JP2013182872A - Vehicular lamp - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vehicular lamp of which design freedom is improved by arranging a printed-circuit board having a base surface part formed of a transparent material and a conductive pattern which is formed on the base surface part and to which a semiconductor light-emitting element is connected.SOLUTION: A lamp unit 6 is arranged in a lamp outer case 4 constructed of a lamp housing 2 having an opening at least on one side and a cover 3 for covering the opening of the lamp housing, the lamp unit has a printed-circuit board 11 on which a semiconductor light-emitting element 12 functioning as a light source is mounted, and the printed-circuit board is provided with a base surface part 13 formed of a transparent material and a conductive pattern 14 which is formed on the base surface part and to which the semiconductor light-emitting element is connected. Thereby, light emitted from the semiconductor light-emitting element can transmit the printed-circuit board and direction of the printed-circuit board can be freely established to improve design freedom.

Description

  The present invention relates to a vehicular lamp. More particularly, the present invention relates to a technical field in which a printed circuit board having a base surface portion formed of a transparent material and a conductive pattern formed on the base surface portion and connected to a semiconductor light emitting element is arranged to improve design flexibility.

  Some vehicle lamps include, for example, a lamp unit having a light source disposed inside a lamp outer casing constituted by a cover and a lamp housing.

  Such vehicle lamps include a semiconductor light emitting element mounted on a printed circuit board as a light source, and configured so that light emitted from the semiconductor light emitting element is irradiated to the outside (for example, Patent Document 1). reference).

  By mounting the light source on the printed circuit board, the light source body constituted by the light source and the printed circuit board is thin, so that the size of the vehicle lamp can be reduced.

JP 2010-15910 A

  However, in the vehicular lamp described in Patent Document 1, it is necessary to arrange the light source body in such a direction that the light emitted from the semiconductor light emitting element is not shielded by the printed circuit board. There is a problem that the degree of freedom in design is limited.

  Therefore, an object of the vehicle lamp of the present invention is to overcome the above-described problems and to improve the degree of design freedom.

  In order to solve the above-described problem, a vehicular lamp is a vehicle in which a lamp unit is disposed inside a lamp outer casing that includes a lamp housing having an opening on at least one side and a cover that covers the opening of the lamp housing. The lamp unit includes a printed circuit board on which a semiconductor light emitting element functioning as a light source is mounted, and the printed circuit board is formed on a base surface portion formed of a transparent material and the semiconductor light emitting device. And a conductive pattern to which the element is connected.

  Therefore, in the vehicular lamp, at least a part of the light emitted from the semiconductor light emitting element can be transmitted through the printed board.

  The vehicular lamp according to the present invention is a vehicular lamp in which a lamp unit is arranged inside a lamp outer casing formed by a lamp housing having an opening on at least one side and a cover that covers the opening of the lamp housing. The lamp unit has a printed circuit board on which a semiconductor light emitting element functioning as a light source is mounted. The printed circuit board is formed on a base surface portion formed of a transparent material, and a conductive pattern to which the semiconductor light emitting element is connected. It is characterized by providing.

  Therefore, the light emitted from the semiconductor light emitting element can be transmitted through the printed board, the orientation of the printed board can be freely set, and the degree of freedom in design can be improved.

  In the invention described in claim 2, a reflector that reflects light is disposed on the opposite side of the cover across the printed circuit board, and light emitted from the semiconductor light emitting element is reflected by the reflector and The printed circuit board and the cover are transmitted to be irradiated outside.

  Therefore, the light emitted from the light source body can be reflected by the reflector and transmitted through the printed circuit board and the cover, the reflector can be used effectively, the amount of emitted light can be increased, and the degree of freedom in design. Can be improved.

  In a third aspect of the present invention, conductive patterns are formed on both surfaces of the base surface portion, and the semiconductor light emitting elements are connected to the respective conductive patterns formed on both surfaces of the base surface portion.

  Therefore, it is possible to increase the amount of emitted light while ensuring a reduction in thickness.

  In the invention described in claim 4, the printed circuit board has an insulating layer and a pair of base surface portions laminated on both surfaces of the insulating layer, and each conductive pattern formed on the base surface portion. Are opposed to each other and the semiconductor light emitting element is disposed between the pair of base surface portions, and both surfaces of the semiconductor light emitting element are connected to the respective conductive patterns.

  Therefore, the semiconductor light emitting element can be protected.

  In the invention described in claim 5, the conductive pattern is formed of a transparent material.

  Therefore, the light transmittance of the printed circuit board is increased, and the degree of freedom in design can be further improved and the amount of light irradiated to the outside can be increased.

