JP2013140904A - Light emitting device and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a light emitting device which efficiently extracts light.SOLUTION: In a light emitting device 1, a light emitting element 20 on a substrate 10 is covered by a resin 50. A manufacturing method of the light emitting device 1 includes a resin hardening process where the resin 50 dropped toward the light emitting element 20 is hardened by utilizing heat generated by the light emitting element 20. The manufacturing method enables the resin 50 covering the light emitting element 20 to be easily formed into a substantially semicircular shape (a substantially hemispherical shape) in a cross sectional view. Thus can be provided a light emitting device, which reduces the likelihood that light emitted form the light emitting element 20 is totally reflected on a boundary surface between a sealing resin and an outer air layer and enables efficient light extraction.

Description

  The present invention relates to a light emitting device and a method for manufacturing the same.

  Conventionally, for example, a light emitting device using a light emitting element such as an LED (Light Emitting Diode) chip is known. A light emitting device using an LED chip is applied to various devices. For example, it is applied to a backlight of a liquid crystal display device (a light source device that illuminates a liquid crystal panel from the back). The backlight includes a type called a direct type and a type called an edge light type.

  An edge light type backlight will be described as an example. Light emitted from the light emitting device enters the light guide plate from the end face of the light guide plate. The light incident on the light guide plate is emitted in a planar shape from the light guide plate and illuminates the liquid crystal panel from the back. In such an edge light type backlight, the intensity of the light emitted from the light emitting device is constant so that the light emitted from the light emitting device is efficiently incident from the end face of the light guide plate into the light guide plate. It is required to be strong in the direction (having directivity). For this reason, a light emitting device applied to an edge light type backlight generally has a cup-shaped reflector structure.

  A configuration of a light emitting device having a cup-shaped reflector structure can be found in, for example, Patent Document 1. FIG. 8 is a schematic cross-sectional view showing a configuration of a conventional light emitting device having a cup-shaped reflector structure. A conventional light emitting device 100 includes a light emitting element (LED chip) 101, a package (base) 102 on which the light emitting element 101 is placed, a lead 103 integrally formed with the package 102, a light emitting element 101 and a lead 103. And a sealing resin 105 that covers the light emitting element 101 and the wire 104.

  The package 102 includes a reflector portion 106 made of, for example, white resin. The reflector portion 106 is formed with an opening portion 106a having a side surface that is inclined so as to have a wide opening in the opening direction. The light emitted from the light emitting element 101 (located on the bottom surface of the opening 106a) is efficiently extracted in a desired direction by utilizing reflection by the side surface (tilted side surface) of the reflector unit 106 or the like.

JP 2007-36030 A

  By the way, in the conventional light emitting device 100, the sealing resin 105 is filled in the opening 106 a of the reflector portion 106 for the purpose of protecting the light emitting element 101 and the wire 104. As the material of the sealing resin 105, an epoxy-based or silicone-based thermosetting resin is often used. In this case, the refractive index of the sealing resin 105 is approximately 1.4 to 1.6. On the other hand, the refractive index of the air layer outside the package 102 is 1.0.

  Since there is a refractive index difference between the sealing resin 105 and the air layer, a part of the light emitted from the light emitting element 101 and incident on the interface between them (incident angle to the interface is 38 to 46 ° or more). Light having an angle) is totally reflected according to Snell's law and bounces back into the interior (inside the package). The totally reflected light repeats internal reflection and eventually exits to the outside (air layer). However, since the intensity of light attenuates as the internal reflection is repeated, the conventional light emitting device 100 has a phenomenon that the extraction efficiency of light emitted from the light emitting element 101 is lowered.

  In view of the above, an object of the present invention is to provide a light emitting device that can efficiently extract light and a method for manufacturing such a light emitting device.

  In order to achieve the above object, a method for manufacturing a light emitting device according to the present invention is a method for manufacturing a light emitting device in which a light emitting element mounted on a base is covered with a resin, and the resin dropped toward the light emitting element Is configured (first configuration) including a resin curing step of curing using heat generated by the light emitting element.

