JP2013125666A - Sheet with movable contact, manufacturing method of the same, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet with a movable contact having a novel structure in which conduction is effected in a wiring layer by heating, and replacement work can be readily performed.SOLUTION: A sheet with a movable contact includes a substrate 10, a foam layer 20 (expansion layer) formed on the substrate 10, an electrode 30 formed on the foam layer 20, and an adhesive layer 40 formed outside of the foam layer 20 and the electrode 30 on the substrate 10. The foam layer 20 is expanded by heating to contact separated wiring layers 54, 56, thereby effecting a conduction between the wiring layers 54, 56.

Description

  The present invention relates to a sheet with a movable contact, a manufacturing method thereof, and an electronic device using the same.

  Conventionally, there is a temperature switch that utilizes the expansion of a heating foaming agent. In such a temperature switch, in a heating environment, the foaming agent foams and the foamed layer expands, and the movable contact fixed on the foamed layer comes into contact with the fixed contact to obtain conduction (Patent Document). 1).

  Further, there is a temperature switch that turns on / off conduction by temperature setting using a bimetal using metals having different thermal expansions (Patent Document 2 and the like).

No. 4-9714 JP 2009-4278 A

  In a temperature switch that uses the expansion of a heated foaming agent, the foaming phenomenon is irreversible, and once it functions as a switch, it must be removed and replaced. However, with the conventional temperature switch, the ease of removal is not considered, and the replacement work is troublesome.

  Moreover, in the temperature switch using a bimetal, conduction can be interrupted by heating, but when a flexible base material such as a film or paper is used, there is a possibility that the conduction will be conducted again by bending.

  It is an object of the present invention to provide a sheet with a movable contact having a novel structure capable of conducting a wiring layer by heating and easily performing replacement work, a manufacturing method thereof, and an electronic device using the sheet.

  According to one aspect of the disclosure below, a base material, an expansion layer formed on the base material, an electrode formed on the expansion layer, and the base outside the expansion layer and the electrode A sheet with a movable contact having an adhesive layer formed on a material is provided.

  According to another aspect of the disclosure, a base material, an expansion layer formed on the base material, an electrode formed on the expansion layer, an outer side of the expansion layer and the electrode A sheet with a movable contact including an adhesive layer formed on the substrate, and a wiring substrate including a plurality of wiring layers separated by providing opposing connection portions, and the wiring substrate An electronic device in which the adhesive layer of the movable contact-attached sheet is bonded onto the wiring substrate so that the electrode of the movable contact-attached sheet is disposed at a position corresponding to the connection portion of the wiring layer Is provided.

  Furthermore, according to another aspect of the disclosure, a step of forming an expansion layer on a base material, a step of forming an electrode on the expansion layer, and the base material outside the expansion layer and the electrode The manufacturing method of the sheet | seat with a movable contact which has the process of forming an adhesion layer on it is provided.

  The sheet with a movable contact is formed by laminating an expansion layer and an electrode on a base material, and an adhesive layer is formed on the outer base material thereof. The adhesive layer of the movable contact-attached sheet is adhered to the wiring substrate so that the electrode of the movable contact-attached sheet corresponds to each connection portion of the separated wiring layer of the wiring substrate.

  When heated, the expansion layer of the sheet with the movable contact expands, and the electrode thereon is brought into contact with the connection portion of the wiring layer to achieve conduction. When exchanging the sheet with movable contact functioning as a switch, the adhesive layer of the sheet with movable contact can be easily peeled off from the wiring substrate, which facilitates the replacement operation.

  Moreover, since the base material of the sheet | seat with a movable contact can use a flexible base material, it is also possible to attach to the curved surface of a flexible wiring base material.

Drawing 1 is a sectional view and a top view (the 1) showing a manufacturing method of a sheet with a movable contact of an embodiment. 2A and 2B are a cross-sectional view and a plan view (part 2) illustrating the method for manufacturing the sheet with movable contact according to the embodiment. Drawing 3 is a sectional view and a top view (the 3) showing a manufacturing method of a sheet with a movable contact of an embodiment. FIG. 4 is a cross-sectional view and a plan view showing the sheet with movable contact according to the embodiment. FIG. 5 is a cross-sectional view and a plan view showing a movable contact-attached sheet according to a modification of the embodiment. 6 is a cross-sectional view and a plan view showing a wiring substrate to which the sheet with movable contact of FIG. 4 is attached. 7 is a cross-sectional view and a plan view showing a state in which the movable contact-attached sheet of FIG. 4 is attached to the wiring substrate of FIG. FIG. 8 is a cross-sectional view and a plan view showing a state in which the foamed layer of the sheet with movable contact is expanded by heating to bring the electrode into contact with the wiring substrate to conduct. FIG. 9 is a cross-sectional view showing how the sheet with movable contacts is removed from the wiring substrate. FIGS. 10A and 10B are a cross-sectional view and a plan view for explaining the first embodiment. 11A and 11B are a sectional view and a plan view for explaining the second embodiment. 12A and 12B are a cross-sectional view and a plan view for explaining the third embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  1-3 is a figure which shows the manufacturing method of the sheet | seat with a movable contact of embodiment, FIG. 4 is a figure which shows the sheet | seat with a movable contact of embodiment. In each figure, the upper view is a cross-sectional view, the lower view is a plan view, and the cross-sectional view shows a cross section taken along line II in the plan view.

