JP2013138999A - Liquid injection head and liquid injection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid injection head and a liquid injection device which provide an improved reliability of connection between a flexible substrate and an electronic component-mounted part.SOLUTION: In the liquid injection head, a first substrate includes driver elements and an electronic component-mounted part having a plurality of exposed lead electrodes for connecting the driver elements with an external part. A second substrate is formed so that it is adhered to the first substrate by lamination thereon and covers the driver elements to surround them while leaving the electronic component-mounted part exposed to the outside. A flexible substrate is adhered to the mounted part with an electroconductive adhesive to make electrical connection between the connecting part of the former and the front end exposed electrode portion of the latter. Further, a potting material is solidified after being filled in between the front end portion of the flexible substrate and the second substrate surrounding the front end portion to thereby enhance strength of connection therebetween. Furthermore, a first recessed part is formed in a site where the part surrounding the front end portion of the flexible substrate in the second substrate is in contact with the side of the first substrate.

Description

  The present invention relates to a liquid ejecting head and a liquid ejecting apparatus.

A droplet discharge method (inkjet method) has been proposed as one method for manufacturing a microdevice. This droplet discharge method is a method in which a functional liquid containing a material for forming a device is formed into droplets and discharged from a droplet discharge head. Further, the droplet discharge head is recognized as an ink jet recording head and is also used for general image printing. Note that droplet discharge is a concept of liquid ejection, and will be described below as liquid ejection.
In such a liquid ejecting head, in order to solve the problems caused by connection by conventional wire bonding, outer lead bonding (flexible substrate) using a flexible substrate (flexible substrate) in which a wiring pattern functioning as an outer lead is formed in advance. By performing OLB (Outer Lead Bonding) connection, electrical connection between the driving element (piezoelectric element) and the driving device (driving circuit unit) is performed without causing inconvenience such as short circuit between wires. It has been broken. (For example, patent document 1). Further, a reinforcing material (potting agent) is filled between the sealing plate which is a part of the liquid jet head and the flexible substrate, and the flexible substrate is firmly held by this reinforcing material.

JP 2010-227760 A

  The gap between the sealing plate that is a part of the liquid ejecting head and the flexible substrate is narrow, and a gap may remain in a portion that should be in close contact due to the viscosity of the reinforcing material. When there is such an unintended void, when the solvent of the ink enters through the adhesive portion of the sealing plate and the case member, the same solvent is positively drawn by capillary action.

By the way, the flexible substrate is electrically connected to the wiring pattern to the drive element via an ACP (anisotropic conductive paste) connection.
However, the solvent drawn in as described above causes the ACP connection portion to swell, resulting in poor connection with the wiring pattern to the drive element.
The present invention provides a liquid ejecting head and a liquid ejecting apparatus that improve connection reliability between a flexible substrate and a mounting portion.

  The present invention includes a driving element provided on the first substrate, a mounting portion drawn from an electrode of the driving element, and the driving element provided on the driving element side of the first substrate. A second substrate having the mounting portion as an outside; a case member provided on the opposite side of the second substrate from the first substrate; a flexible substrate having a connection portion connected to the mounting portion; and the flexible substrate And a reinforcing member that reinforces the connection strength of the drive element to the mounting portion, and a first recess is provided on a side surface of the second substrate on the first substrate side.

  In the present invention configured as described above, the driving element and the mounting portion drawn from the electrode are provided on the first substrate, and the second substrate is provided on the driving element side of the first substrate. It is done. Here, the second substrate includes the driving element, but has a shape with the mounting portion as the outside. Further, the case member is provided on the opposite side of the second substrate from the first substrate. And the flexible substrate is connected to the said mounting part via the connection part, and the reinforcement material reinforces the connection strength with respect to the mounting part of the said drive element in the said flexible substrate. In this state, a first recess is provided on a side surface of the second substrate on the first substrate side.

  The ink solvent is ejected from such a liquid ejecting head, but the solvent may leak from a crack or the like generated in the flow path, and tends to penetrate into each part. In particular, since the second substrate has a shape that exposes the mounting portion of the first substrate to the outside, the solvent transmitted through the surface of the case member and the second substrate tends to permeate the mounting portion. However, since the first substrate side surface of the second substrate is provided with a first recess, the first recess sucks and holds such a solvent by a capillary phenomenon due to surface tension (trap). ) Has an effect.

  According to the present invention, since the solvent of the ink transmitted on the surface of the case member and the second substrate is retained by the first recess, the solvent does not easily penetrate into the mounting portion, and the ACP connection portion is swollen. Thus, it is possible to prevent a connection failure with the wiring pattern to the drive element.

