は、請求項２に記載の電子部品搭載用基板であって、前記打ち抜き金属材は、前記両面基板の少なくとも一面側から加圧及び加熱してプレス加工することにより前記孔部と密着固定されていることを特徴とする。   A third aspect of the present invention is the electronic component mounting substrate according to the second aspect, wherein the punched metal material is pressed and heated from at least one side of the double-sided substrate to perform the pressing process. It is characterized by being tightly fixed to the hole.

請求項４に記載の発明は、請求項２又は請求項３に記載の電子部品搭載用基板であって、前記接着層はプリプレグであることを特徴とする。   According to a fourth aspect of the invention, there is provided the electronic component mounting substrate according to the second or third aspect, wherein the adhesive layer is a prepreg.

請求項１に記載の発明によれば、金属材プレス工程により金属材を加圧、加熱するため、孔部の内壁から接着層が溶け出すことにより、孔部内に嵌入した金属材を隙間なく密着固定することができる。   According to the first aspect of the present invention, since the metal material is pressurized and heated by the metal material pressing step, the adhesive layer melts from the inner wall of the hole portion, so that the metal material fitted into the hole portion is closely adhered. Can be fixed.

また、金属材プレス工程により、孔部の内壁から接着層が溶け出すため、任意の形状の放熱部材（金属材）であっても、孔部の内壁に密着固定することができる。   In addition, since the adhesive layer melts from the inner wall of the hole by the metal material pressing step, even a heat radiating member (metal material) having an arbitrary shape can be tightly fixed to the inner wall of the hole.

従って、放熱部材（金属材）の形状の違いに関係なく、孔部と密着固定することができるため、信頼性の高い電子部品搭載用基板を製造することができる。   Therefore, since it can be tightly fixed to the hole regardless of the difference in the shape of the heat dissipation member (metal material), a highly reliable electronic component mounting board can be manufactured.

請求項２に記載の発明によれば、２枚の片面板の間に加圧、加熱されて溶解可能な接着層が設けられているため、金属材を加圧、加熱することにより孔部の内壁から接着層が溶け出し、孔部内に嵌入した金属材を隙間なく密着固定することができる。   According to invention of Claim 2, since the adhesive layer which can be melt | dissolved by being pressurized and heated between the two single-sided plates is provided, from the inner wall of the hole by pressurizing and heating the metal material The adhesive layer melts and the metal material fitted in the hole can be tightly fixed without any gap.

請求項３に記載の発明によれば、金属材を加圧及び加熱してプレス加工することにより孔部の内壁から接着層が溶け出すため、任意の形状の金属材であっても、孔部の内壁に密着固定することができる。   According to the invention described in claim 3, since the adhesive layer melts from the inner wall of the hole by pressurizing and heating the metal material, the hole can be formed even if the metal material has any shape. The inner wall can be fixed tightly.

請求項４に記載の発明によれば、接着層はプリプレグであるため、加熱により孔部の内壁から溶け出したプリプレグにより、内壁と金属材との隙間を埋めることができる。   According to the fourth aspect of the present invention, since the adhesive layer is a prepreg, the gap between the inner wall and the metal material can be filled with the prepreg melted from the inner wall of the hole by heating.

従って、金属材の形状の違いに関係なく、孔部と密着固定することができるため、信頼性の高い電子部品搭載用基板を提供することができる。   Therefore, since it can be closely fixed to the hole regardless of the difference in the shape of the metal material, a highly reliable electronic component mounting board can be provided.

