JP2013187284A - Transporting device and ceramic member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transporting device with an improved transporting performance.SOLUTION: A transporting device 10 is provided with a ceramic member 200. In the ceramic member 200, attraction electrodes 372, 374, 376, 378 are formed on a ceramic layer 296, and a gas communication path 630 is formed on a ceramic layer 294. A gas emission hole 650 is formed on an opposite face 233 positioned nearer a bottom face 216 than an opposite face 234.

Description

  The present invention relates to a transport device, and more particularly to a ceramic member that holds a body to be transported in the transport device.

  The ceramic member that holds the body to be transported in the transport apparatus is also called a pick, and is formed by integrally firing a plurality of ceramic layers (see, for example, Patent Documents 1 and 2), or a body to be transported that is a dielectric ( For example, a wafer is known that can be attracted by an electrostatic force (see, for example, Patent Document 3). Furthermore, in order to adjust the temperature of a to-be-conveyed body, what has arrange | positioned several protrusion parts on the surface and provided the electric heating body inside is also proposed (for example, refer patent document 4).

JP-A-4-37047 JP 2009-202240 A JP 2011-77288 A JP 2000-114343 A

  Conventionally, sufficient studies have not been made to adjust the temperature of the conveyed object in a ceramic member obtained by integrally firing a plurality of ceramic layers. For example, if there is a temperature difference between the transport source and the transport destination, it takes time to adjust the temperature of the transport target in accordance with the transport destination in order to prevent damage to the transport target and the ceramic member due to thermal shock. There was a problem that would be. Also, in the negative pressure (vacuum) environment, the gas that fills the gap due to surface roughness and surface waviness also decreases at the contact surface between the ceramic member and the transported body, compared with the normal pressure environment. Since the transmission rate is reduced, there is a problem that the temperature of the conveyed object cannot be sufficiently adjusted.

  In view of the above-described problems, an object of the present invention is to provide a transport apparatus with improved transport performance.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1] The ceramic member in Application Example 1 is an electrode configured by integrally firing a plurality of insulating ceramic layers and configured to be movable together with the transported body in a state where a dielectric is adsorbed by an electrostatic force. A ceramic member that is provided with a suction electrode inside and configured to be able to hold a transported body in a transporting device, and is a surface along the layer surface direction of the plurality of ceramic layers and holding the transported body A first facing surface and a second facing surface that are surfaces facing the transported body, wherein the second facing surface is located closer to the transported body than the first facing surface; The adsorption electrode is formed on a first ceramic layer among a plurality of ceramic layers, and is at least one of a gas that cools the transported body and a gas that transfers heat of the ceramic member to the transported body processing A gas supply port for receiving the supply of gas from the outside of the ceramic member, and among the plurality of ceramic layers, the second ceramic layer separated from the first ceramic layer from the first facing surface, A hole that forms a gas communication path that communicates with a gas supply port, and is configured to be able to discharge the processing gas from the gas communication path to at least one of the first facing surface and the second facing surface. A first gas discharge hole is formed. According to this application example, the temperature of the transferred object is effectively adjusted by releasing the processing gas from at least one of the first facing surface and the second facing surface while realizing an adsorption function by electrostatic force. be able to. As a result, the time required for adjusting the temperature of the transported body can be shortened, and as a result, the transport performance of the transport device can be improved.

Application Example 2 The ceramic member according to Application Example 1 has an end surface that is a surface along a direction intersecting the layer surface direction and connected to at least one of the first facing surface and the second facing surface. In addition, a second gas discharge hole, which is a hole configured to be able to discharge the processing gas through the gas communication path, may be formed in the end face. According to this application example, the temperature of the transported body can be more effectively adjusted by discharging the processing gas from the end face in addition to at least one of the first facing surface and the second facing surface.

[Application Example 3] In the ceramic member according to Application Example 2, the second gas discharge hole extends in a direction along an outer periphery of an opposing surface connected to the end surface of the first opposing surface and the second opposing surface. You may penetrate the said end surface toward. According to this application example, the temperature of the transported body can be more effectively adjusted by releasing the processing gas along the outer periphery of the transported body.

[Application Example 4] In the ceramic member of Application Example 2 or Application Example 3, the ceramic member has a base end portion which is an end attached to the transfer device, and the second gas discharge hole is formed on the first facing surface. And it is good also as arrange | positioning to the said base end part side rather than the said 2nd opposing surface. According to this application example, it is possible to more effectively adjust the temperature of the portion of the transported body located on the base end side.

Application Example 5 A ceramic member according to Application Example 2 to Application Example 4, wherein the first opposing surface and the second opposing surface are disposed between the ceramic member and the side attached to the conveying device. And the second gas discharge hole may be disposed closer to the tip than the first facing surface and the second facing surface. According to this application example, it is possible to more effectively adjust the temperature for the portion of the transported body located on the tip side.

[Application Example 6] The ceramic member according to any one of Application Examples 2 to 5, wherein the ceramic member has an outer peripheral portion that forms an outer periphery of the ceramic member, and the second gas discharge hole is disposed in the outer peripheral portion. It is also good. According to this application example, it is possible to more effectively adjust the temperature of the portion of the transported body located in the vicinity of the outer peripheral portion.

[Application Example 7] A transport apparatus according to Application Example 7 is characterized in that the transported body is transported using the ceramic member according to any one of Application Examples 1 to 6. According to this application example, it is possible to shorten the time required for adjusting the temperature of the object to be transported in the ceramic member, and as a result, it is possible to improve the transport performance of the transport device.

  The form of this invention is not restricted to the form of a ceramic member and a conveying apparatus, For example, it is also possible to apply to various forms, such as a pick, a semiconductor manufacturing apparatus, a conveying method, and the manufacturing method of a ceramic member. Further, the present invention is not limited to the above-described embodiments, and it is needless to say that the present invention can be implemented in various forms without departing from the spirit of the present invention.

It is explanatory drawing which shows the structure of a conveying apparatus. It is explanatory drawing which shows the upper surface of a ceramic member. It is explanatory drawing which shows the side surface of the ceramic member seen from the arrow F3 in FIG. It is explanatory drawing which shows the cross section of the ceramic member seen from arrow F4-F4 in FIG. It is explanatory drawing which shows the ceramic layer seen from the position corresponding to arrow F5-F5 of FIG. It is explanatory drawing which shows the ceramic layer seen from the position corresponding to arrow F6-F6 of FIG. It is explanatory drawing which shows the cross section of the ceramic member seen from the position corresponding to arrow F7-F7 of FIG. It is explanatory drawing which shows the ceramic layer seen from the position corresponding to arrow F8-F8 of FIG. It is explanatory drawing which shows the ceramic layer seen from the position corresponding to arrow F9-F9 of FIG. It is explanatory drawing which shows the ceramic layer seen from the position corresponding to arrow F10-F10 of FIG. It is explanatory drawing which shows the cross section of the ceramic member seen from the position corresponding to arrow F11-F11 of FIG. It is explanatory drawing which shows the upper surface of the ceramic member in 2nd Embodiment. It is explanatory drawing which shows the partial cross section of the ceramic member in 2nd Embodiment. It is explanatory drawing which shows the upper surface of the ceramic member in 3rd Embodiment. It is explanatory drawing which shows the partial cross section of the ceramic member in 3rd Embodiment. It is explanatory drawing which shows the cross section of the ceramic member in 4th Embodiment. It is explanatory drawing which shows the upper surface of the ceramic member in 5th Embodiment. It is explanatory drawing which shows the cross section of the ceramic member seen from arrow F16-F16 in FIG. It is explanatory drawing which shows the manufacturing process of a ceramic member.