  According to this configuration, the shape of the resin (sealing resin) that covers the light emitting element can be easily formed in a substantially semicircular shape (substantially hemispherical shape) in cross-sectional view. For this reason, according to this configuration, it is possible to provide a light emitting device in which the possibility that the light emitted from the light emitting element is totally reflected at the interface between the sealing resin and the external air layer can be reduced. In other words, according to this configuration, it is possible to provide a light emitting device with high light extraction efficiency. Moreover, according to this structure, the advantage that the quantity of sealing resin can be reduced is also acquired.

  In the manufacturing method of the light emitting device having the first configuration, even when the resin curing step is performed a plurality of times, a configuration in which the resin covering the light emitting element has a multiple structure (second configuration) is adopted. I do not care. The multiple structure of the resin may be, for example, a structure in which a plurality of resins having different refractive indexes are stacked or a structure in which a plurality of resins containing different types of phosphors are stacked.

  In the manufacturing method of the light emitting device having the first or second configuration, there is a plurality of the light emitting elements mounted on the base, and the resin curing step is applied to each of the plurality of light emitting elements (first 3 configuration) may be employed. According to this configuration, it is possible to provide a light emitting device that includes a plurality of light emitting elements and has high light extraction efficiency. In this configuration, various types of light-emitting devices can be provided depending on how the types of light-emitting elements and resins are combined.

  In the manufacturing method of the light emitting device having the third configuration, the resin types may be different from each other (fourth configuration) among the plurality of light emitting elements.

  In the method for manufacturing a light emitting device having any one of the first to fourth configurations, the base is provided with a reflector part that reflects light emitted from the light emitting element, and the light emitting element includes the reflector part. The structure (5th structure) arrange | positioned in the opening formed in may be sufficient. Even with the light emitting device having such a configuration, according to the manufacturing method of this configuration, it is possible to easily provide a light emitting device having a sealing resin structure in which total reflection can be easily reduced.

  In order to achieve the above object, a light-emitting device of the present invention includes a base, a reflector provided on the base, and formed with an opening, mounted on the base, and within the opening. (6th structure) provided with the light emitting element arrange | positioned in (2), and the sealing resin of the semi-circular view in cross section which covers the said light emitting element.

  According to this configuration, it is possible to reduce the possibility that the light emitted from the light emitting element is totally reflected at the interface between the sealing resin and the external air layer. That is, according to the light emitting device having this configuration, it is possible to efficiently extract light.

  In the light emitting device having the sixth structure, a structure (seventh structure) in which the sealing resin has a multiple structure may be employed. The multiple structure of the sealing resin may be, for example, a structure in which a plurality of resins having different refractive indexes are stacked, or a structure in which a plurality of resins containing different types of phosphors are stacked. Good.

  In the light emitting device having the sixth or seventh structure, a plurality of light emitting elements are mounted on the base, and each of the plurality of light emitting elements is separately covered with the sealing resin (eighth). The configuration may be as follows. In this configuration, various types of light-emitting devices can be provided depending on how the types of light-emitting elements and resins are combined.

  In the light emitting device having the eighth configuration, a configuration (ninth configuration) in which the types of the sealing resin are different from each other between the plurality of light emitting elements may be employed.

  ADVANTAGE OF THE INVENTION According to this invention, the light-emitting device which can take out light efficiently, and the manufacturing method of such a light-emitting device can be provided.

The top view which shows schematic structure of the light-emitting device which concerns on 1st Embodiment of this invention. 1 is a schematic cross-sectional view at the position AA in FIG. Schematic sectional view showing the manufacturing flow of the light emitting device of the first embodiment The top view which shows schematic structure of the light-emitting device which concerns on 2nd Embodiment of this invention. Schematic sectional view at the BB position in FIG. The top view which shows schematic structure of the light-emitting device which concerns on 3rd Embodiment of this invention. Schematic cross-sectional view at the CC position in FIG. Schematic sectional view showing the configuration of a conventional light emitting device having a cup-shaped reflector structure Schematic sectional view showing the manufacturing flow of a conventional light emitting device

  Embodiments of a light emitting device and a method for manufacturing the same according to the present invention will be described below with reference to the drawings.