本発明の実施形態に係る電子部品搭載用基板の両面基板形成工程を示す図である。It is a figure which shows the double-sided board | substrate formation process of the electronic component mounting board | substrate which concerns on embodiment of this invention. 本発明の実施形態に係る電子部品搭載用基板の内抜き工程を示す図である。It is a figure which shows the inside-out process of the electronic component mounting board | substrate which concerns on embodiment of this invention. 本発明の実施形態に係る電子部品搭載用基板の積層工程を示す図である。It is a figure which shows the lamination process of the board | substrate for electronic component mounting which concerns on embodiment of this invention. 本発明の実施形態に係る電子部品搭載用基板のプレス工程を示す図である。It is a figure which shows the press process of the board | substrate for electronic component mounting which concerns on embodiment of this invention. 本発明の実施形態に係る電子部品搭載用基板のスルホール形成工程を示す図である。It is a figure which shows the through hole formation process of the board | substrate for electronic component mounting which concerns on embodiment of this invention. 本発明の実施形態に係る電子部品搭載用基板のスルホールメッキ加工工程を示す図である。It is a figure which shows the through-hole plating process of the electronic component mounting board | substrate which concerns on embodiment of this invention. 本発明の実施形態に係る電子部品搭載用基板のエッチング加工工程を示す図である。It is a figure which shows the etching process process of the electronic component mounting substrate which concerns on embodiment of this invention. 本発明の実施形態に係る電子部品搭載用基板のトップシート貼着工程を示す図である。It is a figure which shows the top sheet sticking process of the electronic component mounting board | substrate which concerns on embodiment of this invention. 本発明の実施形態に係る電子部品搭載用基板の電子部品搭載工程を示す図である。It is a figure which shows the electronic component mounting process of the electronic component mounting board | substrate which concerns on embodiment of this invention. 本発明の実施形態に係る電子部品搭載用基板の電子部品搭載工程を示す図である。It is a figure which shows the electronic component mounting process of the electronic component mounting board | substrate which concerns on embodiment of this invention. 本発明の実施形態に係る電子部品搭載用基板を示す断面図である。It is sectional drawing which shows the electronic component mounting board | substrate which concerns on embodiment of this invention. 従来における電子部品搭載用基板を示す断面図である。It is sectional drawing which shows the board | substrate for electronic component mounting in the past.

以下、本発明の実施形態について図面を参照して説明する。本発明は、電子部品を搭載し、電子機器に組み込まれる配線基板に接続するための電子部品搭載用基板の製造方法及び電子部品搭載用基板に関するものである。   Embodiments of the present invention will be described below with reference to the drawings. The present invention relates to a method for manufacturing an electronic component mounting board for mounting an electronic component and connecting it to a wiring board incorporated in an electronic device, and an electronic component mounting board.

はじめに、図１から図１０を参照して、本発明の実施形態に係る電子部品搭載用基板の製造方法について説明する。図１は、本発明の実施形態に係る電子部品搭載用基板の両面基板形成工程を示す図である。図２は、本発明の実施形態に係る電子部品搭載用基板の打ち抜き工程を示す図である。   First, a method for manufacturing an electronic component mounting board according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a diagram showing a double-sided board forming step of an electronic component mounting board according to an embodiment of the present invention. FIG. 2 is a view showing a punching process of the electronic component mounting board according to the embodiment of the present invention.

また、図３は、本発明の実施形態に係る電子部品搭載用基板の積層工程を示す図である。図４は、本発明の実施形態に係る電子部品搭載用基板のプレス工程を示す図である。図５は、本発明の実施形態に係る電子部品搭載用基板のスルホール形成工程を示す図である。図６は、本発明の実施形態に係る電子部品搭載用基板のスルホールメッキ加工工程を示す図である。   Moreover, FIG. 3 is a figure which shows the lamination process of the board | substrate for electronic component mounting which concerns on embodiment of this invention. FIG. 4 is a diagram showing a pressing process of the electronic component mounting substrate according to the embodiment of the present invention. FIG. 5 is a view showing a through hole forming step of the electronic component mounting board according to the embodiment of the present invention. FIG. 6 is a diagram showing a through-hole plating process for an electronic component mounting board according to an embodiment of the present invention.

さらに、図７は、本発明の実施形態に係る電子部品搭載用基板のエッチング加工工程を示す図である。図８は、本発明の実施形態に係る電子部品搭載用基板のトップシート貼着工程を示す図である。図９は、本発明の実施形態に係る電子部品搭載用基板の電子部品搭載工程を示す図である。図１０は、本発明の実施形態に係る電子部品搭載用基板の電子部品搭載工程を示す図である。   Further, FIG. 7 is a view showing an etching process of the electronic component mounting substrate according to the embodiment of the present invention. FIG. 8 is a view showing a top sheet attaching step of the electronic component mounting substrate according to the embodiment of the present invention. FIG. 9 is a diagram showing an electronic component mounting process of the electronic component mounting board according to the embodiment of the present invention. FIG. 10 is a diagram showing an electronic component mounting process of the electronic component mounting board according to the embodiment of the present invention.