A. First embodiment:
FIG. 1 is an explanatory diagram showing the configuration of the transport apparatus 10. The transport apparatus 10 transports the transported body 90. In this embodiment, the transfer apparatus 10 is an apparatus that constitutes a part of a semiconductor manufacturing apparatus, and the transferred object 90 is a silicon wafer that is a disk-shaped dielectric.

  The transfer device 10 includes a control unit 100, a ceramic member 200, an arm mechanism 710, a moving mechanism 720, an adsorption electrode driving unit 830, a negative pressure supply unit 840, an electric heating element driving unit 850, and a processing gas supply unit. 860.

  The control unit 100 of the transport apparatus 10 controls the operations of the arm mechanism 710, the moving mechanism 720, the adsorption electrode driving unit 830, the negative pressure supply unit 840, the electric heating element driving unit 850, and the processing gas supply unit 860. In the present embodiment, the function of the control unit 100 is realized by a CPU (Central Processing Unit) operating based on a computer program. In another embodiment, the function of the control unit 100 may be realized by an ASIC (Application Specific Integrated Circuit) operating based on the circuit configuration.

  The arm mechanism 710 of the transport device 10 is a mechanism that connects the ceramic member 200 and the moving mechanism 720, moves the ceramic member 200 relative to the moving mechanism 720, and is transported to the outside of the transport device 10. Deliver the body 90. The moving mechanism 720 of the transfer device 10 is a mechanism that is mounted with the ceramic member 200 and the arm mechanism 710 and is relatively movable with respect to the outside of the transfer device 10, and is to be transferred held by the ceramic member 200. The body 90 is moved.

  The ceramic member 200 of the transport apparatus 10 is also called a pick, and is configured to be movable together with the transported body 90 while holding the transported body 90 in the transport apparatus 10. The ceramic member 200 is formed by integrally firing a plurality of ceramic layers using an insulating ceramic material. Inside the ceramic member 200, a conductor pattern using a conductive material is formed.

In this embodiment, the main component of the insulating ceramic material used for the ceramic member 200 is aluminum oxide (alumina) (Al ₂ O ₃ ). In another embodiment, the main component of the insulating ceramic material is yttria oxide (Y ₂ O ₃ ), silicon oxide (SiO ₂ ), zirconium oxide (ZrO ₂ ), magnesium oxide (MgO), mullite (3Al ₂ O _3). 2SiO ₂ ) or glass ceramic (for example, a mixture of alumina and borosilicate glass).

  In the present embodiment, the main component of the conductive material used for the ceramic member 200 is tungsten (W). In another embodiment, the main component of the conductive material may be molybdenum (Mo), tantalum (Ta), silver (Ag), or copper (Cu), an alloy of these conductive metals, conductive Silicon carbide (SiC) may be used.

  In the present embodiment, the ceramic member 200 is configured to be capable of attracting the transported body 90 that is a dielectric by electrostatic force by receiving power supply from the attracting electrode driving unit 830. Details of the configuration for electrostatic adsorption in the ceramic member 200 will be described later.

  In the present embodiment, the ceramic member 200 is configured to be capable of adsorbing the transport target 90 with negative pressure by receiving supply of negative pressure (vacuum) from the negative pressure supply unit 840. Details of the configuration for negative pressure adsorption in the ceramic member 200 will be described later.

  In the present embodiment, the ceramic member 200 is configured to be able to generate heat by receiving power supply from the electric heating element driving unit 850. Details of the structure for generating heat in the ceramic member 200 will be described later.

  In the present embodiment, the ceramic member 200 is configured to be able to release the processing gas to the transported body 90 by receiving the processing gas supplied from the processing gas supply unit 860. In the present embodiment, the processing gas supplied to the ceramic member 200 by the processing gas supply unit 860 is a heat transfer gas (for example, helium (He)) for transferring the heat of the ceramic member 200 to the transported body 90. is there. Details of the configuration for releasing the processing gas in the ceramic member 200 will be described later.

  FIG. 2 is an explanatory view showing the upper surface of the ceramic member 200. FIG. 3 is an explanatory view showing a side surface of the ceramic member 200 as viewed from the direction of the arrow F3 in FIG. FIG. 4 is an explanatory view showing a cross section of the ceramic member 200 as viewed from the direction of arrows F4-F4 in FIG. FIG. 2 shows XYZ axes orthogonal to each other. The XYZ axes in FIG. 2 correspond to the XYZ axes in other figures including FIG. 3 and FIG.

  As shown in FIGS. 2 and 3, in the present embodiment, the ceramic member 200 has a substantially U-shaped plate shape. In the usage state of the ceramic member 200 in the conveying apparatus 10, the axis along the horizontal direction of the U-shape in the ceramic member 200 is the X-axis, the axis along the vertical direction of the U-shape is the Y-axis, and the axis along the gravity direction Is the Z axis. The + X axis direction from the right side to the left side of the U-shape of the ceramic member 200 is set as the -X axis direction. The + Y-axis direction from the closed end of the U-shape of the ceramic member 200 toward the open end is set as the -Y-axis direction. The + Z-axis direction from the lower side to the upper side in the direction of gravity is defined as the + Z-axis direction, and the opposite is the −Z-axis direction. In the present embodiment, the conveyed object 90 is held on a surface of the ceramic member 200 parallel to the X axis and the Y axis. The thickness direction of the ceramic member 200 corresponds to the Z-axis direction.

  As shown in FIG. 4, the ceramic member 200 includes seven ceramic layers 291, 292, 293, 294, 295, 296, and 297 as a plurality of ceramic layers. These ceramic layers are laminated in this order from the bottom surface 216 side: ceramic layer 291, ceramic layer 292, ceramic layer 293, ceramic layer 294, ceramic layer 295, ceramic layer 296, and ceramic layer 297. The layer surface direction of these ceramic layers is a direction along a plane parallel to the X axis and the Y axis. The number of ceramic layers in the ceramic member 200 is not limited to seven. In other embodiments, the number may be six or less, or may be eight or more.

  The ceramic member 200 includes a base end surface 211, base end side surfaces 213 and 214, a base end top surface 215, a bottom surface 216, a through hole 218, a base end stepped surface 219, front end surfaces 222 and 223, and an outer surface 224. , 225, inner side surfaces 221, 226, 227, opposing surfaces 231, 232, 233, 234, 235, tip upper surfaces 242, 243, and tip step surfaces 248, 249.

  The base end surface 211 of the ceramic member 200 is a surface parallel to the X axis and the Z axis and facing the −Y axis direction. The base end surface 211 is located at the end in the −Y axis direction of the ceramic member 200 and constitutes a base end portion that is an end on the side attached to the transport device 10. The base end surface 211 is connected to the base end side surfaces 213 and 214, the base end top surface 215, and the bottom surface 216.

  The base end side surface 213 of the ceramic member 200 is a surface parallel to the Z axis facing the −X axis direction and the −Y axis direction, and is formed between the base end surface 211 and the outer surface 224. The base end side surface 214 of the ceramic member 200 is a surface parallel to the Z axis that faces the + X axis direction and the −Y axis direction, and is formed between the base end surface 211 and the outer surface 225.

