JP2013158919A - Laminator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lower a holding mechanism in spite of a lowering hindrance factor associated with the holding mechanism.SOLUTION: A laminator 100 is a device for performing laminate processing on a body M to be laminated. The laminator 100 includes: an upper case 10; a lower case 12 having an inner space whose upper surface is opened; a diaphragm 31 fitted to the upper case 10; a heater board 7 which has a through-hole 6 and heats the body M to be laminated; an elevation plate 35 which can be elevated and lowered; a holding mechanism 1 which is placed on the elevation plate 35, provided to penetrate the through-hole 6, and holds the body M to be laminated; an elevation mechanism which elevates and lowers the elevation plate 35; and a lowering mechanism which lower the holding mechanism 1 by applying force downward to the holding mechanism 1 when the elevation mechanism is lowered.

Description

  Embodiments described herein relate generally to a laminating apparatus, and more particularly, to a laminating apparatus suitable for manufacturing a thin plate-shaped object to be laminated such as a solar cell module.

  As a form of the solar cell, a crystalline solar cell using single crystal silicon or polycrystalline silicon and an amorphous solar cell using amorphous silicon (amorphous silicon) are known.

  However, any form of solar cell is susceptible to chemical changes and is vulnerable to physical shock. Therefore, in general, a module in which a solar cell is laminated with a laminate member such as a transparent vinyl film, tempered glass, or heat-resistant glass (hereinafter referred to as “solar cell module”) is used. In the lamination process for the solar cell module, the solar cell is sandwiched between the laminate member and the back sheet via a filler (for example, EVA (ethylene vinyl acetate) resin), and heated under vacuum to melt the filler. This is done.

  Conventionally, as a laminating apparatus for performing such a laminating process, a filler in a laminated body is melted in a laminating portion of an upper chamber having a diaphragm that is expandable downward and a lower chamber having a heater panel. There is known an apparatus for laminating a diaphragm by vacuuming the diaphragm. In such a laminating apparatus, an object to be laminated, which is a laminated body sandwiching solar cells, is placed on a heater panel. Next, vacuuming is performed for hermetically reducing the pressure in the upper chamber and the lower chamber so as to obtain a vacuum state. Next, by introducing air into the diaphragm, the object to be laminated is narrowed between the diaphragm and the heater panel. Next, the object to be laminated that has been narrowed by the heater panel is heated.

  However, in recent years, the size of the laminates has increased, and there is a tendency that laminating is simultaneously performed on a plurality of laminates in order to improve production efficiency. Therefore, the time for moving the object to be laminated on the heater panel is prolonged. As a result, the time for which the object to be laminated waits on the heater panel is also prolonged.

  When the time for which the object to be laminated waits on the heater board becomes longer, there is a problem that the object to be laminated is heated non-uniformly for a long time before laminating.

  Furthermore, if the object to be laminated is heated before laminating, the filler inside the object to be laminated may be melted before vacuuming. In this case, since bubbles are generated inside the laminate, there is a problem that the quality of the solar cell module is deteriorated.

  For such a problem, a laminating apparatus of Patent Document 1 is known. The laminating apparatus of Patent Document 1 includes a plurality of pins for raising and lowering the object to be laminated carried into the laminating unit. By the plurality of pins, the object to be laminated is separated from the heater panel until evacuation is completed.

JP-A-9-141743

  The plurality of pins of the laminating apparatus of Patent Document 1 are arranged so as to penetrate through the through holes formed in the heater panel. For example, a plurality of pins are protruded from the upper surface of the heater panel when the lower end of the pin is pushed up at once according to the raising drive of the lifting plate arranged at the lower end of the pin, and The upper end of the pin becomes almost the same height as the upper surface of the heater panel.