  In the invention described in claim 6, a flexible printed board having flexibility is used as the printed board.

  Therefore, the printed circuit board can be arranged on a curved surface, the degree of freedom of arrangement of the semiconductor light emitting elements is increased, and the degree of freedom of design can be further improved.

  The best mode for carrying out the vehicular lamp of the present invention will be described below with reference to the accompanying drawings.

  The vehicle lamps shown below are respectively attached to the left and right ends of the vehicle body, and are used, for example, as tail lamps or stop lamps. The vehicle lamps shown below are not limited to tail lamps and stop lamps. For example, head lamps, cornering lamps, fog lamps, hazard lamps, turn signal lamps, position lamps, clearance lamps, back lamps, tail lamps and stop lamps. Various other lamps such as a combination lamp in which a plurality of lamps are combined may be used.

  First, the vehicular lamp 1 according to the first embodiment will be described (see FIGS. 1 to 4).

  As shown in FIG. 1, the vehicular lamp 1 includes a lamp housing 2 having a recess opened on one side and a cover 3 that closes the opening of the lamp housing 2. The lamp housing 2 and the cover 3 constitute a lamp outer casing 4, and the inner space of the lamp outer casing 4 is formed as a lamp chamber 5.

  A lamp unit 6 is disposed in the lamp chamber 5. The lamp unit 6 includes a reflector 7 that is opened on one side, an inner lens 8 that closes the opening of the reflector 7, and a light source body 9 that is attached to the outer surface of the inner lens 8.

  The reflector 7 includes, for example, two reflecting portions 10 and 10 arranged on the left and right, and the inner surfaces of the reflecting portions 10 and 10 are formed as reflecting surfaces 10a and 10a, respectively.

  The inner lens 8 is formed in a curved surface with a gentle curvature, for example. In the inner lens 8, for example, two arrangement holes 8a and 8a are formed.

  The light source body 9 includes, for example, two semiconductor light emitting elements 12 and 12 that are mounted on the printed board 11 and function as a light source. For example, an LED (Light Emitting Diode) is used as the semiconductor light emitting element 12.

  The printed circuit board 11 is a flexible printed circuit board having flexibility, a base surface portion 13 used as a base material, a conductive pattern 14 formed on the base surface portion 13, and a cover surface portion 15 laminated on the base surface portion 13 and covering the conductive pattern 14. (See FIG. 2).

  The base surface portion 13 is formed in a sheet shape from a transparent resin material such as polyethylene naphthalate (PEN) or polyethylene terephthalate (PET).

  The conductive pattern 14 is formed in a very thin line shape by, for example, copper foil or the like. The conductive pattern 14 may be formed of a transparent material such as ITO (Indium Tin Oxide), which is a compound obtained by adding tin to indium oxide.

  The cover surface portion 15 is formed in a sheet shape using the same transparent material as the base surface portion 13, and openings 15 a and 15 a communicating with the conductive pattern 14 are formed in the cover surface portion 15.

  The semiconductor light emitting elements 12 and 12 are respectively disposed in the openings 15a and 15a formed in the cover surface portion 15, and the semiconductor light emitting elements 12 and 12 are respectively connected to the conductive pattern 14 by a conductive adhesive or the like.

  An extension 16 is disposed around the lamp unit 6 in the lamp chamber 5 (see FIG. 1), and the extension 16 prevents a structure existing around the lamp unit 6 from being visible from the outside.

  In the light source body 9, the cover surface portion 15 of the printed circuit board 11 is attached to the inner lens 8 with a transparent adhesive or the like, and the semiconductor light emitting elements 12 and 12 are arranged in the arrangement holes 8 a and 8 a of the inner lens 8, respectively. The light source body 9 is disposed in a state where the light emitting surfaces of the semiconductor light emitting elements 12 and 12 face the reflecting portions 10 and 10 of the reflector 7 respectively.

  In the vehicular lamp 1 provided with the lamp unit 6, light emitted from the semiconductor light emitting elements 12 and 12 is reflected by the reflecting surfaces 10a and 10a of the reflecting portions 10 and 10, respectively, and the inner lens 8, the printed circuit board 11, and the cover are reflected. 3 is transmitted through in order.

  Below, the modification of the lamp unit arrange | positioned at the vehicle lamp 1 which concerns on 1st Embodiment is demonstrated (refer FIG.3 and FIG.4).

  The lamp unit 6A according to the modification shown below is different from the lamp unit 6 described above only in the configuration of the light source body and the control lens in which the lens step is formed. For this reason, only the parts different from the lamp unit 6 will be described in detail, and the other parts will be denoted by the same reference numerals as the same parts in the lamp unit 6 and description thereof will be omitted.