2 is an external perspective view of a liquid ejecting head. FIG. FIG. 3 is an exploded perspective view of a liquid ejecting head. FIG. 6 is a partially cutaway view of a perspective view of the liquid ejecting head viewed from the nozzle opening side. It is AA arrow sectional drawing of FIG. It is sectional drawing which expands and shows the connection part of a flexible substrate. It is a top view which shows the modification of a guidance recessed part. It is a top view which shows the modification of a guidance recessed part. It is a top view which shows the modification of a guidance recessed part. It is a top view which shows the modification of a guidance recessed part. It is a perspective view which shows schematic structure of a liquid ejecting apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The lateral direction of the liquid ejecting head (arrangement direction of the nozzles) is the X-axis direction, the longitudinal direction of the liquid ejecting head (direction perpendicular to the X-axis direction) is the Y-axis direction, and the thickness direction of the liquid ejecting head (that is, X The direction orthogonal to the axial direction and the Y-axis direction) is taken as the Z-axis direction.

<Liquid jet head>
An embodiment of a liquid jet head (liquid jet head) according to the present invention will be described with reference to FIGS. 1 is an external perspective view showing a configuration according to an embodiment of a liquid ejecting head, FIG. 2 is an exploded perspective view of the liquid ejecting head, and FIG. 3 is a partially cutaway perspective view of the liquid ejecting head viewed from the nozzle opening side. 4 is a cross-sectional view taken along line AA in FIG. 1, FIG. 5 is an enlarged cross-sectional view showing a connection portion of the flexible substrate, and FIG. 6 is a plan view of the flexible substrate.
As shown in FIG. 1, the liquid jet head 1 is provided on a nozzle substrate 21, a flow path forming substrate 22 (first substrate) provided on the upper surface of the nozzle substrate 21, and an upper surface of the flow path forming substrate 22. A diaphragm 24 that is displaced by driving the piezoelectric element (drive element) 23, and a reservoir forming substrate 25 (second substrate) provided on the upper surface of the diaphragm 24 (provided on the drive element side of the first substrate). A flexible substrate that electrically connects the case member 101 provided on the upper surface side of the reservoir forming substrate 25 (the side opposite to the first substrate in the second substrate), the piezoelectric element 23, and the driver IC (drive circuit unit) 26. The main body 1 </ b> A provided with 27 is mainly configured. In this embodiment, the liquid ejecting head is configured by one base 1A. However, the liquid ejecting head may be configured by unitizing a plurality of bases 1A.

The case member 101 is made of plastic, for example. The case member 101 is used as an attachment member when the liquid ejecting head 1 is mounted on a liquid ejecting apparatus as will be described later.
As shown in FIG. 3, the nozzle substrate 21 is made of, for example, stainless steel, glass ceramics, plastic, or silicon, and is a through-hole that penetrates the nozzle substrate 21 and discharges a functional liquid droplet. A plurality of are formed. A plurality of nozzle openings 31 formed side by side in the Y-axis direction constitute first to fourth nozzle opening groups 31A to 31D. Here, the first nozzle opening group 31A and the second nozzle opening group 31B are arranged to face each other in the X-axis direction, and the third nozzle opening group 31C and the fourth nozzle opening group 31D are arranged to face each other in the X-axis direction. . The third nozzle opening group 31C is formed adjacent to the first nozzle opening group 31A in the Y-axis direction, and the fourth nozzle opening group 31D is adjacent to the second nozzle opening group 31B in the Y-axis direction. It is formed to fit.

In FIG. 3, the first to fourth nozzle opening groups 31 </ b> A to 31 </ b> D are shown to be configured by six nozzle openings 31, but actually, for example, about 720 nozzle openings. 31 is formed.
The flow path forming substrate 22 is formed of, for example, a rigid silicon single crystal, and the plurality of partition walls 35 are formed by anisotropically etching the silicon single crystal substrate that is the base material of the flow path forming substrate 22. ing.
Further, the nozzle substrate 21 is fixed to the lower surface of the flow path forming substrate 22 via, for example, an adhesive or a heat welding film, and the vibration plate 24 is provided on the upper surface of the flow path forming substrate 22.