はじめに、図１に示すように、２枚の片面板（導体層）１２ａ、１２ｂの一面側に銅箔（金属箔）１３を貼着し、２枚の片面板１２ａ、１２ｂの間に加圧又は加熱することにより溶解可能なプリプレグ１４を設けて両面基板１１を形成する（両面基板形成工程）。   First, as shown in FIG. 1, a copper foil (metal foil) 13 is attached to one side of two single-sided plates (conductor layers) 12a and 12b, and pressure is applied between the two single-sided plates 12a and 12b. Or the prepreg 14 which can be melt | dissolved by heating is provided, and the double-sided board | substrate 11 is formed (double-sided board | substrate formation process).

片面板１２ａ、１２ｂは、一面側（プリプレグ１４と反対側）には銅箔（金属箔）が貼着されており、他面側は約０．１ｍｍ厚のプリプレグ１４と密着する。   The single-sided plates 12a and 12b have a copper foil (metal foil) attached to one side (the side opposite to the prepreg 14), and the other side is in close contact with the prepreg 14 having a thickness of about 0.1 mm.

上記のように形成された両面基板１１は、一方の片面板１２ａから他方の片面板１２ｂまで貫通する孔部１５をプレス加工等で形成する（孔部加工工程）。   The double-sided substrate 11 formed as described above forms a hole 15 penetrating from one single-sided plate 12a to the other single-sided plate 12b by press working or the like (hole processing step).

次に、図２に示すように、両面基板１１の一方の片面板１２ａ上に雌金型２を介して約０．３ｍｍ厚の銅板（金属板）３を搭載する。   Next, as shown in FIG. 2, a copper plate (metal plate) 3 having a thickness of about 0.3 mm is mounted on one single-sided plate 12 a of the double-sided substrate 11 through the female mold 2.

そして、雄金型４により銅板３を矢印Ａ方向から打ち抜き、雌金型２を貫通して孔部１５内に打ち抜き銅材（金属材）１６を嵌入する（打ち抜き工程）。   Then, the copper plate 3 is punched from the direction of the arrow A by the male die 4, and the punched copper material (metal material) 16 is inserted into the hole 15 through the female die 2 (punching step).

両面基板１１の孔部１５内に嵌入した銅材１６は、電子部品搭載用基板１（図１１参照）にＬＥＤ等の発熱素子である電子部品を搭載した際に、発熱素子で発生した熱を放熱する放熱部材となる。   The copper material 16 fitted into the hole 15 of the double-sided substrate 11 generates heat generated by the heating element when an electronic component, such as an LED, is mounted on the electronic component mounting board 1 (see FIG. 11). It becomes a heat radiating member for radiating heat.

次に、両面基板１１の孔部１５内に銅材を嵌入した状態で、両面基板１１の両面側（一方の片面板１２ａ側及び他方の片面板１２ｂ側）から加圧し、その後加熱することにより銅材１６をプレス加工する（金属材プレス工程）。   Next, in a state where a copper material is inserted into the hole 15 of the double-sided substrate 11, pressure is applied from both sides of the double-sided substrate 11 (one single-sided plate 12a side and the other single-sided plate 12b side), and then heated. The copper material 16 is pressed (metal material pressing step).

この金属材プレス工程により銅材１６を加圧、加熱するため、孔部１５の内壁１７からプリプレグ１４が溶け出すことにより、孔部１５内に嵌入した銅材１６を隙間なく密着固定することができる。   In order to pressurize and heat the copper material 16 by this metal material pressing step, the prepreg 14 is melted from the inner wall 17 of the hole portion 15 so that the copper material 16 fitted in the hole portion 15 can be closely fixed without any gap. it can.

また、上記金属材プレス工程により、孔部１５の内壁１７からプリプレグ１４が溶け出すため、任意の形状の放熱部材（銅材１６）であっても、孔部１５の内壁１７に密着固定することができる。   Moreover, since the prepreg 14 is melted from the inner wall 17 of the hole 15 by the metal material pressing step, even if it is a heat radiating member (copper material 16) having an arbitrary shape, it is tightly fixed to the inner wall 17 of the hole 15. Can do.

従って、放熱部材（銅材１６）の形状の違いに関係なく、孔部１５と密着固定することができるため、信頼性の高い電子部品搭載用基板１（図１１参照）を製造することができる。   Therefore, since the heat radiation member (copper material 16) can be closely fixed to the hole 15 regardless of the difference in the shape of the heat dissipation member (copper material 16), the highly reliable electronic component mounting substrate 1 (see FIG. 11) can be manufactured. .

