JP2011150795A - Plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plasma display panel of high quality and high yield which can keep a constant spacing between a front panel and a back panel, and can prevent defects due to breaking of an electrode wire. <P>SOLUTION: The plasma display panel includes the front substrate arranging a plurality of display electrodes, the back substrate with address electrodes arranged to cross the display electrodes and with an insulating layer arranged on the address electrodes, and a sealing layer sealing the front substrate and the back substrate. The sealing layer includes bead material and filler. The sealing layer includes bead material and a filler, with a particle size D of the bead material of 130-180 μm, a width W of the display electrode or the address electrode of 50-70 μm, and an upper limit of the particle size d of the filler of 40-60 μm. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a plasma display panel known as a display device.

  In recent years, expectations for large screens and wall-mounted televisions have increased as interactive information terminals, and there are a number of display devices such as liquid crystal display panels, field emission displays, and electroluminescence displays. Among these display devices, the plasma display panel (hereinafter referred to as “PDP”) is a self-luminous and beautiful image display, and is easy to enlarge. Development for higher definition and larger screen is underway.

  The PDP has a front plate on which components such as a display electrode, a dielectric layer, and a protective layer made of MgO are formed, and a back plate on which components such as electrodes, partition walls, an insulator layer, and a phosphor layer are formed. -G and B are arranged facing each other so as to form minute discharge cells (hereinafter simply referred to as cells), and the periphery is sealed with a sealing layer. A discharge gas obtained by mixing neon (Ne) and xenon (Xe) or the like is sealed in the cell at a pressure of, for example, about 66500 Pa (about 500 Torr).

  Here, in the prior art, the sealing layer is formed by applying and firing a sealing material containing glass frit, but the sealing material shrinks during the sealing process during PDP manufacture, and the front plate and There was a phenomenon in which the distance from the back plate was narrower than the distance at the center of the panel. In order to prevent this phenomenon, a material in which a member having a higher melting point than the sealing material (hereinafter referred to as a bead material) is mixed as a spacer in the sealing layer has been proposed (see, for example, Patent Document 1). ).

JP 2001-236896 A

  However, in the case of a PDP having a sealing layer in which bead materials are mixed, if the sealing layer is sandwiched between the front plate and the back plate during the sealing exhaust process, the bead material in the sealing layer is not moved forward. In some cases, the electrode layers formed on the face plate and the back plate are directly or indirectly pressed to cause cracks in the electrode. In such a case, if a crack larger than the width of the electrode occurs, the electrode may be disconnected.

  The present invention has been made in view of such a current situation, and by using a sealing material including a bead material, it is possible to keep the distance between the front plate and the back plate constant and to prevent the problem of electrode disconnection. An object is to provide a high-quality, high-yield PDP.

  In order to solve the above-described conventional problems, the PDP of the present invention includes a front substrate on which a plurality of display electrodes are arranged, and a rear substrate on which address electrodes are arranged so as to intersect the display electrodes and an insulating layer is arranged on the address electrodes. And a plasma display panel provided with a sealing layer for sealing the front substrate and the rear substrate, the sealing layer having a bead material and a filler, and the particle size D of the bead material is 130 μm to 180 μm, and the display electrode Alternatively, the width W of the address electrode is 50 μm to 70 μm, and the upper limit of the particle size d of the filler is 40 μm to 60 μm. Here, it is desirable that a sealing layer is formed on the address electrode and the insulator layer.

  As described above, according to the present invention, it is possible to provide a high-quality and high-yield PDP by keeping the distance between the front plate and the rear plate constant and preventing the problem of electrode disconnection.

Sectional perspective view which shows schematic structure of PDP in embodiment of this invention Plan view of the PDP Sectional view of the PDP sealing part Sectional view with respect to longitudinal direction of address electrode of sealing part of same PDP

  Hereinafter, a PDP according to an embodiment of the present invention will be described with reference to the drawings. First, the structure of the PDP will be described with reference to FIG. As shown in FIG. 1, the PDP is configured by arranging a glass front substrate 1 and a rear substrate 2 so as to face each other so as to form a discharge space therebetween. On the front substrate 1, a plurality of scanning electrodes 3 and sustaining electrodes 4 constituting display electrodes are formed in parallel with each other. A dielectric layer 5 is formed so as to cover the scan electrode 3 and the sustain electrode 4, and a protective layer 6 is formed on the dielectric layer 5.

