JP2013119050A - Waste liquid treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a waste liquid treatment apparatus capable of efficiently separating a waste liquid containing silicon refuse into silicon refuse and purified water (water) in a state easy to reutilize.SOLUTION: The waste liquid treatment apparatus 1 includes a separation treatment means 20 and a recovery means 50. The separation treatment means 20 is equipped with a waste liquid storage liquid tank 21, a plurality of silicon adsorbing plates 23 arranged at equal intervals, a silicon passing control part 24 including a plurality of silicon passing control plates arranged in opposed relation to the silicon adsorbing plates 23 and an electric field forming part. The silicon passing control plates permit only the liquid of the waste liquid to pass and control the passage of silicon refuse. The silicon passing control part 24 is equipped with a discharge part 31 for discharging the purified water in a housing 30 demarcating a region where the purified water passed through the silicon passing control plates is present. In the electric field forming part, a silicon adsorbing plate 23 is used as an anode and the silicon passing control plate is used as a cathode. A recovery means 50 separates the silicon refuse from the silicon adsorbing plate 23.

Description

  The present invention relates to a waste liquid treatment apparatus that separates waste liquid containing silicon waste into silicon waste and purified water (water).

  In the manufacture of silicon devices, the process of cutting a silicon ingot to form a silicon wafer, the process of polishing the silicon wafer, and circuits such as ICs and LSIs in a large number of areas arranged in a lattice pattern on the surface of the silicon wafer And forming each silicon chip by cutting each region along a predetermined street (cutting line). In these processes, for example, purified water (water) is used to cool a cutting blade, a processing point, a polished portion, or the like, or to flush silicon scraps.

  In recent years, a technique for separating waste liquid containing silicon waste into purified water (water) not containing silicon waste and silicon from the viewpoint of reuse of purified water (water) and reuse of silicon is required. Silicon scraps are fine particles and are contained in a suspended state in the waste liquid. As this type of conventional technology, a physical method for performing filtration or centrifugation, or a chemical method using a chemical (for example, see Patent Document 1) is known.

JP-A-8-164304

  However, the physical method as described above has a problem that clogging occurs during filtration or silicon particles pass through in the first place. In particular, in the centrifugal separation method, the concentration of silicon particles is too thin with respect to purified water (water), and the efficiency of the centrifugal separator may be poor. Moreover, in the above chemical methods, since chemicals are used, it is difficult to reuse purified water (water).

  This invention is made in view of the above, and provides the waste liquid processing apparatus which can isolate | separate the waste liquid containing a silicon waste into a silicon waste and purified water (water) in the state which is easy to reuse efficiently. For the purpose.

  In order to achieve the above object, according to the present invention, a waste liquid treatment apparatus for separating waste liquid containing silicon waste into purified water not containing silicon waste and silicon waste, a waste liquid storage tank for storing waste liquid, A waste liquid feed pump that feeds the waste liquid stored in the waste liquid storage tank, a separation processing means that separates the waste liquid supplied by the waste liquid feed pump into silicon waste and purified water that does not contain silicon waste, and the separation treatment Recovery means for recovering silicon waste separated by the means, purified water storage tank for storing purified water that does not contain silicon waste separated by the separation processing means, and silicon waste for storing silicon waste recovered by the recovery means The separation processing means includes a liquid tank for storing the waste liquid supplied by the waste liquid feed pump, and a plurality of tanks arranged at equal intervals in the liquid tank. A positively charged silicon adsorbing plate for adsorbing the silicon debris charged on the surface, and a plurality of the silicon adsorbing plate opposite to the silicon adsorbing plate and spaced apart from the silicon adsorbing plate and passing only the waste liquid only A silicon passage restricting portion including a net-like silicon passage restricting plate that restricts the passage of the negatively charged silicon scrap, and the silicon adsorbing plate as an anode, the silicon passage restricting plate as a cathode, and the silicon adsorbing plate And an electric field forming portion for forming an electric field between the silicon passage restricting plate and the silicon passage restricting plate, and the silicon passage restricting portions are arranged so as to be parallel to each other so as to block the opening on both sides of the frame and the frame. A casing configured with a pair of the silicon passage restriction plates and defining a region where the purified water that has passed through the silicon passage restriction plate is present, and the purified water disposed in the casing is discharged to the purified water storage tank And a recovery unit for separating the silicon scrap from the silicon adsorption plate, and an adsorption plate movement for moving the silicon adsorption plate from the liquid tank of the separation processing unit to the separation unit A waste liquid treatment apparatus comprising: a portion.

  Further, in the waste liquid treatment apparatus, the purified water storage tank divides the inside of the tank into two spaces across the inner walls facing each other and erases bubbles in the purified water disposed gradually inclined in the height direction. An inclined defoaming plate, a supply port for supplying purified water discharged from the discharge portion disposed above the inclined defoaming plate, and the tank disposed below the inclined defoaming plate It is preferable to provide a feed port for supplying the purified water from which bubbles have been removed to the outside.

  Further, in the waste liquid treatment apparatus, the discharge unit of the separation processing means feeds the purified water disposed in each casing and passed through the silicon passage regulating plate from each casing to the purified water storage tank. A feed pipe and an open / close valve connected to the feed pipe, and when the silicon adsorbing plate is pulled up from the liquid layer of the separation processing means by the adsorbing plate moving section of the recovery means Further, it is preferable that the opening / closing valves of the two silicon passage restriction portions adjacent to the silicon adsorbing plate are closed, and the supply of water from the two adjacent silicon passage restriction portions to the purified water storage tank is stopped.

  Further, in the waste liquid treatment apparatus, a silicon waste tank for storing silicon waste separated by the separation unit is connected below the separation unit of the recovery means, and the separation unit is connected to the silicon waste tank. It is preferable to provide a hydrogen gas discharging means for discharging hydrogen gas generated from the stored silicon scrap to the outside.

  Further, in the waste liquid treatment apparatus, a weighing scale for measuring the weight of the silicon waste tank disposed below the silicon waste tank, and an informing means for informing when the weight of the silicon waste tank reaches a predetermined weight It is preferable to comprise.

  According to the waste liquid treatment apparatus of the present invention, since the separation processing means adsorbs the negatively charged silicon scrap in the waste liquid to the positively charged silicon adsorption plate, it is possible to separate very small silicon waste from the waste liquid. . For this reason, silicon waste can be separated from the waste liquid without using filtration or a centrifuge, that is, the filter is not clogged, and it is not necessary to use a very large centrifuge. Moreover, it is not necessary to use chemicals in order to separate the silicon waste from the waste liquid. Therefore, the waste liquid containing silicon waste can be separated into silicon waste and purified water in a state where it can be efficiently reused.

