JP2013131529A - Substrate processing device, and method of manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing device and a method of manufacturing a semiconductor device capable of downsizing a device.SOLUTION: A substrate processing device 100 includes: a first base unit 320; a second base unit 330; a move unit 350 moving relative to the second base unit 330; a coupling unit 380 that can be coupled to the move unit 350, and that moves relative to the second base unit 330 while being unified with the move unit 350 in a state coupled to the move unit 350; and a controller moving the second base unit 330 to a position where a locus of movement of tweezers 388 is not interfered with other member, and controlling so as to make the move unit 350 move a distance longer than a distance that the second base unit 330 moves relative to the first base unit 320, in a state that coupling with the coupling unit 380 is released.

Description

  The present invention relates to a substrate processing apparatus and a semiconductor device manufacturing method.

  In Patent Document 1, prior to wafer transfer operation from a wafer processing chamber, a cassette for storing wafers, a boat on which wafers are loaded and inserted into the wafer processing chamber, from cassette to boat, and from boat to cassette, In a semiconductor manufacturing apparatus including a wafer transfer machine that sets a position of a front end surface of a plate on which a wafer is placed, the wafer transfer machine has a turntable that can be rotated and raised and each has a wafer placement unit A plurality of wafer transfer plates; a wafer transfer plate having a wafer mounting portion; and a wafer gripping portion attached to be movable in the radial direction of the turntable, and the plurality of plates. A first mechanism for maintaining the leading end surface of the sheet plate at a first position determined with respect to the gripping portion, and the leading end surface of the plate for single wafers at the first position and the first position And a second mechanism for selecting and setting at least the wafer mounting portion at the protruding second position forward from the mounting, and transferring the plurality of wafers by combining the single wafer plate and the plurality of plates. At the time of loading, the front end surface of the plurality of plates is maintained at the first position by the first mechanism, and the front end surface of the plate for sheet transfer is moved to the first position by the second mechanism. In the case of transferring a single wafer to a single wafer, the second mechanism is used to move the plate for transferring the single wafer while the front end surfaces of the plurality of plates are maintained at the first position by the first mechanism. The front end surface is set from the first position of the plurality of plates to the second position, and in subsequent sheet transfer, the sheets are maintained while maintaining the positional relationship between the plurality of plates and the sheet plates. 1 wafer per plate The semiconductor manufacturing apparatus shall initiate the placement to sheet transfer is disclosed.

  In Patent Document 2, a support base on which a substrate is placed, one or a plurality of slidably stacked plate arms arranged at the lower part of the support base, and the plate arm are provided respectively. An arm drive mechanism for sliding the support base or the plate arm positioned above the plate arm, and changing the support base and the plate arm between a retracted state and an extended state. Accordingly, the substrate is transported between the first position and the second position, and each of the plate-like arms has an opening in which the arm driving mechanism is accommodated. A substrate transfer apparatus is disclosed.

JP 2004-343145 A JP 2005-19967 A

In the prior art, there is a problem that when the substrate is transferred, the movement trajectory of the member may interfere with other members, and if the interference is not caused, the device may be enlarged. there were.
An object of the present invention is to provide a substrate processing apparatus and a method of manufacturing a semiconductor device that can reduce the size of the apparatus.

  The present invention according to claim 1 includes a first base part, a second base part that moves relative to the first base part, and a first holding part that holds a substrate, A moving part that moves relative to the base part; and a second holding part that holds the substrate, and is connectable to the moving part, and is connected to the moving part and integrated with the moving part. A connecting portion that moves relative to the second base portion, and moves the second base portion to a position where the locus of movement of the second holding portion does not interfere with other members, and the connection with the connecting portion is A control unit that controls the moving unit to move a distance longer than a distance that the second base unit has moved relative to the first base unit in the released state. is there.

  The present invention according to claim 2 includes a first base part, a second base part that moves relative to the first base part, and a first holding part that holds a substrate, A moving part that moves relative to the base part; and a second holding part that holds the substrate, and is connectable to the moving part, and is connected to the moving part and integrated with the moving part. A semiconductor device manufacturing method of a semiconductor device manufacturing apparatus having a connecting portion that moves relative to a base portion of the second device, the step of holding the substrate in the first holding portion, and the second base, A step of moving the second holding portion to a position where the locus of movement does not interfere with other members, and a step of moving the moving portion in a state where the connection with the connecting portion is released, The distance that the moving part moves with respect to the second base part is the second base. A method of manufacturing a long semiconductor device than the distance to move relative to the scan unit is the first base portion.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the substrate processing apparatus which can reduce an apparatus, and a semiconductor device can be provided.

