JP2013152999A - Three-dimensional mounting system, cad device, mounting device, three-dimensional mounting method and program therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a three-dimensional mounting system capable of mounting a chip on a three-dimensional object of arbitrary shape in a correct position with high accuracy, without damaging the chip.SOLUTION: A three-dimensional mounting system 1 having a CAD device 10 and a mounting device 20 includes a design information storage unit 41 for storing design information on a three-dimensional object 3, an arrangement point specification unit 42 for specifying an arrangement point, an auxiliary point specification unit 43 for specifying at least two auxiliary points or three auxiliary points located on the surface of the three-dimensional object 3, a small plane setting unit 44 for setting a small plane including the auxiliary points, a perpendicular specification unit 45 for specifying the position and direction of a line passing through the small plane and perpendicular thereto, a coordinate transformation unit 53 for transforming the position and direction of the perpendicular in a virtual space into the coordinate in an actual space on the basis of the coordinate transformation formula of the virtual space of the CAD device and the actual space of the mounting device, and a head control unit 54 for controlling the position and direction of a head 28 in the mounting device 20 on the basis of the coordinate thus transformed.

Description

  The present invention relates to a three-dimensional mounting system for mounting a chip on a three-dimensional object.

  Currently, a technique for mounting a chip at an arbitrary position in a three-dimensional object having an arbitrary shape is desired. When a chip is mounted on a three-dimensional object with a technique such as flip chip, particularly in a curved surface area where the curvature is greater than 0, the chip is perpendicular (substantially perpendicular) to the curved surface of the three-dimensional object to be mounted. If this surface is not installed, there is a problem that the chip is damaged and cannot be mounted.

  As a technique for mounting components on a curved surface, for example, a technique disclosed in Patent Document 1 is disclosed. The technique shown in Patent Document 1 enables mounting of a workpiece on a surface other than a horizontal surface, such as a curved surface or a vertical surface, on a wall surface of a housing on which a circuit is formed, corresponding to high-density mounting and downsizing of a housing. The mounter is a technique related to a mounter, and the mounter is composed of a multi-axis robot, an electronic component supply device, an XY table, and a control unit that controls the entire mounter, and is arranged at the tip of the head assembly. By driving a servo motor arm, a suction nozzle holder or the like, the QFP sucked and held by the suction nozzle is mounted on the inner peripheral surface of the electronic device housing.

JP 2000-307296 A

  However, the technology disclosed in Patent Document 1 does not disclose specific technical contents such as how to position the mounting head, and does not guarantee the accuracy or accuracy of mounting.

  The present invention provides a three-dimensional mounting system and the like that can be mounted with high accuracy at an accurate position without damaging a chip even in a curved region of a three-dimensional object having an arbitrary shape.

  A three-dimensional mounting system according to the present invention includes a CAD device that manages information on a three-dimensional object having an arbitrary shape to be mounted on a chip, and a mounting device that mounts a chip on the three-dimensional object. A mounting system, wherein the CAD device stores design information storage means for storing design information of the three-dimensional object, and an arrangement indicating an arrangement point when a chip is mounted on the three-dimensional object from the design information Arrangement point specifying means for specifying point coordinates; at least two auxiliary points that are located on the surface of the three-dimensional object around the arrangement point coordinates and are not on a straight line in relation to the arrangement point; or , Auxiliary point specifying means for specifying at least three auxiliary points that are not on a straight line as auxiliary point coordinates, microplane setting means for setting a microplane including the auxiliary points, and passing through the microplane to the microplane Vertical line specifying means for specifying the position and direction of a vertical line perpendicular to the vertical line, and the mounting device uses the perpendicular line in the virtual space based on a coordinate conversion formula between the virtual space of the CAD device and the real space of the mounting device. A coordinate conversion means for converting the position and direction into coordinates in real space, and a head control means for controlling the position and direction of the head of the mounting apparatus based on the converted coordinates.

  As described above, in the three-dimensional mounting system according to the present invention, the position and direction of the perpendicular to the surface on which the chip is mounted on the virtual space of the CAD device is specified, and the specified information is converted into real space coordinates, In order to control the position and direction of the head of the mounting apparatus according to the transformed coordinates, for example, a curved surface having an arbitrary curvature on a three-dimensional object or a shape having a bent portion formed by a plurality of surfaces. Even in the area, by specifying the substantially vertical direction accurately in the virtual space, there is an effect that the chip can be mounted at an accurate position with high accuracy without being damaged.

