JP2013135079A - Semiconductor resin mold component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor resin mold component 6 capable of assuring a creepage distance LE between a conductive piece 2 and a cooler 12 by using a small insulating plate 10.SOLUTION: A semiconductor resin mold component 6 includes a flat surface 6D and a pair of facing side surfaces 6B and 6C, with a semiconductor device sealed up inside. From a portion of the facing side surfaces 6B and 6C, the conductive pieces 2 and 4 connected to the semiconductor device protrude. The pair of facing side surfaces 6B and 6C can be held by a pair of holding members 14 and 16. The flat surface 6D is used by being fixed to the cooler 12 through the insulating plate 10. When the side surfaces 6B and 6C from which the conductive pieces 2 and 4 protrude are observed in length direction, a central region R, obtained by dividing into three portions in thickness direction, forms a chevron 6P which protrudes more to the outside as approaches the center, and both end regions S and T, obtained by dividing into three in thickness direction, form projections 6N and 6K which protrude outside, with thickness R at the central region being thicker than thickness U of the holding member.

Description

  In the present specification, a technique related to a component obtained by molding a semiconductor device with a resin (hereinafter referred to as a semiconductor resin molded component) is disclosed.

In this specification, semiconductor resin molded parts having the following characteristics are particularly handled.
(1) It has a flat surface and a pair of opposing side surfaces.
(2) A semiconductor device is enclosed inside.
(3) The conductive piece protrudes from a part of at least one of the opposing side surfaces. The conductive piece is connected to the semiconductor device.
(4) A pair of opposing side surfaces can be clamped by a pair of clamping members.
(5) A flat surface is fixed to a cooler through an insulating plate.
For example, a semiconductor device that controls electric power supplied to a traveling motor of an electric vehicle or a hybrid vehicle is used as a semiconductor resin molded component having the above-described characteristics.

  In the case of a semiconductor resin mold component of the above type, when it is fixed to a cooler, the conductive piece and the cooler must be insulated. When the voltage difference between the conductive piece and the cooler is large, current may flow along the surface of the insulating plate existing between the conductive piece and the cooler (so-called creeping discharge may occur). . In order to prevent creeping discharge, it is necessary to secure a creeping distance.

FIG. 1A shows one structure for ensuring a creepage distance. 6A of illustration is a semiconductor resin mold component, 2 and 4 are conductive pieces. The semiconductor resin mold component 6A has the following characteristics.
(1) It has a flat surface 6D and a pair of side surfaces 6B and 6C. The pair of side surfaces 6B and 6C are opposed to each other and are collectively referred to as a pair of opposed side surfaces.
(2) A semiconductor device (not shown) is enclosed inside.
(3A) The conductive piece protrudes from a part of at least one of the opposite side surfaces. In the case of FIG. 1A, the conductive piece 2 protrudes from one opposing side surface 6B, and the conductive piece 4 protrudes from the other opposing side surface 6C.
(3B) The conductive piece 2 is connected to the semiconductor device, and the conductive piece 4 is also connected to the semiconductor device.
(4) In FIG. 1 (A1), 14 and 16 shown show a pair of clamping member, for example, is attached to the robot. The pair of opposing side surfaces 6B and 6C can be held by the pair of holding members 14 and 16, and the semiconductor resin mold part 6A can be conveyed by a robot (not shown). On the side surfaces 6B and 6C from which the conductive pieces 2 and 4 protrude, there are a range in which the conductive pieces 2 and 4 protrude and a range in which the conductive pieces do not protrude. The pair of sandwiching members 14 and 16 sandwich the pair of opposing side surfaces 6B and 6C within a range where the conductive piece does not protrude.
(5) The semiconductor resin molded component 6A is used by fixing the flat surface 6D to the cooler 12 via the insulating plate 10A.

In the structure of FIG. 1A, an insulating plate 10A larger than the flat surface 6D is used to ensure the creepage distance LA between the conductive piece 2 and the cooler 12 and the creepage distance between the conductive piece 4 and the cooler 12. doing.
FIG. 1B shows a case where an insulating plate 10 smaller than the flat surface 6D is used. In this case, the creepage distance LB between the conductive piece 2 and the cooler 12 becomes too short. A current flows along the surface of the insulating plate 10, and a current flows between the conductive piece 2 and the cooler 12. The same applies to the space between the conductive piece 4 and the cooler 12. In order to prevent the creeping discharge, as shown in FIG. 1A, it is necessary to use an insulating plate 10A larger than the flat surface 6D.
FIG. 1C shows the technical contents described in Patent Document 1. In the technique of Patent Document 1, the creeping distance between the conductive piece 2 and the cooler 12 is ensured by forming irregularities 6F on the outer peripheral portion of the flat surface 6D. Similarly, the creepage distance between the conductive piece 4 and the cooler 12 is ensured by forming the unevenness 6G on the outer peripheral portion of the flat surface 6D.
FIG. 1D also shows the technical contents described in Patent Document 1. In this technique, the creeping distance between the conductive piece 2 and the cooler 12 is ensured by forming the protrusion 6I extending in the longitudinal direction (perpendicular to the paper surface) on the side surface 6B. Similarly, the creeping distance between the conductive piece 4 and the cooler 12 is ensured by forming the ridge 6J extending in the longitudinal direction on the side surface 6C.

