JP2013058396A - Vehicular lamp - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vehicular lamp that can reduce a production cost by reducing the number of components and moreover improve light emission efficiency of light emitted from a semiconductor light-emitting element.SOLUTION: The vehicular lamp 1 includes a semiconductor light-emitting element 4 having a light-emitting part 8 and a circuit board 6 to which the semiconductor light-emitting element 4 is electrically connected. The circuit board 6 has an opening 20 and the semiconductor light-emitting element 4 is arranged on a rear face 6b side of the circuit board 6 so that a light emission axis P of the light emitted from the light-emitting part 8 may pass through the opening 20 from the rear face 6b of the circuit board 6 toward a front face 6a.

Description

  The present invention relates to a vehicular lamp that improves the light emission efficiency of a semiconductor light emitting element while reducing the manufacturing cost.

  Some vehicular lamps emit light from a semiconductor light emitting element serving as a light source in a predetermined direction through a light guide. On the other hand, the semiconductor light emitting element may be damaged when it contacts the light guide due to vehicle vibration or the like. Therefore, in the vehicular lamp, it is desirable to dispose the semiconductor light emitting element away from the light guide from the viewpoint of preventing contact. On the other hand, when a gap is provided between the semiconductor light emitting element and the light guide, a part of the light from the light emitting element is not incident on the light guide and is lost by leaking out of the light guide from the gap. There is a fear. Patent Document 1 describes a vehicular illumination device in which a semiconductor light emitting element is arranged away from a light guide.

JP 2009-262911 A

  As shown in FIG. 2 of Patent Document 1, the vehicle lighting device 1 of Patent Document 1 positions the LED 2 and the light guide 3 by the middle plate 102 provided with the opening 104. Specifically, in the vehicle lighting device 1 of Patent Document 1, the light guide 3 is fixed to the surface of the intermediate plate 102 having the opening 104, and the surface of the substrate 21 (the surface facing the light guide 3). The substrate 21 is fixed to the back surface of the intermediate plate 102 so that the LED 2 projecting from the substrate 2 is disposed in the opening 104. As a result, the LED 2 is positioned away from the light guide 3 due to the difference between the thickness of the intermediate plate 102 and the height of the LED 2.

  However, since the vehicular lighting device 1 of Patent Document 1 uses an intermediate plate having a complicated shape, the manufacturing cost increases due to the complicated formation of the intermediate plate 102 and the increase in the number of parts of the intermediate plate 102 itself. There is a problem with that.

  In view of the above problems, the vehicular lamp of the present invention provides a vehicular lamp that has improved the light emission efficiency of light from a semiconductor light emitting element while reducing the manufacturing cost.

  In order to solve the above-mentioned problem, the vehicular lamp according to claim 1 is a vehicular lamp that includes a semiconductor light-emitting element having a light-emitting portion and a circuit board that electrically connects the semiconductor light-emitting element. The semiconductor light emitting element has an opening, and the semiconductor light emitting element is disposed on the back side of the circuit board so that light emitted from the light emitting part passes through the opening from the back surface of the circuit board toward the front surface. did.

  (Function) In the vehicular lamp according to the first aspect, an opening is provided in the circuit board itself, and the semiconductor light emitting element is provided on the back side of the circuit board. Therefore, an optical member such as a light guide can be directly fixed to the front surface of the circuit board even if the intermediate plate as in the prior art is omitted and the number of components is reduced. In addition, light from the light emitting element is emitted in a predetermined direction from the back surface to the front surface of the opening.

  A second aspect of the present invention is the vehicular lamp according to the first aspect, wherein an optical member that introduces light that has passed through the opening is arranged on the surface side of the circuit board.

  (Operation) In the vehicular lamp according to the second aspect of the present invention, since the optical member is provided on the surface side of the substrate, the light of the light emitting element that has passed through the opening enters the optical member without leakage.

  According to a third aspect of the present invention, in the vehicular lamp according to the first or second aspect, the circuit board is formed by further integrating a flexible base on a flexible printed board formed by integrating a conductor with a film. It was made to be formed FPC with a base.

  (Operation) In the vehicular lamp according to the third aspect of the present invention, since the circuit board has both flexibility and strength, the mounting structure to other members such as an optical member can be simply formed.

  A fourth aspect of the present invention is the vehicular lamp according to any one of the first to third aspects, wherein the peripheral wall surface of the opening is reflective.

  (Operation) In the vehicular lamp according to the fourth aspect, the light incident on the peripheral wall surface of the opening is reflected from the back side to the front side of the opening of the circuit board.