  When two auxiliary points are specified by the auxiliary point specifying means, a minute plane may be set based on a total of three points including the two auxiliary points and the arrangement point. When three or more auxiliary points are specified by the auxiliary point specifying means, a minute plane may be set based on the auxiliary points.

  In the three-dimensional mounting system according to the present invention, the coordinate conversion means determines the rotation angle of the head when the perpendicular is the central axis based on the state of the chip installed on the head and the position of the auxiliary point. Is to be calculated.

  Thus, in the three-dimensional mounting system according to the present invention, in order to calculate the rotation angle of the head when the perpendicular is the central axis, based on the state of the chip installed on the head and the position of the auxiliary point, In addition to the position and direction of the head, it is possible to accurately control the direction of rotation, and the chip can be mounted at an accurate position with high accuracy.

  In the three-dimensional mounting system according to the present invention, the mounting device includes a marker acquisition unit that acquires a marker written on the three-dimensional object, a marker position stored in the design information, and the marker acquisition unit. Coordinate transformation formula deriving means for deriving the coordinate transformation formula from the acquired marker position is provided.

  As described above, in the three-dimensional mounting system according to the present invention, the mounting apparatus acquires the marker recorded on the three-dimensional object, and uses the marker position stored in the design information and the acquired marker position. In order to derive the coordinate conversion formula, the coordinates of the virtual space on the CAD device and the coordinates of the real space on the mounting device can be accurately obtained even when the three-dimensional object is placed in an arbitrary arrangement position or arrangement direction. Thus, the chip can be mounted at an accurate position with high accuracy.

  In the three-dimensional mounting system according to the present invention, the auxiliary point specifying means specifies points on the three-dimensional object corresponding to at least three vertex positions of the chip as auxiliary points.

  Thus, in the three-dimensional mounting system according to the present invention, in order to specify the points on the three-dimensional object corresponding to at least three vertex positions of the chip as auxiliary points, the angle of the surface of the chip with respect to the three-dimensional object Thus, it is possible to accurately set the angle of the minute plane specified by the subsequent processing, and it is possible to accurately execute the chip when it is installed vertically.

  In the three-dimensional mounting system according to the present invention, the CAD device calculates the curvature of the surface of the three-dimensional object corresponding to the position where the chip is mounted, and according to the value of the curvature, Mounting determination means for determining whether or not the chip can be mounted.

  As described above, in the three-dimensional mounting system according to the present invention, since it is determined whether the chip can be mounted according to the curvature of the surface of the three-dimensional object, it is possible to determine in advance whether the mounting is possible on the CAD device. There is an effect that the work can be efficiently performed without performing a wasteful mounting operation.

It is a figure which shows the process outline | summary of the three-dimensional mounting system which concerns on 1st Embodiment. It is a hardware block diagram of the CAD apparatus in the three-dimensional mounting system which concerns on 1st Embodiment. It is a hardware block diagram of the mounting apparatus in the three-dimensional mounting system which concerns on 1st Embodiment. It is a functional block diagram of the three-dimensional mounting system which concerns on 1st Embodiment. It is a 1st figure which shows the process of the three-dimensional mounting system which concerns on 1st Embodiment. It is a 2nd figure which shows the process of the three-dimensional mounting system which concerns on 1st Embodiment. It is a 3rd figure which shows the process of the three-dimensional mounting system which concerns on 1st Embodiment. It is a 4th figure which shows the process of the three-dimensional mounting system which concerns on 1st Embodiment. It is a 5th figure which shows the process of the three-dimensional mounting system which concerns on 1st Embodiment. It is a flowchart which shows operation | movement of the CAD apparatus in the three-dimensional mounting system which concerns on 1st Embodiment. It is a flowchart which shows operation | movement of the mounting apparatus in the three-dimensional mounting system which concerns on 1st Embodiment. It is a functional block diagram of the CAD apparatus in the three-dimensional mounting system which concerns on 2nd Embodiment. It is a figure which shows the process of the CAD apparatus in the three-dimensional mounting system which concerns on 2nd Embodiment.

  Embodiments of the present invention will be described below. Throughout the present embodiment, the same elements are denoted by the same reference numerals.