JP 2007-73743 A

The structure in FIG. 1A requires a large insulating plate 10A. Large insulating plates are difficult to handle, are easy to break, and increase costs.
In the structure of FIG. 1B, a necessary creepage distance is not ensured and insulation cannot be ensured.
In the structure of FIG. 1C, the flat surface 6D ′ in contact with the insulating plate 10 is not actually flat, and is provided with irregularities 6F and 6G. Therefore, when pressure is applied to the insulating plate 10A and the flat surface 6D 'to bring them into close contact, the insulating plate 10 may break.
The semiconductor resin mold component 6H of FIG. 1D cannot be gripped by the sandwiching members 14 and 16 shown in FIG. 1A1 because the protruding strips 6I and 6J formed on the pair of opposite side surfaces obstruct. There is.

The present specification discloses a technique for solving the above problems all at once. That is,
(A) A necessary creepage distance can be secured by the small insulating plate 10.
(B) The surface 6D closely contacting the insulating plate 10 is flat and the insulating plate 10 is not damaged.
(C) It can be clamped by the clamping members 14 and 16.

The semiconductor device resin mold component disclosed in the present specification has the requirements (1) to (5) described above, and has the following characteristics.
(6) When the side surface from which the conductive piece protrudes is observed from the longitudinal direction, the central region when it is divided into three in the thickness direction is a mountain shape that projects outward as it approaches the center, and when divided into three in the thickness direction In the both end regions, the convex shape projects outward.
(7) The thickness of the central region is thicker than the thickness of the clamping member.

When the feature (6) is provided, a creeping distance can be secured between the conductive piece and the cooler. There is no need to use a large insulating plate.
When the feature (7) is provided, the pair of opposing side surfaces can be clamped by the existing clamping member.
The surface closely contacting the insulating plate is flat and does not damage the insulating plate.

  The above semiconductor device resin molded component can be handled by an existing clamping member, and even if a small insulating plate is used, a necessary creepage distance can be secured and the insulating plate is not damaged. Easy-to-use parts can be provided.

The laminated structure of a semiconductor device resin mold part, an insulating plate, and a cooler is shown, (A) shows the 1st structure which ensures creeping distance, (B) shows the virtual structure using a small insulating board, (C ) Shows the second structure for securing the creepage distance, (D) shows the third structure for securing the creepage distance, (E) shows the structure of the embodiment for securing the creepage distance, and (A1) shows (A1) ) Shows a state in which the semiconductor device resin molded component of () is clamped by a pair of clamping members, and (E1) shows a state of clamping the semiconductor device resin molded component of (E) by a pair of clamping members.

The main features of the embodiments described below are listed.
Feature 1: Convex shapes formed in both end regions when divided into three in the thickness direction are in a direction projecting outward as the end portions in the thickness direction are approached. The distance between the convex shape formed on one end side in the thickness direction and the convex shape formed on the other end side in the thickness direction is expanded outward. Since the interval is enlarged toward the outside, it is easy to insert the clamping member into the interval. The pair of convex shapes does not obstruct the holding member approaching the pair of opposed side surfaces, but rather can guide them.
Feature 2: The side where the conductive piece protrudes has a range where the conductive piece protrudes and a range where the conductive piece does not protrude. At least the mountain shape extends uniformly from the range where the conductive piece protrudes to the range where the conductive piece does not protrude. The clamping member clamps the pair of opposed side surfaces in a range where the conductive piece does not protrude.
Feature 3: A trough shape that is in close contact with the chevron is formed on the sandwiching member that sandwiches the pair of opposing side surfaces.
The