  The base end upper surface 215 of the ceramic member 200 is a surface parallel to the X axis and the Y axis and facing the + Z axis direction. The proximal end upper surface 215 is connected to the proximal end surface 211 and the proximal end side surfaces 213 and 214. As shown in FIG. 3, the base end upper surface 215 is provided on the + Z-axis direction side of the opposing surfaces 231 and 232. A proximal step surface 219 is formed between the proximal upper surface 215 and the opposing surface 231. In the present embodiment, as shown in FIG. 2, the + Y-axis direction side of the base end upper surface 215, the base end step surface 219, and the −Y-axis direction side of the facing surface 231 are circular along the outer shape of the conveyed object 90. It is formed in an arc shape.

  The bottom surface 216 of the ceramic member 200 is a surface parallel to the X axis and the Y axis and facing the −Z axis direction. The bottom surface 216 is a substantially U-shaped surface that is the same as the overall shape of the ceramic member 200, and includes a base end surface 211, base end side surfaces 213 and 214, front end surfaces 222 and 223, outer side surfaces 224 and 225, and inner side surfaces 221 and 226, It connects to each surface of 227.

  The through hole 218 of the ceramic member 200 penetrates between the base end upper surface 215 and the bottom surface 216 along the Z axis. In the present embodiment, the ceramic member 200 is attached to the arm mechanism 710 using the through hole 218. In the present embodiment, the number of through-holes 218 is two, but in other embodiments, it may be three or more.

  The tip surfaces 222 and 223 of the ceramic member 200 are arcuate surfaces that are parallel to the Z axis and convex in the + Y axis direction. The front end surfaces 222 and 223 are positioned at the end of the ceramic member 200 in the + Y-axis direction, and constitute a front end portion in which opposed surfaces 231, 232, 234, 234, and 235 are disposed between the front end surfaces 211. The front end surface 222 is located on the −X axis direction side, and the front end surface 223 is located on the + X axis direction side. The front end surface 222 is connected to the bottom surface 216, the outer side surface 224, the inner side surface 226, the facing surface 231, and the front end upper surface 242. The tip surface 223 is connected to the bottom surface 216, the outer surface 225, the inner surface 227, the facing surface 231, and the tip upper surface 243.

  The outer surface 224 of the ceramic member 200 is a surface that is parallel to the Y axis and the Z axis and faces the −X axis direction, and is formed between the distal end surface 222 and the proximal end side surface 213. The outer surface 225 of the ceramic member 200 is a surface parallel to the Y axis and the Z axis and facing the + X axis direction, and is formed between the distal end surface 223 and the proximal end side surface 214. The outer side surfaces 224 and 225 are outer peripheral portions that form the outer periphery of the ceramic member 200.

  The inner surface 221 of the ceramic member 200 is a circular arc surface that is parallel to the Z axis and concave in the + Y axis direction, and is formed between the inner surface 226 and the inner surface 227. The inner surface 226 of the ceramic member 200 is a surface parallel to the Y axis and the Z axis and facing the + X axis direction, and is formed between the tip surface 222 and the inner surface 221. The inner surface 227 of the ceramic member 200 is a surface that is parallel to the Y axis and the Z axis and faces the −X axis direction, and is formed between the tip surface 223 and the inner surface 221. The inner side surfaces 221, 226, and 227 are outer peripheral portions that form the outer periphery of the ceramic member 200.

  The facing surfaces 231, 232, 233, 234, and 235 of the ceramic member 200 are surfaces that are parallel to the X-axis and the Y-axis and face the + Z-axis direction. The facing surfaces 231, 232, 233, 234, and 235 face the transported body 90 in a state where the transported body 90 is held on the ceramic member 200. In FIG. 2, the opposing surfaces 232 and 234 are hatched to facilitate understanding of the drawing.

  The facing surfaces 231, 233, and 235 are first facing surfaces located on the bottom 216 side of the facing surfaces 232 and 234, that is, on the −Z-axis direction side of the facing surfaces 232 and 234. The facing surfaces 232 and 233 are second facing surfaces located on the transported object 90 side with respect to the facing surfaces 231, 233 and 235, that is, on the + Z-axis direction side with respect to the facing surfaces 231, 233 and 234. In this embodiment, the opposing surfaces 231, 232, 233, 234, and 235 are formed by cutting the ceramic layer 297 after the ceramic member 200 is integrally fired.

  In the present embodiment, as shown in FIG. 2, the facing surface 235 is a substantially U-shaped plane as viewed from the Z-axis direction. The facing surface 234 is a plane that is located in the + Z-axis direction relative to the facing surface 235 and surrounds the outer periphery of the facing surface 235 when viewed from the Z-axis direction. The facing surface 233 is a plane that is positioned in the −Z-axis direction relative to the facing surface 234 and surrounds the outer periphery of the facing surface 234 when viewed from the Z-axis direction. The facing surface 232 is a plane that is located in the + Z-axis direction relative to the facing surface 233 and surrounds the outer periphery of the facing surface 233 when viewed from the Z-axis direction. The facing surface 231 is a plane that is located in the −Z-axis direction with respect to the facing surface 232 and surrounds the outer periphery of the facing surface 232 when viewed from the Z-axis direction. In the present embodiment, as shown in FIG. 4, the positions of the opposing surfaces 231, 233 and 235 in the Z-axis direction are the same, and the positions of the opposing surfaces 232 and 234 in the Z-axis direction are the same.

  The top end surfaces 242 and 243 of the ceramic member 200 are surfaces parallel to the X axis and the Y axis and facing the + Z axis direction. The tip top surface 242 is connected to the tip surface 222, and the tip top surface 243 is connected to the tip surface 223. As shown in FIG. 3, the tip upper surfaces 242 and 243 are provided on the + Z-axis direction side of the opposing surfaces 231 and 232. A tip step surface 248 is formed between the tip top surface 242 and the facing surface 231, and a tip step surface 249 is formed between the tip top surface 243 and the facing surface 231. In the present embodiment, as shown in FIG. 2, the −Y-axis direction side of the tip upper surfaces 242 and 243, the tip step surfaces 248 and 249, and the + Y-axis direction side of the facing surface 231 are along the outer shape of the transported body 90. It is formed in a circular arc shape.

  As shown in FIG. 2 and FIG. 4, the opposing surface 235 of the ceramic member 200 is formed with an adsorption hole 450 that is a hole configured to adsorb the conveyed object 90 by providing a negative pressure to the opposing surface 235. ing. In this embodiment, before the ceramic member 200 is integrally fired, the suction holes 450 are formed by cutting the ceramic layers 295, 296, and 297. In the present embodiment, the number of the suction holes 450 is 6, but in other embodiments, the number may be 5 or less, or 7 or more.

  As shown in FIGS. 2 and 4, a gas discharge hole 650, which is a hole configured to be able to discharge a processing gas, is formed on the facing surface 233 of the ceramic member 200. In this embodiment, before the ceramic member 200 is integrally fired, the gas release holes 650 are formed by cutting the ceramic layers 295, 296, and 297. In the present embodiment, the number of gas discharge holes 650 is 12, but in other embodiments, it may be 11 or less, or 13 or more.

  As shown in FIGS. 2 and 3, the ceramic member 200 includes power supply ports 312 and 316, a negative pressure supply port 412, power supply ports 512 and 516, and a gas supply port 612.

  The power supply ports 312 and 316 of the ceramic member 200 respectively receive the supply of electric power with potentials whose polarities are reversed from each other from the adsorption electrode driving unit 830. In the present embodiment, the power supply ports 312 and 316 are formed by brazing cylindrical conductive metal terminals protruding in the + Z-axis direction from the base end upper surface 215, and are cables connected to the suction electrode driving unit 830. These terminals (not shown) can be fixed.