FIG. 1 is a diagram illustrating a schematic configuration example of a waste liquid treatment apparatus according to an embodiment. FIG. 2 is a diagram illustrating a schematic configuration example of the separation processing unit of the waste liquid processing apparatus according to the embodiment. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 4 is a diagram illustrating a schematic configuration example of the electric field forming unit of the separation processing unit of the waste liquid processing apparatus according to the embodiment. FIG. 5 is a diagram illustrating a flow of silicon waste removal operation of the waste liquid treatment apparatus according to the embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

  FIG. 1 is a diagram illustrating a schematic configuration example of a waste liquid treatment apparatus according to an embodiment. FIG. 2 is a diagram illustrating a schematic configuration example of the separation processing unit of the waste liquid processing apparatus according to the embodiment. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 4 is a diagram illustrating a schematic configuration example of the electric field forming unit of the separation processing unit of the waste liquid processing apparatus according to the embodiment.

  The waste liquid treatment apparatus 1 according to the present embodiment includes, for example, a waste liquid 2 (shown in FIG. 3) containing silicon waste 3, silicon waste 3 (shown in FIG. 3), and silicon waste 3 (shown in FIG. 3). It is an apparatus which separates into purified water 4 (not shown) shown in FIG.

  As shown in FIG. 1, the waste liquid treatment apparatus 1 includes a waste liquid storage tank 10, a waste liquid feed pump 11 (shown in FIG. 2), a separation processing means 20, a recovery means 50, a purified water storage tank 80, silicon The waste tank 90, the notification means 100, and the control means 101 are provided.

  The waste liquid storage tank 10 is a container that stores the waste liquid 2. The waste liquid storage tank 10 is disposed on the bottom of the apparatus body 5 and on the side of a liquid tank 21 described later of the separation processing means 20. Waste liquid 2 containing silicon waste 3 is supplied into the waste liquid storage tank 10 from a processing apparatus that performs various types of machining on the wafer. The waste liquid storage tank 10 temporarily stores and stores the waste liquid 2. A waste liquid supply pipe 12 (shown in FIG. 2) is connected to the waste liquid storage tank 10.

  As shown in FIG. 2, the waste liquid feed pump 11 is provided in the waste liquid feed pipe 12. The waste liquid feed pump 11 feeds the waste liquid 2 stored in the waste liquid storage tank 10 into the liquid tank 21 through a stirring pipe 22 described later.

  The separation processing means 20 separates the waste liquid 2 supplied by the waste liquid feed pump 11 into silicon waste 3 and purified water 4 that does not contain the silicon waste 3. As shown in FIGS. 1 and 2, the separation processing means 20 includes a liquid tank 21, a plurality of stirring pipes 22 (shown in FIGS. 2 and 3), a plurality of silicon adsorption plates 23, and a plurality of silicon passage restrictions. Part 24 and electric field forming part 25. The liquid tank 21 is a rectangular parallelepiped container having an open top and stores the waste liquid 2 supplied by the waste liquid feed pump 11. The liquid tank 21 is provided on the bottom of the apparatus body 5 so that the waste liquid storage tank 10 is located on the side. The waste liquid feed pipe 12 penetrates the liquid tank 21. Further, a drain pipe (not shown) for preventing the waste liquid 2 from overflowing is provided on the upper part of the liquid tank 21. The drain pipe is connected to the waste liquid storage tank 10 and guides the waste liquid 2 that is about to overflow from the liquid tank 21 to the waste liquid storage tank 10 again.

  The plurality of stirring pipes 22 are provided in the lower part of the liquid tank 21 in a state where the longitudinal directions are parallel to each other. The longitudinal direction of the plurality of stirring pipes 22 is parallel to the longitudinal direction of the liquid tank 21. The plurality of stirring pipes 22 are provided at a distance from the bottom of the liquid tank 21. The plurality of agitation pipes 22 are connected with one end portions bundled together and connected to the waste liquid supply pipe 12. The waste liquid 2 is supplied to the plurality of agitation pipes 22 by the waste liquid feed pump 11 through the waste liquid feed pipe 12. As shown in FIG. 3, a plurality of through holes 26 are provided in the lower portion of the stirring pipe 22 facing the bottom of the liquid tank 21 with a space therebetween. The plurality of through holes 26 penetrate the stirring pipe 22 and are provided at intervals in the longitudinal direction of the stirring pipe 22. The through hole 26 discharges the waste liquid 2 toward the bottom of the liquid tank 21. The agitation pipe 22 agitates the waste liquid 2 in the liquid tank 21 by discharging the waste liquid 2 toward the bottom of the liquid tank 21 through the plurality of through holes 26.

  The silicon adsorption plate 23 is made of an electrochemically noble material, and is formed in a flat plate shape having a rectangular planar shape. Examples of the material constituting the silicon adsorption plate 23 include copper (Cu), silver (Ag), platinum (Pt), and gold (Au). In this embodiment, stainless steel (SUS316, SUS304, etc.) is applied. doing.

  A plurality of silicon adsorption plates 23 are arranged in the liquid tank 21 at equal intervals. The plurality of silicon adsorbing plates 23 are arranged at intervals from each other in a state where the surfaces thereof are orthogonal to the longitudinal direction of the liquid tank 21, that is, in a state parallel to the width direction of the liquid tank 21. The silicon adsorbing plate 23 is provided with a supported piece 27 projecting from both ends in the width direction and two engaged pieces 27 projecting upward from the center portion in the width direction at an interval from each other. The supported piece 27 is overlaid on a power feeding bar 36 provided inside the liquid tank 21 of the electric field forming unit 25. The supported piece 27 is stacked on the power supply bar 36 to hold the silicon adsorption plate 23 in the liquid tank 21. The engaged piece 27 is formed in a rectangular plate shape, and an engaged hole 29 penetrating along the surface of the silicon adsorption plate 23 is provided in the center. A protruding and retracting pin 70 of a suction plate moving unit 52 (to be described later) of the collecting means 50 enters and engages with the engaged hole 29. The silicon adsorption plate 23 is positively charged in the waste liquid 2 by the electric field forming unit 25 when the supported piece 27 is superimposed on the power supply bar 36. The silicon adsorption plate 23 is used to adsorb the silicon waste 3 that is positively charged in the waste liquid 2 and negatively charged in the waste liquid 2.