  A plurality of address electrodes 8 covered with an insulator layer 7 are provided on the back substrate 2, and a grid-like partition wall 9 is provided on the insulator layer 7. A phosphor layer 10 is provided on the surface of the insulator layer 7 and on the side surfaces of the partition walls 9. The front substrate 1 and the rear substrate 2 are arranged to face each other so that the scan electrodes 3 and the sustain electrodes 4 and the address electrodes 8 cross each other. In the discharge space formed therebetween, for example, neon And a mixed gas of xenon. Note that the structure of the PDP is not limited to that described above, and for example, a structure having stripe-shaped partition walls may be used.

  A method for manufacturing the above PDP will be described below. First, a photosensitive paste for electrode formation is formed on the front substrate 1 by a screen printing method or the like. Thereafter, patterning of the display electrode is performed by performing exposure and development. After forming the pattern of the display electrode, the dielectric layer 5 is formed and baked by using a screen printing method or a coating method so as to cover it. Further, a protective layer 6 such as MgO is formed thereon by vapor deposition.

  A photosensitive paste for the address electrode 8 is formed on the back substrate 2 by a screen printing method, and then the pattern of the address electrode 8 is formed by exposure and development. Then, an insulator layer 7 is formed on the address electrode 8 by screen printing or coating, and a photosensitive paste is applied in several steps to form a grid or stripe-shaped partition wall 9 thereon. It is formed by the method and exposed. At this time, it is possible to form a structure having at least two steps depending on the number of times the paste is applied and the exposure pattern. After pattern formation by development, baking is performed. After firing, the RGB phosphor layer 10 is disposed inside the partition wall 9 by a dispenser method or the like, and is dried in a high temperature atmosphere.

  The front substrate 1 and the rear substrate 2 produced by the above method are arranged so that the film surfaces face each other, and sealing is performed. At this time, sealing is performed with a sealing material applied around the front substrate 1 or the back substrate 2.

  Thereafter, the substrate is evacuated while being heated from the exhaust holes arranged on the back substrate 2 side, and after reaching a certain degree of vacuum, a rare gas such as xenon or neon is sealed inside the PDP. After gas filling, the exhaust pipe is sealed to complete the PDP.

  Next, the electrode extraction part of the PDP and the formation region of the sealing layer in the embodiment of the present invention will be described. FIG. 2 is a plan view of the PDP in the embodiment of the present invention. In this way, the front substrate 1 and the rear substrate 2 are arranged to face each other, and the sealing layer 11 is formed around the common region (broken line portion in the figure). The reason why the front substrate 1 and the rear substrate 2 are different from each other in this way is that electrode terminal portions are formed at the end portions of the respective substrates. From this electrode terminal portion, a voltage for image display is applied to each electrode. In the drawing, the electrode terminal portion of the address electrode 8 is shown in the long side portion of the PDP. Thus, the sealing layer 11 is formed on each electrode. Since the electrode terminal portions of the scan electrode 3 and the sustain electrode 4 are the back surface of the front substrate 1, they are not shown in the figure.

  FIG. 3 is a cross-sectional view of the sealing portion of the PDP in the embodiment of the present invention. Here, description will be made using the electrode terminal portion of the address electrode 8. Thus, in the embodiment of the present invention, the formation region of the sealing layer 11 is formed on the insulator layer 7, the address electrode 8, and the boundary region thereof.

  The reason why the sealing layer 11 is formed on both the insulator layer 7 and the address electrode 8 as described above is as follows. For example, when the sealing layer is formed only on the insulator layer 7, a discharge gas or outside air leaks from the voids of the insulator layer 7, and the image display stops. On the contrary, when the sealing layer is formed only on the address electrode, there is a portion where the address electrode is exposed inside the PDP, which may cause an erroneous discharge at the exposed portion. For these reasons, the embodiment of the present invention is configured as described above.

  In the sealing layer 11 according to the embodiment of the present invention, a bead material 12 is mixed in addition to the sealing material. Thereby, it is possible to perform sealing while keeping the distance between the front substrate 1 and the rear substrate 2 constant.

  However, in the prior art, in the case of a PDP composed of a sealing layer in which bead materials are mixed, the bead material directly or indirectly presses the electrode layer during the sealing and exhausting process to cause cracks in the electrode. There was a problem of disconnection.

