JP2013149072A - Work-piece bonding method and touch panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a work-piece bonding method having excellent reworkability without developing a color, a relatively short processing time and a relatively low cost, and a touch panel manufactured by using the method.SOLUTION: A work-piece bonding method comprises: irradiating a surface of a cover glass 11 having a hydrophilic surface and a surface of a silicone substrate 17a (for example, a PDMS) to be bonded therewith with ultraviolet light, laminating them, and pressurizing and heating the laminate to bond them together; coating a primer on an ITO electrode 13 provided on a hard coat layer 14a of a PET film 14 having a hydrophobic surface and irradiating the coated surface and the surface of the silicone substrate 17a (for example, the PDMS) to be bonded therewith with the ultraviolet light, laminating them, and pressurizing and heating the laminate to bond them together; and coating the primer on a second ITO electrode 15 on a glass substrate 16 and on the hard coat layer 14a of the PET film 14 and irradiating the coated surface and a surface of a silicone substrate 17b (for example, a PDMS) to be bonded therewith with the ultraviolet light, laminating them, and pressurizing and heating the laminate to bond them together.

Description

  The present invention relates to a touch panel, an organic EL (Organic Electro-Luminescence), an organic semiconductor, a work bonding method that can be used for manufacturing a solar battery panel, and the touch panel manufactured by this method. Further, in detail, for example, a workpiece having a hydrophobic surface and a member made of silicone, such as a resin such as PET (Polyethylene terephthalate) with a hard coat layer provided on the surface, are bonded together, for example, glass For example, ITO (oxidized) is applied to the surface of a workpiece having a hydrophilic surface, such as a workpiece having a hydrophobic surface such as a resin having a hard coat layer provided on the surface, or a member made of glass or the above resin. Indium tin oxide (Indium Tin Oxide) A transparent conductive film such as a transparent electrode, and a workpiece bonding method for bonding workpieces having a hydrophobic surface to each other with a silicone member interposed therebetween, and these It is related with the touch panel manufactured by bonding the workpiece | work of this.

  In recent years, attention has been paid to organic EL, organic semiconductors, solar cells, and the like manufactured by bonding workpieces. In addition, a touch panel is known as one manufactured by bonding workpieces. A touch panel is capable of controlling on / off of a switch, data input, and the like by touching a display on which an image is displayed with a finger or a pen, and has been rapidly spread in recent years. For example, touch panels are widely used in gadgets such as mobile phones, mobile game machines, and tablet terminals, car navigation devices, bank ATMs, ticket vending machines, and the like.

FIG. 18 is a schematic diagram of a touch panel including a video display device and a touch sensor module. As an example, a projected capacitive touch panel is shown.
As shown in FIG. 18, the touch panel 100 includes an image display device 30 such as an LCD panel and a position input device 10 disposed on the upper portion.
The position input device 10 processes the position input information from the touch sensor module 10a and the touch sensor module 10a for detecting a portion of the touch sensor surface that is touched with a finger or a pen, and the image display device based on the information. 30 includes a touch panel control unit 10b for controlling 30.

  The touch sensor module 10a includes a PET film 14 provided with a first transparent conductive film (for example, ITO electrode) pattern and a glass substrate 16 provided with a second transparent conductive film (for example, ITO electrode) pattern. The first ITO electrode 13, the PET film 14, the second ITO electrode 15, and the glass substrate 16 are laminated in this order from the top. A light-transmitting hard coat layer 14 a is provided on both surfaces of the PET film 14 to prevent the PET film 14 from being scratched. That is, the first transparent conductive film pattern is provided on the hard coat layer 14 a on the PET film 14. The hard coat layer 14a is made of, for example, an acrylate resin.

Further, a cover glass 11 is installed on the side of the PET film 14 on which the first ITO electrode 13 is applied. A black matrix 12 is formed on the periphery of the surface of the cover glass 11 on the side facing the surface of the PET film 14 on which the first ITO electrode 13 pattern is applied.
On the other hand, on the lower side of the glass substrate 16, there is a wiring layer 21 that is electrically connected to the first ITO electrode 13 and the second ITO electrode 15 and further electrically connected to the touch panel control unit 10b described later. Provided.
The wiring layer 21 is disposed on the lower side of the glass substrate 16 so as to be shielded by the black matrix 12 provided on the cover glass 11 when observed from the cover glass 11 side. That is, the wiring layer 21 is provided at a position that does not interfere with the image displayed on the touch panel.

  The touch panel control unit 10 b includes a touch panel (TP) control IC unit 22 and an FPC (flexible printed circuit board) 23, and the touch panel control IC unit 22 is provided on the FPC 23. The FPC 23 has an annular structure in which an opening is provided in the central portion so as to be shielded by the black matrix 12 provided in the cover glass 11 when observed from the cover glass 11 side. Provided at the top of the structural part. That is, the touch panel control unit 10b is provided at a position that does not interfere with an image displayed on the touch panel. As described above, the touch panel control unit 10b is electrically connected to the wiring layer 21 of the touch sensor module 10a and is also electrically connected to the image display device 30.

  The touch sensor module 10a and the touch panel control unit 10b described above are stacked on the image display device 30 including the image display panel 32 such as an LCD panel to form a touch panel. A polarizing film 31 is provided on the surface of the image display panel 32. As shown in FIG. 18, the touch panel laminated in the order of the touch sensor module 10 a, the touch panel control unit 10 b, and the image display device 30 from the top is bonded with an ultraviolet curable adhesive 24 (UV Resin). That is, the surface on which the wiring layer 21 of the glass substrate 16 of the touch sensor module 10a is provided, and the polarizing film on the surface of the touch panel control unit 10b and the image display device 30 are bonded by UV Resin. In addition, the part in which the wiring layer 21 of the glass substrate 16 of the touch sensor module 10a is not provided, the opening part of the touch panel control unit 10b, and the like are filled with UV Resin.

The touch panel detects position information such as a finger touching the cover glass 11 by the touch panel sensor module 10a, and controls the operation of the image display device 30 based on a control signal from the touch panel control unit 10b that has received the position information. To do.
As shown in FIG. 18B, the first ITO electrode 13 is an electrode pattern in which a plurality of electrode pattern units extending in the Y direction are arranged in parallel in the X direction. That is, the first ITO electrode 13 is composed of a plurality of electrode pattern units.
On the other hand, as shown in FIG. 18C, the second ITO electrode 15 is an electrode pattern in which a plurality of electrode pattern units extending in the X direction are arranged in parallel in the Y direction. That is, the second ITO electrode 15 is composed of a plurality of electrode pattern units.
A high frequency voltage is applied to each electrode pattern unit by a power source (not shown). When the finger approaches the cover glass 11 of the touch panel, the electrode pattern unit is disposed at a position close to the finger in the finger and the first ITO electrode 13, and is disposed at a position close to the finger in the finger and the second ITO electrode 15. Capacitances (capacitors) are formed between the electrode pattern units, and current flows in each unit. By detecting this change in current, the position of the finger on the cover glass 11 is detected.

That is, as apparent from FIGS. 18B and 18C, the first ITO electrode 13 detects the position of the finger in the X direction, and the second ITO electrode 15 detects the position of the finger in the Y direction. As shown in FIG. 18D, the touch panel sensor module 10a is placed on the cover glass 11 by arranging the first ITO electrodes 13 and the second ITO electrodes 15 in a matrix in the XY two-dimensional direction. The position of the touched finger in the XY two-dimensional direction is detected.
A signal related to the position of the finger in contact with the cover glass 11 detected by the touch panel sensor module 10a is transmitted to the touch panel control unit 10b.

  Here, between the PET film 14 and the cover glass 11 in the touch panel sensor module 10a (between the surface of the PET film 14 on which the first ITO electrode 13 is applied and the lower surface of the cover glass 11), or the PET film. 14 and the glass substrate 16 (between the surface of the hard coat layer 14a opposite to the first ITO electrode 13 side of the PET film 14 and the surface of the glass substrate 16 provided with the second ITO electrode 15). When the air layer is interposed, light is reflected at the interface due to the difference in refractive index at the interface between each surface and the air layer, and the display image quality of the touch panel is deteriorated such as a decrease in luminance and a decrease in contrast.

Therefore, in order to eliminate such an air layer, the air layer is replaced with a transparent material having a refractive index close to that of the cover glass 11, the PET film 14, and the glass substrate 16 in comparison with air, and the brightness of the touch panel display. It is performed to suppress a decrease in image quality and a decrease in contrast.
Specifically, the lower surface of the cover glass 11 and the first ITO electrode 13 side surface of the PET film 14 are joined by the transparent adhesive member 19 having a refractive index as described above compared with air. . Further, the surface of the hard film layer 14a opposite to the first ITO electrode 13 side of the PET film 14 and the surface of the glass substrate 16 on which the second ITO electrode 15 is provided are also bonded by the adhesive member as described above.

  As an adhesive member, for example, an optical adhesive tape (Optically Clear Adhesive Tape: hereinafter referred to as OCA tape) using a highly transparent acrylic adhesive as exemplified in Patent Document 1 and Patent Document 2, A highly transparent curable resin (Optically Clear Resin: hereinafter referred to as OCR) as exemplified in Document 3 and Patent Document 4 is used.

JP-A-9-251159 JP 2011-74308 A JP 2009-48214 A JP 2010-257208 A Japanese Patent No. 3714338 JP 2006-187730 A International Publication No. 2008/087800 JP 2008-19348 A

As described above, using the OCA tape and OCR, bonding of the lower surface of the cover glass 11 and the surface of the PET film 14 on the first ITO electrode 13 side, opposite to the first ITO electrode 13 side of the PET film 14 By performing bonding between the surface of the hard coat layer 14a on the side and the surface of the glass substrate 16 on which the second ITO electrode 15 is provided, it is possible to suppress a decrease in luminance and a decrease in contrast of the touch panel display. .
However, when using an OCA tape or OCR, it is necessary to consider the following problems and problems.

In the case of an OCA tape, the reworkability is poor because the adhesive strength is strong. That is, since it is difficult to peel it off and use it again, a high bonding accuracy is required when using the OCA tape.
In addition, since the OCA tape is hard, it is affixed when there is a step structure on the surface such as the surface of the PET film 14 on the first ITO electrode 13 side or the surface of the glass substrate 16 on which the second ITO electrode 15 is provided. Air bubbles are likely to enter the stepped portion.
Furthermore, as described above, the OCA tape has poor reworkability, and bubbles are likely to be mixed in the stepped portion of the surface, so that the pasting process is difficult. Therefore, it is difficult to use an OCA tape in the case of an object to be joined whose joining surface area is large. In addition, OCA tape is relatively expensive.

  On the other hand, joining by OCR is performed as follows. That is, OCR is applied to at least one joint surface of two workpieces, the two workpieces are overlapped, and the OCR is cured by heating or ultraviolet (UV) irradiation to join the two workpieces. Here, since OCR generally has a high viscosity, it is difficult to uniformly apply it to the joint surface. Therefore, for example, the problem that the bonding surface of the cover glass 11 and the bonding surface of the PET film 14 are bonded in a non-parallel state may occur.

  In addition, OCR has a low heat resistant temperature, and in the case of ultraviolet (UV) curable OCR, it is necessary to consider the influence of the temperature rise of OCR during UV irradiation. That is, if the distance between the UV light source 40 and the OCR bonding surface is too short, the OCR is heated to a temperature higher than the heat resistance temperature of the OCR. Therefore, the distance between the UV light source 40 and the OCR bonding surface needs to be increased to some extent. In this case, however, the UV intensity at the OCR bonding surface is also weakened. become longer.

In addition, since the OCR is deformed during curing, the joining state of the two workpieces is not always desirable. For example, when the cover glass 11 and the PET film 14 are bonded or the glass substrate 16 and the image display panel 32 are bonded, the distance between the cover glass 11 and the PET film 14 or the distance between the glass substrate 16 and the image display panel 32 is not uniform. In some cases, the performance of the touch panel deteriorates.
Furthermore, even in the case of OCR, the temporal resistance is not always sufficient, and when a certain amount of time elapses after bonding, the OCR itself is colored, for example, becomes yellow. Therefore, in the case of the touch panel, the image looks discolored. OCR is also relatively expensive.