  A plurality of silicon passage restricting portions 24 are provided between the silicon adsorbing plates 23 adjacent to each other, facing the silicon adsorbing plates 23 and spaced apart from the silicon adsorbing plates 23. The silicon passage restricting portions 24 are arranged at equal intervals in the liquid tank 21 and are arranged in parallel with the silicon adsorption plate 23.

  The silicon passage restriction unit 24 includes a housing 30 and a discharge unit 31. The housing 30 includes a rectangular frame body 32 and a pair of silicon passage restriction plates 33 disposed so as to be parallel and spaced apart from each other so as to block the opening surfaces on both sides of the frame body 32 (included). ). That is, the housing 30 includes a frame body 32 and a pair of silicon passage restriction plates 33. Similar to the silicon adsorption plate 23, the silicon passage restriction plate 33 is made of an electrochemically noble material and has a flat plate shape with a rectangular planar shape. Examples of the material constituting the silicon passage restriction plate 33 include copper (Cu), silver (Ag), platinum (Pt), and gold (Au). In this embodiment, stainless steel (SUS316, SUS304, or the like) is used. Applicable.

  The silicon passage restriction plate 33 is formed in a mesh shape and is negatively charged by the electric field forming unit 25. The mesh opening of the silicon passage restriction plate 33 is formed sufficiently larger than the silicon scrap 3. The silicon passage restriction plate 33 does not have a function of hooking the silicon dust 3 with a mesh, and may have a mesh roughness enough to generate repulsive force on the silicon dust 3 by being charged negatively. In the present embodiment, the silicon passage restriction plate 33 is composed of a mesh of 500 pieces / inch. The silicon passage restricting plate 33 is negatively charged by the electric field forming unit 25, thereby allowing only purified water (water) 4 as a liquid of the waste liquid 2 to pass therethrough, and repulsive force between the silicon waste 3 negatively charged. And the passage of the silicon scrap 3 is restricted. The housing 30 is composed of a frame body 32 and a pair of silicon passage restriction plates 33, thereby forming an area where the purified water 4 that has passed through the silicon passage restriction plate 33 is present, and the silicon passage restriction plate 33 is formed of silicon. By generating a repulsive force between the waste 3 and the waste water 2 in the liquid tank 21, a region where the purified water 4 exists is partitioned.

  The discharge part 31 is arrange | positioned at each housing | casing 30, and discharges the purified water 4 arrange | positioned in the housing | casing 30 to the purified water storage tank 80. FIG. The discharge unit 31 includes a supply pipe 34 disposed in the housing 30 and an open / close valve 35 connected to the supply pipe 34. The supply pipe 34 is connected to both the housing 30 and the purified water storage tank 80. The feed pipe 34 is erected from the upper center of the frame body 32, is bent horizontally toward the upper side of the purified water storage tank 80, and then is bent downward toward the purified water storage tank 80. The tank 80 is connected to a supply port 83 described later. The supply pipe 34 supplies the purified water that has passed through the silicon passage restriction plate 33 from each housing 30 to the purified water storage tank 80. The open / close valve 35 is provided in the horizontal center portion of the feed pipe 34 and can open and close the flow path in the feed pipe 34.

  The electric field forming unit 25 forms an electric field between the silicon adsorption plate 23 and the silicon passage restriction plate 33 with the silicon adsorption plate 23 as an anode and the silicon passage restriction plate 33 as a cathode. As shown in FIGS. 2 and 4, the electric field forming unit 25 includes a power feed bar 36 (shown in FIG. 2), a power feed pin 37 (shown in FIG. 1), and a DC power source 38.

  The power supply bar 36 is made of a conductive material and is formed in a strip shape. A pair of power supply bars 36 are provided with the longitudinal direction parallel to the longitudinal direction of the liquid tank 21 (only one is shown in FIG. 2), and is provided on the inner surface of the liquid tank 21 over the entire length of the liquid tank 21. . A supported piece 27 of the silicon suction plate 23 is overlaid on the power supply bar 36. The power feeding bar 36 is electrically connected to the silicon adsorption plate 23 by overlapping the supported pieces 27, that is, by accommodating the silicon adsorption plate 23 in the liquid tank 21.

  The power feed pin 37 is made of a conductive material and is formed in a rod shape. The power feed pin 37 is provided on a lifting plate 59 (to be described later) of the suction plate moving unit 52 of the collecting means 50 in a state where the longitudinal direction is parallel to the vertical direction. The power feed pin 37 contacts the silicon suction plate 23 and is electrically connected to the silicon suction plate 23 when the projecting and retracting pin 70 is engaged with the engaged hole 29.

  The DC power source 38 has a negative side electrically connected to the silicon passage restriction plate 33 of the silicon passage restriction portion 24, and charges the silicon passage restriction plate 33 of the silicon passage restriction portion 24 negatively. The DC power source 38 is electrically connected to the power supply bar 36 and the power supply pin 37 on the positive side, and charges the silicon adsorbing plate 23 positively through the power supply bar 36 and the power supply pin 37.

  The recovery means 50 recovers the silicon waste 3 separated by the separation processing means 20. As shown in FIG. 1, the recovery unit 50 includes a separation unit 51 that separates the silicon scrap 3 from the silicon adsorption plate 23, and an adsorption that moves the silicon adsorption plate 23 from the liquid tank 21 of the separation processing unit 20 to the separation unit 51. The board moving part 52 is provided.

  As shown in FIG. 1, the separation unit 51 and the silicon waste tank 90 are overlapped with each other and arranged outside one end of the liquid tank 21 of the separation processing means 20. The separation unit 51 includes a box-shaped separation container 54 provided with a slit 53 through which the silicon adsorption plate 23 can be passed on the upper surface and opened at the bottom, a pair of scrapers (not shown) provided in the separation container 54, and a scraper. And a rotation mechanism (not shown) that rotates. The slit 53 is provided with a shutter 55 for passing through the silicon adsorption plate 23 and preventing entry of foreign matter. The scraper is made of a synthetic resin (elastic material) having elasticity such as rubber, and positions the silicon adsorption plates 23 accommodated in the separation container 54 between each other. The scraper is formed in a strip shape, and the longitudinal direction is provided in parallel with the width direction of the liquid tank 21. The scraper is rotated by a rotation mechanism so that the lower end of the scraper comes in contact with or separates from (contacts or leaves) the surface of the silicon adsorption plate 23 accommodated in the separation container 54. The rotation mechanism rotates the central portion of the scraper around an axis parallel to the width direction of the liquid tank 21.

