JP2013125935A - Board assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To identify the array position of the individual boards in a board assembly even after dividing the board assembly into individual boards, in the board assembly of individual boards.SOLUTION: In a board assembly 1 consisting of a plurality of individual boards 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i arranged via a division margin 3, a plurality of position recognition marks 4x, 4y indicating the array positions in the assembly of individual boards are provided corresponding to the individual boards 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i, respectively. Since each position recognition mark 4x, 4y is provided at the division margin 3 adjoining a corresponding individual board, the array position of the individual boards in the board assembly 1 can be identified even after dividing the board assembly into individual boards 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i.

Description

  The present invention relates to a substrate assembly in which a plurality of individual substrates are arranged via a dividing space.

  In recent years, in the production of substrates on which electronic circuits are formed, in order to reduce the time and man-hours required for production, a multi-sided collective substrate in which a plurality of individual substrates are formed in one substrate is formed. It is common to produce many pieces at once. In such a case, it is preferable not to mount a mounting component on an individual board that has a defect in the production process in order to reduce production cost and production time.

  Therefore, in the related art, as shown in FIG. 6, each of the plurality of individual substrates 502, the width of each of the individual substrates 502, the name of the product type, and the electronic component are provided at one place on the outer edge of the electronic circuit substrate 501. Is a technology for determining whether or not an electronic component can be mounted on each individual board 502 by forming a production information mark 503 indicating information such as whether or not the electronic component can be mounted, and reading the mark with a camera provided in the electronic component mounting apparatus. It has been proposed (Patent Document 1).

JP 2002-76699 A (refer to paragraphs 0035 to 0038, FIG. 1, etc.)

  By the way, in a multi-sided board, since the defect of the individual board may occur at the same position on the electronic circuit board, it is possible to grasp where the individual board is arranged on the electronic circuit board. This is useful for failure analysis. However, in the invention described in Patent Document 1, after the electronic circuit board is divided for each individual board, the production information for each individual board is lost, so it is difficult to investigate the production history of the individual board.

  The present invention has been made in view of the above-described problems, and in a substrate assembly that is an assembly of individual substrates, a position recognition mark that indicates an arrangement position in the assembly of individual substrates is provided on a division margin adjacent to the individual substrate. Thus, it is an object of the present invention to make it possible to identify the arrangement position of individual substrates in the substrate assembly even after the substrate assembly is divided.

  In order to achieve the above-described object, the substrate assembly of the present invention is a substrate assembly in which a plurality of individual substrates are arranged via a dividing margin, and is provided corresponding to each of the plurality of individual substrates. A plurality of position recognition marks indicating arrangement positions in an assembly of individual substrates are provided, and each of the position recognition marks is provided in the division margin adjacent to the corresponding individual substrate. 1). Thereby, even after dividing into a plurality of individual substrates, the arrangement position of each individual substrate in the substrate assembly can be identified.

  In addition, each of the position recognition marks may have a mark having a different arrangement position in the plurality of individual substrates corresponding to the arrangement position of the plurality of individual substrates. Thereby, it is possible to more easily identify the arrangement position in the assembly of the plurality of individual substrates.

  The plurality of individual substrates are arranged in a grid in the X and Y directions orthogonal to each other, and each of the position recognition marks is provided along one side of the corresponding individual substrate in the X direction. An X-direction mark and a Y-direction mark provided along one side of the Y-direction, and each of the X-direction marks corresponds to an arrangement position of the plurality of individual substrates in the X-direction. The Y-direction marks correspond to the arrangement positions of the plurality of individual substrates in the Y direction. In addition, the individual substrates may be arranged on the individual substrates so that their positions in the Y direction are different from each other (Claim 3). As a result, it is possible to identify the position of the individual substrate in the assembly based on the arrangement position in the X direction and the arrangement position in the Y direction of the individual substrate on which the position recognition mark is confirmed.