  The lamp unit 6A has a light source body 9A.

  The light source body 9A includes, for example, two semiconductor light emitting elements 12X and 12X and semiconductor light emitting elements 12Y and 12Y mounted on both sides of the printed board 11A and the printed board 11A, respectively.

  11 A of printed circuit boards have the base surface part 13, the conductive patterns 14 and 14 formed in both surfaces of the base surface part 13, and the cover surface parts 15 and 15 laminated | stacked on the base surface part 13 from both sides, respectively, and covering the conductive patterns 14 and 14, respectively. (See FIG. 4).

  As shown in FIG. 3, in the light source body 9A, one cover surface portion 15 of the printed board 11A is attached to the outer surface of the inner lens 8 with a transparent adhesive or the like, and the semiconductor light emitting elements 12X and 12X are connected to the inner lens 8 respectively. It arrange | positions at the arrangement | positioning holes 8a and 8a. The light source body 9A is arranged with the light emitting surfaces of the semiconductor light emitting elements 12X and 12X facing the reflecting portions 10 and 10 of the reflector 7, respectively.

  The lamp unit 6A is provided with a control lens 17 disposed between the cover 3 and the inner lens 8. The control lens 17 is disposed at a position facing the inner lens 8, and has lens steps 17a and 17a at portions facing the semiconductor light emitting elements 12Y and 12Y, respectively.

  The lamp unit 6A may not be provided with the control lens 17, and in this case, the cover 3 may be provided with lens steps similar to the lens steps 17a and 17a.

  In the vehicular lamp 1 provided with the lamp unit 6A, the light emitted from the semiconductor light emitting elements 12X and 12X is reflected by the reflecting surfaces 10a and 10a of the reflecting portions 10 and 10, respectively, and is controlled by the inner lens 8 and the printed board 11A. The lens 17 and the cover 3 are sequentially transmitted and irradiated to the outside. When the control lens 17 is not provided, the light emitted from the semiconductor light emitting elements 12X and 12X and reflected by the reflecting surfaces 10a and 10a is sequentially transmitted through the inner lens 8, the printed board 11A, and the cover 3. To the outside.

  On the other hand, in the vehicle lamp 1 provided with the lamp unit 6A, the light emitted from the semiconductor light emitting elements 12Y and 12Y is subjected to diffusion control by the lens steps 17a and 17a of the control lens 17 and transmitted through the cover 3. Is irradiated to the outside. If the control lens 17 is not provided, the light emitted from the semiconductor light emitting elements 12Y and 12Y is incident on the inside of the cover 3 and is diffused and controlled by a lens step and irradiated to the outside. Is done.

  Thus, by using the light source body 9A on which the semiconductor light emitting elements 12X, 12X, 12Y, and 12Y are mounted on both sides, it becomes possible to emit light from the light source body 9A in opposite directions, and the reflector 7 is effective. The amount of emitted light can be increased and the degree of design freedom can be improved.

  Further, the printed circuit board 11A has conductive patterns 14 and 14 formed on both surfaces in the thickness direction, and the semiconductor light emitting elements 12X and 12X and the semiconductor light emitting elements 12Y and 12Y are connected to the conductive patterns 14 and 14, respectively. The amount of emitted light can be increased while ensuring the above.

  Next, a vehicle lamp 21 according to a second embodiment will be described (see FIGS. 5 to 7).

  As shown in FIG. 5, the vehicular lamp 21 includes a lamp housing 22 having a recess opened in one side and a cover 23 that closes the opening of the lamp housing 22. The lamp housing 22 and the cover 23 constitute a lamp outer casing 24, and the inner space of the lamp outer casing 24 is formed as a lamp chamber 25.

  A lamp unit 26 is disposed in the lamp chamber 25. The lamp unit 26 includes a reflector 27 that is open on one side, an inner lens 28 that closes the opening of the reflector 27, and a light source body 29 that is attached to the inner surface of the inner lens 28.

  The reflector 27 includes, for example, two reflecting portions 30 and 30 arranged on the left and right, and the inner surfaces of the reflecting portions 30 and 30 are formed as reflecting surfaces 30a and 30a, respectively.

  The inner lens 28 is formed in a flat plate shape, for example. In the inner lens 28, for example, two lens steps 28a and 28a are formed on the surface opposite to the side where the reflector 27 is located.

  The light source body 29 includes, for example, two semiconductor light emitting elements 32 and 32 that are mounted inside the printed board 31 and function as a light source. For example, an LED is used as the semiconductor light emitting element 32.