  The suction plate moving unit 52 is provided above the liquid tank 21 of the separation processing means 20. As shown in FIG. 1, the suction plate moving unit 52 includes a horizontal movement unit 56, a vertical plate 57, a lifting unit 58, a lifting plate 59, and a suction plate support unit 60.

  The horizontal moving means 56 is means for moving the silicon adsorption plate 23 along the longitudinal direction of the liquid tank 21 above the liquid tank 21. The horizontal movement means 56 includes a horizontal ball screw 61, a horizontal movement motor (not shown), and a pair of horizontal movement guide rails 62. The horizontal ball screw 61 is provided in parallel with the longitudinal direction of the liquid tank 21 and is supported on the upper part of the apparatus main body 5 so as to be rotatable about an axis. The horizontal ball screw 61 is formed longer than the liquid tank 21 of the separation processing means 20, and is provided over the other end of the liquid tank 21 on the side away from the separation part 51 and above the separation part 51. ing. A nut 63 attached to the vertical plate 57 is screwed into the horizontal ball screw 61. The horizontal movement motor is provided in the apparatus main body and the like, and rotates the horizontal ball screw 61 around the axis. A pair of horizontal movement guide rails 62 are arranged on the upper part of the apparatus body 5 in parallel with the horizontal ball screw 61, and a slide block 64 fixed to the vertical plate 57 is slidably attached thereto. The pair of horizontal movement guide rails 62 are formed longer than the liquid tank 21 of the separation processing unit 20 and are provided above the other end of the liquid tank 21 and above the separation part 51. The horizontal moving means 56 rotates the horizontal ball screw 61 by a horizontal moving motor, thereby causing the vertical suction plate 57, that is, the silicon suction plate 23 engaged by the suction plate support means 60 to move to a pair of guide rails 62 for horizontal movement. It is moved along the longitudinal direction of the liquid tank 21 while being guided.

  Both surfaces of the vertical plate 57 are provided in parallel with both the vertical direction and the width direction of the liquid tank 21. The vertical plate 57 is provided so that the nut 63 and the slide block 64 are fixed, and is movable along the guide rail 62 for horizontal movement.

  The lifting / lowering means 58 is a means for lifting and lowering the silicon adsorption plate 23 in order to pull up the silicon adsorption plate 23 from the liquid tank 21 or insert it into the liquid tank 21. The lifting / lowering means 58 includes a vertical ball screw 65, a lifting / lowering motor (not shown), and a pair of lifting / lowering guide rails 66. The vertical ball screw 65 is provided in parallel with the vertical direction, and is supported on the surface of the free end side of the vertical plate 57 so as to be rotatable about the axis. The vertical ball screw 65 is formed longer than the height of the silicon suction plate 23 and is provided over the entire length of the vertical plate 57. A nut (not shown) attached to the lifting plate 59 is screwed into the vertical ball screw 65. The elevating motor is provided on the vertical plate 57 and the like, and drives the vertical ball screw 65 to rotate about the axis. The pair of lifting guide rails 66 are disposed on the surface of the free end side of the vertical plate 57 in parallel with the vertical ball screw 65 and support the lifting plate 59 so as to be slidable. The pair of elevating guide rails 66 is formed to have a length substantially equal to the height of the silicon adsorption plate 23 and is provided over the entire length of the vertical plate 57. The elevating means 58 guides the silicon adsorbing plate 23 engaged by the elevating plate 59, that is, the adsorbing plate supporting means 60, by a pair of elevating guide rails 66 by rotating the vertical ball screw 65 by the elevating motor. While moving up and down.

  The elevating plate 59 is formed in a band plate shape parallel to the width direction of the liquid tank 21 and is disposed on the surface of the vertical plate 57 on the free end side. A power supply pin 37 is attached to the lift plate 59. The elevating plate 59 has a nut and a slide block (not shown) fixed thereto, and is provided so as to be movable along the elevating guide rail 66.

  The suction plate support means 60 includes a pair of chuck cylinders 68. The pair of chuck cylinders 68 are disposed at a distance from each other in the width direction of the liquid tank 21. The chuck cylinder 68 includes a cylinder body 69 attached to the lifting plate 59 and a projecting and retracting pin 70 provided so as to project and retract from the cylinder body 69. The chuck cylinder 68 is attached to the lower surface of the elevating plate 59 with the projecting pins 70 protruding from the cylinder body 69 approaching each other. The projecting pin 70 is formed in a columnar shape parallel to the width direction of the liquid tank 21. The projecting and retracting pins 70 project and retract from the cylinder main body 69 over a position indicated by a dotted line and a position indicated by a solid line in FIG. When the lift plate 59 is lowered by the lift means 58 and protrudes from the cylinder main body 69, the projecting pin 70 enters and engages with the engaged hole 29 of the silicon suction plate 23.

  The silicon waste tank 90 is a container for storing the silicon waste 3 recovered by the recovery means 50. The silicon waste tank 90 is formed in a box shape having an open top, and is connected to the lower side of the separation container 54 of the separation unit 51 of the recovery means 50 to store the silicon waste 3 separated by the separation unit 51. .

  The separation unit 51 includes a hydrogen gas discharge pipe 71 as a hydrogen gas discharge unit that discharges hydrogen gas generated from the silicon scrap 3 stored in the silicon scrap tank 90 to the outside. The hydrogen gas discharge pipe 71 passes through the wall of the separation container 54 and communicates the inside and outside of the separation container 54. The hydrogen gas discharge pipe 71 is open to the atmosphere.

  A weight meter 91 is disposed below the silicon waste tank 90. The weigh scale 91 includes a known load cell and the like, and is provided between the floor of the apparatus body 5 and the silicon waste tank 90 as shown in FIG. The weigh scale 91 is for measuring the weight of the silicon waste tank 90 and outputs the measurement result to the control means 101.

  The purified water storage tank 80 is a container that stores the purified water 4 that does not contain the silicon waste 3 separated by the separation processing means 20. As shown in FIG. 1, the purified water storage tank 80 is overlaid on the waste liquid storage tank 10 and disposed on the side of the liquid tank 21 of the separation processing means 20. In the present invention, it is desirable to dispose the waste liquid storage tank 10 and the purified water storage tank 80 so as to overlap each other, and the waste liquid storage tank 10 may be disposed so as to overlap the purified water storage tank 80.

