JP2013110304A - Chip resistor and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip resistor which is able to prevent a conduction between side electrodes, and a manufacturing method of the chip resistor.SOLUTION: A chip resistor includes: an insulative substrate 1 having recesses 1a which extend in one direction and are located on an upper face at both edges thereof extending in another direction intersecting with the one direction; a resistor 3 formed on the upper face of the insulative substrate 1; an upper face electrode 2 electrically connected to the resistor 3 and formed on the upper face of the insulative substrate 1; side electrodes 4 electrically connected to the upper face electrode 2 and formed so as to respectively cover both side faces in the one direction of the insulative substrate 1; and projections 5 formed on the recesses 1a.

Description

  The present invention relates to a chip resistor and a manufacturing method of the chip resistor, and more particularly to a chip resistor having a side electrode and a manufacturing method thereof.

  A chip resistor and a manufacturing method thereof are disclosed in, for example, Japanese Patent Laid-Open No. 2003-282304 (Patent Document 1). In the chip resistor described in this publication, an upper surface electrode and a resistor layer are formed on the upper surface of an insulating substrate. A first protective layer and a second protective layer are formed on the surface of the resistor. An external electrode layer is formed on the end surface of the insulating substrate.

  In this chip resistor manufacturing method, multiple insulating substrates are divided to form individual chip resistors. The multi-piece insulating substrate is divided into individual resistor regions by a primary dividing groove and a secondary dividing groove. A thick film glaze paste is baked on the top surface of the insulating substrate to form a top surface electrode. Thereafter, the resistor paste is formed by baking the resistor paste. Subsequently, the first protective layer is formed by baking the glass paste on the upper surface of the resistor. Here, trimming using laser light is performed to adjust the resistance value. Subsequently, the second protective layer is formed by solidifying the synthetic resin so as to cover the first protective layer.

  The end face of the insulating substrate divided into strips along the primary dividing groove is dipped in the material of the external electrode layer to form the external electrode layer. Subsequently, the insulating substrate is individually divided along the secondary dividing grooves. Thereafter, a nickel plating layer is formed on the surface of the external electrode layer by electrolytic plating, and a solder plating layer is formed on the nickel plating layer by electrolytic plating. In this way, a chip resistor is manufactured.

JP 2003-282304 A (Patent Document 1)

  In the chip resistor manufacturing method described in the above publication, when the end face of the insulating substrate divided into strips is immersed in the material of the external electrode layer, the material of the external electrode layer enters the secondary dividing groove. At this time, since both end surfaces of the insulating substrate are immersed in the material of the external electrode layer, the material of the external electrode layer enters the secondary dividing groove from the both end surfaces, and the external electrode passes through the secondary dividing groove. Layers may be connected. That is, the side electrodes formed on the side surfaces of the insulating substrate may be electrically connected. In this case, there is a problem that the side electrodes become conductive when a current flows.

  This invention is made | formed in view of the said subject, The objective is to provide the chip resistor which can prevent conduction | electrical_connection between side-surface electrodes, and its manufacturing method.

  The chip resistor of the present invention includes an insulating substrate having recesses extending in one direction at both edges in the other direction intersecting with one direction of the upper surface, a resistor formed on the upper surface of the insulating substrate, and the resistor and the electrical And an upper electrode formed on the upper surface of the insulating substrate, and a side electrode electrically connected to the upper electrode and formed so as to cover both sides in one direction of the insulating substrate, And a raised portion formed on the recess.

  In the chip resistor of the present invention, since the raised portion is formed on the concave portion on the upper surface of the insulating substrate, it is possible to suppress the electrode material of the side electrode from flowing through the concave portion beyond the raised portion. Thereby, it can prevent that the side electrodes are electrically connected by connecting the electrode material of a side electrode via a recessed part. For this reason, conduction between the side electrodes can be prevented.

  In the above chip resistor, the ridge is preferably formed so as to reach a position higher than the upper surface. For this reason, it can further suppress that the electrode material of a side electrode flows through a recessed part beyond a protruding part.

  In the above chip resistor, preferably, the raised portions are formed at both end portions in one direction of the upper surface. For this reason, it can suppress that the electrode material of a side electrode flows through a recessed part over a protruding part in the both ends of the upper surface of an insulated substrate. Thereby, the space | interval of the electrode materials of the side electrode in a recessed part can fully be hold | maintained.

  In the above chip resistor, the raised portion is preferably formed so as to be in contact with the side electrode. For this reason, it can suppress that the electrode material of a side electrode flows over a recessed part exceeding a raised part because a raised part contacts a side electrode.

