JP2013187505A - Illumination device, illumination system, exposure device, exposure method, and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an illumination device, an illumination system, an exposure device, an exposure method, and a device manufacturing method that are suited for a case where a light flux emitted from a light emitting element is used as exposure light.SOLUTION: An illumination device includes: a light branching/collection system that branches a light flux outputted from a light emitting element into a plurality of light fluxes, guides the plurality of light fluxes, and collects the plurality of light fluxes to output a light flux; and an illumination optical system that guides the light flux outputted from the light branching/collection system and irradiates a visual field area of an illumination target surface. The light branching/collection system includes: a light branching device that branches the light flux outputted from the light emitting element into the plurality of light fluxes; a light guide fiber group that includes, for each of the plurality of light fluxes obtained as a result of the division by the light branching device, a light guide fiber that guides the light flux; and a light collection device that includes a collimator lens unit that converts the plurality of light fluxes emitted from the light guide fiber group into parallel light and a diffraction optical element unit that diffracts the light flux.

Description

  The present invention relates to a technique for projecting and exposing a pattern formed on a mask onto the surface of a photosensitive substrate.

  In recent years, thin display panels using elements such as liquid crystal or organic EL (Electro Luminescence) have been widely used as information display devices. These display panels are manufactured by patterning transparent thin film electrodes on a thin glass substrate by a photolithography technique. In this photolithography technique, there is an apparatus for projecting and exposing a pattern formed on a mask onto a photosensitive substrate (hereinafter also referred to as a substrate) (for example, Patent Document 1). As this exposure apparatus, a scanning projection exposure apparatus for projecting and exposing a mask pattern onto a photosensitive substrate while moving the mask and the photosensitive substrate with respect to the projection optical system, as described in Patent Document 1, There is a step-and-repeat type exposure apparatus that fixes a mask and a plate at the time of exposure and performs exposure again by stepping the plate with respect to the mask when exposure to the region is completed.

JP 2001-337462 A

  In the exposure apparatus, a lamp such as a high-pressure mercury lamp or a xenon lamp is used as a light source of exposure light. Here, as a light source that outputs light, there is a light emitting diode (LED), particularly a light emitting element (LED element) such as a high brightness LED. The LED element emits less light than one high-pressure mercury lamp or xenon lamp. For this reason, when using an LED element for a light source, the exposure apparatus needs to ensure the light quantity required for exposure by combining a plurality of LED elements. Also, the exposure apparatus is required to enhance the performance of exposure light such as illuminance uniformity and telecentricity of exposure light even when an LED element is used as a light source.

  An object of an aspect of the present invention is to provide an illumination device, an illumination system, an exposure device, an exposure method, and a device manufacturing method that are suitable when a light beam emitted from a light emitting element such as an LED element is used as exposure light. .

  According to the first aspect of the present invention, there is provided an illuminating device that irradiates a field area of an irradiated surface with light beams output from a plurality of light emitting elements, wherein the light beams output from the light emitting elements are branched into a plurality of light beams. A light branching / aggregation system that guides the branched light fluxes, collects the branched light fluxes and outputs the light flux, and guides the light fluxes output from the light branching / aggregation system, and the field area of the irradiated surface And the optical branching / aggregating system divides the light beam output from the light emitting element into a plurality of light beams and a light guide device for guiding the light beam branched by the light branching device. An optical fiber is provided for each branched light flux, and a plurality of light guide fiber groups in which the exit faces of the light guide fibers are arranged adjacent to each other, and a light flux output from the exit face of the light guide fiber is set as parallel light. A collimator lens guides the light A collimator lens unit disposed corresponding to the light beam output from the exit surface of the fiber, and a diffractive optical element that diffracts and outputs the light beam output from the collimator lens unit for each light beam output from the collimator lens And a light collecting device including the diffractive optical element unit.

  According to the 2nd aspect of this invention, it has the illuminating device according to the 1st aspect of this invention, and the light source provided with two or more said light emitting elements, and outputting the said light beam to the said illuminating device from the said light emitting element. A featured lighting system is provided.

  According to the third aspect of the present invention, the illumination device according to the first aspect of the present invention, a mask stage that supports a mask irradiated with light emitted from the illumination device, and a pattern formed on the mask And a plate stage that supports a plate on which a pattern having the same shape is exposed.

  According to the fourth aspect of the present invention, a pattern formed on a mask is irradiated with a light beam, and the substrate is irradiated via a projection optical system disposed between the mask and a substrate stage that supports the substrate. In the exposure method, the light beams from a plurality of light emitting elements are branched into a plurality of wavelengths for each wavelength and incident on the light guide fiber, and the light beams branched from the light emission surface of the regularly arranged light guide fibers are emitted. A branching / aggregating step, and an irradiating step of irradiating the mask with the light beam by diffracting the light beam emitted from each of the light guide fibers and then passing through an illumination optical system. An exposure method is provided.

  According to the fifth aspect of the present invention, the step of exposing the substrate using the exposure method according to the fourth aspect of the present invention, and developing the exposed substrate to correspond to the transferred pattern. There is provided a device manufacturing method comprising a step of forming an exposure pattern layer and a step of processing a plurality of the substrates through the exposure pattern layer.

  ADVANTAGE OF THE INVENTION According to the aspect of this invention, the illuminating device suitable for the case where the light beam radiate | emitted from light emitting elements, such as an LED element, is used for exposure light, an illumination system, an exposure apparatus, the exposure method, and a device manufacturing method can be provided. .

FIG. 1 is a perspective view of an exposure apparatus according to this embodiment. FIG. 2 is a view of the exposure apparatus according to the present embodiment as viewed from the scanning direction side. FIG. 3 is a side view of the exposure apparatus according to the present embodiment. FIG. 4 is a schematic diagram showing an outline of an illumination system provided in the exposure apparatus according to the present embodiment. FIG. 5 is a view showing the structure of an illumination system provided in the exposure apparatus according to this embodiment. FIG. 6 is a view showing the structure of the illumination device provided in the exposure apparatus according to this embodiment. FIG. 7 is a front view of the light collecting device included in the illumination device according to the present embodiment. FIG. 8 is a cross-sectional view taken along the line AA of FIG. FIG. 9 is a top view showing a part of a lighting system according to a modification. FIG. 10 is a side view showing a part of an illumination system according to a modification. FIG. 11 is a front view showing a part of an illumination system according to a modification. FIG. 12 is a view showing the structure of the illumination device provided in the exposure apparatus according to the modification. FIG. 13 is a front view illustrating an example of a correction filter. FIG. 14 is a front view illustrating an example of a correction filter. FIG. 15 is a front view illustrating an example of a correction filter. FIG. 16 is a flowchart showing the procedure of the device manufacturing method according to the present embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the embodiments described below.

  In the following, an X axis, a Y axis, and a Z axis are set as shown in the drawings as appropriate, and description will be made with reference to an XYZ orthogonal coordinate system including these three axes. The rotation (tilt) directions around the X axis, Y axis, and Z axis are expressed as θX direction, θY direction, and θZ direction, respectively.

<Exposure device>
FIG. 1 is a perspective view of an exposure apparatus EX according to the present embodiment. FIG. 2 is a view of the exposure apparatus EX according to the present embodiment as viewed from the scanning direction side. FIG. 3 is a side view of the exposure apparatus EX according to the present embodiment. The exposure apparatus EX includes a mask stage 1, a substrate stage 2, a mask stage drive system 3, a substrate stage drive system 4, an illumination system IS, a projection system PS, and a control device 5. Further, the exposure apparatus EX includes a body 13. The body 13 includes a base plate 10, a first column 11, and a second column 12. For example, the base plate 10 is disposed on a support surface (for example, a floor surface) FL in a clean room via a vibration isolation table BL. The first column 11 is disposed on the base plate 10. The second column 12 is disposed on the first column 11. The body 13 supports each of the projection system PS, the mask stage 1 and the substrate stage 2. The projection system PS is supported by the first column 11 via the surface plate 14. The mask stage 1 is supported so as to be movable with respect to the second column 12. The substrate stage 2 is supported so as to be movable with respect to the base plate 10.