<First Embodiment>
FIG. 1 is a top view showing a schematic configuration of a light emitting device 1 according to the first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view at the position AA in FIG. In FIG. 2, the state of light emitted from the light emitting element 20 is schematically shown by broken-line arrows. As shown in FIGS. 1 and 2, the light emitting device 1 has a substantially rectangular parallelepiped appearance. However, the external shape of the light emitting device 1 is merely an example, and the shape may be changed as appropriate.

  The light emitting device 1 includes a light emitting element 20 mounted on the base 10. The light emitting element 20 is an LED chip formed using a semiconductor. The type of semiconductor constituting the LED chip is appropriately determined depending on, for example, the wavelength of light desired to be emitted from the LED chip.

  The base 10 of the light emitting device 1 includes a reflector unit 11. The reflector portion 11 is formed with an inverted quadrangular frustum-shaped opening 11a. The opening 11a has a side surface that is inclined so as to have a wide opening toward the outside (in FIG. 2, the upper side corresponds). The light emitting element 20 is disposed in the opening 11a. A part of the light emitted from the light emitting element 20 is reflected by the side surface of the opening 11a.

  The reflector unit 11 is preferably formed with a high light reflectance, and is formed of, for example, a white resin. The reflector portion 11 may be formed integrally with the base 10, or may be formed as a member different from the base 10 and fixed to the base 10.

  A lead terminal 30 is attached to the base 10 of the light emitting device 1. The lead terminal 30 may be formed integrally with the base 10. The lead terminal 30 may be formed of a material having good conductivity, for example, a metal such as copper or a copper alloy. Specifically, the lead terminal 30 includes a pair of lead terminals 31 and 32 so as to function as positive and negative electrodes.

  Each of the pair of lead terminals 31 and 32 is provided such that one end thereof is positioned on the bottom surface of the opening 11 a of the reflector unit 11. In addition, the two types of lead terminals 31 and 32 are both bent in the middle from the one end to the other end. The other end portion is exposed to the outside in a state of wrapping around the lower side of the base 10.

  The light emitting element 20 is placed on one side of the pair of lead terminals 31 and 32 (in this embodiment, the lead terminal 31). Specifically, the light emitting element 20 is placed in the vicinity of one end located on the bottom surface of the opening 11 a of the lead terminal 31. The light emitting element 20 is electrically connected to the lead terminals 31 and 32 via metal wires 40.

  The lead terminals 31 and 32 are preferably formed with high reflectivity so that the light emitted from the light emitting element 20 can be efficiently reflected. For this purpose, the lead terminals 31 and 32 may be subjected to metal plating such as aluminum or silver.

  The light emitting element 20 and the metal wire 40 are covered with a sealing resin 50. The sealing resin 50 may be a thermosetting resin such as silicone or epoxy. Further, the sealing resin 50 may include an additive such as a phosphor. The sealing resin 50 is provided for the purpose of protecting the light emitting element 20 and the metal wire 40 from an external impact or the like. The sealing resin 50 in the light emitting device 1 is provided in a substantially semicircular shape (substantially hemispherical shape) in cross-sectional view. The reason why the sealing resin 50 is provided in such a shape will be apparent from the following description.

  Next, a method for manufacturing the light emitting device 1 configured as described above will be described. FIG. 3 is a schematic cross-sectional view showing a manufacturing flow of the light emitting device 1 of the first embodiment.

  As shown in FIG. 3, in manufacturing the light emitting device 1, first, the light emitting element 20 is mounted on the base 10 (step (a)). The base 10 including the reflector portion 11 is formed integrally with a lead frame (a predetermined pattern is formed) by insert molding, for example. This lead frame is subjected to processing such as bending after insert molding to become the lead terminal 30 described above.