(First embodiment of the present invention)
A three-dimensional mounting system according to the present embodiment will be described with reference to FIGS. The three-dimensional mounting system according to the present embodiment includes a CAD device and a mounting device, and a chip is mounted on the mounting device using information calculated by the CAD device.

  FIG. 1 shows a processing outline of the three-dimensional mounting system 1. In the CAD apparatus 10, design information of the three-dimensional object 3 that is a target on which the chip 2 is mounted is managed. In the virtual space of the CAD device 10 (virtual space specified based on the coordinate A), the arrangement point 4 on which the chip 2 is mounted is specified, the micro plane 5 based on the arrangement point 4 is set, and the set micro plane The perpendicular line 6 is identified from 5. The mounting apparatus 20 acquires information necessary for mounting from the CAD apparatus 10 and actually mounts the chip 2 based on the information. Since the information acquired from the CAD device 10 is calculated in the virtual space, it is converted into the coordinates of the real space (the real space specified based on the coordinates B). Based on the converted coordinates, the head 28 is driven and controlled in the directions of θ, φ, and ρ, and at a predetermined position. After the position and direction are controlled, the chip 2 is actually flip-chip mounted on the three-dimensional object 3.

  2 and 3 show the hardware configuration of the CAD device 10 and the mounting device 20. FIG. 2 is a hardware configuration of the CAD device 10, and FIG. 3 is a hardware configuration of a portion related to the control function of the mounting device 20. In FIG. 2, the computer of the CAD apparatus 10 includes a CPU 11, a RAM 12, a ROM 13, a hard disk (referred to as HD) 14, a communication I / F 15, and an input / output I / F 16. The ROM 13 and the HD 14 store an operating system and various programs, which are read into the RAM 12 as necessary, and each program is executed by the CPU 11.

  The communication I / F 15 is an interface for performing communication between other devices (for example, a mounting device, a server, etc.). The input / output I / F 16 is an interface for receiving input from an input device such as a keyboard and a mouse, and outputting data to a printer, a monitor, and the like. The input / output I / F 16 can be connected to a drive corresponding to a removable disk such as a magneto-optical disk, a floppy disk, a CD-R, a DVD-R, or the like, if necessary. Each processing unit is connected via a bus and exchanges information.

  In FIG. 3, the hardware configuration related to the control function of the mounting apparatus 20 includes a CPU 21, a RAM 22, a ROM 23, a hard disk (HD) 24, a communication I / F 25, an input / output I / F 26, a camera 27, and a head 28. The CPU 21, RAM 22, ROM 23, hard disk (HD) 24, communication I / F 25, and input / output I / F 26 are the same as the configuration of the CAD device 10. The input / output I / F 26 may accept input from an input device such as a keyboard or a mouse, or may accept input from an input device such as a switch or a panel.

  The camera 27 captures an image of the three-dimensional object 3 placed on the workpiece of the mounting apparatus 20 and acquires a marker. The head 28 is flip-chip mounted at a predetermined position of the three-dimensional object 3 by setting the chip 2 at the tip.

  FIG. 4 is a functional block diagram of the CAD device 10 and the mounting device 20 constituting the three-dimensional mounting system 1 according to the present embodiment. The CAD apparatus 10 includes a design information storage unit 41 that stores design information of the three-dimensional object 3, an arrangement point specifying unit 42 that specifies the coordinates of the arrangement point 4 where the chip 2 is arranged from the design information, An auxiliary point specifying unit 43 that specifies a plurality of auxiliary points 4a, 4b,... On the surface of the three-dimensional object 3 in the peripheral region, and a micro plane setting unit that sets a micro plane 5 including the specified auxiliary points 4a and the like. 44, a perpendicular identifying unit 45 that identifies the position and direction of the perpendicular 6 that passes through the minute plane 5 and is perpendicular to the minute plane 5, and a first input / output unit 46 that inputs and outputs information between the mounting apparatus 20. Prepare.

  The mounting apparatus 20 images the three-dimensional object 3 placed on the workpiece, acquires the position of the marker written on the three-dimensional object 3 in real space, and the acquired marker position. A coordinate conversion formula deriving unit 52 for deriving a coordinate conversion formula for converting the coordinates of the virtual space into the coordinates of the real space based on the position of the marker in the virtual space stored in the design information storage unit 41; A coordinate conversion unit 53 that converts coordinates in the virtual space of the CAD device 10 into coordinates in the real space of the mounting device, a head control unit 54 that drives and controls the head 28 according to the converted coordinates, and a CAD device. 10 and a second input / output unit 56 that inputs and outputs information.