  In the present embodiment, the exposure apparatus EX is a step-and-scan type scanning exposure apparatus that scans and exposes the substrate P with the exposure light EL that passes through the pattern of the mask M by moving the mask M and the substrate P in synchronization. Scanning stepper). The exposure apparatus EX is not limited to this, and, for example, a step-and-repeat projection in which the pattern of the mask M is collectively exposed while the mask M and the substrate P are stationary, and the substrate P is sequentially moved stepwise. An exposure apparatus (stepper) may be used.

  The mask M includes a reticle on which a device pattern to be projected onto the substrate P is formed. The substrate P includes a base material and a photosensitive film (coated photosensitizer) formed on the surface of the base material. The base material includes a large glass plate, and the length of one side or the diagonal length (the length of the diagonal line) is, for example, 500 mm or more (that is, the outer diameter is 500 mm or more). In the present embodiment, a rectangular glass plate having a side of about 3000 mm is used as the base material of the substrate P.

  The exposure apparatus EX includes a plurality (seven in this embodiment) of light sources 20 and a plurality (seven in this embodiment) of illumination devices IL1 to IL7 (hereinafter referred to as illumination devices IL unless otherwise specified). A lighting system IS having In the illumination system IS, one illumination device IL is arranged for one light source 20. That is, the light source 20 and the illumination device IL are arranged in a one-to-one relationship. The illumination device IL includes an illumination optical system. The exposure apparatus EX includes a projection system PS having a plurality (seven in this embodiment) of projection optical systems PL1 to PL7. The number of light sources 20, illumination devices IL, and projection optical systems PL is not limited to seven. For example, the illumination system IS has eleven light sources, eleven illumination devices IL, and the projection system PS projects. You may have 11 optical systems. In the following description, the illumination devices IL1 to IL7 are appropriately referred to as first to seventh illumination devices IL1 to IL7, and the projection optical systems PL1 to PL7 are referred to as first to seventh projection optical systems PL1 to PL7.

  The illumination system IS is a system that irradiates the mask M with exposure light EL. The first to seventh illumination devices IL1 to IL7 included in the illumination system IS expose a partial region of the mask M arranged in each of the seven illumination regions (illumination fields) IR1 to IR7 with a substantially uniform illuminance distribution. Irradiate with light EL. In the present embodiment, as the exposure light EL emitted from the illumination system IS, light beams emitted from a plurality of light emitting elements included in the light source 20 are used. The detailed structure of the illumination system IS will be described later.

  The projection system PS is a system that projects an image of the pattern of the mask M irradiated with the exposure light EL onto the substrate P. The projection system PS includes a plurality of projection optical systems PL1 to PL7 that project pattern images at predetermined magnifications on predetermined projection regions PR1 to PR7, respectively. The projection areas PR1 to PR7 are areas to which the exposure light EL emitted from the projection optical systems PL1 to PL7 is irradiated. The projection system PS projects mask pattern images onto seven different projection areas PR1 to PR7, respectively. The projection system PS projects the mask pattern image at a predetermined projection magnification onto portions of the substrate P that are arranged in the projection regions PR1 to PR7.

  As shown in FIG. 3, the first projection optical system PL1 includes an image plane adjustment unit 33, a shift adjustment unit 34, two sets of catadioptric optical systems 31, 32, a field stop 35, and a scaling adjustment unit 36. And.

  The exposure light EL irradiated to the illumination area IR1 and passed through the mask M enters the image plane adjustment unit 33. The image plane adjustment unit 33 can adjust the position of the image plane of the first projection optical system PL1 (position in the Z axis, θX, and θY directions). The image plane adjustment unit 33 is disposed at a position that is optically conjugate with respect to the mask M and the substrate P. The image plane adjustment unit 33 includes a first optical member 33A and a second optical member 33B, and an optical system driving device that can move the first optical member 33A relative to the second optical member 33B.

  The first optical member 33A and the second optical member 33B are opposed to each other through a predetermined gap by a gas bearing. The first optical member 33A and the second optical member 33B are glass plates that transmit the exposure light EL, and each have a wedge shape. The control device 5 shown in FIG. 1 operates the optical system driving device and adjusts the positional relationship between the first optical member 33A and the second optical member 33B, whereby the position of the image plane of the first projection optical system PL1. Can be adjusted. The exposure light EL that has passed through the image plane adjustment unit 33 enters the shift adjustment unit 34.

  The shift adjustment unit 34 can shift the image of the pattern of the mask M on the surface of the substrate P in the X-axis direction and the Y-axis direction. The exposure light EL transmitted through the shift adjustment unit 34 enters the first set of catadioptric optical system 31. The catadioptric optical system 31 forms an intermediate image of the pattern of the mask M. The exposure light EL emitted from the catadioptric optical system 31 enters the field stop 35. The field stop 35 is disposed at the position of the intermediate image of the mask pattern formed by the catadioptric optical system 31. The field stop 35 defines the projection region PR1. In the present embodiment, the field stop 35 defines the projection region PR1 on the substrate P in a trapezoidal shape. The exposure light EL that has passed through the field stop 35 enters the second set of catadioptric optical system 32.

  The catadioptric optical system 32 has the same structure as the catadioptric optical system 31. The exposure light EL emitted from the catadioptric optical system 32 enters the scaling adjustment unit 36. The scaling adjustment unit 36 can adjust the magnification (scaling) of the image of the mask pattern. The exposure light EL that has passed through the scaling adjustment unit 36 is irradiated onto the substrate P. In the present embodiment, the first projection optical system PL1 projects an image of the mask pattern onto the substrate P at an equal magnification, but the present invention is not limited to this. For example, the first projection optical system PL1 may enlarge or reduce the image of the mask pattern, or may project it in an inverted manner. The projection optical systems PL1 to PL7 all have an equivalent structure.

  The mask stage 1 is a device that moves the illumination areas IR1 to IR7 while holding the mask M. The mask stage 1 includes a mask holding unit 15 that can hold the mask M. The mask holding unit 15 includes a chuck mechanism that can vacuum-suck the mask M, and the mask M can be detached. The mask holding unit 15 holds the mask M so that the surface (pattern forming surface) of the mask M on the projection system PS side and the XY plane including the X axis and the Y axis are substantially parallel.

  The mask stage drive system 3 is a system that moves the mask stage 1. The mask stage drive system 3 includes a linear motor, for example, and can move the mask stage 1 on the guide surface 12G of the second column 12. The mask stage 1 can be moved in the three directions of the X axis, the Y axis, and the θZ direction on the guide surface 12G with the mask M held by the mask holding unit 15 by the operation of the mask stage drive system 3. .

  The substrate stage 2 holds the substrate P and scans the substrate P with respect to the projection areas PR1 to PR7 of the exposure light EL irradiated from the illumination system IS and the projection system PS as a pattern transfer device (X-axis direction). Move to. The substrate stage 2 includes a substrate holding unit 16 that can hold the substrate P. The substrate holding unit 16 includes a chuck mechanism that can vacuum-suck the substrate P, and the substrate P can be detached. The substrate holding unit 16 holds the substrate P so that the surface (exposure surface) of the substrate P and the XY plane are substantially parallel.

  The substrate stage drive system 4 is a system that moves the substrate stage 2. The substrate stage drive system 4 includes, for example, a linear motor, and can move the substrate stage 2 on the guide surface 10G of the base plate 10. The substrate stage 2 operates in the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions on the guide surface 10G in a state where the substrate P is held by the substrate holding unit 16 by the operation of the substrate stage drive system 4. It is possible to move in 6 directions.

  As shown in FIG. 3, the reference member 43 is disposed on the surface of the substrate stage 2 on the −X side with respect to the substrate holding unit 16 on the projection system PS side. The surface 44 of the reference member 43 on the projection system PS side is disposed in substantially the same plane as the surface of the substrate P held by the substrate holding unit 16. Further, a transmissive portion 45 that can transmit the exposure light EL is disposed on the surface 44 of the reference member 43. Below the reference member 43 (inside the substrate stage 2), a light receiving device 46 capable of receiving light transmitted through the transmitting portion 45 is disposed. The light receiving device 46 includes a lens system 47 on which light that has passed through the transmission unit 45 enters, and an optical sensor 48 that receives the light that has passed through the lens system 47. In the present embodiment, the optical sensor 48 includes an image sensor (CCD: Charge Coupled Device). The optical sensor 48 outputs a signal corresponding to the received light to the control device 5.