  The present invention has been made in view of the above circumstances, and the object of the present invention is that the reworkability is good and the color does not develop even when used for a long time, the processing time is relatively short, the cost is relatively low, and the bonding surface is It is to provide a method for bonding workpieces that can be easily joined to large-area members, and to provide a touch panel that uses such a bonding method to suppress reduction in brightness and contrast. It is to be.

  The present invention has a hydrophilic surface such as a workpiece having a hydrophilic surface such as glass, a workpiece having a hydrophobic surface such as resin, a workpiece having a hydrophobic surface by applying a transparent conductive film on the surface of glass or resin, etc. When a workpiece and a workpiece having a hydrophobic surface are bonded together, or when workpieces having a hydrophobic surface are bonded to each other, a member made of silicone is used instead of the conventional OCA tape or OCR. It provides a technique for pasting together. Furthermore, the present invention provides a technique for bonding the silicone member to the second and third workpieces having the hydrophobic surface.

  As a specific example, a touch panel will be described. In the touch panel shown in FIG. 18, the lower surface (the surface of the first workpiece) of the cover glass 11 and the first ITO electrode 13 side surface (the surface of the second workpiece) of the PET film 14 are bonded together, or the PET film. 14 is the surface of the hard coat layer 14a opposite to the first ITO electrode 13 side (the surface of the first workpiece) and the surface of the glass substrate 16 on which the second ITO electrode 15 is provided (the surface of the second workpiece). Are bonded to each other using a member made of silicone instead of the conventional OCA tape or OCR.

  When the surface of a member made of silicone (hereinafter referred to as a silicone substrate) is irradiated with ultraviolet rays in the atmosphere, the surface is oxidized to become a hydrophilic surface, and a glass substrate 16 or a resin substrate is superposed on such a surface, thereby superposing glass. It is known that the substrates 16 and the resin substrate and the silicone substrate irradiated with ultraviolet rays are pressed or heated for a predetermined time to bond both substrates.

For example, as described in Patent Document 5, when the silicone substrate is a polydimethylsiloxane (PDMS) substrate, the surface of the silicone (PDMS) substrate 17 is an organo group as shown in FIG. The surface has a siloxy group (hydrophobic surface).
By irradiating the surface of the substrate 17 held in the atmosphere with ultraviolet rays having a wavelength of 220 nm or less (for example, ultraviolet rays having a central wavelength of 172 nm emitted from a xenon excimer lamp), active oxygen is generated on the substrate surface. When the active oxygen comes into contact with the substrate surface, the substrate surface is oxidized. That is, as shown in FIG. 2B, the methyl group related to the organosiloxy group is eliminated, and the active oxygen is bonded to the silicon atom to which the methyl group is bonded.

  Since moisture exists in the atmosphere, the above-mentioned active oxygen and hydrogen are combined, and as shown in FIG. 2C, the substrate surface is in a state in which a hydroxy group (OH group) is bonded to a silicon atom. It becomes. By superimposing the hydrophilic surfaces of the glass substrate 16 on these surfaces and bringing them into close contact, hydrogen bonds are formed at the interface between the surface of the PDMS substrate 17 and the glass surface, as shown in FIG. Both substrates are bonded together.

Silicone is a relatively stable material, and unlike OCR, the silicone itself does not color even after a certain amount of time has elapsed after bonding. Therefore, even if it is used as a bonding material for each substrate of the touch panel display, the touch panel image is not affected by discoloration.
Since silicone is a relatively soft material, a step structure is formed on the surface of the PET film 14 such as the surface of the hard coat layer 14a on the first ITO electrode 13 side or the surface of the glass substrate 16 on the first wiring layer 21 side. Even when there is a bubble, it is possible to easily suppress air bubbles from being mixed into the stepped portion at the time of attachment. That is, it is possible to easily join even a member having a large joint surface.

  In addition, as described above, bonding using a silicone substrate does not have a process of applying to a bonding surface like OCR, and is not bonding by a curing reaction such as OCR, so application when OCR is used. There is no problem of uniformity of the resin or deformation during curing.

Silicone has a higher heat resistance temperature than OCR, and therefore, the distance between the UV light source 40 and the surface of the silicone substrate during the treatment of the silicone substrate is made smaller than the distance between the ultraviolet (UV) light source 40 and the OCR bonding surface during OCR curing. The UV intensity at the silicone substrate surface is greater than the UV intensity at the OCR interface. That is, in the UV irradiation process on the silicone substrate, the UV utilization efficiency is higher than in the UV irradiation process on the OCR bonding surface.
Further, according to the experiments by the inventors, the time required for the UV irradiation process to the silicone substrate, the heating process of the bonded substrate such as the silicone substrate and the glass substrate, and the pressurizing process is longer than the time required for the UV curing reaction of the OCR. I found it shorter.
In general, a silicone substrate is less expensive than an OCA tape or OCR.

  In the case of bonding using a silicone substrate, the bonding is not completed immediately by overlaying the glass substrate or resin substrate and the silicone substrate irradiated with ultraviolet rays, but both substrates are pressurized for a predetermined time as described above, The joining is completed by heating. Therefore, it is easy to separate the two substrates immediately after the overlapping. Therefore, for example, when the alignment between the glass substrate or the resin substrate and the silicone substrate irradiated with ultraviolet rays is insufficient, if they are just after being overlapped, they are peeled off once, and the silicone substrate is irradiated again with ultraviolet rays and bonded. It becomes possible to perform a process. That is, it is rich in rework as compared with the OCA tape.

FIG. 1 shows a configuration example of a touch panel assembled using the bonding method of the present invention.
The basic configuration is the same as that shown in FIG. 18, and includes the position input device 10 including the touch sensor module 10a and the touch panel control unit 10b, and the image display device 30. In the present invention, Between the first ITO electrode 13 provided on the surface of the hard coat layer 14a of the PET film 14 and the cover glass 11, a silicone substrate (for example, PDMS) 17a is provided. A primer is interposed between one ITO electrode 13. Further, a silicone substrate 17b is provided between the hard coat layer 14a of the PET film 14 and the second ITO electrode 15 provided on the surface of the glass substrate 16, and between the silicone substrate 17b and the hard coat layer 14a, and A primer is interposed between the silicone substrate 17 b and the ITO electrode 15.

  Here, as a result of experiments by the inventors, the following knowledge was obtained. That is, the surface of the silicone substrate is irradiated with ultraviolet rays (UV) to make the surface a hydrophilic surface, and the hydrophilic surface of the silicone substrate and the PET film 14 or the surface on which the first ITO electrode 13 is applied are applied to the surface. It was found that bonding was not possible even when the glass substrate 16 provided with the second ITO electrode 15 was overlapped. Similarly, it was found that bonding was not possible even if the hydrophilic surface of the silicone substrate obtained by UV irradiation and the hard coat layer 14a surface opposite to the first ITO electrode 13 side of the PET film 14 were overlapped. .

  That is, the bonding surface of the silicone substrate that is a hydrophilic surface, the surface on which the first ITO electrode 13 of the PET film 14 (which is a hydrophobic surface) is applied, and the first ITO electrode 13 of the PET film 14 are applied. It has been found that it is difficult to join the surface of the hard coat layer 14a opposite to the surface on which the second ITO electrode 15 is applied to the surface of the hard coat layer 14a.

  The inventors have intensively studied, and the hard coat layer 14a on the opposite side of the surface of the PET film 14 on which the first ITO electrode 13 is applied and the surface of the PET film 14 on which the first ITO electrode 13 is applied. By applying primer 18 (primer) to the surface and the surface of the glass substrate 16 on which the second ITO electrode 15 is applied, and further modifying the surface of the primer 18, these surfaces (PET film) The surface of the hard coating layer 14a opposite to the surface of the PET film 14 on which the first ITO electrode 13 is applied, the second ITO of the glass substrate 16 The surface on which the electrode 15 is applied) is a surface suitable for bonding, and the surface suitable for bonding and the surface of the silicone substrate irradiated with UV are overlapped, It found that it is possible to join the these surface PET film 14. And as a primer 18, it turned out that a silane coupling agent and a siloxane type coating agent are effective.

Although the primer 18 is applied to the surface of the workpiece and the surface of the primer 18 is modified, the mechanism by which the workpiece and the UV-irradiated silicone substrate can be bonded is not necessarily clearly understood. It is thought that this is the mechanism. Hereinafter, this possible mechanism will be described with reference to FIGS.
As an example, consider the case where a silane coupling agent is used as the primer 18 and the surface on which the primer 18 is applied is the surface on which the first ITO electrode 13 of the PET film 14 is applied. 4 is bonded to the cover glass 11 in advance by the method shown in FIG.

FIG. 3A shows a state in which a surface of the PET film 14 on which the first ITO electrode 13 is applied is coated with a silane coupling agent as the primer 18.
Silane coupling agents have two types of functional groups with different reactivity in one molecule. In FIG. 3A, a functional group represented by RO (O is oxygen) is a functional group chemically bonded to an inorganic material, and X is a functional group bonded to an organic material. Since the first ITO electrode 13 on the PET film 14 is inorganic, it is chemically bonded to the functional group RO.

Next, as shown in FIG. 3B, ultraviolet rays such as an excimer lamp are applied to the silane coupling coat surface of the PET film 14 in the atmosphere containing moisture (H ₂ O) and carbon dioxide (CO ₂ ). Irradiate ultraviolet rays (UV) emitted from a (UV) light source 40. The surface of the silane coupling coat surface of the PET film 14 is modified by UV irradiation.
Specifically, (a) the functional groups RO and X of the silane coupling agent are decomposed and separated, and the silicon oxide becomes the surface of the first ITO electrode 13 on the PET film 14 or the first ITO electrode of the PET film 14. As a result of bonding with a part of the surface on which 13 patterns are not applied, or (b) the above-described decomposition reaction of the functional group X or the chemical reaction of moisture and carbon dioxide in the air by UV irradiation, silicon oxide becomes a PET film. 14 part of the surface of the first ITO electrode 13 on the surface 14 or the surface of the PET film 14 where the pattern of the first ITO electrode 13 is not applied, and a carboxyl group (—COOH) are combined, or (c) a silane coupling agent As a result, the surface of the first ITO electrode 13 on the partially exposed PET film 14 and the pattern of the first ITO electrode 13 on the PET film 14 are applied. The surface that is not exposed to oxygen radicals generated as a result of the chemical reaction between moisture in the air and carbon dioxide caused by UV irradiation, and a hydroxyl group (—OH: hereinafter also referred to as OH group) is bonded. Conceivable. Then, it is considered that (a) silicon oxide described above reacts with moisture in the air, and as shown in the diagram on the right side of FIG.
Although illustration is omitted in FIG. 3B, it is considered that impurities adhering to the silane coupling coat surface of the PET film 14 are also cleaned by oxygen radicals generated as a result of UV irradiation.

In summary, the surface on which the first ITO electrode 13 pattern is applied on the PET film 14 is (a) a portion where the terminal of the bonded silicon oxide is an OH group, and (b) a portion bonded to the carboxyl group. (Termination is an OH group), (c) It is considered that a portion to which an OH group is bonded by an oxidation reaction with oxygen radicals is mixed.
In any case, since the termination is an OH group, the surface of the surface on which the first ITO electrode 13 pattern on the PET film 14 is applied by the surface modification of the silane coupling coat surface of the PET film 14 by UV irradiation. Most of them are bonded to OH groups, and the surface of the PET film 14 on which the first ITO electrode 13 pattern is applied is considered to be a hydrophilic surface.

  That is, the surface of the PET film 14 that is a hydrophobic surface coated with the first ITO electrode 13 is coated with the primer 18, and the surface coated with the primer 18 is irradiated with ultraviolet rays (UV). The surface on which the first ITO electrode 13 is applied is considered to be a surface suitable for bonding (hydrophilic surface).