  As shown in FIG. 1, the purified water storage tank 80 includes a tank body 81 as a tank, an inclined defoaming plate 82 for eliminating bubbles in the purified water 4, a plurality of supply ports 83, and a supply port 84. I have. The tank body 81 is a rectangular parallelepiped container.

  The inclined defoaming plate 82 is formed in a flat plate shape and is accommodated in the tank body 81 of the purified water storage tank 80. The inclined defoaming plate 82 straddles the inner walls facing each other in the width direction of the liquid tank 21 of the tank body 81 and partitions the inside of the tank body 81 into two spaces. The inclined defoaming plate 82 is disposed so as to be gradually inclined in the height direction from one end to the other end. A gap through which the purified water 4 can pass is provided between the long side of the inclined defoaming plate 82 and the inner wall of the tank body 81.

  The supply port 83 supplies the purified water 4 discharged from the discharge unit 31 into the tank body 81. The same number of supply ports 83 as the discharge units 31, that is, the silicon passage restriction units 24 are provided. The supply ports 83 are provided on the upper portion of the tank body 81 with a space therebetween. That is, the supply port 83 is disposed above the inclined defoaming plate 82. The supply port 83 passes through the upper part of the tank body 81. The supply port 83 is connected to the supply pipe 34 of the discharge unit 31.

  The feed port 84 supplies the purified water 4 from which bubbles have been removed from the tank body 81 to the outside. The feed port 84 is disposed below the inclined defoaming plate 82 and penetrates the tank body 81. A supply pipe 85 connected to a device (not shown) for reusing the purified water 4 is connected to the supply port 84.

  The notification means 100 notifies when the weight of the silicon waste tank 90 reaches a predetermined weight according to a command from the control means 101. As the notification means, a known notification lamp or speaker can be used.

  The control means 101 controls each component of the waste liquid treatment apparatus 1. The control means 101 notifies the notifying means when the weight of the silicon waste tank 90 measured by the weight meter 91 reaches a predetermined weight. When the silicon adsorbing plate 23 is pulled up from the liquid tank 21 of the separation processing unit 20 by the adsorbing plate moving unit 52 of the collecting unit 50 by the control unit 101, two silicon passage restricting units adjacent to the pulled up silicon adsorbing plate 23. The 24 open / close valves 35 are closed. And the control means 101 stops supply to the purified water storage tank 80 from these two adjacent silicon passage control parts 24. FIG. Note that the control unit 101 is mainly configured by a microprocessor (not shown) including an arithmetic processing unit configured by a CPU or the like, a ROM, a RAM, or the like. The control means 101 is connected to a display means for displaying the state of the machining operation and an operation means used when the operator registers machining content information.

  Next, the processing operation of the waste liquid processing apparatus 1 according to this embodiment will be described. Here, the waste liquid 2 to be processed by the waste liquid processing apparatus 1 is a waste liquid generated when various kinds of machining are performed on a wafer such as a semiconductor wafer made of silicon. The waste liquid 2 includes silicon waste 3 made of silicon constituting the wafer and having a particle size of about several μm, and purified water 4 used for cooling for machining or the like. Note that various machining processes include cutting, cutting, grinding, polishing, and the like. The silicon waste 3 in the waste liquid 2 is negatively charged.

  First, when the operator registers the processing content information and is instructed to start the processing operation, the processing operation is started. Prior to the start of the processing operation, the silicon adsorption plates 23 and the silicon passage restricting portions 24 are alternately accommodated in the liquid tank 21 of the separation processing means 20 while being separated from each other in parallel. In addition, the waste liquid 2 containing silicon waste 3 is supplied from a processing apparatus that performs various machining operations on the waste liquid storage tank 10 after or before the start of the processing operation, and the waste liquid 2 is stored in the waste liquid storage tank 10.

  After the processing operation is started, the control means 101 drives the horizontal movement motor of the horizontal movement means 56 of the suction plate moving section 52 so that the vertical plate 57, that is, the suction plate support means 60 is the most of the plurality of silicon suction plates 23. It is positioned above the silicon adsorption plate 23 away from the separation part 51. The control means 101 reduces the projecting and retracting pins 70 of the chuck cylinder 68 and closes all the open / close valves 35. Further, the control means 101 causes the electric field forming unit 25 to charge all the silicon adsorbing plates 23 positively and all the silicon passage restricting plates 33 to be negatively charged. An electric field is formed between them. Thereafter, the control means 101 drives the waste liquid feed pump 11 to continue feeding the waste liquid 2 in the waste liquid storage tank 10 into the liquid tank 21 through the waste liquid feed pipe 12 and the stirring pipe 22. Then, the waste liquid 2 is supplied into the liquid tank 21 through the feed pipe 12 and the stirring pipe 22. As the waste liquid 2 is supplied, the entire silicon passage restricting portion 24 and the silicon adsorbing plate 23 are gradually submerged in the waste liquid 2, and the waste liquid 2 that is about to overflow from the liquid tank 21 passes through the drain pipe again. Led to.

  Then, when a predetermined amount of the waste liquid 2 is accumulated in the liquid tank 21, the control means 101 opens all the open / close valves 35. Until all the open / close valves 35 are opened, the separation processing means 20 adsorbs the silicon dust 3 negatively charged by the silicon adsorption plate 23. In addition, the silicon passage restricting plate 33 generates a repulsive force with the silicon waste 3 before all the open / close valves 35 are opened, and the purified water 4 is passed into the housing 30 without passing through the silicon waste 3 in the waste liquid 2. Let it pass.

  When the open / close valve 35 is opened, the purified water 4 in the housing 30 of the silicon passage restriction portion 24 is discharged through the discharge portion 31 and discharged from the supply pipe 34 into the tank body 81 of the purified water storage tank 80. The The purified water 4 discharged from the supply pipe 34 into the tank main body 81 of the purified water storage tank 80 collides with the inclined defoaming plate 82 and discharges the included bubbles to the outside of the purified water 4 due to the impact of this collision. In this way, the bubbles in the purified water 4 discharged into the tank body 81 by the inclined defoaming plate 82 are erased. The purified water 4 that does not contain the silicon waste 3 separated by the separation processing unit 20 and whose bubbles are eliminated by the inclined defoaming plate 82 is stored in the purified water storage tank 80. The purified water 4 in the purified water storage tank 80 is supplied to a device (not shown) for reusing the purified water 4 through the supply port 84 and the supply pipe 85. Thus, the waste liquid 2 is separated into the silicon waste 3 and the purified water 4 by the electric field forming unit 25. In addition, while the waste liquid 2 is separated into the silicon waste 3 and the purified water 4 by the electric field forming unit 25 of the discharge unit 31, the waste liquid 2 discharged into the liquid tank 21 through the through hole 26 of the stirring pipe 22 is illustrated in FIG. As shown by the arrow in 3, it collides with the bottom of the liquid tank 21 and bounces upward. The waste liquid 2 discharged into the liquid tank 21 through the through hole 26 of the stirring pipe 22 flows in the liquid tank 21 as shown by the arrows in FIG. 3, thereby stirring the waste liquid 2 in the liquid tank 21. .

