JP2013190721A - Method and device for precise alignment of optical components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To precisely and rapidly align an optical waveguide of a head slider with a semiconductor laser element.SOLUTION: A precise alignment device for aligning an optical waveguide of a head slider 26 with a semiconductor laser element 01 executes steps of: using an NFP camera 23 to take images while moving a slider 26, which has the optical waveguide opened by transfer of X-Y piezo stages 27 and 28, in an X-Y axis direction; extracting a reference frame image of a reference coordinate with maximum illuminance from these taken multiple frame images; using the reference coordinate of this reference frame image as a reference to extract an X-Y peripheral frame image separated by a distance of ±3 frames in the X-axis and Y-axis directions; calculating a target coordinate that is estimated to be an optical axis of the semiconductor laser element 01, by applying a quadratic approximation calculation to each illuminance value of these extracted reference frame image and X-Y peripheral frame image, for each of X and Y axes; and positioning the slider 26 on this target coordinate.

Description

  The present invention relates to a high-precision alignment method and a high-precision alignment apparatus for an optical component capable of positioning the optical axis of a semiconductor laser element in an optical waveguide provided in the component, and more particularly to a semiconductor laser in a slider of a magnetic head. The present invention relates to a high-precision alignment method for an optical component and a high-precision alignment apparatus that can position an optical axis of a semiconductor laser element in an optical waveguide provided on a slider with high accuracy in a magnetic head manufacturing apparatus on which the element is mounted.

  In general, a magnetic disk device is desired to have a higher recording density with an increase in storage capacity. In recent years, as one of techniques for dramatically improving the recording density, the magnetic disk device has a size of about several tens of nm × several tens of nm. There has been proposed a heat-assisted magnetic recording technique in which a semiconductor laser beam is irradiated onto a minute region and heat and a magnetic field of 200 ° C. or higher are applied. A magnetic disk drive employing this heat-assisted magnetic recording technology has an optical waveguide that transmits laser light at a desired position of a slider on which a magnetic head element is mounted, and a semiconductor laser element is positioned in this optical waveguide with high accuracy. It is configured to be bonded and fixed with UV (ultraviolet) curable resin or the like.

  In a magnetic disk device adopting this heat-assisted magnetic recording technology, it is necessary to position the semiconductor laser element with high accuracy in an optical waveguide opened at a desired position of the slider. For example, the size of the slider is 0.7 mm × width. It is a micro component with a depth of 0.85 mm and a height of 0.23 mm, a semiconductor laser element size of width 0.2 mm × depth 0.1 mm × height 0.5 mm, and a light emitting point 1 μm in diameter, which is opened in the slider Since the optical waveguide has a diameter of 1 μm, highly accurate positioning is difficult.

  The conventional technique for positioning a semiconductor laser element with high accuracy in an optical waveguide opened at a desired position of the slider is to move the slider in the X and Y directions with respect to the semiconductor laser element attached to the submount. Is taken with an NFP (near field pattern) camera, and the XY coordinates of the slider position at which the light quantity of the photographed camera image is maximized are detected by image processing. The semiconductor laser element was bonded and fixed at the position.

  The alignment technique based on the light amount of the camera image according to this conventional technique has a limit in the frame rate (number of frames that can be photographed per second) of the NFP camera that performs photographing, and the above-described semiconductor laser is necessary for performing high-precision positioning. The moving speed when moving the slider in the XY direction with respect to the element cannot be performed at a high speed. Therefore, the alignment time becomes long and the magnetic head manufacturing time becomes redundant.