  In the method for producing a seed with a movable contact according to the embodiment, as shown in FIG. As a material of the base material 10, paper, polyester resin, glass epoxy resin, glass, ceramics, or the like is used.

  Next, as shown in FIG. 2A, in order to form a foamed layer, a heated foaming agent coating 20a in which heated foaming agent particles 24 are dispersed in a resin 22 is prepared. The resin 22 is dissolved in an organic solvent or the like.

  The heated foaming agent particle 24 has a spherical core 24a formed from a hydrocarbon and a shell 24b formed from a thermoplastic resin formed on the outer surface of the core 24a. An example of the thermoplastic resin that forms the shell 24b is an acrylic resin.

  When the heated foaming agent particles 24 are heated, the hydrocarbons in the core 24a are vaporized and the thermoplastic resin in the shell 24b is softened to cause expansion. The heating temperature for foaming the heated foaming agent particles 24 is 80 ° C to 150 ° C. Examples of such heated foaming agent particles 24 include “ADVANCEL” manufactured by Sekisui Chemical Co., Ltd. and “Microsphere” manufactured by Matsumoto Yushi Seiyaku Co., Ltd.

  Examples of the resin 22 supporting the heating foaming agent particles 24 include acrylic resin, polyester resin, epoxy resin, urethane resin, polyvinyl alcohol resin, polyethylene resin, polyolefin resin, polycarbonate resin, and fluorine resin. Moreover, it is preferable to use a thermoplastic resin that does not inhibit the expansion of the heated foaming agent particles 24 as the resin 22 that supports the heated foaming agent particles 24.

  Further, a photosensitive resin may be used as the resin 22 supporting the heating foaming agent particles 24, and a required pattern may be formed based on photolithography that performs light irradiation.

  Moreover, as a ratio of the heating foaming agent particle 24 disperse | distributed to resin 22, it is preferable to set mass: 10g-150g of the heating foaming agent particle | grains 24 with respect to 100 mass of resin22.

  And as shown in FIG.2 (b), after forming the heating foaming agent coating material 20a in pattern shape on the center part of the base material 10, the foaming layer 20 is obtained by making it dry. The heating foaming agent coating 20a is dried in an atmosphere at a temperature lower than the foaming start temperature of the heating foaming agent particles 24 so that the heating foaming agent particles 24 do not foam.

  As a method for forming the heating foam coating material 20a, screen printing, offset printing, flexographic printing, spin coating method, roll coating method, slit coating method, a controller that can supply a certain amount of liquid and a dispenser equipped with a nozzle or needle are used. Or an ink jet method.

  As will be described later, after the electrodes are formed on the foamed layer 20, an adhesive layer is disposed around them to form a sheet with a movable contact, which is attached to the wiring substrate. When heated, the foam layer 20 expands and expands, and the electrode on the foam layer 20 comes into contact with the separated wiring layer of the wiring substrate to achieve conduction.

  Focusing on the expansion ratio of the heating foaming agent 24, if the expansion ratio is too small, the expansion of the foam layer 20 is insufficient, and the electrodes do not contact the wiring layer of the wiring substrate, resulting in switching failure. On the other hand, when the expansion ratio of the heating foaming agent 24 is too large, pressure is applied from the foam layer 20 to the wiring substrate, and the adhesive layer of the movable contact-attached sheet is peeled off from the wiring substrate, so that conduction cannot be maintained. .

  From such a viewpoint, the heating foaming agent 24 having a foaming ratio of 2 to 100 times, preferably 10 to 50 times is used.

  As the expansion layer, the expansion layer 20 in which the heated foaming agent particles 24 expand and expand is exemplified, but various expansion layers other than the expansion layer 20 that expand upon heating can be used.

  Subsequently, as shown in FIG. 3, an electrode 30 is formed on the foam layer 20. As the material of the electrode 30, aluminum (Al), silver (Ag), gold (Au), copper (Cu), nickel (Ni), ITO (Indium Tin Oxide), or the like is used. Or you may use what these metals contained in resin and made printing possible.

  Alternatively, a conductive polymer such as polyaniline or PDOT / PSS may be used as the material of the electrode 30.

  As a first method for forming the electrode 30, there is a method in which a metal layer is formed on the substrate 10 and the foamed layer 20 by a sputtering method or an ion plating method, followed by patterning based on photolithography. .