  The processing of each processing unit will be specifically described with reference to FIGS. In FIG. 5A, first, the arrangement point specifying unit 42 reads the information of the target three-dimensional object 3 from the design information stored in the design information storage unit 41, and the arrangement point 4 on which the chip 2 is mounted. Is identified. The arrangement point 4 may be, for example, (1) a point on the three-dimensional object 3 corresponding to the center point on the chip surface of the chip 2 to be mounted, or (2) any of the chips 2 to be mounted. It may be a point on the three-dimensional object 3 corresponding to that vertex, or (3) the center of gravity of the chip to be mounted. Here, it is assumed that the arrangement point 4 is specified by (1).

  When the chip 2 is mounted based on the specified arrangement point 4, a point on the three-dimensional object 3 corresponding to the position of the vertex of the chip surface of the chip 2 is specified as an auxiliary point (auxiliary points 4a to 4a). 4c). Note that at least two auxiliary points 4a to 4c may be specified. In order to set one minute plane 5, it is necessary to specify at least three points that are not on a straight line. That is, (1) In addition to the arrangement point 4, two auxiliary points (auxiliary points 4a and 4b or auxiliary points 4b and 4c) may be specified (corresponding to the case of FIG. 5B), 2) Three auxiliary points (auxiliary points 4a, 4b, 4c) may be specified without including the arrangement point 4 (corresponding to the case of FIG. 5A). Here, it is assumed that the auxiliary point is specified in (2). At this time, the positions of the auxiliary points 4a to 4c are the positions of the vertices on the chip surface of the chip 2 to be mounted, or the distance from the center on the outer periphery of the chip surface when the chip 2 is not rectangular. It is desirable that the position is specified. Furthermore, it is desirable that the auxiliary points are specified with a certain distance on the outer periphery of the chip surface of the mounted chip 2. By doing so, the minute plane 5 in the subsequent processing is accurately set.

  When three points (arrangement point 4 + 2 auxiliary points or three auxiliary points) are specified, as shown in FIG. 6, the microplane setting unit 44 sets the microplane 5 including these three points. When the minute plane 5 is set, the perpendicular identifying unit 45 identifies the direction and position of the perpendicular 6 that passes through the minute plane 5 and is perpendicular to the minute plane 5. In addition, although it is desirable that the position of the perpendicular line 6 is specified as a position passing through the arrangement point 4 or a position passing through any of the auxiliary points 4a to 4c, it is more preferable to specify the position of the arrangement point 4. Good. Here, it is assumed that the perpendicular 6 is specified at a position passing through the arrangement point 4. A part of the design information in the design information storage unit 41, the information on the arrangement point 4 specified by the arrangement point specifying unit 42, the information on the auxiliary points 4a to 4c specified by the auxiliary point specifying unit 43, and the perpendicular specifying unit 45 specified Information on the direction and position of the perpendicular is sent to the mounting apparatus 20 via the first input / output unit 46.

  The processing so far is the processing of the CAD device 10. That is, the calculation of each process is performed based on the coordinates A that specify the virtual space, and the obtained information is also based on the coordinates A.

  When the above processing is performed in the CAD device 10, the mounting device 20 actually mounts the chip 2 on the three-dimensional object 3 based on the obtained information. In this case, it is necessary to convert the coordinate A that specifies the virtual space in the CAD device 10 into the coordinate B that specifies the real space in the mounting device 20. A predetermined coordinate conversion formula for converting the coordinates may be used. In that case, it is assumed that the three-dimensional object 3 is fixed to the work of the mounting apparatus 20 in a fixed manner. However, the chip 2 is very fine, and even if it is slightly displaced, it cannot be mounted at an accurate position of the three-dimensional object 3. In other words, in order to perform accurate mounting according to the wiring pattern built in the three-dimensional object 3, strict coordinate conversion is required.