  Each of the plurality of individual substrates is provided with a plurality of mounting electrodes arranged in the X direction and the Y direction, and each of the X direction marks is arranged in the X direction of the plurality of individual substrates. Corresponding to the position, each of the Y direction marks is arranged at a position corresponding to any one of the plurality of mounting electrodes arranged in the X direction on the corresponding individual substrate. Corresponding to the arrangement position of the substrate in the Y direction, the substrate is preferably arranged at a position corresponding to one of the plurality of mounting electrodes arranged in the Y direction on the corresponding individual substrate. Item 4). Thereby, the correspondence between the X direction mark and the mounting electrode provided in the X direction of the individual substrate, and the Y direction mark and the mounting electrode provided in the Y direction of the individual substrate are provided. By examining the correspondence, it is possible to easily identify the position where the individual substrate was present in the substrate assembly.

  Each of the plurality of individual substrates is provided with a plurality of mounting electrodes arranged in the X direction that are equal to or larger than the number of arrangements of the individual substrates in the X direction, and more than the number of arrangements of the individual substrates in the Y direction. It is preferable that a plurality of mounting electrodes are arranged in the Y direction. As a result, it is possible to easily and reliably specify at which position in the substrate assembly each individual substrate exists.

  Further, the individual substrate may be a multilayer substrate in which a plurality of insulator layers are laminated, and each of the position recognition marks may be provided inside each of the plurality of individual substrates. . As a result, the position recognition mark is less likely to be corroded, and the arrangement position of the individual substrates in the substrate assembly can be reliably identified.

  The position recognition marks may be provided across a plurality of layers of the insulator layers. As a result, the degree of freedom of arrangement of the position recognition mark is improved, and even when a formation defect of the position recognition mark occurs in one layer, by using the position recognition mark of another layer having no formation defect, The arrangement position of the individual substrates in the substrate assembly can be reliably identified.

  Further, a wiring pattern may be provided on each of the plurality of individual substrates, and each of the position recognition marks may be formed of the same material as that of the wiring pattern. As a result, the wiring pattern and the position recognition mark can be formed at the same time, and the time required for production of the individual substrates can be shortened and the production cost can be reduced.

  The plurality of individual substrates may be mounting substrates on which electronic components are mounted (Claim 9). Thereby, after dividing | segmenting, the individual board | substrate which can identify the arrangement position of the individual board | substrate in a board | substrate aggregate | assembly can be applied to the module in which an electronic component is mounted, for example.

  In the substrate assembly according to the present invention, since a plurality of position recognition marks indicating the arrangement position in the assembly are provided, it is possible to identify the arrangement position of each individual substrate in the substrate assembly even after being divided into a plurality of individual substrates. it can.

It is sectional drawing of the module using the individual board | substrate which comprises the board | substrate aggregate | assembly concerning 1st Embodiment of this invention. It is a top view of the board | substrate aggregate | assembly concerning 1st Embodiment of this invention. It is a figure which shows the example of arrangement | positioning of the position recognition mark provided in the division | segmentation margin of the board | substrate assembly concerning 2nd Embodiment of this invention. It is a figure which shows the example of arrangement | positioning of the position recognition mark provided in the division | segmentation margin of the board | substrate assembly concerning 3rd Embodiment of this invention. It is a figure which shows the example of formation of the position recognition mark which displays the arrangement position of a single substrate. It is a figure which shows the board | substrate aggregate | assembly of a prior art.

<First Embodiment>
The board | substrate aggregate | assembly concerning 1st Embodiment of this invention is demonstrated with reference to FIG. 1 and FIG. FIG. 1 is a cross-sectional view of a module using individual substrates constituting the substrate assembly according to the first embodiment of the present invention, and FIG. 2 is a plan view of the substrate assembly according to the first embodiment of the present invention. It shows an arrangement example of the position recognition marks provided at the margins. In FIG. 1, a part of a plurality of insulator layers constituting an individual substrate which is a multi-layer substrate is not shown, and a boundary between the individual substrate and a division is indicated by a broken line. Further, in FIG. 2, for the sake of simplicity of explanation, the position recognition marks and the mounting electrodes provided in the division are shown, and other wiring electrodes and ground electrodes are not shown.

  The individual substrate 2 constituting the substrate assembly 1 according to this embodiment is a multilayer substrate in which an insulator layer in which electrodes 6 such as signal transmission wiring electrodes and ground electrodes are formed is laminated on the front surface or the back surface. Each insulator layer is composed of a low-temperature co-fired ceramic substrate (LTCC), a glass epoxy resin substrate, a glass substrate, or the like. The individual board 2 is used for, for example, a short-range wireless communication (Bluetooth (registered trademark)) or a wireless LAN module.