  The printed circuit board 31 is a flexible printed circuit board having flexibility, for example, and is used as a base material and is formed on the base surface portions 33 and 33 and the inner surfaces of the base surface portions 33 and 33 that are spaced apart in the thickness direction. It has the pattern 34, 34 and the insulating layer 35 provided between the base surface parts 33, 33 (refer FIG. 6). The insulating layer 35 is formed of a transparent adhesive.

  The base surface portion 33 and the conductive pattern 34 are formed of the same material as the base surface portion 13 and the conductive pattern 14, respectively.

  The semiconductor light emitting elements 32 and 32 are arranged at positions where the insulating layer 35 exists in the thickness direction of the printed circuit board 31 and are connected to conductive patterns 34 and 34 located on both sides, respectively.

  In the light source body 29, one base surface portion 33 of the printed circuit board 31 is attached to the inner lens 28 with a transparent adhesive or the like. In the light source body 29, the light emitting surfaces of the semiconductor light emitting elements 32 and 32 are arranged at positions with respect to the lens steps 28a and 28a, respectively facing the inner lens 28 side.

  In the lamp chamber 25, an extension 36 is disposed around the lamp unit 26 (see FIG. 5), and the extension 36 prevents a structure existing around the lamp unit 26 from being visible from the outside.

  Light sources 37 and 37 are attached to the reflecting portions 30 and 30 of the reflector 27, respectively. For example, an LED is used as the light source 37. The light source 37 is not limited to the LED, and other types of light sources such as a discharge bulb, an incandescent bulb, and a halogen bulb may be used.

  In the vehicular lamp 21 provided with the lamp unit 26, the light emitted from the semiconductor light emitting elements 32 and 32 is respectively incident on the inner lens 28, and diffusion and the like are controlled by the lens steps 28a and 28a. The light is transmitted to the outside.

  Light emitted from the light sources 37 and 37 is reflected by the reflecting surfaces 30a and 30a of the reflecting portions 30 and 30, respectively, and is sequentially transmitted through the printed board 31, the inner lens 28, and the cover 23 to be irradiated to the outside.

  Thus, by using the light source body 29 in which the semiconductor light emitting elements 32 and 32 are arranged, the semiconductor light emitting elements 32 and 32 can be protected.

  Moreover, in the light source body 29, since the base surface portions 33 and 33 are positioned on the outermost surface side and function as a cover surface portion, there is no need to provide a cover surface portion in addition to the base surface portions 33 and 33. Easy and thinning can be achieved.

  Below, the modification of the lamp unit arrange | positioned at the vehicle lamp 21 which concerns on 2nd Embodiment is demonstrated (refer FIG. 7).

  The lamp unit 26A according to the modification shown below is different from the lamp unit 26 described above in that the direction in which the light source body is arranged is different and that the light source is not attached to the reflector. Only parts that are different from the lamp unit 26 will be described in detail, and the other parts will be denoted by the same reference numerals as the same parts in the lamp unit 26, and description thereof will be omitted.

  In the light source 29, the other base surface portion 33 of the printed circuit board 31 is attached to the inner surface of the inner lens 28 with a transparent adhesive or the like. The light source 29 is arranged in a state where the light emitting surfaces of the semiconductor light emitting elements 32 and 32 face the reflecting portions 30 and 30 of the reflector 27, respectively.

  The lamp unit 26A is not provided with the light sources 37, 37.

  In the vehicular lamp 21 provided with the lamp unit 26A, the light emitted from the semiconductor light emitting elements 32, 32 is reflected by the reflecting surfaces 30a, 30a of the reflecting portions 30, 30, respectively, and the printed circuit board 31, the inner lens 28, The light is irradiated through the cover 23 in order.

  In the lamp unit 26A, there is a possibility that light leaks to the side opposite to the reflector 27 side in the semiconductor light emitting elements 32, 32, and this light is controlled such as diffusion by the lens steps 28a, 28a of the inner lens 28. This is performed and transmitted through the cover 3 to be irradiated to the outside.

  As described above, since the light source body 29 in which the semiconductor light emitting elements 32 and 32 are disposed is used in the lamp unit 26A as in the lamp unit 26, the semiconductor light emitting elements 32 and 32 are protected. Can do.

  Further, as in the case of the lamp unit 26, in the light source body 29, the base surface portions 33 and 33 are located on the outermost surface side and function as the cover surface portion, so a cover surface portion is provided in addition to the base surface portions 33 and 33. There is no need, and manufacturing can be facilitated and thinned.