  As shown in FIGS. 1 and 2, the interferometer system 6 includes a laser interferometer unit 6 </ b> A that measures position information of the mask stage 1 and a laser interferometer unit 6 </ b> B that measures position information of the substrate stage 2. The laser interferometer unit 6 </ b> A can measure position information of the mask stage 1 using a measurement mirror 1 </ b> R disposed on the mask stage 1. The laser interferometer unit 6 </ b> B can measure the position information of the substrate stage 2 using the measurement mirror 2 </ b> R disposed on the substrate stage 2. In the present embodiment, the interferometer system 6 can measure the positions of the mask stage 1 and the substrate stage 2 with respect to the X-axis, Y-axis, and θX directions using the laser interferometer units 6A and 6B.

  The first detection system 7 detects the position in the Z-axis direction of the surface (pattern formation surface) of the mask M on the projection system PS side. The first detection system 7 is a so-called oblique incidence type multi-point focus / leveling detection system, and is disposed opposite to the projection system PS-side surface of the mask M held on the mask stage 1 as shown in FIG. It has a plurality of detectors 7A-7F. Each of the detectors 7A to 7F emits detection light from a projection unit that irradiates detection light to the detection regions MZ1 to MZ6 and a lower surface (surface on the projection system PS side) of the mask M arranged in the detection regions MZ1 to MZ6. A light receiving portion capable of receiving light. When the position in the Z-axis direction on the lower surface of the mask M arranged in the detection regions MZ1 to MZ6 changes, the first detection system 7 applies to the light receiving unit according to the amount of displacement in the Z-axis direction on the lower surface of the mask M. The incident position of the detection light is displaced. Each of the detectors 7A to 7F outputs a signal corresponding to the displacement amount of the incident position of the detection light with respect to the light receiving unit to the control device 5. The control device 5 can determine the position in the Z-axis direction of the lower surface of the mask M arranged in the detection regions MZ1 to MZ6 based on signals from the respective light receiving portions of the detectors 7A to 7F.

  The second detection system 8 detects the position in the Z-axis direction on the surface (exposure surface) of the substrate P. The second detection system 8 is a so-called oblique incidence type multi-point focus / leveling detection system, and as shown in FIG. 3, a plurality of detectors 8A arranged to face the surface of the substrate P held by the substrate stage 2. Has ~ 8H. Each of detectors 8A to 8H includes a projection unit that irradiates detection light to detection regions PZ1 to PZ8 and a light receiving unit that can receive detection light from the surface of substrate P arranged in detection regions PZ1 to PZ8. . When the position in the Z-axis direction on the surface of the substrate P arranged in the detection regions PZ1 to PZ8 changes, the second detection system 8 is applied to the light receiving unit according to the amount of displacement in the Z-axis direction on the surface of the substrate P. The incident position of the detection light is displaced. Each of the detectors 8 </ b> A to 8 </ b> H outputs a signal corresponding to the displacement amount of the incident position of the detection light with respect to the light receiving unit to the control device 5. The control device 5 can obtain the position in the Z-axis direction of the surface of the substrate P arranged in the detection regions PZ1 to PZ8 based on signals from the respective light receiving portions of the detectors 8A to 8H.

  The alignment system 9 detects an alignment mark as a position mark provided on the substrate P, and measures its position. The position of the alignment mark is, for example, a position in the XY coordinate system of the exposure apparatus EX. The alignment mark is transferred to the substrate P by exposure and provided on the surface of the substrate P. In the present embodiment, the alignment system 9 is disposed on the −X side in the X-axis direction (scanning direction) with respect to the projection system PS.

  The alignment system 9 is a so-called off-axis alignment system. As shown in FIG. 3, the alignment system 9 includes a plurality (six in this embodiment) of detectors 9 </ b> A to 9 </ b> F arranged to face the surface of the substrate P held by the substrate stage 2. Each of the detectors 9A to 9F includes a projection unit that irradiates detection light to the detection areas SA1 to SA6, and a microscope and a light receiving unit that acquire optical images of alignment marks arranged in the detection areas SA1 to SA6. The detectors 9A to 9F and the detection areas SA1 to SA6 are arranged along a direction orthogonal to the scanning direction, that is, the Y-axis direction.

  Next, the control device 5 will be described. The control device 5 controls the operation of the exposure apparatus EX and executes the exposure method according to the present embodiment. The control device 5 is, for example, a computer, and includes a processing unit, a storage unit, and an input / output unit. The processing unit is, for example, a CPU (Central Processing Unit). The storage unit is, for example, a RAM (Random Access Memory), a ROM (Read Only Memory), a hard disk device, or a combination thereof. The input / output unit includes an interface, an input port, an output port, and the like for connecting to an illumination system IS, a projection system PS, an interferometer system 6, an alignment system 9, a mask stage driving system 3, a substrate stage driving system 4, and the like. It has. The processing unit controls the operation of the devices of the exposure apparatus EX via the input / output unit, or acquires information regarding the state of the devices, detection values detected by the devices, and the like.

<Lighting system>
FIG. 4 is a schematic diagram showing an outline of the illumination system IS provided in the exposure apparatus EX according to the present embodiment. FIG. 5 is a view showing the structure of the illumination system IS provided in the exposure apparatus EX according to the present embodiment. FIG. 6 is a view showing the structure of the illumination device IL provided in the exposure apparatus EX according to the present embodiment. FIG. 7 is a front view of the light collecting device included in the illumination device IL according to the present embodiment. FIG. 8 is a cross-sectional view taken along the line AA of FIG. As shown in FIGS. 1, 2, and 4, the illumination system IS includes seven light sources 20 for exposure light EL and seven illumination devices IL (first to seventh illumination devices IL1 to IL7) corresponding to the light sources 20, respectively. And).

  The light source 20 includes light emitting elements 101A, 101B, 101C, and 101D (hereinafter referred to as the light emitting element 101 unless otherwise specified) as the light source of the exposure light EL. Here, in FIGS. 4 and 5, the light source 20 of the present embodiment showing only four light emitting elements 101 </ b> A, 101 </ b> B, 101 </ b> C, and 101 </ b> D includes 70 light emitting elements 101. As the light emitting element 101, a light emitting diode is used. The light source 20 outputs a light beam having a predetermined wavelength from the light emitting element 101. In the light source 20 of the present embodiment, a light emitting diode that outputs light with a wavelength of 390 nm to 410 nm with an output of 1 W and a light emitting surface size of 1 mm × 1 mm is used as the light emitting element 101. The light source 20 of the present embodiment uses 70 light emitting diodes of the same type as the light emitting element 101. The light source 20 is not limited to the number and type of light emitting diodes used as the light emitting element 101.

  The illumination device IL includes an optical branching / aggregation system 21 and an illumination optical system 22. The light branching / aggregating system 21 branches the light beams output from the light emitting elements 101 of the light source 20 and then collects them. The illumination optical system 22 performs various processes while irradiating the mask M as exposure light while guiding the light beam collected by the light branching / aggregation system 21.

  As shown in FIG. 4, the optical branching / aggregating system 21 includes optical branching devices 102A, 102B, 102C, and 102D that branch the light beams output from the light emitting elements 101A, 101B, 101C, and 101D into a plurality of parts (hereinafter, particularly distinguished) If not, it is referred to as an optical branching device 102), a light guide fiber group FG, and an optical assembly device 103. The optical branching devices 102A, 102B, 102C, and 102D respectively split the light beams output from the light emitting elements 101A, 101B, 101C, and 101D into a plurality. The light guide fiber group FG includes light guide fibers F11 to F42 as light guide paths, and guides the light splitting devices 102A, 102B, 102C, and 102D and the branched light flux. The light collecting device 103 collimates the light beams emitted from the respective light guide fibers F11 to F42 and then diffracts them to collect them into one light beam, and the collected one light beam is used as the exposure light EL. 22 to output.

