JP2013143259A - Contact connection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact connection device capable of making a situation that electric connection of an attachment attached to an electronic equipment body with the electronic equipment body is cut off due to vibration etc. hard to occur with comparatively simple structure which is suitable for miniaturization of the whole, and in which the number of components is made comparatively small.SOLUTION: A contact connection device is constituted by including: a body side connection part 13 provided to an electronic equipment body 11; and an attachment side connection part 15 provided to an attachment 14. The attachment side connection part 15 includes conductive contact surface parts 16 and 17, and the body side connection part 13 includes conductive contacts 23 and 24 each made into a plate-like member having a punched shape obtained by performing punching processing to a conductive plate member, and forming a predetermined interval between the two contacts aligned and arranged in respective plate thickness directions and adjacent to each other. Contact parts provided on respective plate thickness end surfaces are brought into contact with the conductive contact surface parts 16 and 17 on the basis of a fact that the conductive contacts 23 and 24 have mutually different characteristic frequencies.

Description

  The invention described in the claims of the present application relates to a contact connection device that establishes an electrical interconnection state between an electronic device main body and an attachment when a specific attachment is attached to the electronic device main body.

  When detachably attaching an attachment such as a battery pack to an electronic device main body such as a mobile phone main body, not only mechanically attaching the attachment to the electronic device main body but also electrically connecting the attachment to the electronic device main body. Is needed. Therefore, in order to make electrical interconnection between the electronic device main body and the attachment, the main body side connection portion is provided in the electronic device main body, the attachment side connection portion is provided in the attachment, and the attachment side connection portion is provided in the main body side connection portion. Are electrically connected.

  Such a main body side connection part and an attachment side connection part shall be provided with the electroconductive contact which a main body side connection part protrudes outside, for example, and an attachment side connection part forms an electroconductive contact surface part A contact receiving part is provided. Then, when the attachment side connection portion is electrically connected to the main body side connection portion, the conductive contact provided in the main body side connection portion abuts on the conductive contact surface portion of the contact receiving portion provided in the attachment side connection portion. A state is taken, thereby placing the conductive contact and the conductive contact surface portion of the contact receiving portion in a mutual contact connection state.

  An attachment is attached to the electronic device main body, and the conductive contact provided in the main body side connection portion abuts on the conductive contact surface portion of the contact receiving portion provided in the attachment side connection portion, so that the conductive contact and the conductive contact surface portion of the contact receiving portion are provided. When the external shock or vibration is applied to the electronic device body or attachment or both the electronic device body and attachment, the contact receiving portion The mutual contact connection state between the conductive contact surface part and the conductive contact is disturbed, and the electrical connection with the main body side connection part of the attachment side connection part, that is, the electrical connection with the electronic device main body of the attachment is broken. May occur. In particular, when the frequency of impact or vibration from the outside corresponds to the natural frequency of the conductive contact included in the main body side connection portion, the conductive contact generates resonance and is relatively large. Will vibrate with a certain amplitude, thereby repeating the state of being separated from the conductive contact surface portion of the contact receiving portion, and each time an electrical connection with the electronic device body of the attachment is broken. End up.

  Therefore, in the past, even when an external shock or vibration is applied to the electronic device body or the attachment or both the electronic device body and the attachment with the attachment attached to the electronic device body, the electronic device of the attachment The device which makes it difficult to produce the situation where the electrical connection with an apparatus main body is cut | disconnected is made | formed. As such a device, a plurality of conductive contacts in which the main body side connection portion provided in the electronic device main body abuts on the conductive contact surface portion of the contact receiving portion provided in the attachment side connection portion provided in the attachment are provided. In addition, each of the plurality of conductive contacts has different natural frequencies, so that the electronic device main body or the attachment or both the electronic device main body and the attachment are attached to the electronic device main body. In addition, even when an external impact or vibration is applied, a connection mechanism that maintains a state in which at least one of the plurality of conductive contacts is in contact with the conductive contact surface portion of the contact receiving portion Has been proposed (see, for example, Patent Document 1 or Patent Document 2).

  In the connection mechanism proposed in Patent Document 1, the main body side connecting portion (connector unit (10)) provided in the electronic device main body (telephone main body (2)) forms a plurality of conductive contacts. It has a set of pins (11) and contact pins (12), and the attachment side connection provided on the attachment (battery pack (3)) attached to the electronic device body forms a conductive contact surface part A contact plate (3C) forming a contact receiving portion is provided. When the attachment is attached to the main body of the electronic device, the attachment-side connecting portion including the contact plate (3C) is disposed opposite to the main-body-side connecting portion including the pair of the contact pin (11) and the contact pin (12). .

