JP2011249201A - Method of manufacturing plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plasma display panel in which an interval between a front plate and a back plate is kept constant and trouble of electrode disconnection can be prevented, and which has high quality and high yield.SOLUTION: The present invention relates to a method of manufacturing a plasma display panel (PDP), the PDP including: a front substrate on which a plurality of display electrodes are disposed; a back substrate in which an address electrode is disposed to cross the display electrodes and an insulator layer is disposed on the address electrode; and an adsorption layer for adsorbing the front substrate and the back substrate. The adsorption layer has beads, the address electrode contains a glass component in 5 vol% to 40 vol%, and a temperature in the adsorption step is lower than a yield point of the address electrode.

Description

  The present invention relates to a method for manufacturing a plasma display panel known as a display device.

  In recent years, expectations for large screens and wall-mounted televisions are increasing as interactive information terminals, and there are many display devices such as liquid crystal display panels, field emission displays, and electroluminescence displays. Among these display devices, the plasma display panel (hereinafter referred to as “PDP”) is a self-luminous and beautiful image display, and is easy to enlarge. Development for higher definition and larger screen is underway.

  The PDP has a front plate on which components such as a display electrode, a dielectric layer, and a protective layer made of MgO are formed, and a back plate on which components such as electrodes, partition walls, an insulator layer, and a phosphor layer are formed. -G and B are arranged facing each other so as to form minute discharge cells (hereinafter simply referred to as cells), and the periphery is sealed with a sealing layer. A discharge gas obtained by mixing neon (Ne) and xenon (Xe) or the like is sealed in the cell at a pressure of, for example, about 66500 Pa (about 500 Torr).

  Here, in the prior art, the sealing layer is formed by applying and firing a sealing material containing glass frit, but the sealing material shrinks during the sealing process during PDP manufacture, and the front plate and There was a phenomenon in which the distance from the back plate was narrower than the distance at the center of the panel. In order to prevent this phenomenon, a material in which a member having a higher melting point than the sealing material (hereinafter referred to as a bead material) is mixed as a spacer in the sealing layer has been proposed (see, for example, Patent Document 1). ).

JP 2001-236896 A

  However, in the case of a PDP having a sealing layer in which bead materials are mixed, if the sealing layer is sandwiched between the front plate and the back plate during the sealing exhaust process, the bead material in the sealing layer is not moved forward. In some cases, the electrode layers formed on the face plate and the back plate are directly or indirectly pressed to cause cracks in the electrode. In such a case, if a crack larger than the width of the electrode occurs, the electrode may be disconnected.

  The present invention has been made in view of such a current situation, and by using a sealing material including a bead material, it is possible to keep the distance between the front plate and the back plate constant and to prevent the problem of electrode disconnection. An object is to provide a high-quality, high-yield PDP.

  In order to solve the above-described conventional problems, a PDP manufacturing method according to the present invention includes a front substrate on which a plurality of display electrodes are arranged, an address electrode arranged so as to intersect the display electrode, and an insulator layer on the address electrode. And a manufacturing method of a PDP provided with a sealing layer for sealing the front substrate and the rear substrate, wherein the sealing layer includes a bead material, and the address electrode has a volume ratio. 5 to 40% of the glass component, and the temperature of the sealing step is lower than the yield point of the address electrode. Here, it is desirable that a sealing layer is formed on the address electrode and the insulator layer.

  As described above, according to the present invention, it is possible to provide a high-quality and high-yield PDP by keeping the distance between the front plate and the rear plate constant and preventing the problem of electrode disconnection.

Sectional perspective view which shows schematic structure of PDP in embodiment of this invention Plan view of the PDP Sectional view of the PDP sealing part

  Hereinafter, a PDP according to an embodiment of the present invention will be described with reference to the drawings. First, the structure of the PDP will be described with reference to FIG. As shown in FIG. 1, the PDP is configured by arranging a glass front substrate 1 and a rear substrate 2 so as to face each other so as to form a discharge space therebetween. On the front substrate 1, a plurality of scanning electrodes 3 and sustaining electrodes 4 constituting display electrodes are formed in parallel with each other. A dielectric layer 5 is formed so as to cover the scan electrode 3 and the sustain electrode 4, and a protective layer 6 is formed on the dielectric layer 5.

  A plurality of address electrodes 8 covered with an insulator layer 7 are provided on the back substrate 2, and a grid-like partition wall 9 is provided on the insulator layer 7. A phosphor layer 10 is provided on the surface of the insulator layer 7 and on the side surfaces of the partition walls 9. The front substrate 1 and the rear substrate 2 are arranged to face each other so that the scan electrodes 3 and the sustain electrodes 4 and the address electrodes 8 cross each other. In the discharge space formed therebetween, for example, neon And a mixed gas of xenon. Note that the structure of the PDP is not limited to that described above, and for example, a structure having stripe-shaped partition walls may be used.