  The light beams from the respective light emitting elements 101A, 101B, 101C, and 101D are guided light fibers F11, F12, and FD respectively corresponding to the optical branching devices 102A, 102B, 102C, and 102D and the optical branching devices 102A, 102B, 102C, and 102D. The light collecting device 103 is irradiated through F21, F22, F31, F32, F41, and F42. The light guide fibers F11 and F12 correspond to the optical branching device 102A. The light guide fibers F21 and F22 correspond to the optical branching device 102B. The light guide fibers F31 and F32 correspond to the optical branching device 102C. The light guide fibers F41 and F42 correspond to the optical branching device 102D. The light beam that has passed through the light collecting device 103 passes through the illumination optical system 22 and is then irradiated on the surface of the mask M as exposure light EL. The optical branching / aggregation system 21 is shown only in the configuration corresponding to the four light emitting elements 101A, 101B, 101C, 101D in FIGS. 4 and 5, but the optical branching devices 102A, 102B, 102C, 102D, The light guide fiber groups FG are provided corresponding to the light emitting elements 101, respectively. That is, the optical branching / aggregation system 21 of the present embodiment is provided with 70 optical branching devices 102 corresponding to the 70 light emitting elements 101. In addition, the light guide fibers constituting the light guide fiber group FG are also provided corresponding to the 70 light branching devices 102. Specifically, since the light guide fiber group FG includes two light guide fibers for one optical branching device 102, the light guide fiber group FG includes 140 light guide fibers. In addition, the light collecting device 103 also includes a number of parts corresponding to the number of light guide fibers constituting the light guide fiber group FG in each part.

  Hereinafter, each part of the optical branching / aggregation system 21 will be described in detail with reference to FIGS. The light guide fibers F11 to F41 (hereinafter referred to as the light guide fiber F1 unless otherwise specified) and F12 to F42 (hereinafter referred to as the light guide fiber F2 unless otherwise specified) are used as the light guide paths. An incident portion where a light beam from the incident portion is incident, a light guide portion that allows the light beam incident from the incident portion to pass therethrough, and an emission portion that emits the light flux that has passed through the light guide portion. The light guide fibers F11 to F41 and F12 to F42 all have the same structure. In the following, the light guide fibers F1 and F2 will be described as an example unless otherwise specified. In the light guide fiber group FG, the incident surfaces of the light guide fibers F <b> 1 and F <b> 2 are arranged at positions corresponding to the light branching device 102, and the emission surfaces are arranged at positions corresponding to the light collecting device 103. Here, in the light guide fiber group FG, the exit surfaces of the light guide fibers F1 and F2 are arranged on one surface, and the exit surfaces of the light guide fibers F1 and F2 are the exit surfaces of the other light guide fibers F1 and F2. Adjacent to. In other words, the light guide fiber group FG forms one large light exit surface by bringing the light exit surfaces of the plurality of light guide fibers F1 and F2 to be adjacent to each other. The light collecting device 103 is disposed at a position facing the emission surface of the light guide fiber group FG. In this embodiment, the light guide fibers F1 and F2 are bundles in which a plurality of quartz fibers having a single strand φ0.2 mm are bundled, and the fiber incident surface size is 3 mm × 3 mm. The light guide fibers F1 and F2 are not limited to those having such specifications.

  Each of the optical branching devices 102A, 102B, 102C, and 102D includes a condenser lens 111 and a dichroic mirror 112, respectively, as shown in FIGS. The condensing lens 111 is an optical element that expands the light beam emitted from the light emitting element 101. The condensing lens 111 of this embodiment expands the light beam output from the light emitting element 101 three times. The luminous flux output from the light emitting element 101 is enlarged by the condenser lens 111, so that the NA becomes 1/3.

  The dichroic mirror 112 branches the light beam from the light emitting element 101 into a plurality of systems (two systems in the present embodiment), and enters the incident parts of the light guide fibers F11 and F12. The dichroic mirror 112 is an optical element that reflects a part of the light beam and transmits the remaining wavelengths. The dichroic mirror 112 is disposed on the optical path of the light beam expanded by the condensing lens 111, and is a component of a part of the wavelength band (λ1) of the light beam output from the light emitting element 101 and expanded by the condensing lens 111. Is reflected, and the light beam composed of the remaining wavelength band (λ2) is transmitted. The dichroic mirror 112 of the present embodiment reflects a light beam composed of a component having a wavelength band λ1 = 390 nm to 400 nm among light beams composed of a component having a wavelength of 390 nm to 410 nm output from the light emitting element 101, λ1 = A component composed of components from 400 nm to 410 nm is passed. The dichroic mirror 112 causes the reflected light beam composed of the λ1 component to be incident on the light guide fiber F1, and causes the light beam composed of the transmitted λ2 component to be incident on the light guide fiber F2. That is, in the optical branching / aggregation system 21, the incident surface of the light guide fiber F1 is disposed at the focal position of the light beam reflected by the dichroic mirror 112, and the light guide fiber F2 is incident at the focal position of the light beam that has passed through the dichroic mirror 112. The surface is arranged.

  With such a structure, the light branching device 102 can branch into two systems after expanding the light flux from the light emitting element 101. Further, the optical branching device 102 causes the branched light beams having different wavelengths to enter the light guide fibers F1 and F2, respectively.

  As shown in FIG. 6, the light collecting device 103 is disposed so as to face the emission surface of the light guide fiber group FG. As shown in FIGS. 7 and 8, the light collecting apparatus 103 includes a collimator lens unit 121 and a diffractive optical element unit (hereinafter also referred to as a DOE unit) 122. 6 to 8, in order to make the configuration of the light collecting device 103 easier to see, the actual number of components of the collimator lens unit 121 of the light collecting device 103 and the constituent members of the DOE unit 122 are the actual numbers of this embodiment. Less than shown.

  The collimator lens unit 121 is a unit in which collimator lenses are disposed at positions corresponding to the light guide fibers F1 and F2. Here, as described above, since the light guide fibers F1 and F2 are disposed so that the emission surfaces are adjacent to each other, the collimator lens unit 121 is disposed so that the collimator lens is adjacent. The collimator lens unit 121 can be said to have the same configuration as a fly-eye lens. That is, the collimator lens unit 121 is a single member in which a plurality of collimator lenses are connected in a matrix (vertical and horizontal) on one surface. The collimator lens of the collimator lens unit 121 uses the light beam emitted from the light guide fiber F1 or the light guide fiber F2 arranged at the corresponding position as parallel light. Here, in this embodiment, the light guide fiber group FG includes 70 light guide fibers F1 and 70 light guide fibers F2. Therefore, the collimator lens unit 121 has 140 collimator lenses. FIG. 7 shows only 37 collimator lenses out of 140 collimator lenses. In the collimator lens unit 121 of this embodiment, the shape (one element size) of one collimator lens is 7.4 mm × 7.4 mm, and the focal length is 10 mm. The size of one collimator lens constituting the collimator lens unit 121 is basically determined by the emission diameters of the light guide fibers F1 and F2 (φ3.4 mm in the present embodiment) and the focal length of the collimator lens. decide.

  The DOE unit 122 includes a substrate 123 and a plurality of diffractive optical elements (hereinafter also referred to as DOE) 124A and 124B. The DOE unit 122 faces the collimator lens unit 121, and the substrate 123 is disposed at a position where the light beam that has passed through the collimator lens unit 121 passes. The substrate 123 is made of a transparent material. In the DOE unit 122, diffractive optical elements (hereinafter also referred to as DOE) 124A and 124B are arranged on the substrate 123 at positions corresponding to the light guide fibers F1 and F2, respectively. Here, the DOEs 124A and 124B are also arranged adjacent to each other. In the DOE unit 122, the DOE 124A is disposed at a position corresponding to the light guide fiber F1, and the light beam output from the light guide fiber F1 is collimated by the collimator lens and then diffracted by the DOE 124A. Similarly, in the DOE unit 122, the DOE 124B is disposed at a position corresponding to the light guide fiber F2, and the light beam output from the light guide fiber F2 is collimated by the collimator lens and then diffracted by the DOE 124B. . When the light beams diffracted by the DOEs 124A and 124B are observed in the far field, each becomes a trapezoidal irradiation region.

