JP2013161774A - Method of manufacturing plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plasma display panel that has an electrode hardly broken and is high in quality and yield by suppressing formation of a sea-island structure consisting of a silver component and a glass component.SOLUTION: A method of manufacturing a plasma display panel is a method of manufacturing a plasma display panel in which a front plate and a back plate having an address electrode, an insulator layer, and a partition wall are arranged opposite each other and the front plate and back plate are sealed, and includes a process of burning the address electrode, insulator layer, and partition wall in one process, a displacement of a kiln per unit area of the back plate for burning per unit time in the burning process being 21,000-28,000 [(NL/min)/(m/min)].

Description

  The present invention relates to a method for manufacturing a plasma display panel known as a display device.

  In recent years, expectations for large screens and wall-mounted televisions are increasing as interactive information terminals, and there are many display devices such as liquid crystal display panels, field emission displays, and electroluminescence displays. Among these display devices, the plasma display panel (hereinafter referred to as “PDP”) is a self-luminous and beautiful image display, and is easy to enlarge. Development for higher definition and larger screen is underway.

  The PDP has a front plate on which components such as a display electrode, a dielectric layer, and a protective layer made of MgO are formed, and a back plate on which components such as electrodes, partition walls, an insulator layer, and a phosphor layer are formed. -G and B are arranged facing each other so as to form minute discharge cells (hereinafter simply referred to as cells), and the periphery is sealed with a sealing layer. A discharge gas obtained by mixing neon (Ne), xenon (Xe), or the like is sealed in the cell at a predetermined pressure.

  Conventionally, as a cell forming method of a back plate, there is a method of simultaneously baking an address electrode, an insulator layer and a partition layer after forming a pattern by exposing and developing a film formed by a screen printing method or a coat coating method. It has been proposed (see, for example, Patent Document 1).

JP 2001-236896 A

  However, when the electrode film thickness decreases, the silver component and the glass component contained in the electrode after firing form a sea-island structure (sea structure: glass component, island structure: silver component), and the sintering of the silver component is the glass component There is a problem that an electrode disconnection occurs due to being obstructed (for example, only one glass component is connected from one to the other in the width direction of the electrode).

  The present invention has been achieved as a result of examining the solution of the problems in the above-described prior art as an object. Accordingly, an object of the present invention is to provide a high quality, high yield PDP that suppresses formation of a sea-island structure composed of a silver component and a glass component, is less likely to cause electrode disconnection.

In order to achieve the above object, a method for manufacturing a PDP according to the present invention includes a front plate and an address electrode, an insulator layer, and a back plate having a partition wall arranged opposite to each other, and the front plate and the back plate are sealed. A method of manufacturing a worn PDP, comprising the step of firing the address electrode, the insulator layer, and the partition wall in the same step, wherein the unit of the back plate is fired per unit time in the firing step. The exhaust amount of the firing furnace per area is 21000 [(NL / min) / (m ² / min)] or more and 28000 [(NL / min) / (m ² / min)] or less.

  ADVANTAGE OF THE INVENTION According to this invention, formation of the sea-island structure which consists of a silver component and a glass component can be suppressed, electrode disconnection cannot generate | occur | produce easily, and high quality and high yield PDP can be provided.

Sectional perspective view which shows schematic structure of PDP in embodiment of this invention Plan view of the PDP

  Hereinafter, a PDP according to an embodiment of the present invention will be described with reference to the drawings. First, the structure of the PDP will be described with reference to FIGS. As shown in FIG. 1, the PDP is configured by disposing a front plate 1 and a back plate 2 so as to form a discharge space therebetween. On the front plate 1, a plurality of scanning electrodes 3 and sustaining electrodes 4 constituting display electrodes are formed in parallel with each other. A dielectric layer 5 is formed so as to cover the scan electrode 3 and the sustain electrode 4, and a protective layer 6 is formed on the dielectric layer 5.

  A plurality of address electrodes 8 covered with an insulator layer 7 are provided on the back plate 2, and a grid-like partition wall 9 is provided on the insulator layer 7. A phosphor layer 10 is provided on the surface of the insulator layer 7 and on the side surfaces of the partition walls 9. The front plate 1 and the back plate 2 are arranged to face each other so that the scan electrodes 3 and the sustain electrodes 4 and the address electrodes 8 cross each other. In the discharge space formed therebetween, for example, neon And a mixed gas of xenon. Note that the structure of the PDP is not limited to that described above, and for example, a structure having stripe-shaped partition walls may be used.