  In addition, the following patent document is cited as a document describing a technique for aligning a general optical axis. In the following patent document 1, one of a plurality of optical components is sequentially positioned at a light quantity measurement point. In the optical component alignment method for measuring the amount of light incident from one optical component to the other optical component and obtaining the optimum position for the maximum light amount, the light amount at the first light amount measurement point is less than a predetermined light amount value. In this case, the distance between the subsequent light intensity measurement point and the first light intensity measurement point is set to a large predetermined distance, and if the light intensity at the first light intensity measurement point is equal to or greater than the predetermined light intensity value, An alignment technique for performing alignment processing by setting the distance to the light quantity measurement point to a small predetermined distance is described. Patent Document 2 below emits light from the first optical component to the second optical component. The introduced light is detected by a photodetector, and the photodetector In the optical component alignment method of amplifying an output by an amplifying unit and adjusting a relative position between the first optical component and the second optical component based on an output of the amplifying unit, While the optical component and the second optical component are reciprocally scanned one-dimensionally and reciprocally relative to one axis, the one relating to the one axis based on the output of the amplification means obtained according to the reciprocating scan. A light intensity distribution obtaining step for obtaining a dimensional light intensity distribution, and the first optical component and the second optical component based on the one-dimensional light intensity distribution obtained in the light intensity distribution obtaining step. An alignment technique is described that performs a position adjustment step for adjusting the relative position so that the relative position becomes the alignment position.

JP 2005-345925 A JP 2008-186035 A

  The technique described in the above-mentioned patent document performs positioning of the semiconductor laser element with respect to the optical fiber, and when attaching the semiconductor laser element to the magnetic head slider in which the optical waveguide targeted by the present invention is opened, The light passing through the optical waveguide of the slider is photographed with an NFP camera while moving the slider in the X and Y directions with respect to the semiconductor laser element mounted on the submount, and the alignment is based on the maximum light quantity of the photographed camera image. There is a problem that it is difficult to apply to the technology, the alignment time becomes long, and the magnetic head manufacturing time becomes redundant. In addition, the alignment method according to the prior art includes the noise inherent to the optical system device, the output variation inherent to the camera element, and various noises due to stray light components, and it is difficult to accurately extract XY coordinates.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described conventional technique, and a high-precision alignment method for an optical component capable of aligning an optical waveguide of a magnetic head slider and a semiconductor laser element with high accuracy and high speed. And providing a high-precision alignment device.

  In order to achieve the above object, according to the first aspect of the present invention, there is provided an X-axis stage in which an optical waveguide supports a slider having an opening in a bottom direction and moves only in an X-axis direction; A Y-axis stage that moves only in the direction, a laser-gripping jig that grips the semiconductor laser element separately in the direction of the bottom surface of the slider supported by the X-stage and the Y-axis stage, and the upper surface of the slider An observation camera that captures a plurality of frame images at a predetermined frame rate; and a control unit that controls movement of the slider in the XY-axis direction by the X-axis stage and the Y-axis stage and imaging by the observation camera; and a semiconductor laser element; While moving the slider in the XY axis direction, a plurality of frame images are taken from the bottom surface side of the slider at a predetermined frame rate. An optical component high-precision alignment method for positioning a semiconductor laser element and an optical waveguide based on a frame image, wherein the control means moves the slider in the XY-axis direction by moving the XY-axis stage. A first step of capturing a plurality of frame images captured every predetermined frame, and extracting a reference frame image having the highest illuminance from the plurality of frame images acquired in the first step. A second step, a third step of extracting a peripheral frame image based on the reference coordinates of the reference frame image extracted in the second step, a reference frame image extracted in the second step and the third step, and an XY periphery The target coordinates estimated as the optical axis of the laser beam are obtained by performing a second-order approximation for each illuminance value of the frame image for each XY axis. And a fifth step of positioning the slider at the target coordinates calculated in the fourth step. The invention according to claim 2, wherein the reference coordinate is used as a reference in the third step. A peripheral frame image separated by a predetermined number in the X-axis and Y-axis directions, a peripheral frame image separated by a predetermined distance with reference to the reference coordinates, or a peripheral frame image of a predetermined area based on the reference coordinates. According to a third aspect of the present invention, in the alignment method according to any one of the above features, the laser beam diameter emitted from the semiconductor laser element is 1 μm, the optical waveguide diameter of the slider is 1 μm, and the frame rate of the observation camera. Is set to 100 fps, the XY scanning plane area of the slider is set to 10 μm × 10 μm, and the slider is connected to the X-axis stage and the Y-axis stage. The slider is composed of a piezo stage that moves in the X-axis and Y-axis directions using the piezo effect. The Y-axis piezo stage vibrates at 2 Hz in the Y-axis direction while the X-axis piezo stage vibrates at 2 Hz in the X-axis direction. The bottom surface of the slider in the first step is photographed with an observation camera at a feeding speed.