A pressure generating chamber 36 in which the functional liquid discharged from the nozzle opening 31 is disposed is formed by a space surrounded by the flow path forming substrate 22 having the plurality of partition walls 35, the nozzle substrate 21, and the vibration plate 24. Has been. A plurality of the pressure generating chambers 36 are formed side by side in the Y-axis direction so as to correspond to the plurality of nozzle openings 31 constituting each of the first to fourth nozzle opening groups 31A to 31D.
The first pressure generation chamber group 36A is constituted by a plurality of pressure generation chambers 36 formed corresponding to the first nozzle opening group 31A. Similarly, the second pressure generation chamber group 36B is configured by the plurality of pressure generation chambers 36 corresponding to the second nozzle opening group 31B, and the third pressure generation chamber 36B is configured by the plurality of pressure generation chambers 36 corresponding to the third nozzle opening group 31C. The chamber group 36C is configured, and the fourth pressure generating chamber group 36D is configured by the plurality of pressure generating chambers 36 corresponding to the fourth nozzle opening group 31D. The first pressure generation chamber group 36A and the second pressure generation chamber group 36B are arranged to face each other in the X-axis direction, and the third pressure generation chamber group 36C and the fourth pressure generation chamber group 36D are related to the X-axis direction. It arrange | positions so that it may mutually oppose.

One end portions of the plurality of pressure generation chambers 36 constituting the first pressure generation chamber group 36 </ b> A are communicated with each other by a communication portion 39 via a supply path 38 constituting a part of the reservoir 37. The communication portion 39 is a through hole formed in the flow path forming substrate 22 and is connected to a reservoir portion 51 described later.
Similarly, the end portions of the pressure generation chambers 36 constituting the second to fourth pressure generation chamber groups 36 </ b> B to 36 </ b> D are also communicated with each other by the communication portion 39 via the supply path 38.

  The vibration plate 24 disposed between the flow path forming substrate 22 and the reservoir forming substrate 25 is provided on the elastic film 41 so as to cover the upper surface of the flow path forming substrate 22 and on the upper surface of the elastic film 41. And a lower electrode film 42. The elastic film 41 is made of, for example, silicon dioxide having a thickness of about 1 to 2 μm, and the lower electrode film 42 is made of, for example, platinum having a thickness of about 0.2 μm. In the present embodiment, the lower electrode film 42 is an electrode common to the plurality of piezoelectric elements 23.

The piezoelectric element 23 for displacing the diaphragm 24, that is, the driving element includes a piezoelectric film 45 provided on the upper surface of the lower electrode film 42, an upper electrode film 46 provided on the upper surface of the piezoelectric film 45, and an upper A lead electrode 47 (terminal portion) that is a lead-out wiring of the electrode film 46 is provided.
The piezoelectric film 45 is made of, for example, a metal oxide having a thickness of about 1 μm. The upper electrode film 46 is made of, for example, platinum having a thickness of about 0.1 μm, and the lead electrode 47 is made of, for example, gold having a thickness of about 0.1 μm. An insulating film (not shown) is provided between the lead electrode 47 and the lower electrode film 42.

A plurality of piezoelectric elements 23 are provided so as to correspond to each of the plurality of nozzle openings 31 and the pressure generation chamber 36. That is, the piezoelectric element 23 is provided for each nozzle opening 31 (for each pressure generation chamber 36). As described above, the lower electrode film 42 functions as a common electrode for the plurality of piezoelectric elements 23, and the upper electrode film 46 and the lead electrode 47 function as individual electrodes for the plurality of piezoelectric elements 23.
Further, a first piezoelectric element group 23A is formed by a plurality of piezoelectric elements 23 provided side by side in the Y-axis direction so as to correspond to the respective nozzle openings 31 constituting the first nozzle opening group 31A. Similarly, a second piezoelectric element group 23B corresponding to the second nozzle opening group 31B is formed, a third piezoelectric element group (not shown) corresponding to the third nozzle opening group 31C is formed, and a fourth nozzle opening group 31D. Corresponding to the fourth piezoelectric element group (not shown). The first piezoelectric element group 23A and the second piezoelectric element group 23B are arranged to face each other in the X-axis direction. Further, the third piezoelectric element group and the fourth piezoelectric element group are arranged so as to face each other in the X-axis direction.

  The piezoelectric element 23 may include a lower electrode film 42 in addition to the piezoelectric film 45, the upper electrode film 46, and the lead electrode 47. That is, the lower electrode film 42 in the present embodiment may be configured to have both the function as the piezoelectric element 23 and the function as the diaphragm 24. In the present embodiment, the diaphragm 24 is constituted by the elastic film 41 and the lower electrode film 42, but the elastic film 41 may be omitted and the lower electrode film 42 may have the function of the elastic film 41.

The reservoir forming substrate 25 is formed, for example, by etching a silicon single crystal that is the same material as the flow path forming substrate 22. Further, the reservoir forming substrate 25 is in a state where an insulating film is formed on the surface by, for example, thermal oxidation. The reservoir forming substrate 25 is preferably formed of a material having a thermal expansion coefficient substantially the same as the thermal expansion coefficient of the flow path forming substrate 22. For example, glass or a ceramic material may be used.
As shown in FIG. 4, reservoir portions 51 corresponding to the respective communication portions 39 are formed on the reservoir forming substrate 25 so as to extend in the Y-axis direction. The reservoir 37 is configured by the reservoir portion 51 and the communication portion 39 described above.