  Next, the silicon waste removal operation of the waste liquid treatment apparatus 1 according to this embodiment will be described. FIG. 5 is a diagram illustrating a flow of silicon waste removal operation of the waste liquid treatment apparatus according to the embodiment.

  First, the control means 101 determines whether or not there is a silicon suction plate 23 that needs to remove the silicon scrap 3 among the plurality of silicon suction plates 23 (step ST1). Here, it is determined whether or not the silicon adsorbing plate 23 adsorbs the silicon adsorbing plate 23 and the silicon adsorbing plate 23 needs to be removed. Whether or not the silicon waste 3 needs to be removed depends on the elapsed time since the electric field forming unit 25 formed the electric field, the amount of the waste liquid 2 supplied from the processing apparatus into the waste liquid storage tank 10, and the processing apparatus. It is preferable to make a determination based on at least one of the material of the wafer processed in step 1 and the part number of the tool that processes the wafer of the processing apparatus.

  Next, when the control means 101 determines that there is a silicon adsorption plate 23 that needs to remove the silicon scrap 3 among the plurality of silicon adsorption plates 23 (Yes in step ST1), as shown below, the silicon adsorption plate The silicon scrap 3 is separated from the plate 23. If it is determined that there is no silicon suction plate 23 that needs to remove the silicon scrap 3 among the plurality of silicon suction plates 23 (No in step ST1), the silicon suction plate 23 that needs to remove the silicon scrap 3 is determined. Step ST1 is repeated until it is determined that there is.

  When separating the silicon scrap 3 adsorbed from the silicon adsorbing plate 23, the control means 101 drives the horizontal moving motor of the horizontal moving means 56 of the adsorbing plate moving section 52 to rotate the horizontal ball screw 61 around its axis. To rotate. The control means 101 moves the vertical plate 57, that is, the suction plate support means 60 along the guide rail 62 for horizontal movement, and positions it above the silicon suction plate 23 where the silicon scrap 3 needs to be removed. The control means 101 stops the horizontal movement motor.

  The control means 101 drives the raising / lowering motor of the raising / lowering means 58 to rotate the vertical ball screw 65 around the axis. The control means 101 lowers the elevating plate 59, that is, the suction plate support means 60 along the elevating guide rail 66 to support the suction plate on the supported piece 27 of the silicon suction plate 23 where the silicon scrap 3 needs to be removed. The chuck cylinder 68 of the means 60 is aligned in the horizontal direction. The control means 101 stops the lifting motor.

  The control means 101 causes the projecting and retracting pins 70 of the pair of chuck cylinders 68 to protrude from the cylinder body 69 and causes the projecting and retracting pins 70 to enter the engaged holes 29 of the supported pieces 27 to be engaged. Then, the power supply pin 37 of the electric field forming unit 25 comes into contact with the silicon suction plate 23 in which the projecting and sinking pin 70 is engaged with the engaged hole 29, and the silicon suction plate 23 is brought into contact with both the power supply bar 36 and the power supply pin 37. Positively charged. Then, the control means 101 drives the raising / lowering motor of the raising / lowering means 58 with the protruding and retracting pin 70 protruding from the cylinder body 69, that is, with the protruding and retracting pin 70 engaged with the engaged hole 29. The control means 101 drives the vertical ball screw 65 to rotate about its axis, and raises the lifting plate 59, that is, the suction plate support means 60 along the guide rail 66 for lifting and lowering it from the liquid tank 21.

  Then, when a signal for pulling up the silicon adsorption plate 23 (shown by a dotted line in FIG. 4) is inputted, the control means 101 closes the open / close valve 35 of the silicon passage restriction portion 24 on both sides thereof. As shown in FIG. 4, the control means 101 feeds the purified water storage tank 80 from the inside of the housing 30 of the two silicon passage restriction portions 24 adjacent to the silicon adsorption plate 23 pulled up from the liquid tank 21. Stop. The control means 101 stops the lifting motor when the silicon suction plate 23 in which the projecting pin 70 is engaged with the engaged hole 29 is completely pulled up from the liquid tank 21.

  Then, the control means 101 drives the horizontal movement motor of the horizontal movement means 56 of the suction plate moving section 52 to move the silicon suction plate 23 in which the projecting pins 70 are engaged with the engaged holes 29 to the separation section 51. It is positioned above the slit 53. The control means 101 stops the horizontal movement motor. At this time, a pair of scrapers (not shown) of the separation unit 51 are provided in parallel with a space therebetween. Then, the control means 101 drives the raising / lowering motor of the raising / lowering means 58 to lower the silicon adsorption plate 23 engaged with the projecting and retracting pins 70 in the engaged holes 29, and through the slits 53, the separation unit 51. Insert into the separation container 54. The control means 101 stops the lifting motor when the silicon suction plate 23 with the projecting pins 70 engaged with the engaged holes 29 is positioned below the lower ends of the pair of scrapers.

  Then, the control means 101 drives the rotating mechanism of the separating portion 51 to bring the lower end portion of the scraper into contact with the silicon suction plate 23 in which the projecting pins 70 are engaged with the engaged holes 29. The control means 101 drives the raising / lowering motor of the raising / lowering means 58 to raise the silicon suction plate 23 in which the projecting and retracting pins 70 are engaged with the engaged holes 29. Then, as the silicon adsorption plate 23 rises, the scraper slides on the silicon adsorption plate 23, and the silicon scrap 3 is scraped off (separated) from the silicon adsorption plate 23 by the scraper. The silicon scrap 3 scraped off from the silicon adsorption plate 23 by the scraper falls into the silicon scrap tank 90 through the opening of the separation container 54 and is stored in the silicon scrap tank 90.