  A fifth aspect of the present invention is the vehicle lamp according to any one of the first to fourth aspects, wherein a lighting control circuit is provided on the back side of the circuit board.

  (Operation) In the vehicular lamp according to the fifth aspect, since the lighting control circuit is provided on the same surface of the semiconductor light emitting element in the circuit board, the lighting control circuit does not protrude to the surface side of the circuit board.

  According to the vehicle lamp of the first aspect, the manufacturing cost is reduced due to the reduction in the number of components, and the light emission efficiency is improved because the light from the semiconductor light emitting element is emitted in a predetermined direction through the opening.

  According to the vehicular lamp of the second aspect, the light emitted from the light emitting element is emitted through the optical member without leakage, so that the light emission efficiency is further improved.

  According to the vehicle lamp of the third aspect, the manufacturing cost is further reduced, and the durability of the circuit board mounted component is improved.

  According to the vehicle lamp of claim 4, the light emission efficiency of the light emitting element is further improved.

  According to the vehicle lamp of the fifth aspect, since the lighting control circuit does not protrude to the surface side of the circuit board, the manufacturing cost is further reduced by omitting the intermediate plate as in the prior art.

(A) The disassembled perspective view of the circuit board unit in the vehicle lamp of a 1st Example. (B) II sectional drawing of the (a) figure in the condition which assembled the circuit board unit. Sectional drawing which shows the state cut | disconnected in the same position as FIG.1 (b) in the state which assembled the vehicle lamp of 1st Example. Sectional drawing which shows the state cut | disconnected in the same position as FIG.1 (b) in the state which assembled the vehicle lamp of 2nd Example. (A) The disassembled perspective view of the vehicle lamp of 3rd Example. (B) II-II sectional drawing of the figure (a) in the condition which assembled the vehicle lamp. (A) The disassembled perspective view of the vehicle lamp of 4th Example. (B) III-III sectional drawing of the (a) figure in the condition which assembled the vehicle lamp. Sectional drawing which shows the state cut | disconnected in the same position as FIG.1 (b) in the state which decomposed | disassembled the circuit board unit in the vehicle lamp of 3rd Example.

  First, a first embodiment of a vehicular lamp according to the present invention will be described with reference to FIGS. The vehicular lamp 1 according to the first embodiment includes a circuit board unit 2 and a light guide 3 that is a transparent optical member.

  The circuit board unit 2 is formed by a semiconductor light emitting element (LED) 4, a lighting control circuit 5, and a metal base FPC 6 (a FPC with a base according to claim 3; FPC indicates a flexible printed board). The semiconductor light emitting element 4 is formed by a main body portion 7, a light emitting portion 8, a pair of power feeding portions 9, a pair of conductive wires 10, and a cap 11. Both the semiconductor light emitting portion 8 and the pair of power feeding portions 9 are provided on the surface 7 a of the main body portion 7. The pair of power supply units 9 are provided in parallel to the left and right of the light emitting unit 8 by solder lands, copper foil, or the like. The light emitting section 8 is electrically connected to a pair of power feeding sections 9 also formed of copper foil or the like by a pair of conductive wires 10 formed of copper foil or the like, and is transparent or translucent and has a substantially hemispherical dome shape. Covered from above by a cap 11 having the same. Note that the semiconductor light emitting element 4 may have a single conducting wire 10 by mounting the light emitting unit 8 on a conductive substrate such as a SiC substrate. Further, the type of the semiconductor light emitting element 4 is not limited.

  The metal base FPC 6 is formed by integrating a metal base 14 on the surface of the FPC 13. As shown in FIG. 1B, the FPC 13 is integrated by sandwiching a copper foil pattern (conductor) 15 having a circuit wiring shape between a heat conductive insulating film 16 on the front surface side and a highly reflective insulating film 17 on the back surface side. The metal base 14 is formed by a thick copper foil 18 and a heat conductive insulating film 19 integrated with the surface of the thick copper foil 18. The metal base FPC 6 is formed to a thickness of about 300 μm (reference number h1) by the total thickness of the FPC 13 and the metal base 14, and has flexibility as a whole. Further, by integrating the FPC 13 and the metal base 14, the heat dissipation of the heat generated in the FPC 13 is improved.