  The contact pin (11) and the contact pin (12) that form a set included in the main body side connection portion extend in parallel to each other. The contact pin (11) is movably accommodated along the guide sleeve (14) that faces the contact plate (3C) when the attachment-side connecting portion is arranged to face the main-body-side connecting portion. Similarly, the coil spring (S1) accommodated in the guide sleeve (14) is urged in a direction toward the contact plate (3C). Further, the contact pin (12) is movably accommodated along the guide sleeve (15) that faces the contact plate (3C) when the attachment side connection portion is disposed opposite to the main body side connection portion. Similarly, the coil spring (S2) accommodated in the guide sleeve (15) is urged in a direction toward the contact plate (3C).

  Under such circumstances, the contact pin (11) and the contact pin (12) are selected as the respective mass or the spring constant of the coil spring (S1) or (S2) for energizing each or both, They have different natural frequencies. Then, with the attachment side connection portion being disposed opposite to the main body side connection portion, the set of the contact pin (11) and the contact pin (12) in the main body side connection portion is the contact plate (3C) in the attachment side connection portion. Abutting on the conductive contact surface portion, the attachment side connection portion is brought into an electrical connection state with the main body side connection portion.

  Thus, in the connection mechanism proposed in Patent Document 1, the contact pin (11) and the contact pin (12) having different natural frequencies are arranged on the conductive contact surface portion of the contact plate (3C). If the attachment is attached to the main body of the electronic device and the external shock or vibration is applied to both the electronic device main body or the attachment or both the electronic device main body and the attachment, at least contact It is expected that any one of the pin (11) and the contact pin (12) is kept in contact with the conductive contact surface portion of the contact plate (3C).

  Moreover, in the connection mechanism proposed in Patent Document 2, the main body side connection portion (card housing portion (7)) provided in the electronic device main body (card connector (1)) has a plurality of contact terminals ( 40), and the attachment side connecting portion provided on the attachment (IC (memory) card (20)) attached to the electronic device main body forms a contact receiving portion that forms a conductive contact surface portion ( 25). When the attachment is attached to the main body of the electronic device, the attachment side connecting portion is disposed to face the main body side connecting portion.

  Each of the plurality of contact terminals (40) arranged in the main body side connection portion is formed of a metal plate material, and is divided into two plate-like spring pieces having a predetermined width. The unit (43a) and the split spring piece unit (43b) are arranged in the respective width directions and extend in parallel with each other.The split spring piece unit (43a) and the split spring piece unit (43b) ) Form two conductive contacts. In the split spring piece unit (43a) and the split spring piece unit (43b), each of which is a plate spring piece, a part of the plate surface having a predetermined width in the split spring piece unit (43a) is a contact point. A part of the plate surface having a predetermined width in the split spring piece unit (43b) is a contact part (44b).

  The split spring piece unit (43a) and the split spring piece unit (43b), which form these two conductive contacts, are selected so that the width or length of each is different from each other. It has a frequency. The split spring piece unit (43a) and the split spring piece that form two conductive contacts of each contact terminal (40) in the main body side connection portion with the attachment side connection portion facing the main body side connection portion The unit (43b) has contact points (44a) and contact points (44b) formed as a part of a plate surface having a predetermined width as contact pads (25) constituting contact receiving parts in the attachment side connection part. The attachment side connection portion is brought into an electrical connection state with the main body side connection portion.

  In this manner, in the connection mechanism proposed in Patent Document 2, the split spring piece unit (43a) and the split spring piece unit (43b) having different natural frequencies are electrically connected to the contact pad (25). When an external shock or vibration is applied to the electronic device main body or attachment or both the electronic device main body and attachment while the attachment is attached to the electronic device main body by being in contact with the sexual contact surface It is expected that at least one of the split spring piece unit (43a) and the split spring piece unit (43b) is kept in contact with the conductive contact surface portion of the contact pad (25).

Japanese Patent Laid-Open No. 11-168536 (paragraphs 0006 to 0010, 0012 to 0017, FIGS. 1 to 5) JP 2002-100440 (paragraphs 0029-0036, 0044, 0045, 0048-0050, FIGS. 1-3, 6, 8, 9)

  Even if an external impact or vibration is applied to the electronic device main body or the attachment or both the electronic device main body and the attachment with the attachment attached to the electronic device main body as described above, the attachment to the electronic device main body In the connection mechanism described in Patent Document 1 that has been conventionally proposed to make it difficult for the electrical connection to be interrupted, the main body side connection portions each form a conductive contact. There are contact pins that form two sets having different natural frequencies, and these contact pins are movably accommodated along the guide sleeve and are also accommodated by coil springs accommodated in the guide sleeve. Shall be energized. Therefore, the main body side connection portion configured to include a plurality of contact pins has a drawback that the number of components is large and the configuration becomes complicated. In addition, since a relatively large occupied space is required for the installation of the guide sleeve that accommodates each contact pin, there is an inconvenience that the overall size of the main body side connection portion is hindered. The connection mechanism described in Patent Document 1 is not suitable for downsizing.