  In the above chip resistor, preferably, the material of the raised portion is made of an insulator. For this reason, a side electrode can be insulated by a protruding part.

  In the above chip resistor, preferably, the material of the raised portion includes at least one of glass and resin. For this reason, a raised part can be manufactured easily.

  In the above chip resistor, the raised portion is preferably made of a material that is transparent to visible light. For this reason, it can also be visually recognized that the raised portion is formed on the recess while ensuring the design. Thereby, reliability can be improved.

  Preferably, the chip resistor further includes a cover coat that covers the resistor, and the cover coat and the raised portion are formed of the same material. For this reason, the resistor can be protected by the cover coat. Further, since the cover coat and the raised portion can be formed at a time, productivity can be improved.

  The manufacturing method of the chip resistor of the present invention includes the following steps. A strip-shaped insulating substrate having a groove extending in one direction on the upper surface is prepared. A plurality of upper surface electrodes are formed on the upper surfaces of both ends in one direction of the strip-shaped insulating substrate. A plurality of resistors extending in one direction so as to be in contact with the upper surface electrode are formed on the upper surface of the strip-shaped insulating substrate. A plurality of raised portions are formed on the groove. Side electrodes are formed by bringing both side surfaces in one direction of the strip-shaped insulating substrate into contact with the electrode material. The strip-shaped insulating substrate is divided along the groove so that each has a top electrode, a resistor, a raised portion, and a side electrode.

  In the manufacturing method of the chip device of the present invention, since a plurality of raised portions are formed on the groove on the upper surface of the strip-shaped insulating substrate, the electrode material is raised when both side surfaces of the strip-shaped insulating substrate are brought into contact with the electrode material. Can be prevented from flowing through the groove. Thereby, it is possible to prevent the side electrodes from being electrically connected to each other by connecting the electrode material through the groove. For this reason, conduction between the side electrodes can be prevented.

  In the above-described chip resistor manufacturing method, preferably, a cover coat is formed so as to cover the resistor. The cover coat and the raised portion are formed at the same time. For this reason, the resistor can be protected by the cover coat. Further, since the cover coat and the raised portion can be formed at the same time, productivity can be improved.

  As described above, according to the present invention, it is possible to obtain a chip resistor that can prevent conduction between side electrodes and a method for manufacturing the same.

It is a schematic top view of the chip resistor in one embodiment of the present invention. It is a schematic sectional drawing in alignment with the II-II line of FIG. It is a schematic sectional drawing in alignment with the III-III line of FIG. It is a schematic sectional drawing which follows the IV-IV line of FIG. It is a schematic sectional drawing of the modification 1 of the chip resistor in one embodiment of this invention. It is a schematic sectional drawing of the modification 2 of the chip resistor in one embodiment of this invention. It is a schematic top view of the modification 3 of the chip resistor in one embodiment of the present invention. It is a schematic sectional drawing of the modification 4 of the chip resistor in one embodiment of this invention. It is a schematic perspective view which shows the process in which the insulated substrate is prepared in the manufacturing method of the chip resistor in one embodiment of this invention. It is a schematic perspective view which shows the process in which an upper surface electrode is formed in the manufacturing method of the chip resistor in one embodiment of this invention. It is a schematic perspective view which shows the process in which a resistor is formed in the manufacturing method of the chip resistor in one embodiment of this invention. It is a schematic perspective view which shows the process in which a cover coat is formed in the manufacturing method of the chip resistor in one embodiment of the present invention. It is a schematic side view which shows the process in which a side electrode is formed in the manufacturing method of the chip resistor in one embodiment of this invention. It is a schematic side view which shows the state in which the side electrode was formed in the manufacturing method of the chip resistor in one embodiment of this invention. In the manufacturing method of the chip resistor in one embodiment of the present invention, it is a schematic sectional view showing a state where the upper surface electrode is formed, and is a diagram along line II-II in FIG. FIG. In the manufacturing method of the chip resistor in one embodiment of the present invention, it is a schematic sectional view showing a state in which a resistor is formed, and is a view along line II-II in FIG. FIG. In the manufacturing method of the chip resistor in one embodiment of the present invention, it is a schematic sectional view showing a state where an undercoat is formed, and is a view along line II-II in FIG. 1 and a line III-III. FIG. In the manufacturing method of the chip resistor in one embodiment of the present invention, it is a schematic sectional view showing a state where a top coat is formed, and is a view along line II-II in FIG. 1 and a line III-III. FIG. In the manufacturing method of the chip resistor in one embodiment of the present invention, it is a schematic sectional view showing a state in which a side electrode is formed, and is a view along line II-II in FIG. FIG. In the manufacturing method of the chip resistor in one embodiment of the present invention, it is a schematic sectional view showing a state where a plating layer is formed, and is a diagram along line II-II in FIG. 1 and a line III-III. FIG. It is a schematic side view which shows the process in which the side electrode of a comparative example is formed. It is a schematic side view which shows the state in which the side electrode of the comparative example was formed.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
First, the configuration of the chip resistor according to one embodiment of the present invention will be described.