  In the present embodiment, a coordinate conversion formula is derived by reading a marker written on the three-dimensional object 3. In FIG. 7, the three-dimensional object 3 is fixedly installed on the workpiece, and the marker acquisition unit 51 acquires the image of the three-dimensional object 3 captured by the camera 27. At that time, at least two markers 71 and 72 are marked on the three-dimensional object 3, and imaging is performed so that these markers appear in the image. The positions of the markers 71 and 72 based on the coordinates B in the real space are specified from the obtained image. Then, the coordinate transformation formula deriving unit 52 calculates the virtual space from the positions of the markers 71 and 72 in the specified real space and the positions of the markers 71 and 72 in the virtual space stored in the design information acquired from the CAD device. A coordinate conversion formula for converting the coordinate A of the above into the coordinate B of the real space is derived. At this time, it is desirable that the value of z is inevitably determined by fixing the three-dimensional object 3 on the xy plane.

  When the coordinate conversion formula is derived, the coordinate conversion unit 53 converts the arrangement point 4, the auxiliary points 4a to 4c, and the direction and position of the perpendicular 6 from the virtual space to the coordinates of the real space. Then, as shown in FIG. 8A, the head controller 54 adjusts the direction of the head 28 (the angles of θ and φ) based on the converted coordinates, and the position (the central axis of the head 28 is arranged). The position is controlled by adjusting the position passing through the point 4). At this time, the rotation angle of ρ is adjusted by associating the aspect of the chip 2 set on the head 28 with the auxiliary points 4a to 4c.

  FIG. 8B is a diagram showing an aspect of the chip 2 set in the head 28. A circumferential angle (0 ° to 360 °) set in advance in the head 28 and the position of the chip 2 are set in association with each other. That is, in the case of FIG. 8B, the chip 2 is set so that the vertex of the chip 2 corresponds to the positions of 45 °, 135 °, 225 °, and 315 °, and 135 °, 225 °, and The vertices corresponding to the position of 315 ° correspond to the auxiliary points 4a to 4c. Therefore, the rotation angle of the head 28 can be adjusted and controlled.

  When the head 28 is driven and controlled, the distance between the position where the chip 2 is set and the three-dimensional object 3 is calculated, and the flip chip mounting is actually performed. Once the coordinate conversion formula is derived, a plurality of chips 2 can be continuously mounted based on the derived coordinate conversion formula as shown in FIG.

  Next, the operation of the three-dimensional mounting system according to this embodiment will be described. FIG. 10 is a flowchart showing the operation of the CAD apparatus 10, and FIG. 11 is a flowchart showing the operation of the mounting apparatus 20. First, the arrangement point specifying unit 42 specifies the arrangement point 4 on which the chip 2 is mounted based on the design information stored in the design information storage unit 41 (S11). The auxiliary point specifying unit 43 specifies two or more points on the three-dimensional object 3 corresponding to the position of the vertex of the chip 2 as auxiliary points 4a, 4b,... (S12). At this time, it is assumed that the arrangement point 4 and the two auxiliary points 4a and 4b or the three auxiliary points 4a to 4c are not on a straight line. The minute plane specifying unit 44 specifies the minute plane 5 passing through the arrangement point 4 and the two auxiliary points 4a and 4b or the three auxiliary points 4a to 4c (S13). The perpendicular identifying unit 45 identifies the position and direction of the perpendicular passing through the minute plane 5 and perpendicular to the minute plane 5 (S14). At this time, it is desirable to specify the position of the perpendicular line passing through the arrangement point 4. The 1st input / output part 46 outputs the information of the calculation result in each said process to the mounting apparatus 20 (S15).

  In the mounting apparatus 20, the second input / output unit 56 inputs information output from the CAD apparatus 10. This input timing may be any time before the coordinate transformation formula is derived. In FIG. 11, when the three-dimensional object 3 is placed on the workpiece, the camera 27 images the three-dimensional object 3 together with the markers 71 and 72 marked on the three-dimensional object. The marker acquisition unit 51 acquires the positions of the markers 71 and 72 from the captured image (S21). The coordinate conversion formula deriving unit 52 derives a coordinate conversion formula for performing coordinate conversion from the virtual space to the real space from the coordinates of the markers 71 and 72 obtained from the design information and the positions of the markers 71 and 72 obtained from the image. (S22). The coordinate conversion unit 53 converts the information obtained from the CAD device 10 into real space coordinates based on the derived coordinate conversion formula (S23). The head controller 54 controls the drive of the head 28 based on the coordinates of the converted real space (S24), flip-chip mounts the chip 2 (S25), and ends the process.