  In this embodiment, the light guide fiber group FG includes 70 light guide fibers F1 and 70 light guide fibers F2. Therefore, in the DOE unit 122, 70 DOEs 124A are arranged, and 70 DOEs 124B are arranged. FIG. 7 shows only 37 DOEs 124A and 124B out of a total of 140 DOEs. In the DOE unit 122 of the present embodiment, the shape (one element size) of one collimator lens is 7.4 mm × 7.4 mm. The DOE 124A is an optical element designed to diffract light having a wavelength band of λ1, that is, light having a wavelength of 390 nm to 400 nm. The DOE 124B is an optical element designed to diffract light having a wavelength band of λ2, that is, light having a wavelength of 400 nm to 410 nm.

  The DOE unit 122 is created by forming a grating for generating a desired diffraction pattern on a quartz glass substrate having a diameter of about 100 mm by an etching technique or the like. Thus, the DOE unit 122 is an integrated glass substrate. Therefore, the light collecting apparatus 103 can align the DOEs 124A and 124B and the collimator lens by relatively moving the plate-like collimator lens unit 121 and the plate-like DOE unit 122 and aligning them. it can.

  Next, the arrangement of the DOE 124A and the DOE 124B and the arrangement positions of the light guide fibers F1 and F2 will be described. As described above, in the optical branching / aggregation system 21, the DOE 124A and the light guide fiber F1 are associated with each other, and the DOE 124B and the light guide fiber F2 are associated with each other. For this reason, the arrangement pattern of DOE124A, 124B and the arrangement pattern of light guide fiber F1, F2 become the same arrangement pattern. Therefore, the arrangement pattern of the DOEs 124A and 124B will be described below as a representative.

  As shown in FIGS. 7 and 8, in the DOE unit 122, the DOE 124A and the DOE 124B are alternately arranged. Here, in FIG.7 and FIG.8, DOE124A and DOE124B are shown by different hatching. The DOE 124A is disposed at the closest position (in this embodiment, in the vertical and horizontal directions in FIG. 7). Similarly, the DOE 124A is disposed at the closest position (in the present embodiment, in the vertical and horizontal directions in FIG. 7). As described above, the arrangement pattern of the exit surfaces of the light guide fibers F1 and F2 facing the DOE unit 122 via the collimator lens unit 121 is the same. Therefore, in the light guide fiber group FG, the exit surfaces of the light guide fibers F1 and F2 are alternately arranged, and the wavelengths of the light beams emitted from the exit surface of the light guide fiber group FG are alternately switched. As described above, the DOE unit 122 can disperse regions where light beams having different wavelengths are emitted uniformly on the exit surface of the DOE unit 122 by alternately arranging the DOE 124A and the DOE 124B. In this way, by uniformly dispersing regions where light beams having different wavelengths are emitted, it is possible to average the wavelength specification for the illumination NA.

  The light collecting device 103 causes the collimator lens unit 121 to collimate the light beam output from the exit surface of the light guide fiber group FG, and then diffracts and emits the light from the DOE unit 122. In the present embodiment, the light beam emitted from the light collecting device 103 is incident on the illumination optical system 22 and then is irradiated onto the surface of the mask M as the exposure light EL.

  As described above, the light branching / collecting system 21 branches the light beams output from the plurality of light emitting elements 101 into a plurality of wavelength regions while expanding the light flux by the light branching device 102 to a predetermined magnification. The optical branching / aggregating system 21 causes a light beam branched into a plurality of wavelength regions to enter separate light guiding fibers F1 and F2 of the light guiding fiber group FG while expanding to a predetermined magnification. The light branching / aggregating system 21 alternately arranges the exit surfaces of the light guide fibers F1 and F2 of the light guide fiber FG, and emits light fluxes in the respective wavelength bands from the exit surfaces of the light guide fibers F1 and F2. The optical branching / aggregation system 21 converts the light fluxes of the respective wavelength bands emitted from the light guide fibers F1 and F2 into parallel light by the corresponding collimator lens of the collimator lens unit 121, and then DOE 124A corresponding to the wavelength bands of the light fluxes. Diffraction is performed by the DOE unit 122 in which 124B is arranged. Thereby, the light branching / aggregating system 21 can make the illumination optical system 22 enter the light beam in which the light beam emitted from the light emitting element 101 of the light source 20 is uniformly dispersed.

  The light branching / aggregating system 21 can diffract the light beam more appropriately by the DOE unit 122 by separating the light beam emitted from the light emitting element 101 by the wavelength dividing band by the light branching device 102. Here, the DOEs 124A and 124B are optical devices designed so that when a light beam having a target wavelength is incident, the light beam transmitted (passed) through the DOEs 124A and 124B is diffracted, and the intensity distribution with respect to the diffraction angle satisfies a desired condition. It is an element. The DOEs 124A and 124B of this embodiment each have a bandwidth of 10 nm as described above. The optical branching / aggregating system 21 can appropriately diffract the light beam by causing the light beam separated for each wavelength band by the light branching device 102 to enter the DOEs 124A and 124B.

  Next, the illumination optical system 22 will be described. As shown in FIG. 6, the illumination optical system 22 includes an aperture stop (σ stop) 130, a condenser lens 131, a field stop 132, a relay lens 133, and a relay lens 134. These are arranged in this order from the optical branching / aggregation system 21 (the side of the DOE unit 122 that emits the light beam) toward the substrate stage 2. The light beam emitted from the DOE unit 122 passes through the aperture stop 130 and the diameter of the light beam is limited, then passes through the condenser lens 131, and is formed into the shape of the field of view (trapezoid) at the position of the field stop 132. . Thereafter, the light beam passes through the relay lenses 133 and 134 and irradiates the mask M. Here, the condenser lens 131 has a focal length of 445 mm and an illumination area size of 100 mm × 10 mm. The aperture stop (σ stop) 130 limits the luminous flux by setting the aperture diameter to φ100 so that the illumination NA is 0.11. In the illumination optical system 22, the relay lens 133 and the relay lens 134 constitute an equal magnification relay lens optical system, and a field stop 132 is disposed at the image forming position on the incident side of the relay lens optical system, and the emission side. A mask M is arranged at the image forming position.

  In the illumination system IS and the illumination device IL of this embodiment, when the light guide fiber F1 or F2 and the collimator lens and the DOE 124A or 124B are counted as one set, the 140 light guide fibers F1 or F2, the collimator lens and the DOE 124A or 124B are included. Have. A light beam emitted from one DOE 124A or 124B forms one trapezoidal illumination field, and 140 illumination fields overlap, and the illuminance distribution in the illumination field is averaged to obtain a uniform intensity distribution.

Here, as an example, assuming that the light emission output per light emitting element 101 is 1 W, the mask surface illuminance [mW / cm ² ] when 70 light emitting elements 101 are used is calculated. In this calculation, the loss at the time of guiding the light beam to the exit surface of the light guide fiber F1 or F2 is 25% of the light emission angle of the light emitting element 101 that cannot be taken in, and the light is transmitted through the light guide fibers F1 and F2. It is assumed that the loss due to is 30%. Therefore, about 36 [W] of the light emission output 70 [W] of the light emitting element 101 is the total light energy of the light flux output from the exit surfaces of the light guide fibers F1 and F2. In this calculation, it is assumed that the loss during light guiding from the exit surface of the light guiding fiber to the mask M includes 20% of the light amount loss caused by passing through the optical system including light shielding by the aperture stop 130. Assume that the loss at DOE 124A or 124B is about 15%. Under the above conditions, in the illumination system IS and the illumination device IL, the illuminance of the exposure light applied to the mask M is 2448 [mW / cm ² ].