  Similarly, even if an external shock or vibration is applied to the electronic device main body or the attachment or both the electronic device main body and the attachment with the attachment attached to the electronic device main body, In the connection mechanism described in Patent Document 2 that has been conventionally proposed as a method that makes it difficult to cause a situation in which the automatic connection is cut off, the main body side connection portion includes a plurality of contact terminals arranged in an array. Each of the plurality of contact terminals forms two divided spring piece units each having a different natural frequency, each of which forms a conductive contact, arranged in the width direction and extending parallel to each other. However, each of these split spring piece units has a contact portion formed as a part of a plate surface having a predetermined width. It has been, the contact portions are intended to contact the conductive contact surface of the contact pads forming a contact receiving portion in the attachment-side connecting portion. Therefore, each conductive contact forming the two split spring piece units arranged in the width direction and extending in parallel with each other has a relatively large occupied space in the width direction. In particular, when an increase in the spring constant of the split spring piece unit is desired, the width dimension of each split spring piece unit will be increased, and as a result, the occupied space in the width direction of each conductive contact will be further increased. It will be. As a result, the main body side connection portion in which a plurality of such conductive contacts are arranged is disadvantageous in that the miniaturization thereof is hindered. Therefore, the connection described in Patent Document 2 is required. The mechanism is also unsuitable for downsizing.

  In view of such points, the invention described in the claims of the present application constitutes a connection mechanism that establishes an electrical interconnection state between the attachment and the electronic device main body when the attachment is attached to the electronic device main body. The electronic device main body or the attachment or the electronic device main body with the attachment attached to the electronic device main body with a relatively simple configuration that is suitable for the overall miniaturization and has a relatively small number of components. Provided is a contact connection device capable of making it difficult for an electrical connection between an attachment and an electronic device main body to be broken even if an external impact or vibration is applied to both the attachment and the attachment.

  A contact connection device according to an invention described in any one of claims 1 to 6 in the claims of the present application (hereinafter referred to as the present invention) is a first connection portion provided in an electronic device main body. And a second connection portion provided on an attachment attached to the electronic device main body and connected to the first connection portion, and one of the first and second connection portions is conductive contact Each of the first and second connection portions is a flat plate-like member having a punching shape obtained by punching a conductive plate material, and includes a surface portion, and in each plate thickness direction. A plurality of conductive contacts that are arranged in a row and form a predetermined distance between two adjacent ones, and at least one of the plurality of conductive contacts has a stamped shape of the plurality of conductive contacts. Unlike other things A first connection portion having a natural frequency different from that of the other ones, wherein a plurality of conductive contacts are brought into contact with the conductive contact surface portions of the respective plate thickness end surfaces. It is characterized by obtaining a mutual contact connection state between the first connection portion and the second connection portion.

  In particular, in the contact connecting device according to the second aspect of the present invention, each of the plurality of conductive contacts has elasticity, and the contact portion is connected to the conductive contact surface portion. The elastic force which presses with the board thickness end surface provided is made to act.

  In the contact connection device according to the present invention as described above, the first connection portion provided in the electronic device main body such as a mobile phone and the first provided in the attachment such as the battery pack attached to the electronic device main body. One of the two connection portions, for example, the second connection portion constituting the attachment side connection portion includes a conductive contact surface portion, and the other of the first connection portion and the second connection portion, for example, The first connection portion constituting the main body side connection portion includes a plurality of conductive contacts. Each of the plurality of conductive contacts is a flat plate member having a punched shape obtained by punching the conductive plate material, and is arranged and arranged in the respective plate thickness directions so as to be adjacent to each other. A predetermined interval is formed between the first connection portions. In addition, the plurality of conductive contacts are such that at least one of them has a natural frequency different from that of the other ones with a punching shape different from the other of the plurality of conductive contacts. The contact portions provided on the respective plate thickness end surfaces are brought into contact with the conductive contact surface portions included in the second connection portions, thereby obtaining the mutual contact connection state of the first and second connection portions. Is done.

  In particular, in the contact connection device according to the second aspect of the present invention, for example, a punched shape obtained by punching a conductive plate provided in the first connecting portion. Each of the plurality of conductive contacts that are flat plate members having elasticity has elasticity, and the contact portion provided on the plate thickness end surface is contacted with, for example, the conductive contact surface portion included in the second connection portion. When contacting, the elastic force which presses it to the electroconductive contact surface part by the plate | board thickness end surface in which the contact part was provided is made to act.