  According to a third aspect of the present invention, the laser beam emitted from the semiconductor laser element is irradiated to the upper surface of the slider whose optical waveguide is opened in the bottom direction, and the bottom surface side of the slider is moved while moving the semiconductor laser element and the slider in the XY axis direction. A high-precision alignment device for an optical component that captures a plurality of frame images at a predetermined frame rate and positions a semiconductor laser element and an optical waveguide based on the captured frame images, and supports the slider An X-axis stage that moves only in the X-axis direction, a Y-axis stage that supports the slider and moves only in the Y-axis direction, and a semiconductor laser element toward the bottom surface of the slider supported by the X-axis stage and the Y-axis stage A laser gripping tool that grips the frame at a distance, and a plurality of frame images at a predetermined frame rate positioned in the upper surface direction of the slider. An observation camera for performing shadowing, and control means for controlling movement of the slider in the XY-axis direction by the X-axis stage and Y-axis stage and photographing by the observation camera, and the control means is configured by moving the XY-axis stage. A first step of photographing the bottom surface of the slider with an observation camera while moving the slider in the XY-axis direction, and acquiring a plurality of frame images taken for each predetermined frame, and a plurality of frame images acquired by the first step A second step of extracting a reference frame image having the highest illuminance; a third step of extracting a peripheral frame image based on the reference coordinates of the reference frame image extracted in the second step; and the second and third steps. Second-order approximation calculation is performed for each XY axis for each illuminance value of the reference frame image and the XY peripheral frame image extracted by the process. Therefore, the fourth step of calculating the target coordinates estimated as the optical axis of the laser beam and the fifth step of positioning the slider at the target coordinates calculated in the fourth step are performed, and the invention according to claim 4 In the third step, a peripheral frame image separated by a predetermined number in the X-axis and Y-axis directions with respect to the reference coordinates, or a peripheral frame image separated by a predetermined distance with reference to the reference coordinates, or the reference coordinates A peripheral frame image of a predetermined region as a reference is extracted, and the invention according to claim 6 is characterized in that, in the alignment apparatus of any one of the above characteristics, a laser beam diameter emitted from the semiconductor laser element is 1 μm, When the optical waveguide diameter of the slider is 1 μm and the frame rate of the observation camera is 100 fps, the XY scanning plane area of the slider is set to 10 μm × 10 μm, The slider is composed of a piezo stage that moves the slider in the X-axis and Y-axis directions using the piezo effect, and the X-axis piezo stage vibrates at 2 Hz in the X-axis direction. The piezoelectric stage is characterized in that the bottom surface of the slider in the first step is photographed by an observation camera at a feed rate of 2 μm / s in the Y-axis direction.

  The high-precision alignment method and high-precision alignment apparatus for optical components according to the present invention provide a reference frame image having the highest illuminance among a plurality of frame images, and each illuminance value of an XY peripheral frame image based on the reference frame image. By calculating quadratic approximation for each XY axis and calculating the target coordinates estimated as the optical axis of the laser beam, the optical waveguide of the slider and the semiconductor laser element can be aligned with high accuracy and at high speed.