  Then, as shown in FIG. 4C, the first ITO of the PET film 14 coated with such a silane coupling agent and having a hydrophilic surface (ie, a surface suitable for bonding) by UV irradiation treatment. Hydrogen bonding is performed by superimposing a bonding surface of a silicone substrate 17 formed by modifying the surface opposite to the bonding surface with the cover glass 11 on the surface provided with the electrode 13 with a hydrophilic surface by UV irradiation. The formed and superposed silicone substrate 17 and the PET substrate are heated to cause dehydration of the joint surface, and finally the PET film 14 on which the first ITO electrode 13 pattern is applied to the silicone substrate 17 and the joint surface. Are considered to be bonded by oxygen covalent bonds.

  3 and 4, the case where the surface of the PET film 14 on which the first ITO electrode 13 is applied is coated with a silane coupling agent as the primer 18 is considered. However, the first ITO of the PET film 14 is considered. Even if the primer 18 is coated on the surface of the hard coat layer 14a opposite to the surface on which the electrode 13 is applied, or on the surface of the glass substrate 16 on which the second ITO electrode 15 is applied, bonding is possible by the same mechanism. It is thought to become.

  Also, when a siloxane-based coating agent used for antifouling or antistatic use is used as the primer 18 instead of the silane coupling agent, the surface of the workpiece coated with the siloxane-based coating agent is irradiated with ultraviolet rays. The terminal state of the coated surface is considered to be a hydrophilic surface bonded with OH groups and modified to a surface suitable for bonding.

Based on the above, the present invention solves the above problems as follows.
(1) One surface of a workpiece having a hydrophobic surface is coated with a primer composed of a silane coupling agent or a siloxane-based coating agent, and the surface coated with the primer of the workpiece and the silicone member are irradiated with ultraviolet rays. Lamination is performed such that the surface of the workpiece irradiated with ultraviolet rays and the surface of the silicone member exposed to ultraviolet rays are in contact with each other, and pressurization is performed so that the contact surface of the laminated workpiece and the member formed of silicone is pressurized. Or a workpiece having a hydrophobic surface by heating a laminated workpiece and a member made of silicone or heating a laminated workpiece and a member made of silicone so that the contact surface is pressurized. A member made of silicone is bonded together.
(2) The surface of the second workpiece having a hydrophobic surface is coated with a primer made of a silane coupling agent or a siloxane-based coating agent, and one surface of the first workpiece having a hydrophilic surface and the second Each surface of the workpiece coated with the primer is irradiated with ultraviolet rays on both sides of the silicone member, and the first workpiece, the silicone member, and the second workpiece are in contact with the ultraviolet-irradiated surface. The first and second workpieces and the silicone that are laminated or heated so that the contact surface is pressurized or the laminated first and second workpieces and silicone members are heated or laminated. The first workpiece having a hydrophilic surface and the second workpiece having a hydrophobic surface are heated by pressurizing the member made of such that the contact surface is pressurized. Bonded by interposing a member made of silicone.
(3) A primer 18 made of a silane coupling agent or a siloxane-based coating agent is coated on the surface of the first work having a hydrophobic surface and the second work having a hydrophobic surface, and the first work and the second work Each of the surfaces of the workpiece coated with the primer and the both sides of the silicone member are irradiated with ultraviolet rays, and the first workpiece, the silicone member and the second workpiece are irradiated with the ultraviolet rays. Laminate so that the contacted surfaces are in contact, pressurize so that the contact surface is pressurized, heat the stacked workpieces, or pressurize the stacked workpieces so that the contact surfaces are pressurized By heating, the first work having a hydrophobic surface and the second work having a hydrophobic surface are bonded together with a member made of silicone interposed.
(4) In a touch panel including a touch sensor module having a substrate coated with a transparent conductive film and an image display device, the touch sensor module is coated with a primer made of a silane coupling agent or a siloxane-based coating agent, A substrate coated with a transparent conductive film whose surface coated with the primer is modified by ultraviolet irradiation, a member made of silicone whose surface is modified by ultraviolet irradiation, and a substrate composed of the substrate and the silicone. The respective surfaces irradiated with the ultraviolet rays are laminated facing each other.

In the present invention, the following effects can be obtained.
(1) A work surface having a hydrophobic surface is coated with a primer made of a silane coupling agent or a siloxane-based coating agent, and the work piece primer-coated surface and a silicone member are irradiated with ultraviolet rays and attached to the work. By combining them, the surface of the workpiece can be made a surface suitable for bonding (hydrophilic surface), and the workpiece and the member made of silicone can be bonded reliably.
For this reason, it becomes possible to bond together a member made of silicone and a resin such as PET having a hydrophobic surface, a work provided with a transparent conductive film, and the like.
(2) One surface of a workpiece having a hydrophilic surface is irradiated with ultraviolet light, the surface of a workpiece having a hydrophobic surface is coated with a primer, the surface coated with the primer is irradiated with ultraviolet light, and both surfaces of a member made of silicone Laminate the workpiece with a hydrophilic surface, a workpiece with a hydrophobic surface, and a component made of silicone so that the UV-irradiated surfaces face each other, or on the surface of a workpiece with a hydrophobic surface. The primer-coated surface is irradiated with ultraviolet light, and both surfaces of the silicone material are irradiated with ultraviolet light. The ultraviolet light of the workpiece with a hydrophobic surface, the silicone material, and the workpiece with a hydrophobic surface. The following effects can be obtained by laminating so that the irradiation surfaces face each other and bonding them together.
(A) Since coloring after a long time does not occur in silicone, coloring after a long time does not occur as in the case of bonding with an OCA tape or OCR.
For this reason, the influence of discoloration does not generate | occur | produce in the image of a touch panel by applying to manufacture of a touch panel.
(B) Even when there is a step structure such as a conductive thin film on the joint surface, silicone deforms and adheres according to the step, so it is easy to suppress bubbles from being mixed into the stepped portion during bonding. is there.
(C) As in the case of bonding using OCR, it is possible to avoid problems such as difficulty in realizing coating uniformity and deformation during curing. Also, since silicone has a higher heat resistant temperature than OCR, ultraviolet irradiation The light source and the silicone irradiation surface can be brought close to each other, and the silicone light irradiation surface can be efficiently modified.
(D) Generally, a member made of silicone is less expensive than an OCA tape or OCR, so that the manufacturing cost can be reduced.
(E) In the case of joining using a member made of silicone, the joining is not completed immediately even if the workpiece and the member made of silicone are overlapped, but the joining is performed by pressurizing or heating for a predetermined time. Complete. For this reason, it is easy to separate the workpiece and the silicone immediately after the overlapping. Therefore, when the alignment between the workpiece and the member made of silicone is insufficient, if they are just after being overlapped, both of them are peeled off once, and the joining step is performed by irradiating the member made of silicone again with ultraviolet rays. It becomes possible. That is, it is rich in rework as compared with the OCA tape.
(F) Conventionally, it is possible to bond a member made of silicone, which has been difficult to be bonded even by using a surface modification treatment by ultraviolet irradiation, to the surface of a conductive thin film substrate where the surface of the touch sensor module is hydrophobic. It becomes. Therefore, when the components of the touch sensor module are bonded together, it is possible to configure the touch sensor module by bonding the components using a member made of silicone instead of the conventional OCA tape or OCR. .

It is an example of composition of a touch panel assembled using the joining method of the present invention. It is a figure explaining joining of the PDMS board | substrate which the surface hydrophilic glass substrate and ultraviolet rays irradiated. It is a figure (1) explaining joining of the surface where the ITO electrode of the PET film coated with the primer is applied and the silicone substrate. It is a figure (2) explaining joining to the surface with which the ITO electrode of the PET film coated with the primer is given, and a silicone substrate. It is a figure explaining the joining process (A-1) with the PET film by which the cover glass and the 1st transparent conductive film (ITO electrode) were given to the surface. The figure (1) explaining the joining process (B-1) of the PET film with which the 1st transparent conductive film (ITO) was given to the surface, and the glass with which the 2nd transparent conductive film (ITO) was given to the surface It is. The figure (2) explaining the joining process (B-1) of PET film with which the 1st transparent conductive film (ITO) was given to the surface, and the glass with which the 2nd transparent conductive film (ITO) was given to the surface It is. It is a figure explaining the joining process (A-2) with the PET film by which the cover glass and the 1st transparent conductive film (ITO) were given to the surface. The figure (1) explaining the joining process (B-2) of the PET film with which the 1st transparent conductive film (ITO) was given to the surface, and the glass with which the 2nd transparent conductive film (ITO) was given to the surface It is. The figure (2) explaining the joining process (B-2) of the PET film with which the 1st transparent conductive film (ITO) was given to the surface, and the glass with which the 2nd transparent conductive film (ITO) was given to the surface It is. It is a figure explaining the joining process (A-3) with the PET film by which the cover glass and the 1st transparent conductive film (ITO) were given to the surface. It is a figure explaining the joining process (B-3) of the PET film with which the 1st transparent conductive film (ITO) was given to the surface, and the glass with which the 2nd transparent conductive film (ITO) was given to the surface. It is another example of a structure of the touch panel assembled using the joining method of the present invention. It is a figure explaining the joining process (C-1) with the 1st glass substrate by which the cover glass and the 1st transparent conductive film (ITO) were given to the surface. Bonding process (D-1) of the 1st glass substrate with which the 1st transparent conductive film (ITO) was given to the surface, and the 2nd glass substrate with which the 2nd transparent conductive film (ITO) was given to the surface FIG. It is a figure explaining the joining process (C-2) with the 1st glass substrate by which the cover glass and the 1st transparent conductive film (ITO) were given to the surface. Bonding step (D-2) between the first glass substrate having the first transparent conductive film (ITO) applied to the surface and the second glass substrate having the second transparent conductive film (ITO) applied to the surface FIG. It is a schematic diagram of the touch panel which consists of a video display apparatus and a touch sensor module.

Hereinafter, although the case where a touch panel is manufactured is described as an example of the embodiment of the present invention, the present invention can be applied to the manufacture of the organic EL, organic semiconductor, solar cell and the like in addition to the touch panel.
(1) Embodiment 1
FIG. 1 is a diagram showing a first configuration example of the touch panel according to the present invention.
The basic configuration is the same as that shown in FIG. 18, and the touch panel 100 includes an image display device 30 such as an LCD panel and a position input device 10 disposed above the image display device 30.
The position input device 10 processes the position input information from the touch sensor module 10a and the touch sensor module 10a for detecting a portion of the touch sensor surface that is touched with a finger or a pen, and the image display device based on the information. 30 includes a touch panel control unit 10b for controlling 30.

  The touch sensor module 10a includes a PET film 14 provided with a first transparent conductive film (for example, ITO electrode) pattern shown in FIG. 18B and a second transparent conductive film shown in FIG. 18C. (For example, ITO electrode) The structure is laminated on a glass substrate 16 provided with a pattern. From the top, the cover glass 11, the silicone substrate 17a, the primer 18, the first ITO electrode 13, the PET film 14, the primer 18, the silicone The substrate 17b, the primer 18, the second ITO electrode 15, and the glass substrate 16 are laminated in this order. A light-transmitting hard coat layer 14 a is provided on both surfaces of the PET film 14 to prevent the PET film 14 from being scratched. As described above, the hard coat layer 14a is made of, for example, an acrylate resin.

A black matrix 12 is formed on the periphery of the surface of the cover glass 11 on the side facing the surface of the PET film 14 on which the first ITO electrode 13 pattern is applied.
On the lower side of the glass substrate 16, a wiring layer 21 that is electrically connected to the first ITO electrode 13 and the second ITO electrode 15 and is also electrically connected to the touch panel control unit 10b is provided. The wiring layer 21 is disposed on the lower side of the glass substrate 16 so as to be shielded by the black matrix 12 provided on the cover glass 11 when observed from the cover glass 11 side.
The touch panel control unit 10b includes the touch panel (TP) control IC unit 22 and the FPC (flexible printed circuit board) 23 as described above, and the touch panel control IC unit 22 is provided on the FPC 23. The FPC 23 has an annular structure in which an opening is provided in the central portion so as to be shielded by the black matrix 12 provided in the cover glass 11 when observed from the cover glass 11 side. Provided at the top of the structural part.
The touch panel control unit 10b is electrically connected to the wiring layer 21 of the touch sensor module 10a, and is also electrically connected to the image display device 30.
The touch sensor module 10a and the touch panel control unit 10b described above are stacked on the image display device 30 to constitute a touch panel.