  The manufacturing method of the individual substrate 2 is manufactured by dividing the substrate assembly 1 in which the plurality of individual substrates 2 are arranged via the margin 3 into each individual substrate 2. In this case, a plurality of insulator layer assemblies in which a plurality of insulator layers are arranged through a partition are prepared, and laser processing is performed on each of the plurality of insulator layers in each insulator layer assembly. A via hole is formed by, for example, a via conductor 9 is formed by filling the formed via hole with a conductive paste containing Ag, Cu or the like by a screen printing technique or the like, and screen printing or photo printing is performed on the front or back surface of a plurality of insulators. The electrode 6 is formed by a lithography technique or the like. In addition, the substrate assembly 1 is manufactured by laminating each of the aggregates of the respective insulator layers in which the via conductors 9 and the electrodes 6 are formed on a plurality of insulator layers, and pressurizing and firing them. Then, the substrate assembly 1 is divided into individual substrates 2 by dicing or the like.

  The module 8 using the individual substrate 2 obtained by dividing the substrate assembly 1 according to this embodiment is positioned in the uppermost layer among the plurality of insulator layers constituting the individual substrate 2, as shown in FIG. The electronic component 7 is mounted on the surface of the insulating layer to be formed, and the position recognition mark 4 indicating the arrangement position of the individual substrates 2 in the collective substrate 1 is formed in the inner layer dividing margin 3. Each insulator layer is provided with an electrode 6 such as a wiring electrode for signal transmission and a ground electrode, and a via conductor 9, and a mounting electrode is provided on the back surface of the insulator layer located at the lowest layer among the plurality of insulator layers 5 is formed. The position recognition mark 4 and the electrode 6 are preferably made of the same material. By doing in this way, since the electrode 6 and the position recognition mark 4 can be formed simultaneously, the time required for production of an individual substrate and the production cost can be reduced.

  Further, in the substrate assembly 1 according to this embodiment, for example, as shown in FIG. 2, the individual substrates 2 a, 2 b, 2 c, 2 d, 2 e, 2 f, 2 g, 2 h, 2 i having a rectangular shape are separated by 3. Are arranged in a grid pattern (3 rows × 3 columns) in the X and Y directions orthogonal to each other. In this case, each of the plurality of individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i has three mounting electrodes 5x1 arranged in the X direction on the back surface of the insulator layer located at the bottom layer. , 5x2, 5x3 (hereinafter collectively referred to as 5x), two mounting electrodes 5y1, 5y2, 5y3 (hereinafter collectively referred to as 5y) provided in pairs in the Y direction. Position recognition marks 4 x 1, 4 x 2, 4 x 3, 4 y 1 are provided at the margin 3 of the aggregate of the insulator layers located in the inner layer among the aggregate of the plurality of insulator layers that are provided in pairs and constitute the substrate assembly 1. 4y2 and 4y3 are provided. Hereinafter, 4x1, 4x2, and 4x3 are collectively referred to as 4x, 4y1, 4y2, and 4y3 are collectively referred to as 4y, 4x, and 4y are collectively referred to as 4.

  As shown in FIG. 2, the position recognition mark 4 is provided corresponding to each of the plurality of individual substrates 2 a, 2 b, 2 c, 2 d, 2 e, 2 f, 2 g, 2 h, 2 i, and is adjacent to the corresponding individual substrate 2. It is provided in the dividing margin 3. In this embodiment, each of the position recognition marks 4 provided corresponding to each of the plurality of individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i is in the X direction of the corresponding individual substrate 2. An X-direction mark 4x provided along one side and a Y-direction mark 4y provided along one side in the Y direction are included.