  In the contact connection device according to the present invention, the first provided in the electronic device main body, one of which is provided with a conductive contact surface portion and the other is provided with a plurality of conductive contacts abutting on the conductive contact surface portion. A plurality of conductive contacts each having a punched shape obtained by punching a conductive plate material. The first connecting portion or the second connecting portion is formed as a member, and is arranged and arranged in the respective plate thickness directions to form a predetermined interval between two adjacent ones. Therefore, the contact connection device according to the present invention can have a relatively simple configuration in which the number of components is relatively small.

  Under such circumstances, each of the plurality of conductive contacts constituting the first connection portion or the second connection portion is a flat plate shape having a punched shape obtained by punching a conductive plate material. Since it is a member and is arranged in the respective plate thickness directions to form a predetermined interval between two adjacent ones, the occupied space in the arrangement direction of the plurality of conductive contacts is relatively The first connection portion or the second connection portion formed by the plurality of conductive contacts is relatively small. Therefore, the contact connection device according to the present invention is suitable for the overall size reduction.

  Furthermore, in the contact connection device according to the present invention, the plurality of conductive contacts, at least one of which is different from the other of the plurality of conductive contacts in the punching shape. The contact portion provided on each plate thickness end surface is brought into contact with the conductive contact surface portion, and the mutual contact connection state of the first and second connection portions is determined. To get. Thereby, the attachment is attached to the electronic device main body, and the plurality of conductive contacts are brought into contact with the conductive contact surface portions of the contact portions provided on the respective plate thickness end surfaces. Even if an impact or vibration from the outside is applied to both the main body and the attachment, in the plurality of conductive contacts in which the contact portion provided on each plate thickness end surface is in contact with the conductive contact surface portion, At least one of them maintains a state in which the contact portion provided on the plate thickness end surface is in contact with the conductive contact surface portion, and the mutual connection between the first connection portion and the second connection portion. The contact connection state is continued. As a result, it is difficult to cause a situation in which the electrical connection with the electronic device main body provided with the first connection portion of the attachment provided with the second connection portion is cut off.

  Thus, according to the contact connection device according to the present invention, it is suitable for overall downsizing in constructing an electrical interconnection state between the attachment and the electronic device body when the attachment is attached to the electronic device body. In addition, with a relatively simple configuration in which the number of component parts is relatively small, and an attachment is mounted on the electronic device main body, an external impact is applied to the electronic device main body or the attachment or both the electronic device main body and the attachment. Alternatively, even if vibration is applied, it is possible to make it difficult to cause a situation in which the electrical connection of the attachment to the electronic device main body is broken.

  Moreover, according to the contact connecting device which concerns on what was described in Claim 2 of this invention, it is obtained by stamping the electroconductive board | plate material with which a 1st connection part or a 2nd connection part is provided. Each of the plurality of conductive contacts which are flat plate members having a punched shape has elasticity, and the second connecting portion or the first connecting portion is provided as a contact portion provided on the plate thickness end surface. When contacting the conductive contact surface portion with which the conductive contact surface portion is provided, an elastic force is applied to the conductive contact surface portion by the plate thickness end surface provided with the contact portion, so that the first connection portion and the second connection portion The mutual contact connection state can be obtained more reliably and stably.

It is a perspective view which shows the part of the electronic device main body to which an example of the contact connection apparatus which concerns on this invention was applied, and the attachment with respect to an electronic device main body. It is the perspective view seen from the front side showing the main part side connection part (the 1st connection part) which constitutes an example of the contact connection device concerning the present invention. It is the perspective view seen from the back side showing the main part side connection part (the 1st connection part) which constitutes an example of the contact connection device concerning the present invention. It is a top view which shows the main body side connection part (1st connection part) which comprises an example of the contact connection apparatus which concerns on this invention. It is sectional drawing which shows the VV line cross section in FIG. It is a perspective view which shows one of the 2 types of electroconductive contacts with which the main body side connection part (1st connection part) which comprises an example of the contact connection apparatus which concerns on this invention is equipped. It is sectional drawing which shows the VII-VII line cross section in FIG. It is a perspective view which shows the other of the 2 types of electroconductive contacts with which the main body side connection part (1st connection part) which comprises an example of the contact connection apparatus which concerns on this invention is equipped. It is sectional drawing which shows the state in which the attachment is in the middle of the attachment to an electronic device main body in the part with respect to the part of the electronic device main body to which an example of the contact connection apparatus which concerns on this invention was applied, and an attachment with respect to an electronic device main body. It is sectional drawing which shows the state which mounting | wearing to the electronic device main body of the attachment was completed in the part of the electronic device main body and the attachment with respect to an electronic device main body to which an example of the contact connection apparatus which concerns on this invention was applied.

  The mode for carrying out the present invention will be described with reference to the following embodiments of the present invention.