1 is a perspective view showing a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a side perspective view showing the substrate processing apparatus shown in FIG. 1. It is a perspective view which shows the wafer transfer apparatus which the substrate processing apparatus shown in FIG. 1 has. It is a figure which shows the cross section of the wafer transfer apparatus shown in FIG. 3, and shows the drive transmission mechanism of the wafer transfer apparatus shown in FIG. The operation of the wafer transfer apparatus shown in FIG. 3 will be described. FIG. 3A is a schematic diagram for explaining the operation of conveying five wafers at a time. FIG. It is a schematic diagram explaining the operation | movement to convey. It is a schematic diagram which shows the wafer transfer apparatus which concerns on a 1st comparative example. It is a schematic diagram which shows the wafer transfer apparatus which concerns on a 2nd comparative example.

Next, one mode of a substrate processing apparatus and a method for manufacturing a semiconductor device according to an embodiment of the present invention will be described.
The following description is for explaining an embodiment of the present invention, and does not limit the scope of the present invention. Accordingly, those skilled in the art can employ embodiments in which these elements or all of the elements are replaced with equivalent ones, and these embodiments are also included in the scope of the present invention. In the description of each drawing, the same reference numerals are assigned to components having a common function, and the description is not repeated as much as possible.

  1 and 2 show a substrate processing apparatus 100 according to an embodiment of the present invention. The substrate processing apparatus 100 is an apparatus for processing a wafer W made of silicon or the like used as a substrate. For example, the substrate processing apparatus 100 is also used as a semiconductor device manufacturing apparatus for manufacturing a semiconductor device such as an IC. The manufacturing method of a semiconductor device is implemented by using. The substrate processing apparatus 100 is a vertical heat treatment apparatus, and can perform, for example, an oxidation process, a diffusion process, a CVD process, or the like on the substrate.

  As shown in FIGS. 1 and 2, the substrate processing apparatus 100 has a substrate processing apparatus main body 101, a front maintenance port 103 is formed in the front wall 101 a of the substrate processing apparatus main body 101, and the front maintenance port 103 is formed. A maintenance door 104 that opens and closes and a front opener 113 are attached. Further, a FOUP loading / unloading port 112 used as a cassette loading / unloading port is formed on the front wall 101a.

  In the substrate processing apparatus main body 101, a FOUP mounting shelf 105 used as a cassette mounting shelf, a spare FOUP shelf 107, a FOUP 110 used as a cassette and storing wafers W, and a FOUP delivery A cassette stage 114 used as a stand and used as an I / O stage, a boat elevator 115 used as a substrate holder lifting mechanism, and a FOUP transfer device 118 used as a cassette transfer device Has been placed. The FOUP transport device 118 includes a FOUP lift mechanism 118a used as a cassette lift mechanism and a FOUP transport mechanism 118b used as a cassette transport mechanism. Further, a transfer shelf 123 and a wafer transfer device 300 are arranged in the substrate processing apparatus main body 101.

  Further, in the substrate processing apparatus main body 101, a clean unit 134a, a clean unit 134b, a furnace port shutter 147 used as a furnace port opening / closing mechanism, a processing furnace 202, a boat 217, and a seal cap 219 are provided. Has been placed. For example, QUARTZ BOAT can be used as the boat 217.

  In the substrate processing apparatus 100, the wafer W is loaded into the FOUP 110 and transferred in a sealed state. The front maintenance port 103 is opened during maintenance. The maintenance door 104 opens and closes the front maintenance port 103, and the FOUP loading / unloading port 112 is formed in the maintenance door 104 so as to communicate between the inside and outside of the substrate processing apparatus main body 101.

