JP2013154411A - Fixed abrasive grain type saw wire and method for producing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fixed abrasive grain type saw wire, the abrasive grain of which is restrained from dropping in cutting work to keep the cutting efficiency thereof and to provide a method for producing the fixed abrasive grain type saw wire.SOLUTION: When an abrasive grain is stuck to an original metal wire and a grain-stuck metal wire is plated with a metal in order to fix the abrasive grain firmly to the metal wire, the grain-stuck metal is plated while applying tension to the metal wire. The tension is set to be 5-50% of a breaking load of the metal wire. As a result, the fixed abrasive grain type saw wire, the abrasive grain of which is restrained from dropping in cutting work to keep the cutting efficiency thereof, can be produced. A steel wire is used as the metal wire and the metal, with which the grain-stuck metal wire is plated, is nickel.

Description

The present invention relates to a fixed abrasive saw wire suitable for manufacturing a wafer-like plate by slicing a hard and brittle material such as a semiconductor ingot including a silicon ingot, crystal, and sapphire, and a method for manufacturing the same.

Conventionally, a saw wire cutting operation has been used to produce a wafer-like plate by slicing a hard and brittle material such as a semiconductor ingot such as a silicon ingot, crystal, and sapphire.

The fixed abrasive type saw wire is obtained by fixing hard abrasive grains such as diamond on the surface of a metal wire by plating or the like, and is hung at a predetermined interval on a main roller of a wire saw machine which is a machine for cutting a silicon ingot etc. The object to be cut such as a silicon ingot is cut by running at high speed.

In such a fixed-abrasive type saw wire, since the abrasive grains are fixed to the wire strand in advance, the abrasive grains do not rotate during cutting, and the abrasive grains effectively grind the workpiece by running the wire. Since the material to be cut continues to be cut, the cutting performance is high and the operability is excellent. Therefore, it replaces the conventional abrasive saw wire that sprays slurry that is a mixture of conventional abrasive and special oil or aqueous agent. Is becoming mainstream.

FIG. 1 shows a schematic diagram of a wire saw machine. In the wire saw machine, the saw wire 1 supplied from the supply reel 2 is wound around the main roller 3 several times and travels at a high speed.
At this time, the saw wire 1 is in a high tension load state between the main rollers 3, and when the workpiece 5 is pressed from above, the workpiece 5 is ground and thinly sliced by the abrasive grains fixed to the surface. .
The used saw wire 1 is wound up on the discharge reel 4.

Since the saw wire is in a high tension load state at the time of cutting, the saw wire extends in the metal wire direction within the elastic region.
Therefore, a minute gap is formed between the abrasive grains and the plating, and the abrasive grains fall off during the cutting operation, and the adhesion of the abrasive grains becomes non-uniform. The surface accuracy is also reduced.

When the surface accuracy is lowered, the restoration polishing takes a long time, and when the surface cannot be repaired, the object to be cut is discarded.
Therefore, there is a demand for a saw wire that can suppress the falling of abrasive grains even when high tension is applied to the saw wire.

In order to solve this problem, Japanese Patent Application Laid-Open No. 2002-326151 discloses a technique for preventing abrasive grains from falling off. This is one in which a part of the abrasive grains is embedded in the soft plating layer by pressing the abrasive grains with a pressure roller to increase the fixing force.
However, if this wire saw is stretched during cutting, the abrasive grains may fall off.

JP 2002-326151 A

Since fixed abrasive saw wires are in a high tension load state during cutting, they are elastically deformed, creating a minute gap between the abrasive grains and the plating, and the abrasive grains fall off during the cutting operation, and the abrasive grains There is a problem in that the adhesion becomes non-uniform, so that not only the cutting efficiency is greatly reduced, but also the surface accuracy of the workpiece is reduced.

An object of the present invention is to solve such a conventional problem, and to provide a fixed abrasive saw wire that suppresses the falling of abrasive grains during cutting and maintains cutting efficiency, and a method for manufacturing the same.