  An example of a contact connection device according to the present invention is an attachment provided on an attachment such as a battery pack attached to a main body side connection portion provided on an electronic device main body and an electronic device main body, which is a main body of an electronic device such as a mobile phone. Side connection part. FIG. 1 shows a part of an electronic device main body to which an example of a contact connection device according to the present invention is applied and an attachment to the electronic device main body.

  In FIG. 1, for example, an electronic device main body 11 that is a main body of an electronic device used as a mobile phone includes a circuit board 12 to which various electronic components are attached. The circuit board 12 includes a main body side connection portion 13. The electronic device main body 11 is provided with a main body side connection portion (first connection portion) 13. Further, for example, an attachment 14, which is a battery pack, is attached to the electronic device main body 11 in a state of being arranged on the circuit board 12.

  The attachment 14 is provided with an attachment side connection portion (second connection portion) 15 that is arranged as a flat portion and connected to the main body side connection portion 13. The attachment-side connecting portion 15 includes a pair of conductive contact surface portions 16 and 17 that are opposed to the main body-side connecting portion 13. Each of the conductive contact surface portions 16 and 17 is formed by a flat contact member 18 (FIGS. 9 and 10) formed of a conductive plate material.

  2, 3, and 4 show the main body side connection portion 13 provided in the electronic device main body 11. The main body side connection portion 13 includes a housing 20 that is formed of an insulating material such as a synthetic resin and disposed on the circuit board 12. The housing 20 is provided with a pair of fixed metal members 21 and 22 and two sets of first conductive contacts 23 and second conductive contacts 24. The two first conductive contacts 23 and the two second conductive contacts 24 that form two sets are arranged as a total of four conductive contacts. Therefore, the main body side connecting portion 13 includes a plurality of conductive contacts arranged in an array, which are two first conductive contacts 23 and two second conductive contacts 24.

  As shown in FIG. 1, the fixed metal member 21 provided in the housing 20 is fixed to the mounting portion 26 provided on the circuit board 12 by soldering, for example. Although not shown, the fixed metal member 22 provided on the housing 20 is also fixed by soldering, for example, to an attachment portion similar to the attachment portion 26 provided on the circuit board 12. Thereby, the housing 20 is fixed to the circuit board 12, and the entire main body side connection portion 13 is attached to the circuit board 12.

  Each of the two first conductive contacts 23 and the two second conductive contacts 24 is, for example, a flat plate having a punching shape obtained by punching a conductive plate material having elasticity. It is considered as a member. The first conductive contact 23 and the second conductive contact 24 forming each of the two sets are arranged in the respective plate thickness directions, and a predetermined interval is formed between them. Yes.

  As shown in FIG. 5 showing a cross section taken along the line V-V in FIG. 4, and further as shown in FIG. 6 alone, the first conductive contact 23 formed as a flat plate member having a punched shape is formed in the housing 20. A bent belt-like body extending from the front side end face part 20a to the back side end face part 20b is formed. At one end portion, a contact portion 27 is provided on the plate thickness end surface, and at the other end portion, a press-fit locking portion 28 for the housing 20 and a connection end portion 29 for the circuit board 12 are provided. A contact portion 27 provided at one end portion of the first conductive contact 23 is led out of the housing 20 from the front end surface portion 20 a of the housing 20, and is also connected to the other end portion of the first conductive contact 23. The provided connection end portion 29 is led out of the housing 20 from the rear side end surface portion 20b of the housing 20, and the press-fitting locking portion 28 provided at the other end portion of the first conductive contact 23 is provided in the housing. A bent portion that is press-fitted into 20 and connects one end portion and the other end portion of the first conductive contact 23 is accommodated in the housing 20.

  The first conductive contact 23 in which the press-fitting locking portion 28 is press-fitted into the housing 20 and fixed to the housing 20 can elastically displace the contact portion 27 by the elasticity of the conductive plate material constituting the first conductive contact 23. Is done.

  Further, as shown in FIG. 7 showing a cross section taken along line VII-VII in FIG. 4, and further, as shown in FIG. 8 alone, the second conductive contact 24 formed as a flat plate member having a punched shape is also provided. The housing 20 is a bent belt-like body extending from the front side end face part 20a to the back side end face part 20b. At one end portion, a contact portion 30 is provided on the plate thickness end surface, and at the other end portion, a press-fit locking portion 31 for the housing 20 and a connection end portion 32 for the circuit board 12 are provided. The contact portion 30 provided at one end portion of the second conductive contact 24 is led out of the housing 20 from the front-side end surface portion 20a of the housing 20, and is also connected to the other end portion of the second conductive contact 24. The provided connection end portion 32 is led out of the housing 20 from the rear side end surface portion 20b of the housing 20, and the press-fit locking portion 31 provided at the other end portion of the second conductive contact 24 is the housing. A bent portion that is press-fitted into the second conductive contact 24 and connects one end portion and the other end portion of the second conductive contact 24 is accommodated in the housing 20.