次に、図３及び図４に示すように、加圧、加熱によりプリプレグ１４が硬化した後、両面基板１１の両面に銅箔（図示省略）が積層された金属板２１を積層し、所定方向（例えば、図３の矢印Ｂ方向）からプレス加工することにより積層板２２を形成する（積層プレス加工工程）。   Next, as shown in FIGS. 3 and 4, after the prepreg 14 is cured by pressurization and heating, a metal plate 21 in which copper foil (not shown) is laminated on both sides of the double-sided substrate 11 is laminated, and a predetermined direction is obtained. The laminated board 22 is formed by pressing from (for example, arrow B direction of FIG. 3) (lamination press processing process).

次に、図５に示すように、両面基板１１の表裏を導通して搭載する電子部品を接続するため、両面基板１１の厚さ方向に貫通孔（スルホール）２３を、ドリルやレーザー光線照射などの方法により穿孔してスルホール２３を形成する（スルホール形成工程）。   Next, as shown in FIG. 5, in order to connect the electronic components to be mounted by conducting the front and back of the double-sided substrate 11, through holes (through holes) 23 are formed in the thickness direction of the double-sided substrate 11, such as drilling or laser beam irradiation. A through hole 23 is formed by drilling by a method (through hole forming step).

次に、図６に示すように、形成したスルホール２３の内壁や積層板２２の表面側に無電解メッキ等の方法によりスルホールメッキを施し、スルホールメッキ層２４を形成する（スルホールメッキ加工工程）。   Next, as shown in FIG. 6, through-hole plating is performed on the inner wall of the formed through-hole 23 and the surface side of the laminated plate 22 by a method such as electroless plating to form a through-hole plating layer 24 (through-hole plating process).

次に、図７に示すように、積層板２２の表面側にエッチングなどを施すことによりパターニングをし、電子部品を搭載するための回路を形成する（エッチング加工工程）。   Next, as shown in FIG. 7, patterning is performed by performing etching or the like on the surface side of the laminated plate 22 to form a circuit for mounting electronic components (etching process).

次に、図８に示すように、エッチングなどを施すことによりパターニングを行なった積層板２２の表面側に電子基板を搭載するトップシートとして接着シート２５を貼着する（トップシート貼着工程）
次に、図９に示すように、接着シート２５を貼着することにより製造された電子部品搭載用基板１には、図１０に示すように、電子部品３１を搭載し、電子部品３１と両面基板１１とをボンディングワイヤ３２で結線する（電子部品搭載工程）。 Next, as shown in FIG. 8, an adhesive sheet 25 is attached as a top sheet for mounting the electronic substrate on the surface side of the laminated plate 22 patterned by etching or the like (top sheet attaching step).
Next, as shown in FIG. 9, an electronic component 31 is mounted on the electronic component mounting substrate 1 manufactured by adhering the adhesive sheet 25, as shown in FIG. 10. The substrate 11 is connected by a bonding wire 32 (electronic component mounting process).

上述したように、電子部品搭載用基板１の製造方法は、金属材プレス工程を含むことにより、孔部１５の内壁１７からプリプレグ１４が溶け出し、孔部１５内に嵌入した銅材１６を隙間なく密着固定することができる。   As described above, the manufacturing method of the electronic component mounting substrate 1 includes a metal material pressing step, so that the prepreg 14 is melted from the inner wall 17 of the hole 15 and the copper material 16 fitted into the hole 15 is separated by a gap. It can be fixed tightly.

また、金属材プレス工程を含むことにより、孔部１５の内壁１７からプリプレグ１４が溶け出すため、任意の形状の放熱部材（銅材１６）であっても、孔部１５の内壁１７に密着固定することができる。   Moreover, since the prepreg 14 melts from the inner wall 17 of the hole 15 by including the metal material pressing step, even if it is a heat dissipation member (copper material 16) of any shape, it is closely fixed to the inner wall 17 of the hole 15. can do.

従って、放熱部材（銅材１６）の形状の違いに関係なく、孔部１５と密着固定することができるため、信頼性の高い電子部品搭載用基板１（図１１参照）を製造することができる。   Therefore, since the heat radiation member (copper material 16) can be closely fixed to the hole 15 regardless of the difference in the shape of the heat dissipation member (copper material 16), the highly reliable electronic component mounting substrate 1 (see FIG. 11) can be manufactured. .