  The metal base FPC 6 has an opening 20 that opens from the front surface 6a to the back surface 6b and has a square cross section. The opening 20 is formed such that one side length L <b> 1 is larger than the diameter L <b> 2 of the cap 11, and the cap 11 is disposed inside the opening 20. The height h2 of the cap 11 is formed lower than the thickness (opening thickness) h1 of the metal base FPC 6. The cross-sectional shape of the opening 20 may be circular as long as the cap 11 can be inserted. In addition, the inner peripheral wall surface of the opening 20 is made reflective by performing a vapor deposition process such as silver or aluminum.

  Further, a step-shaped attachment portion 21 for attaching the semiconductor light emitting element 4 is provided on the peripheral portion on the back surface side of the opening portion 20. The attachment portion 21 is formed by removing a part of the highly reflective insulating film 17 based on the shape of the semiconductor light emitting element 4 and exposing the copper foil pattern (conductor) 15 to the back surface side.

  The semiconductor light emitting element 4 has a back surface of the metal base FPC 6 by applying or applying a double-sided tape, an adhesive, or the like to the front surface 7a of the main body portion 7 (a portion excluding a portion where the pair of power feeding portions 9 and the cap 11 are formed). It is affixed on the attachment part 21 provided in the 6b side. As shown in FIG. 2, the semiconductor light emitting device 4 includes a light emitting portion 8 and a cap 11 disposed inside the opening 20 of the metal base FPC 6, and a pair of power feeding portions 9 having a copper foil pattern (conductor) of the metal base FPC 6. 15 is fixed to the attachment portion 21 of the back surface 6b of the metal base FPC 6 so as to be connected to the FPC 15.

  A light guide 3 that is an optical member is attached to the surface 6a of the metal base FPC 6. The light guide 3 is attached to the back surface 3b without a gap by applying or applying a double-sided tape, an adhesive, or the like to the front surface 6a of the metal base FPC 6. In the vehicular lamps according to the first to third embodiments of the present application, the semiconductor light emitting element 4 and the lighting control circuit 5 are mounted on the back surface 6b of the metal base FPC 6 so that no protrusion is provided on the front surface 6a. 3 can be easily fixed to the metal base FPC 6 with a double-sided tape or the like. The light emission axis P of the light emitted from the light emitting portion 8 of the semiconductor light emitting element 4 is directly incident on the back surface 3b of the light guide 3 or is reflected by the inner peripheral wall surface of the opening 20 and then the light guide. 3 is incident on the back surface 3b of the light source 3, then passes through the light guide 3 and exits from the front surface 3a in a predetermined forward direction.

  First, a second embodiment of the vehicular lamp according to the present invention will be described with reference to FIG. The vehicular lamp 30 of the second embodiment has the same configuration as the vehicular lamp 1 of the first embodiment, except that the optical member is changed from the light guide 3 of the first embodiment to the transparent lens 31. Similarly to the light guide 3 of the first embodiment, the lens 31 has a back surface 31b attached to the front surface 6a by applying or applying a double-sided tape, an adhesive, or the like to the front surface 6a of the metal base FPC 6.

  The lens 31 is continuous to the tip of the second convex curved surface 31d, which is a first convex curved surface 31c directly facing the light emitting portion 8, and a plurality of second convex curved surfaces 31d on the front surface side continuous to the left and right of the first convex curved surface 31c. And a horizontal surface 31e to be provided. Further, the lens 31 is provided with a plurality of back-side convex curved surfaces 31f that are continuous with the back surface 31b and have tips that are continuous with the horizontal surface 31e. Light (P 1, P 2) emitted from the light emitting unit 8 is directly incident on the back surface of the lens 31, or is reflected by the inner peripheral wall surface of the opening 20 and then is incident on the back surface 3 b of the light guide 3. A part P1 of the light incident on the light guide 3 is transmitted through the lens 31, and is emitted in a predetermined forward direction from the first convex curved surface 31c while forming a focal point F1 in front. Further, the remaining light P2 not emitted from the first convex curved surface 31c is reflected at least once between the second convex curved surface 31d and the back-side convex curved surface 31f while passing through the lens 31, and finally from the horizontal surface 31e. The light is emitted in a predetermined forward direction.

  In the first and second embodiments, a metal base FPC, which is more desirable because it is easy to dissipate heat from the semiconductor light emitting element, is used for the circuit board. An FPC that does not have a metal base may be used for the circuit board.

  Next, the vehicle lamp 35 of the third embodiment will be described with reference to FIG. In the third embodiment and the fourth embodiment shown in FIG. 5 described later, description will be made assuming that (reference symbols Fr, Re, Le, Ri) = (front, rear, left, right) of the vehicular lamp.