  In the touch panel shown in FIG. 1, the substrate of the first transparent conductive film (for example, the first ITO electrode 13) in the touch sensor module 10a is the PET film 14, and the second transparent conductive film (for example, the second transparent conductive film) In this example, the substrate of the ITO electrode 15) is the glass substrate 16. In the configuration example of the touch panel shown in FIG. 1, the thickness of each substrate and each layer is exaggerated for ease of explanation, and the relative relationship between the actual thickness of each substrate and each layer is shown in FIG. It is different from what is shown.

Hereinafter, the bonding process of each workpiece | work for manufacturing the said touch sensor module is demonstrated.
[Step A-1] Joining process of cover glass and PET film having first transparent conductive film (ITO electrode) applied on surface This process is shown in FIG. This process shows a method of bonding a first workpiece having a hydrophilic surface and a second workpiece having a hydrophobic surface with a silicone substrate interposed, and corresponds to a first workpiece having a hydrophilic surface. The cover glass 11 and the second workpiece having a hydrophobic surface correspond to the PET film 14 having the first transparent conductive film (ITO electrode 13) applied to the surface of the hard coat layer 14a.

(A) Bonding of Cover Glass 11 and Silicone Substrate 17a First of PET film 14 which is a second work having a lower surface and a hydrophobic surface of cover glass 11 which is a first work having a hydrophilic surface Prior to bonding the ITO electrode 13 side surface, first, the cover glass 11 and a silicone (for example, PDMS) substrate 17a are bonded.
As shown in FIG. 5A, the surface of the silicone substrate 17a is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to oxidize the surface of the silicone substrate 17a. Is a hydrophilic surface.
Next, the joint surface of the cover glass 11 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp.

  Thereafter, the bonding surface of the cover glass 11 and the UV irradiation surface of the silicone substrate 17a are overlapped. The bonding strength is increased by appropriately pressing or heating the overlapped cover glass 11 and the silicone substrate 17a.

In addition, since the cover glass 11 itself is a hydrophilic surface, it is not always necessary to irradiate UV light. However, by irradiating the joint surface of the cover glass 11 with UV light, the joint surface of the cover glass 11 is activated or impurities on the surface of the cover glass 11 are decomposed and removed. Bonding to 17a is more reliably performed.
Moreover, you may perform UV irradiation to the joint surface of the silicone (PDMS) board | substrate 17a surface and the cover glass 11 simultaneously.

(B) Joining of Silicone Substrate 17a Joined with Cover Glass 11 and PET Film 14 Next, as shown in FIG. 5B, for example, a first ITO electrode having a pattern as shown in FIG. A primer 18 is coated on the surface of the PET film 14 having the first ITO electrode 13 pattern applied thereto on the surface of the hard coat layer 14a. Next, the surface coated with the primer 18 is irradiated with UV light emitted from an ultraviolet (UV) light source such as an excimer lamp, so that the primer coated surface is a surface suitable for bonding.

  On the other hand, the surface of the silicone substrate 17a bonded to the cover glass 11 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp on the surface opposite to the bonding surface with the cover glass 11. The UV irradiation surface of the silicone substrate 17a is oxidized to make the surface hydrophilic.

  Thereafter, the UV-irradiated surface of the silicone substrate 17a and the UV-treated primer-coated surface of the PET film 14 are overlapped, and the overlapped cover glass 11 and the silicone substrate 17a are appropriately pressurized or heated. The silicone substrate 17a to which the cover glass 11 is bonded and the PET film 14 to which the first ITO electrode 13 is applied are bonded.

That is, the joining method employed in this step (A-1) is as follows.
(1) The silicone substrate 17a is bonded to the lower surface of the cover glass 11, which is a first workpiece having a hydrophilic surface. As a bonding method, the silicone substrate 17a is irradiated with ultraviolet rays to make the ultraviolet irradiation surface a hydrophilic surface, and the surface is laminated on the cover glass 11, and the cover glass 11 which is the first workpiece having the hydrophilic surface and the silicone. The substrate 17a is bonded. As described above, the bonding surface of the cover glass 11 may be irradiated with ultraviolet rays.
(2) Primer coat the surface of the hard film layer 14a of the PET film 14, which is the second workpiece having a hydrophobic surface, to which the first transparent conductive film (ITO electrode 13) is applied.
(3) The first transparent conductive film (ITO) of the surface of the silicone substrate 17a bonded to the cover glass 11 as the first work having a hydrophilic surface and the PET film 14 as the second work having a hydrophobic surface. The primer 18 coated on the surface on which the electrode 13) is applied is irradiated with ultraviolet rays to make both surfaces hydrophilic surfaces.
(4) Superimpose both ultraviolet irradiation surfaces.
(5) From the top, the contact of each workpiece superposed in the order of the PET film 14 as the second workpiece having a hydrophobic surface, the silicone substrate 17a, and the cover glass 11 as the first workpiece having a hydrophilic surface. Heat while pressing the surface.
In (5) of this bonding method, only pressurization or heating may be used, but it is desirable to heat while applying pressure.

[Step B-1] Joining process between PET film having first transparent conductive film (ITO electrode) applied to surface and glass having second transparent conductive film (ITO electrode) applied to the surface 6 and FIG. This process shows a method for bonding a first workpiece having a hydrophobic surface and a second workpiece having a hydrophobic surface via a silicone substrate, and corresponds to a first workpiece having a hydrophobic surface. This is done by a PET film 14 to which a cover glass 11 is bonded, and a second substrate having a hydrophobic surface corresponding to a glass substrate 16 having a second transparent conductive film (ITO electrode 15) applied to the surface. is there.
(A) Bonding of Silicone Substrate 17b and PET Film 14 (Already Bonded to Cover Glass 11) As shown in FIG. 6A, the surface of the silicone substrate 17b is emitted from an ultraviolet (UV) light source 40 such as an excimer lamp. Irradiation with UV light oxidizes the surface of the silicone substrate 17b to make the surface hydrophilic.

Next, in the PET film 14 in which the cover glass 11 is bonded to the surface of the hard coat layer 14a on which the first ITO electrode 13 pattern is applied via the silicone substrate 17a, as shown in FIG. The primer 18 is coated on the surface of the hard coat layer 14a opposite to the surface on which the 1 ITO electrode 13 pattern is applied. Next, the surface coated with the primer 18 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to make the primer coated surface suitable for bonding.
Thereafter, the UV-irradiated surface of the silicone substrate 17b and the UV-treated primer coat surface of the PET film 14 are overlapped, and the PET film 14 and the silicone substrate 17b are appropriately pressurized or heated to A first ITO electrode 13 is bonded to a PET film 14 having a surface.

(B) Joining of PET film 14 (attached to cover glass 11) and glass substrate 16 As shown in FIG. 7B, the joining surface of PET substrate 14 with silicone substrate 17b joined to PET film 14 The surface opposite to the surface is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, and the UV irradiation surface of the silicone substrate 17b is oxidized to make the surface a hydrophilic surface.
Next, for example, a primer 18 is coated on the surface of the glass substrate 16 on which the second ITO electrode 15 having a pattern as shown in FIG. . Next, the surface coated with the primer 18 is irradiated with UV light emitted from an ultraviolet (UV) light source such as an excimer lamp, so that the primer coated surface is a surface suitable for bonding.

Thereafter, the UV-irradiated surface of the silicone substrate 17b and the UV-treated primer coat surface of the glass substrate 16 are overlapped, and the glass substrate 16 and the silicone substrate 17b are appropriately pressurized or heated to obtain the PET film 14 and The bonded silicone substrate 17b is bonded to the glass substrate 16 having the second ITO electrode 15 provided on the surface thereof.
In addition, instead of the glass substrate 16 having the second ITO electrode 15 applied to the surface, a resin substrate (for example, a PET film 14) having the second ITO electrode 15 applied to the surface may be used. There is no change in the procedure of step 2.

That is, the bonding method in this step (B-1) is as follows.
(1) The surface of the hard coat layer 14a (hydrophobic surface) of the PET film 14 to which the cover glass 11 is not bonded in the PET film 14 which is the first workpiece having the hydrophobic surface and bonded to the cover glass 11. ) Is coated with primer 18.
(2) The surface of the silicone substrate 17b and the surface coated with the primer 18 of the PET film 14, which is the first workpiece having a hydrophobic surface, are irradiated with ultraviolet rays to make both surfaces hydrophilic surfaces.
(3) Both ultraviolet irradiation surfaces are overlapped.
(4) From above, the workpiece superposed in the order of the silicone substrate 17b, the primer 18, and the PET workpiece 14 (cover glass 11 already bonded) having a hydrophobic surface is heated while being pressed.
(5) The primer 18 is coated on the surface of the glass substrate 16 that is the second workpiece having a hydrophobic surface, on which the second transparent conductive film (ITO electrode 15) is applied.
(6) The surface of the silicone substrate 17b bonded to the PET film 14 (cover glass 11 bonded), which is the first workpiece having a hydrophobic surface, and the glass substrate 16 which is the second workpiece having the hydrophobic surface. The primer 18 coated on the surface of the second transparent conductive film (ITO electrode 15) is irradiated with ultraviolet rays to make both surfaces hydrophilic surfaces.
(7) Superimpose both ultraviolet irradiation surfaces.
(8) From above, the PET film 14 (cover glass 11 bonded), which is the first workpiece having a hydrophobic surface, the silicone substrate 17b, and the glass substrate 16, which is the second workpiece having a hydrophobic surface, are stacked in this order. The contact surface of each workpiece is heated while applying pressure.
In addition, in (4) and (8) of this bonding method, only pressurization or heating may be used, but it is desirable to heat while applying pressure.

The touch sensor module in the touch panel shown in FIG. 1 is configured through [Step A-1] and [Step B-1] employing the bonding method of the present invention.
The touch sensor module 10a and the touch panel control unit 10b are stacked on the image display device 30 such as an LCD panel to constitute a touch panel. Here, the structure example of the touch panel control unit 10b and the joining of the touch panels stacked in the order of the touch sensor module 10a, the touch panel control unit 10b, and the image display device 30 are the same as those in the related art, and thus detailed description will be given here. Omitted.

In the first embodiment, a touch sensor module in a touch panel is constructed by the following method. That is, when bonding each component of the touch sensor module, silicone (substrate) is used instead of the conventional OCA tape or OCR, and ultraviolet rays are irradiated to the bonding surface between the silicone (substrate) and each component. .
Then, on the substrate on which the conductive thin film (for example, ITO electrode) of the touch sensor module is provided, the surface on which the conductive thin film is provided is coated with a primer (for example, a silane coupling agent), and the primer The coated surface is irradiated with ultraviolet rays.
Furthermore, when the surface on which the conductive thin film is not provided on the substrate on which the conductive thin film is provided is a hydrophobic surface, the surface is also coated with a primer 18 (for example, a silane coupling agent). The primer coat surface is irradiated with ultraviolet rays.

By constructing a touch sensor module by the bonding method of the present invention, the following advantages can be obtained.
That is, unlike OCA tape and OCR, silicone does not color after a long time, and the touch panel image, which is the final product, does not have an influence of discoloration.
Even when a step structure such as a conductive thin film is present on the joint surface, silicone deforms and adheres according to the step, so that it is easy to prevent air bubbles from being mixed into the step portion at the time of attachment. . Further, it is possible to easily join a member having a large joint surface.

Further, since the bonding is not performed by a curing reaction such as OCR, problems such as difficulty in realizing coating uniformity in the coating process on the bonding surface peculiar to OCR and deformation during curing can be avoided. In addition, since the heat resistant temperature is higher than that of OCR, the ultraviolet light source and the irradiation surface of the silicone substrate can be brought close to each other, and the light irradiation surface of the silicone substrate can be efficiently modified. On the other hand, when UV curable OCR is used, since the heat resistance of OCR itself is low, the UV curable OCR application surface and the UV irradiation light source 40 cannot be brought too close to each other, and the UV curable OCR application surface is not provided. The intensity of ultraviolet rays becomes small, and the utilization efficiency of ultraviolet rays becomes small. As a result, the time required for the OCR curing reaction for bonding increases.
In general, a silicone substrate is less expensive than an OCA tape or OCR.