  The X-direction marks 4x1 of the individual substrates 2a, 2b, 2c located in the first column from the left are the two pairs of three mounting electrodes arranged in the X direction on the individual substrates 2a, 2b, 2c. 5x, the X direction marks 4x2 of the individual substrates 2d, 2e, and 2f that are provided at positions corresponding to the mounting electrodes 5x1 arranged on the leftmost side of the respective pairs are arranged in the second column. In the individual substrates 2d, 2e, and 2f, among the three mounting electrodes 5x in each of the two pairs, each pair is provided at a position corresponding to the mounting electrode 5x2 arranged second from the left, and positioned in the third column. The X direction marks 4x3 of the individual substrates 2g, 2h, 2i are arranged third from the left of each of the two mounting electrodes 5x in each of the individual substrates 2g, 2h, 2i. It is provided at positions corresponding to the mounting electrodes 5x3. In this case, the X direction mark 4x of each of the plurality of individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i is divided into upper and lower adjacent to the sides parallel to the X direction of the individual substrates. 3 each.

  In addition, the Y-direction marks 4y1 of the individual substrates 2a, 2d, 2g located in the first row from the top of the two pairs of mounting electrodes 4y arranged in the Y direction on the individual substrates 2a, 2d, 2g. Among them, the Y-direction marks 4y2 of the individual substrates 2b, 2e, and 2h that are provided at the positions corresponding to the mounting electrodes 5y1 arranged on the top of each pair are the individual substrates. In 2b, 2e, and 2h, among the three mounting electrodes 5y of each of the two pairs, the position corresponding to the mounting electrode 5y2 arranged second from the top of each pair, the individual substrate 2c positioned in the third row, The Y direction mark 4y3 of 2f, 2i is attached to the mounting electrode 5y3 arranged third from the top of each pair of the three mounting electrodes 5y in each of the individual substrates 2c, 2f, 2i. Provided respond located. In this case, each Y-direction mark 4y of each individual substrate 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i is divided into left and right division margins 3 adjacent to the sides parallel to the Y direction of the individual substrate. Is provided.

  Accordingly, in each of the individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i, the respective upper and lower three mounting electrodes 5x1, in which the X direction marks 4x are arranged in the X direction of the individual substrate 2, respectively. By examining which mounting electrode 5x of 5x2 and 5x3 is provided, it is possible to identify in which column the individual substrate 2 is arranged in the substrate assembly 1. In addition, it is determined which of the three mounting electrodes 5y1, 5y2, 5y3 arranged in the Y direction of the corresponding individual substrate 2 corresponds to each mounting electrode 5y corresponding to each Y-direction mark 4y. By examining, it is possible to identify in which row the individual substrate 2 is arranged in the substrate assembly 1. The position of the individual substrate 2 in the substrate assembly 1 can be specified by the arrangement position of the row and column as a result of the examination. In addition, the arrangement position of the position recognition mark 4 provided in the inner layer of the multilayer substrate can be confirmed by, for example, X-ray analysis or polishing the multilayer substrate.

  Further, the substrate assembly 1 is formed by dicing so as to leave the position recognition marks 4 provided on the dividing margins 3 adjacent to the individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i. Even when the individual substrates 2 are divided, the arrangement positions of the individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, and 2i in the substrate assembly 1 can be identified. In particular, when performing failure analysis, if the cause of the failure is due to, for example, a hole in the photomask when a wiring pattern is formed by photolithography, a failure occurs at the same position in the substrate assembly 1. Therefore, by examining the arrangement position of the individual substrates 2 in which a problem has occurred, the time required for investigating the cause can be shortened, and the efficiency of failure analysis can be improved.

  Further, since each of the position recognition marks 4 is provided inside (inner layer) of the multilayer substrate, there is no possibility of disappearing due to corrosion or the like, and each of the individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i The arrangement position in the substrate assembly 1 can be reliably identified.

  Further, for each individual substrate 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i, the X-direction mark 4x has two portions of the upper and lower dividing margins 3 adjacent to the individual substrate 2, Y Since the direction mark 4y is provided at two locations, the left and right dividing margins 3 adjacent to the individual substrate, for example, even if one mark cannot be recognized due to a shift in the dicing position, the other mark If it remains, the arrangement position of the individual substrates 2 in the substrate assembly 1 can be identified. In particular, if the deviation of the dicing position is caused by the deviation of the recognition position of the alignment mark by the camera of the dicing apparatus, there is a high possibility that one of the marks will remain.