  The vehicle lamp 35 of the third embodiment is different from the first embodiment and the second embodiment in which the optical member (3, 31) is fixed to the metal base FPC 6 by a sticking means such as a double-sided tape or an adhesive. An uneven lance structure is adopted as a fixing means for 36 (light guide, lens, etc.) and circuit board unit 37.

  In the circuit board unit 37 of the third embodiment, the same semiconductor light emitting element 4 and lighting control circuit 5 as those of the first embodiment are mounted on the back surface of the metal base FPC 38 having a shape different from that of the metal base FPC of the first and second embodiments. The configuration is as follows.

  The metal base FPC 38 is formed so as to have flexibility as a whole by integrating the metal base 40 on the surface of the FPC 39. Since the metal base FPC 38 has flexibility, it can be bent at an arbitrary position, and the bent shape can be maintained. The metal base FPC 38 is configured by a flat portion 41 and left and right end portions (42, 43) that are continuous to the left and right of the flat portion 41 and bent upward at a substantially right angle. The flat portion 41 is provided with an opening 44 that opens from the front surface 41a toward the back surface 41b. The inner peripheral wall surface of the opening 44 is subjected to reflection treatment by vapor deposition of silver, aluminum or the like. The semiconductor light emitting element 4 is attached to the back surface 41b of the flat portion 41 with the light emitting portion 8 and the cap 11 disposed inside the opening 44 with a double-sided tape or the like, and the lighting control circuit 5 is also connected to the back surface of the flat portion 41. 41b. The light emitting unit 8 and the lighting control circuit 5 of the semiconductor light emitting element 4 are electrically connected to a copper foil pattern (not shown) of the FPC 38 as in the first and second embodiments.

  On the other hand, left and right end portions (42, 43) of the metal base FPC 38 are respectively provided with engagement holes (45, 46) penetrating left and right, and left and right sides (47, 48) of the optical member 36 are provided with left and right engagement holes (47, 48). Protrusions (49, 50) that protrude outward and engage with the engagement holes (45, 46) of the metal base FPC 38 are provided. In the optical member 36, the protrusions (49, 50) are engaged with the engagement holes (45, 46) of the metal base FPC 38 with the rear surface 36 a of the optical member 36 being in contact with the surface 41 a of the flat portion 41. Thus, the metal base FPC 38 is fixed.

  Next, the vehicle lamp 50 of the fourth embodiment will be described with reference to FIG. In the vehicle lamp 50 of the fourth embodiment, the recesses (engagement holes 45 and 46) provided in the metal base FPC 38 in the vehicle lamp 35 of the third embodiment are optical members (light guides, lenses, etc.). 51 (engagement holes 52, 53), and convex portions (projections 49, 50) provided on the optical member 36 are provided on the metal base FPC 54 (tongue pieces 55, 56), thereby forming an uneven lance structure. In addition to the replacement, it has the same configuration as the vehicular lamp 35 of the third embodiment.

  As shown in FIG. 5, the metal base FPC 54 of the fourth embodiment includes an FPC 54 a and a metal base 54 b, and a configuration in which left and right end portions (58, 59) of the flat portion 57 are bent upward at a substantially right angle and an opening. 60. The inner peripheral wall surface of the opening 60 is subjected to a reflection process by vapor deposition of silver or aluminum. The semiconductor light emitting element 4 is attached to the back surface 57b of the flat portion 57 with the light emitting portion 8 and the cap 11 inserted into the opening 60 as in the third embodiment, and the lighting control circuit 5 is mounted.

  The tongue pieces (55, 56) provided at the left and right ends (58, 59) of the metal base FPC 54 are substantially cut off by cutting out three sides (55b to 55d, 56b to 56d) other than the upper side (55a, 56a). It is formed in a quadrangular shape and is formed into an inward convex shape by bending the lower end portions (55e, 56e) inward.

  Further, the engagement holes (52, 53) are formed in a box shape that is recessed inwardly on both the left and right surfaces (61, 62) of the optical member 51. In the optical member 51, the tongue piece portions (55, 56) of the metal base FPC 54 are engaged with the engagement holes (52, 53) of the optical member 51 in a state where the rear surface 51 a of the optical member 51 is in contact with the surface 57 a of the flat portion 57. Is fixed to the metal base FPC 54.

  In the vehicular lamps (35, 50) of the third and fourth embodiments, since no mounting parts projecting on the surfaces (38a, 54a) of the metal base FPC (38, 54) are provided, the rear surface (36a , 51a) can be fixed to the metal base FPC (38, 54) with the surface (38a, 54a) being in close contact therewith. As a result, the semiconductor light emitting element 4 can be disposed away from the optical member (36, 51) without providing a separate member between the metal base FPC (38, 54) and the optical member (36, 51), and the light emitting portion. The light emitted from 8 can enter the optical member (36, 51) without leakage.

