JP2013179404A5 - - Google Patents

Claims (4)

A substrate ,
A first insulating film formed before SL on the substrate,
A recess formed in a part of the first insulating film;
A first protective film formed on the side and bottom of the recess;
A second protective film covering the recess and formed on the first insulating film;
A diaphragm formed on the second protective film;
A first electrode formed on the diaphragm above the recess;
A piezoelectric layer formed to cover the first electrode;
A second electrode formed on the piezoelectric layer;
A hole penetrating the diaphragm and the second protective film to the recess ;
With
Ultrasonic array sensor in a plan view of the plate thickness direction of the substrate, before Kiana unit, characterized in that disposed between the outer periphery of the outer edge of the second electrode recess. In plan view in the thickness direction of the substrate,
2. The ultrasonic array sensor according to claim 1, wherein a plurality of the hole portions are provided, are arranged at the same distance from the center of the concave portion, and are point-symmetrical from the center of the concave portion. Forming a first insulating film on the substrate;
Removing a part of the first insulating film and forming a plurality of recesses in the first insulating film;
Forming a first protective film that is not etched with vapor-phase hydrofluoric acid in the plurality of recesses;
Filling the plurality of recesses with a first insulating film;
Forming a second protective film that is not etched with vapor hydrofluoric acid on the first insulating film and on the first insulating film;
Forming a diaphragm on the second protective film;
Forming a plurality of piezoelectric layers on the diaphragm;
Removing a part of the second protective film and the diaphragm, and forming a hole exposing the second insulating film;
Removing the second insulating film by vapor phase hydrofluoric acid or liquid phase;
A method for producing an ultrasonic array sensor, comprising:   4. The method of manufacturing an ultrasonic array sensor according to claim 3, further comprising a step of forming a third protective film that is not etched with vapor-phase hydrofluoric acid on the side surface of the hole and the piezoelectric layer.