  Further, since the position recognition mark 4 is provided in the dividing margin 3, the number of individual substrates 2 in the substrate assembly 1 is increased as compared with the case where the position recognition mark 4 is separately provided on the outer edge portion of the substrate assembly 1. Therefore, the production efficiency of the individual substrate 2 can be improved and the production cost can be reduced.

  Further, when a shield case for blocking unnecessary electromagnetic waves irradiated from the outside is mounted on each of the individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i, printing is performed on the shield case portion. A method of giving positional information of the individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i is also conceivable. However, the method is limited to an individual substrate having a shield case, and the printing program is complicated. The problem of becoming. In this respect, since the position recognition mark 4 according to this embodiment is provided in the dividing margin 3, even if there is no shield case, the substrate assembly of the individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i. The position within 1 can be identified.

  In addition, by placing markings such as numbers on the front or back of each individual board 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i, the position information is given to each individual board 2a, 2b, 2c, 2d, 2e, Although a method of assigning to each of 2f, 2g, 2h, and 2i is also conceivable, a certain amount of space must be secured on the individual substrate in order to recognize the marking as a number, and there is a problem in miniaturizing the product. Arise. In addition, if the position information is expressed in graphics using a resist, etc., the space for marking can be saved. However, since there are only a few places where the marking position can be seen, products that do not have a shield case or seal cases can be easily removed. There arises a problem that the use of the individual substrate 2 is restricted by the product structure that such an individual substrate 2 can be used only for a certain product. Since the substrate assembly 1 according to this embodiment is provided with the position recognition marks 4 indicating the position information of the individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i on the dividing margin 3, the individual substrates 2a , 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i, it is not necessary to secure a marking space, and the product can be downsized. Further, since the position information mark 4 is provided on the dividing margin 3 outside the individual substrate 2, there is no problem that the use of the individual substrate 2 is restricted by the product structure as described above.

  In this embodiment, since the position recognition mark 4 is arranged adjacent to the individual substrate 2, the substrate width and the production type name of each individual substrate are collectively put on a part of the outer edge portion of the substrate assembly as in the prior art. As compared with the case where a production information mark indicating information such as whether or not an electronic component can be mounted is provided, the acquisition time of information on each individual substrate (arrangement position of each individual substrate in the substrate assembly) can be shortened.

Second Embodiment
A substrate assembly according to a second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a plan view of the substrate assembly according to the second embodiment, showing an example of the arrangement of the position recognition marks provided on the dividing margin. In FIG. 3, in order to simplify the description, wiring electrodes and ground electrodes formed on the individual substrates are not shown.

  The substrate assembly 1a according to the second embodiment differs from the substrate assembly 1 according to the first embodiment shown in FIG. 2 in that the individual substrates 2a, 2b, 2c, 2d, and 2e are as shown in FIG. , 2 f, 2 g, 2 h, 2 i, the X direction mark 4 x and the Y direction mark are located at positions corresponding to the mounting electrode 5 provided on the back surface of the insulator layer located at the lowermost layer of the plurality of insulator layers. 4y is not provided. Since other configurations are the same as those of the first embodiment, the description thereof is omitted by giving the same reference numerals.

  Even in such a case, the individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i in the individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i, respectively. Reference points Pa, Pb, Pc, Pd, Pe, Pf, Pg, Ph, and Pi are set at the same upper position, and an X direction mark 4x is arranged at a position separated by x1 from the reference point in the X direction. If the individual substrate 2 is arranged in the first column from the left, and the X direction mark 4x is arranged at a position separated by x2 from the reference point in the X direction, the individual substrate 2 is arranged. When the substrate 2 is arranged in the second column from the left, and the X direction mark 4x is arranged at a position x3 away from the reference point in the X direction, the individual substrate 2 is 3 from the left. If you decide that they are arranged in the second column, Each of the plates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i is separated from the reference points Pa, Pb, Pc, Pd, Pe, Pf, Pg, Ph, Pi by a distance corresponding to the arrangement position. By providing the X direction mark 4x at the position, it is possible to identify in which row in the substrate assembly 1a the individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i are arranged. it can.