  The cassette stage 114 is disposed in the vicinity of the FOUP loading / unloading port 112 and inside the substrate processing apparatus main body 101. The FOUP 110 is loaded onto the cassette stage 114 by an in-process transfer device (not shown) and unloaded from the cassette stage 114. In addition, the wafer W in the FOUP 110 is placed on the cassette stage 114 by the in-process transfer device so that the wafer W in the FOUP 110 is in a vertical posture and the wafer loading / unloading port of the FOUP 110 faces upward. Further, the cassette stage 114 rotates the FOUP 110 clockwise 90 degrees in the clockwise direction to the rear of the housing, the wafer W in the FOUP 110 is in a horizontal posture, and the wafer loading / unloading port of the FOUP 110 faces the rear of the substrate processing apparatus main body 101. Operate.

  The FOUP mounting shelf 105 is disposed at a substantially central portion in the front-rear direction within the substrate processing apparatus main body 101. The FOUP mounting shelf 105 is configured to store a plurality of FOUPs 110 in a plurality of stages and a plurality of rows. The FOUP mounting shelf 105 is provided with the transfer shelf 123 described above, and the transfer shelf 123 stores the FOUP 110 to be transferred by the wafer transfer device 300.

  The cassette stage 114 is disposed on the front side of the substrate processing apparatus main body 101, and delivers the FOUP 110 to the outside. The spare FOUP shelf 107 is disposed above the cassette stage 114 and is used for preliminarily storing the FOUP 110.

  The FOUP transport device 118 is installed between the cassette stage 114 and the FOUP mounting shelf 105. The FOUP lifting / lowering mechanism 118a of the FOUP transport device 118 can move up and down while holding the FOUP 110. A robot arm (not shown) is attached to the FOUP raising / lowering mechanism 118a, and the FOUP 110 is conveyed vertically and horizontally in cooperation with the robot arm. The FOUP 110 is transported between the cassette stage 114, the FOUP mounting shelf 105, and the spare FOUP shelf 107 by the continuous operation of the FOUP lifting mechanism 118a, the robot arm, and the FOUP transport mechanism 118b.

  At this time, the FOUP 110 is conveyed onto the cassette stage 114 with the opening surface facing rearward. The FOUP lifting / lowering mechanism 118a, the robot arm, and the FOUP transporting mechanism 118b transport the FOUP 110 taken in the cassette stage 114 from the cassette stage 114 to the FOUP mounting shelf 105 by moving it up and down, rotating, and horizontally. To do. By repeating the above operation, the required number of FOUPs 110 is transferred to the FOUP mounting shelf 105.

  The FOUP transport device 118 transports the FOUP 110 from the FOUP mounting shelf 105 to the front opener 113. The FOUP 110 is placed on the front opener 113 with the opening surface facing rearward. Thereafter, the lid is removed from the FOUP 110 by the front opener 113.

  The wafer transfer device 300 is installed behind the FOUP mounting shelf 105. The wafer transfer apparatus 300 includes a rotation / linear motion mechanism 310 that can rotate the wafer W in the horizontal direction and linearly move, and a lifting / lowering mechanism 304 that moves the rotation / linear motion mechanism 310 up and down. ing. The elevating mechanism 304 is installed at the right (back side in FIG. 2) end of the substrate processing apparatus main body 101. Further, the wafer transfer apparatus 300 loads (charges) the wafer W on the boat 217 and unloads (discharges) the wafer W from the boat 217 by the continuous operation of the rotation / linear motion mechanism 310 and the lifting / lowering mechanism 304. . Details of the wafer transfer device 300 will be described later.

  The boat elevator 115 has an arm 128, is disposed below the processing furnace 202, and operates as an elevating mechanism that moves the boat 217 up and down to the processing furnace 202. The above-described seal cap 219 is horizontally installed on the arm 128. The seal cap 219 can vertically support the boat 217 and close the lower end portion of the processing furnace 202.

  The boat 217 includes a plurality of holding members, and horizontally holds a plurality of (for example, about 50 to 150) wafers W with their centers aligned and vertically aligned. .

  The processing furnace 202 is disposed above the rear portion of the substrate processing apparatus main body 101. The lower end of the processing furnace 202 is opened and closed by a furnace port shutter 147 used as a furnace port opening / closing mechanism. Further, the boat 217 is inserted into the processing furnace 202 by the boat elevator 115, and the boat 217 is pulled out.