That is, when metal plating is performed to attach abrasive grains to a metal wire and to fix the abrasive grains to the metal wire, the metal plating is performed while applying tension to the metal wire, and the tension is applied to the metal wire. A fixed-abrasive saw wire that is 5 to 50% of the breaking load of the wire and a method for manufacturing the same.

Preferably, the tension is 25 to 50% of the breaking load of the metal wire.

Preferably, the metal wire is a steel wire, and the fixed abrasive saw wire in which the metal of the metal plating is nickel and the manufacturing method thereof.

According to the method of the present invention, when a workpiece is cut using a fixed-abrasive saw wire, even if a high tension is applied, dropping of the abrasive is suppressed and cutting efficiency is maintained while maintaining cutting efficiency. A fixed-abrasive saw wire that does not degrade the surface accuracy can be manufactured.

FIG. 1 is a schematic view of a wire saw machine. FIG. 2 shows an example of a manufacturing process of the fixed abrasive saw wire of the present invention. FIG. 3 is a cross-sectional view schematically showing a cross section in the metal wire direction of a metal wire in which abrasive grains are temporarily attached to the metal wire of the example. FIG. 4 is an explanatory diagram of a process of performing fixing plating while applying tension to the metal wire of the example. FIG. 5 is a cross-sectional view schematically showing a cross section in the metal wire direction of a metal wire in which abrasive grains are fixed to the metal wire of the example.

Hereinafter, a preferred embodiment of the fixed abrasive saw wire of the present invention will be described together with its manufacturing method while referring to the drawings as appropriate.

The present invention relates to a fixed-abrasive saw wire and a method of manufacturing the same, and in the metal plating for applying the metal particles for attaching the abrasive particles to the metal wire and fixing the abrasive particles to the metal wire, applying the tension to the metal wire. It is characterized by giving.

In FIG. 2, an example of the manufacturing process of the fixed abrasive type saw wire of this invention is shown.
The metal wire 7 fed out from the feeding reel 6 is washed in the washing tank 8, and in the abrasive grain temporary adhesion plating tank 9,
As shown in FIG. 3, abrasive grains 15 are temporarily attached to the metal wire 7. The temporary adhesion method may be any method such as plating or adhesive.
Next, the abrasive grains are fixed in the fixed plating tank 10. Any tension may be applied at the time of fixing, and it may be applied at the time of feeding. As shown in FIG. 4, the dancer roller 11 provided on the outlet side of the fixed plating layer applies tension to the metal wire 7 in the plating layer. Metal plating may be applied.
Thereafter, the metal wire is washed and wound on the take-up reel 13.

The metal used for the metal wire is preferably a high-strength metal wire, and more preferably a steel wire that is often used industrially.
The metal wire may have a surface plated with brass in order to facilitate drawing.

The material of the abrasive grains is not limited as long as the abrasive grains are hard abrasive grains such as diamond, cemented carbide, silicon carbide and the like.

Conventionally, the tension applied during fixed plating is about 3% of the breaking load of the metal wire.
The tension applied to the metal wire is preferably 5 to 50% of the breaking load of the metal wire. If the tension is less than 5% of the breaking load, the elongation due to elastic deformation of the metal wire cannot be expected as in the conventional manufacturing method, and if it exceeds 50%, the elastic region may be exceeded and the plastic region may be reached. In addition, there is a possibility that the plating may be peeled off due to the reduction of the product.
Preferably, the tension is 25 to 50% of the breaking load.
More preferably, the tension is a value obtained by dividing by 2 the sum of the tension when winding the fixed abrasive saw wire on the take-up reel 13 during manufacture and the tension applied when cutting. For example, when manufacturing a fixed abrasive saw wire for cutting sapphire, the sum of the tension of about 2N during winding and the wire tension of about 42N during cutting of sapphire is 44N, and dividing this by 2 gives 22N. Therefore, the tension applied at the time of fixed plating is 22N.