  A method for manufacturing the above PDP will be described below. First, a photosensitive paste for electrode formation is formed on the front substrate 1 by a screen printing method or the like. Thereafter, patterning of the display electrode is performed by performing exposure and development. After forming the pattern of the display electrode, the dielectric layer 5 is formed and baked by using a screen printing method or a coating method so as to cover it. Further, a protective layer 6 such as MgO is formed thereon by vapor deposition.

  A photosensitive paste for the address electrode 8 is formed on the back substrate 2 by a screen printing method, and then the pattern of the address electrode 8 is formed by exposure and development. Then, an insulator layer 7 is formed on the address electrode 8 by screen printing or coating, and a photosensitive paste is applied in several steps to form a grid or stripe-shaped partition wall 9 thereon. It is formed by the method and exposed. At this time, it is possible to form a structure having at least two steps depending on the number of times the paste is applied and the exposure pattern. After pattern formation by development, baking is performed. After firing, the RGB phosphor layer 10 is disposed inside the partition wall 9 by a dispenser method or the like, and is dried in a high temperature atmosphere.

  The front substrate 1 and the rear substrate 2 produced by the above method are arranged so that the film surfaces face each other, and sealing is performed. At this time, sealing is performed with a sealing material applied around the front substrate 1 or the back substrate 2.

  Thereafter, the substrate is evacuated while being heated from the exhaust holes arranged on the back substrate 2 side, and after reaching a certain degree of vacuum, a rare gas such as xenon or neon is sealed inside the PDP. After gas filling, the exhaust pipe is sealed to complete the PDP.

  Next, the electrode extraction part of the PDP and the formation region of the sealing layer in the embodiment of the present invention will be described. FIG. 2 is a plan view of the PDP in the embodiment of the present invention. In this way, the front substrate 1 and the rear substrate 2 are arranged to face each other, and the sealing layer 11 is formed around the common region (broken line portion in the figure). The reason why the front substrate 1 and the rear substrate 2 are different from each other in this way is that electrode terminal portions are formed at the end portions of the respective substrates. From this electrode terminal portion, a voltage for image display is applied to each electrode. In the drawing, the electrode terminal portion of the address electrode 8 is shown in the long side portion of the PDP. Thus, the sealing layer 11 is formed on each electrode. Since the electrode terminal portions of the scan electrode 3 and the sustain electrode 4 are the back surface of the front substrate 1, they are not shown in the figure.

  FIG. 3 is a cross-sectional view of the sealing portion of the PDP in the embodiment of the present invention. Here, description will be made using the electrode terminal portion of the address electrode 8. Thus, in the embodiment of the present invention, the formation region of the sealing layer 11 is formed on the insulator layer 7, the address electrode 8, and the boundary region thereof.

  The reason why the sealing layer 11 is formed on both the insulator layer 7 and the address electrode 8 as described above is as follows. For example, when the sealing layer is formed only on the insulator layer 7, a discharge gas or outside air leaks from the voids of the insulator layer 7, and the image display stops. On the contrary, when the sealing layer is formed only on the address electrode, there is a portion where the address electrode is exposed inside the PDP, which may cause an erroneous discharge at the exposed portion. For these reasons, the embodiment of the present invention is configured as described above.

  In the sealing layer 11 according to the embodiment of the present invention, a bead material 12 is mixed in addition to the sealing material. Thereby, it is possible to perform sealing while keeping the distance between the front substrate 1 and the rear substrate 2 constant.

  However, in the prior art, in the case of a PDP composed of a sealing layer in which bead materials are mixed, the bead material directly or indirectly presses the electrode layer during the sealing and exhausting process to cause cracks in the electrode. There was a problem of disconnection.

  As for the occurrence of this problem, the material in contact with the sealing layer, that is, the material of the dielectric layer and the electrode layer under the temperature condition during the sealing exhaust process is included in the sealing material other than the bead material or the bead material. Since it is softer than the filler component, it is presumed that it is pressed by another sealing layer constituting member such as a bead material and cracks and disconnections are generated in the electrode layer.

  As a countermeasure against this cause, it can be estimated that it is effective to increase the softening point of the glass component contained in the electrode layer and maintain the strength of the glass component at a high temperature.

  However, as a result of detailed analysis of the state of occurrence of problems, it has been discovered that even with electrode layers having the same softening point of the glass component, there are phenomena in which the occurrence frequency of disconnection due to the bead material is different.