次に、図１１を参照して、本発明の実施形態に係る電子部品用搭載基板について説明する。図１１は、本発明の実施形態に係る電子部品搭載用基板を示す図である。   Next, an electronic component mounting substrate according to an embodiment of the present invention will be described with reference to FIG. FIG. 11 is a diagram showing an electronic component mounting board according to an embodiment of the present invention.

図１１に示すように、電子部品３１（図１０参照）が搭載される電子部品搭載用基板１は、銅箔（金属箔）１３が貼着された２枚の片面板１２（図１参照）の間に加圧、加熱されて溶解可能な接着層（プリプレグ、図１参照）１４が設けられた両面基板１１と、両面基板１１を貫通する孔部１５から略構成されている。   As shown in FIG. 11, an electronic component mounting board 1 on which an electronic component 31 (see FIG. 10) is mounted has two single-sided plates 12 (see FIG. 1) to which a copper foil (metal foil) 13 is attached. It is substantially composed of a double-sided substrate 11 provided with an adhesive layer (prepreg, see FIG. 1) 14 that can be melted by being pressurized and heated, and a hole 15 that penetrates the double-sided substrate 11.

このように、２枚の片面板１２ａ、１２ｂの間に加圧、加熱されて溶解可能なプリプレグ（接着層）１４が設けられているため、銅材（金属材）１６を加圧、加熱することにより孔部１５の内壁１７からプリプレグ１４が溶け出し、孔部１５内に嵌入した銅材１６を隙間なく密着固定することができる。   Thus, since the prepreg (adhesive layer) 14 that can be melted by being pressurized and heated is provided between the two single-sided plates 12a and 12b, the copper material (metal material) 16 is pressurized and heated. As a result, the prepreg 14 melts from the inner wall 17 of the hole 15, and the copper material 16 fitted into the hole 15 can be tightly fixed without any gap.

両面基板１１は、一面側（プリプレグ１４と反対側）に銅箔１３が貼着されている。また、両面基板１１の一方の片面板１２ａから他方の片面板１２ｂまで孔部１５が貫通している。   The double-sided substrate 11 has a copper foil 13 attached to one side (the side opposite to the prepreg 14). Moreover, the hole 15 penetrates from one single-sided plate 12a of the double-sided substrate 11 to the other single-sided plate 12b.

孔部１５には、両面基板１１の一方の片面板１２ａ上に銅板（金属板）３を搭載して、この銅板３を打ち抜くことにより銅材（金属材）１６を嵌入させる（図２参照）。この銅材１６は、電子部品搭載用基板１にＬＥＤ等の発熱素子である電子部品３１を搭載した際に、発熱素子で発生した熱を放熱する放熱部材となる。   In the hole 15, a copper plate (metal plate) 3 is mounted on one side plate 12 a of the double-sided substrate 11, and a copper material (metal material) 16 is inserted by punching out the copper plate 3 (see FIG. 2). . The copper material 16 becomes a heat radiating member that radiates heat generated by the heat generating element when the electronic component 31 that is a heat generating element such as an LED is mounted on the electronic component mounting substrate 1.

銅材１６は、両面基板１１の少なくとも一面側から加圧及び加熱してプレス加工することにより孔部１５と密着固定される。   The copper material 16 is tightly fixed to the hole 15 by pressurizing and heating from at least one surface side of the double-sided substrate 11.

このように、銅材１６を加圧及び加熱してプレス加工することにより孔部１５の内壁１７からプリプレグ１４が溶け出すため、任意の形状の放熱部材（銅材１６）であっても、孔部１５の内壁１７に密着固定することができる。   Thus, since the prepreg 14 melts from the inner wall 17 of the hole 15 by pressurizing and heating the copper material 16, even if it is a heat dissipation member (copper material 16) of any shape, The inner wall 17 of the part 15 can be tightly fixed.

つまり、２枚の片面板１２の間に設けられたプリプレグ１４（図１参照）が孔部１５の内壁１７からプリプレグ１４が溶け出すことにより、孔部１５内に嵌入した銅材１６を隙間なく密着固定する。   That is, the prepreg 14 (see FIG. 1) provided between the two single-sided plates 12 melts from the inner wall 17 of the hole 15 so that the copper material 16 fitted into the hole 15 can be removed without a gap. Fix tightly.