  Furthermore, in the case of bonding using a silicone substrate, the bonding is not completed immediately after the glass substrate or resin substrate and the silicone substrate irradiated with ultraviolet rays are overlaid, but both substrates are pressurized or heated for a predetermined time. To complete the joining. Therefore, it is easy to separate the two substrates immediately after the overlapping. Therefore, for example, when the alignment between the glass substrate or the resin substrate and the silicone substrate irradiated with ultraviolet rays is insufficient, if they are just after being overlapped, they are peeled off once, and the silicone substrate is irradiated again with ultraviolet rays and bonded. It becomes possible to perform a process. That is, it is rich in rework as compared with the OCA tape.

In particular, in the bonding method of the present invention, the bonding between the silicone substrate, which has been difficult to bond even by using surface modification treatment by ultraviolet irradiation, and the conductive thin film surface of the conductive thin film substrate of the touch sensor module is conventionally performed. In addition, for the bonding of the silicone substrate and the conductive thin film substrate when the surface is hydrophobic, a silane coupling agent is introduced into the conductive thin film surface and the hydrophobic surface of the substrate, and the silane coupling agent is Since it was possible to modify the surface by ultraviolet irradiation (to obtain a surface state suitable for bonding), it was possible to perform the above-described bonding.
That is, when bonding each component of the touch sensor module, silicone (substrate) is used in place of the conventional OCA tape or OCR, and ultraviolet rays are irradiated to the bonding surface between the silicone (substrate) and each component to perform touch. The touch sensor module can be configured by pasting each component of the sensor module.

[Modification (1) of Embodiment 1]
In Embodiment 1, the example which comprises the touch sensor module in the touch panel shown in FIG. 1 was shown through [process A-1] and [process B-1] which employ | adopted the joining method of this invention.

That is, in [Step A-1], the cover glass 11 and the silicone substrate 17a are first joined, and then the silicone substrate 17a joined to the cover glass 11 and the PET film 14 are joined in this order. 11 and a PET film 14 having a surface coated with a first transparent conductive film (ITO electrode 13).
In [Step B-1], first, the PET film 14 bonded to the cover glass 11 and the silicone substrate 17b are bonded via the silicone substrate 17a configured in [Step A-1], and then this The silicone substrate 17b and the second ITO electrode 15 bonded to the PET film 14 are applied to the surface in the order of bonding the glass substrate 16 and the silicone substrate 17b bonded to the cover glass 11 and the bonded PET film 14. The touched glass substrate 16 was joined to form the touch sensor module 10b.

However, the order in which the workpieces are bonded is not limited to the order shown in [Step A-1] and [Step B-1].
For example, in the above [Step A-1], first, the silicone substrate 17a and the PET film 14 are joined, and then the silicone substrate 17a joined to the PET film 14 and the cover glass 11 are joined in the order, You may join the cover glass 11 and PET film 14 with which the 1st transparent conductive film (ITO electrode) was given to the surface. (Hereinafter, such a step is referred to as [Step A-2].)

  Similarly, in the above [Step B-1], the silicone substrate 17b and the glass substrate 16 are first bonded, and then the silicone substrate 17b bonded to the glass substrate 16 and the cover glass 11 are bonded to the PET film 14. In this order, the cover glass 11, the joined PET film 14, the glass substrate 16, and the joined silicone substrate 17b may be joined to form a touch sensor module. (Hereinafter, a process replacing the process B-1 will be referred to as [process B-2].)

Hereinafter, an example in which the touch sensor module in the touch panel shown in FIG. 1 is configured through [Step A-2] and [Step B-2] using the bonding method of the present invention with reference to FIGS. Will be explained.
[Step A-2] Joining Step of Cover Glass and PET Film with First Transparent Conductive Film (ITO Electrode) on its Surface This step is shown in FIG. This process shows a method of bonding a first workpiece having a hydrophilic surface and a second workpiece having a hydrophobic surface with a silicone substrate interposed, and corresponds to a first workpiece having a hydrophilic surface. The cover glass 11 and the second work having a hydrophobic surface correspond to the PET film 14 with the first transparent conductive film (ITO electrode 13) applied to the surface of the hard coat layer 14a.

(A) Bonding of Silicone Substrate 17a and PET Film 14 For example, in the PET film 14 in which the first ITO electrode 13 having a pattern as shown in FIG. 18B is applied to the surface of the hard coat layer 14a, FIG. ), The primer 18 is coated on the surface of the hard coat layer 14a provided with the first ITO electrode 13 pattern. Next, the surface coated with the primer 18 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to make the primer coated surface suitable for bonding.

Further, the surface of the silicone substrate 17a is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to oxidize the surface of the silicone substrate 17a to make the surface a hydrophilic surface.
Thereafter, the UV-irradiated surface of the silicone substrate 17a and the primer-coated surface of the PET film 14 subjected to the UV-irradiation treatment are overlapped, and the PET film 14 and the silicone substrate 17a are appropriately pressurized or heated to obtain the silicone substrate 17a and A first ITO electrode 13 is bonded to a PET film 14 having a surface.

(B) Bonding of Silicone Substrate 17a Bonded to PET Film 14 and Cover Glass 11 Next, as shown in FIG. 8B, bonding of the silicone substrate 17a bonded to PET film 14 to PET film 14 is performed. The surface opposite to the surface is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, and the UV irradiated surface of the silicone substrate 17a is oxidized to make the surface a hydrophilic surface.
Further, the joint surface of the cover glass 11 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp.

  Thereafter, the UV irradiation surface of the silicone substrate 17a bonded to the PET film 14 and the bonding surface of the cover glass 11 are overlapped, and the overlapped cover glass 11 and the silicone substrate 17a are appropriately pressurized or heated. , Increase the bonding strength.

In addition, since the cover glass 11 itself is a hydrophilic surface, it is not always necessary to irradiate UV light. However, by irradiating the joint surface of the cover glass 11 with UV light, the joint surface of the cover glass 11 is activated or impurities on the surface of the cover glass 11 are decomposed and removed. Bonding to 17a is more reliably performed.
Moreover, you may perform UV irradiation to the joint surface of the silicone (PDMS) board | substrate 17a joined to PET film 14 and the cover glass 11 simultaneously.

That is, the bonding method in this step (A-2) is as follows.
(1) The primer 18 is coated on the surface of the PET film 14, which is the second workpiece having a hydrophobic surface, on which the first transparent conductive film (ITO electrode 13) is applied.
(2) For the primer 18 coated on the surface of the surface of the PET film 14 which is the second workpiece having a hydrophobic surface and the surface of the silicone substrate 17a, the first transparent conductive film (ITO electrode 13). UV irradiation to make both surfaces hydrophilic.
(3) Both ultraviolet irradiation surfaces are overlapped.
(4) It heats, pressing the contact surface of the workpiece | work with which PET film 14 which is the 2nd workpiece | work which has a hydrophobic surface, and the silicone substrate 17a are piled up.
(5) Next, the surface of the silicone substrate 17a bonded to the PET film 14 as the second workpiece having a hydrophobic surface and the bonding surface of the cover glass 11 as the first workpiece having a hydrophilic surface Irradiate ultraviolet rays.
(6) Superimpose both ultraviolet irradiation surfaces.
(7) From the top, the contact of each workpiece superposed in the order of the PET film 14 as the second workpiece having a hydrophobic surface, the silicone substrate 17a, and the cover glass 11 as the first workpiece having a hydrophilic surface. Heat while pressing the surface.
In (4) and (7) of this bonding method, only pressurization or only heating may be used, but it is desirable to heat while applying pressure.

[Step B-2] Joining process of PET film having first transparent conductive film (ITO electrode) applied to surface and glass having second transparent conductive film (ITO electrode) applied to the surface 9 and FIG. This process shows a method for bonding a first workpiece having a hydrophobic surface and a second workpiece having a hydrophobic surface via a silicone substrate, and corresponds to a first workpiece having a hydrophobic surface. This is done by a PET film 14 to which a cover glass 11 is bonded, and a second substrate having a hydrophobic surface corresponding to a glass substrate 16 having a second transparent conductive film (ITO electrode 15) applied to the surface. is there.

(A) Bonding of Silicone Substrate 17b and Glass Substrate 16 As shown in FIG. 9 (a), the surface of the silicone substrate 17b is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to thereby form silicone. The surface of the substrate 17b is oxidized to make the surface hydrophilic.

  Further, for example, in the glass substrate 16 on which the second ITO electrode 15 having a pattern as shown in FIG. 18C is applied, the primer 18 is coated on the surface on which the second ITO electrode 15 pattern is applied. . Next, the surface coated with the primer 18 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to make the primer coated surface suitable for bonding.

  Thereafter, the UV-irradiated surface of the silicone substrate 17b and the UV-treated primer coat surface of the glass substrate 16 are overlapped, and the glass substrate 16 and the silicone substrate 17b are appropriately pressed or heated to obtain the silicone substrate 17b. The second ITO electrode 15 is bonded to the glass substrate 16 provided on the surface.

  As shown in FIG. 10B, the silicone substrate 17b bonded to the glass substrate 16 is emitted from an ultraviolet (UV) light source 40 such as an excimer lamp on the surface opposite to the bonding surface with the glass substrate 16. UV light is irradiated to oxidize the UV irradiated surface of the silicone substrate 17b to make the surface hydrophilic.

  Next, in the PET film 14 in which the cover glass 11 is bonded to the surface on which the first ITO electrode 13 pattern is applied via the primer 18 and the silicone substrate 17a, as shown in FIG. The primer 18 is coated on the surface of the hard coat layer 14a opposite to the surface on which the ITO electrode 13 pattern is applied. Next, the surface coated with the primer 18 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to make the primer coated surface suitable for bonding.

  Thereafter, the UV-irradiated surface of the silicone substrate 17b and the UV-treated primer coat surface of the PET film 14 are overlapped, and the PET film 14 and the silicone substrate 17b are appropriately pressed or heated to form the glass substrate 16 The bonded silicone substrate 17b and the PET film 14 having the first ITO electrode 13 applied to the surface are bonded.

That is, the bonding method in this step (B-2) is as follows.
(1) The primer 18 is coated on the surface of the glass substrate 16 that is the second workpiece having a hydrophobic surface, on which the second transparent conductive film (ITO electrode 15) is applied.
(2) For the primer 18 coated on the surface of the glass substrate 16 which is the second workpiece having a hydrophobic surface and the surface of the silicone substrate 17b, and the second transparent conductive film (ITO electrode 15) applied to the surface. UV irradiation to make both surfaces hydrophilic.
(3) Both ultraviolet irradiation surfaces are overlapped.
(4) Heat is applied while pressing the contact surface of the workpiece on which the silicone substrate 17b and the glass substrate 16 as the second workpiece having a hydrophobic surface are superimposed.
(5) In the PET film 14 which is the first work having a hydrophobic surface and the cover glass 11 is bonded, the primer 18 is applied to the surface of the hard coat layer 14a of the PET film 14 where the cover glass 11 is not bonded. Coat.
(6) The hardware in which the surface of the silicone substrate 17b bonded to the glass substrate 16 that is the second workpiece having a hydrophobic surface and the cover glass 11 of the PET substrate that is the first workpiece having the hydrophobic surface are not bonded. The primer 18 coated on the surface of the coat layer 14a is irradiated with ultraviolet rays to make both surfaces hydrophilic surfaces.
(7) Superimpose both ultraviolet irradiation surfaces.
(8) From above, PET film 14 (cover glass 11 bonded), which is a first workpiece having a hydrophobic surface, primer 18, silicone substrate 17b, primer 18, and glass which is a second workpiece having a hydrophobic surface Heating is performed while pressing the contact surfaces of the workpieces stacked in the order of the substrate 16.
In addition, in (4) and (8) of this bonding method, only pressurization or heating may be used, but it is desirable to heat while applying pressure.