The figure which shows the structure of the highly accurate alignment apparatus of the optical component by embodiment of this invention. The flowchart which shows the whole outline | summary of the alignment operation | movement of the high-precision alignment apparatus by embodiment The figure which shows the detail of the alignment operation | movement of the high-precision alignment apparatus by embodiment The figure which shows the slider and semiconductor laser element which are the object of this invention

Hereinafter, an embodiment of a high-precision alignment method and a high-precision alignment apparatus for optical components according to the present invention will be described in detail with reference to the drawings.
[Assumptions]
First, an alignment technique in a magnetic head slider targeted by the alignment method and apparatus of the present invention will be described with reference to FIG. As shown in FIG. 4, the alignment technique of the present invention is an optical axis of a semiconductor laser device 01 that emits laser light 90 supported by an optical waveguide 30 and a submount 40 that are opened in a slider 26 for a magnetic disk device. The NFP camera (not shown) takes a picture from the bottom side of the slider 26 while moving the slider 26 in the XY axis direction with the semiconductor laser element 01 emitting the laser light 90 fixed. Then, the slider 26 is positioned based on the XY axis coordinates of the slider 26 that maximizes the amount of light to be photographed. Thereafter, the semiconductor laser device 01 is lowered to the optical waveguide 30 of the slider 26, and the UV between the slider 26 and the submount 40. Alignment and fixation are performed by irradiating the cured resin with ultraviolet rays and curing it.

[Description of configuration]
As shown in FIG. 1, the high-precision alignment device according to the present embodiment is mounted with the semiconductor laser element 01 and the slider 26 depicted on the right side in the drawing, and moves relative to the XYZ axes. A mechanism unit that shoots the irradiated laser beam through the optical waveguide 30 of the slider 26 with an NFP (near field pattern observation) camera 23, and each XYZ of the mechanism unit depicted on the left side in the drawing. The control computer 18 controls axial movement and imaging, and a drive circuit system unit for driving each part of the mechanical system unit according to a control signal from the control computer 18.

  The mechanical system unit is mounted on the vibration isolation table 07 and moves the slider 26 only in the Y-axis direction. The mechanism unit is supported by the Y-axis stage 05 and moves the slider 26 only in the X-axis direction. A Z-axis stage 04, a laser gripping jig 03 supported by the X-axis stage 04 and the Y-axis stage 05 and mounted with the semiconductor laser element 01, and a Z mounted on the vibration isolation table 07 and moving only in the Z-axis direction. Mounted on the axis stage 02 and the slider 26, mounted on the X-axis piezo stage 27 and the Y-axis piezo stage 28 mounted on the Z-axis stage 02, and the vibration isolation table 07, and move only in the Z-axis direction. Z-axis stage 25, NFP (near field pattern) camera 23 supported by Z-axis stage 25, and NFP optical system 24 and a CCD (Charge Coupled Device) camera 22 for taking an image in the lateral direction of the slider 26.

  The drive circuit system unit includes a camera controller 20 for controlling the NFP camera 23 and the NFP optical system 24, a motor driver 21 for driving the XYZ axis stage, the X axis piezo stage 27 and the Y axis piezo. A fine XY axis controller 08 for driving the stage 28, a function generator 12 for controlling light emission of the semiconductor laser element 01, and an LD driver 09 are configured. The X-axis piezo stage 27 and the Y-axis piezo stage 28 are stages using a piezo effect in which an operating force is generated by distortion proportional to the voltage by applying a voltage to the crystal of the piezoelectric material.

  The control computer 18 includes a display 19, a general CPU (Central Processing Unit), memory, storage means such as a magnetic disk device, input / output devices such as a keyboard, various interface devices, basic OS (operating system), and various software In this embodiment, a camera link 17 for linking with the NFP camera 23 and the CCD camera 22 and a motor driver 21 for driving the piezo XY axis piezo stages 27 and 28 are provided by software in this embodiment. A motor controller 16 to be controlled, and an AD converter 15 and a DA converter 14 for converting between analog data and digital data are provided.