  A die bond material is supplied to one (lead terminal 31) of the pair of lead terminals 31 and 32 exposed from the opening 11a of the reflector part 11, and the light emitting element 20 is placed thereon. As a result, the light emitting element 20 is fixed to one end of the lead terminal 31. Thereafter, wire bonding is performed, and each of the pair of lead terminals 31 and 32 and the light emitting element 20 are electrically connected via the metal wire 40.

  When the light emitting element 20 is mounted on the base 10, the light emitting element 20 of the light emitting device 1 is turned on (step (b)). When the light emitting element 20 is turned on, the light emitting element 20 generates heat and heat is supplied to the vicinity thereof. In this step (b), the lead terminals 31 and 32 are electrically connected to a power supply unit (not shown) so that the light emitting element 20 can be turned on.

  When the light emitting element 20 is turned on, a predetermined amount of the sealing resin 50 is dropped (injected) toward the light emitting element 20 using, for example, a dispenser. The dropped sealing resin 50 is heat-cured immediately after the dropping by the heat generated by lighting the light emitting element 20 (step (c)). Heat generated by the light emission of the light emitting element 20 is thermally conducted radially. For this reason, the shape of the sealing resin 50 dripped toward the light emitting element 20 can be made substantially semicircular (substantially hemispherical) in cross-sectional view.

  Thus, the light-emitting device 1 having the cup-shaped reflector structure in which the light-emitting element 20 and the metal wire 40 are covered with the sealing resin 50 is obtained (step (d)).

  Note that the time until the sealing resin 50 is cured can be controlled by changing the amount of heat generated when the light emitting element 20 is turned on. The amount of heat generated when the light emitting element 20 is turned on can be varied by adjusting the amount of power supplied to the light emitting element 20 and the lighting time of the light emitting element 20. That is, the turn-off timing of the light emitting element 20 is executed at an appropriate timing so as to obtain a desired heat generation amount. The lighting timing of the light emitting element 20 may be determined as appropriate. In some cases, for example, the timing may be almost the same as the dropping of the sealing resin 50.

  Next, the effect in the light-emitting device 1 of 1st Embodiment and its manufacturing method is demonstrated. Prior to the description of the effect, a method for manufacturing the conventional light emitting device 100 (see FIG. 8) will be described as a comparative example. FIG. 9 is a schematic cross-sectional view showing a manufacturing flow of the conventional light emitting device 100.

  As shown in FIG. 9, in manufacturing the conventional light emitting device 100, first, the light emitting element 101 is mounted on the base 102 (step (a)). This step (a) is the same as the manufacturing method of the light emitting device 1 according to the first embodiment described above.

  When the light emitting element 101 is mounted on the base 102, a predetermined amount of the sealing resin 105 is dropped (injected) using, for example, a dispenser, and the opening 106 a of the reflector 106 is filled with the sealing resin 105 ( Step (b)). When the opening 106a is filled with the sealing resin 105, the sealing resin 105 is heated and cured by, for example, oven heating (step (c)). As described above, the light emitting device 100 having a cup-shaped reflector structure in which the light emitting element 101 and the wire 104 are covered with the sealing resin 105 is obtained (step (d)).

  In the light emitting device 1 of the first embodiment and the conventional light emitting device 100, the refractive index (for example, about 1.4 to 1.6) of the sealing resins 50 and 105 is based on the refractive index (1.0) of the external air layer. Is also big. For this reason, of the light emitted from the light emitting elements 20 and 101, the light whose incident angle to the interface between the sealing resins 50 and 105 and the external air layer is a critical angle (for example, about 38 to 46 °) or more Causes total reflection (a phenomenon based on Snell's law). When this total reflection occurs, reflection and absorption are repeated inside the package (light emitting device), and the light extraction efficiency tends to decrease.

  In the conventional light emitting device 100, the interface between the sealing resin 105 and the external air layer is substantially flat. More specifically, due to the effect of surface tension, the interface between the sealing resin 105 and the external air layer becomes slightly concave as shown in FIG. On the other hand, in the light emitting device 1 of the first embodiment, the interface between the sealing resin 50 and the external air layer can be formed into a substantially hemispherical surface by utilizing the self-heating of the light emitting element 20 (see, for example, FIG. 2).