[Modification (2) of Embodiment 1]
[Step A-1] [Step B-1] of Embodiment 1 and [Step A-2] [Step B-2] of Modification Example (1) of Embodiment 1 are performed by bonding two workpieces. It is comprised by repeating. However, you may comprise so that three workpieces may be bonded together in each process.

For example, in the above [Step A-1] and [Step A-2], the cover glass 11, the silicone substrate 17a, and the PET film 14 may be bonded at a time. (Hereinafter, such a step is referred to as [Step A-3].)
Similarly, in the above [Step B-1] and [Step B-2], the cover glass 11, the joined PET film 14, the silicone substrate 17b, and the glass substrate 16 may be joined at one time (hereinafter referred to as such). This process is called [Process B-3].)

  Hereinafter, an example in which the touch sensor module in the touch panel shown in FIG. 1 is configured through [Step A-3] and [Step B-3] using the bonding method of the present invention will be described with reference to FIGS. .

[Step A-3] Joining process of cover glass and PET film having first transparent conductive film (ITO electrode) on surface This step is shown in FIG. This process shows a method of bonding a first workpiece having a hydrophilic surface and a second workpiece having a hydrophobic surface with a silicone substrate interposed, and corresponds to a first workpiece having a hydrophilic surface. The cover glass 11 and the second work having a hydrophobic surface correspond to the PET film 14 with the first transparent conductive film (ITO electrode 13) applied to the surface of the hard coat layer 14a.

  For example, in the PET film 14 in which the first ITO electrode 13 having a pattern as shown in FIG. 18B is applied to the surface of the hard coat layer 14a, the pattern of the first ITO electrode 13 is as shown in FIG. The primer 18 is coated on the surface of the applied hard coat layer 14a. The surface coated with the primer 18 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to make the primer coated surface suitable for bonding.

Further, as shown in FIG. 11, both surfaces of the silicone substrate 17a are irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to oxidize the surface of the silicone substrate 17a and make the surface hydrophilic. And
Further, as shown in FIG. 11, UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp is applied to the joint surface of the cover glass 11.

  Thereafter, the UV irradiation treatment is performed on the bonding surface of the cover glass 11 that has been subjected to the UV irradiation treatment and one surface of the silicone substrate 17a that has been subjected to the UV irradiation treatment, and on the other surface of the silicone substrate 17a that has been subjected to the UV irradiation treatment. Overlay with the primer coat surface. And the work laminated | stacked in order of the cover glass 11, the silicone substrate 17a, and the PET film 14 is pressurized or heated suitably, and the cover glass 11, the silicone substrate 17a, and the 1st ITO electrode 13 are on the surface. The applied PET film 14 is bonded at a time.

In addition, since the cover glass 11 itself is a hydrophilic surface, it is not always necessary to irradiate UV light. However, by irradiating the joint surface of the cover glass 11 with UV light, the joint surface of the cover glass 11 is activated or impurities on the surface of the cover glass 11 are decomposed and removed. Bonding to 17a is more reliably performed.
Moreover, UV irradiation to the joint surface of the cover glass 11, both surfaces of the silicone substrate 17a, and the primer coat surface of the PET film 14 may be performed simultaneously or individually.

That is, the bonding method in this step (A-3) is as follows.
(1) The primer 18 is coated on the surface of the PET film 14, which is the second workpiece having a hydrophobic surface, on which the first transparent conductive film (ITO electrode 13) is applied.
(2) The first transparent conductive film of the PET film 14, which is the second workpiece having a hydrophobic surface, the bonding surface of the cover glass 11 which is the first workpiece having a hydrophilic surface, both surfaces of the silicone substrate 17 a, and the hydrophobic surface. The primer 18 coated on the surface on which the (ITO electrode 13) is applied is irradiated with ultraviolet rays to make each ultraviolet irradiation surface a hydrophilic surface.
(3) Thereafter, the UV irradiation-treated bonding surface of the cover glass 11 and the one surface of the silicone substrate 17a that has been subjected to the UV irradiation treatment, and the other surface of the silicone substrate 17a that has been subjected to the UV irradiation treatment and the UV of the PET film 14. Overlay the irradiated primer coat surface.
(4) Then, the contact surfaces of the workpieces laminated in the order of the cover glass 11, the silicone substrate 17a, and the PET film 14 are heated while being pressed to join the workpieces at a time.
In (4) of this bonding method, only pressurization or heating may be used, but it is desirable to heat while applying pressure.

[Step B-3] Joining process between PET film having first transparent conductive film (ITO electrode) applied to surface and glass having second transparent conductive film (ITO electrode) applied to the surface 12 shows. This process shows a method for bonding a first workpiece having a hydrophobic surface and a second workpiece having a hydrophobic surface via a silicone substrate, and corresponds to a first workpiece having a hydrophobic surface. This is done by a PET film 14 to which a cover glass 11 is bonded, and a second substrate having a hydrophobic surface corresponding to a glass substrate 16 having a second transparent conductive film (ITO electrode 15) applied to the surface. is there.

  As shown in FIG. 12, in the PET film 14 to which the cover glass 11 is bonded via the silicone substrate 17a, the primer 18 is coated on the surface of the hard coat layer 14a opposite to the surface to which the cover glass 11 is bonded. To do. The surface coated with the primer 18 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, so that the primer coated surface is a surface suitable for bonding.

  Further, as shown in FIG. 12, both surfaces of the silicone substrate 17b are irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to oxidize the surface of the silicone substrate 17b so that the surface becomes a hydrophilic surface. And

  Further, for example, in the glass substrate 16 on the surface of which the second ITO electrode 15 having a pattern as shown in FIG. 18C is applied, the surface on which the pattern of the second ITO electrode 15 is applied as shown in FIG. The primer 18 is coated. The surface coated with the primer 18 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, so that the primer coated surface is a surface suitable for bonding.

After that, the UV-treated primer coat surface of the PET film 14 and one surface of the silicone substrate 17b treated with UV irradiation, and the other surface of the silicone substrate 17b treated with UV irradiation and the glass substrate 16 are irradiated with UV. Overlay the applied primer coat surface.
And the work laminated | stacked in order of the PET film 14, the silicone substrate 17b, and the glass substrate 16 with which the cover glass 11 has been joined is suitably pressurized or heated, and PET with the cover glass 11 having been joined. The film 14, the silicone substrate 17b, and the glass substrate 16 on which the second ITO electrode 15 is applied are bonded at a time.
In addition, UV irradiation to the primer coat surface of the PET film 14, both surfaces of the silicone substrate 17b, and the primer coat surface of the glass substrate 16 may be performed simultaneously or individually.

That is, the bonding method in this step (B-3) is as follows.
(1) In the PET film 14 which is the first work having a hydrophobic surface and the cover glass 11 is bonded, the primer 18 is applied to the surface of the hard coat layer 14a of the PET film 14 where the cover glass 11 is not bonded. Coat.
(2) The primer 18 is coated on the surface of the glass substrate 16 that is the second workpiece having a hydrophobic surface, on which the second transparent conductive film (ITO electrode 15) is applied.
(3) Primer coated on the surface of the hard coat layer 14a opposite to the surface to which the cover glass 11 of the PET film 14 to which the cover glass 11 is bonded is a first work having a hydrophobic surface. 18 and the primer 18 coated on the surface of the glass substrate 16 which is the second workpiece having a hydrophobic surface and the second transparent conductive film (ITO electrode 15) on the surface of the silicone substrate 17b. On the other hand, ultraviolet rays are irradiated to make each ultraviolet irradiation surface a hydrophilic surface.
(4) Thereafter, the UV-treated primer coat surface of the PET film 14 and the UV-treated one surface of the silicone substrate 17b, and the UV-treated other surface of the silicone substrate 17b and the glass substrate 16 The primer-coated surface that has been subjected to UV irradiation is overlaid.
(5) Then, while pressing the contact surfaces of the workpieces laminated in the order of the PET film 14 to which the cover glass 11 has been bonded, the silicone substrate 17b, and the glass substrate 16 are heated, the workpieces are bonded at once. To do.
In (5) of this bonding method, only pressurization or heating may be used, but it is desirable to heat while applying pressure.

[Embodiment 2]
In the first embodiment, in the configuration example of the touch panel shown in FIG. 1, the substrate of the first transparent conductive film (for example, ITO electrode 13) is the PET film 14, and the second transparent conductive film (for example, the ITO electrode). The bonding method of the present invention employed when assembling a touch sensor module in which the substrate 15) is the glass substrate 16 has been shown.
In Embodiment 2, the joining method of the present invention employed when assembling the touch sensor module in the configuration example of the touch panel shown in FIG. 13 will be described.

  As a substrate for a transparent conductive film, a glass substrate is superior in visibility and durability as compared with a film substrate. In other words, the glass substrate has higher light transmittance than the film substrate, can reduce the influence of light confusion and substrate distortion, and has less discoloration due to ultraviolet rays, etc. It is superior to this. In addition, the glass substrate is excellent in durability and water resistance in a wide temperature range, and has higher weather resistance than the film substrate. In a touch panel for mechanical equipment or a touch panel for outdoor use that requires high visibility and weather resistance, there is an increasing demand for using a glass substrate as a substrate for a transparent conductive film. The use of a glass substrate for any of the substrates has been studied. In addition, thinning of the glass substrate is being realized, and as with the film substrate, it has become possible to cope with the degree of freedom of shape and the thinning of the panel.

FIG. 13 shows the case where both the substrate of the first transparent conductive film (for example, ITO electrode 13) and the substrate of the second transparent conductive film (for example, ITO electrode 15) are glass substrates 16a and 16b. The structural example of the touch panel assembled using the joining method is shown. Here, FIG. 13A shows a case where the first transparent conductive film 13 and the second transparent conductive film 15 face each other with the silicone substrate 17b interposed therebetween.
In FIG. 13A, the touch sensor module 10a includes a cover glass 11, a silicone substrate 17a, a first glass substrate 16a, a first ITO electrode 13, a primer 18, a silicone substrate 17b, a primer 18, and a second glass from the top. The ITO electrode 15 and the second glass substrate 16b are laminated in this order. Other configurations are the same as those in FIG.

FIG. 13B shows a case where only the second transparent conductive film 15 of the first transparent conductive film 13 and the second transparent conductive film 15 is in contact with the silicone substrate 17b.
In FIG. 13B, the touch sensor module 10a includes a cover glass 11, a silicone substrate 17a, a primer 18, a first ITO electrode 13, a first glass substrate 16a, a silicone substrate 17b, a primer 18, and a second glass from the top. The ITO electrode 15 and the second glass substrate 16b are laminated in this order. Other configurations are the same as those in FIG.
In the configuration example of the touch panel shown in FIG. 13, the thickness of each substrate and each layer is exaggerated for easy explanation, and the relative relationship between the actual thickness of each substrate and each layer is shown in FIG. 13. It is different from what is shown.
First, the joining method of the present invention used when manufacturing the touch panel having the configuration example shown in FIG. 13A will be described with reference to FIGS.

[Step C-1] Joining Step of Cover Glass and First Glass Substrate with First Transparent Conductive Film (ITO Electrode) Provided on the Surface This step is shown in FIG. This step is a bonding step between the cover glass 11 and the first glass substrate 16a provided with the first transparent conductive film (ITO electrode 13) on the surface. This step is a previous step prior to [Step 3] to which the bonding method of the present invention is applied.

(A) Bonding of Cover Glass 11 and Silicone Substrate 17a As shown in FIG. 14A, the surface of the silicone (PDMS) substrate 17a is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp. Then, the surface of the silicone substrate 17a is oxidized to make the surface hydrophilic.
Next, the joint surface of the cover glass 11 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp.

Thereafter, the bonding surface of the cover glass 11 and the UV irradiation surface of the silicone substrate 17a are overlapped. The bonding strength is increased by appropriately pressing or heating the overlapped cover glass 11 and the silicone substrate 17a.
In addition, since the cover glass 11 itself is a hydrophilic surface, it is not always necessary to irradiate UV light. However, by irradiating the joint surface of the cover glass 11 with UV light, the joint surface of the cover glass 11 is activated or impurities on the surface of the cover glass 11 are decomposed and removed. Bonding to 17a is more reliably performed.
Moreover, you may perform UV irradiation to the joint surface of the silicone (PDMS) board | substrate 17a surface and the cover glass 11 simultaneously.