  The negative pressure supply port 412 of the ceramic member 200 receives supply of negative pressure from the negative pressure supply unit 840. In the present embodiment, the negative pressure supply port 412 is formed by brazing a cylindrical conductive metal terminal protruding in the + Z-axis direction from the base end upper surface 215, and is a tube connected to the negative pressure supply unit 840. It is comprised so that fixing | fixing the edge part (not shown) of this is possible.

  The power supply ports 512 and 516 of the ceramic member 200 receive supply of electric power from the electric heating element driving unit 850, one corresponding to the positive electrode and the other corresponding to the negative electrode. In the present embodiment, the power supply ports 512 and 516 are formed by brazing a cylindrical conductive metal terminal protruding in the + Z-axis direction from the base end upper surface 215, and a cable connected to the electric heater driving unit 850. These terminals (not shown) can be fixed.

  The gas supply port 612 of the ceramic member 200 receives supply of processing gas from the processing gas supply unit 860. In this embodiment, the gas supply port 612 is formed by brazing a cylindrical conductive metal terminal protruding in the + Z-axis direction from the base end upper surface 215, and is a tube connected to the process gas supply unit 860. An end (not shown) is configured to be fixable.

  As shown in FIG. 4, adsorption electrodes 372, 374, 376 and 378 which are conductor patterns are formed between the ceramic layer 296 and the ceramic layer 297. In this embodiment, before laminating the ceramic layer 297 on the ceramic layer 296, the adsorption electrodes 372, 374, 376, and 378 are formed by screen-printing a conductive paste containing a conductive material on the ceramic layer 296. . In the present embodiment, the adsorption electrodes 372 and 374 are first electrodes configured to have a different polarity potential from the adsorption electrodes 376 and 378, and the adsorption electrodes 376 and 378 are different from the adsorption electrodes 372 and 374. It is the 2nd electrode comprised so that it might become a potential of polarity.

  FIG. 5 is an explanatory diagram showing the ceramic layer 296 viewed from a position corresponding to the arrow F5-F5 in FIG. FIG. 5 illustrates a ceramic layer 296 in which adsorption electrodes 372, 374, 376, and 378 are formed. In FIG. 5, the adsorption electrodes 372, 374, 376, and 378 are hatched for easy understanding of the drawing. As shown in FIG. 5, the adsorption electrodes 372, 374, 376, and 378 are formed so as to avoid the adsorption holes 450 and the gas discharge holes 650.

  As shown in FIGS. 2, 4, and 5, the adsorption electrode 372 overlaps along the outer side of the opposed surface 232 when viewed from the Z-axis direction, and the adsorption electrode 376 is opposed to the opposed surface when viewed from the Z-axis direction. It overlaps along the inner side of 232. Each of the adsorption electrode 372 and the adsorption electrode 376 is disposed so as to overlap with the opposing surface 232 substantially evenly when viewed from the Z-axis direction.

  As shown in FIGS. 2, 4, and 5, the adsorption electrode 374 overlaps along the outer side of the opposed surface 234 when viewed from the Z-axis direction, and the adsorption electrode 378 is opposed to the opposed surface when viewed from the Z-axis direction. Overlapping along the inner side of 234. Each of the adsorption electrode 374 and the adsorption electrode 378 is disposed so as to substantially overlap the opposing surface 234 when viewed from the Z-axis direction.

  FIG. 6 is an explanatory view showing the ceramic layer 295 viewed from the position corresponding to the arrow F6-F6 in FIG. FIG. 7 is an explanatory view showing a cross section of the ceramic member 200 viewed from a position corresponding to the arrow F7-F7 in FIG. As shown in FIGS. 6 and 7, lands 332 and 336 that are conductor patterns are formed between the ceramic layer 295 and the ceramic layer 296. In FIG. 6, lands 332 and 336 are hatched for easy understanding of the drawing. In FIG. 6, the power supply ports 312 and 316 are indicated by alternate long and short dash lines at positions projected onto the ceramic layer 295 along the Z-axis direction. In FIG. 5, the lands 332 and 336 are indicated by broken lines.

  In this embodiment, before the ceramic layer 296 is stacked on the ceramic layer 295, the lands 332 and 336 are formed by screen-printing a conductive paste containing a conductive material on the ceramic layer 295.

  The land 332 is a conductor configured to receive power through the power supply port 312. In the present embodiment, the land 332 is configured to be able to receive power through the power supply port 312 by being exposed to the inside of the cylindrical power supply port 312.

  The land 336 is a conductor configured to be able to receive power through the power supply port 316. In the present embodiment, the land 336 is configured to be able to receive power through the power supply port 316 by being exposed to the inside of the cylindrical power supply port 316.

  As shown in FIG. 7, vias 352 and 354 are formed in the ceramic layer 296, and similarly, vias 356 and 358 are formed in the ceramic layer 296. In FIG. 5, the vias 352, 354, 356, and 358 are shown by broken lines. In FIG. 6, the vias 352, 354, 356, and 358 are illustrated by alternate long and short dash lines at positions projected onto the ceramic layer 295 along the Z-axis direction.

  In this embodiment, before the adsorption electrodes 372, 374, 376, and 378 are formed in the ceramic layer 296, a through hole is formed in the ceramic layer 292, and a conductive paste containing a conductive material is filled in the through hole. As a result, vias 352, 354, 356, and 358 are formed.

  The via 352 is a conductor that penetrates the ceramic layer 296 and electrically connects the land 332 and the adsorption electrode 372. The via 354 is a conductor that penetrates the ceramic layer 296 and electrically connects the land 332 and the adsorption electrode 374.

  The via 356 is a conductor that penetrates the ceramic layer 296 and electrically connects the land 336 and the adsorption electrode 376. The via 358 is a conductor that penetrates the ceramic layer 296 and electrically connects the land 336 and the adsorption electrode 378.

  As shown in FIG. 4, a negative pressure communication path 430 and a gas communication path 630 are formed in the ceramic layer 294. The negative pressure communication path 430 is a flow path that communicates between the negative pressure supply port 412 and the suction hole 450. The gas communication path 630 is a flow path that communicates between the gas supply port 612 and the gas discharge hole 650. In this embodiment, before laminating the ceramic layer 295 on the ceramic layer 294, the negative pressure communication path 430 and the gas communication path 630 are formed by cutting the ceramic layer 294.

  FIG. 8 is an explanatory view showing the ceramic layer 294 viewed from a position corresponding to the arrow F8-F8 in FIG. In FIG. 8, each of the negative pressure supply port 412, the suction hole 450, the gas supply port 612, and the gas discharge hole 650 is illustrated by a one-dot chain line at a position projected on the ceramic layer 294 along the Z-axis direction.

  In the present embodiment, the negative pressure communication path 430 advances from the position corresponding to the negative pressure supply port 412 to the inner surface 221, and then branches into two toward the front end surface 222 and the front end surface 223, and six adsorptions It passes through a position corresponding to the hole 450. In the present embodiment, the gas communication path 630 branches into two from the position corresponding to the gas supply port 612 toward the front end surface 222 and the front end surface 223, and then on the other hand, the outer side surface 224, the front end surface 222, and the inner side surface 226. And passes through positions corresponding to the six gas discharge holes 650 along the order of the outer surface 225, the front end surface 223, and the inner surface 227.