  Note that while the silicon scrap 3 is removed from the liquid tank 21 and removed by the separating portion 51, the silicon suction plate 23 in which the projecting pin 70 is engaged with the engaged hole 29 is charged positively by the power supply pin 37. Has been. For this reason, when the silicon adsorbing plate 23 in which the projecting pin 70 is engaged with the engaged hole 29 moves above the liquid tank 21 or the separating portion 51, the gel-like silicon scrap 3 is transferred to the silicon adsorbing plate 23. It can suppress that it continues being adsorbed and falls unexpectedly.

  And the control means 101 will stop the raising / lowering motor, if the silicon | silicone adsorption board 23 from which the silicon | silicone waste 3 was isolate | separated by the isolation | separation part 51 is pulled up completely from the isolation | separation part 51. FIG. The control means 101 drives the horizontal movement motor of the horizontal movement means 56 of the suction plate moving section 52 in the opposite direction to the previous one, and the opening / closing valve 35 is closed on the silicon suction plate 23 from which the silicon waste 3 has been separated. Positioned between the silicon passage restriction portions 24. The control means 101 stops the horizontal movement motor. The control means 101 drives the lifting motor to lower the silicon adsorbing plate 23 from which the silicon waste 3 has been separated by the separating portion 51 and insert it into the liquid tank 21. When the supported piece 27 of the silicon adsorbing plate 23 overlaps the power supply bar 36, the control means 101 opens the opening / closing valve 35 of the discharge portion 31 of the two silicon passage restriction portions 24 closed earlier, and the chuck cylinder. 68 projecting pins 70 are reduced. And the control means 101 drives the raising / lowering motor, and raises the raising / lowering plate 59, ie, the suction plate support means 60. As shown in FIG. The control means 101 raises the lifting plate 59, that is, the suction plate support means 60, then stops the lifting motor and drives the horizontal movement motor, so that the vertical plate 57 is separated from the separating portion 51 by the silicon adsorption. Positioning above the plate 23, the horizontal movement motor is stopped.

  The control means 101 repeats the steps described above to sequentially separate the silicon scraps 3 from the silicon suction plate 23 that needs to remove the silicon scraps 3. The control means 101 stores the separated silicon waste 3 in the silicon waste tank 90. Further, when the control unit 101 repeats the above-described step ST1, if the weight of the silicon waste tank reaches a predetermined weight based on the measurement result from the weighing scale 91, the control unit 101 notifies the notification unit 100 of the silicon waste tank. It is notified that the weight of 90 has reached a predetermined weight. The control means 101 prompts the operator to take out the silicon waste 3 from the silicon waste tank 90. The silicon waste 3 stored in the silicon waste tank 90 is subjected to a drying process, for example, and can be reused.

  As described above, in the waste liquid treatment apparatus 1 according to the present embodiment, the separation processing means 20 adsorbs the negatively charged silicon waste 3 in the waste liquid 2 to the positively charged silicon adsorption plate 23, so that it is very small. The silicon waste 3 can be reliably separated from the waste liquid 2. For this reason, the waste liquid treatment apparatus 1 can reliably separate the silicon waste 3 from the waste liquid 2 without using filtration or a centrifuge. That is, the waste liquid treatment apparatus 1 can separate the silicon waste 3 from the waste liquid 2 without causing clogging of the filter and without using a very large centrifuge. Further, the waste liquid treatment apparatus 1 does not require the use of chemicals in order to separate the silicon waste 3 from the waste liquid 2. Therefore, the waste liquid treatment apparatus 1 can separate the waste liquid 2 including the silicon waste 3 into the silicon waste 3 and the purified water 4 (water) in a state where the waste liquid 2 is easily and efficiently reused.

  Further, the waste liquid treatment apparatus 1 is provided with a supply port 83 that guides the purified water 4 into the tank body 81 above the inclined defoaming plate 82 provided in the tank body 81 of the purified water storage tank 80. The purified water 4 guided into 81 first collides with the inclined defoaming plate 82. For this reason, the impact that collides with the inclined defoaming plate 82 acts on the purified water 4 guided into the tank body 81, and bubbles are removed from the purified water 4 by the impact. Therefore, it can suppress that the purified water 4 stored in the tank main body 81 of the purified water storage tank 80 contains a bubble, and the waste liquid processing apparatus 1 can obtain the purified water 4 in the state which is easy to reuse reliably.

  Further, when the silicon adsorbing plate 23 is pulled up from the liquid tank 21, silicon scrap 3 in the waste liquid 2 between the two silicon passage restricting parts 24 from which the silicon adsorbing plate 23 has been pulled up from each other is transferred to the silicon adsorbing plate 23. Not adsorbed. For this reason, the silicon scrap 3 easily enters the two silicon passage restriction portions 24. However, in the waste liquid treatment apparatus 1, when the silicon adsorption plate 23 is pulled up from the liquid tank 21, the opening / closing valve 35 of the discharge portion 31 of the two silicon passage restriction portions 24 adjacent to the pulled silicon adsorption plate 23 is closed. For this reason, in the waste liquid treatment apparatus 1, the silicon waste 3 in the waste liquid 2 between the two silicon passage restriction parts 24 in which the silicon adsorbing plate 23 is pulled up from each other is transferred to the supply pipe 34, the opening / closing valve 35, and the like. It is possible to suppress the passage through the silicon passage restricting plate 33 and being led to the supply pipe 34 by the flow over. Therefore, the waste liquid treatment apparatus 1 can suppress the silicon waste 3 from being led to the purified water storage tank 80 through the discharge unit 31. Therefore, it can suppress that the purified water 4 stored in the tank main body 81 of the purified water storage tank 80 contains the silicon | silicone waste 3, and the waste liquid processing apparatus 1 can obtain the purified water 4 in the state which is easy to reuse reliably.

  In the waste liquid treatment apparatus 1, a hydrogen gas discharge pipe 71 is provided in a separation unit 51 provided above a silicon waste tank 90 that stores silicon waste 3. For this reason, the waste liquid treatment apparatus 1 can discharge the hydrogen gas generated by the reaction of the silicon waste 3 in the silicon waste tank 90 with water vapor or the like in the atmosphere to the outside of the silicon waste tank 90. Therefore, it is possible to suppress an increase in pressure in the silicon waste tank 90 due to, for example, hydrogen gas accumulating in the silicon waste tank 90.