  Next, a vehicle lamp 80 according to a fifth embodiment will be described with reference to FIG. In the vehicular lamp 60 of the fifth embodiment, the metal base FPC 61 is formed by integrating the metal base 63 on the back surface of the FPC 62, contrary to the metal base FPC 6 of the first embodiment.

  The metal base FPC 61 is formed by integrating a metal base 63 on the back surface of the FPC 62. The FPC 62 is formed by a copper foil pattern (conductor) 64, a highly reflective insulating film 65 and a heat conductive insulating film 66 integrated on the front and back sides thereof, and the metal base 63 includes a thick copper foil 67 and a thick copper foil 67. It is formed by the heat conductive insulating film 68 integrated on the back surface.

  The metal base FPC 61 has an opening 69 that opens from the front surface 61a toward the back surface 61b, and has a pair of conductive portions 70 on the back surface 61b. The inner peripheral wall surface of the opening 69 is formed to have reflectivity. The pair of conductive portions 70 are provided in parallel to the left and right of the opening 69 by a soldered land or a conductive metal such as copper, and are provided at positions corresponding to the pair of power feeding portions 9. The upper surface of each conductive portion 70 is electrically connected to the copper foil pattern 64 while being insulated from the thick copper foil 67, and the lower surface 70 a of the conductive portion 70 is flush with the back surface 61 b of the metal base FPC 61. Arranged and exposed downward.

  In the semiconductor light emitting device 4, the front surface 7 a of the main body 7 is attached to the back surface 61 b of the metal base FPC 61 with a double-sided tape, an adhesive, or the like. The semiconductor light emitting element 4 has a light emitting portion 8 and a cap 11 disposed inside the opening 69 of the metal base FPC 61 and a pair of power feeding portions 9 connected to the pair of conductive portions 70, respectively. It is fixed to 61b. The lighting control circuit 5 is mounted on the back surface 6 b of the metal base FPC 61 and is electrically connected to the copper foil pattern 15 through the conductive portion 71.

  The FPC with a base according to claim 3 does not integrate a metal base on the surface of the FPC (13, 39, 54a, 62) like the metal base FPC (6, 38, 54, 61). , FPC (13, 39, 54a, 62) may be formed by integrating a resin having a certain strength, flexibility and high heat dissipation on the surface of FPC (13, 39, 54a, 62).

  The height of the cap 11 may be higher than the thickness of the metal base FPC (38, 54). However, in that case, a concave relief portion is provided on the rear surface (36a, 51a) of the optical member (36, 51) so that the cap 11 does not contact. Moreover, the fixing method of the optical member and the metal base FPC in each embodiment is not limited to the pasting type or the uneven lance type.

1, 30, 35, 50, 80 Vehicle lamp 3 Light guide (optical member)
4 Semiconductor Light Emitting Element 5 Lighting Control Circuit 6, 38, 54, 61 Metal Base FPC (Circuit Board)
6a, 41a, 57a, 61a Front surface 6b, 41b, 57b, 61b Back surface 8 Light emitting part 13, 39, 54a, 62 FPC
14, 40, 54b, 63 Metal base 15, 64 Copper foil pattern (conductor)
16, 66 Thermal conductive insulating film 17, 65 High reflective insulating film 20, 44, 60, 69 Opening 31 Lens (optical member)
36, 51 Optical members such as light guides and lenses P, P1 Light (light emission axis)

Claims (5)

In a vehicle lamp having a semiconductor light emitting element having a light emitting portion and a circuit board for electrically connecting the semiconductor light emitting element,
The circuit board has an opening,
The vehicular lamp, wherein the semiconductor light emitting element is arranged on the back side of the circuit board so that light emitted from the light emitting part passes through the opening from the back side to the front side of the circuit board.   The vehicular lamp according to claim 1, wherein an optical member for introducing light that has passed through the opening is disposed on a surface side of the circuit board.   3. The FPC with a base according to claim 1, wherein the circuit board is an FPC with a base formed by further integrating a flexible base with a flexible printed board formed by integrating a conductor with a film. Vehicle lamps.   The vehicular lamp according to any one of claims 1 to 3, wherein a peripheral wall surface of the opening is reflective.   The vehicular lamp according to any one of claims 1 to 4, wherein a lighting control circuit is provided on the back side of the circuit board.

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