また、２枚の片面板１２の間に設けられた接着層はプリプレグ１４であるため、加熱により孔部１５の内壁１７から接着層が溶け出し、内壁１７と銅材１６との隙間を埋めることができる。   Further, since the adhesive layer provided between the two single-sided plates 12 is the prepreg 14, the adhesive layer melts from the inner wall 17 of the hole 15 by heating and fills the gap between the inner wall 17 and the copper material 16. Can do.

従って、放熱部材（銅材１６）の形状の違いに関係なく、孔部１５と密着固定することができるため、信頼性の高い電子部品搭載用基板１を提供することができる。   Therefore, the electronic component mounting board 1 with high reliability can be provided because the heat radiation member (copper material 16) can be closely fixed to the hole 15 regardless of the difference in shape of the heat dissipation member (copper material 16).

このようにして、本発明の実施形態に係る電子部品搭載用基板の製造方法は、金属箔１３が一面側に貼着された２枚の片面板１２ａ、１２ｂの間に加圧、加熱されて溶解可能なプリプレグ（接着層）１４を設けて電子部品３１が搭載される両面基板１１を形成する両面基板形成工程と、両面基板１１の一方の片面板１２ａから他方の片面板１２ｂまで貫通する孔部１５を形成する孔部加工工程と、両面基板１１の一方の片面板１２ａ上に銅板（金属板）３を搭載して、この銅板３を打ち抜いて孔部１５内に打ち抜き銅材（金属材）１６を嵌入させる打ち抜き工程と、孔部１５内に銅材１６を嵌入させた状態で、両面基板１１の少なくとも一面側から加圧及び加熱して銅材１６をプレス加工する金属材プレス工程と、を含む。   Thus, the manufacturing method of the electronic component mounting substrate according to the embodiment of the present invention is pressurized and heated between the two single-sided plates 12a and 12b having the metal foil 13 attached to one side. A double-sided substrate forming step for forming a double-sided substrate 11 on which an electronic component 31 is mounted by providing a meltable prepreg (adhesive layer) 14, and a hole penetrating from one single-sided plate 12a to the other single-sided plate 12b of the double-sided substrate 11 A hole processing step for forming the portion 15, and a copper plate (metal plate) 3 is mounted on one single-sided plate 12 a of the double-sided substrate 11, and the copper plate 3 is punched and punched into the hole 15 (metal material) ) A punching process for inserting 16, and a metal material pressing process for pressing the copper material 16 by pressing and heating from at least one side of the double-sided substrate 11 with the copper material 16 inserted in the hole 15. ,including.

また、本発明の実施形態に係る電子部品搭載用基板１は、銅箔（金属箔）１３が一面側に貼着された２枚の片面板１２ａ、１２ｂの間に加圧、加熱されて溶解可能なプリプレグ（接着層）１４が設けられた両面基板１１と、両面基板１１は、一方の片面板１２ａから他方の片面板１２ｂまで貫通する孔部１５を設け、両面基板１１の一方の片面板１２ａ上に銅板（金属板）３を搭載して、この銅板３を打ち抜いて孔部１５内に打ち抜き銅材１６を嵌入させる。   In addition, the electronic component mounting substrate 1 according to the embodiment of the present invention is melted by being pressed and heated between two single-sided plates 12a and 12b each having a copper foil (metal foil) 13 attached to one side. The double-sided board 11 provided with a possible prepreg (adhesive layer) 14 and the double-sided board 11 are provided with a hole 15 penetrating from one single-sided board 12a to the other single-sided board 12b, and one single-sided board of the double-sided board 11 A copper plate (metal plate) 3 is mounted on 12 a, the copper plate 3 is punched, and a punched copper material 16 is inserted into the hole 15.

さらに、本発明の実施形態に係る電子部品搭載用基板１は、打ち抜き銅材１６は、両面基板１１の少なくとも一面側から加圧及び加熱してプレス加工することにより孔部１５と密着固定されている。   Furthermore, in the electronic component mounting substrate 1 according to the embodiment of the present invention, the punched copper material 16 is closely fixed to the hole 15 by pressing and heating from at least one side of the double-sided substrate 11 and pressing. Yes.

また、本発明の実施形態に係る電子部品搭載用基板１は、接着層はプリプレグ１４である。   In the electronic component mounting substrate 1 according to the embodiment of the present invention, the adhesive layer is the prepreg 14.