  The clean unit 134 a is disposed above the mounting shelf 105, supplies clean air that is a cleaned atmosphere, and distributes clean air inside the substrate processing apparatus main body 101. The clean unit 134a also has a supply fan and a dustproof filter so as to supply clean air that is a cleaned atmosphere.

  The clean unit 134b is disposed on the left side of the elevating mechanism 304 and the boat elevator 115, and supplies clean air that is a cleaned atmosphere in the same manner as the clean unit 134a, and clean air is supplied into the substrate processing apparatus main body 101. Circulate. The clean unit 134b has a supply fan and a dustproof filter so as to supply clean air that is a cleaned atmosphere. The clean air blown from the clean unit 134b circulated through the rotary linear motion mechanism 310 and the boat 217. Thereafter, the air is sucked into an exhaust device (not shown) and exhausted to the outside of the substrate processing apparatus main body 101.

  In the substrate processing apparatus 100 configured as described above, the FOUP loading / unloading port 112 is opened by the front opener 113 before the FOUP 110 is supplied to the cassette stage 114. Thereafter, the FOUP 110 is loaded from the FOUP loading / unloading port 112 and is placed on the cassette stage 114 so that the wafer W is in a vertical posture and the wafer loading / unloading port of the FOUP 110 faces upward. Thereafter, the wafer W in the FOUP 110 is placed in a horizontal posture by the cassette stage 114, and the FOUP 110 is rotated 90 ° clockwise in the clockwise direction so that the wafer loading / unloading port of the FOUP 110 faces the rear of the housing.

  Next, the FOUP 110 is automatically transported and delivered by the FOUP transport device 118 to a designated position on the FOUP mounting shelf 105 or the spare FOUP shelf 107, temporarily stored, and then stored in the FOUP mounting shelf 105. Or, it is transferred from the spare FOUP shelf 107 to the transfer shelf 123 by the FOUP transfer device 118 or directly transferred to the transfer shelf 123.

  Next, the wafer transfer apparatus 300 moves the wafer W up and down, rotates it, and moves it back and forth horizontally to transfer the wafer W in the FOUP 110 to the lowered boat 217. The transfer of the wafer W is performed on the plurality of FOUPs 110 until the number of wafers W reaches a predetermined number. When a predetermined number of wafers W are loaded in the boat 217, the boat elevator 115 raises the boat 217 and inserts the boat 217 into the processing furnace 202. That is, when a predetermined number of wafers W are loaded into the boat 217, the lower end of the processing furnace 202 where the furnace port shutter 147 is closed is opened, and then the boat 217 holding the wafer W group is sealed. When the cap 219 is raised by the boat elevator 115, the cap 219 is loaded into the processing furnace 202. After the boat 217 holding the wafer W group is loaded, arbitrary processing is performed on the wafer W in the processing furnace 202.

  After the processing, the wafer W and the FOUP 110 are paid out to the outside of the substrate processing apparatus main body 101 in the reverse procedure described above. After the required processing is performed on the wafer W in the processing furnace 202, the boat elevator 115 lowers the boat 217 and pulls out the boat 217 from the processing furnace 202. After the wafer W is cooled to a required temperature, the boat 217 is unloaded as processed wafers in a procedure reverse to the above-described procedure. That is, when the FOUP 110 is transferred to the transfer shelf 123, the wafer W is picked up from the FOUP 110 by the wafer transfer device 300 through the wafer loading / unloading port and loaded (charged) into the boat 217. Then, after delivering the wafer W to the boat 217, the wafer transfer apparatus 300 loads the next wafer W onto the boat 217.

FIG. 3 shows a wafer transfer apparatus 300.
As described above, the wafer transfer apparatus 300 holds a predetermined number of wafers W in a horizontal posture between the FOUP 110 and the boat 217, transfers the wafer W from the FOUP 110 to the boat 217, and transfers the wafer W from the boat 217 to the FOUP 110. It is. Moreover, the wafer transfer apparatus 300 has the rotation linear motion mechanism 310 and the raising / lowering mechanism 304 (refer FIG. 1) as mentioned above. In FIGS. 3 and 4, the lifting mechanism 304 is not shown, and the rotary linear motion mechanism 310 is shown. The rotary linear motion mechanism 310 rises and falls as a whole when the elevating mechanism 304 operates.