In addition, the reservoir forming substrate 25 is formed with an introduction path 52 that is connected to the side wall of each communication portion 39 and introduces the functional liquid into each communication portion 39.
A compliance substrate 53 is bonded to the upper surface of the reservoir forming substrate 25. The compliance substrate 53 includes a sealing film 54 and a fixing plate 55.
The sealing film 54 is formed of a material having low rigidity and flexibility such as a polyphenylene sulfide film having a thickness of about 6 μm. The upper part of the reservoir 51 is sealed with the sealing film 54.

  The fixing plate 55 is made of a hard material such as a metal such as stainless steel having a thickness of about 30 μm. A region of the fixing plate 55 corresponding to the reservoir 51 is an opening 56 that is completely removed in the thickness direction. Therefore, the upper portion of the reservoir 51 is sealed only by the flexible sealing film 54, and thus is a flexible portion 57 that can be deformed by a change in internal pressure. Further, the case member 101 is provided on the compliance substrate 53.

  In addition, the compliance substrate 53 and the case member 101 outside the reservoir unit 51 are formed with a functional liquid introduction port 58 that communicates with the introduction path 52 and supplies the functional liquid to the reservoir unit 51. Normally, when the functional liquid is supplied from the functional liquid introduction port 58 to the reservoir section 51, a pressure change occurs in the reservoir section 51 due to, for example, the flow of the functional liquid at the time of driving the piezoelectric element 23 or ambient heat. However, as described above, since the upper portion of the reservoir portion 51 is the flexible portion 57 sealed only by the sealing film 54, the flexible portion 57 is bent and deformed to absorb the pressure change. Therefore, the inside of the reservoir 51 is maintained at a constant pressure. The other portions are held at a sufficient strength by the fixing plate 55. The case member 101 is provided in a non-contact state with the flexible portion 57 so as not to impair the deformation of the flexible portion 57.

  A groove-shaped opening 60 extending in the Y-axis direction is formed in the central portion of the reservoir forming substrate 25 in the X-axis direction. Each of the openings 60 is partitioned by two wall portions 25A extending in the Y-axis direction, each of the two openings 60 aligned in the X-axis direction. First and second sealing portions 61A and 61B for sealing the first to fourth piezoelectric element groups 23A to 23D with the diaphragm 24, and third and fourth sealing portions are formed. More specifically, the first sealing portion 61A seals the first piezoelectric element group 23A corresponding to the first pressure generating chamber group 36A between the diaphragm 24 and the second sealing portion 61B. The element group 23B is sealed. Although the third sealing portion and the fourth sealing portion are not shown in FIG. 4, they seal the third and fourth piezoelectric element groups.

 A space of the reservoir forming substrate 25 facing the piezoelectric element 23 is provided with a space that does not hinder the movement of the piezoelectric element 23, and a piezoelectric element holding portion serving as a second recess that can seal the space. 62 is formed. The piezoelectric element holding part 62 is formed in each of the first and second sealing parts 61A and 61B and the third and fourth sealing parts, and covers the first to fourth piezoelectric element groups 23A to 23D. It is formed in size. Of the piezoelectric elements 23, at least the piezoelectric film 45 is sealed in the piezoelectric element holding portion 62.

  As described above, the reservoir forming substrate 25 functions as a sealing member for blocking the piezoelectric element 23 from the external environment and sealing the piezoelectric element 23. By sealing the piezoelectric element 23 with the reservoir forming substrate 25, it is possible to prevent the piezoelectric element 23 from being damaged by an external environment such as moisture. In the present embodiment, the inside of the piezoelectric element holding part 62 is simply sealed. However, for example, the space inside the piezoelectric element holding part 62 is maintained in a vacuum, nitrogen or argon atmosphere, etc. The inside of the part 62 can be kept at low humidity, and the destruction of the piezoelectric element 23 can be prevented more reliably.

In addition, among the piezoelectric elements 23 sealed by the piezoelectric element holding portion 62 of the first sealing portion 61A, one end portion of the lead electrode 47 extends to the outside of the first sealing portion 61A and has an opening. The portion 60 is disposed on the flow path forming substrate 22 exposed.
Similarly, among the piezoelectric elements 23 sealed by the piezoelectric element holding portion 62 of the second sealing portion 61B, the other end portion of the lead electrode 47 extends to the outside of the second sealing portion 61B, and is opened. The portion 60 is disposed on the flow path forming substrate 22 exposed. In addition, among the piezoelectric elements 23 sealed by the piezoelectric element holding portions 62 of the third and fourth sealing portions, a part of the lead electrode 47 extends to the outside of the third and fourth sealing portions, It arrange | positions on the flow-path formation board | substrate 22 exposed in the opening part 60 provided between 3rd and 4th sealing part.