  The exposure apparatus EX, the illumination system IS, and the illumination apparatus IL are configured as described above, so that even when a plurality of light emitting elements 101 are used as the light source 20, the exposure light EL (illumination light) suitable for the mask M (covered light) is used. (Irradiation surface) can be irradiated.

  Further, by using the light emitting element 101 as the light source 20, the output light flux can be used efficiently. Specifically, since the light-emitting element 101 can emit light in a wavelength band necessary for exposure, the light-emitting element 101 outputs light toward the illumination optical system 22 more efficiently than a mercury lamp or the like that emits broadband light. be able to.

  Further, by using the light emitting element 101 as the light source 20, the light source 20 can be temporarily turned off during intermittent exposure. Specifically, the time required from when the light emitting element 101 is activated until a predetermined light beam is emitted is shorter than that of the mercury lamp. For this reason, the light source 20 using the light emitting element 101 can be switched on and off in a short time. In this way, the light source 20 can be turned off, so that power consumption during use can be reduced. Moreover, it is possible to suppress generation of unnecessary heat by turning on the illumination even when exposure is not performed. Further, since the exposure can be performed in a short time, the exposure can be executed efficiently.

  Further, by using a plurality of light emitting elements 101 as the light source 20, the life of the light source 20 can be extended compared to a mercury lamp or the like. In the present embodiment, the amount of light can be increased by increasing the number of light emitting elements 101 constituting the light source 20. As a result, the amount of light can be increased while suppressing the increase in size and cost of the apparatus. Thereby, the manufacturing cost of the goods manufactured with exposure apparatus EX can be reduced.

  In the present embodiment, the light beam output from the light-emitting element 101 of the light source 20 is guided by the light guide fiber groups F1 and F2, that is, the optical fiber is used to guide the light beam. The degree of freedom of arrangement of the system IS and the illumination device IL can be improved. For example, the light emitting element 101 of the light source 20 can be arranged outside the vicinity of the illumination device IL. Thereby, the space of the exposure apparatus EX, the illumination system IS, and the illumination apparatus IL can be efficiently used, and each part can be efficiently arranged, so that the apparatus can be downsized. Moreover, since the space in which the light source 20 can be arranged becomes larger, the light source 20 can be easily enlarged and the amount of light can be easily increased.

  In the present embodiment, the light flux output from the light emitting element 101 is condensed by the condenser lens 111, so that the NA of the light flux can be reduced. The proportion of the light beam incident on the fiber F1 or F2 can be increased.

<Modification of lighting system>
9 to 11 are schematic views showing examples of modified illumination that can be realized by the illumination system according to the present embodiment. FIG. 9 is a top view showing a part of a lighting system according to a modification. FIG. 10 is a side view showing a part of an illumination system according to a modification. FIG. 11 is a front view showing a part of an illumination system according to a modification. The illumination system of the modification shown in FIGS. 9 to 11 includes a cooling device that cools the light emitting element 101 of the light source 20. In addition, the illumination system of a modification is the structure similar to illumination system IS of this embodiment mentioned above except providing the cooling device. 9 to 11 show a state in which five light emitting elements 101 among a large number of light emitting elements 101 are arranged in two rows. In addition, the optical branching device 102 corresponding to the light emitting element 101 and the light guide fibers F1 and F2 are also displayed for 5 sets × 2 columns. 9 to 11 show a part of the light source 20, and a plurality of similar configurations are arranged.

  The cooling device 150 includes a refrigerant circulation portion 151 and a refrigerant pipe 152 as shown in FIGS. 9 to 11. The refrigerant circulation unit 151 supplies the refrigerant to the refrigerant pipe 152 and cools the refrigerant pipe 152. The refrigerant circulation unit 151 controls the circulation of the refrigerant into the refrigerant pipe 152 and further cools the refrigerant. Both ends of the refrigerant pipe 152 are connected to the refrigerant circulation portion 151. The cooling device 150 includes three refrigerant pipes 152, extends in a direction parallel to the row direction of the light emitting elements 101, and is disposed between the two rows of the light emitting elements 101 and outside each row. The refrigerant pipe 152 is disposed in the vicinity of the light emitting element 101. Since both ends of the refrigerant pipe 152 are connected to the refrigerant circulation unit 151, the refrigerant supplied from the refrigerant circulation unit 151 flows through the pipe line and is then returned to the refrigerant circulation unit 151.

  The cooling device 150 cools the refrigerant pipe 152 by flowing the refrigerant in one direction through the refrigerant pipe 152 in the refrigerant circulation section 151. Thereby, the cooling device 150 can absorb the heat generated in the light emitting element 101 sandwiched between the refrigerant pipes 152 and can cool the light emitting element 101.

  As in this modification, the light emitting element 101 can be cooled by providing the cooling device 150 that cools the light emitting element 101. Further, the light emitting element 101 can be continuously cooled by using the cooling device 150 as a mechanism for circulating the refrigerant. In addition, the refrigerant pipe 152 is arranged so as to extend in the arrangement direction of the light emitting elements 101, and the single refrigerant pipe 152 is arranged so as to pass in the vicinity of the plurality of light emitting elements 101, whereby the structure of the cooling device 150 is configured. It can be simplified and cooling can be performed efficiently.

  By providing the cooling device 150 and cooling the light emitting element 101, it is possible to suppress the temperature change of the light emitting element 101, the change in the optical path of the light beam due to the temperature change, the change in the wavelength of the output light beam, and the light quantity Can be prevented from occurring. Thereby, it can suppress that the exposure light irradiated at the time of exposure changes, and can perform exposure with a higher precision. Note that when an LED, particularly a high-brightness LED, is used as the light-emitting element 101, the amount of heat generation increases, and thus the above effect can be more suitably obtained by providing the cooling device 150.

(Modification of lighting device)
Next, a modification of the lighting device will be described with reference to FIGS. FIG. 12 is a view showing the structure of the illumination device provided in the exposure apparatus according to the modification. FIG. 13 is a front view illustrating an example of a correction filter. FIG. 14 is a front view illustrating an example of a correction filter. FIG. 15 is a front view illustrating an example of a correction filter. Illumination device ILa shown in FIG. 12 includes correction filter 235, correction filter 236, illuminance unevenness adjustment mechanism 240, and telecentric adjustment mechanism 250 in addition to the configuration of illumination device IL described above.

  The correction filter 235 is disposed closer to the mask M than the relay lens 134 of the illumination optical system 22. That is, the light beam that has passed through the relay lens 134 of the illumination optical system 22 passes through the correction filter 235. The correction filter 235 is a filter that corrects illuminance unevenness that is symmetric with respect to the optical axis, and a pattern of a predetermined transmittance distribution is formed on a flat glass plate with a chromium film or the like. That is, the correction filter 235 forms a predetermined transmittance distribution pattern by changing the thickness and formation region of the chromium film formed in a flat glass plate shape according to the position.

  Here, FIG. 13 and FIG. 14 show an example of the correction filter 235. The correction filter 235A shown in FIG. 13 is a pattern in which the transmittance decreases in the short side direction of the shape of the illumination area IR from the center of the illumination area IR toward the periphery, that is, away from the center of the illumination area IR. The illuminator ILa can reduce the illuminance around the center of the illumination region IR by correcting the illuminance distribution of the light beam using the correction filter 235A.

  The correction filter 235B shown in FIG. 14 is a pattern in which the transmittance increases in the short side direction of the shape of the illumination region IR from the center of the illumination region IR toward the periphery, that is, as the distance from the center of the illumination region IR increases. The illuminator ILa can increase the illuminance around the center of the illumination region IR by correcting the illuminance distribution of the light beam using the correction filter 235B.

  The correction filter 236 is arranged on the mask M side of the relay lens 134 of the illumination optical system 22 in the same manner as the correction filter 235. That is, the light beam that has passed through the relay lens 134 of the illumination optical system 22 passes through the correction filter 236. In addition, the front-rear relationship of the positions of the arrangement of the correction filter 235 and the correction filter 236 on the optical path is not particularly limited. Further, the correction filters 235 and 236 may be disposed between the field stop 132 and the relay lens 133. The correction filter 236 is a filter that corrects uneven illuminance inclined with respect to the optical axis, and a pattern of a predetermined transmittance distribution is formed on a flat glass plate with a chromium film or the like. That is, the correction filter 236 also has a predetermined transmittance distribution pattern formed by changing the thickness and formation region of the chromium film formed in a flat glass plate shape according to the position.