  However, in consideration of suppressing the decrease in the effective heating area of the heater panel or suppressing the swing of the pin, the clearance between the outer diameter of the pin and the inner diameter of the through hole of the heater panel is extremely small (for example, sufficient Of several millimeters). As a result, there are cases where a plurality of pins are stuck in the through holes and do not descend due to slight misalignment during assembly, thermal expansion of the heater panel, or dust biting. That is, the laminating apparatus of Patent Document 1 has a problem that the holding mechanism cannot be lowered when there is a factor that inhibits the lowering of the holding mechanism that holds the object to be laminated.

  The present invention has been made in view of such a viewpoint. The problem to be solved by the present invention is to enable the holding mechanism to be lowered even if there is a factor that inhibits the lowering of the holding mechanism.

  A laminating apparatus according to an embodiment of the present invention is an apparatus that performs a laminating process on an object to be laminated. The laminating apparatus includes an upper case, a lower case having an internal space with an open upper surface, a diaphragm attached to the upper case, a through hole, and a heater panel for heating the object to be laminated, An elevating plate that can be raised and lowered, a holding mechanism that is placed on the elevating plate and is inserted through the through hole, and that holds the object to be laminated; an elevating mechanism that raises and lowers the elevating plate; A lowering mechanism for lowering the holding mechanism by applying a downward force to the holding mechanism when the lifting mechanism is lowered.

  According to the present invention, the holding mechanism can be lowered even if there is a factor that inhibits the lowering of the holding mechanism.

It is a block diagram which shows the whole structure of the laminating apparatus 100 of this embodiment. It is the elements on larger scale of the laminating apparatus 100 of FIG. 1 of this embodiment. It is the elements on larger scale of the side cross section of the raising / lowering mechanism of this embodiment. It is explanatory drawing of operation | movement of the raising / lowering mechanism in the lamination process of this embodiment. It is explanatory drawing of operation | movement of the raising / lowering mechanism in the lamination process of this embodiment. It is explanatory drawing of operation | movement of the raising / lowering mechanism in the lamination process of this embodiment. It is explanatory drawing of operation | movement of the raising / lowering mechanism in the lamination process of this embodiment. It is explanatory drawing of operation | movement of the raising / lowering mechanism in the lamination process of this embodiment. It is explanatory drawing of operation | movement of the raising / lowering mechanism in the lamination process of the comparative example of this embodiment. It is explanatory drawing of operation | movement of the raising / lowering mechanism in the lamination process of the comparative example of this embodiment. It is explanatory drawing of operation | movement of the raising / lowering mechanism in the lamination process of the comparative example of this embodiment.

  The present embodiment will be described with reference to the drawings.

  The overall configuration of the laminating apparatus of this embodiment will be described. FIG. 1 is a configuration diagram showing the overall configuration of a laminating apparatus 100 of the present embodiment. FIG. 2 is a partially enlarged view of the laminating apparatus 100 of FIG. 1 of the present embodiment.

  As shown in FIG. 1, the laminating apparatus 100 is an apparatus that performs a laminating process on the object to be laminated M.

  A diaphragm 31 is attached to the upper case 10 so as to partition the lower surface of the internal space in the horizontal direction (H direction in FIG. 1). An upper chamber 13 is formed in a space surrounded by the diaphragm 31 and the inner wall surface of the upper case 10. For example, the material of the diaphragm 31 is a silicon-based material or a butyl-based material.

  An intake / exhaust port 32 is provided on the side surface or upper surface of the upper case 10 so as to communicate with the upper chamber 13. The evacuation in the upper chamber 13 and the introduction of the atmosphere into the upper chamber 13 are performed via the intake / exhaust port 32.

  The lower case 12 has an internal space whose upper surface is released. A heater panel 7 is provided in this internal space. The heater panel 7 heats the laminate M. For example, the heater panel 7 is one in which a heater is provided inside an aluminum metal plate. A plurality of through holes 6 are provided in the heater panel 7 (see FIG. 2A).

  The holding mechanism 1 is provided so as to be inserted through the through hole 6 of the heater panel 7 (see FIG. 2B). The holding mechanism 1 holds the laminated body M (for example, a solar cell module) on its upper end surface. For example, the holding mechanism 1 is a columnar metal.