[Description of operation]
As shown in FIGS. 1 and 2, the overall operation of the high-precision alignment apparatus configured as described above includes the step S21 of setting the semiconductor laser element 01 on the laser gripping jig 03 and the slider 26 as the X-axis piezo stage. 27 and a step S23 for setting the Y-axis piezo stage 28; a step S24 for adjusting the position of the focal point by focus control by light emission of the semiconductor laser element 01; and a gap between the semiconductor laser element 01 and the upper surface of the slider 26. While the X-axis stage 04 and the Y-axis stage 05 are moved at a first predetermined speed in a state where the laser beam passes through the optical waveguide 30 from the semiconductor laser element 01, the NFP camera 23 receives the laser beam, and the received laser beam Slide the slider 26 to the X-axis stage 04 and the Y-axis stage 05 at the XY coordinates of the frame with the largest light intensity (illuminance) Step S25 for positioning the coarse core, step S26 for lowering the slider 26 close to the semiconductor laser element 01 to minimize the gap, and the X-axis piezo stage 27 and the Y-axis piezo stage 28. The laser beam that has passed through the optical waveguide 30 from the semiconductor laser element 01 while being moved at a predetermined speed of 2 is received by the NFP camera 23, and based on the XY coordinates of the frame that has the largest light quantity (illuminance) of the received laser beam. A step S27 for finely positioning the slider 26 with the X-axis piezo stage 27 and the Y-axis piezo stage 28 using alignment calculation, which will be described later, and UV bonding for bonding the laser element 01 and the slider 26 by ultraviolet irradiation. Step S28 and step S29 of collecting the slider 26 to which the semiconductor laser element 01 is fixed are performed. It allows to fix the both while aligning the semiconductor laser device 01 with high precision to the optical waveguide 30 of the slider 26.

  In particular, the high-precision alignment apparatus according to the present embodiment also scans the X-axis piezo stage 27 and the Y-axis piezo stage 28 at a relatively high second predetermined speed during the fine alignment positioning operation in step S27. High-precision positioning can be performed, and details of the high-precision alignment will be described with reference to FIGS. 1 and 3.

  FIG. 3 shows the steps of the alignment positioning operation, which is a feature of the present embodiment, on the left side, and the waveguide position of the laser beam irradiated on the slider on the right side, and the movement of the XY axis stage. A plurality of frame images (coarse positioning areas in which the slider is roughly positioned) are scanned every predetermined frame (for example, 100 frames / disease) by the NFP camera 23 while the slider 26 is moved in the XY axis direction by the Step S401 for acquiring the entire photographic image), Step S402 for extracting the frame image f0 having the highest illuminance coordinate A (reference coordinate) from among the many frame images extracted in Step S401, and Step S402 for extracting. XY peripheral frame images that are separated by ± 3 frames in the XY direction with reference to the XY coordinate axes of the frame image f0 Fine alignment that calculates the coordinate B estimated as the laser optical axis position by performing polynomial curve fitting by quadratic approximation operation for each XY axis for each illuminance value of the seven frame images extracted in step S403 and step S403 By executing the step S404 and the step S405 of moving the slider to the coordinate B calculated in the step S404, high-precision alignment can be performed.

  Here, the principle of fine alignment by the step S404 will be described. In the alignment technique in the prior art, for example, the XY scanning plane area for moving the slider at the coordinate A is 10 μm × 10 μm, the vibration speed in the X-axis direction is 2 Hz vibration, the feed speed in the Y-axis direction is 2 μm / second, and the NFP camera If the frame rate is 100 fps and the scanning condition of the laser beam and the optical waveguide diameter is 1 μm, the alignment time of the prior art requires 5 seconds. Since the X axis decreases to 0.4 μm and the Y axis decreases to 1 μm, the scanning speed of each scanning axis decreases, which takes 10 seconds.