  The second conductive contact 24 in which the press-fitting locking portion 31 is press-fitted into the housing 20 and fixed to the housing 20 can also elastically displace the contact portion 30 due to the elasticity of the conductive plate material constituting the second conductive contact 24. Is done.

  The first conductive contact 23 and the second conductive contact 24 as described above are different from each other in the punching shapes forming the respective bent-shaped bodies, thereby having different natural frequencies. Has been. Accordingly, the first conductive contact 23 and the second conductive contact 24 forming the two sets are arranged and arranged in the plate thickness direction in the housing 20 with different natural frequencies. Will be provided.

  As shown in FIG. 1, the connection end portion 29 and the connection end portion 32 provided on the first conductive contact 23 and the second conductive contact 24 forming one of the two sets are respectively connected to the housing 20. Is fixed to the circuit board 12 and connected to the connection terminal portion 33 provided on the circuit board 12 by, for example, soldering. Further, the connection end portion 29 and the connection end portion 32 provided in the first conductive contact 23 and the second conductive contact 24 forming the other of the two sets are fixed to the circuit board 12 by the housing 20. Then, the connection terminal portion 34 provided on the circuit board 12 is connected to the connection terminal portion 34 by, for example, soldering. Thereby, each of the first conductive contact 23 and the second conductive contact 24 is electrically connected to the circuit component in the circuit board 12.

  Further, the contact portion 27 and the contact portion 30 provided in the first conductive contact 23 and the second conductive contact 24 that form one of the two sets, respectively, are such that the housing 20 is fixed to the circuit board 12. Conductive contact provided in the attachment-side connecting portion 15 of the attachment 14 attached to the electronic device body 11 with the connecting end portion 29 and the connecting end portion 32 connected to the connecting terminal portion 33 provided on the circuit board 12. A state of contacting the surface portion 16 is taken. Similarly, the contact portion 27 and the contact portion 30 provided on the first conductive contact 23 and the second conductive contact 24 forming the other of the two sets are respectively fixed to the circuit board 12. The connection end portion 29 and the connection end portion 32 are connected to the connection terminal portion 34 provided on the circuit board 12, and the conductivity provided in the attachment-side connection portion 15 in the attachment 14 attached to the electronic device main body 11. A state of contacting the contact surface portion 17 is taken. Therefore, each of the first conductive contact 23 and the second conductive contact 24 has a conductive thickness provided on the attachment-side connecting portion 15 of the attachment 14 on the plate thickness end surface provided with the contact portion 27 and the contact portion 30. The contact surfaces 16 and 17 are brought into contact with each other.

  Under such circumstances, when the attachment 14 is attached to the electronic device main body 11 having the main body side connecting portion 13 attached to the circuit board 12, first, as shown in FIG. 9, the attachment 14 is provided on the electronic device main body 11. The attachment side connecting portion 15 is placed in a state of being pressed and moved toward the circuit board 12 with the front side end surface portion 20a of the housing 20 in the main body side connecting portion 13 facing. In this case, the first conductive contact 23 and the second conductive contact 24 forming one of the two sets provided in the main body side connection portion 13 are provided with a contact portion 27 and a contact portion 27 provided on a plate thickness end surface, respectively. The contact portion 30 is brought into contact with the conductive contact surface portion 16 formed by the flat contact member 18 provided in the attachment side connection portion 15 of the attachment 14. In addition, although not shown in the drawings, the first conductive contact 23 and the second conductive contact 24 constituting the other of the two sets provided in the main body side connecting portion 13 are each provided with a plate thickness. The contact portion 27 and the contact portion 30 provided on the end surface are brought into contact with the conductive contact surface portion 17 formed by the flat contact member 18 provided in the attachment side connection portion 15 in the attachment 14.

  Thereafter, the attachment 14 has a first conductive property provided in the main body side connection portion 13 on each of the conductive contact surface portions 16 and 17 formed by the flat contact member 18 provided in the attachment side connection portion 15 in the attachment 14. As shown in FIG. 10, the contact portion 27 and the contact portion 30 provided on the plate thickness end surfaces of the contact 23 and the second conductive contact 24 are continuously pressed and moved while contacting each other. The state of being placed on the circuit board 12 is taken. As a result, the attachment of the attachment 14 to the electronic device main body 11 is completed.