  A method for manufacturing the above PDP will be described below. First, a photosensitive paste for electrode formation is formed on the front plate 1 by a screen printing method or the like. Thereafter, patterning of the display electrode is performed by performing exposure and development. After forming the pattern of the display electrode, the dielectric layer 5 is formed and baked by using a screen printing method or a coating method so as to cover it. Further, a protective layer 6 such as MgO is formed thereon by vapor deposition.

  A photosensitive paste for the address electrode 8 is formed on the back plate 2 by a screen printing method, and then the pattern of the address electrode 8 is formed by exposure and development. This is the precursor of the address electrode 8. Then, the insulator layer 7 is formed on the address electrode 8 by screen printing or coating. This is the precursor of the insulator layer 7. In order to form a grid-like or striped partition wall 9 thereon, a photosensitive paste is formed several times by a coat coating method and exposed.

  At this time, it is possible to form a structure having at least two steps depending on the number of times the paste is applied and the exposure pattern. This is the precursor of the partition wall 9.

  After pattern formation by development, baking is performed. In the embodiment of the present invention, the precursor of the address electrode 8, the precursor of the insulator layer 7, and the precursor of the partition wall 9 are baked in the same process to form respective portions. The firing process will be described later.

  After firing, the RGB phosphor layer 10 is disposed inside the partition wall 9 by a dispenser method or the like, and is dried in a high temperature atmosphere.

  The front plate 1 and the back plate 2 produced by the above method are arranged so that the film surfaces face each other, and sealing is performed. At this time, sealing is performed with a sealing material applied around the front plate 1 or the back plate 2.

  Thereafter, the substrate is evacuated while being heated from the exhaust hole arranged on the back plate 2 side, and after reaching a certain degree of vacuum, a rare gas such as xenon or neon is sealed inside the PDP. After gas filling, the exhaust pipe is sealed to complete the PDP.

  Next, the baking process of the back plate in the embodiment of the present invention will be described.

  In the firing step, the back plate on which the precursor of the address electrode 8, the precursor of the insulator layer 7, and the precursor of the partition wall 9 are arranged is subjected to a batch furnace type firing furnace or a belt type or roller type continuous type firing. Baking in a furnace. The firing atmosphere and temperature vary depending on the characteristics of the paste and the substrate, but are usually fired in air.

  In the case of a roller-type continuous firing furnace, an insulating layer formed on the address electrode is formed, and a glass substrate having a partition pattern formed on the insulating layer is divided into a plurality of layers from room temperature to the top keeping temperature. Firing is performed with a temperature profile having a temperature raising step at a temperature raising rate. Specifically, a first temperature raising step for heating from room temperature to about 350 ° C. to 430 ° C., a second temperature raising step for heating the substrate to a constant temperature after completion of the first temperature raising step, and the substrate at 450 ° C. The constant temperature step for maintaining the above constant temperature is continuously performed in this order, the temperature increase rate in the first temperature increase step is 20 ° C./min to 40 ° C./min, and the temperature increase rate in the second temperature increase step is 5 ° C. It is preferable that the holding time in the constant temperature step is 5 to 20 minutes.

  When the temperature is raised during firing, thermal decomposition of the binder component starts from about 250 ° C., and thermal decomposition is rapidly accelerated at 400 ° C. or higher. If the rate of temperature rise in the second temperature raising step exceeds 14 ° C./min, it is not preferable because peeling of the electrode due to blistering or cracking of the insulator layer may occur, and if it is less than 5 ° C./min. It is not preferable because productivity is deteriorated due to an increase in time.

  Moreover, when the temperature increase rate of a 1st temperature rising step is less than 20 degree-C / min, it will lead to the increase in baking time, and when it exceeds 40 degreeC / min, since a glass substrate may be broken, it is unpreferable. Moreover, it is preferable that the sum total of the temperature rising time of a 1st temperature rising step and a 2nd temperature rising step is 15 to 30 minutes. When it exceeds 30 minutes, productivity is deteriorated, which is not preferable. When it is less than 15 minutes, the temperature increase rate of the second temperature increase step is increased, which is not preferable. If the holding time in the constant temperature step is less than 5 minutes, it is not preferable because peeling of the electrode due to blistering or cracking of the insulator layer may occur, and if it exceeds 20 minutes, productivity is deteriorated.