  As a second method of forming the electrode 30, a plating resist having an opening provided on the foam layer 20 is formed on the substrate 10, and a metal plating layer is formed in the opening by electroless plating or the like. The electrode 30 may be formed.

  Further, as a third method of forming the electrode 30, a conductive ink containing conductive particles, a resin, and a solvent is formed by a spin coating method, a roll coating method, or a slit coating method, and then patterned based on photolithography. There is a way. Examples of the conductive particles contained in the conductive ink include silver (Ag), nickel (Ni), and copper (Cu).

  As a fourth method for forming the electrode 30, a conductive ink containing conductive particles, a resin, and a solvent may be formed by screen printing, offset printing, flexographic printing, or the like. Alternatively, the conductive ink may be directly drawn by a method using a controller capable of supplying a certain amount of liquid and a dispenser equipped with a nozzle or needle, an ink jet method, or the like.

  As a specific example of the conductive ink, there is “ECM-100” manufactured by Taiyo Ink Co., which is a silver ink.

  Next, as shown in FIG. 4, an adhesive layer 40 is formed in a frame-like region around the foam layer 20 and the electrode 30 on the base material 10. The adhesive layer 40 is formed from a tape 40a provided with an adhesive layer 40b on both sides. A resin film or the like is used as the tape 40a. Alternatively, the entire adhesive layer 40 may be formed from an adhesive material. In addition, a peelable adhesive layer may be used as the adhesive layer 40. The peelable adhesive layer is sometimes called an adhesive layer.

  As described above, the movable contact-attached sheet 1 of the embodiment is obtained. In the case of using a large-sized substrate 10 with multiple chamfers, a large number of component forming regions are defined on the substrate 10, and the substrate 10 is cut at a required stage of the manufacturing process to obtain individual sheets with movable contacts. 1 is obtained.

  As shown in FIG. 4, the sheet 1 with a movable contact according to the embodiment is formed by laminating a foam layer 20 and an electrode 30 in order from the bottom in a central portion on a base material 10. An adhesive layer 40 is formed in a frame shape on the base material 10 outside the foam layer 20 and the electrode 30.

  The height (thickness) of the adhesive layer 40 is set to be higher than the total height of the foam layer 20 and the electrode 30 when the foam layer 20 is not foamed. In addition to this, the height (thickness) of the adhesive layer 40 is set to be lower than the total height of the foam layer 20 and the electrode 30 after the foam layer 20 is heated and expanded.

  That is, in the state where the upper side of the sheet with movable contact 1 in FIG. 4 is free, when the foamed layer 20 is not foamed, the upper surface of the adhesive layer 40 is disposed above the upper surface of the electrode 30. And after the foaming layer 20 expands and expands by heating, each thickness is set so that the upper surface of the electrode 30 is arranged above the upper surface of the adhesive layer 40.

  As will be described later, the adhesive layer 40 of the movable contact-attached sheet 1 is disposed by being adhered to the wiring substrate and functions as a switch. The pressure-sensitive adhesive layer 40 needs to have a certain degree of adhesion between room temperature and the temperature at which the foamed layer 20 foams. The peel strength of the adhesive layer 40 is preferably 100 g or more in a peel strength test using only springs.

  After the sheet with movable contact 1 functions as a switch, the adhesive layer 40 of the sheet with movable contact 1 is peeled from the wiring substrate. In order to make the peeling at this time easier, it is preferable to use the pressure-sensitive adhesive layer 40 having a characteristic that the adhesive strength is reduced by cooling treatment, irradiation of electromagnetic waves such as ultraviolet rays, or heat treatment.

  By using such an adhesive layer 40, the peel strength at the time of peeling of the adhesive layer 40 is reduced to 30 g or less in a peel strength test using only a spring, so that peeling becomes easy.

  Thus, as the pressure-sensitive adhesive layer 40, a material having a characteristic that a sufficient adhesive force is obtained at the time of adhesion and the adhesive force is reduced at the time of peeling is preferably used.

  FIG. 5 shows a sheet 1a with a movable contact according to a modification of the embodiment. As shown in FIG. 5, in the sheet 1a with a movable contact of the first modified example, the adhesive layer 40 formed around the foam layer 20 and the electrode 30 is divided and arranged. As described above, the adhesive layers 40 are not necessarily connected and may be formed in a frame shape around the foam layer 20 and the electrode 30.

  Thus, by arranging the adhesive layer 40 in a frame shape around the foam layer 20 and the electrode 30, the sheets 1 and 1a with movable contacts can be stably adhered to the wiring substrate.

  Although not particularly illustrated, the adhesive layer 40 is not necessarily arranged so as to surround the foam layer 20 and the electrode 30, and may be arranged in an L shape or the like only in one direction of the foam layer 20 and the electrode 30. Good.