  Similarly, for the rows, the individual points 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i, respectively, from the reference points Pa, Pb, Pc, Pd, Pe, Pf, Pg, Ph, Pi. When the Y direction mark 4y is arranged at a position separated by y1 in the Y direction, the individual substrates are arranged in the first row from the top, the reference points Pa, Pb, Pc, Pd, Pe, When the Y-direction mark 4y is arranged at a position y2 away from Pf, Pg, Ph, Pi in the Y direction, the individual substrate is arranged in the second row from the top, the reference point Pa. , Pb, Pc, Pd, Pe, Pf, Pg, Ph, and Pi, the Y direction mark 4y is arranged at a position separated by y3 in the Y direction. If you decide that they are arranged in By providing the Y-direction mark 4y at a position corresponding to this, it is determined in which row in the substrate assembly 1a the individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i are arranged. Can be identified.

<Third Embodiment>
A substrate assembly according to a third embodiment of the present invention will be described with reference to FIG. FIG. 4 is a plan view of the substrate assembly according to the third embodiment, and shows an example of the arrangement of position recognition marks provided at the division. In FIG. 4, in order to simplify the description, wiring electrodes and ground electrodes formed on the individual substrates are not shown.

  The substrate assembly 1b according to the third embodiment is different from the substrate assembly 1a according to the second embodiment shown in FIG. 3 in that the individual substrates 2a, 2b, 2c, 2d, 2e are as shown in FIG. , 2f, 2g, 2h, 2i, corresponding to the arrangement positions of the individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i instead of the X-direction mark and the Y-direction mark, respectively. The position recognition marks 4 having different arrangement positions in the individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h and 2i are provided. In addition, since the other structure is the same as 2nd Embodiment, description is abbreviate | omitted by attaching | subjecting the same code | symbol.

  In this case, the arrangement position of the position recognition mark 4 in each individual substrate 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i is associated with the arrangement position of the individual substrate 2 in the substrate assembly 1b. Then, by checking the arrangement position of the position recognition mark 4 provided on the dividing margin 3 of the target individual substrate 2, the arrangement position of the target individual substrate 2 in the substrate assembly 1b can be identified. it can.

  In this embodiment, a plurality of position recognition marks 4 may be provided for each individual substrate. By doing so, since the variation of the arrangement position of the position recognition mark 4 is increased, it is possible to easily associate the arrangement positions even with a board assembly having a large number of individual boards arranged.

  The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention.

  For example, in each of the embodiments described above, a total of nine substrates in three columns and three rows are arranged in each substrate assembly 1, 1a, 1b. However, the number of individual substrates 2 to be arranged may be larger than this. It doesn't matter if there are few. Also, the number of rows and columns need not be the same, and the individual substrates 2 may be arranged so that the numbers of rows and columns are different.

  Further, in each of the above-described embodiments, the position recognition mark 4 is provided in the insulator layer positioned in the inner layer among the respective insulator layers in the multilayer substrate. However, the position recognition mark 4 is provided in the insulator in the uppermost layer, for example. You may provide in the surface of a layer, the back surface of the insulator layer in the lowest layer, ie, the surface of a multilayer substrate, or a back surface.

  Further, in each of the individual substrates 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, and 2i, a part of the position recognition mark 4 may be provided in another insulator layer. In this case, the degree of freedom of arrangement of the position recognition mark 4 can be improved. Further, the same position recognition mark 4 may be provided so as to overlap over a plurality of layers. In this case, even if the formation failure of the position recognition mark 4 occurs in one layer, the position recognition mark 4 of another layer having no formation failure can be used to ensure the inside of the substrate assembly of the individual substrates. The sequence position can be identified.

  In the first embodiment, the mounting electrodes 5x are arranged on the individual substrates 3 in the same number as the number of columns of the individual substrates in the substrate assembly 1 (up and down), and the mounting electrodes 5y are disposed in the substrate assembly 1. The number of mounting electrodes 5x and the number of mounting electrodes 5y is the same as the number of rows of the individual substrates. However, any number of mounting electrodes 5x and mounting electrodes 5y may be provided as long as the number is greater than the number of rows and columns.