(B) Bonding of Silicone Substrate 17a Bonded to Cover Glass 11 and First Glass Substrate 16 Next, as shown in FIG. 14B, cover glass 11 of silicone substrate 17a bonded to cover glass 11 is covered. The surface opposite to the bonding surface is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, and the UV irradiation surface of the silicone substrate 17a is oxidized to make the surface hydrophilic. And
On the other hand, for example, the first ITO electrode 13 having a pattern as shown in FIG. 18B on the surface of the first glass substrate 16a is opposite to the surface opposite to the surface on which the first ITO electrode 13 is applied. Irradiates UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp.

  Thereafter, the UV irradiation surface of the first glass substrate 16 a and the UV irradiation surface of the silicone substrate 17 a bonded to the cover glass 11 are overlapped. The bonding strength is increased by appropriately pressing or heating the overlapped cover glass 11 and the silicone substrate 17a.

As described above, the surface on the opposite side to the surface on which the first ITO electrode 13 is applied in the first glass substrate 16a (the bonding surface of the first glass substrate 16a) itself is a hydrophilic surface. It is not always necessary to irradiate UV light. However, by irradiating the bonding surface of the first glass substrate 16a with UV light, the bonding surface of the first glass substrate 16a is activated or impurities on the bonding surface of the first glass substrate 16a are decomposed. Since it is removed, the first glass substrate 16a and the silicone substrate 17a are more reliably joined.
Further, the UV irradiation to the surface of the silicone (PDMS) substrate 17a and the bonding surface of the first glass substrate 16a may be performed simultaneously.

[Step D-1] A first glass substrate having a first transparent conductive film (ITO electrode) applied to the surface and a second glass substrate having a second transparent conductive film (ITO electrode) applied to the surface; FIG. 15 shows this process. This process shows a method for bonding a first workpiece having a hydrophobic surface and a second workpiece having a hydrophobic surface via a silicone substrate, and corresponds to a first workpiece having a hydrophobic surface. This corresponds to a first glass substrate 16a having a cover glass 11 bonded to one surface and a first ITO electrode 13 applied to the other surface, and a second workpiece having a hydrophobic surface. Is a second glass substrate 16b having a second transparent conductive film (ITO electrode 15) on its surface.

(A) Bonding of the first glass substrate 16 (already bonded to the cover glass 11) and the silicone substrate 17b As shown in FIG. 15A, an ultraviolet (UV) light source 40 such as an excimer lamp is formed on the surface of the silicone substrate 17b. The surface of the silicone substrate 17b is oxidized by irradiating with UV light emitted from the surface to make the surface hydrophilic.

  Next, as shown in FIG. 15A, the first glass substrate 16a in which the cover glass 11 is bonded to one surface and the first ITO electrode 13 is applied to the other surface in the previous step. The primer 18 is coated on the surface on which the pattern of the first ITO electrode 13 is applied. Next, the surface coated with the primer 18 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to make the primer coated surface suitable for bonding.

  Thereafter, the UV irradiation surface of the silicone substrate 17b and the UV-treated primer coat surface of the first glass substrate 16a are overlapped, and the first glass substrate 16a and the silicone substrate 17b are appropriately pressurized or heated. Then, the silicon substrate 17b and the first glass substrate 16a to which the cover glass 11 is bonded on one surface and the first ITO electrode 13 is applied to the other surface are bonded.

(B) Bonding of the first glass substrate 16a (already bonded to the cover glass 11) and the second glass substrate 16b Next, as shown in FIG. 15B, the first glass substrate 16a was bonded. The surface of the silicone substrate 17b opposite to the bonding surface with the first glass substrate 16a is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, and the silicone substrate 17b is irradiated with UV light. The surface is oxidized to make the surface hydrophilic.

  On the other hand, for example, in the second glass substrate 16b on the surface of which the second ITO electrode 15 having a pattern as shown in FIG. 18C is applied, the primer 18 is applied to the surface on which the second ITO electrode pattern is applied. Coat. Next, the surface coated with the primer 18 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to make the primer coated surface suitable for bonding.

  Thereafter, the UV irradiation surface of the silicone substrate 17b bonded to the first glass substrate 16a and the UV-treated primer coat surface of the second glass substrate 16b are overlapped, and the second glass substrate 16b and the first glass substrate 16b are appropriately combined. The silicon substrate 17b bonded to the glass substrate 16a and the silicone substrate 17b bonded to the first glass substrate 16a and the second ITO electrode 15 on the surface are pressed or heated. The two glass substrates 16b are joined.

That is, the bonding method in this step (D-1) is as follows.
(1) A first workpiece having a hydrophobic surface, in which a cover glass 11 is bonded to one surface via a silicone substrate 17a, and a first ITO electrode 13 is applied to the other surface. A primer 18 is coated on the surface of the first glass substrate 16a on which the first ITO electrode 13 is applied.
(2) The surface of the silicone substrate 17b and the surface of the first glass substrate 16a, which is the first workpiece having a hydrophobic surface, coated with the primer 18 are irradiated with ultraviolet rays to make both surfaces hydrophilic. The surface.
(3) Both ultraviolet irradiation surfaces are overlapped.
(4) While pressurizing the contact surface of each workpiece superposed in order of the silicone substrate 17b and the first glass substrate 16a (cover glass 11 bonded) which is a first workpiece having a hydrophobic surface from above. , Heat.
(5) In the second glass substrate 16b which is the second workpiece having a hydrophobic surface, the primer 18 is coated on the surface provided with the second transparent conductive film (ITO electrode 15).
(6) The surface of the silicone substrate 17b bonded to the first glass substrate 16a (cover glass 11 bonded) which is a first workpiece having a hydrophobic surface, and the second workpiece which is a second workpiece having a hydrophobic surface. The primer 18 coated on the surface of the second glass substrate 16b on which the second transparent conductive film (ITO electrode 15) is applied is irradiated with ultraviolet rays to make both surfaces hydrophilic surfaces.
(7) Superimpose both ultraviolet irradiation surfaces.
(8) From above, the first glass substrate 16a (cover glass 11 bonded), which is a first workpiece having a hydrophobic surface, the silicone substrate 17b, and the second glass, which is a second workpiece having a hydrophobic surface. It heats, pressing the contact surface of each workpiece | work piled up in order of the board | substrate 16b.
In addition, in (4) and (8) of this bonding method, only pressurization or heating may be used, but it is desirable to heat while applying pressure.

Next, the joining method of the present invention applied when manufacturing the touch panel having the configuration example shown in FIG. 13B will be described with reference to FIGS.
[Step C-2] Joining Step of Cover Glass and First Glass Substrate with First Transparent Conductive Film (ITO Electrode) Surface This step is shown in FIG. This process shows a method of bonding a first workpiece having a hydrophilic surface and a second workpiece having a hydrophobic surface via a silicone substrate, and corresponds to a first workpiece having a hydrophilic surface. The cover glass 11 and the second workpiece having a hydrophobic surface correspond to the first glass substrate 16a having the first transparent conductive film (ITO electrode 13) applied to the surface.

(A) Bonding of cover glass 11 and silicone substrate 17a A lower surface of cover glass 11 which is a first workpiece and a first ITO electrode 13 side surface of first glass substrate 16a which is a second workpiece. Prior to bonding, first, the cover glass 11 and a silicone (for example, PDMS) substrate 17a are bonded.
As shown in FIG. 16A, the surface of the silicone (PDMS) substrate 17a is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to oxidize the surface of the silicone substrate 17a and make the surface hydrophilic. Surface.
Next, the joint surface of the cover glass 11 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp.

  Thereafter, the bonding surface of the cover glass 11 and the UV irradiation surface of the silicone substrate 17a are overlapped. The bonding strength is increased by appropriately pressing or heating the overlapped cover glass 11 and the silicone substrate 17a.

In addition, since the cover glass 11 itself is a hydrophilic surface, it is not always necessary to irradiate UV light. However, by irradiating the joint surface of the cover glass 11 with UV light, the joint surface of the cover glass 11 is activated or impurities on the surface of the cover glass 11 are decomposed and removed. Bonding to 17a is more reliably performed.
Moreover, you may perform UV irradiation to the joint surface of a silicone (PDMS) board | substrate surface and the cover glass 11 simultaneously.

(B) Bonding of Silicone Substrate 17a Bonded to Cover Glass 11 and First Glass Substrate 16a Next, as shown in FIG. 16B, for example, a first pattern having a pattern as shown in FIG. In the first glass substrate 16a to which the ITO electrode 13 is applied, a primer 18 is coated on the surface on which the first ITO electrode 13 pattern is applied. Next, the surface coated with the primer 18 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to make the primer coated surface suitable for bonding.

  On the other hand, the surface of the silicone substrate 17a bonded to the cover glass 11 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp on the surface opposite to the bonding surface with the cover glass 11. The UV irradiation surface of the silicone substrate 17a is oxidized to make the surface hydrophilic.

  Thereafter, the UV-irradiated surface of the silicone substrate 17a and the UV-treated primer coat surface of the first glass substrate 16a are overlapped, and the overlapped cover glass 11 and the silicone substrate 17a are appropriately pressurized or heated. In other words, the silicone substrate 17a to which the cover glass 11 is bonded and the first glass substrate 16a to which the first ITO electrode 13 is applied are bonded.

That is, the joining method employed in this step (C-2) is as follows.
(1) The silicone substrate 17a is bonded to the lower surface of the cover glass 11, which is a first workpiece having a hydrophilic surface. The bonding method is to irradiate the silicone substrate 17a with ultraviolet rays so that the ultraviolet irradiation surface is a hydrophilic surface, and the surface is laminated on the cover glass 11 to bond the cover glass 11 as the first workpiece and the silicone substrate 17a. . As described above, the bonding surface of the cover glass 11 may be irradiated with ultraviolet rays.
(2) Primer coat the surface of the first glass substrate 16a, which is the second workpiece having a hydrophobic surface, to which the first transparent conductive film (ITO electrode 13) is applied.
(3) The first transparent conductivity of the surface of the silicone substrate 17a bonded to the cover glass 11, which is the first workpiece having a hydrophilic surface, and the first glass substrate 16a, which is the second workpiece having a hydrophobic surface. The primer 18 coated on the surface on which the film (ITO electrode 13) is applied is irradiated with ultraviolet rays to make both surfaces hydrophilic surfaces.
(4) Superimpose both ultraviolet irradiation surfaces.
(5) From above, contact surfaces of the workpieces that are superposed in the order of the cover glass 11 that is the first workpiece having a hydrophilic surface, the silicone substrate 17a, and the first glass substrate 16a that is the second workpiece. Heat while applying pressure.
In (5) of this bonding method, only pressurization or heating may be used, but it is desirable to heat while applying pressure.

[Step D-2] A first glass substrate having a first transparent conductive film (ITO electrode) applied to the surface and a second glass substrate having a second transparent conductive film (ITO electrode) applied to the surface; FIG. 17 shows this process. Also in this step, a method of bonding a first workpiece having a hydrophilic surface and a second workpiece having a hydrophobic surface via a silicone substrate is shown, and the first workpiece having a hydrophilic surface is attached to the first workpiece. This corresponds to a first glass substrate 16a having a cover glass 11 bonded to one surface on which the first ITO electrode 13 is applied, and a second work corresponding to a second workpiece having a hydrophobic surface. It is the 2nd glass substrate 16b by which the transparent conductive film (ITO electrode 15) was given to the surface.

(A) Joining of first glass substrate 16a (attached to cover glass 11) and silicone substrate 17b Joined to cover glass 11 of first glass substrate 16a, which is a first workpiece having a hydrophilic surface. Prior to joining the surface opposite to the first ITO electrode 13 side and the second ITO electrode 15 side surface of the second glass substrate 16b, which is a second workpiece having a hydrophobic surface, The first glass substrate 16a (already bonded to the cover glass 11) and the silicone (for example, PDMS) substrate 17b are bonded.