  On the other hand, as a result of studies by the inventors, the occurrence frequency is different because the expansion of the entire electrode layer with respect to a constant load at the time of temperature rise is stopped even if the softening point of the glass component is the same. It was found that this was due to the different temperatures. It has also been found that this temperature can be controlled by adjusting the volume ratio concentration of the glass component in the electrode formed on the substrate. Here, in the embodiment of the present invention, this temperature is referred to as an electrode yield point.

  That is, by controlling the yield point of this electrode, it is possible to suppress the occurrence of cracks and breaks in the bead material. From this knowledge, in the embodiment of the present invention, by setting the concentration by the volume ratio of the glass component in the electrode formed on the substrate to 5% to 40%, the yield point of the electrode is set to an optimum range, and further, The sealing process is performed at a temperature lower than the bending point. As a result, it is possible to increase the strength of the electrode layer during the sealing step and to prevent the occurrence of cracks and disconnection due to the bead material or the like.

  Here, by lowering the concentration of the glass component in the electrode, the yield point of the electrode is increased, and the range of sealing temperatures that can be carried out is good and good, but when the concentration by volume ratio is lower than 5%, The adhesion between the electrode layer and the substrate cannot be obtained, and film peeling occurs. On the other hand, when the concentration of the glass component in the electrode is increased, the adhesion between the electrode layer and the substrate can be ensured, but when the concentration by volume ratio is higher than 40%, the silver component concentration is relatively decreased, and the electrode As a result, the electrical conductivity becomes insufficient.

In the embodiment of the present invention, specifically, the bending point of the electrode is a temperature measured as follows. An electrode formed on a substrate by a compression load method using a thermomechanical analyzer TMA8310E1 manufactured by Rigaku Denki Co., Ltd. under the measurement conditions of a standard sample: SiO ₂ having a diameter of 5 mm, a heating rate: 10 ° C./min, and a load: 50 g. The surface is measured to obtain a thermal expansion curve. The curve shows the sample temperature (° C.) on the horizontal axis and the sample expansion displacement (μm) on the vertical axis. As the yield point of the electrode, the temperature at which the expansion apparently stops, that is, the slope of the curve is 100 ° C. In the above, the temperature is in the range of ± 0.00001 μm / ° C. The reason why the temperature is set to 100 ° C. or higher is to exclude a state in which the expansion at the start of the temperature increase is stopped.

  Next, the material of each component in the embodiment of the present invention will be described. First, the address electrode 8 will be described. The electrode paste for forming the address electrode 8 is at least 50% to 85% silver (Ag) particles and 1% to 15% glass component in a component ratio expressed by weight. It is a photosensitive paste comprising 8% to 40% of a photosensitive organic binder component containing a monomer, a photopolymerization initiator, a solvent and the like. Here, in the embodiment of the present invention, in a state where the address electrode 8 is formed, the upper composition is performed so that the volume ratio of the glass component is 5% to 40%.

The glass component does not substantially contain a lead component, and the content of each component in terms of moles, bismuth oxide (Bi ₂ O ₃ ) is 0.1% to 20%, and zinc oxide (ZnO) is 10%. % To 40%, silicon oxide (SiO ₂ ) is 10 to 40%, boron oxide (B ₂ O ₃ ) is 10 to 30%, and Ba and Ca are 1% or less. In addition, the address electrode layer according to the embodiment of the present invention is not limited to the use of only the glass material, but may further include one or more other glass materials. That is, the effect of the present invention can be obtained by blending at least one kind of low melting point glass frit having a transition point characteristic in the electrode layer in a component ratio expressed by volume of 5% to 40%.

  And the said photosensitive paste is apply | coated by the printing method etc. on the back substrate 2, and an electrode paste layer is formed. Then, a silver (Ag) electrode pattern having a width of 100 μm is formed on the electrode paste layer by photolithography or the like, and then baked at 560 to 600 ° C.

  Next, the insulator layer 7 will be described. The insulator paste for forming the insulator layer is composed of 25% to 35% glass component, 25% to 35% filler, 10% to 20% binder, and 20% to 30% solvent in a component ratio expressed by weight. The compounding ratio is used. More desirably, the blending ratio is 30% to 35% glass component, 25% to 30% filler, 10% to 20% binder, and 20% to 30% solvent.

And the glass component of the insulator layer 7 does not substantially contain a lead component, and the content of each component in molar notation is as follows. Bismuth oxide (Bi ₂ O ₃ ) is 0.1% to 25%, zinc oxide (ZnO) is 10% to 30%, titanium oxide (TiO ₂ ) is 0.1% to 25%, and tungsten oxide (WO ₃ ), Mn, Sb and Ba are 0.1% or less.