  In addition, an opening 102 formed along the Y-axis direction is formed at the center of the case member 101 in the X-axis direction. The opening 102 has a size including at least the opening area of the opening 60 formed in the reservoir forming substrate 25. As shown in FIGS. 1 and 2, the holding area (inner wall surface) 103 of the flexible substrate 27 is formed. Is formed in a notch shape. Hereinafter, the opening constituted by the opening 60 of the reservoir forming substrate 25 and the opening of the flexible substrate 27 is collectively referred to as a through opening (opening) 150.

  By forming the opening 60 in the reservoir forming substrate 25, the reservoir forming substrate 25 encloses the piezoelectric element groups 23A to 23D (driving elements) with the first sealing portion 61A, the second sealing portion 61B, and the like. However, the mounting portion to which the flexible substrate 27 is connected is inside the opening 60 and is external. That is, the flexible substrate 27 as an external wiring is connected to the mounting portion through the opening 60, and the mounting portion and the outside are electrically connected.

  Further, the first sealing portion 61A and the second sealing portion 61B are formed on the reservoir forming substrate 25 by anisotropic etching to form the second recess. At this time, the reservoir forming substrate 25, a guide recess (first recess) 25C is formed on the side surface of the opening 60 (inner peripheral surface of the opening 60) so as to have the same depth in the Z direction. This is because if they are simultaneously formed by anisotropic etching, they are formed at the same depth. As will be described later, the guide recess 25C forms a recess that allows the ink solvent to be sucked by capillary action based on surface tension.

  That is, the guide recess 25C (first recess) is provided on the side surface of the reservoir forming substrate 25 (second substrate) on the flow path forming substrate 22 (first substrate) side. Further, the guide recess 25C is formed at the lower end of the opening 60, and the opening 60 is connected to the flow path forming substrate 22 (first substrate) of the reservoir forming substrate 25 (second substrate). It becomes a part formed so that the opening shape is enlarged at the connection end part, and becomes a part formed in an annular shape so that the area of the mounting part in the flow path forming substrate 22 (first substrate) is widened.

  In other words, the first substrate has a mounting portion on which a drive element is disposed and a plurality of electrodes that are drawn out to connect the drive element to the outside are exposed. The second substrate is laminated and adhered to the first substrate, covers the drive element, and surrounds the periphery of the mounting portion while exposing the mounting portion to the outside. The flexible substrate electrically connects the exposed electrode portion at the tip to the mounting portion with a conductive adhesive. Further, the reinforcing material is filled and solidified between the tip portion of the flexible substrate and the second substrate surrounding the tip portion, thereby reinforcing the connection strength. Furthermore, the 1st recessed part is provided in the site | part which the site | part surrounding the front-end | tip part of the said flexible substrate in a said 2nd board | substrate contacts the said 1st board | substrate side.

For this reason, when the solvent of ink is transmitted on the surface of the second substrate toward the portion where the conductive adhesive electrically connects the flexible substrate and the mounting portion, the same is required before reaching the same portion. The solvent needs to move from the surface of the second substrate to the first substrate side. However, since the first concave portion described above is provided in this portion, the ink solvent is sucked in this portion by capillary action based on the surface tension.
The holding region 103 is provided with a convex member 80 facing the mounting surface side of the driver IC 26 facing the flexible substrate 27. The convex member 80 is provided to face both ends in the width direction of the flexible substrate 27 (Y-axis direction shown in FIGS. 1 and 2). The convex member 80 may be made of the same material as the case member 101 or may be made of a different member.

The driver IC 26 is a driver IC having, for example, a semiconductor integrated circuit (IC) including a circuit board and a driving circuit, and four driver ICs 26 are provided according to the first to fourth nozzle opening groups 31A to 31D. Each driver IC 26 is flip-chip mounted on a predetermined area (mounting portion) 27 </ b> A on one surface of the flexible substrate 27.
The flexible substrate 27 on which such a driver IC 26 is mounted is in a state in which one end side is inserted into the through opening 150 of the case member 101 and the reservoir forming substrate 25 as shown in FIG. The flexible substrate 27 electrically connects the lead electrode 47 of the piezoelectric element 23 exposed to the bottom surface of the through opening 150 and the driver IC 26. The through-opening 150 is open in the stacking direction with the flow path forming substrate 22 in the reservoir forming substrate 25.