  Next, the usage method of the sheet | seat 1 with a movable contact of FIG. 4 mentioned above is demonstrated. 6 to 8, the upper view is a cross-sectional view, and the lower view is a plan view.

  As shown in FIG. 6, a wiring substrate 50 having a first wiring layer 54 and a second wiring layer 56 on the upper surface of the insulating substrate 52 is prepared. As the wiring substrate 50, for example, a printed wiring board or the like is used.

  Referring to the plan view of FIG. 6, on the upper surface of the wiring substrate 50, a first wiring layer 54 having a connection portion C1 on the distal end side and a second wiring portion 56 having a connection portion C2 on the distal end side extend. Is provided. The connection part C1 of the first wiring layer 54 and the connection part C2 of the second wiring layer 56 are arranged in parallel with a distance D.

  As described above, the first wiring layer 54 and the second wiring layer 56 are formed separately, and the connection portions C1 and C2 are arranged to face each other.

  Then, as shown in the cross-sectional view of FIG. 7, the sheet with movable contact 1 of FIG. 4 is turned upside down, and the electrode 30 of the sheet with movable contact 1 is connected to each of the connection portions C1, The sheet 1 with a movable contact is disposed on the wiring substrate 50 so as to correspond to C2.

  Thereby, the pressure-sensitive adhesive layer 40 of the movable contact-attached sheet 1 is in a state of being bonded onto the wiring substrate 50. As described above, the electronic device 3 including the switch component of the embodiment is obtained from the wiring substrate 50 and the movable contact-attached sheet 1 adhered thereon.

  In the electronic device 3, since the foam layer 20 is not foamed at this stage, the electrode 30 and the connection portions C1 and C2 of the first and second wiring layers 54 and 56 of the wiring substrate 50 are separated from each other. ing.

  The plan view of FIG. 7 is a perspective view of the electronic device 3 of FIG. As shown in the plan view of FIG. 7, the connection portion C <b> 1 of the first wiring layer 54 of the wiring substrate 50 is disposed in an overlapping region on one end side of the electrode 30 of the sheet 1 with the movable contact. Further, the connection portion C2 of the second wiring layer 56 of the wiring substrate 50 is disposed in an overlapping region on the other end side of the electrode 30 of the sheet 1 with the movable contact.

  Next, as shown in FIG. 8, when the electronic device 3 of FIG. 7 is heat-treated at a temperature of 80 ° C. to 150 ° C., the foam layer 20 expands and expands. In the electronic device 3 shown in FIG. 8, the foam layer 20 expands downward, and the electrode 30 disposed under the foam layer 20 is connected to the connection portions C <b> 1 and C <b> 2 of the first and second wiring layers 54 and 56 and the insulation. Contact the substrate 52.

  At this time, the adhesive layer 40 of the sheet 1 with the movable contact is adhered to the wiring substrate 50 with an adhesive strength that can withstand the force that the foam layer 20 and the electrode 30 press the wiring substrate 50 downward. For this reason, the sheet | seat 1 with a movable contact is hold | maintained in the state adhere | attached on the wiring base material 50 by the adhesion layer 40. FIG.

  In this way, the connection portion C1 of the first wiring layer 54 of the wiring substrate 50 is electrically connected to the connection portion C2 of the second wiring layer 56 via the electrode 30 of the sheet 1 with the movable contact. As a result, the first wiring layer 54 and the second wiring layer 56 of the wiring substrate 50 are electrically connected.

  The foaming phenomenon of the foam layer 20 is irreversible, and the expanded foam layer 20 does not immediately return to its original state even when the temperature is lowered. For this reason, as shown in FIG. 9, the sheet | seat 1 with a movable contact which functioned as a switch peels from the wiring base material 50, and is removed.

  At this time, the sheet 1 with a movable contact is removed from the wiring substrate 50 by peeling the adhesive layer 40 from the interface between the adhesive layer 40 of the sheet with movable contact 1 and the wiring substrate 50. As described above, the pressure-sensitive adhesive layer 40 can be more easily peeled by using the pressure-sensitive adhesive layer 40 having such a characteristic that the adhesive force is reduced by cooling treatment, irradiation of electromagnetic waves such as ultraviolet rays, or heat treatment.

  Thereafter, a new sheet with movable contacts is similarly attached to the wiring substrate 50.

  As described above, in the present embodiment, the wiring substrate is arranged so that the electrode 30 of the sheet 1 with the movable contact corresponds to the connection portions C1 and C2 of the first and second wiring layers 54 and 56 of the wiring substrate 50. The adhesive layer 40 of the movable contact-attached sheet 1 is adhered on the material 50.

  When heated, the foam layer 20 expands and the electrode 30 comes into contact with the connection portions C1 and C2 of the first and second wiring layers 54 and 56 of the wiring substrate 50, thereby causing the first and second electrodes to contact each other. The wiring layers 54 and 56 are made conductive.