  In the first embodiment and the second embodiment, for one individual substrate 2, the X direction mark 4 x is provided in each of the upper and lower division margins 3 adjacent to the individual substrate, and the Y direction mark 4 y is provided. However, if the dicing accuracy can be ensured, the X-direction mark 4x is placed on only the upper or lower division margin 3 and the Y-direction mark 4y is provided. It is also possible to have a configuration in which the is provided on only one of the left and right divisions.

  Needless to say, the shape of the individual substrate 2 is not limited to a rectangular shape.

  Further, the display method of the arrangement position of the individual substrates 2 in the substrate assembly by the position recognition mark 4 is not limited to the above-described embodiments, and for example, as shown in FIG. 5, the arrangement position of the individual substrates 2 in the substrate assembly. May be represented by numbers, and the numbers may be divided into 3 and expressed in binary numbers. In this case, 1 is represented by a black circle mark, 0 is represented by no mark, and the arrangement position of the individual substrates 2 can be identified by reading the arrangement of the black circle mark and no mark. FIG. 5 shows an example of forming the position recognition mark 4 when “93” is expressed in binary (1011101).

1, 1a, 1b Substrate assembly 2, 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i Substrate 3 Divide 4 Position recognition mark 4x, 4x1, 4x2, 4x3 X direction mark 4y, 4y1 , 4y2, 4y3 Y direction mark 5, 5x, 5x1, 5x2, 5x3, 5y, 5y1, 5y2, 5y3 Mounting electrode

Claims (9)

In a substrate assembly in which a plurality of individual substrates are arranged through dividing margins,
Provided for each of the plurality of individual substrates, and includes a plurality of position recognition marks indicating arrangement positions in the assembly of the individual substrates,
Each of the position recognition marks is provided at the division margin adjacent to the corresponding individual substrate.   2. The position recognition mark according to claim 1, wherein each of the position recognition marks has a mark having a different arrangement position in the plurality of individual substrates corresponding to the arrangement position of the plurality of individual substrates. Board assembly. The plurality of individual substrates are arranged in a lattice pattern in the X direction and the Y direction orthogonal to each other,
Each of the position recognition marks has an X direction mark provided along one side of the X direction of the corresponding individual substrate and a Y direction mark provided along one side of the Y direction. ,
Each of the X-direction marks is arranged on the individual substrate so that the positions in the X direction in the individual substrates corresponding to the arrangement positions of the plurality of individual substrates in the X direction are different from each other.
Each of the Y-direction marks is arranged on the individual substrate so that the position of the plurality of individual substrates in the Y direction in the corresponding individual substrate is different from the corresponding position in the Y direction. The substrate assembly according to claim 1 or 2, wherein Each of the plurality of individual substrates is provided with a plurality of mounting electrodes arranged in the X direction and the Y direction,
Each of the X direction marks corresponds to one of the plurality of mounting electrodes arranged in the X direction on the corresponding individual substrate corresponding to the arrangement position of the plurality of individual substrates in the X direction. Placed in the corresponding position,
Each of the Y direction marks corresponds to one of the plurality of mounting electrodes arranged in the Y direction on the corresponding individual substrate corresponding to the arrangement position of the plurality of individual substrates in the Y direction. The substrate assembly according to claim 3, wherein the substrate assembly is disposed at a corresponding position. Each of the plurality of individual substrates is provided with a plurality of mounting electrodes arranged in the X direction that are equal to or larger than the number of arrangements of the individual substrates in the X direction, and a plurality of mounting electrodes that are equal to or larger than the number of arrangements of the individual substrates in the Y direction. The board assembly according to claim 4, wherein mounting electrodes are arranged in the Y direction.   The individual substrate is a multilayer substrate in which a plurality of insulator layers are laminated, and each of the position recognition marks is provided inside each of the plurality of individual substrates. 6. The substrate assembly according to any one of 5 above.   The substrate assembly according to claim 6, wherein each of the position recognition marks is provided across a plurality of layers of each of the insulator layers.   8. The substrate according to claim 1, wherein a wiring pattern is provided on each of the plurality of individual substrates, and each of the position recognition marks is formed of the same material as the wiring pattern. Aggregation. The board assembly according to claim 1, wherein the plurality of individual boards are mounting boards on which electronic components are mounted.

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