  As shown in FIG. 4, electric heating elements 572, 574, and 576 that are conductor patterns are formed between the ceramic layer 291 and the ceramic layer 292. In this embodiment, before the ceramic layer 292 is laminated on the ceramic layer 291, the electric heaters 572, 574, and 576 are formed by screen printing a conductive paste containing a conductive material on the ceramic layer 291.

  FIG. 9 is an explanatory diagram showing the ceramic layer 292 viewed from a position corresponding to the arrow F9-F9 in FIG. FIG. 10 is an explanatory diagram showing the ceramic layer 291 viewed from the position corresponding to the arrow F10-F10 in FIG. FIG. 11 is an explanatory view showing a cross section of the ceramic member 200 viewed from a position corresponding to the arrow F11-F11 in FIG. In FIG. 10, the electric heating elements 572, 574, and 576 are hatched for easy understanding of the drawing.

  As shown in FIG. 10, in the present embodiment, the electric heating bodies 572 and 576 are first electric heating bodies arranged on the outer peripheral side of the ceramic layer 291, and the electric heating body 574 is located inside the electric heating bodies 572 and 576. It is the 2nd electric heating body arranged. In the present embodiment, the heating elements 572 and 576 are formed of a conductive material having a higher resistance value than that of the heating element 574 so that the heating value per unit area of the heating elements 572 and 576 is larger than that of the heating element 574. It is configured. In another embodiment, the electric heating elements 572 and 576 may be configured so that the heating value per unit area of the electric heating elements 572 and 576 is larger than that of the electric heating element 574 by supplying a larger current to the electric heating elements 572 and 576. good. In another embodiment, the heating elements 572, 574, and 576 may be configured to have the same heat generation amount per unit area.

  As shown in FIGS. 9 to 11, lands 532 and 536 that are conductor patterns are formed between the ceramic layer 292 and the ceramic layer 293. In FIG. 9, lands 532 and 536 are hatched for easy understanding of the drawing. In FIG. 9, the power supply ports 512 and 516 are illustrated by dashed lines at positions projected onto the ceramic layer 292 along the Z-axis direction. In FIG. 10, the lands 532 and 536 are illustrated by dashed lines at positions projected onto the ceramic layer 291 along the Z-axis direction.

  In the present embodiment, before the ceramic layer 293 is laminated on the ceramic layer 292, the lands 532 and 536 are formed by screen-printing a conductive paste containing a conductive material on the ceramic layer 292.

  The land 532 is a conductor configured to be able to receive power through the power supply port 512. In the present embodiment, the land 532 is configured to be able to receive power through the power supply port 512 by being exposed to the inside of the cylindrical power supply port 512.

  The land 536 is a conductor configured to receive power through the power supply port 516. In the present embodiment, the land 536 is configured to be able to receive power through the power supply port 516 by being exposed to the inside of the cylindrical power supply port 516.

  As shown in FIGS. 9 and 11, vias 552, 553, 554 and vias 556, 557, 558 are formed in the ceramic layer 292. In FIG. 9, vias 552, 553, 554 and vias 556, 557, 558 are illustrated by broken lines. In FIG. 10, the power supply ports 512, 516, lands 532, 536, vias 552, 553, 554, and vias 556, 557, 558 are set at positions projected onto the ceramic layer 291 along the Z-axis direction. This is illustrated with a chain line.

  In the present embodiment, before the lands 332 and 336 are formed in the ceramic layer 292, through holes are formed in the ceramic layer 292, and a conductive paste containing a conductive material is filled in the through holes, thereby printing vias. 552, 553, 554 and vias 556, 557, 558 are formed.

  The via 552 is a conductor that penetrates the ceramic layer 292 and electrically connects the end of the electric heating element 572 on the + X axis direction side and the land 532. The via 553 is a conductor that penetrates the ceramic layer 292 and electrically connects the end portion on the + X-axis direction side of the electric heating element 574 and the land 532. The via 554 is a conductor that penetrates the ceramic layer 292 and electrically connects the end of the electric heating element 576 on the + X-axis direction side and the land 532.

  The via 556 is a conductor that penetrates the ceramic layer 292 and electrically connects the end of the electric heating element 572 on the −X axis direction side and the land 536. The via 557 is a conductor that penetrates the ceramic layer 292 and electrically connects the end of the electric heating element 574 on the −X axis direction side and the land 536. The via 558 is a conductor that penetrates the ceramic layer 292 and electrically connects the end of the electric heating element 576 on the −X axis direction side and the land 536.

  FIG. 17 is an explanatory view showing a manufacturing process of the ceramic member 200. When manufacturing the ceramic member 200, first, a green sheet as a base of the ceramic layers 291 to 297 is prepared (process P110). The green sheet is formed by mixing an insulating ceramic material powder with an organic binder, a plasticizer, a solvent, and the like into a sheet shape.

  After preparing a green sheet (process P110), a green sheet is processed according to each structure of the ceramic layers 291-297 (process P120). Specifically, after cutting each green sheet into a square, a guide hole suitable for alignment in a subsequent process (such as screen printing, cutting, and thermocompression bonding) is punched near the outer periphery of each green sheet. If necessary, conductive paste is screen-printed on the surface of the green sheet in accordance with the shapes of the adsorption electrodes 372, 374, 376, 378, lands 332, 336, electric heating elements 572, 574, 576, and lands 532, 536. . As needed, via holes which are through holes are punched at positions where vias 352, 354, 356, 358 and vias 552, 553, 554, 556, 557, 558 are formed, and a conductor paste is formed in the via holes. The hole is printed. The through hole 218, the negative pressure communication path 430, the suction hole 450, the gas communication path 630, the gas discharge hole 650, and the like are cut into a green sheet as necessary.

  After processing the green sheets according to each of the ceramic layers 291 to 297 (process P120), a plurality of green sheets corresponding to each of the ceramic layers 291 to 297 are stacked, and the adjacent ceramic layers are joined by thermocompression bonding. (Process P125). Thereby, a green sheet laminate in which a plurality of green sheets is laminated is formed.

  After forming the green sheet laminate (process P125), the green sheet laminate is cut into an outer shape suitable for firing in the subsequent process (process P130).

  After cutting the green sheet laminate (process P130), the green sheet laminate is degreased (process P140). Specifically, the green sheet laminate is degreased by exposing it to an air atmosphere at 250 ° C. for 10 hours.

  After degreasing the green sheet laminate (process P140), the green sheet laminate is integrally fired. Specifically, the green sheet laminate is fired in a reducing atmosphere at 1400 to 1600 ° C. (process P150). As a result, alumina derived from the green sheet and tungsten derived from the conductive paste are simultaneously sintered to obtain a fired body in which the internal structure of the ceramic member 200 is formed.

  After firing (process P150), the fired body obtained by firing is formed into a ceramic member 200 (process P160). Specifically, the outer shape of the fired body is polished and cut according to the ceramic member 200. The opposing surfaces 231, 233, and 235 are formed by polishing cutting in the present embodiment, but may be formed by blasting in other embodiments.