  When removing the sheet 1 with the movable contact functioning as a switch, it can be easily removed by peeling the adhesive layer 40 from the wiring substrate 50.

  Thus, the sheet 1 with a movable contact of the present embodiment is extremely easy to attach to and remove from the wiring substrate 50, and the replacement work of the sheet 1 with a movable contact becomes easy.

  Moreover, since the base material 10 of the sheet | seat 1 with a movable contact can use a flexible base material, it is also possible to attach to the curved surface of a flexible wiring base material.

  In addition, if the sheet | seat 1 with a movable contact provided with the adhesion layer 40 connected in frame shape is attached to the wiring base material 50, the inner side area | region of the adhesion layer 40 connected in frame shape will become sealed space. For this reason, when heat-treating the foam layer 20, depending on conditions, the case where the air of sealed space expand | swells and the adhesion layer 40 peels from the wiring base material 50 is assumed.

  In such a case, as shown in FIG. 5 described above, it is preferable to use a sheet 1a with a movable contact provided with adhesive layers 40 that are separated from each other and arranged in a frame shape. Since the adhesive layer 40 is separated, the expanded air can be released to the outside from between the adhesive layers 40, so that the adhesive layer 40 is not likely to be peeled off from the wiring substrate 50.

  Further, in the example of the wiring substrate 50 of FIG. 7, the first and second wiring layers 54 and 56 are formed on a flat substrate, but the first and second wiring layers 54 and 56 are formed on the wiring substrate 50. It may be arranged on the bottom of the concave portion of the wiring substrate 50 or may be arranged on the convex portion of the wiring substrate 50.

  For example, when the first and second wiring layers 54 and 56 are arranged at the bottom of the concave portion of the wiring substrate 50, the height of the adhesive layer 40 of the sheet with movable contact and the height of the electrode 30 are the same position. It may be set.

  As described above, the height of the adhesive layer 40 and the height of the electrode 30 are appropriately adjusted according to the arrangement structure of the first and second wiring layers 54 and 56 of the wiring substrate 50.

Example 1
The inventor of the present application actually manufactured the above-described sheet with a movable contact, and conducted an experiment to confirm the adhesiveness and peelability of the adhesive layer and the conduction of the wiring layer.

  First, experimental samples will be described. A heated foaming agent paint was prepared by mixing heated foaming agent particles: 20 parts by weight with PET 9100: 100 parts by weight of Jujo Ink Co., Ltd., which contains a polyester resin, and stirring with a rotating and rotating stirrer. As the heated foaming agent particles, “F-36” manufactured by Matsumoto Yushi Co., Ltd., having a foaming start temperature of 80 ° C. was used.

  Furthermore, as shown to Fig.10 (a), the PET film 11 whose sheet size is 100 mm x 100 mm was prepared as a base material. As the PET film 11, “Lumirror 125-T60” manufactured by Toray Industries, Inc. was used.

  And the above-mentioned heating foaming agent coating material was apply | coated to the center part on the PET film 11 by screen printing, and it was made to dry for 30 minutes at 60 degreeC, and the foaming layer 21 of the size of 6 mm x 6 mm was formed. The thickness of the foamed layer 21 after drying was 30 μm.

  Next, as shown in FIG. 10 (a), conductive ink is formed only on the portion where the foam layer 21 is formed by screen printing using a 300 mesh plate and dried at 80 ° C. for 10 minutes. An electrode 31 was formed. The thickness of the electrode 31 after drying was 8 μm. As the conductive ink, “ECM-100” which is a silver ink manufactured by Taiyo Ink Co., Ltd. was used.

  Subsequently, as shown in the plan view of FIG. 10A, a frame-shaped double-sided tape having a size of 30 mm × 30 mm having a center hole 41 x of 10 mm × 10 mm was prepared as the adhesive layer 41. The adhesive layer 41 includes an adhesive layer 41a on both sides of the tape 41b. This adhesive layer 41 was pasted around the foam layer 21 and the electrode 31 on the PET film 11. As the double-sided tape used as the adhesive layer 41, “192” manufactured by Kikusui Tape Co., Ltd. was used.

  By producing the movable contact-attached sheet 2 by the above method, an experimental sample of Example 1 was obtained. At this time, when a peel strength test was performed using only a spring to be peeled off at an angle of 90 ° in an environment of 25 ° C., the peel weight for peeling the adhesive layer 41 from the PET film 11 was 250 g.

  Further, as shown in FIG. 10B, a wiring substrate 51 in which connecting portions C1 and C2 of two conductive wiring layers 54 and 56 are arranged in parallel on a glass substrate 52a. Prepared. The basic structure of the wiring substrate 51 is the same as the plan view of the wiring substrate 50 of FIG. 8 described above. The width of each of the two wiring layers 54 and 56 is 1 mm, each length is 30 mm, each thickness is 0.2 μm, and the interval between the two connection portions C1 and C2 is 1 mm.