  1 to 4, a chip resistor according to one embodiment of the present invention includes an insulating substrate 1, an upper surface electrode 2, a resistor 3, a side electrode 4, a raised portion 5, and a cover coat. 6 and the plating layer 7 are mainly included. The insulating substrate 1 has a recess 1a. The recess 1a is formed to extend in one direction on both edges in the other direction intersecting with one direction on the upper surface of the insulating substrate 1. The material of the insulating substrate 1 is, for example, ceramic.

  The upper surface electrode 2 is formed on the upper surface of the insulating substrate 1. The pair of upper surface electrodes 2 are formed at both ends in one direction of the insulating substrate 1. The upper surface electrode 2 is formed, for example, by firing a conductive paste mainly composed of silver. The resistor 3 is formed on the upper surface of the insulating substrate 1. The resistor 3 is formed so as to connect the pair of upper surface electrodes 2 to each other. The resistor 3 is formed to extend in one direction. The resistor 3 is formed such that part of both ends overlaps part of each of the pair of upper surface electrodes 2. The resistor 3 is formed, for example, by firing the material paste. The top electrode 2 and the resistor 3 are electrically connected.

  The side electrode 4 is electrically connected to the upper surface electrode 2. The side electrodes 4 are formed so as to cover both sides in one direction of the insulating substrate 1. The side electrode 4 is formed so as to overlap a part of the upper surface electrode 2. The side electrode 4 is formed so as to cover a part of each of the upper surface and the lower surface of the insulating substrate 1. The side electrode 4 is formed by firing a conductive paste as a material thereof.

  The raised portion 5 is formed on the recess 1a. The raised portion 5 is formed so as to reach a position higher than the upper surface of the insulating substrate 1. The raised portions 5 are formed at both end portions in one direction on the upper surface of the insulating substrate 1. The raised portion 5 is formed so as to be in contact with the side electrode 4. The material of the raised portion 5 may be a conductor or an insulator, but is preferably made of an insulator. More preferably, the material of the raised portion 5 includes at least one of glass and resin. Further, the raised portion 5 is preferably formed of a material that is transparent to visible light. Here, the visible light is light having a wavelength of 360 nm to 400 nm on the short wavelength side and 760 nm to 830 nm on the long wavelength side. A material transparent to visible light is a material that transmits light having the above-described wavelength.

  As shown in FIG. 1, the raised portions 5 are formed at two locations in one recess 1 a. The two raised portions 5 are provided in the vicinity of the end portion on the side electrode 4 side in the recess 1a, and the raised portions 5 are separated from each other. More specifically, the position of the end portion 5 a inside the raised portion 5 in the recess 1 a is provided outside the end portion 2 a inside the upper surface electrode 2. That is, the interval between the raised portions 5 is larger than the interval between the upper surface electrodes 2. Further, the outer end 5 b of the raised portion 5 is located on the inner side from the end surface 1 b of the insulating substrate 1. Thus, the raised portion 5 is formed to have a width smaller than that of the upper surface electrode 2. As a result, it is possible to prevent the breakage from becoming difficult when the insulating substrate 1 is broken along the recess 1a due to the excessive amount of the raised portions 5 being formed in the recess 1a. Further, the side electrode 4 is formed so as to cover a part of the raised portion 5. That is, as shown in FIG. 3, the inner portion of the raised portion 5 is not covered with the side electrode 4, and the outer portion of the raised portion 5 is covered with the side electrode 4 as shown in FIG. 4.

  The cover coat 6 is formed so as to cover the resistor 3. The cover coat 6 mainly has an undercoat 6a and a topcoat 6b. The undercoat 6 a is formed so as to cover the resistor 3. A top coat 6b is formed so as to cover the undercoat 6a. The cover coat 6 and the raised portion 5 may be formed of the same material. It is preferable that at least the undercoat 6a and the raised portion 5 are formed of the same material. In the undercoat 6a, a trimming groove is formed by laser light irradiation or the like in order to adjust the resistance value. The undercoat 6a and the topcoat 6b are formed, for example, by baking a glass paste. The top coat 6b may be formed by curing a resin. The plating layer 7 is formed so as to cover the side electrode 4. The plating layer 7 is formed, for example, by superposing a solder plating layer or a tin plating layer on a nickel plating layer.