  As shown in FIG. 3, the rotation / linear motion mechanism 310 is mounted on the first base portion 320 so as to be movable with respect to the rotation mechanism 314, the first base portion 320, and the first base portion 320. The second base part 330, the moving part 350 mounted on the second base part 330 so as to be movable with respect to the second base part 330, and the movable part 350 being connectable. The connecting portion 380 can be moved relative to the second base portion 330 integrally with the moving portion 350 while being connected to the moving portion 350.

  The rotation mechanism 314 is connected to a rotation drive source (not shown) such as a motor, and receives a drive transmission from the drive source, and rotates about the rotation shaft 316 as indicated by an arrow in FIG. To do. The bottom surface of the first base portion 320 is attached to the rotation mechanism 314, and the rotation mechanism 314 rotates to rotate the first base portion 320, the second base portion 330, the moving portion 350, and the connection. The portion 380 rotates around the rotation shaft 316 in the direction of the arrow shown in FIG.

  The first base portion 320 rises and lowers when the elevating mechanism 304 (see FIG. 1) operates, and rotates when the rotating mechanism 314 operates. It doesn't move. The first base portion 320 is, for example, a hollow housing, and is supported on the upper surface so that the second base portion 330 can be moved so as to be supported from the lower side in the gravity direction. Yes.

  The second base portion 330 is, for example, a hollow housing, the upper surface 332 of the second base portion 330 is substantially horizontal, and, for example, two rails 334 and 334 are parallel to each other on the surface 332. It is attached to become. A transfer number switching mechanism 340 is attached to the surface 332.

  The transfer number switching mechanism 340 is a mechanism for switching the number of wafers W transferred from the FOUP 110 to the boat 217 and transferred from the boat 217 to the FOUP 110. The transfer number switching mechanism 340 is connected only to the moving unit 350 or connected to the moving unit 350 and It is possible to select whether to connect to both of the parts 380. Further, the transfer number switching mechanism 340 can move in the front-rear direction with respect to the second base portion 330 (see FIG. 4). For this reason, by moving in the front-rear direction while being connected only to the moving part 350, only the moving part 350 is moved in the front-rear direction while the connecting part 380 is stationary with respect to the second base part 330. Can do. Also. By connecting to both the moving part 350 and the connecting part 380 and moving in the front-rear direction, the moving part 350 and the connecting part 380 can be moved in the front-rear direction integrally with the second base part 330.

  Further, the transfer number switching mechanism 340 also functions as a connection mechanism that connects the moving unit 350 and the connecting unit 380 and releases the connection between the moving unit 350 and the connecting unit 380. The transfer number switching mechanism 340 also functions as a drive transmission unit that transmits the drive for moving the moving unit 350 relative to the second base unit 330 to the moving unit 350, and the connecting unit 380 It also functions as a drive transmission unit that transmits a driving force for moving the second base unit 330 to the connection unit 380.

  The moving unit 350 includes sliders 352 and 352 and a moving unit main body 356 attached so as to straddle the two sliders 352 and 352. The sliders 352 and 352 are respectively placed on the rails 334 and 334, guided by the rails 334 and 334, and can move along the rails 334 and 334. For example, one tweezer 362 that holds the wafer W is attached to the moving unit main body 356 as a first holding unit. The tweezers 362 are plate-like members arranged substantially horizontally, and hold the wafer W so as to be supported from the lower side in the gravity direction.

  The connecting portion 380 includes sliders 382 and 382 and a connecting portion main body 386 attached so as to straddle the two sliders 382 and 382. The sliders 382 and 382 are respectively placed on the rails 334 and 334, guided by the rails 334 and 334, and can move along the rails 334 and 334. For example, four tweezers 388 that are used as second holding portions and hold the wafer W are attached to the connecting portion main body 386. Each of the tweezers 388 is a plate-like member arranged substantially horizontally, and each holds the wafer W so as to be supported from the lower side in the gravity direction.

  FIG. 4 shows a drive transmission mechanism 400 included in the wafer transfer apparatus 300. The drive transmission mechanism 400 is a mechanism for moving the second base portion 330 with respect to the first base, and is a mechanism for moving the moving portion 350 with respect to the second base portion 330. This is a mechanism for moving the part 380 relative to the second base part 330 together with the moving part 350.