  Similarly to FIG. 8 described above, the movable contact-attached sheet 2 is provided so that the electrode 31 of the movable contact-provided sheet 2 corresponds to the connection portions C1, C2 of the two wiring layers 54, 56 of the wiring substrate 51. The exposed surface of the adhesive layer 41 of the sheet 2 was adhered on the wiring substrate 51 to prepare the switch substrate 5.

  In the state of FIG. 10B, when the resistance value between the two wiring layers 54 and 56 was measured by a tester, it was confirmed that it was overload and not conductive. This is because at this stage, the electrode 31 of the movable contact-attached sheet 2 is separated from the connection portions C1 and C2 of the wiring layers 54 and 56.

  The switch substrate 5 was heated in an oven at 100 ° C. for 10 minutes to expand the foamed layer 21, and the resistance value between the two wiring layers 54 and 56 was measured. The resistance value was 50Ω. Yes, it was confirmed that it was conducting.

  That is, it means that the foamed layer 21 is expanded by the heat treatment, and the electrode 31 on the expanded layer 21 is in contact with the connection portions C1 and C2 of the two wiring layers 54 and 56.

  Further, when a peel strength test was performed on the switch base material 5 with only a spring in an environment of 25 ° C., the peeling weight for peeling the adhesive layer 41 of the movable contact-attached sheet 2 from the wiring base material 51 was 250 g. It was.

  That is, it was confirmed that the sheet 2 with the movable contact can be peeled off from the wiring substrate 51 and can be replaced with a new sheet 2 with the movable contact.

(Example 2)
In Example 2, a pressure-sensitive adhesive layer having a characteristic that the adhesive force is lowered by cooling is used. Other elements are the same as those in the first embodiment.

  As shown in the sectional view of FIG. 11A, the foam layer 21 and the electrode 31 were formed on the PET film 11 by the same method as in Example 1. Furthermore, as shown in the plan view of FIG. 11A, an adhesive tape 42 provided with a cooling peelable adhesive layer 42a having such a characteristic that the adhesive strength is reduced by cooling to the upper surface side was prepared.

  This adhesive tape 42 has a thickness of 115 μm, a central hole 42x of 10 mm × 10 mm, and a size of 30 mm × 30 mm. As such an adhesive tape 42, “Intellimer Tape CS2110C20” manufactured by Nitta Corporation was used.

  Subsequently, as shown in the cross-sectional view of FIG. 11A, a frame-like double-sided tape 43 having a thickness of 25 μm and a pressure-sensitive adhesive layer 43a formed on both sides is affixed to the non-adhesive surface of the lower surface of the adhesive tape 42. Thus, the pressure-sensitive adhesive layer 44 was obtained.

  Further, an adhesive layer 43 a on the lower surface of the adhesive layer 44 was pasted around the foam layer 21 and the electrode 31 on the PET film 11. The experimental sample of Example 2 was obtained by manufacturing the movable contact-attached sheet 2a by the above method.

  Then, as shown in FIG. 11 (b), in the same manner as in Example 1, the cooling release adhesive layer 42a of the adhesive layer 44 of the movable contact-attached sheet 2a is adhered onto the wiring substrate 51 to switch the switch. The base material 5a was created.

  When a peel strength test with only a spring was performed in an environment of 25 ° C., the peel weight for peeling off the adhesive layer 44 of the sheet 2 with movable contact from the wiring substrate 51 was 150 g.

  In the state of FIG. 11B, when the resistance value between the two wiring layers 54 and 56 was measured by a tester, it was confirmed that it was overloaded and not conductive as in Example 1. .

  The switch substrate 5a was heated in an oven at 100 ° C. for 10 minutes to expand the foam layer 21, and then the resistance value between the two wiring layers 54 and 56 was measured. In addition, it was confirmed that the resistance value was 50Ω and the film was conductive.

  Further, when the switch substrate 5a was similarly subjected to a peel strength test using only a spring under a cooling treatment in a temperature atmosphere of 0 ° C., the adhesive layer 44 of the movable contact-attached sheet 2a was attached to the wiring substrate 51. The peel weight to be peeled off was 30 g.

  As described above, the pressure-sensitive adhesive layer 44 used in Example 2 uses the pressure-sensitive adhesive layer 44 including the cooling peelable pressure-sensitive adhesive layer 42a having a characteristic that the peel weight is reduced from 150 g to 30 g by the cooling treatment. For this reason, in 2nd Example, the sheet | seat 2a with a movable contact can be easily peeled from the wiring base material 51 rather than the case where the normal adhesion layer 41 of Example 1 is used, The sheet | seat 2a with a movable contact The replacement work becomes easier.

(Example 3)
In Example 3, a pressure-sensitive adhesive layer having a characteristic that the adhesive strength is reduced by irradiating ultraviolet rays is used. Other elements are the same as those in the first embodiment.