  For this reason, in the light-emitting device 1 of 1st Embodiment, compared with the conventional light-emitting device 100, the ratio of the light which injects into the interface of sealing resin and an external air layer more than a critical angle is suppressed. That is, in the light emitting device 1 of the first embodiment, total reflection is less likely to occur as compared with the conventional light emitting device 100. As a result, in the light emitting device 1 of the first embodiment, the light quantity loss due to light absorption inside the package is suppressed, and the light extraction efficiency is improved.

  Moreover, according to the manufacturing method of the light-emitting device 1 of 1st Embodiment, hardening of the sealing resin 50 is achieved by lighting the light emitting element 20. FIG. For this reason, the manufacturing method of the light-emitting device 1 of 1st Embodiment can manufacture a light-emitting device efficiently compared with the manufacturing method of the conventional light-emitting device 100 which requires oven etc. for hardening of the sealing resin 105. FIG. Moreover, according to the manufacturing method of the light-emitting device 1 of 1st Embodiment, there also exists an advantage that the light emitting element 20 and the metal wire 40 can be coat | covered by the minimum required resin amount.

  Conventionally, in order to obtain a substantially hemispherical sealing resin, it is necessary to mold. For this reason, it is not easy to obtain a substantially hemispherical sealing resin in a light emitting device having a reflector structure. In this regard, in the method for manufacturing the light emitting device 1 of the first embodiment, it is possible to easily obtain a substantially hemispherical sealing resin even though the light emitting device has a reflector structure.

Second Embodiment
Next, the light emitting device of the second embodiment will be described. The light emitting device of the second embodiment is generally the same as the configuration of the first embodiment. For this reason, the same code | symbol is attached | subjected to the overlapping part and description is abbreviate | omitted when there is no necessity for description in particular.

  FIG. 4 is a top view showing a schematic configuration of the light emitting device 2 according to the second embodiment of the present invention. FIG. 5 is a schematic cross-sectional view at the BB position in FIG. As shown in FIGS. 4 and 5, in the light emitting device 2 of the second embodiment, the sealing resin 50 covering the light emitting element 20 and the metal wire 40 has a multiple structure. The sealing resin 50 is different from the light emitting device 1 of the first embodiment in that it has a multiple structure.

  Specifically, the sealing resin 50 of the light emitting device 2 has a double structure including the first sealing resin 51 and the second sealing resin 52. The first sealing resin 51 is substantially semicircular (substantially hemispherical) in cross section. The second sealing resin 52 is formed so as to cover the first sealing resin 51. The sealing resin 50 including the first sealing resin 51 and the second sealing resin 52 is generally semicircular (substantially hemispherical) in sectional view.

  The first sealing resin 51 and the second sealing resin 52 may be different types (properties) of resins. For example, a configuration in which one is a resin containing a phosphor and the other is a resin not containing a phosphor may be employed. Further, for example, the phosphors are contained in both of the two sealing resins 51 and 52, and the types of the phosphors to be contained are different between the first sealing resin 51 and the second sealing resin 52. May be adopted. Further, for example, a configuration in which the refractive indexes are different between the first sealing resin 51 and the second sealing resin 52 may be employed.

  In the light emitting device 2 of the second embodiment, the sealing resin 50 has a double structure, but the sealing resin 50 may have a multiple structure of a triple structure or more.

  The light emitting device 2 of the second embodiment can be manufactured as follows. Until the formation of the first sealing resin 51, the light emitting device 2 of the second embodiment has the same manufacturing flow as steps (a) to (c) (see FIG. 3) in the light emitting device 1 of the first embodiment. Formed with. When the first sealing resin 51 is formed, a predetermined amount of the second sealing resin 52 is dropped (injected) toward the light emitting element 20 using a dispenser or the like with the light emitting element 20 turned on. .