  In the above, an example is shown in which each of the lamp units 6, 6A, 26, 26A is provided with two semiconductor light emitting elements 12, 12X, 12Y, 32, reflecting portions 10, 30, and lens steps 17a, 28a. However, these numbers are not limited to two, and one or three or more may be provided.

  As described above, in the vehicular lamp 1, the base surface portions 13 and 33 of the printed circuit boards 11, 11A, and 31 are formed of a transparent material.

  Accordingly, light emitted from the semiconductor light emitting elements 12 and 12X can be transmitted through the printed circuit boards 11, 11A, and 31, and the directions of the printed circuit boards 11, 11A, and 31 can be freely set. The degree of freedom can be improved.

  In addition, since the base surface portions 13 and 33 are made of a transparent material, the printed circuit boards 11, 11 </ b> A, and 31 are hardly visible from the outside even when not lit, and the design can be improved.

  Furthermore, since the conductive patterns 14 and 34 are formed of a transparent material, the light transmittance of the printed circuit boards 11, 11 </ b> A, and 31 is increased. Can be achieved.

  In addition, by using a flexible printed board as the printed boards 11, 11A, 31, for example, the printed boards 11, 11A, 31 can be arranged on a curved surface, and the semiconductor light emitting elements 12, 12X, 12Y The degree of freedom of arrangement becomes high, and the degree of freedom of design can be further improved.

  The shapes and structures of the respective parts shown in the best mode for carrying out the invention described above are merely examples of the embodiments performed in practicing the present invention. The range should not be interpreted in a limited way.

2 to 4 show a first embodiment of a vehicular lamp according to the present invention, and this figure is a schematic cross-sectional view of the vehicular lamp. It is an expanded sectional view which shows a part of light source body. It is a schematic sectional drawing of the lamp unit which concerns on a modification. It is an expanded sectional view which shows a part of light source body provided in the lamp unit which concerns on a modification. 6 and 7 show a second embodiment of the vehicular lamp according to the present invention, and this figure is a schematic cross-sectional view of the vehicular lamp. It is an expanded sectional view which shows a part of light source body. It is a schematic sectional drawing of the lamp unit which concerns on a modification.

  DESCRIPTION OF SYMBOLS 1 ... Vehicle lamp, 2 ... Lamp housing, 3 ... Cover, 4 ... Lamp outer casing, 6 ... Lamp unit, 7 ... Reflector, 11 ... Printed circuit board, 12 ... Semiconductor light emitting element, 13 ... Base surface part, 14 ... Conductive pattern , 6A ... lamp unit, 11A ... printed circuit board, 12X ... semiconductor light emitting element, 12Y ... semiconductor light emitting element, 21 ... vehicle lamp, 22 ... lamp housing, 23 ... cover, 24 ... lamp outer casing, 26 ... lamp unit, 27 ... Reflector, 31 ... Printed circuit board, 32 ... Semiconductor light emitting element, 33 ... Base surface part, 34 ... Conductive pattern, 35 ... Insulating layer, 26A ... Lamp unit

Claims (6)

A vehicular lamp in which a lamp unit is arranged inside a lamp outer casing formed by a lamp housing having an opening in at least one and a cover covering the opening of the lamp housing,
The lamp unit has a printed circuit board on which a semiconductor light emitting element functioning as a light source is mounted,
The printed circuit board includes a base surface portion formed of a transparent material and a conductive pattern formed on the base surface portion and connected to the semiconductor light emitting element. A reflector that reflects light is disposed on the opposite side of the cover across the printed circuit board;
2. The vehicular lamp according to claim 1, wherein light emitted from the semiconductor light emitting element is reflected by the reflector, is transmitted through the printed circuit board and the cover, and is irradiated to the outside. 3. Conductive patterns are formed on both sides of the base surface part,
3. The vehicular lamp according to claim 1, wherein the semiconductor light emitting element is connected to each conductive pattern formed on each of both surfaces of the base surface portion. 4. The printed circuit board has an insulating layer and a pair of base surface portions respectively laminated on both surfaces of the insulating layer;
The respective conductive patterns formed on the base surface portion are positioned to face each other, the semiconductor light emitting element is disposed between the pair of base surface portions, and both surfaces of the semiconductor light emitting element are connected to the respective conductive patterns. The vehicular lamp according to claim 1 or 2, characterized in that. The vehicle lamp according to claim 1, 2, 3, or 4, wherein the conductive pattern is formed of a transparent material. The vehicular lamp according to claim 1, 2, 3, 4, or 5, wherein a flexible printed board having flexibility is used as the printed board.

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