  As shown in the sectional view of FIG. 12A, the foam layer 21 and the electrode 31 were formed on the PET film 11 by the same method as in Example 1. Furthermore, as shown in the plan view of FIG. 12A, an adhesive tape 45 provided with an ultraviolet peelable pressure-sensitive adhesive layer 45a having a characteristic that the adhesive strength is reduced by irradiating the upper surface with ultraviolet rays was prepared.

  The adhesive tape 45 has a thickness of 115 μm, a central hole 45x of 10 mm × 10 mm, and a size of 30 mm × 30 mm. As such an adhesive tape 45, “N4605” manufactured by Sumitomo Bakelite Co., Ltd. was used.

  Subsequently, as shown in the cross-sectional view of FIG. 12A, a frame-like double-sided tape 43 having a thickness of 25 μm and a pressure-sensitive adhesive layer 43a formed on both sides is pasted on the non-adhesive surface of the lower surface of the adhesive tape 45. Thus, the pressure-sensitive adhesive layer 46 was obtained.

  Further, the adhesive layer 43 a on the lower surface of the adhesive layer 46 was pasted around the foam layer 21 and the electrode 31 on the PET film 11. The experimental sample of Example 3 was obtained by manufacturing the movable contact-attached sheet 2b by the above method.

  Then, as shown in FIG. 12B, as in Example 1, the UV peelable adhesive layer 45a of the adhesive layer 46 of the movable contact-attached sheet 2b is adhered on the wiring substrate 51 to switch The base material 5b was created.

  When a peel strength test with only a spring was performed in an environment of 25 ° C., the peel weight for peeling off the adhesive layer 46 of the movable contact-attached sheet 2 from the wiring substrate 51 was 210 g.

  In the state of FIG. 12B, when the resistance between the two wiring layers 54 and 56 was measured by a tester, it was confirmed that it was overloaded and not conductive as in Example 1.

  When the switch substrate 5b was heated in an oven at 100 ° C. for 10 minutes to expand the foam layer 21, the resistance between the two wiring layers 54 and 56 was measured. The resistance value was 50Ω, and it was confirmed that conduction was achieved.

Further, after irradiating the switch substrate 5b with ultraviolet light having a peak wavelength of 405 nm at 500 mJ / cm ² , similarly, a peel strength test using only a spring was performed. As a result, the adhesive layer 46 of the movable contact-attached sheet 2b was formed as a PET film. The peel weight peeled from 11 was 30 g.

  Thus, in Example 3, the pressure-sensitive adhesive layer 46 provided with the ultraviolet-ray peelable pressure-sensitive adhesive layer 45a having the characteristic that the peel weight decreases from 210 g to 30 g by ultraviolet irradiation is used.

  For this reason, in Example 3, the sheet | seat 2b with a movable contact can be easily peeled from the wiring base material 51 rather than the case where the normal adhesion layer 41 of Example 1 is used, Replacement work becomes easier.

  As a comparative example, an insulating layer that does not contain heated foaming agent particles was formed instead of the foamed layer 21 in the above-described Examples 1 to 3, and a switch base material was created. Was not conducted.

  Based on the above experimental results, Table 1 collectively shows the peeling weight before and after the peeling treatment when using three types of adhesive layers.

剥離処理を行わない通常の粘着層４１を使用する場合（実施例１）は、剥離重さは２５０ｇである。また、剥離処理として冷却処理を行って接着力を低下させる粘着層４４を使用する場合（実施例２）は、剥離処理前の剥離重さが１５０ｇであり、剥離処理後の剥離重さが３０ｇに低下する。

When using the normal adhesion layer 41 which does not perform a peeling process (Example 1), peeling weight is 250g. Moreover, when using the adhesion layer 44 which performs a cooling process and reduces adhesive force as a peeling process (Example 2), the peeling weight before a peeling process is 150 g, and the peeling weight after a peeling process is 30 g. To drop.

  Moreover, when using the adhesion layer 45 which reduces ultraviolet-ray irradiation as a peeling process (Example 3), the peeling weight before peeling process is 210g, and the peeling weight after peeling process is 30g. To drop.

  Thus, by using the cooling peeling type or ultraviolet irradiation peeling type pressure-sensitive adhesive layers 44 and 45, the peeling weight is 150 g or more and sufficient adhesive strength is obtained before peeling treatment, and peeling is performed when peeling. The weight can be reduced to 30 g to weaken the adhesive strength.

  As a result, the sheet with movable contact can be stably mounted on the wiring substrate, and can be easily removed as compared with the case of using a normal adhesive layer, and the replacement work of the sheet with movable contact can be facilitated. .

  Further, based on the above experimental results, Table 2 summarizes the resistance values between the two wiring layers 54 and 56 before and after heating in the switch base materials 5, 5 a and 5 b of Examples 1 to 3 described above. Is shown.