  In particular, there is a situation in which a crack is generated in the electrode through a filler contained in the sealing layer. FIG. 4 is a view showing a state in which the electrode is cracked by the filler. This figure is a sectional view in the longitudinal direction of the address electrodes. The dotted line indicates the position of the address electrode 8 and the filler 13 that have moved by the movement of the substrate during sealing.

  As described above, when the substrate moves at the time of sealing, the bead material 12 and the filler 13 cause a crack in the address electrode.

  On the other hand, the inventors calculated the disconnection occurrence probability per address electrode using the particle diameter D of the bead material 12, the particle diameter d of the filler 13, and the width W of the address electrode 8. The disconnection occurrence probability is calculated in consideration of the probability that the bead material and filler exist on the address electrode, the moving direction, and the like.

As a result, it was estimated that the disconnection occurrence probability per address electrode in the filler particle size range of 100 μm or less in the prior art was 2.5 × 10 ⁻⁵ %.

In contrast, in the embodiment of the present invention, the particle diameter D of the bead material 12 is 130 μm to 180 μm, the width W of the address electrode 8 is 50 μm to 70 μm, and the upper limit of the particle diameter d of the filler 13 is 40 μm to 60 μm. Yes. As a result, the probability of occurrence of disconnection per address electrode can be reduced to 3.0 × 10 ⁻⁶ % or less.

  It was confirmed that the defective disconnection of the address electrode in the sealing layer forming region was significantly reduced by actually defining the particle sizes of the bead material 12 and filler 13 of the sealing layer as described above.

  Although the numerical value as the upper limit of the filler particle size is shown here, the effect of the embodiment of the present invention can be obtained if the uppermost part of the particle size distribution, that is, the integrated value d99 of the particle size distribution becomes this value.

  Next, in the embodiment of the present invention, materials of each component will be described.

  First, the address electrode 8 will be described. Photosensitive organic binder component 8 containing at least 70% by weight to 90% by weight of silver (Ag) particles, 1% by weight to 15% by weight of a glass component, and a photosensitive polymer, a photosensitive monomer, a photopolymerization initiator, a solvent, and the like. A photosensitive paste composed of 15% by weight to 15% by weight is applied by a printing method or the like to form an electrode paste layer.

The glass component of the electrode paste contains at least 20% to 50% by weight of bismuth oxide (Bi ₂ O ₃ ) so that the softening point of the binder glass exceeds 550 ° C.

  And the said photosensitive paste is apply | coated by the printing method etc. on the back substrate 2, and an electrode paste layer is formed. Then, the electrode paste layer is baked by forming a silver (Ag) electrode pattern having a predetermined width by a photolithography method or the like.

  Next, the insulator layer 7 will be described. The insulator paste for forming the insulator layer is composed of 25% to 35% glass component, 25% to 35% filler, 10% to 20% binder, and 20% to 30% solvent in a component ratio expressed by weight. The compounding ratio is used. More desirably, the blending ratio is 30% to 35% glass component, 25% to 30% filler, 10% to 20% binder, and 20% to 30% solvent.

And the glass component of the insulator layer 7 does not substantially contain a lead component, and the content of each component in molar notation is as follows. Bismuth oxide (Bi ₂ O ₃ ) is 0.1% to 25%, zinc oxide (ZnO) is 10% to 30%, titanium oxide (TiO ₂ ) is 0.1% to 25%, and tungsten oxide (WO ₃ ), Mn, Sb and Ba are 0.1% or less.

  Such an insulator layer paste is applied on the back substrate 2 and the address electrode 8 by a die coating method or the like, and is formed through a drying process and a baking process. In the firing step, the ultimate temperature was set to about 570 ° C to 630 ° C. The film thickness is 8 μm to 15 μm after the firing step.

  Next, the partition wall 9 will be described. The barrier rib paste for forming the barrier rib 9 is as follows. As described above, the partition wall 9 is composed of a partition upper layer and a partition lower layer. In the partition paste used for the partition lower layer, the blending ratio expressed by weight is 30% to 70% glass component, 2% to 30% binder component, and 20% to 50% solvent component.