  On the other hand, in the alignment method according to the present embodiment, when the scanning condition and alignment time are set to 5 seconds, the frame rate f0 (maximum illuminance frame image f0 extracted in step S402 can be captured in 1 second). There is a possibility that a frame image deviated from the original maximum illuminance position may be selected due to the limitation on the number of frames), but a predetermined number range of XY in the XY direction centering on the frame image f0 having the maximum illuminance. A peripheral frame image is extracted, a polynomial curve fitting is performed by quadratic approximation of a plurality of frame images including the frame image of the maximum illuminance and a predetermined number of frame images, and the peak coordinate of the maximum illuminance value in the XY coordinates is calculated. By applying this peak coordinate as the coordinate B of the alignment target (laser beam optical axis), it is faster and more accurate than the prior art. It is possible to perform the core. In the above-described embodiment, the example in which the XY peripheral frame image separated by ± 3 frames in the XY direction with reference to the coordinate A (reference coordinate) having the highest illuminance has been described, but the present invention focuses on the reference coordinate. It is not limited to extracting an arbitrary number of frame images in the XY direction and performing polynomial curve fitting by quadratic approximation for each XY axis, but a frame of a predetermined distance or a predetermined region based on the maximum illuminance coordinate An image may be selected as an XY peripheral frame image to be extracted. For example, a polynomial curve fitting may be performed on all imaging frames within a range of ± 2 um with reference to the maximum luminance coordinate. .

  In the prior art, the alignment method according to the present embodiment is extraction of XY coordinates including various noises due to device-specific noise, camera element-specific output variations, and stray light components. By applying quadratic approximation of images and multiple frame images including a predetermined range of frame images, polynomial curve fitting by the least squares method can be applied to remove the noise components described above, and more accurate and accurate Alignment can be performed.

  As described above, the high-precision alignment method and the high-precision alignment apparatus for optical components according to the present embodiment align the laser light from the semiconductor laser element with the slider in which the optical waveguide is opened, and the predetermined region of the slider and the laser. Taking a plurality of frame images including laser light passing through the optical waveguide of the slider while moving the semiconductor laser element emitting light relative to the X and Y axes, a frame having the maximum illuminance among the taken plurality of frame images Extracting a predetermined number range of XY coordinate frame images based on the image and the maximum illuminance frame image, and performing a second-order approximation operation using the least square method on the extracted maximum illuminance frame image and the predetermined number range of frame images Thus, the optical waveguide of the magnetic head slider and the optical axis of the semiconductor laser element can be aligned with high accuracy and at high speed.

01 Semiconductor laser element, 02 Z-axis stage, 03 Laser gripping jig,
04 X-axis stage, 05 Y-axis stage, 07 vibration isolation table,
08 Fine XY axis controller, 12 function generator,
14 DA converter, 15 AD converter, 16 motor controller,
17 camera link, 18 control computer, 19 display,
20 camera controller, 21 motor driver, 22 CCD camera,
23 NFP camera, 24 NFP optical system, 25 Z-axis stage,
26 Slider, 27 Y-axis piezo stage, 28 X-axis piezo stage 30 Optical waveguide

Claims (6)