表２に示すように、実施例１〜３のスイッチ基材５，５ａ、５ｂでは、加熱前の状態では、可動接点付シート２，２ａ、２ｂの各発泡層２１が未発泡のため、その上の電極３１が２本の配線層５４，５６と離れている。このため、２本の配線層５４，５６間の抵抗は、オーバーロードとなって、導通されていない。

As shown in Table 2, in the switch base materials 5, 5a and 5b of Examples 1 to 3, in the state before heating, the foam layers 21 of the movable contact-attached sheets 2, 2a and 2b are not foamed. The upper electrode 31 is separated from the two wiring layers 54 and 56. For this reason, the resistance between the two wiring layers 54 and 56 is overloaded and is not conducted.

  On the other hand, after the heat treatment, the foamed layers 21 of the movable contact-attached sheets 2, 2a, 2b of Examples 1 to 3 are foamed and expanded, and the electrode 31 on the foamed layers 21 is provided in each of the two wiring layers 54, 56. It contacts the connection parts C1 and C2. For this reason, the resistance value between the two wiring layers 54 and 56 becomes 50Ω, and it becomes conductive.

  On the other hand, in the comparative example not provided with the foam layer, the resistance value between the two wiring layers is overloaded because the electrode of the sheet with the movable contact does not contact the two wiring layers even when the heat treatment is performed. And is not conductive.

1, 1a, 2, 2a, 2b ... sheet with movable contact, 3 ... electronic device, 5, 5a, 5b ... switch base material, 10, 11 ... base material, 20a ... heated foaming agent paint, 20, 21 ... foam layer (Expanded layer), 22 ... resin, 24 ... heated foaming agent particles, 24a ... core, 24b ... shell, 30, 31 ... electrode, 40, 41, 45, 46 ... adhesive layer, 40a, 41b ... tape, 40b, 41a , 43a ... adhesive layer, 43 ... double-sided tape, 41x, 42x, 45x ... center hole, 42, 45 ... adhesive tape, 42a ... cooling release adhesive layer, 45a ... UV release adhesive layer, 50, 51 ... Wiring substrate, 52 ... insulating substrate, 52a ... glass substrate, 54 ... first wiring layer, 56 ... second wiring layer, C1, C2 ... connection part.

Claims (12)

A substrate;
An inflatable layer formed on the substrate;
An electrode formed on the expansion layer;
A sheet with a movable contact, comprising: the expansion layer and an adhesive layer formed on the substrate outside the electrode.   The sheet with movable contact according to claim 1, wherein the adhesive layer is arranged in a frame shape around the expansion layer and the electrode.   3. The sheet with a movable contact according to claim 1, wherein a height of the adhesive layer is higher than a total height of the expansion layer and the electrode when the expansion layer is not expanded.   3. The movable contact according to claim 1, wherein a height of the adhesive layer is equal to or lower than a total height of the expansion layer and the electrode after the expansion layer expands. Attached sheet.   The sheet with movable contact according to any one of claims 1 to 4, wherein the adhesive layer is formed from a tape having an adhesive layer on both sides.   The said adhesion layer has the characteristic that the surface on the opposite side to the said base material side has the characteristic that adhesive force declines by cooling, electromagnetic wave irradiation, or a heating. Sheet with movable contact. A substrate;
An inflatable layer formed on the substrate;
An electrode formed on the expansion layer;
A sheet with a movable contact including the expansion layer and an adhesive layer formed on the substrate outside the electrode;
A wiring substrate including a plurality of wiring layers separated by providing opposing connection portions;
The adhesive layer of the sheet with movable contact is disposed on the wiring substrate so that the electrode of the sheet with movable contact is disposed at a position corresponding to the connection portion of the wiring layer of the wiring substrate. An electronic device characterized by being bonded.   When the electronic device is heated, the expansion layer of the sheet with the movable contact expands, and the electrodes come into contact with the connection portions facing the wiring layer of the wiring substrate, whereby the plurality of wirings The electronic device according to claim 7, wherein the layers are conductive. Forming an expanded layer on the substrate;
Forming an electrode on the expansion layer;
Forming a pressure-sensitive adhesive layer on the base material outside the expansion layer and the electrode, and a method for producing a sheet with a movable contact.   The method for producing a sheet with a movable contact according to claim 9, wherein in the step of forming the adhesive layer, the adhesive layer is arranged in a frame shape around the expansion layer and the electrode.   The sheet with a movable contact according to claim 9 or 10, wherein the pressure-sensitive adhesive layer has a property that the surface opposite to the substrate side has a characteristic that an adhesive force is reduced by cooling, electromagnetic wave irradiation, or heating. Production method.   The height of the said adhesion layer is set higher than the total height of the said expansion | swelling layer and the said electrode, The manufacturing method of the sheet | seat with a movable contact as described in any one of 9 thru | or 11 characterized by the above-mentioned.

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