JP2013191836A5 - - Google Patents

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Publication number
JP2013191836A5
JP2013191836A5 JP2013019986A JP2013019986A JP2013191836A5 JP 2013191836 A5 JP2013191836 A5 JP 2013191836A5 JP 2013019986 A JP2013019986 A JP 2013019986A JP 2013019986 A JP2013019986 A JP 2013019986A JP 2013191836 A5 JP2013191836 A5 JP 2013191836A5
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JP
Japan
Prior art keywords
wire
bonding
forming tool
tool
bonding system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013019986A
Other languages
English (en)
Japanese (ja)
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JP6289808B2 (ja
JP2013191836A (ja
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Publication date
Priority claimed from US13/746,489 external-priority patent/US8998063B2/en
Application filed filed Critical
Publication of JP2013191836A publication Critical patent/JP2013191836A/ja
Publication of JP2013191836A5 publication Critical patent/JP2013191836A5/ja
Application granted granted Critical
Publication of JP6289808B2 publication Critical patent/JP6289808B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013019986A 2012-02-07 2013-02-05 ワイヤーループ成形システムおよびその使用方法 Active JP6289808B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201261596145P 2012-02-07 2012-02-07
US61/596,145 2012-02-07
US13/746,489 US8998063B2 (en) 2012-02-07 2013-01-22 Wire loop forming systems and methods of using the same
US13/746,489 2013-01-22

Publications (3)

Publication Number Publication Date
JP2013191836A JP2013191836A (ja) 2013-09-26
JP2013191836A5 true JP2013191836A5 (enExample) 2016-03-17
JP6289808B2 JP6289808B2 (ja) 2018-03-07

Family

ID=48902029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013019986A Active JP6289808B2 (ja) 2012-02-07 2013-02-05 ワイヤーループ成形システムおよびその使用方法

Country Status (3)

Country Link
US (2) US8998063B2 (enExample)
JP (1) JP6289808B2 (enExample)
CN (2) CN103295934B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9082753B2 (en) * 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
DE102014011219B4 (de) * 2014-07-29 2017-10-26 Audi Ag Vorrichtung und Verfahren zur Ausbildung einer elektrischen Kontaktierung zwischen einer Energiespeicherzelle und einer Leiterblechstruktur
US9881891B1 (en) * 2016-11-15 2018-01-30 Asm Technology Singapore Pte Ltd Method of forming three-dimensional wire loops and wire loops formed using the method
DE102018221950A1 (de) 2018-12-17 2020-06-18 BINDER tecsys GmbH Verfahren zur Herstellung und Positionierung elektrischer Verbinder
KR102859474B1 (ko) 2020-07-10 2025-09-15 삼성전자주식회사 와이어 본딩 장치
US11842978B1 (en) * 2022-07-15 2023-12-12 Asmpt Singapore Pte. Ltd. Wire bonding system including a wire biasing tool

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3218702A (en) * 1961-06-09 1965-11-23 Frederick W Steudler Method and apparatus for bonding wires to metal surfaces
US4068371A (en) * 1976-07-12 1978-01-17 Miller Charles F Method for completing wire bonds
JPS58137221A (ja) * 1982-02-10 1983-08-15 Hitachi Ltd ワイヤボンデイング装置
JPS58192688A (ja) * 1982-04-30 1983-11-10 Chiyouonpa Kogyo Kk ワイヤボンデイング装置におけるワイヤル−プ整形方法
ES2059841T3 (es) * 1989-02-13 1994-11-16 Bayer Agrochem Kk Nitro compuestos con actividad insecticida.
US4925085A (en) * 1989-05-25 1990-05-15 Motorola Inc. Bonding means and method
JPH05144867A (ja) * 1991-11-19 1993-06-11 Hitachi Ltd 電子装置およびワイヤボンデイング方法ならびにワイヤボンデイング装置
US5277355A (en) * 1992-11-25 1994-01-11 Kulicke And Soffa Investments, Inc. Self-aligning fine wire clamp
JP2783125B2 (ja) 1993-07-23 1998-08-06 株式会社デンソー ワイヤボンディング方法
US5395038A (en) * 1994-04-25 1995-03-07 International Business Machines Corporation High placement accuracy wire bonder for joining small closely spaced wiring features
US5868300A (en) * 1995-06-29 1999-02-09 Orthodyne Electronics Corporation Articulated wire bonder
JPH09321074A (ja) * 1996-05-31 1997-12-12 Toyota Motor Corp ワイヤボンディング装置
JP4467175B2 (ja) * 2000-12-22 2010-05-26 株式会社新川 ボンディングデータ設定装置および方法
US7464854B2 (en) * 2005-01-25 2008-12-16 Kulicke And Soffa Industries, Inc. Method and apparatus for forming a low profile wire loop
US7735716B2 (en) * 2006-10-27 2010-06-15 Kulicke And Soffa Industries, Inc. Method of controlling the trajectory of a bonding tool during the formation of a wire loop
US7597235B2 (en) 2007-11-15 2009-10-06 Infineon Technologies Ag Apparatus and method for producing a bonding connection
JP4625858B2 (ja) * 2008-09-10 2011-02-02 株式会社カイジョー ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム
JP2010118400A (ja) * 2008-11-11 2010-05-27 Renesas Technology Corp 半導体装置及びその製造方法
US8434669B1 (en) * 2012-01-05 2013-05-07 Asm Technology Singapore Pte Ltd. Universal bond head for wire bonders

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