  Specifically, the flexible substrate 27 bends between the mounting area of the driver IC 26 and the terminal portion 73 so that the end portion on the terminal portion 73 side, that is, the connection portion 27b is placed in the through opening 150 (FIGS. 4 and 5). By inserting, the lead electrode 47 disposed in the through opening 150 and the terminal portion 73 are connected. The terminal portion 73 and the lead electrode 47 are connected to each other by a conductive adhesive 79 such as an anisotropic conductive paste (ACP: Anisotropic Conductive Paste). Hereinafter, the connection structure between the terminal portion 73 and the lead electrode 47 is referred to as an OLB connection portion 100.

  The connection portion 27 b of the flexible substrate 27 is provided with a plurality of electrodes connected to the lead electrodes 47 of the piezoelectric element 23 at the tip. A load is applied to the OLB connection portion 100 by bending stress or tensile force acting on the flexible substrate 27. When bending force or tensile force is applied to the flexible substrate 27, stress concentrates on the end portion in the width direction of the flexible substrate 27. Moreover, in the connection part 27b which comprises the OLB connection part 100, since stress concentrates on the edge part in the width direction similarly, there exists a possibility that joining strength may fall. On the other hand, in this embodiment, in order to reinforce the connection strength between the piezoelectric element (drive element) 23 and the lead electrode 47 of the flexible substrate 27, that is, the connection strength of the OLB connection portion 100, a reinforcing material made of, for example, an adhesive or the like. The flexible substrate 27 is fixed to the inner wall surface 28 a of the through opening 150 via 81.

  As described above, the through hole 150 is formed in the case member 101 and the reservoir forming substrate 25 so that the distal end portion of the flexible substrate 27 is inserted, and the side surface of the case member 101 and the reservoir forming substrate 25 is inserted. The reinforcing material 81 made of an adhesive is filled between the front end portion of the flexible substrate 27 and solidified. That is, the flexible substrate 27 is fixed to the inner wall surface 28 a of the through opening 150 by the reinforcing material 81.

  In the present embodiment, the penetrating opening 150 surrounds the tip portion of the flexible substrate 27. However, it is not always necessary to surround the entire circumference, and a part of the shape may be cut off. The reinforcing material 81 is filled between the flexible substrate 27 and the inner wall surface 28a of the reservoir forming substrate 25, which is the second substrate, and is further filled into the upper part of the tip of the flexible substrate 27 and other parts to be solidified. It doesn't matter. The flexible substrate 27 is bent at the tip and bent substantially perpendicularly toward the opening of the through opening 150, but the direction in which the flexible substrate 27 is pulled out is not necessarily limited to this direction.

The guide recess 25C serving as the first recess is a portion where the inner wall surface 28a facing the through opening 150 in the reservoir forming substrate 25 serving as the second substrate and the flow path forming substrate 22 serving as the first substrate are in contact with each other. Is provided. This is because the reservoir forming substrate 25 is a portion surrounding the tip portion of the flexible substrate 27 by the inner wall surface 28 a and is in contact with the flow path forming substrate 22.
The depth of the guide recess 25 </ b> C means a height upward from the surface where the reservoir forming substrate 25 is in contact with the flow path forming substrate 22. This depth matches the internal height of the piezoelectric element holding portion 62. When the piezoelectric element holding portion 62 is formed on the reservoir forming substrate 25 by wet etching, it is only etched for the same time at the same time, so no additional work process is required.

  The guide recess 25 </ b> C is shaped so that the opening is enlarged over the entire circumference at a portion in contact with the reservoir forming substrate 25 and the flow path forming substrate 22, which is the lower end of the opening 60. However, it does not necessarily have to be formed all around. For example, as shown in FIG. 6, although it is located on the entire circumference, it need not be continuous, and may be formed intermittently and intermittently. Further, since it may be a part around or close to the conductive adhesive 79, the opening 60 does not extend over the entire circumference as shown in FIG. In the case of being present, it may be formed only in the adjacent parts. Further, as shown in FIG. 8, in order to increase the volume to be absorbed, a shape that extends in a groove shape on the side opposite to the opening 60 side may be used. Furthermore, as shown in FIG. 9, the distance from the opening 60 may not be constant, and a pool portion 25C1 that stores the absorbed solvent by partially increasing the distance may be formed.

  As shown in FIGS. 4 and 5, the reinforcing member 81 is provided so as to enter between the convex member 80 and the flexible substrate 27. The convex member 80 is provided at a position facing both ends in the width direction of the flexible substrate 27, extends along the depth direction (Z direction in the drawing) of the through opening 150, and further upwards in the depth direction. The gap with the flexible substrate 27 gradually becomes smaller. Therefore, when the reinforcing material 81 is applied as described later, the reinforcing material 81 is inserted between the flexible substrate 27 and the convex member 80 by the action of the capillary force.