  In this way, when the attachment 14 is attached to the electronic device main body 11, the first conductive contact 23 and the second conductive contact 24 that form one of the two sets provided in the main body side connection portion 13. However, due to the elasticity of each, the contact portion 27 and the contact portion 30 provided on each plate thickness end surface are elastically displaced, and the conductive contact surface portion 16 on which the contact portion 27 abuts the plate is provided with the contact portion 27. The first conductive contact 23 and the second conductive member forming the other of the two sets provided in the main body side connection portion 13 are made to act by a pressing force by the thick end surface and the plate thickness end surface provided with the contact portion 30. The contact portion 27 is provided on the conductive contact surface portion 17 where the contact portion 27 and the contact portion 30 provided on the respective plate thickness end faces are elastically displaced by the elasticity of the conductive contacts 24 and are brought into contact with each other. Thickness end face and the contact portion 30 exerts a pressing force of the plate thickness end surface provided. Thereby, the mutual contact between the main body side connecting portion 13 having the first conductive contact 23 and the second conductive contact 24 and the attachment side connecting portion 15 having the conductive contact surface portion 16 and the conductive contact surface portion 17. The connection state can be obtained more reliably and stably.

  And the mutual contact connection of the main body side connection part 13 provided with the first conductive contact 23 and the second conductive contact 24 and the attachment side connection part 15 provided with the conductive contact surface part 16 and the conductive contact surface part 17. When the state is taken, the attachment 14 includes the conductive contact surface portion 16 and the conductive contact surface portion 17 included in the attachment side connection portion 15, and the first conductive contact 23 and the second contact portion included in the main body side connection portion 13. Are electrically connected to the circuit components of the circuit board 12 through the conductive contacts 24.

  Under such circumstances, the first conductive contact 23 and the second conductive contact 23 are respectively brought into contact with the conductive contact surface portion 16 and the conductive contact surface portion 17 of the attachment-side connection portion 15, respectively. The conductive contacts 24 are different from each other in the punching shapes forming the respective bent-shaped bodies, and thus have different natural frequencies. Even if external shock or vibration is applied to both the attached attachment 14 or the electronic device main body 11 and the attachment 14, at least one of them makes the contact portion 27 or the contact portion 30 conductive. The first conductive contact 23 and the second conductive contact are maintained in contact with the contact surface portion 16 or the conductive contact surface portion 17. 4 becomes to continue the mutual contact connection between the attachment-side connecting portion 15 having a body-side connecting portion 13 and the conductive contact surface 16 and the conductive contact surface 17 with the. As a result, it is difficult to cause a situation in which the electrical connection with the electronic device main body 11 provided with the main body side connection portion 13 of the attachment 14 provided with the attachment side connection portion 15 is cut off.

  In the example of the contact connecting device according to the present invention as described above, the main body side connecting portion 13 provided with the first conductive contact 23 and the second conductive contact 24 provided in the electronic device main body 11. And the attachment-side connecting portion 15 provided with the conductive contact surface portion 16 and the conductive contact surface portion 17 provided on the attachment 14, and the first conductive contact 23 and the second conductive contact 24. Are flat plate members each having a punching shape obtained by punching a conductive plate material, and are arranged in the respective plate thickness directions to form a predetermined interval between two adjacent ones. The main body side connecting portion 13 is configured. Therefore, an example of the contact connecting device according to the present invention described above can have a relatively simple configuration in which the number of components is relatively small.

  Under such circumstances, each of the first conductive contact 23 and the second conductive contact 24 is a flat plate member having a punched shape obtained by punching a conductive plate material. At the same time, the first conductive contacts 23 and the second conductive contacts 24 are arranged in a direction in which the first conductive contacts 23 and the second conductive contacts 24 are arranged. The space occupied by the main body side connecting portion 13 formed by the first conductive contact 23 and the second conductive contact 24 is relatively small. Therefore, an example of the above-described contact connection device according to the present invention is suitable for overall miniaturization.

  Furthermore, in the example of the contact connecting device according to the present invention described above, as described above, the first conductive contact 23 and the second conductive contact 24 have different natural frequencies. Thus, even if an external impact or vibration is applied to the electronic device main body 11 or the attachment 14 attached to the electronic device main body 11 or both of the electronic device main body 11 and the attachment 14, the attachment-side connection portion 15 is provided. In addition, it is difficult to cause a situation where the electrical connection with the electronic device main body 11 provided with the main body side connection portion 13 of the attachment 14 is cut off.

  Thus, according to the above-described contact connection device according to the present invention, in constructing an electrical interconnection state between the attachment 14 and the electronic device main body 11 when the attachment 14 is mounted on the electronic device main body 11, Mounted on the electronic device main body 11 or the electronic device main body 11 with the attachment 14 mounted on the electronic device main body 11 with a relatively simple configuration suitable for overall miniaturization and having a relatively small number of components. Even if an external impact or vibration is applied to both the attached attachment 14 or the electronic device main body 11 and the attachment 14, it is difficult to cause a situation where the electrical connection of the attachment 14 to the electronic device main body 11 is broken. Will be able to.