  Here, FIG. 15 shows an example of the correction filter 236. The correction filter 236 shown in FIG. 15 has a pattern in which the transmittance decreases in the long side direction of the shape of the illumination region IR from one end of the illumination region to the other (in this embodiment, from right to left in the drawing). is there. The illumination device ILa can increase the illuminance gradually from one end of the illumination region IR toward the other end by correcting the illuminance distribution of the light beam using the correction filter 236.

  The illuminance unevenness adjustment mechanism 240 is a mechanism that adjusts the positions of the correction filters 235 and 236 and replaces the correction filters 235 and 236 to be arranged. The illuminance unevenness adjustment mechanism 240 can make the illuminance distribution in the illumination region IR more uniform by adjusting the correction filters 235 and 236. For example, the illuminance unevenness adjustment mechanism 240 adjusts (corrects) the illuminance distribution in the illumination region IR by adjusting the positions of the correction filters 235 and 236 in the Z direction, rotating or moving them in the XY plane. .

  Here, although the illumination device ILa of the present embodiment is provided with the illuminance unevenness adjustment mechanism 240 and the correction filters 235 and 236 can be adjusted, the correction filters 235 and 236 may be installed and fixed at the time of manufacture. In this case, it is only necessary to measure the illuminance distribution of the illumination region IR in a state where the correction filters 235 and 236 of the illumination device ILa are not installed, and to arrange the corresponding correction filters 235 and 236 based on the measurement result. The correction filter 235 may be a filter having one characteristic of the correction filters 235A and 235B based on the measurement result. The illumination device ILa may include only one of the correction filter 235 and the correction filter 236.

  The telecentric adjustment mechanism 250 is a mechanism that adjusts the telecentricity in the illumination area (illumination visual field) IR of the illumination device ILa. The telecentric adjustment mechanism 250 includes a support portion 252 and a drive portion 254 that moves the support portion 252. The support unit 252 supports the emission surfaces of the light guide fibers F1 and F2, the light collecting device 103, and the aperture stop 130. The support part 252 fixes the relative positions of the light emission fibers F1 and F2, the light collecting device 103, and the aperture stop 130. The drive unit 254 is a moving mechanism that moves the support unit 252 in the Z direction, that is, the direction of the arrow 256, the X direction, that is, the direction of the arrow 257, and the Y direction, that is, the direction of the arrow 259 parallel to the Y axis. .

  The telecentric adjustment mechanism 250 can change the position of the illumination optical system 22 relative to the condenser lens 131 by moving the support portion 252 in the directions indicated by arrows 256, 257, and 259 by the drive portion 254. Thereby, the direction of the light beam incident on the condenser lens 131 can be adjusted. For example, the telecentric adjustment mechanism 250 moves the support portion 252 in the direction of the arrow 256 (the optical axis direction) and moves each portion of the support portion 252 so that magnification telecentricity, that is, telecentricity that is symmetric with respect to the optical axis (telecentricity). City) can be adjusted. The telecentric adjustment mechanism 250 can adjust the inclined telecentricity, that is, uniform telecentricity within the field of view, by moving the support portion 252 in the direction of the arrow 258 or the arrow 259 (eccentric direction).

  The illumination device ILa can make the illuminance distribution in the illumination region IR more uniform by providing the correction filters 235 and 236 and the illuminance unevenness adjusting mechanism 240. Further, the illumination device ILa can improve the telecentricity of the exposure light by providing the telecentric adjustment mechanism 250.

(Exposure method)
Next, an exposure method according to this embodiment will be described. The exposure method according to the present embodiment irradiates the pattern formed on the mask M with a light beam, and the substrate via the projection optical systems PL1 to PL7 disposed between the mask M and the substrate stage 2 supporting the substrate P. This is an exposure method for irradiating and exposing P, and the above-described exposure apparatus EX is realized. First, the light branching device 102 of the exposure apparatus EX branches the light beams from a plurality of light emitting elements into a plurality of wavelengths for each wavelength and enters the light guiding fibers F1 and F2, and the light guiding fibers F1 and F2 regularly arranged. A branching / aggregating process for emitting the light beam branched from the exit surface is executed. Note that the exposure apparatus EX branches the light flux for each wavelength band.

  Next, the exposure apparatus EX diffracts the light beams that have passed through the respective light guide fibers F1, F2 and the like, and then passes them through the illumination optical system 22 so that the exposure light composed of the light beams is applied to the mask M. The irradiation process to irradiate is performed.

(Device manufacturing method)
FIG. 16 is a flowchart showing the procedure of the device manufacturing method according to the present embodiment. The device manufacturing method according to the present embodiment is used when manufacturing a device such as a semiconductor device. In the device manufacturing method according to the present embodiment, first, device function / performance design is performed (step S101). Next, a mask (reticle) based on the design is manufactured (step S102), and then a substrate that is a base material of the device is manufactured (step S103). Next, using the exposure method according to the above embodiment, the mask pattern is exposed to the substrate with exposure light to transfer the mask pattern to the substrate, and the exposed substrate (photosensitive agent) is developed and transferred. Then, a substrate processing (exposure processing) including a step of forming an exposure pattern layer (development of the developed photosensitive agent) corresponding to the pattern including the alignment mark and processing the substrate through the exposure pattern layer is performed. (Step S104). A device is manufactured by subjecting the processed substrate to a device assembly process (step S105) and an inspection (step S106) including processing processes such as a dicing process, a bonding process, and a packaging process.

  The illumination device IL of the exposure apparatus EX of the above embodiment splits the light beam into two light beams based on the wavelength band, but is not limited to this. The illuminating device IL may split the light beam into three light beams based on the wavelength band. The illumination device IL may determine the number of light beams to be branched based on the wavelength band of the light beam output from the light emitting element and the length of the wavelength band that can be preferably diffracted by the DOE.

  The illumination device IL of the exposure apparatus EX of the above embodiment can have various patterns for the arrangement pattern of the light guide fibers and the arrangement pattern of the DOE constituting the DOE unit. As described above, it is preferable to make the arrangement balance of the light in each wavelength band more uniform on the emission surface, but the light guide fiber and the DOE that emit light beams in the same wavelength region may be arranged adjacent to each other. .

  Further, in order to irradiate exposure light with high efficiency and high illuminance, the illumination device IL preferably uses a dichroic mirror to branch the light flux output from the light emitting element for each wavelength band, but is not limited thereto. Not. The illuminating device IL may branch the light beam output from the light emitting element into a plurality as it is.

  Although the projection system PS of the exposure apparatus EX of the above embodiment has been described as a case where projection is performed with a projection magnification of 1, the present invention is not limited to this. The exposure apparatus EX can set the projection magnification to an arbitrary magnification by changing the arrangement and focal position of the lenses constituting the optical system of the projection system PS. In the exposure apparatus EX, the projection magnification is less than 1, the line width of the pattern of the mask M is reduced by the projection magnification, and an image is formed on the substrate P, that is, the line width of the pattern of the mask M is connected to the substrate P. It is good also as a structure which becomes a magnitude | size several times (2 times, 3 times) of the line width of the pattern to be imaged. Further, the exposure apparatus EX is configured such that the projection magnification is larger than 1, the line width of the pattern of the mask M is enlarged by the projection magnification, and an image is formed on the substrate P, that is, the line width of the pattern of the mask M is the substrate. A configuration in which the size is one-fifth (1/2, 1/3) of the line width of the pattern formed by P may be employed.

  Regardless of the projection magnification, that is, the magnification of the optical system arranged between the mask M and the substrate P, the exposure apparatus EX uses the line width of the pattern of the mask M as a value obtained by multiplying the projection magnification by the target line width. A large value is preferable. Thereby, the exposure amount can be further reduced.