  The partition paste forming the partition upper layer has a glass component ratio of 15% to 35%, a filler component of 20% to 30%, a binder component of 2% to 30%, and a solvent component of 20% to 50%. %. More desirably, the glass component was 25% to 40%, the filler was 10% to 20%, the binder component was 2% to 30%, and the solvent component was 20% to 50%.

  Using such a partition paste, a partition layer is formed by a screen printing method or a coating method. Thereafter, a precursor of the partition wall 9 is formed by a photolithography method or the like, and sintering is performed in a firing process to form the partition wall 9. The ultimate temperature of the firing step is about 560 ° C to 630 ° C.

  As for the firing step, as described above, the electrode layer, the insulator layer, and the partition layer may be fired for each step, or the electrode layer, the insulator layer, and the partition layer may be fired at once. But you can. The ultimate temperature of the firing step at this time is 560 ° C to 630 ° C.

Next, the sealing layer 11 will be described. The sealing material paste for forming the sealing layer 11 includes a glass component containing at least bismuth oxide (Bi ₂ O ₃ ) and molybdenum oxide (MoO ₃ ) or tungsten oxide (WO ₃ ), and a heat-resistant filler 13. And an organic binder component and the bead material 12 described above.

As the glass component, at least 20% to 50% bismuth oxide (Bi ₂ O ₃ ), 20% to 40% zinc oxide (ZnO), and boron oxide (B ₂ O ₃ ) in terms of the content of each component in terms of moles. Is 10% to 30%, and aluminum oxide (Al ₂ O ₃ ) is 0.5% to 2.5%.

  The heat-resistant filler 13 is used to adjust the thermal expansion coefficient of the sealing material and to control the flow state of the glass. Cordierite, forsterite, β-eucryptite, zircon, mullite Barium titanate, aluminum titanate, titanium oxide, molybdenum oxide, tin oxide, aluminum oxide, quartz glass and the like are particularly preferable.

The bead material 12 is a spherical glass bead material made of boron oxide (B ₂ O ₃ ), aluminum oxide (Al ₂ O ₃ ), or the like. The particle size of the bead material 12 and the particle size of the filler 13 are as described above.

  Such a sealing material paste is applied to the periphery of either the back substrate 2 or the front substrate 1 by a dispenser method or the like. Thereafter, after drying for a certain period of time, provisional baking is performed at around 400 ° C., and the organic binder component is removed by burning. Then, both substrates are arranged so that the scanning electrode 3 and sustain electrode 4 group of the front substrate 1 and the address electrode 8 of the rear substrate 2 are orthogonal to each other, and baked at 450 ° C. to 500 ° C. to seal the sealing material. Solidify to form the sealing layer 11.

  As described above, the PDP having the electrode layer and the sealing layer of the present invention can provide a high quality and high yield PDP.

  In the embodiment of the present invention, the width of the address electrode is defined as described above. However, this width is used only for the sealing layer forming region, and the width of the electrode terminal portion, the width of the electrode in the panel, etc. It is not necessary to use this width for the location. In particular, by making the width of the electrode terminal portion smaller than the above range, an effect of preventing a short circuit failure in the terminal portion such as migration can be expected.

  Further, in the embodiment of the present invention, the address electrode has been described as a measure against disconnection, but the effect of the present invention is also achieved by implementing the above technique for the display electrode on the front plate side.

  According to the PDP of the present invention, it is possible to keep the distance between the front plate and the back plate constant, prevent the problem of electrode disconnection, and provide a high quality and high yield PDP.

DESCRIPTION OF SYMBOLS 1 Front substrate 2 Back substrate 7 Insulator layer 8 Address electrode 9 Partition 10 Phosphor layer 11 Sealing layer 12 Bead material 13 Filler

Claims (2)

A front substrate on which a plurality of display electrodes are arranged, a rear substrate on which address electrodes are arranged so as to intersect the display electrodes and an insulating layer is arranged on the address electrodes, and the front substrate and the rear substrate are sealed. A plasma display panel provided with a sealing layer,
The sealing layer has a bead material and a filler,
The plasma is characterized in that the particle size D of the bead material is 130 μm to 180 μm, the width W of the display electrode or the address electrode is 50 μm to 70 μm, and the upper limit of the particle size d of the filler is 40 μm to 60 μm. Display panel. The plasma display panel according to claim 1, wherein the sealing layer is formed on the address electrodes and the insulator layer.

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