(Second embodiment of the present invention)
A three-dimensional mounting system according to the present embodiment will be described with reference to FIGS. The three-dimensional mounting system according to the present embodiment is obtained by extending the function of the CAD device 10 to the three-dimensional mounting system according to the first embodiment. In addition, in this embodiment, the description which overlaps with the said 1st Embodiment is abbreviate | omitted.

  FIG. 12 is a functional block diagram of the CAD device 10 in the three-dimensional mounting system according to the present embodiment. The difference from the CAD apparatus 10 shown in FIG. 4 is that a curvature calculation unit 47 and a mounting determination unit 48 are provided. Based on the chip placement information 31 (placement information including the placement point, placement direction, size, etc. of the chip 2) input from the user, the curvature of the surface on which the chip 2 on the three-dimensional object 3 is placed is calculated. . The mounting determination unit 48 determines the threshold value of the calculated curvature, determines whether the chip 2 can be mounted at the placement point, and displays the determination result on the display unit 32.

  FIG. 13 is a diagram illustrating processing of the mounting determination unit 48. FIG. 13A shows that the curvature of the surface on the three-dimensional object 3 on which the chip 2 is mounted exceeds a preset threshold value (a value at which the chip 2 is not damaged even if the chip 2 is mounted). In this case, a warning that the chip 2 cannot be mounted is displayed on the display unit 32. FIG. 13B shows a case where the curvature of the surface on the three-dimensional object 3 on which the chip 2 is mounted is less than a preset threshold value. In this case, the arrangement of the chip 2 is formally specified in the design information. A notification to the effect of registration is displayed on the display unit 32. In this way, it is possible to determine in advance whether or not the chip 2 can be placed at a desired position on the CAD device 10.

  The curvature calculation unit 47 obtains an average value of curvature at a point on the three-dimensional object 3 corresponding to the other end from a point on the three-dimensional object 3 corresponding to one end of the chip 2. Alternatively, the maximum value may be obtained.

  Further, the display unit 32 may be notified of a warning only when the chip 2 cannot be mounted, and may not be particularly notified when the chip 2 can be mounted.

DESCRIPTION OF SYMBOLS 1 3D mounting system 2 Chip | tip 3 3D target object 4 Arrangement | positioning point 4a, 4b, ... Auxiliary point 5 Minute plane 6 Perpendicular 10 CAD apparatus 11, 21 CPU
12,22 RAM
13,23 ROM
14,24 HD
15, 25 Communication I / F
16, 26 I / F I / F
27 Camera 28 Head 31 Chip Arrangement Information 32 Display Unit 41 Design Information Storage Unit 42 Arrangement Point Identification Unit 43 Auxiliary Point Identification Unit 44 Micro Plane Setting Unit 45 Perpendicular Line Identification Unit 46 First Input / Output Unit 47 Curvature Calculation Unit 48 Mounting Determination Unit 51 Marker acquisition unit 52 Coordinate conversion formula deriving unit 53 Coordinate conversion unit 54 Head control unit 56 Second input / output unit 71, 72 Marker

Claims (9)