  As a substrate of the above-mentioned embodiment, not only a glass substrate for a display device, but also a semiconductor wafer for manufacturing a semiconductor device, a ceramic wafer for a thin film magnetic head, or a mask or a reticle used in an exposure apparatus (synthetic quartz, A silicon wafer) or the like can be applied.

  As the exposure apparatus EX, a step-and-scan type scanning exposure apparatus (scanning stepper) that synchronously moves the mask M and the substrate P and scans and exposes the substrate P with exposure light via the pattern of the mask M. In addition, the present invention may be applied to a step-and-repeat projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the mask M and the substrate P are stationary, and the substrate P is sequentially moved stepwise. it can. In addition, the exposure apparatus EX includes a plurality of projection optical systems, and the plurality of projection optical systems are configured to irradiate the exposure light onto the respective areas of the mask. However, the single projection optical system irradiates the entire area of the mask with the exposure light. It is good also as composition to do.

  In addition, the present embodiment is a twin stage type having a plurality of substrate stages as described in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to an exposure apparatus.

  In addition, the present embodiment includes a substrate stage for holding a substrate as disclosed in US Pat. No. 6,897,963, European Patent Application No. 1713113, and the like, and a reference mark without holding the substrate. The present invention can also be applied to an exposure apparatus provided with a reference member on which a slab is formed and / or a measurement stage on which various photoelectric sensors are mounted. An exposure apparatus including a plurality of substrate stages and measurement stages can be employed.

  Further, the type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a liquid crystal display element or a display, but an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on a substrate P, a thin film magnetic head, an imaging element ( CCDs), micromachines, MEMS, DNA chips, reticles, masks and the like can be widely applied to exposure apparatuses.

  In the above embodiment, the position information of each stage is measured using an interferometer system including a laser interferometer. However, the present invention is not limited to this. For example, a scale (diffraction grating) provided in each stage is detected. An encoder system may be used.

  In the above embodiment, a light transmissive mask in which a predetermined light shielding pattern (or phase pattern / dimming pattern) is formed on a light transmissive substrate is used. As described in US Pat. No. 6,778,257, a variable shaping mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

  Further, the exposure apparatus EX of the above embodiment assembles various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured. In order to ensure these various accuracies, before and after the assembly of the exposure apparatus EX, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, The electrical system is adjusted to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection between the various subsystems, wiring connection of the electric circuit, pipe connection of the atmospheric pressure circuit, and the like. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus EX is preferably manufactured in a clean room in which temperature, cleanliness, etc. are controlled.

  In addition, the constituent elements of the above embodiment can be combined as appropriate. Some components may not be used. In addition, as long as it is permitted by law, all the publications related to the exposure apparatus and the like cited in the above embodiment and the descriptions of US patents are incorporated as a part of the description of this specification. As described above, all other embodiments and operation techniques made by those skilled in the art based on the above-described embodiments are all included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Mask stage 2 Substrate stage 5 Control apparatus 6 Interferometer system 7 1st detection system 8 2nd detection system 9 Alignment system 10 Base plate 15 Mask holding part 16 Substrate holding part 20 Light source 21 Optical branching / aggregation system 22 Illumination optical system 101, 101A, 101B, 101C, 101D Light emitting element 102, 102A, 102B, 102C, 102D Optical branching device 103 Light collecting device 111 Condensing lens 112 Dichroic mirror 121 Collimator lens unit 122 Diffractive optical element unit (DOE unit)
123 Substrate 124A, 124B Diffractive optical element 130 Aperture stop (σ stop)
131 Condenser lens 132 Field stop 133, 134 Relay lens 150 Cooling device 151 Refrigerant circulation part 152 Refrigerant piping 235, 235A, 235B, 236 Correction filter EL Exposure light EX Exposure devices F1-F42 Light guide fiber FG Light guide fiber group IL Illumination device IL1 to IL7 First to seventh illumination devices IR1 to IR7 Illumination area IS Illumination system M Mask P Substrate PL1 to PL7 Projection optical system PS Projection system

Claims (15)

An illumination device that irradiates a field area of an irradiated surface with light beams output from a plurality of light emitting elements,
A light branching / aggregation system for branching a light flux output from the light emitting element into a plurality of beams, guiding the branched light fluxes, collecting the branched light fluxes and outputting the light fluxes;
An illumination optical system that guides the light beam output from the light branching / aggregation system and irradiates the field area of the irradiated surface, and
The optical branching / aggregating system includes an optical branching device that splits a light beam output from the light emitting element into a plurality of parts,
A light guide fiber group in which a light guide fiber that guides a light beam branched by the light branching device is provided for each branched light beam, and a plurality of light guide fiber emission surfaces are disposed adjacent to each other,
From a collimator lens unit in which a collimator lens that collimates the light beam output from the exit surface of the light guide fiber is disposed corresponding to the light beam output from the exit surface of the light guide fiber, and from the collimator lens unit And a light collecting device including a diffractive optical element unit that includes a diffractive optical element that diffracts and outputs the emitted light beam for each light beam emitted from the collimator lens. The optical branching device has a dichroic mirror that divides a light beam output from the light emitting element into a plurality of parts in a wavelength region,
The diffractive optical element unit has the same number of types as the number of the diffractive optical element divided by the optical branching device, and the arrangement pattern matches the arrangement pattern of the wavelength of the light beam emitted from the light guide fiber. 2. The illumination device according to claim 1, wherein a diffractive optical element is disposed.   The illumination device according to claim 2, wherein the light guide fiber group includes adjacent light guide fibers that guide light beams having different wavelengths.   4. The illumination optical system includes a correction filter having a transmittance distribution in which the transmittance increases or decreases according to the distance from the center in the short side direction of the illumination area. The lighting device according to one item.   5. The illumination optical system includes a correction filter having a transmittance distribution in which the transmittance increases or decreases from one to the other in the long side direction of the illumination area. The lighting device according to item.   The illumination device according to claim 4, further comprising an illuminance unevenness adjustment mechanism that adjusts a position of the correction filter based on an illuminance distribution of the illumination area.   The telecentric adjustment mechanism which adjusts the position of the output surface of the said light guide fiber group and the position of an optical branching apparatus based on the telecentricity of the said illumination area is further provided, The one of Claim 1 to 6 characterized by the above-mentioned. The lighting device according to item.   The lighting device according to claim 1, wherein the light branching device includes a condensing lens that expands a light beam output from the light emitting element and makes the light incident on the light guide fiber. . The illumination device according to any one of claims 1 to 8,
An illumination system comprising: a plurality of the light emitting elements; and a light source that outputs the light flux from the light emitting elements to the illumination device.   The illumination system according to claim 9, wherein the light emitting element is a light emitting diode.   The cooling device having a refrigerant pipe extending in an arrangement direction of the light emitting elements and having a refrigerant pipe arranged in the vicinity of the light emitting elements and a refrigerant circulation portion for circulating the refrigerant in the refrigerant pipe. Or the illumination system of 10. The illumination device according to any one of claims 1 to 8,
A mask stage that supports a mask irradiated with light emitted from the illumination device;
A plate stage for supporting a plate on which a pattern having the same shape as the pattern formed on the mask is exposed;
An exposure apparatus comprising: In an exposure method of irradiating a pattern formed on a mask with a light beam and irradiating the substrate via a projection optical system disposed between the mask and a substrate stage that supports the substrate, and exposing the substrate,
A branching / aggregating step of splitting a light beam from a plurality of light emitting elements into a plurality of wavelengths for each wavelength and entering the light guide fiber, and emitting the light beam branched from the output surface of the light guide fiber regularly arranged;
An irradiating step of irradiating the mask with the luminous flux by diffracting the luminous flux emitted from each of the light guide fibers and then passing through an illumination optical system;
An exposure method comprising:   The exposure method according to claim 13, wherein the substrate has an outer diameter larger than 500 mm. Exposing the substrate using the exposure method according to claim 13 or 14,
Developing the exposed substrate to form an exposed pattern layer corresponding to the transferred pattern;
Processing a plurality of the substrates through the exposure pattern layer;
A device manufacturing method comprising:

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