Since the convex member 80 is provided at a position facing both ends in the width direction of the flexible substrate 27, both ends of the flexible substrate 27 are fixed to the inner wall surface 28 a of the through opening 150 through the reinforcing material 81. It has become.
Therefore, when bending force or tensile force is applied to the flexible substrate 27, the end portion of the flexible substrate 27 where stress concentrates is fixed to the inner wall surface of the through opening 150 by the reinforcing material 81. Connection strength can be greatly improved.

According to the present embodiment, the reinforcing member 81 includes the liquid ejecting head 1 having high connection reliability in the OLB connection portion 100. Therefore, a stable electrical connection can be obtained between the driver IC 26 and the piezoelectric element 23, and a highly reliable liquid ejection operation can be performed.
(Manufacturing method of liquid jet head)
As a method for manufacturing the liquid jet head 1 having the above-described configuration, a method disclosed in JP 2010-2277160 can be employed. At this time, as described above, the first recess and the second recess are simultaneously formed.

<Liquid jetting device>
Next, an example of the liquid ejecting apparatus (liquid ejecting apparatus) IJ of the present invention including the liquid ejecting head 1 described above will be described with reference to FIG. FIG. 10 is a perspective view illustrating a schematic configuration of the liquid ejecting apparatus IJ.
In FIG. 10, the liquid ejecting apparatus IJ includes a liquid ejecting head 1, a drive shaft 4, a guide shaft 5, an external controller CT, a stage 7, a cleaning mechanism 8, a base 9, and a heater 6. Yes. The liquid ejecting head 1 is attached to a liquid ejecting apparatus IJ via a case member 101 in a carriage (not shown). The stage 7 supports the substrate P from which the functional liquid is discharged by the liquid ejecting head 1, and includes a fixing mechanism (not shown) that fixes the substrate P at a reference position. The functional liquid is discharged from the nozzle opening of the liquid jet head 1 to the substrate P supported by the stage 7.

  A drive motor 2 is connected to the drive shaft 4. The drive motor 2 is composed of a stepping motor or the like. When a drive signal in the Y-axis direction is supplied from the external controller CT, the drive shaft 4 is rotated. When the drive shaft 4 rotates, the liquid jet head 1 moves in the Y-axis direction. The guide shaft 5 is fixed so as not to move with respect to the base 9. The stage 7 includes a drive motor 3. The drive motor 3 is composed of a stepping motor or the like. When a drive signal in the X-axis direction is supplied from the external controller CT, the stage 7 is moved in the X-axis direction.

The external controller CT supplies a voltage for controlling the liquid ejection to the liquid ejection head 1. Further, the external controller CT supplies a drive pulse signal for controlling the movement of the liquid jet head 1 in the Y-axis direction to the drive motor 2 and also moves the stage 7 in the X-axis direction to the drive motor 3. A drive pulse signal for controlling is supplied.
The cleaning mechanism 8 cleans the liquid jet head 1 and includes a drive motor (not shown). By driving the drive motor, the cleaning mechanism 8 moves in the X-axis direction along the guide shaft 5. The movement of the cleaning mechanism 8 is also controlled by the external controller CT. Here, the heater 6 is means for heat-treating the substrate P by lamp annealing, and evaporates and dries the solvent contained in the functional liquid applied on the substrate P. The power on and off of the heater 6 is also controlled by the external controller CT.

Then, the liquid ejecting apparatus IJ ejects droplets onto the substrate P while relatively scanning the liquid ejecting head 1 and the stage 7 that supports the substrate P.
In such a liquid ejecting apparatus IJ, since the guide recess 25C is formed, ink leaks from the liquid ejecting head 1 for some reason, travels along the surface of the case member 101, and enters the opening 60. Further, even if it enters the gap of the reinforcing material 81, it is absorbed by the guide recess 25C before coming into contact with the conductive adhesive 79. For this reason, the reliability which can prevent that the electrically conductive adhesive 79 swells by attracting | sucking a solvent and produces a conduction defect can be made high.

In the above-described embodiment, the functional liquid ejected from the liquid jet head 1 includes a liquid crystal display device forming material for forming a liquid crystal display device and an organic EL forming material for forming an organic EL display device. And a wiring pattern forming material for forming a wiring pattern of an electronic circuit. Thereby, the liquid ejecting apparatus IJ can manufacture each of the devices with the functional liquid ejected based on the liquid ejecting method.
The preferred embodiments according to the present invention have been described above with reference to the accompanying drawings. However, it goes without saying that the present invention is not limited to such examples, and the above embodiments may be combined. It is obvious for those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea described in the claims. It is understood that it belongs to.