A three-dimensional mounting system comprising a CAD device that manages information relating to a three-dimensional object having an arbitrary shape to be mounted with a chip, and a mounting device that mounts a chip on the three-dimensional object,
The CAD device is
Design information storage means for storing design information of the three-dimensional object;
From the design information, an arrangement point specifying means for specifying an arrangement point coordinate indicating an arrangement point when a chip is mounted on the three-dimensional object;
At least two auxiliary points that are located around the arrangement point coordinates and are located on the surface of the three-dimensional object and are not on a straight line in relation to the arrangement point, or at least three auxiliary points that are not on a straight line Auxiliary point specifying means for specifying the auxiliary point coordinates;
A minute plane setting means for setting a minute plane including the auxiliary point;
A perpendicular specifying means for specifying a position and direction of a perpendicular passing through the minute plane and perpendicular to the minute plane;
The mounting apparatus is
Coordinate conversion means for converting the position and direction of the perpendicular in the virtual space into coordinates in the real space based on a coordinate conversion formula between the virtual space of the CAD device and the real space of the mounting device;
A three-dimensional mounting system comprising: head control means for controlling the position and direction of the head of the mounting apparatus based on the transformed coordinates. The three-dimensional mounting system according to claim 1,
The three-dimensional mounting characterized in that the coordinate conversion means calculates a rotation angle of the head when the perpendicular is a central axis based on a state of a chip installed on the head and a position of the auxiliary point. system. In the three-dimensional mounting system according to claim 1 or 2,
The mounting apparatus is
Marker acquisition means for acquiring a marker written on the three-dimensional object;
A three-dimensional mounting system comprising: a coordinate conversion formula deriving unit that derives the coordinate conversion formula from a marker position stored in the design information and a marker position acquired by the marker acquisition unit. The three-dimensional mounting system according to any one of claims 1 to 3,
The three-dimensional mounting system, wherein the auxiliary point specifying unit specifies points on the three-dimensional object corresponding to at least three vertex positions of the chip as auxiliary points. The three-dimensional mounting system according to any one of claims 1 to 4,
The CAD device is
Curvature calculating means for calculating the curvature of the surface of the three-dimensional object corresponding to the position where the chip is mounted;
A three-dimensional mounting system comprising: mounting determination means for determining whether or not the chip can be mounted according to the curvature value. A CAD device that manages information about a three-dimensional object of an arbitrary shape to be mounted on a chip and provides the mounting device with information on the position and direction of the head of the mounting device when mounting the chip,
Design information storage means for storing design information of the three-dimensional object;
From the design information, an arrangement point specifying means for specifying an arrangement point coordinate indicating an arrangement point when a chip is mounted on the three-dimensional object;
Auxiliary point specifying means for specifying at least two auxiliary points located around the arrangement point coordinates and on the surface of the three-dimensional object and not on a straight line in relation to the arrangement point coordinates as auxiliary point coordinates; ,
A micro-plane setting means for setting a micro-plane including the arrangement point and the auxiliary point;
Perpendicular specifying means for specifying the position and direction of the perpendicular passing through the minute plane and perpendicular to the minute plane;
A CAD apparatus comprising: output means for outputting information of a calculation result to the mounting apparatus. A mounting apparatus that mounts the chip on the three-dimensional object based on information about the position and direction of the head when the chip is mounted on a three-dimensional object of an arbitrary shape provided by a CAD apparatus,
Coordinate conversion means for converting the position and direction of the head in the virtual space into coordinates in the real space based on a coordinate conversion formula between the virtual space of the CAD device and the real space of the mounting device;
A mounting apparatus comprising: head control means for controlling the position and direction of the head of the mounting apparatus based on the transformed coordinates. Computer
Stores design information of an arbitrary-shaped three-dimensional object to be mounted on a chip, and specifies arrangement point coordinates indicating arrangement points when a chip is mounted on the three-dimensional object from the stored design information A placement point identification step to be performed;
An auxiliary point specifying step for specifying, as auxiliary point coordinates, at least two auxiliary points that are located around the arrangement point coordinates and are located on the surface of the three-dimensional object and are not on a straight line in relation to the arrangement point coordinates; ,
A micro-plane setting step for setting a micro-plane including the arrangement point and the auxiliary point;
A perpendicular identifying step for identifying a position and direction of a perpendicular passing through the minute plane and perpendicular to the minute plane;
A coordinate conversion step of converting the position and direction of the perpendicular in the virtual space into coordinates in the real space based on a coordinate conversion formula between the virtual space and the real space;
A three-dimensional mounting method comprising: performing a head control step for controlling a position and a direction of a head of the mounting apparatus based on the converted coordinates. Computer
Design information storage means for storing design information of a three-dimensional object having an arbitrary shape to be mounted with a chip;
An arrangement point specifying means for specifying an arrangement point coordinate indicating an arrangement point when a chip is mounted on the three-dimensional object from the design information;
Auxiliary point specifying means for specifying, as auxiliary point coordinates, at least two auxiliary points that are located around the arrangement point coordinates and are located on the surface of the three-dimensional object and are not on a straight line in relation to the arrangement point coordinates;
A minute plane setting means for setting a minute plane including the arrangement point and the auxiliary point;
Perpendicular specifying means for specifying the position and direction of the perpendicular passing through the minute plane and perpendicular to the minute plane;
Coordinate conversion means for converting the position and direction of the perpendicular in the virtual space into coordinates in the real space, based on a coordinate conversion formula between the virtual space and the real space,
A three-dimensional mounting program that functions as head control means for controlling the position and direction of a head of a mounting apparatus based on the converted coordinates.