  The drive transmission mechanism 400 includes a first drive pulley 410 and a second drive pulley 412 that is disposed coaxially with the first drive pulley 410 and has a smaller diameter than the first drive pulley 410. The first drive pulley 410 and the second drive pulley 412 are mounted in the hollow portion of the second base portion 330 so as to be rotatable with respect to the second base portion 330. The first drive pulley 410 and the second drive pulley 412 are connected to a motor 420 used as a drive source, and are integrated in the direction of the arrow a shown in FIG. 4 and the direction opposite to the arrow a shown in FIG. Can be rotated in the same direction at the same angular velocity.

  The motor 420 and the above-described transfer number switching mechanism 340 are controlled by a control circuit 500 including, for example, a CPU. The control circuit 500, the transfer number switching mechanism 340, and the drive transmission mechanism 400 constitute a control unit that controls operations such as movement and stop of the second base unit 330, the moving unit 350, and the connecting unit 380.

  The drive transmission mechanism 400 includes a driven pulley 430, a driven pulley 432, a driven pulley 434, and a driven pulley 436. The driven pulley 432, the driven pulley 434, and the driven pulley 436 are attached to the hollow portion of the second base portion 330 so that they can rotate with respect to the second base portion 330.

  Further, the drive transmission mechanism 400 includes a first belt member 440. The first belt member 440 is an endless belt-like member, and spans the first drive pulley 410, the driven pulley 430, the driven pulley 432, the driven pulley 434, and the driven pulley 436 as shown in FIG. Has been. Further, the transfer number switching mechanism 340 described above is attached to the first belt member 440, and the transfer number switching mechanism 340 moves integrally with the first belt member 440 when the first belt member 440 moves. It is like that.

  The drive transmission mechanism 400 includes a fixed pulley 446 and a fixed pulley 448. The fixed pulley 446 and the fixed pulley 448 are fixed to the hollow portion of the first base portion 320 so as not to rotate with respect to the first base portion 320.

  Further, the drive transmission mechanism 400 includes a second belt member 452. The second belt member 452 is an endless belt-like member, and is stretched around the second drive pulley 412, the fixed pulley 446, and the fixed pulley 448 as shown in FIG. Further, the second belt member 452 is fixed to the fixed pulley 446 and the fixed pulley 448, for example, and does not move relative to the fixed pulley 446 and the fixed pulley 448 even when the second drive pulley 412 rotates. ing.

  In the drive transmission mechanism 400 configured as described above, when the first drive pulley 410 and the second drive pulley 412 rotate together in the direction of arrow a shown in FIG. 4, the first belt member 440 is driven from the first drive pulley 410. The first belt member 440 and the transfer number switching mechanism 340 move as a unit in the direction of the arrow b shown in FIG.

  When the transfer number switching mechanism 340 moves in the direction of the arrow b, when the transfer number switching mechanism 340 is connected only to the moving unit 350, the connecting unit 380 is stationary with respect to the second base unit 330. The moving part 350 moves in the arrow b direction with respect to the second base part 330. In addition, when the transfer number switching mechanism 340 is connected to both the moving unit 350 and the connecting unit 380, when the transfer number switching mechanism 340 moves in the direction of the arrow b, both the moving unit 350 and the connecting unit 380 are moved. It moves in the direction of arrow b with respect to the second base portion 330.

  Further, when the second drive pulley 412 rotates in contact with the second belt member 452, the second drive pulley 412 moves in the direction of the arrow c shown in FIG. 4, and the second drive pulley 412 moves. The second base portion 330 moves integrally with the second drive pulley 412 in the direction of the arrow c shown in FIG. 4 with respect to the first base portion 320.

  On the other hand, when the first drive pulley 410 and the second drive pulley 412 rotate in the direction opposite to the arrow a shown in FIG. 4, the moving unit 350 alone or the moving unit 350 and the connecting unit 380 are integrated. 4 moves in the direction opposite to the arrow b shown in FIG. 4 with respect to the second base portion 330, and the second base portion 330 moves in the direction opposite to the arrow c shown in FIG. Move to.