そして、本発明の実施形態に係る電子部品搭載用基板１の製造方法によれば、金属材プレス工程により銅材（金属材）１６を加圧、加熱するため、孔部１５の内壁１７からプリプレグ１４が溶け出すことにより、孔部１５内に嵌入した銅材１６を隙間なく密着固定することができる。   And according to the manufacturing method of the electronic component mounting substrate 1 according to the embodiment of the present invention, the copper material (metal material) 16 is pressed and heated by the metal material pressing step, so that the prepreg is formed from the inner wall 17 of the hole 15. By melting 14, the copper material 16 fitted in the hole 15 can be tightly fixed without a gap.

また、金属材プレス工程により、孔部１５の内壁１７からプリプレグ１４が溶け出すため、任意の形状の放熱部材（銅材１６）であっても、孔部１５の内壁１７に密着固定することができる。   Further, since the prepreg 14 is melted from the inner wall 17 of the hole 15 by the metal material pressing step, even if it is a heat dissipation member (copper material 16) having an arbitrary shape, it can be tightly fixed to the inner wall 17 of the hole 15. it can.

従って、放熱部材（銅材１６）の形状の違いに関係なく、孔部１５と密着固定することができるため、信頼性の高い電子部品搭載用基板１を製造することができる。   Accordingly, since the heat radiation member (copper material 16) can be closely fixed to the hole 15 regardless of the difference in shape of the heat dissipation member (copper material 16), the highly reliable electronic component mounting substrate 1 can be manufactured.

また、本発明の実施形態に係る電子部品搭載用基板１によれば、２枚の片面板１２ａ、１２ｂの間に加圧、加熱されて溶解可能なプリプレグ（接着層）１４が設けられているため、銅材（金属材）１６を加圧、加熱することにより孔部１５の内壁１７からプリプレグ１４が溶け出し、孔部１５内に嵌入した銅材１６を隙間なく密着固定することができる。   In addition, according to the electronic component mounting substrate 1 according to the embodiment of the present invention, the prepreg (adhesive layer) 14 that is meltable by being pressurized and heated is provided between the two single-sided plates 12a and 12b. Therefore, by pressing and heating the copper material (metal material) 16, the prepreg 14 is melted from the inner wall 17 of the hole 15, and the copper material 16 fitted into the hole 15 can be closely fixed without any gap.

さらに、本発明の実施形態に係る電子部品搭載用基板１によれば、銅材１６を加圧及び加熱してプレス加工することにより孔部１５の内壁１７からプリプレグ１４が溶け出すため、任意の形状の放熱部材（銅材１６）であっても、孔部１５の内壁１７に密着固定することができる。   Furthermore, according to the electronic component mounting substrate 1 according to the embodiment of the present invention, the prepreg 14 is melted from the inner wall 17 of the hole 15 by pressurizing and heating the copper material 16. Even the heat radiating member (copper material 16) having a shape can be tightly fixed to the inner wall 17 of the hole 15.

また、本発明の実施形態に係る電子部品搭載用基板１によれば、接着層はプリプレグ１４であるため、加熱により孔部１５の内壁１７から溶け出したプリプレグ１４により、内壁１７と銅材１６との隙間を埋めることができる。   Further, according to the electronic component mounting substrate 1 according to the embodiment of the present invention, since the adhesive layer is the prepreg 14, the inner wall 17 and the copper material 16 are formed by the prepreg 14 that has melted from the inner wall 17 of the hole 15 by heating. Can be filled.

従って、放熱部材（銅材１６）の形状の違いに関係なく、孔部１５と密着固定することができるため、信頼性の高い電子部品搭載用基板１を提供することができる。   Therefore, the electronic component mounting board 1 with high reliability can be provided because the heat radiation member (copper material 16) can be closely fixed to the hole 15 regardless of the difference in shape of the heat dissipation member (copper material 16).

以上、本発明の電子部品搭載用基板及び電子部品搭載用基板の製造方法を図示の実施形態に基づいて説明したが、本発明はこれに限定されるものではなく、各部の構成は、同様の機能を有する任意の構成のものに置き換えることができる。   As mentioned above, although the manufacturing method of the electronic component mounting substrate and the electronic component mounting substrate of the present invention has been described based on the illustrated embodiment, the present invention is not limited to this, and the configuration of each part is the same. Any configuration having a function can be replaced.