For example, in the above embodiment, the case where the flexible substrate 27 on which the driver IC 26 is mounted is bonded to the lead electrode 47 of the piezoelectric element 23 has been described. However, the flexible substrate 27 is connected to the lead electrode 47 with the mounting portion 27A protruding from the opening. After bonding to 47, the driver IC 26 may be mounted on the mounting portion 27A.
Moreover, it goes without saying that those skilled in the art will understand,
・ Apply by changing the combination of the mutually replaceable members and configurations disclosed in the above embodiments as appropriate.

・ Although not disclosed in the above-described embodiments, members and configurations that are known techniques and can be mutually replaced with the members and configurations disclosed in the above-described embodiments are appropriately replaced, and combinations thereof are changed. Although not disclosed in the above embodiments, members and configurations that can be assumed by those skilled in the art as substitutes for the members and configurations disclosed in the above embodiments based on known techniques It is disclosed as an embodiment of the present invention that appropriate substitutions and combinations thereof are applied.

DESCRIPTION OF SYMBOLS 1 ... Liquid ejection head, 22 ... Flow path formation board | substrate (1st board | substrate), 23 ... Piezoelectric element (drive element), 25 ... Reservoir formation board | substrate (2nd board | substrate), 25C ... Guidance recessed part (1st recessed part), 26 DESCRIPTION OF SYMBOLS: Driver IC (drive circuit part), 27 ... Flexible substrate, 27A ... Mounting part, 27b ... Connection part, 28a ... Inner wall surface, 47 ... Lead electrode (terminal part), 60 ... Opening part, 62 ... Piezoelectric element holding part ( (Second recess), 80 ... convex member, 81 ... reinforcing material, 101 ... case member, 102 ... opening, 150 ... penetrating opening (opening), IJ ... liquid ejecting apparatus

Claims (12)

A first substrate;
A driving element provided on the first substrate;
A mounting portion drawn from the electrode of the drive element;
A second substrate containing the drive element provided on the drive element side of the first substrate but having the mounting portion as an outside;
A case member provided on the opposite side of the second substrate from the first substrate;
A flexible substrate having a connection portion connected to the mounting portion;
A reinforcing material that reinforces connection strength to the mounting portion of the driving element in the flexible substrate,
A liquid ejecting head, wherein a first recess is provided on a side surface of the second substrate on the first substrate side.   2. The liquid ejecting head according to claim 1, wherein a second concave portion in which the driving element is included is formed on a surface of the second substrate facing the first substrate.   3. The liquid jet head according to claim 1, wherein a depth of the first recess is the same as a depth of the second recess.   A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1.   The first substrate is a flow path forming substrate, the second substrate is a reservoir forming substrate, and these are laminated, and an opening communicating in the laminating direction is formed in the second substrate, and exposed through the opening. 4. The mounting portion is formed at a portion of the first substrate to be different, and an inner peripheral surface forming the opening forms the side surface. The liquid jet head described.   The liquid ejection according to claim 5, wherein the first concave portion is a portion formed outward from the opening portion in a stacked portion of the opening of the first substrate with the second substrate. head. A first substrate having a mounting portion in which a driving element is disposed and a plurality of electrodes drawn out to connect the driving element to the outside are exposed;
A second substrate that is stacked and adhered to the first substrate, covers the drive element, and is formed so as to surround the drive element while exposing the mounting portion to the outside;
A flexible substrate having a connecting portion for electrically connecting the exposed electrode portion at the tip to the mounting portion with a conductive adhesive;
A reinforcing material that is filled and solidified so as to reinforce the connection strength between the tip portion of the flexible substrate and the second substrate surrounding the tip portion;
The liquid ejecting head according to claim 1, wherein a portion of the second substrate surrounding the tip portion of the flexible substrate is provided with a first recess at a portion in contact with the first substrate side.   The liquid ejecting head according to claim 7, wherein the first recess is formed in an annular shape surrounding the flexible substrate.   The liquid ejecting head according to claim 7, wherein the first recess surrounds the flexible substrate but is intermittently formed.   The liquid ejecting head according to claim 7, wherein the first recess is formed in a part surrounding the flexible substrate.   The liquid ejecting head according to claim 7, wherein the first recess has a groove-shaped portion that surrounds the flexible substrate and extends to the opposite side of the flexible substrate.   The liquid ejecting head according to claim 7, wherein the first recess has a pool portion that surrounds the flexible substrate and expands on the opposite side of the flexible substrate.

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