  Here, when the rotation angle of the first drive pulley 410 and the second drive pulley 412 is constant, the moving distance between the first belt member 440 and the transfer number switching mechanism 340 or the like is the distance of the first drive pulley 410. It depends on the diameter. That is, if the diameter of the first drive pulley 410 is increased, the distance that the transfer number switching mechanism 340 and the like move becomes longer, and if the diameter of the first drive pulley 410 is decreased, the distance that the transfer number switching mechanism 340 and the like moves. Becomes shorter. Further, when the rotation angle of the first drive pulley 410 and the second drive pulley 412 is constant, the moving distance of the second base portion 330 and the like varies depending on the diameter of the second drive pulley 412. That is, if the diameter of the second drive pulley 412 is increased, the distance that the second base portion 330 and the like move becomes longer, and if the diameter of the second drive pulley 412 is reduced, the second base portion 330 and the like move. The distance to be shortened.

Further, depending on the ratio between the diameter of the first drive pulley 410 and the diameter of the second drive pulley 412, the distance by which the transfer number switching mechanism 340 and the like move relative to the second base portion 330, and the second base portion 330. Is determined with respect to the distance moved with respect to the first base portion 320. In this embodiment, the diameter of the first drive pulley 410 is twice the diameter of the second drive pulley 412,
The distance that the transfer number switching mechanism 340 and the like move with respect to the second base portion 330 is twice the distance that the second base portion 330 moves with respect to the first base portion 320.

  FIG. 5 shows the operation of the wafer transfer apparatus 300, and FIG. 5A shows the operation of the wafer transfer apparatus 300 when the five wafers W are transferred together into the FOUP 110. FIG. 5B shows the operation of the wafer transfer apparatus 300 when a single wafer W is transferred into the FOUP 110.

  The wafers W are held by the four tweezers 388 and the tweezers 362, respectively, and the transfer number switching mechanism 340 is connected to both the moving part 350 and the connecting part 380, and the first driving pulley 410 and the second driving pulley 412 are connected. 4 is rotated in the direction of the arrow a shown in FIG. 4, the second base portion 330 moves in a direction approaching the FOUF 110 with respect to the first base portion 320 and moves as shown in FIG. 5A. The part 350 and the connecting part 380 move toward the FOUP 110 with respect to the second base part 330, and the four tweezers 388 and the tweezers 362 holding the wafer W are inserted into the FOUP 110. Further, when the first drive pulley 410 and the second drive pulley 412 are rotated in the opposite direction to the arrow a shown in FIG. 4 from the state shown in FIG. The wafer transfer apparatus 300 moves in a direction away from the FOUF 110 with respect to the first base part 320 and moves in a direction away from the FOUP 110 with respect to the second base part 330. The state shown in FIG. 4 is obtained.

  The first drive pulley 410 and the second drive pulley 412 are held in a state where the wafer W is held by the tweezer 362, the moving unit 350 and the transfer number switching mechanism 340 are connected, and the connection unit 380 and the transfer number switching mechanism 340 are not connected. 4 in the direction of arrow a shown in FIG. 4, the second base portion 330 moves in a direction approaching the FOUF 110 with respect to the first base portion 320 as shown in FIG. With the connecting portion 380 stationary with respect to the second base portion 330, the moving portion 350 moves in a direction approaching the FOUP 110 with respect to the second base portion 330, so that the tweezers 362 holding the wafer W are within the FOUP 110. Is inserted.

  Here, as described above, the distance L2 that the moving part 350 moves relative to the second base part 330 is longer than the distance L1 that the second base part 330 moves relative to the first base part 320. The distance L2 is twice the distance L1. Further, as shown in FIG. 5B, the second base portion 330 moves to a position where the movement trajectories of the four tweezers 388 do not interfere with members such as the FOUP mounting shelf 105, for example. As described above, in the substrate processing apparatus 100, the moving unit 350 is configured such that the second base unit 330 moves to the position where the trajectory of the tweezers 388 does not interfere with members such as the FOUP mounting shelf 105. The second base portion 330 is moved by a distance L2 that is longer than the distance L1 that the second base portion 330 has moved relative to the first base portion 320 in a state in which the connection with the connection portion 380 is released. The base portion 330 is moved.

  Further, when the first drive pulley 410 and the second drive pulley 412 are rotated in the opposite direction to the arrow a shown in FIG. 4 from the state shown in FIG. 4 moves in a direction away from the FOUF 110 with respect to the first base unit 320, and moves in a direction away from the FOUP 110 with respect to the second base unit 330, so that the wafer transfer apparatus 300 is shown in FIG. It will be in the state.