本発明は、製造工程の簡素化を図ると共に、貫通穴と放熱部材との密着性を向上することができる電子部品搭載用基板の製造方法及び電子部品搭載用基板を提供する上で極めて有用である。   INDUSTRIAL APPLICABILITY The present invention is extremely useful in providing a method for manufacturing an electronic component mounting board and an electronic component mounting board capable of simplifying the manufacturing process and improving the adhesion between the through hole and the heat dissipation member. is there.

１ 電子部品搭載用基板
２ 雌金型
３ 銅板
４ 雄金型
１１ 両面基板
１２ 片面板
１３ 銅箔
１４ プリプレグ
１５ 孔部
１６ 銅材
１７ 内壁
２１ 金属板
２２ 積層板
２３ スルホール
２４ スルホールメッキ層
２５ 接着シート
３１ 電子部品
３２ ボンディングワイヤ DESCRIPTION OF SYMBOLS 1 Electronic component mounting board 2 Female metal mold 3 Copper plate 4 Male metal mold 11 Double-sided board 12 Single-sided board 13 Copper foil 14 Prepreg 15 Hole part 16 Copper material 17 Inner wall 21 Metal plate 22 Laminated board 23 Through hole 24 Through hole plating layer 25 Adhesive sheet 31 Electronic component 32 Bonding wire

Claims (4)

金属箔が一面側に貼着された２枚の片面板の間に加圧、加熱されて溶解可能な接着層を設けて電子部品が搭載される両面基板を形成する両面基板形成工程と、
前記両面基板の一方の片面板から他方の片面板まで貫通する孔部を形成する孔部加工工程と、
前記両面基板の一方の片面板上に金属板を搭載して、この金属板を打ち抜いて前記孔部内に打ち抜き金属材を嵌入させる打ち抜き工程と、
前記孔部内に金属材を嵌入させた状態で、前記両面基板の少なくとも一面側から加圧及び加熱して金属材をプレス加工する金属材プレス工程と、を含むことを特徴とする電子部品搭載用基板の製造方法。 A double-sided board forming step of forming a double-sided board on which an electronic component is mounted by providing an adhesive layer that can be melted by being pressed and heated between two single-sided plates having a metal foil attached to one side;
Hole processing step for forming a hole penetrating from one single-sided plate of the double-sided substrate to the other single-sided plate;
A punching step of mounting a metal plate on one side plate of the double-sided substrate, punching out the metal plate and fitting a punched metal material into the hole,
A metal material pressing step of pressing and heating the metal material by pressing and heating from at least one side of the double-sided substrate with the metal material fitted in the hole. A method for manufacturing a substrate. 電子部品が搭載される電子部品搭載用基板であって、
金属箔が一面側に貼着された２枚の片面板の間に加圧、加熱されて溶解可能な接着層が設けられた両面基板と、
前記両面基板は、一方の片面板から他方の片面板まで貫通する孔部を設け、
前記両面基板の一方の片面板上に金属板を搭載して、この金属板を打ち抜くことにより前記孔部内に打ち抜き金属材を嵌入させることを特徴とする電子部品搭載用基板。 An electronic component mounting board on which electronic components are mounted,
A double-sided board provided with an adhesive layer that can be melted by being pressed and heated between two single-sided plates with a metal foil attached to one side;
The double-sided board is provided with a hole penetrating from one single-sided plate to the other single-sided plate,
An electronic component mounting board, wherein a metal plate is mounted on one single-sided plate of the double-sided substrate, and the punched metal material is inserted into the hole by punching out the metal plate. 請求項２に記載の電子部品搭載用基板であって、
前記打ち抜き金属材は、前記両面基板の少なくとも一面側から加圧及び加熱してプレス加工することにより前記孔部と密着固定されていることを特徴とする電子部品搭載用基板。 The electronic component mounting board according to claim 2,
The electronic component mounting board according to claim 1, wherein the punched metal material is pressed and heated from at least one side of the double-sided substrate and pressed and fixed to the hole. 請求項２又は請求項３に記載の電子部品搭載用基板であって、前記接着層はプリプレグであることを特徴とする電子部品搭載用基板。   4. The electronic component mounting substrate according to claim 2, wherein the adhesive layer is a prepreg. 5.
JP2012060097A 2012-03-16 2012-03-16 Method of manufacturing substrate for mounting electronic component and substrate for mounting electronic component Pending JP2013197153A (en)

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