  The constant temperature step is preferably set to about 450 ° C. to 520 ° C., and the temperature increase rate from the constant temperature step to the third temperature increase step for increasing the firing temperature to 520 ° C. to 600 ° C. is 5 ° C./min to 20 ° C. / It is preferable that the temperature is raised in minutes and held for 7 to 20 minutes for firing. When the temperature is lower than 520 ° C., the sintering is insufficient, and the partition wall is chipped. The temperature exceeding 600 ° C. is not preferable because the shape of the partition wall may change due to sagging.

  Furthermore, when manufacturing a PDP using the above firing method, the amount of oxygen required for the thermal decomposition of the binder component contained in the electrode layer, the insulator layer, and the partition wall layer is calculated, and the displacement is determined by determining the displacement It is possible to obtain a good film without any blistering or cracks in the insulator layer.

  However, in the prior art, when the electrode film thickness decreases, the silver component and glass component contained in the electrode after firing form a sea-island structure (sea structure: glass component, island structure: silver component), and the silver component is sintered. There has been a problem that an electrode disconnection occurs due to being obstructed by the glass component (for example, only one glass component is connected from one to the other in the width direction of the electrode).

On the other hand, as a result of studies by the inventors, the exhaust amount of the firing furnace per unit area of the back plate that is fired per unit time is 21000 [(NL / min) / (m ² / min)] or more and 28000 [ (NL / min) / (m ² / min)] It was found that the formation of the sea-island structure of the electrode can be suppressed, and the occurrence of electrode disconnection can be suppressed by setting it to (NL / min) / (m ² / min)] or less.

If it is less than 21000 [(NL / min) / (m ² / min)], the sea-island structure of the electrode is formed and electrode disconnection may occur, which is not preferable, and 28000 [(NL / min) / (m ² / min)] is not preferable because the temperature in the firing furnace decreases due to an increase in the displacement and the target temperature condition may not be maintained. More preferably, it is 23000 [(NL / min) / (m ² / min)] or more and 27500 [(NL / min) / (m ² / min)] or less.

  Next, the material of each component in the embodiment of the present invention will be described. First, the address electrode 8 will be described. The electrode paste for forming the address electrode 8 is at least 50% to 85% silver (Ag) particles and 1% to 15% glass component in a component ratio expressed by weight. It is a photosensitive paste comprising 8% to 40% of a photosensitive organic binder component containing a monomer, a photopolymerization initiator, a solvent and the like. Here, in the embodiment of the present invention, in a state where the address electrode 8 is formed, the upper composition is performed so that the volume ratio of the glass component is 5% to 40%.

The glass component does not substantially contain a lead component, and the content of each component in terms of moles, bismuth oxide (Bi ₂ O ₃ ) is 0.1% to 20%, and zinc oxide (ZnO) is 10%. % To 40%, silicon oxide (SiO ₂ ) is 10% to 40%, boron oxide (B ₂ O ₃ ) is 10% to 30%, and Ba and Ca are 1% or less.

  Then, the photosensitive paste is applied onto the back plate 2 by a printing method or the like to form an electrode paste layer. Then, a silver (Ag) electrode pattern having a width of 50 μm to 250 μm is formed on the electrode paste layer by a photolithography method or the like. The film thickness is 1 μm to 4 μm after the firing step.

  Next, the insulator layer 7 will be described. The insulator paste for forming the insulator layer is composed of 25% to 35% glass component, 25% to 35% filler, 10% to 20% binder, and 20% to 30% solvent in a component ratio expressed by weight. The compounding ratio is used. More desirably, the blending ratio is 30% to 35% glass component, 25% to 30% filler, 10% to 20% binder, and 20% to 30% solvent.

And the glass component of the insulator layer 7 does not substantially contain a lead component, and the content of each component in molar notation is as follows. Bismuth oxide (Bi ₂ O ₃ ) is 0.1% to 25%, zinc oxide (ZnO) is 10% to 30%, titanium oxide (TiO ₂ ) is 0.1% to 25%, and tungsten oxide (WO ₃ ), Mn, Sb and Ba are 0.1% or less.

  Such an insulator layer paste is applied on the back plate 2 and the address electrode 8 by a die coating method or the like, and is formed through a drying process. The film thickness is 8 μm to 15 μm after the firing step.