  In the waste liquid treatment apparatus 1, when the weight measured by the weighing scale 91 disposed in the lower part of the silicon waste tank 90 reaches a predetermined weight, the notification unit 100 notifies. For this reason, the waste liquid treatment apparatus 1 can easily collect a predetermined amount of silicon waste 3. Therefore, the waste liquid treatment apparatus 1 can reliably obtain the silicon scrap 3 that is easy to reuse.

  In the waste liquid treatment apparatus 1 according to the above-described embodiment, the waste liquid storage tank 10 and the purified water storage tank 80 are overlapped with each other and provided on the side of the liquid tank 21 of the separation processing unit 20, and the separation unit 51 and the silicon waste tank. Are disposed on the outside of one end of the liquid tank 21 of the separation processing means 20. Further, in the waste liquid treatment apparatus 1, the suction plate moving part 52 of the recovery means 50 is provided above the liquid tank 21 of the separation treatment means 20. Further, the waste liquid treatment apparatus 1 separates the waste liquid 2 into the silicon waste 3 and the purified water 4 by the separation processing means 20 using the silicon adsorption plate 23 as an anode and the silicon passage restriction plate 33 of the silicon passage restriction portion 24 as a cathode. . With such a layout, the waste liquid treatment apparatus 1 is more efficient than the centrifuge that can separate the silicon waste 3 having a particle size of about several μm from the waste liquid 2 while reducing the size of the waste liquid 2 efficiently. Well, it can be separated into silicon waste 3 and purified water (water) 4 in an easily reusable state.

  In the present invention, for example, the shape structure of the silicon adsorption plate 23 and the silicon passage restriction portion 24 is not limited to the above embodiment. Further, in the present invention, the number of silicon adsorbing plates 23 and silicon passage regulating portions 24, the layout of the waste liquid storage tank 10, the separation processing means 20, the recovery means 50, the purified water storage tank 80, and the silicon waste tank 90 are also in the above-described embodiment. It is not limited.

  In the present invention, if the waste liquid storage tank 10, the separation processing means 20, the recovery means 50, the purified water storage tank 80, the silicon waste tank 90, etc. are arranged in the layout of the above-described embodiment, The separation method and the like may be changed as appropriate. Furthermore, in the present invention, the separating unit 51 may use a cylindrical brush instead of the pair of scrapers. Further, a suction pump or a tank for storing hydrogen gas may be connected to the hydrogen gas discharge pipe 71.

1 Waste liquid treatment equipment 2 Waste liquid 3 Silicon scrap 4 Water purification (water, liquid)
DESCRIPTION OF SYMBOLS 10 Waste liquid storage tank 11 Waste liquid feed pump 20 Separation processing means 21 Liquid tank 23 Silicon adsorption plate 24 Silicon passage restriction part 25 Electric field formation part 30 Housing | casing 31 Discharge part 32 Frame body 33 Silicon passage restriction board 34 Feeding pipe 35 Open / close valve 50 Recovery means 51 Separation part 52 Adsorption plate moving part 71 Hydrogen gas discharge pipe (hydrogen gas discharge means)
80 Purified water storage tank 81 Tank body (tank)
82 Inclined defoaming plate 83 Supply port 84 Feed port 90 Silicon waste tank 91 Weigh scale 100 Notification means

Claims (5)

A waste liquid treatment apparatus for separating waste liquid containing silicon waste into purified water not containing silicon waste and silicon waste,
A waste liquid storage tank that stores waste liquid, a waste liquid feed pump that feeds waste liquid stored in the waste liquid storage tank, and purified water that does not contain silicon waste and silicon waste from the waste liquid supplied by the waste liquid feed pump Separation processing means for separating, recovery means for recovering silicon waste separated by the separation processing means, purified water storage tank for storing purified water that does not contain silicon waste separated by the separation processing means, and the recovery means A silicon waste tank for storing the recovered silicon waste,
The separation processing means adsorbs the waste silicon supplied by the waste liquid feed pump, and a plurality of silicon tanks arranged in the liquid tank at equal intervals and charged negatively in the waste liquid. A plurality of positively charged silicon adsorbing plates and a plurality of the silicon adsorbing plates facing each other and spaced apart from the silicon adsorbing plates to allow only the liquid waste liquid to pass therethrough and An electric field between the silicon adsorbing plate and the silicon passage restricting plate, and a silicon passage restricting portion including a net-like silicon passage restricting plate for restricting passage; And an electric field forming part for forming
The silicon passage restricting portion is composed of a frame and a pair of silicon passage restricting plates disposed so as to be parallel to each other so as to close both side opening surfaces of the frame, and the purified water that has passed through the silicon passage restricting plate. A housing that divides a region where the water is present, and a discharge unit that discharges the purified water disposed in the housing to the purified water storage tank,
The recovery unit includes a separation unit that separates silicon waste from the silicon adsorption plate, and an adsorption plate moving unit that moves the silicon adsorption plate from the liquid tank of the separation processing unit to the separation unit.
A waste liquid treatment apparatus characterized by that.   The purified water storage tank has an inclined defoaming plate for extinguishing bubbles in the purified water, which is divided into two spaces and is gradually inclined in the height direction, straddling the inner walls facing each other, and the inclined A supply port for supplying purified water discharged from the discharge portion disposed above the defoaming plate, and purified water from which bubbles have been removed from the tank disposed below the inclined defoaming plate The waste liquid processing apparatus according to claim 1, further comprising a feeding port for supplying to the outside. The discharge portion of the separation processing means is provided in each housing and feeds the purified water that has passed through the silicon passage regulating plate from the inside of the housing to the purified water storage tank; An open / close valve connected to the pipe,
When the silicon adsorbing plate is pulled up from the liquid layer of the separation processing unit by the adsorbing plate moving unit of the recovery unit, the opening and closing valves of the two silicon passage regulating units adjacent to the pulled up silicon adsorbing plate are 3. The waste liquid treatment apparatus according to claim 1, wherein the waste water treatment apparatus is closed and the supply to the purified water storage tank from the two adjacent silicon passage restriction portions is stopped. A silicon waste tank in which silicon waste separated by the separation unit is stored is connected below the separation unit of the recovery means,
The separation unit includes hydrogen gas discharge means for discharging hydrogen gas generated from the silicon scrap stored in the silicon scrap tank to the outside.
The waste liquid treatment apparatus according to any one of claims 1 to 3.   2. A weight meter for measuring the weight of the silicon waste tank disposed at a lower portion of the silicon waste tank, and a notification means for notifying when the weight of the silicon waste tank reaches a predetermined weight. The waste liquid treatment apparatus according to any one of 4.

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