As shown in FIG. 1E, the semiconductor resin molded part 6 of the example has the following requirements.
(1) It has a flat surface 6D and a pair of side surfaces 6B and 6C. The pair of side surfaces 6B and 6C are opposed to each other.
(2) As described in Patent Document 1, a semiconductor device is enclosed inside. The number of encapsulated semiconductor devices is not limited to one. Note that illustration of the semiconductor device is omitted.
(3A) The conductive piece protrudes from a part of at least one of the opposite side surfaces. In the case of FIG. 1E, the conductive piece 2 protrudes from one opposing side surface 6B, and the conductive piece 4 protrudes from the other opposing side surface 6C. There is a case where the conductive piece does not protrude from any one of the side surfaces.
(3B) The conductive piece 2 is connected to the semiconductor device, and the conductive piece 4 is also connected to the semiconductor device. The conductive pieces 2 and 4 may be connected to the same semiconductor device, or may be connected to different semiconductor devices.
(4) In FIG. 1 (E1), 14 and 16 show a pair of clamping members, and are attached to the robot. The pair of opposing side surfaces 6B and 6C can be clamped by the pair of clamping members 14 and 16, and the semiconductor resin molded component 6 can be conveyed by a robot. On the side surfaces 6B and 6C from which the conductive pieces 2 and 4 protrude, there are a range in which the conductive pieces 2 and 4 protrude and a range in which the conductive pieces do not protrude. The pair of sandwiching members 14 and 16 sandwich the pair of opposing side surfaces 6B and 6C within a range where the conductive piece does not protrude.
(5) The semiconductor resin mold component 6 is used by fixing the flat surface 6D to the cooler 12 via the insulating plate 10.

As shown in FIG. 1E, the semiconductor resin mold part 6 of the example has the following features.
(6A) When the side surface 6B from which the conductive piece 2 protrudes is observed from the longitudinal direction (when observed from the direction perpendicular to the paper surface), in the central region R when divided into three in the thickness direction, the closer to the center, the more outward. It is Yamagata 6P which projects. One end region S when divided into three in the thickness direction has a convex shape 6N projecting outward, and the other end region T has a convex shape 6K projecting outward.
(6B) When the side surface 6C from which the conductive piece 4 protrudes is observed from the longitudinal direction, the central region R when it is divided into three in the thickness direction is a chevron 6Q that projects outward as it approaches the center. In one end region S when divided into three in the thickness direction, the convex shape 6M projects outward, and in the other end region T, the convex shape 6L projects outward.


(7) The thickness of the central region R is thicker than the thickness U of the clamping member.
(8) Each of the convex shapes 6K, 6L, 6M, and 6N has a direction that projects outward as it approaches the end in the thickness direction. For this reason, the space | interval of the convex shape 6K and the convex shape 6N and the space | interval of the convex shape 6L and the convex shape 6M are expanded toward the outer side. Therefore, it is easy to insert the clamping members 14 and 16 into the interval between the convex shapes 6K and 6N and the interval between the convex shapes 6L and 6M. The pair of convex shapes 6K, 6N and 6L, 6M can guide rather than obstruct the approach of the sandwiching members 14, 16 to the pair of opposing side surfaces 6B, 6C.
(9) On the side surfaces 6B and 6C from which the conductive pieces 2 and 4 protrude, there are a range in which the conductive pieces 2 and 4 protrude and a range in which the conductive pieces do not protrude. The chevron 6P, 6Q and the convex shapes 6K, 6L, 6M, 6N extend uniformly from the range where the conductive pieces 2, 4 protrude to the range where the conductive pieces 2, 4 do not protrude. The sandwiching members 14 and 16 sandwich the pair of opposing side surfaces 6B and 6C in a range where the conductive piece does not protrude.
(10) The pair of clamping members are formed with valleys that are in close contact with the peaks 6P and 6Q. In the process in which the valleys are in close contact with the chevron 6P, 6Q, the positional relationship between the semiconductor resin mold component 6 and the clamping members 14, 16 becomes a constant positional relationship. The position of the semiconductor resin mold component 6 is accurately determined when transported by the robot.
The semiconductor resin mold component 6 and the insulating plate 10, and the insulating plate 10 and the cooler 12 are fixed with an adhesive or the like.

Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.
The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in the present specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.

2: Conductive piece 4: Conductive piece 6: Semiconductor resin mold parts 6B, 6C: A pair of opposing side surfaces 6D: Flat surface 6P, 6Q: Mountain shape 6K, 6L, 6M, 6N: Convex shape 10: Insulating plate 12: Cooler 14 , 16: clamping member

Claims (2)

It has a flat surface and a pair of opposing side surfaces, encloses the semiconductor device inside, and a conductive piece connected to the semiconductor device protrudes from a part of at least one of the opposing side surfaces. A pair of opposed side surfaces can be sandwiched, and the flat surface is fixed to a cooler via an insulating plate. The semiconductor device is a part molded with resin. The side where the conductive piece protrudes was observed from the longitudinal direction. Sometimes, the central region when it is divided into three in the thickness direction is a chevron that projects outward as it approaches the center, and the convex region that projects outward at both end regions when it is divided into three in the thickness direction,
A semiconductor resin mold component characterized in that the thickness of the central region is larger than the thickness of the clamping member.   The semiconductor resin mold component according to claim 1, wherein the convex shape has a direction that projects outward as it approaches an end in the thickness direction.

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