  Due to the heat generated when the light emitting element 20 is turned on, the dropped second sealing resin 52 is heated and cured immediately after the dropping. Since heat is conducted in a radial manner, the outer surface of the second sealing resin 52 covering the first sealing resin 51 is substantially hemispherical. As a result, a sealing resin 50 having a substantially semicircular (substantially hemispherical) cross-sectional view as a whole is obtained.

  Note that the light emitting element 20 may be turned on from the start of the formation of the first sealing resin 51 to the completion of the formation of the second sealing resin 52. However, the present invention is not limited to this. For example, the light emitting element 20 is turned off in a predetermined time after the first sealing resin 51 is dropped, and then the light emitting element 20 is heated to cure the second sealing resin 52. May be turned on again. In this case, the timing of turning on and off the light emitting element 20 may be determined as appropriate.

  The effects of the light emitting device 2 and the manufacturing method thereof according to the second embodiment are the same as those of the first embodiment. In addition, according to 2nd Embodiment, the effort which puts in and out to heating apparatuses, such as oven, for resin hardening can be saved. As a result, according to the manufacturing method of the second embodiment, there is an advantage that the light emitting device having the multiple-layer sealing resin can be manufactured at low cost.

<Third Embodiment>
Next, a light emitting device according to a third embodiment will be described. The light emitting device of the third embodiment has a portion that overlaps the configuration of the first embodiment. For this reason, the same code | symbol is attached | subjected to the overlapping part and description is abbreviate | omitted when there is no necessity for description in particular.

  FIG. 6 is a top view showing a schematic configuration of the light emitting device 3 according to the third embodiment of the present invention. FIG. 7 is a schematic cross-sectional view at the CC position in FIG. As shown in FIGS. 6 and 7, in the light emitting device 3 of the third embodiment, the number of light emitting elements arranged in the opening 11a of the reflector portion 11 is two (light emitting elements 21 and 22). . This point is different from the light emitting device 1 of the first embodiment.

  Since the number of light emitting elements 21 and 22 is two, the number of lead terminals is increased by one compared to the case of the first embodiment. In other words, a lead terminal 33 is provided between the two lead terminals 31 and 32 so as to be spaced apart from the lead terminals 31 and 32. For the first light emitting element 21, a lead terminal 31 and a lead terminal 33 are used in pairs so that positive and negative electrodes can be obtained. For the same reason, the lead terminal 32 and the lead terminal 33 are used as a pair for the second light emitting element 22. That is, the first light emitting element 21 and each of the lead terminals 31 and 33 are electrically connected through the metal wire 40. Further, the second light emitting element 22 and each of the lead terminals 32 and 33 are electrically connected via the metal wire 40.

  The first light emitting element 21 and the metal wire 40 connected to the first light emitting element 21 are covered with a first sealing resin 53. The second light emitting element 22 and the wire 40 connected to the second light emitting element 22 are covered with a second sealing resin 54. The two sealing resins 53 and 54 are both substantially semicircular (substantially hemispherical) in cross section.

  The two sealing resins 53 and 54 may be the same type (properties) of resins. In this case, for example, the first light emitting element 21 may emit light having a wavelength (color) different from that of the second light emitting element 22.

  Further, the two sealing resins 53 and 54 may be of different types (properties). As a case of different types, for example, a case where the sealing resins 53 and 54 include different phosphors can be cited. Moreover, as a case where it is a different kind, the case where each sealing resin 53 and 54 has a different refractive index is mentioned, for example. When the two sealing resins 53 and 54 are different types, the two light emitting elements 21 and 22 may be the same type or different types.

  In the light emitting device 3 according to the third embodiment, the number of light emitting elements is two, but the number of light emitting elements may be three or more. For example, when the number of light emitting elements is three, the following configuration may be employed. All three light emitting elements emit blue light. The sealing resin that covers the first light emitting element is a sealing resin containing a red phosphor. The sealing resin that covers the second light emitting element is a sealing resin containing a green phosphor. The sealing resin that covers the third light emitting element is a transparent resin (not including a phosphor). Thereby, a light emitting device having a high degree of freedom for full color is realized.