  In the first embodiment described above, the adsorption electrodes 372, 374, 376, and 378 are formed on the ceramic layer 296 that is the first ceramic layer, and the gas supply port 612 is connected to the ceramic layer 294 that is the second ceramic layer. A gas communication passage 630 communicating with the gas communication passage 630 is formed, and a gas discharge hole 650 that is a first gas discharge hole penetrating from the gas communication passage 630 to the facing surface 233 is formed. According to the first embodiment, the heat transfer gas (processing gas) is discharged from the gas discharge hole 650 to the facing surface 233, and between the transported body 90 and the ceramic member 200 (in particular, the transported body 90 and By interposing a heat transfer gas in the gap between the opposing surfaces 232 and 234, heat transfer from the ceramic member 200 to the conveyed object 90 can be promoted. Therefore, temperature adjustment of the to-be-conveyed body 90 can be performed effectively while realizing an adsorption function using electrostatic force. As a result, the time required for adjusting the temperature of the transported object 90 can be shortened, and as a result, the transport performance of the transport device 10 can be improved.

  In the first embodiment, the adsorption electrodes 372, 374, 376, and 378 are formed on the ceramic layer 296, and the lands 332 and 336 that are configured to receive power through the power supply ports 312 and 316 are formed on the ceramic layer 295. Vias 352, 354, 356, and 358 that penetrate the ceramic layer 296 and electrically connect the adsorption electrodes 372, 374, 376, and 378 and the lands 332 and 336 were formed. According to the first embodiment, the suction electrodes 372, 374, 376, and 378 formed on the ceramic layer 296 are connected to the vias 352, 354, and 356 via the lands 332 and 336 formed on the ceramic layer 295. , 358, the degree of freedom in the arrangement and shape of the adsorption electrodes 372, 374, 376, and 378 on the ceramic layer 296 can be improved. As a result, it is possible to improve the attracting force due to the electrostatic force, and as a result, the transport performance of the transport device 10 can be improved.

  Further, since the attracting electrodes 372, 374, 376, and 378 are arranged on the side (that is, the + Z axis direction side) that holds the transported body 90 relative to the lands 332 and 336, the side that holds the transported body 90 (that is, the opposite side) More charges are generated on the surfaces 231, 232, 233, 234, and 235 side, and the attractive force due to the electrostatic force can be further improved.

  Further, the opposing surfaces 232 and 234 that are the second opposing surfaces are positioned closer to the transported body 90 (that is, the + Z-axis direction side) than the opposing surfaces 231, 233, and 235 that are the first opposing surfaces, and Z Since the attracting electrodes 372, 374, 376, and 378 are arranged so that at least a part of the attracting electrodes 372, 374, 376, and 378 overlap with the facing surfaces 232 and 234 when viewed from the axial direction, the facing surface that is closer to the conveyed object 90 232 and 234 can generate a lot of electric charges and can further improve the attractive force due to electrostatic force.

  Further, the adsorption electrodes 372 and 374 that are the first electrodes and the adsorption electrodes 376 and 378 that are the second electrodes are configured to have different polar potentials, and the adsorption electrodes 372 and 374 and the adsorption electrodes 376 and 376 are arranged. Since each of 378 is disposed so as to substantially overlap the opposing surfaces 232 and 234 when viewed from the Z-axis direction, the balance between the positive charge and the negative charge generated in the ceramic member 200 and the transported body 90 is maintained. be able to.

  Further, since the facing surface 234 surrounds the facing surface 235 in which the suction hole 450 is formed as viewed from the Z-axis direction, the suction force due to the negative pressure is exerted on the transported body 90 over the facing surface 235 surrounded by the facing surface 234. Can affect.

  In the first embodiment, the adsorption electrodes 372, 374, 376, and 378 are formed on the ceramic layer 297 to secure the adsorption force due to electrostatic force, and then the electric heaters 572, 574 formed on the ceramic layer 291. Power is supplied to 576 through vias 552, 553, 554, 556, 557, and 558 via lands 532 and 536 formed on the ceramic layer 292. According to the first embodiment, the degree of freedom of the arrangement and shape of the electric heating elements 572, 574, and 576 on the ceramic layer 291 can be improved. As a result, the temperature adjustment by the electric heaters 572, 574, and 576 can be effectively performed without hindering the adsorption force due to the electrostatic force, and as a result, the conveyance performance of the conveyance device 10 can be improved.

  Further, since the electric heating elements 572, 574, and 576 are disposed closer to the bottom surface 216 than the opposing surfaces 231, 232, 233, 234, and 235, temperature unevenness on the opposing surfaces 231, 232, 233, 234, and 235 is suppressed, and the electric heating elements Temperature adjustment by 572,574,576 can be performed more effectively.

  In addition, since the outer heating elements 572 and 576 that are the first electric heaters are configured to generate a larger amount of heat per unit area than the inner heating elements 574 that are the second electric heaters, the outer periphery of the ceramic member 200 Temperature unevenness between the side and the inside can be suppressed, and temperature adjustment by the electric heating elements 572, 574, and 576 can be performed more effectively.

B. Second embodiment:
In the description of the second embodiment, the same reference numerals as those in the first embodiment are used for the same configurations as in the first embodiment, and the configurations corresponding to the first embodiment are different from those in the first embodiment, although the shapes and arrangements are different. A code with an English letter “A” is used.

  FIG. 12A is an explanatory view showing the upper surface of the ceramic member 200A in the second embodiment. FIG. 12B is an explanatory diagram illustrating a partial cross section of a ceramic member 200A according to the second embodiment. The ceramic member 200A of the second embodiment is the same as the ceramic member 200 of the first embodiment except that a gas discharge hole 650A is formed in the base end step surface 219A. The base end step surface 219A of the second embodiment is a surface formed between the base end upper surface 215 and the facing surface 231 and corresponds to the base end step surface 219 of the first embodiment.

  The gas discharge hole 650A of the second embodiment is a hole that communicates with the gas communication path 630A and is configured to be able to discharge the processing gas. In this embodiment, as shown in FIG. 12B, the gas discharge hole 650A passes through the ceramic layers 295A and 296A from the gas communication path 630A along the Z-axis direction, and then extends from the inside of the ceramic layer 297A along the layer surface direction. It penetrates to the base end step surface 219A.

  In the present embodiment, as shown in FIG. 12A, the gas discharge hole 650A penetrates the base end step surface 219A in the direction along the outer periphery of the facing surface 231. In another embodiment, the gas discharge hole 650A may penetrate the base end step surface 219A in a direction orthogonal to the outer periphery of the facing surface 231.

  In the present embodiment, before the ceramic member 200A is integrally fired, the gas release holes 650A are formed by cutting the ceramic layers 295A, 296A, and 297A. In this embodiment, the number of gas discharge holes 650A is four, but in other embodiments, it may be three or less, or may be five or more.

  According to the second embodiment described above, the time required for temperature adjustment of the transported object 90 can be shortened as in the first embodiment. In addition, since the gas discharge hole 650A that is the second gas discharge hole is formed in the base end step surface 219A that is the end surface, the processing target is discharged from the base end step surface 219A in addition to the facing surface 233. The temperature adjustment of 90 can be performed more effectively. Further, since the gas discharge hole 650A passes through the base end step surface 219A in the direction along the outer periphery of the facing surface 231, the processing gas is discharged along the outer periphery of the transferred object 90, thereby The temperature can be adjusted more effectively. Further, since the gas discharge hole 650A is disposed on the base end surface 211 side with respect to the facing surface 231, the temperature adjustment for the portion of the transported body 90 located on the base end surface 211 side can be performed more effectively.

C. Third embodiment:
In the description of the third embodiment, the same reference numerals as those in the first embodiment are used for the same configurations as in the first embodiment, and the configurations corresponding to the first embodiment are different from those in the first embodiment, although the shapes and arrangements are different. A code with an English letter “B” is used.