  Such an insulator layer paste is applied on the back substrate 2 and the address electrode 8 by a die coating method or the like, and is formed through a drying process and a baking process. In the firing step, the ultimate temperature was set to about 570 ° C to 630 ° C. The film thickness is 8 μm to 15 μm after the firing step.

  Next, the partition wall 9 will be described. The barrier rib paste for forming the barrier rib 9 is as follows. As described above, the partition wall 9 is composed of a partition upper layer and a partition lower layer. In the partition paste used for the partition lower layer, the blending ratio expressed by weight is 30% to 70% glass component, 2% to 30% binder component, and 20% to 50% solvent component.

  The partition paste forming the partition upper layer has a glass component ratio of 15% to 35%, a filler component of 20% to 30%, a binder component of 2% to 30%, and a solvent component of 20% to 50%. %. More desirably, the glass component was 25% to 40%, the filler was 10% to 20%, the binder component was 2% to 30%, and the solvent component was 20% to 50%.

  Using such a partition paste, a partition layer is formed by a screen printing method or a coating method. Thereafter, a precursor of the partition wall 9 is formed by a photolithography method or the like, and sintering is performed in a firing process to form the partition wall 9. The ultimate temperature of the firing step is about 560 ° C to 630 ° C.

  As for the firing step, either the electrode layer, the insulator layer, and the partition layer are fired for each step as described above, or the electrode layer, the insulator layer, and the partition layer are fired all at once. But you can. The ultimate temperature of the firing step at this time is 560 ° C to 630 ° C.

Next, the sealing layer 11 will be described. The sealing material paste for forming the sealing layer 11 includes a glass component containing at least bismuth oxide (Bi ₂ O ₃ ) and molybdenum oxide (MoO ₃ ) or tungsten oxide (WO ₃ ), a heat-resistant filler, An organic binder component and the bead material 12 described above are included.

As the glass component, at least 20% to 50% bismuth oxide (Bi ₂ O ₃ ), 20% to 40% zinc oxide (ZnO), and boron oxide (B ₂ O ₃ ) in terms of the content of each component in terms of moles. Is 10% to 30%, and aluminum oxide (Al ₂ O ₃ ) is 0.5% to 2.5%.

  In addition, the heat-resistant filler is used to adjust the thermal expansion coefficient of the sealing material and control the flow state of the glass, but cordierite, forsterite, β-eucryptite, zircon, mullite, titanium. Barium acid, aluminum titanate, titanium oxide, molybdenum oxide, tin oxide, aluminum oxide, quartz glass and the like are particularly preferable.

The bead material 12 is a spherical glass bead material made of boron oxide (B ₂ O ₃ ), aluminum oxide (Al ₂ O ₃ ), or the like. The particle diameter of the bead material is larger than the sum of the height of the partition wall 9 and the thickness of the insulator layer 7. Specifically, the form is as shown in FIG. By setting it as such bead diameter, it can prevent that the space | interval of the front plate and back plate in a sealing part becomes narrower than the space | interval in the center part of a panel.

  Such a sealing material paste is applied to the periphery of either the back substrate 2 or the front substrate 1 by a dispenser method or the like. Thereafter, after drying for a certain period of time, provisional baking is performed at around 400 ° C., and the organic binder component is removed by burning. Then, both substrates are arranged so that the scanning electrode 3 and sustain electrode 4 group of the front substrate 1 and the address electrode 8 of the rear substrate 2 are orthogonal to each other, and baked at 450 ° C. to 500 ° C. to seal the sealing material. Solidify to form the sealing layer 11.

  As described above, the PDP having the electrode layer and the sealing layer of the present invention can provide a high quality and high yield PDP.

  According to the PDP of the present invention, it is possible to keep the distance between the front plate and the back plate constant, prevent the problem of electrode disconnection, and provide a high quality and high yield PDP.

DESCRIPTION OF SYMBOLS 1 Front substrate 2 Back substrate 7 Insulator layer 8 Address electrode 9 Partition 10 Phosphor layer 11 Sealing layer 12 Bead material

Claims (2)

A front substrate on which a plurality of display electrodes are arranged, a rear substrate on which address electrodes are arranged so as to intersect the display electrodes and an insulating layer is arranged on the address electrodes, and the front substrate and the rear substrate are sealed. A method of manufacturing a plasma display panel provided with a sealing layer, wherein the sealing layer includes a bead material, the address electrode contains a glass component having a volume ratio of 5% to 40%, and the sealing A method of manufacturing a plasma display panel, wherein a temperature of the attaching process is lower than a yield point of the address electrode. The method for manufacturing a plasma display panel according to claim 1, wherein the sealing layer is formed on the address electrode and the insulator layer.

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