  An X-axis stage that supports a slider whose optical waveguide is opened in the bottom direction and moves only in the X-axis direction, a Y-axis stage that supports the slider and moves only in the Y-axis direction, the X-axis stage and Y A laser gripping jig for gripping the semiconductor laser element separately in the direction of the bottom surface of the slider supported by the axis stage, an observation camera for capturing a plurality of frame images at a predetermined frame rate located in the top surface direction of the slider, Control means for controlling movement of the slider in the XY axis direction by the X-axis stage and the Y-axis stage and photographing by the observation camera, and moving the semiconductor laser element and the slider in the XY axis direction from the slider bottom side. A plurality of frame images are captured at a frame rate, and the semiconductor laser element and the optical waveguide are guided based on the captured frame images. A high-precision alignment method of an optical component for positioning with a path, wherein the control means photographs the bottom surface of the slider with an observation camera while moving the slider in the XY-axis direction by moving the XY-axis stage, A first step of acquiring a plurality of frame images photographed for each frame, a second step of extracting a reference frame image having the highest illuminance from the plurality of frame images acquired in the first step, and the second step. A third step of extracting a peripheral frame image based on the reference coordinates of the extracted reference frame image, and the illuminance values of the reference frame image and the XY peripheral frame image extracted by the second step and the third step for each XY axis A fourth step of calculating a target coordinate estimated from the optical axis of the laser beam by performing a quadratic approximate calculation, and the fourth step. Core method adjustment of the optical components and performing a fifth step of positioning a slider to the target coordinates.   In the third step, a peripheral frame image separated by a predetermined number in the X-axis and Y-axis directions with respect to the reference coordinates, or a peripheral frame image separated by a predetermined distance with reference to the reference coordinates, or the reference coordinates as a reference 2. The method of aligning optical components according to claim 1, wherein a peripheral frame image of the predetermined area is extracted.   When the laser beam diameter emitted by the semiconductor laser element is 1 μm, the optical waveguide diameter of the slider is 1 μm, and the frame rate of the observation camera is 100 fps, the XY scanning plane area of the slider is set to 10 μm × 10 μm, The slider is composed of a piezo stage that moves the X-axis stage and the Y-axis stage in the X-axis and Y-axis directions using the piezo effect, and the X-axis piezo stage vibrates at 2 Hz in the X-axis direction. 3. The optical component aligning method according to claim 1, wherein the stage images the bottom surface of the slider in the first step with an observation camera at a feed rate of 2 [mu] m / s in the Y-axis direction.   A laser beam emitted from the semiconductor laser element is irradiated onto the upper surface of the slider whose optical waveguide is opened in the bottom direction, and a plurality of frame images at a predetermined frame rate from the bottom surface side of the slider while moving the semiconductor laser element and the slider in the XY axis direction. Is an optical component high-precision alignment device that positions a semiconductor laser element and an optical waveguide based on the captured frame image, and supports the slider and moves only in the X-axis direction. An axis stage, a Y-axis stage that supports the slider and moves only in the Y-axis direction, and a laser grip that grips the semiconductor laser element in the direction of the bottom surface of the slider supported by the X-axis stage and the Y-axis stage. A jig, and an observation camera that is located in the upper surface direction of the slider and shoots a plurality of frame images at a predetermined frame rate; Control means for controlling movement of the slider in the XY-axis direction by the X-axis stage and the Y-axis stage and photographing by the observation camera, and the control means moves the slider in the XY-axis direction by movement of the XY-axis stage. A first step of capturing the bottom surface of the slider with an observation camera and acquiring a plurality of frame images captured for each predetermined frame, and a reference frame image having the highest illuminance among the plurality of frame images acquired in the first step A second step of extracting the peripheral frame image based on the reference coordinates of the reference frame image extracted in the second step, and a reference frame image extracted in the second step and the third step And the optical axis of the laser beam by performing a second-order approximation operation for each XY axis for each illuminance value of the XY peripheral frame image A fourth step of calculating an estimated target coordinates are, alignment device of the optical component and performing a fifth step of positioning a slider to the target coordinates calculated by said fourth step.   In the third step, a peripheral frame image separated by a predetermined number in the X-axis and Y-axis directions with respect to the reference coordinates, or a peripheral frame image separated by a predetermined distance with reference to the reference coordinates, or the reference coordinates as a reference 5. The optical component aligning device according to claim 4, wherein a peripheral frame image of the predetermined area is extracted. When the laser beam diameter emitted by the semiconductor laser element is 1 μm, the optical waveguide diameter of the slider is 1 μm, and the frame rate of the observation camera is 100 fps, the XY scanning plane area of the slider is set to 10 μm × 10 μm, The slider is composed of a piezo stage that moves the X-axis stage and the Y-axis stage in the X-axis and Y-axis directions using the piezo effect, and the X-axis piezo stage vibrates at 2 Hz in the X-axis direction. 6. The optical component aligning device according to claim 4, wherein the stage images the bottom surface of the slider in the first step with an observation camera at a feed rate of 2 [mu] m / s in the Y-axis direction.