  FIG. 13A is an explanatory view showing an upper surface of a ceramic member 200B in the third embodiment. FIG. 13B is an explanatory diagram illustrating a partial cross section of a ceramic member 200B according to the third embodiment. The ceramic member 200B of the third embodiment is the same as the ceramic member 200 of the first embodiment except that the gas discharge holes 650B are formed in the tip step surfaces 248B and 249B.

  The tip step surface 248B of the third embodiment is a surface formed between the tip top surface 242 and the facing surface 231 and corresponds to the tip step surface 248 of the first embodiment. The tip step surface 249B of the third embodiment is a surface formed between the tip top surface 243 and the facing surface 231 and corresponds to the tip step surface 249 of the first embodiment.

  The gas discharge hole 650B of the third embodiment is a hole configured to communicate with the gas communication path 630B and discharge process gas. In this embodiment, as shown in FIG. 13B, the gas discharge hole 650B passes through the ceramic layers 295B and 296B from the gas communication path 630B along the Z-axis direction, and then extends from the inside of the ceramic layer 297B along the layer surface direction. It penetrates to the tip step surfaces 248B and 249B.

  In the present embodiment, as shown in FIG. 13A, the gas discharge hole 650B passes through the tip step surfaces 248B and 249B in the direction along the outer periphery of the facing surface 231. In another embodiment, the gas discharge hole 650B may penetrate the tip step surfaces 248B and 249B in a direction orthogonal to the outer periphery of the facing surface 231.

  In the present embodiment, before the ceramic member 200B is integrally fired, the gas release holes 650B are formed by cutting the ceramic layers 295B, 296B, and 297B. In the present embodiment, the number of gas discharge holes 650B is two for each of the tip step surfaces 248B and 249B. However, in another embodiment, one may be provided for each of the tip step surfaces 248B and 249B. There may be three or more of each.

  According to the third embodiment described above, the time required for temperature adjustment of the transported object 90 can be shortened as in the first embodiment. In addition, since the gas discharge holes 650B, which are the second gas discharge holes, are formed in the tip step surfaces 248B, 249B, which are the end surfaces, the processing gas is discharged from the tip step surfaces 248B, 249B in addition to the facing surface 233. The temperature of the carrier 90 can be adjusted more effectively. Further, since the gas discharge hole 650B penetrates the tip step surfaces 248B and 249B in the direction along the outer periphery of the facing surface 231, the processing object 90 is discharged by discharging the processing gas along the outer periphery of the transported body 90. The temperature can be adjusted more effectively. In addition, since the gas discharge hole 650B is disposed on the front end surfaces 222 and 223 side with respect to the facing surface 231, the temperature of the portion of the transported body 90 located on the front end surfaces 222 and 223 side can be more effectively adjusted.

D. Fourth embodiment:
In the description of the fourth embodiment, the same reference numerals as those of the first embodiment are used for the same configurations as those of the first embodiment, and the configurations corresponding to the first embodiment are different from those of the first embodiment, although the shapes and arrangements are different. A code with an English letter “C” is used.

  FIG. 14 is an explanatory view showing a cross section of a ceramic member 200C in the fourth embodiment. FIG. 14 illustrates a cross section of the ceramic member 200 </ b> C viewed from a position corresponding to the arrow F <b> 4-F <b> 4 in FIG. 2. The ceramic member 200C of the fourth embodiment is the same as the ceramic member 200 of the first embodiment, except that the gas discharge holes 650C are formed on the outer side surfaces 224C and 225C and the inner side surfaces 226C and 227C.

  The outer surface 224C of the fourth embodiment is a surface formed between the distal end surface 222 and the proximal end side surface 213, and corresponds to the outer surface 224 of the first embodiment. The outer surface 225C of the fourth embodiment is a surface formed between the distal end surface 223 and the proximal end side surface 214, and corresponds to the outer surface 225 of the first embodiment.

  The inner side surface 226C of the fourth embodiment is a surface formed between the distal end surface 222 and the inner side surface 221 and corresponds to the inner side surface 226 of the first embodiment. The inner surface 227C of the fourth embodiment is a surface formed between the front end surface 223 and the inner surface 221 and corresponds to the inner surface 227 of the first embodiment.

  The gas discharge hole 650C of the fourth embodiment is a hole configured to communicate with the gas communication path 630C and discharge process gas. In the present embodiment, as shown in FIG. 14, the gas discharge hole 650C penetrates from the gas communication path 630C to the outer side surfaces 224C and 225C and the inner side surfaces 226C and 227C along the layer surface direction.

  In the present embodiment, the gas discharge holes 650C penetrate the outer surfaces 224C, 225C and the inner surfaces 226C, 227C in the directions orthogonal to the outer surfaces 224C, 225C and the inner surfaces 226C, 227C, respectively. In another embodiment, the gas discharge hole 650C may penetrate the outer side surfaces 224C and 225C and the inner side surfaces 226C and 227C in the direction along the outer shape of the transported body 90, respectively.

  In the present embodiment, the gas emission hole 650C is formed by cutting the ceramic layer 294C before the ceramic member 200C is integrally fired. In the present embodiment, the number of gas discharge holes 650C is plural on each of the outer side surfaces 224C and 225C and the inner side surfaces 226C and 227C. However, in the other embodiments, the number may be one.

  According to the fourth embodiment described above, the time required for temperature adjustment of the transported object 90 can be shortened as in the first embodiment. Further, since the gas discharge holes 650C as the second gas discharge holes are formed in the outer surfaces 224C and 225C and the inner side surfaces 226C and 227C as the end surfaces, the outer surfaces 224C and 225C and the inner side surfaces 226C and 226C in addition to the facing surface 233 are formed. The temperature of the transported body 90 can be adjusted more effectively by releasing the processing gas from 227C. Further, since the gas discharge holes 650C are arranged on the outer side surfaces 224C and 225C and the inner side surfaces 226C and 227C, the temperature of the parts of the transported body 90 located near the outer side surfaces 224C and 225C and the inner side surfaces 226C and 227C is further adjusted. Can be done effectively.

  In the fourth embodiment, the gas discharge holes 650C are formed on the outer surfaces 224C and 225C and the inner surfaces 226C and 227C. However, in other embodiments, the gas discharge holes 650C are formed only on the outer surfaces 224C and 225C. Alternatively, the gas discharge hole 650C may be formed only on the inner side surfaces 226C and 227C. In the fourth embodiment, the gas discharge hole 650C is not formed in the inner side surface 221, but in other embodiments, the gas discharge hole 650C may be formed in the inner side surface 221.

E. Fifth embodiment:
In the description of the fifth embodiment, the same reference numerals as in the first embodiment are used for the same configurations as in the first embodiment, and the configurations corresponding to the first embodiment are different from those in the first embodiment, although the shapes and arrangements are different. A code with an English letter “D” is used.

  FIG. 15 is an explanatory view showing an upper surface of a ceramic member 200D in the fifth embodiment. FIG. 16 is an explanatory diagram showing a cross section of the ceramic member 200D as viewed from the direction of arrows F16-F16 in FIG. The ceramic member 200D of the fifth embodiment has a facing surface 231D formed in place of the facing surfaces 231, 232, 233 and the top end surfaces 242, 243, and the processing gas supplied from the processing gas supply unit 860 is transported. Except for the point that it is a cooling gas for cooling the body 90, it is the same as the ceramic member 200 of the first embodiment.