  Next, the partition wall 9 will be described. The barrier rib paste for forming the barrier rib 9 is as follows. As described above, the partition wall 9 is composed of a partition upper layer and a partition lower layer. In the partition paste used for the partition lower layer, the blending ratio expressed by weight is 30% to 70% glass component, 2% to 30% binder component, and 20% to 50% solvent component.

  The partition paste forming the partition upper layer has a glass component ratio of 15% to 35%, a filler component of 20% to 30%, a binder component of 2% to 30%, and a solvent component of 20% to 50%. %. More desirably, the glass component was 25% to 40%, the filler was 10% to 20%, the binder component was 2% to 30%, and the solvent component was 20% to 50%.

  Using such a partition paste, a partition layer is formed by a screen printing method or a coating method. Thereafter, a precursor of the partition wall 9 is formed by a photolithography method or the like, and sintering is performed in a firing process to form the partition wall 9.

  By baking the electrode layer, the insulator layer, and the partition layer together in one time by the manufacturing method of the present invention, the back plate on which the address electrode, the insulator layer, and the partition layer are arranged as described above is used. The formation of a sea-island structure composed of components can be suppressed, and electrode disconnection hardly occurs, and a high-quality and high-yield PDP can be provided.

Next, the sealing layer 11 will be described. The sealing layer 11 is formed around the front plate 1 and the back plate 2 as shown in FIG. The sealing material paste for forming the sealing layer 11 includes a glass component containing at least bismuth oxide (Bi ₂ O ₃ ) and molybdenum oxide (MoO ₃ ) or tungsten oxide (WO ₃ ), a heat-resistant filler, Contains an organic binder component and bead material.

As the glass component, at least 20% to 50% bismuth oxide (Bi ₂ O ₃ ), 20% to 40% zinc oxide (ZnO), and boron oxide (B ₂ O ₃ ) in terms of the content of each component in terms of moles. Is 10% to 30%, and aluminum oxide (Al ₂ O ₃ ) is 0.5% to 2.5%.

  In addition, the heat-resistant filler is used to adjust the thermal expansion coefficient of the sealing material and control the flow state of the glass, but cordierite, forsterite, β-eucryptite, zircon, mullite, titanium. Barium acid, aluminum titanate, titanium oxide, molybdenum oxide, tin oxide, aluminum oxide, quartz glass and the like are particularly preferable.

As the bead material, a spherical glass bead material made of boron oxide (B ₂ O ₃ ), aluminum oxide (Al ₂ O ₃ ) or the like is used. The particle diameter of the bead material is larger than the sum of the height of the partition wall 9 and the thickness of the insulator layer 7. By setting it as such bead diameter, it can prevent that the space | interval of the front plate and back plate in a sealing part becomes narrower than the space | interval in the center part of a panel.

  Such a sealing material paste is applied to the peripheral edge of either the back plate 2 or the front plate 1 by a dispenser method or the like. Thereafter, after drying for a certain period of time, temporary baking is performed at around 400 ° C. to remove the binder component by burning. Then, both substrates are arranged so that the scanning electrode 3 and sustain electrode 4 group of the front plate 1 and the address electrode 8 of the back plate 2 are orthogonal to each other, and baked at 450 ° C. to 500 ° C. to seal the sealing material. Solidify to form the sealing layer 11.

  As described above, by using the method for producing a PDP of the present invention, it is possible to suppress formation of a sea-island structure composed of a silver component and a glass component, and to provide a high-quality, high-yield PDP that is less likely to cause electrode disconnection. Can do.

  ADVANTAGE OF THE INVENTION According to this invention, formation of the sea-island structure which consists of a silver component and a glass component can be suppressed, electrode disconnection cannot generate | occur | produce easily, and high quality and high yield PDP can be provided.

DESCRIPTION OF SYMBOLS 1 Front plate 2 Back plate 7 Insulator layer 8 Address electrode 9 Partition 10 Phosphor layer 11 Sealing layer

Claims (1)

A method of manufacturing a plasma display panel in which a front plate and an address electrode, an insulator layer, and a back plate having a partition wall are arranged to face each other, and the front plate and the back plate are sealed.
The address electrode, the insulator layer, and the partition wall are baked in the same step, and in the baking step, the exhaust amount of the baking furnace per unit area of the back plate to be baked per unit time is 21000. [(NL / min) / ( m 2 / min)] or more, 28000 [(NL / min) / (m 2 / min)] method of manufacturing a plasma display panel, wherein less.

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