  The lower end of the holding mechanism 1 is placed on the lifting plate 35. For example, the elevating plate 35 is an aluminum plate having a thickness of 25 mm. The lower surface of the central portion of the lifting plate 35 is connected to the tip of the piston rod 38 of the cylinder 37. For example, the cylinder 37 is a hydraulic cylinder.

  When the cylinder 37 operates, the piston rod 38 expands and contracts. The elevating plate 35 can be moved up and down in the V direction according to the expansion and contraction of the piston rod 38. That is, the cylinder 37 and the piston rod 38 are lifting mechanisms that lift and lower the lifting plate 35. For example, when the piston rod 38 is extended, the elevating plate 35 is raised in the V direction (that is, moved in the same direction as the arrow in the V direction), and when the piston rod 38 is shortened, the elevating plate 35 is lowered in the V direction ( That is, it moves in the direction opposite to the arrow in the V direction). The distance between the upper end surface of the holding mechanism 1 and the surface of the heater panel 7 changes according to the elevation of the elevation plate 35. When the elevating plate 35 is raised, the distance between the upper end surface of the holding mechanism 1 and the surface of the heater panel 7 becomes longer. When the elevating plate 35 is lowered, the distance between the upper end surface of the holding mechanism 1 and the surface of the heater panel 7 is shortened.

  An intake / exhaust port 39 is provided on the side surface or bottom surface of the lower case 12. When the upper case 10 and the lower case 12 are in close contact with each other, the lower chamber 14 is formed in a space surrounded by the diaphragm 31 and the inner wall surface of the lower case 12. The vacuuming in the lower chamber 14 and the introduction of the atmosphere into the lower chamber 14 are performed via the intake / exhaust port 39.

  The structure of the raising / lowering mechanism of this embodiment is demonstrated. FIG. 3 is a partially enlarged view of a side cross section of the lifting mechanism of the present embodiment.

  As shown in FIGS. 3A and 3B, the holding mechanism 1 is placed on the elevating plate 35. A lower part of the holding mechanism 1 is provided with a first descending portion 2 (for example, a convex member for the holding mechanism 1 such as a washer) by snapping the snap pin 3 into the pin groove 1A. A second lowering portion (for example, a pressing member) 4 is screwed to the lifting plate 35. The second descending portion 4 moves up and down in the V direction together with the lifting plate 35.

  Between the inner wall of the through-hole 6 and the holding mechanism 1, a straight pipe 6A having a smooth inner surface is provided. The holding mechanism 1 can be moved up and down smoothly by the straight pipe 6A. That is, the straight pipe 6 </ b> A is a lifting / lowering smoothing member that smoothens the lifting / lowering of the holding mechanism 1. Note that the straight pipe 6A can be omitted.

  The holding mechanism 1 is configured to be detachable. For example, when the holding mechanism 1 is pulled out in the V direction through the through hole 6 with a force enough to remove the snap pin 3 from the pin groove 1 </ b> A, the first lowering portion 2 can be removed and the holding mechanism 1 can be taken out. Further, a screw portion 1 </ b> B for pulling out the holding mechanism 1 from the through hole 6 is cut at the upper end of the holding mechanism 1. The user can also pull out the holding mechanism 1 through the screw portion 1B using a screw rod. Thereby, the maintenance of the holding mechanism 1 and the through hole 6 (for example, elimination of the lowering inhibition factor of the holding mechanism 1) can be easily performed.

  In other words, the first lowering portion 2, the snap pin 3, and the second lowering portion 4 form a lowering mechanism. The lowering mechanism forcibly lowers the holding mechanism 1 by applying a force downward (opposite to the arrow in the V direction) to the holding mechanism 1 when the elevating mechanism is lowered.

  The operation of the lifting mechanism of this embodiment will be described. 4-8 is explanatory drawing of operation | movement of the raising / lowering mechanism in the lamination process of this embodiment.