The metal used for the fixed plating 16 is preferably a hard metal, and more preferably nickel that is inexpensive and inexpensively used industrially.

As described above, according to the method for manufacturing a fixed abrasive saw wire according to the present invention, during the fixed plating, the fixed plating is performed in a state where the metal wire extends in the metal line direction within the elastic region.
After the fixed plating, the tension applied to the metal wire is released, the metal wire returns to the length before the fixed plating, and the fixed plating is contracted.
The tension actually applied at the time of fixed plating is preferably a value obtained by dividing by 2 the sum of the tension applied when winding the fixed abrasive saw wire on the take-up reel 13 and the tension applied during cutting. When set to such a value, the stress at the time of fixed plating is equally distributed at the time of winding and cutting, so when performing slice cutting using the fixed abrasive saw wire of the present invention, high tension is applied at the time of cutting. Even if the wire is elastically deformed, there is no gap between the abrasive grains and the plating.
Therefore, the abrasive grains do not fall off, the adhesion of the abrasive grains does not become non-uniform, the cutting efficiency does not greatly decrease, and the surface accuracy of the workpiece is not reduced. It is possible to slice and cut hard and brittle materials such as quartz and sapphire in a short time.

EXAMPLES Hereinafter, although this invention is demonstrated further in detail according to an Example, this invention is not limited to a following example.

In this example, a diamond wire having an abrasive grain size of 30 to 40 μm is electroplated onto a strand (breaking load 86 N) having a wire diameter of 0.18 mm obtained by drawing a steel wire that has been subjected to brass plating. Nickel plating and temporary attachment of abrasive grains.

The steel wire is nickel-plated by electroplating while applying tension using a dancer roller to fix the abrasive grains. The nickel plating thickness is 5 μm.
In this fixed plating, plating was performed while applying a tension of 5 to 50% of the breaking load.

In order to confirm the effect of the present invention, a cutting test was performed using the fixed abrasive saw wire of the above example and the conventional fixed abrasive saw wires.
The cutting device uses a wire saw machine, and the object to be cut is sapphire.

Table 1 shows the results of the cutting test. The fixed plating tension [%] in the table indicates what percentage of the breaking load of the steel wire the tension applied during fixed plating is, and the abrasive dropout rate [%] is the fixed abrasive with a microscope. The falling rate of the abrasive grains after the cutting test measured by the grains and the falling marks is shown.

As can be seen from Table 1, the inventive product has a greatly reduced abrasive dropout rate compared to the conventional product. In particular, when a tension of 25 to 50% of the breaking load was applied, it was confirmed that the drop-off rate was as extremely low as 0%.
When a tension of 60% was applied, plating peeling occurred due to the reduction of fixed plating.

It should be understood that the forms and examples for carrying out the invention disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

DESCRIPTION OF SYMBOLS 1 Saw wire 2 Supply reel 3 Main roller 4 Discharge reel 5 Cut object 6 Feeding reel 7 Metal wire 8 Cleaning tank 9 Abrasive grain temporary adhesion plating tank 10 Adhesion plating tank 11 Dancer roller 12 Cleaning tank 13 Take-up reel 14 Temporary adhesion plating 15 Abrasive grain 16 Fixed plating

Claims (4)

A method of manufacturing a fixed abrasive saw wire in which abrasive grains are attached to a strand made of a metal wire, metal plating is performed on the metal wire, and the abrasive grains are fixed.
A method for producing a fixed abrasive saw wire, wherein the metal wire is plated while applying tension to the metal wire, and the tension is 5 to 50% of the breaking load of the metal wire. 2. The method for producing a fixed abrasive saw wire according to claim 1, wherein the tension is 25 to 50% of the breaking load of the metal wire. The method for producing a fixed abrasive saw wire according to claim 1 or 2, wherein the metal wire is a steel wire, and the metal of the metal plating is nickel. A fixed abrasive saw wire manufactured by the method according to claim 1.