  In the above example, the main body side connection portion 13 provided in the electronic device main body 11 includes the first conductive contact 23 and the second conductive contact 24, and the attachment side connection portion provided in the attachment 14. 15 is provided with the conductive contact surface portion 16 and the conductive contact surface portion 17, but the contact connection device according to the present invention is not limited to such an example, and is provided in the electronic device main body. The main body side connection portion includes a conductive contact surface portion corresponding to the conductive contact surface portion 16 or the conductive contact surface portion 17, and the attachment side connection portion provided in the attachment to the electronic device main body includes the first conductive contact 23 and A plurality of conductive contacts having different natural frequencies corresponding to the second conductive contact 24 may be provided.

  In the above example, the main body side connecting portion 13 provided in the electronic device main body 11 includes two first conductive contacts 23 and two second conductive contacts 24 that form two sets. The attachment-side connecting portion 15 provided on the attachment 14 includes the conductive contact surface portion 16 and the conductive contact surface portion 17, but the contact connection device according to the present invention is limited to such an example. One of the main body side connecting portion provided in the electronic device main body and the attachment side connecting portion provided in the attachment to the electronic device main body is, for example, the conductive contact surface portion 16 or the conductive contact surface portion 17. Correspondingly, at least one conductive contact surface portion is provided, and a main body side connecting portion provided in the electronic device main body and an attachment provided in the attachment to the electronic device main body. A plurality of conductive elements having at least one natural frequency different from that of the other, for example, the other of the connection portions on the side of the cementment corresponds to the first conductive contact 23 and the second conductive contact 24, for example. A contact may be provided.

  The contact connection device according to the present invention as described above constitutes a connection mechanism for constructing an electrical interconnection state between the attachment and the electronic device main body when the attachment is mounted on the electronic device main body. It is suitable for downsizing and has a relatively simple configuration with a relatively small number of component parts. With the attachment attached to the electronic device body, both the electronic device body or attachment or both the electronic device body and attachment Can be widely applied to various electronic devices, etc., as it can make it difficult to cause a situation in which the electrical connection of the attachment to the electronic device main body is broken even when an external impact or vibration is applied It is.

  DESCRIPTION OF SYMBOLS 11 ... Electronic device main body, 12 ... Circuit board, 13 ... Main body side connection part, 14 ... Attachment, 15 ... Attachment side connection part, 16, 17 ... Conductive contact surface part, DESCRIPTION OF SYMBOLS 18 ... Flat contact member, 20 ... Housing, 20a ... Front side end surface part, 20b ... Back side end surface part, 21, 22 ... Fixed metal member, 23 ... 1st Conductive contact, 24 ... second conductive contact, 26 ... mounting portion, 27, 30 ... contact portion, 28, 31 ... press-fit locking portion, 29, 32 ... connection end Part, 33, 34 .. connection terminal part

Claims (6)

A first connection portion provided in the electronic device main body and a second connection portion provided in the attachment attached to the electronic device main body and connected to the first connection portion;
One of the first and second connection portions is provided with a conductive contact surface portion, and the other of the first and second connection portions is obtained by punching a conductive plate material. A plurality of conductive contacts that are arranged in the thickness direction and form a predetermined interval between two adjacent ones, each of which is a flat plate member having a punched shape. At least one of the plurality of conductive contacts having a punched shape different from the other of the plurality of conductive contacts and having a different natural frequency than the other of the plurality of conductive contacts. A contact connection device characterized in that a contact portion provided on each plate thickness end surface is brought into contact with the conductive contact surface portion to obtain a mutual contact connection state of the first and second connection portions.   Each of the plurality of conductive contacts has elasticity, and an elastic force is applied to the conductive contact surface portion to press the conductive contact surface portion with a plate thickness end surface provided with the contact portion. The contact connection device according to claim 1.   The first connection portion is disposed on the circuit board, and each of the plurality of conductive contacts included in the first connection portion or the conductive contact surface portion is connected to a connection terminal portion provided on the circuit board. The contact connection device according to claim 1, further comprising a connection end portion.   The first connection portion includes the plurality of conductive contacts and a housing that accommodates most of the plurality of conductive contacts, and the contact portion and the connection of each of the plurality of conductive contacts. The contact connecting device according to claim 3, wherein the end portion is led out of the housing.   The contact connection device according to claim 1, wherein the conductive contact surface portion is formed by a flat contact member formed of a conductive plate material.   Each of the plurality of conductive contacts is formed into a bent belt-like body, and at least one of the plurality of conductive contacts has a punched shape forming a bent shape body as the other of the plurality of conductive contacts. The contact connection device according to claim 1, wherein the contact connection device is different.

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