FIG. 6 shows a wafer transfer apparatus 300 according to the first comparative example.
In the wafer transfer apparatus 300 according to the above-described embodiment of the present invention, the second base portion 330 is attached so as to be movable with respect to the first base portion 320, and the second base portion The moving part 350 and the connecting part 380 are further attached to the 330 so that they can move. On the other hand, the wafer transfer apparatus 300 according to the first comparative example does not have the second base part 330, and the moving part 350 and the connecting part 380 move to the first base part 330. It is attached to be able to.

  That is, in the wafer transfer apparatus 300 according to the above-described embodiment of the present invention, there are a plurality (two) of parts that move in order to move the wafer W horizontally. In the wafer transfer apparatus 300 according to the above, there is only one part that moves to move the wafer W horizontally. For this reason, if it is going to lengthen the distance which moves the wafer W, it is necessary to lengthen the length of the moving direction of the wafer W of the 1st base part 320, and the wafer transfer apparatus 300 and the wafer transfer apparatus 300 are made into the length. The substrate processing apparatus 100 that is included becomes large.

FIG. 7 shows a wafer transfer apparatus 300 according to the second comparative example.
In the wafer transfer apparatus 300 according to the above-described embodiment of the present invention, the distance L <b> 2 that the moving unit 350 moves with respect to the second base unit 330 is such that the second base unit 330 moves to the first base unit 320. On the other hand, the distance L2 is longer than the moving distance L1, and the distance L2 is twice the distance L1. In contrast, in the wafer transfer apparatus 300 according to the second comparative example, the distance L2 and the distance L1 are the same. For this reason, the moving part 350 is moved to the second base part without moving the connecting part 380 relative to the second base part 330 while moving the second base part 330 relative to the first base part 320. When moving with respect to 330, for example, as shown in a region d surrounded by a broken line shown in FIG. 7, the locus of movement of the tweezers 388 easily interferes with other members such as the FOUP mounting shelf 105. If an attempt is made to prevent interference, the wafer transfer apparatus 300 and the substrate processing apparatus 100 having the wafer transfer apparatus 300 become large.

  As described above, the present invention can be applied to a substrate processing apparatus and a method for manufacturing a semiconductor device.

DESCRIPTION OF SYMBOLS 100: Substrate processing apparatus 101: Substrate processing apparatus main body 105: Mounting shelf 300: Wafer transfer apparatus 320: 1st base part 330: 2nd base part 340: Transfer number switching mechanism 350: Moving part 362: Tweezers 380 : Connecting portion 388: Tweezer 400: Drive transmission mechanism 410: First drive pulley 412: Second drive pulley 440: Belt member 452: Belt member 500: Control circuit W: Wafer

Claims (2)

A first base portion;
A second base portion that moves relative to the first base portion;
A first holding portion for holding a substrate; a moving portion that moves relative to the second base portion;
A connecting portion that includes a second holding portion that holds the substrate, is connectable to the moving portion, and moves relative to the second base portion integrally with the moving portion while being connected to the moving portion. When,
The second base portion is moved to a position where the locus of movement of the second holding portion does not interfere with other members, and the second moving portion is moved to the second moving portion in a state where the connection with the connecting portion is released. A control unit that controls the base unit to move a distance longer than a distance moved with respect to the first base unit;
A substrate processing apparatus. A first base portion;
A second base portion that moves relative to the first base portion;
A first holding portion for holding a substrate; a moving portion that moves relative to the second base portion;
A connecting portion that includes a second holding portion that holds the substrate, is connectable to the moving portion, and moves relative to the second base portion integrally with the moving portion while being connected to the moving portion. When,
A semiconductor device manufacturing method of a semiconductor device manufacturing apparatus comprising:
Holding the substrate on the first holding unit;
Moving the second base to a position where the locus of movement of the second holding part does not interfere with other members;
Moving the moving part in a state where the connection with the connecting part is released;
Have
A method of manufacturing a semiconductor device, wherein a distance that the moving part moves with respect to the second base part is longer than a distance that the second base part moves with respect to the first base part.

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