  Further, in the light emitting device 3 of the third embodiment, each sealing resin 53, 54 is a single layer, but not limited thereto, each sealing resin 53, 54 is similar to the second embodiment, It may be a multiple structure.

  The light-emitting device 3 of 3rd Embodiment can be manufactured similarly to the light-emitting device 1 of 1st Embodiment (refer FIG. 3). The two light emitting elements 21 and 22 may be covered with the respective sealing resins 53 and 54 at the same time (the resin curing step in each light emitting element 21 and 22 may be performed at the same time). Further, the two light emitting elements 21 and 22 may be covered with the respective sealing resins 53 and 54 with a time difference (the resin curing process in each light emitting element 21 and 22 may be advanced with a time difference). ).

  The effects of the light emitting device 3 and the manufacturing method thereof according to the third embodiment are the same as those of the first embodiment. In addition, according to the third embodiment, there is an advantage that various light emitting devices can be provided depending on how the types of light emitting elements are combined and how the types of sealing resins are combined.

<Others>
The embodiment described above is merely an example of the present invention, and the scope of application of the present invention is not limited to the above-described embodiment.

  For example, in the embodiment described above, the light emitting element is configured to be mounted on the base using wire bonding. However, the present invention is not limited to this configuration, and the light emitting element may be configured to be flip-chip mounted on the base.

  Moreover, in embodiment shown above, the base in which a light emitting element is mounted was set as the structure which has a reflector part. However, the method for manufacturing a light-emitting device according to the present invention is also applicable to a light-emitting device in which a light-emitting element is mounted on a base (a flat base) that does not have a reflector portion.

  Moreover, in embodiment shown above, it was set as the structure by which the shape of sealing resin which covers a light emitting element becomes a substantially semicircle shape (substantially hemispherical shape) cross-sectional view. However, as described above, by controlling the heat generation amount of the light emitting element, it is possible to control the time until the resin dripped toward the light emitting element is cured. For this reason, according to the method for manufacturing a light-emitting device of the present invention, the shape of the sealing resin that covers the light-emitting element is not limited to a substantially hemispherical shape, and can be formed in a film shape along the light-emitting element, for example.

  Moreover, in embodiment shown above, it was set as the structure whose light emitting element is a LED chip. However, the light emitting element is not limited to this, and may be another light emitting element such as a semiconductor laser chip.

  The light emitting device of the present invention is suitable for a backlight included in a liquid crystal display device, for example.

1, 2, 3 Light emitting device 10 Base 11 Reflector portion 11a Opening portion 20, 21, 22 Light emitting element 50, 51, 52, 53, 54 Sealing resin

Claims (9)

A light-emitting device manufacturing method in which a light-emitting element mounted on a base is covered with a resin,
The manufacturing method of the light-emitting device characterized by including the resin hardening process of hardening the said resin dripped toward the said light emitting element using the heat_generation | fever of the said light emitting element.   The method for manufacturing a light emitting device according to claim 1, wherein the resin curing step is performed a plurality of times so that the resin covering the light emitting element has a multiple structure.   The method for manufacturing a light emitting device according to claim 1, wherein there are a plurality of light emitting elements mounted on the base, and the resin curing step is applied to each of the plurality of light emitting elements.   The method for manufacturing a light emitting device according to claim 3, wherein the types of the resin are different among the plurality of light emitting elements. The base is provided with a reflector part that reflects light emitted from the light emitting element,
The method for manufacturing a light emitting device according to claim 1, wherein the light emitting element is disposed in an opening formed in the reflector portion. The base,
A reflector portion provided on the base and having an opening formed therein;
A light emitting device mounted on the base and disposed in the opening;
A substantially semicircular sealing resin in cross-sectional view covering the light emitting element;
A light emitting device comprising:   The light emitting device according to claim 6, wherein the sealing resin has a multiple structure. A plurality of light emitting elements are mounted on the base,
The light emitting device according to claim 6 or 7, wherein each of the plurality of light emitting elements is separately covered with the sealing resin.   The light emitting device according to claim 8, wherein the plurality of light emitting elements have different types of the sealing resin.

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