  When the object to be laminated M is carried into a predetermined position of the laminating apparatus 100, the cylinder 37 is operated. When the cylinder 37 is operated, the piston rod 38 is extended. When the piston rod 38 extends, the elevating plate 35 rises in the V direction (that is, moves in the same direction as the arrow in the V direction) in the direction of the broken line arrow 3a in FIG. When the elevating plate 35 is raised, the holding mechanism 1 is pushed up. When the holding mechanism 1 is pushed up, as shown in FIG. 4, the holding mechanism 1 protrudes from the heater panel 7 (hereinafter referred to as “protruding state”).

  In the protruding state, as shown in FIG. 5, the object to be laminated M is placed on the upper end of the holding mechanism 1 protruding upward from the heater panel 7 (that is, the object to be laminated M is attached to the holding mechanism 1. Held by the top). If the to-be-laminated body M is mounted, then the upper case 10 will descend as shown in FIG. When the upper case 10 is lowered until the lower end of the upper case 10 and the upper end of the lower case 12 are in close contact, the laminating apparatus 100 is in a sealed state.

  When in a sealed state, evacuation is performed in the upper chamber 13 and the lower chamber 14. For example, evacuation is performed until the pressure in the upper chamber 13 and the lower chamber 14 becomes 0.7 to 1.0 Torr.

  Next, the cylinder 37 operates. When the cylinder 37 operates, the elevating plate 35 descends in the V direction (that is, moves in the direction opposite to the arrow in the V direction) in the direction of the broken line arrow 4a in FIG. When the elevating plate 35 is lowered, as shown in FIG. 7, the second descending portion 4 is lowered in the direction of the broken arrow 7a in FIG. , Move in the direction opposite to the arrow in the V direction). At this time, even if there is a factor that inhibits the descent of the holding mechanism 1 (for example, at least one of slight positional deviation at the time of assembly, thermal expansion of the heater panel 7, and dust biting), the first descent portion 2 is forced. The holding mechanism 1 is pushed down together with the first lowering portion 2.

  Next, as shown in FIG. 8, the laminated body M held by the upper end of the holding mechanism 1 comes into contact with the upper surface of the heater panel 7 (hereinafter referred to as “contact state”).

  If it will be in a contact state, the to-be-laminated body M will be heated and an internal sealing material will be fuse | melted.

  Next, the atmosphere is introduced into the upper chamber 13 through the intake / exhaust port 32. When the atmosphere is introduced into the upper chamber 13, the diaphragm 31 expands downward (in the direction opposite to the arrow in the V direction). When the diaphragm 31 is expanded, the laminated body M is tightly sealed by the expanded diaphragm 31. Thereby, the lamination process with respect to the to-be-laminated body M is completed.

  Next, the air in the upper chamber 13 and the lower chamber 14 is discharged through the intake and exhaust ports 32 and 39 until the pressure in the laminating apparatus 100 reaches atmospheric pressure.

  When the laminating process is thus completed, the upper case 10 and the lower case 12 are separated from each other, and the object to be laminated M is carried out from the laminating apparatus 100.

  According to this embodiment, when the elevating plate 35 descends, the second descending portion 4 applies a force downward (that is, in the direction opposite to the arrow in the V direction) to the first descending portion 2 (that is, the first descending portion 4). 1) While descending part 2 is forcibly pushed down, it descends. Thereby, even if there is a lowering inhibition factor of the holding mechanism 1 in the state of FIG. 4 (that is, the state where the holding mechanism 1 protrudes from the heater panel 7), the holding mechanism 1 can be lowered.

  A comparative example of this embodiment will be described. 9-11 is explanatory drawing of operation | movement of the raising / lowering mechanism in the lamination process of the comparative example of this embodiment.

  As shown in FIG. 9, members corresponding to the first descending portion 2, the snap pin 3, and the second descending portion 4 in FIGS. 3A and 3B are not provided.