As shown in FIG. 17A, the surface of the silicone substrate 17b is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to oxidize the surface of the silicone substrate 17b and make the surface hydrophilic. The surface.
Next, as shown in FIG. 17A, an excimer lamp or the like is applied to the surface opposite to the first ITO electrode 13 side that has been bonded to the cover glass 11 of the first glass substrate 16a in the previous step. Irradiate UV light emitted from an ultraviolet (UV) light source 40.

  Thereafter, the UV irradiation surface of the silicone substrate 17b and the UV irradiation surface of the first glass substrate 16a are overlapped, and the contact surface between the first glass substrate 16a and the silicone substrate 17b is appropriately pressurized or heated. The silicon substrate 17b is bonded to the first glass substrate 16a having the cover glass 11 bonded to one surface.

(B) Joining of the first glass substrate 16a (already joined to the cover glass 11) and the second glass substrate 16b Next, as shown in FIG. 17B, the first glass substrate 16a was joined. The surface of the silicone substrate 17b opposite to the bonding surface with the first glass substrate 16a is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, and the silicone substrate 17b is irradiated with UV light. The surface is oxidized to make the surface hydrophilic.

  On the other hand, for example, in the second glass substrate 16b on the surface of which the second ITO electrode 15 having a pattern as shown in FIG. Coat. Next, the surface coated with the primer 18 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to make the primer coated surface suitable for bonding.

  Thereafter, the UV irradiation surface of the silicone substrate 17b bonded to the first glass substrate 16a and the UV-treated primer coat surface of the second glass substrate 16b are overlapped, and the second glass substrate 16b and the first glass substrate 16b are appropriately combined. The silicon substrate 17b bonded to the glass substrate 16a and the silicone substrate 17b bonded to the first glass substrate 16a and the second ITO electrode 15 on the surface are pressed or heated. The two glass substrates 16b are joined.

That is, the bonding method in this step (D-2) is as follows.
(1) A first glass substrate having a hydrophilic surface and having a cover glass 11 bonded to one surface on which the first ITO electrode 13 is applied via a silicone substrate 17a. A first glass substrate 16a that is a first workpiece having a hydrophilic surface so that the other surface of 16a and the surface of the silicone substrate 17b are irradiated with ultraviolet rays so that the ultraviolet irradiation surfaces of both workpieces are in close contact with each other; The silicone substrate 17b is laminated, and the first glass substrate 16a and the silicone substrate 17b, which are the first workpiece having a hydrophilic surface, are joined.
(2) In the second glass substrate 16b, which is the second workpiece having a hydrophobic surface, the primer 18 is coated on the surface provided with the second transparent conductive film (ITO electrode 15).
(3) The surface of the silicone substrate 17b bonded to the first glass substrate 16a (cover glass 11 bonded) which is a first workpiece having a hydrophilic surface and the second workpiece which is a second workpiece having a hydrophobic surface. The primer 18 coated on the surface of the glass substrate 16b on which the second transparent conductive film (ITO electrode 15) is applied is irradiated with ultraviolet rays to make both surfaces hydrophilic surfaces.
(4) Superimpose both ultraviolet irradiation surfaces.
(5) From above, the first glass substrate 16a (cover glass 11 bonded), which is a first workpiece having a hydrophilic surface, a silicone substrate 17b, and a second glass, which is a second workpiece having a hydrophobic surface. It heats, pressing the contact surface of each workpiece | work piled up in order of the board | substrate 16b.
In (5) of this bonding method, only pressurization or heating may be used, but it is desirable to heat while applying pressure.

The touch sensor module in the touch panel shown in FIG. 13A is configured through [Step C-1] and [Step D-1] employing the bonding method of the present invention.
Moreover, the touch sensor module in the touch panel shown in FIG.13 (b) is comprised through [process C-2] and [process D-2] which employ | adopted the joining method of this invention.

  The touch sensor module 10a and the touch panel control unit 10b are stacked on the image display device 30 such as an LCD panel to constitute a touch panel. Here, the structure example of the touch panel control unit 10b and the joining of the touch panels stacked in the order of the touch sensor module 10a, the touch panel control unit 10b, and the image display device 30 are the same as those in the related art, and thus detailed description will be given here. Omitted.

Also in the second embodiment, when the components of the touch sensor module are bonded, silicone (substrate) is used in place of the conventional OCA tape or OCR, and ultraviolet rays are applied to the joint surface between the silicone (substrate) and each component. Is irradiated.
Then, on the substrate on which the conductive thin film (for example, ITO electrode) of the touch sensor module is provided, the surface on which the conductive thin film is provided is coated with a primer (for example, a silane coupling agent), and the primer coat The surface is irradiated with ultraviolet rays. Therefore, the same effect as in the first embodiment can be achieved.

In particular, since the touch sensor module constructed in the second embodiment uses only a glass substrate as the substrate of the transparent conductive film, the touch panel incorporating this touch sensor module has high visibility and weather resistance. Become.
Further, by adopting the glass substrate as the substrate of the transparent conductive film, the surface of the transparent conductive film opposite to the surface on which the transparent conductive film is applied becomes a hydrophilic surface. Therefore, it is not necessary to introduce a primer to this surface. That is, the manufacturing process of the touch sensor module constructed in the second embodiment is simplified as compared with the manufacturing process of the touch panel constructed in the first embodiment, because the number of surfaces for introducing the primer is small.

[Experimental example]
As described above, in the bonding method according to the present invention, the surface of the first workpiece and the second workpiece having the conductive thin film applied to the bonding surface is modified by the irradiation of ultraviolet rays to the hydrophilic surface. The first workpiece and the second workpiece are laminated with the silicone substrate thus formed interposed therebetween, and the laminated first and second workpieces are subjected to heating / pressurizing treatment. 2 work is pasted together. In particular, in the bonding method of the present invention, it is conventionally possible to bond a silicone substrate and a conductive thin film surface of a conductive thin film substrate, which cannot be bonded even by using a surface modification treatment by ultraviolet irradiation. When bonding the silicone substrate to the conductive thin film substrate when the surface is hydrophobic, a silane coupling agent is introduced into the conductive thin film surface or the hydrophobic surface of the substrate, and the silane coupling agent is irradiated with ultraviolet rays. The above bonding is made possible by modifying the surface by (making the surface state suitable for bonding).

Hereinafter, experimental examples in the case where a silicone substrate and a conductive thin film substrate provided with a conductive thin film are bonded using a primer will be described.
PDMS was used as the silicone substrate, and a PET film having an ITO layer provided on one surface was used as the conductive thin film substrate. A silane coupling agent was used as the primer. The silane coupling agent is KBE-9007 manufactured by Shin-Etsu Silicone, and the structural formula is (C ₂ H ₅ O) ₃ SiC ₃ H ₆ N═C═O.

First, an acetone diluted solution of the silane coupling agent was coated on the ITO layer of the PET film 14 by a spin coating method.
Next, the joint surface of the PDMS substrate (silicone substrate) and the surface of the PET film coated with the silane coupling agent were irradiated with ultraviolet rays.
The ultraviolet light source used was an excimer lamp that emits vacuum ultraviolet rays (VUV) having a center wavelength of 172 nm. Irradiation conditions were an irradiance of 5 mW / cm ² on the irradiated surface and an irradiation time of 180 seconds.

  After the VUV irradiation, the PDMS substrate and the PET film are overlapped so that the VUV irradiation surfaces of the PDMS substrate and the PET film are in contact with each other, and a pressure of 0.25 Mpa is applied to both, so that the temperature of both becomes 100 ° C. Heated. The heating time was 30 seconds. The PDMS substrate and the PET film were joined by the procedure as described above.

In other words, this experiment allows the pasting of a silicon substrate, which has been impossible to bond even by using a surface modification treatment by ultraviolet irradiation, to the conductive thin film surface of the conductive thin film substrate. found. Similarly, it is considered possible to bond the silicone substrate and the conductive thin film substrate when the surface is hydrophobic.
In addition, the same result was obtained even if other silane coupling agents (for example, KBE-403 manufactured by Shin-Etsu Silicone Co., Ltd .: the structural formula is shown in chemical formula (1)) were used as a primer.

  Further, as the primer 18, a siloxane-based coating agent (for example, an alcoholic silica sol “Colcoat N-103X” manufactured by Colcoat Co., Ltd. (ethanol; about 4%, 2-propanol; 40%, 1-butanol; silica in a mixed solvent of 50%) Similar results were obtained using about 2% dispersed).

The bonding method of the present invention is also applicable to a case where a touch sensor module having a configuration other than the touch sensor module having the configuration shown in FIGS. 1 and 13 is configured.
For example, in FIG. 13A, the first and second glass substrates 16a and 16b to which the transparent conductive film is applied are applied to the first and second resin substrates made of the PET film 14 or the like. . In this case, [Step C-1] shown in FIG. 14 is replaced with [Step A-1] shown in FIG. The subsequent [Step D-1] can be applied as it is.

DESCRIPTION OF SYMBOLS 10 Position input device 10a Touch sensor module 10b Touch panel control part 11 Cover glass 12 Black matrix 13 1st ITO electrode (1st transparent conductive film)
14 PET film 14a Hard coat layer 15 Second ITO electrode (second transparent conductive film)
16, 16a, 16b Glass substrate 17, 17a, 17b Silicone (PDMS) substrate 18 Primer 21 Wiring layer 22 Touch panel (TP) control IC part 23 FPC (flexible printed circuit board)
30 Image display device 31 Polarizing film 32 Image display panel 40 Ultraviolet (UV) light source 100 Touch panel

Claims (4)

A method of bonding a workpiece having a hydrophobic surface and a member made of silicone, and coating one surface of the workpiece having a hydrophobic surface with a primer made of a silane coupling agent or a siloxane-based coating agent,
Irradiate the surface of the workpiece coated with the primer and the member made of silicone with ultraviolet rays,
Laminate so that the surface irradiated with ultraviolet rays of the workpiece and the surface irradiated with ultraviolet rays of the member made of silicone are in contact,
Pressurization is performed so that the contact surface between the laminated workpiece and the silicone member is pressurized, or the laminated workpiece and the silicone member are heated, or the laminated workpiece and the silicone member are contact surfaces. A method for bonding workpieces, wherein heating is performed while applying pressure so as to apply pressure. A method in which a first workpiece having a hydrophilic surface and a second workpiece having a hydrophobic surface are bonded together with a member made of silicone interposed therebetween,
A primer composed of a silane coupling agent or a siloxane coating agent is coated on the surface of the second workpiece having a hydrophobic surface,
Irradiate ultraviolet rays to one surface of the first workpiece, each of the surfaces coated with the primer of the second workpiece, and both surfaces of the silicone member,
Laminating the first workpiece, the silicone member and the second workpiece so that the surface irradiated with the ultraviolet rays is in contact,
Pressure is applied so that the contact surface is pressurized, or the laminated first and second workpieces and silicone members are heated, or the laminated first and second workpieces and silicone members are in contact with each other. A work laminating method comprising heating while pressing so that the surface is pressed. A method of bonding a first workpiece having a hydrophobic surface and a second workpiece having a hydrophobic surface with a member made of silicone interposed therebetween,
A primer composed of a silane coupling agent or a siloxane-based coating agent is coated on the surface of the first workpiece having a hydrophobic surface and the surface of the second workpiece,
Irradiate each of the surfaces coated with the primer of the first workpiece and the second workpiece and both surfaces of the silicone member with ultraviolet rays,
Laminating the first workpiece, the silicone member and the second workpiece so that the surface irradiated with the ultraviolet rays is in contact,
Bonding of workpieces characterized in that pressurization is performed so that the contact surface is pressurized, or the stacked workpiece is heated, or the stacked workpiece is heated while pressing the contact surface. Method. A touch sensor module including a touch sensor module having a substrate provided with a transparent conductive film, and an image display device,
The touch sensor module is
A substrate coated with a primer composed of a silane coupling agent or a siloxane-based coating agent, a substrate coated with a transparent conductive film whose surface coated with the primer is modified by ultraviolet irradiation, and a silicone whose surface is modified by ultraviolet irradiation And a member made of silicone, wherein the surfaces of the member made of silicone and irradiated with the ultraviolet rays are laminated facing each other.

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