  The facing surface 231D of the fifth embodiment has a shape obtained by cutting the facing surface 232 and the tip upper surfaces 242 and 243 in the first embodiment to the positions of the facing surfaces 231 and 233, and the facing surface 231 of the first embodiment. The surface corresponding to 233 is included. The facing surface 231 </ b> D is located in the −Z-axis direction with respect to the facing surface 234 and surrounds the outer periphery of the facing surface 234. The facing surface 231D is connected to each of the base end step surface 219, the tip end surfaces 222, 223, the outer side surfaces 224, 225, and the inner side surfaces 221, 226, 227. In the facing surface 231D, gas discharge holes 650 are formed in the same arrangement as in the first embodiment.

The processing gas supply unit 860 of the fifth embodiment supplies a sufficiently cooled processing gas as a cooling gas to the ceramic member 200D. The cooling gas supplied from the processing gas supply unit 860 may be a gas that does not damage and contaminate the transported body 90. In this embodiment, the cooling gas is nitrogen (N ₂ ), but in other embodiments, other inert gases such as argon (Ar) and carbon dioxide (CO ₂ ) may be used.

  According to the fifth embodiment described above, similarly to the first embodiment, the time required for temperature adjustment of the transported body 90 can be shortened. Moreover, the to-be-conveyed body 90 can be cooled by discharging | emitting cooling gas (processing gas) from the gas discharge hole 650 to opposing surface 231D. Therefore, temperature adjustment of the to-be-conveyed body 90 can be performed effectively while realizing an adsorption function using electrostatic force. As a result, the time required for adjusting the temperature of the transported object 90 can be shortened, and as a result, the transport performance of the transport device 10 can be improved.

  Note that at least one of the gas discharge hole 650A of the second embodiment, the gas discharge hole 650B of the third embodiment, and the gas discharge hole 650C of the fourth embodiment may be applied to the ceramic member 200D of the fifth embodiment. good. As a result, the temperature of the transported body 90 can be adjusted more effectively.

F. Other embodiments:
As mentioned above, although embodiment of this invention was described, this invention is not limited to such embodiment at all, Of course, it can implement with a various form within the range which does not deviate from the meaning of this invention. For example, in the above-described embodiment, the gas discharge hole 650 is formed as a hole penetrating from the gas communication path 630 to the first facing surface, but in another embodiment, the hole penetrating to the second facing surface. Or may be formed as holes penetrating through both the first facing surface and the second facing surface.

  The overall shape of the ceramic member is not limited to a substantially U-shaped plate shape, and may be various shapes such as a circle, a triangle, a quadrangle, and a polygon. In addition, the shape, arrangement, number, and the like of each of the facing surface, the adsorption electrode, the negative pressure communication path, the adsorption hole, the electric heating element, the land, the via, the gas communication path, and the gas discharge hole are limited to the above-described embodiment. It may be changed as appropriate according to the embodiment.

  Moreover, the conveying apparatus 10 is an apparatus which comprises a part of liquid crystal substrate manufacturing apparatus which manufactures a liquid crystal substrate using a glass substrate, and the to-be-conveyed body 90 is good also as the glass substrate. Moreover, the conveying apparatus 10 is an apparatus which comprises a part of plasma substrate manufacturing apparatus which manufactures a plasma substrate using a glass substrate, and the to-be-conveyed body 90 is good also as the glass substrate. Moreover, the conveying apparatus 10 is an apparatus which comprises a part of solar cell manufacturing apparatus which manufactures a solar cell substrate using an amorphous silicon wafer, and the to-be-conveyed body 90 is good also as the amorphous silicon wafer.

DESCRIPTION OF SYMBOLS 10 ... Conveyance apparatus 90 ... Conveyed object 100 ... Control part 200,200A-200D ... Ceramic member 211 ... Base end surface 213 ... Base end side surface 214 ... Base end side surface 215 ... Base end upper surface 216 ... Bottom surface 218 ... Through-hole 219, 219A ... proximal end face 221 ... inner side face 222 ... leading end face 223 ... leading end face 224,224C ... outer face 225,225C ... outer face 226,226C ... inner face 227,227C ... inner face 231,231D ... opposite face 232 ... opposite Surface 233 ... opposing surface 234 ... opposing surface 235 ... opposing surface 242 ... tip upper surface 243 ... tip upper surface 248, 248B ... tip stepped surfaces 249, 249B ... tip stepped surfaces 291-297 ... ceramic layer 312 ... power feeding port 316 ... power feeding port 332 , 336 ... Land 352, 354, 356, 358 ... Via 372, 374, 376 78 ... Adsorption electrode 412 ... Negative pressure supply port 430 ... Negative pressure communication passage 450 ... Adsorption hole 512 ... Power supply port 516 ... Power supply port 532, 536 ... Land 552, 553, 554, 556, 557, 558 ... Via 572 ... Electric heating element 574 ... electric heating element 576 ... electric heating element 612 ... gas supply port 630, 630A, 630B, 630C ... gas communication passage 650,650A, 650B, 650C ... gas discharge hole 710 ... arm mechanism 720 ... moving mechanism 830 ... adsorption electrode driving unit 840 ... Negative pressure supply unit 850 ... electric heating element drive unit 860 ... processing gas supply unit

Claims (7)

A plurality of ceramic layers having insulating properties are integrally fired,
An adsorption electrode, which is an electrode configured to adsorb a dielectric by electrostatic force, is provided inside,
A ceramic member configured to be movable together with the transported body in a state where the transported body is held in the transport apparatus,
The first and second opposing surfaces which are surfaces along the layer surface direction of the plurality of ceramic layers and are opposed to the transported body in a state where the transported body is held;
The second facing surface is located closer to the transported body than the first facing surface,
Forming the adsorption electrode on a first ceramic layer of the plurality of ceramic layers;
Providing a gas supply port for receiving a supply of a processing gas which is at least one of a gas for cooling the transported body and a gas for transmitting heat of the ceramic member to the transported body from the outside of the ceramic member;
A gas communication path communicating with the gas supply port is formed in a second ceramic layer of the plurality of ceramic layers that is separated from the first ceramic layer from the first facing surface;
A first gas discharge hole which is a hole configured to penetrate the gas communication path from at least one of the first facing surface and the second facing surface to discharge the processing gas is formed. Ceramic member to be used. The ceramic member according to claim 1,
An end surface which is a surface along a direction intersecting the layer surface direction and connected to at least one of the first facing surface and the second facing surface;
A ceramic member characterized in that a second gas discharge hole, which is a hole configured to be able to discharge the processing gas through the gas communication path, is formed in the end face. The ceramic member according to claim 2,
The second gas discharge hole penetrates through the end surface in a direction along an outer periphery of an opposing surface connected to the end surface of the first opposing surface and the second opposing surface. Element. The ceramic member according to claim 2 or claim 3, wherein
A proximal end that is an end on the side attached to the transport device;
The ceramic member, wherein the second gas discharge hole is disposed closer to the base end side than the first facing surface and the second facing surface. A ceramic member according to any one of claims 2 to 4,
Having a tip part in which the first opposing surface and the second opposing surface are arranged between the side attached to the transport device;
The ceramic member, wherein the second gas discharge hole is disposed closer to the tip than the first facing surface and the second facing surface. A ceramic member according to any one of claims 2 to 5,
Having an outer periphery forming an outer periphery of the ceramic member;
The ceramic member, wherein the second gas discharge hole is disposed in the outer peripheral portion.   The conveying apparatus which conveys the said to-be-conveyed body using the ceramic member as described in any one of Claims 1 thru | or 6.

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