  The holding mechanism 1 ′ is placed on the lifting plate 35 ′. The holding mechanism 1 'is provided so as to penetrate the heater panel 7' through a through hole 6 'drilled in the heater panel 7'. The holding mechanism 1 'is configured to move up and down together with the lifting plate 35' when the lifting plate 35 'moves up and down.

  When the elevating plate 35 ′ is raised, the holding mechanism 1 ′ is raised together with the elevating plate 35 ′, and the upper end of the holding mechanism 1 ′ protrudes from the upper surface of the heater panel 7 ′ (projected state) (see FIG. 10). ).

  On the other hand, when there is a factor that inhibits the lowering of the holding mechanism 1 ′, the holding mechanism 1 ′ does not descend even if the lifting plate 35 ′ is lowered. As a result, the lower end of the holding mechanism 1 ′ is separated from the upper surface of the lifting plate 35 ′ (see FIG. 11).

  On the other hand, according to the present embodiment, as described above, when the elevating plate 35 is lowered, the second lowering portion 4 provided in the holding mechanism 1 is lowered while forcibly pushing down the first lowering portion 2. Therefore, even if there is a factor that inhibits the lowering of the holding mechanism 1, the holding mechanism 1 can be lowered.

  In the present embodiment, the example in which the lowering mechanism is formed by the first lowering portion 2, the snap pin 3, and the second lowering portion 4 has been described. However, the scope of the present invention is not limited to this. . For example, the lowering mechanism may be a mechanism that applies a downward force while holding the holding mechanism 1, or a mechanism that applies a downward force to a portion other than the lower end (for example, the upper end) of the holding mechanism 1. Alternatively, a mechanism that applies a downward force to the holding mechanism using non-contact means (for example, magnetic force) may be used.

  In the present embodiment, the example in which the first lowering portion 2 is a convex member for the holding mechanism 1 has been described, but the scope of the present invention is not limited to this. For example, the first lowering portion 2 is a concave member (for example, a groove dug in the side surface of the holding mechanism 1) with respect to the holding mechanism 1, and the second lowering portion 4 applies a downward force to the concave member. Also good.

  In addition, this invention is not limited to embodiment mentioned above, It deform | transforms and implements a component in the range which does not deviate from the summary. Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above-described embodiments. For example, you may delete a some component from all the components shown by embodiment mentioned above. Furthermore, constituent elements over different embodiments may be appropriately combined.

DESCRIPTION OF SYMBOLS 1 Holding mechanism 1A Pin groove 1B Screw part 2 1st descent | fall part 3 Snap pin 4 2nd descent | fall part 6 Through-hole 6A Straight pipe 7 Heater panel 10 Upper case 12 Lower case 13 Upper chamber 14 Lower chamber 31 Diaphragm 32, 39 Intake and exhaust Port 35 Elevating plate 37 Cylinder 38 Piston rod 100 Laminating device M Laminated object

Claims (6)

A laminating apparatus that performs laminating on a material to be laminated,
Upper case,
A lower case having an internal space with an open upper surface;
A diaphragm attached to the upper case;
A heater panel that has a through hole and that heats the object to be laminated;
A lifting plate that can be raised and lowered;
A holding mechanism mounted on the elevating plate, provided so as to be inserted through the through-hole, and holding the laminated body;
An elevating mechanism for elevating the elevating plate;
And a lowering mechanism for lowering the holding mechanism by applying a downward force to the holding mechanism when the lifting mechanism is lowered. The lowering mechanism is
A first descending portion provided in the holding mechanism;
The laminating apparatus according to claim 1, further comprising: a second descending portion that applies a downward force to the first descending portion.   The laminating apparatus according to claim 1, further comprising a lifting / lowering smoothing member that smoothens the lifting and lowering of the holding mechanism.   The laminating apparatus according to claim 3, wherein the elevating / smoothing member is provided between an inner wall of the through hole and the holding mechanism.   The laminating apparatus according to claim 1, wherein the holding mechanism is configured to be detachable from the through hole.   The laminating apparatus according to claim 5, wherein the holding mechanism is provided with a screw portion for pulling out the holding mechanism from the through hole.

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