  In the above description, the cover coat 6 is formed of two layers, but the present invention is not limited to this. The cover coat 6 may be formed of one layer. That is, the cover coat 6 may have only the top coat 6b without the undercoat 6a.

  Referring to FIG. 5, cover coat 6 may be formed of three layers as in Modification 1 of the chip resistor according to the embodiment of the present invention. In the first modification, the cover coat 6 has a middle coat 6c sandwiched between an undercoat 6a and a top coat 6b. The middle coat 6c is formed so as to cover the undercoat 6a. The middle coat 6c is covered with a top coat 6b. The middle coat 6c is formed so as to fill the trimming groove of the undercoat 6a. In this case, the undercoat 6a, the topcoat 6b, and the middlecoat 6c may be made of glass.

  In addition, referring to FIG. 6, the chip resistor may have a bottom electrode 8 as in Modification 2 of the chip resistor according to one embodiment of the present invention. In Modification 2, the lower surface electrode 8 is formed on the lower surface of the insulating substrate 1. The pair of lower surface electrodes 8 are formed at both ends in one direction of the insulating substrate 1. The bottom electrode 8 is formed, for example, by firing a conductive paste mainly composed of silver.

  In addition, referring to FIG. 7, the ridge 5 may not be covered with the side electrode 4 as in Modification 3 of the chip resistor according to the embodiment of the present invention. In the third modification, the side electrode 4 can be formed up to the end surface of the raised portion 5 on the side electrode 4 side.

  Referring to FIG. 8, one raised portion 5 may be provided for one recessed portion 1 a as in Modification 4 of the chip resistor according to the embodiment of the present invention. Even in this case, it is possible to prevent a short circuit between the side electrodes 4 on both sides. In this case, the raised portion 5 is formed of an insulator.

  Basically, if the raised portion 5 is formed in the concave portion 1a, the side electrode 4 can be prevented from being short-circuited. However, as shown in FIGS. 1, 7, and 8, the break of the insulating substrate 1 is not hindered. In order to achieve this, it is preferable to form the raised portion 5 in the minimum necessary area.

Next, a manufacturing method of the chip resistor according to the embodiment of the present invention will be described.
Referring to FIG. 9, first, a material substrate 100 made of ceramic, for example, is prepared. A first groove (vertical groove) 11 and a second groove (lateral groove) 12 are formed on the upper surface of the material substrate 100. The first groove 11 is formed to extend in one direction (longitudinal direction), and the second groove 12 is formed to extend in another direction (lateral direction) intersecting with one direction. The first groove 11 and the second groove 12 are formed by being baked after being formed by the convex portions provided in the mold when the material substrate 100 is formed. In addition, the 1st groove | channel 11 and the 2nd groove | channel 12 may be formed by irradiating a laser beam to the upper surface of the raw material substrate 100 after baking.

  Each region defined by the first groove 11 and the second groove 12 becomes an insulating substrate 1 (FIG. 1) of one chip resistor. That is, the material substrate 100 is configured by integrating the insulating substrate 1 of one chip resistor, which is partitioned by the first groove 11 and the second groove 12, in the vertical direction and the horizontal direction. Note that a blank portion where no chip resistor is formed is integrally formed on the outermost periphery of the material substrate 100.

  Further, as will be described later, by performing dicing along the second groove 12, a strip-like insulating substrate 10 (FIG. 13) in which one chip resistor is aligned and integrated in the other direction is formed. In the chip resistor manufacturing method of the present embodiment, the manufacturing is started from the state in which the material substrate 100 is prepared. However, the manufacturing may be started from the state in which the strip-shaped insulating substrate 10 is prepared. That is, the strip-shaped strip-shaped insulating substrate 10 may be prepared and the following steps may be performed.

  Referring to FIG. 10, a conductive paste mainly composed of silver is applied by screen printing so as to straddle second groove 12 of material substrate 100 in one direction. Thereafter, the conductive paste is baked to form the upper surface electrode 2. In this way, the upper surface electrode 2 is formed on the upper surface of the material substrate 100 at positions that are both ends of one chip resistor. Thereby, a plurality of upper surface electrodes 2 are formed on the upper surfaces of both end portions in one direction of the strip-shaped insulating substrate 10.

  Referring to FIG. 11, the material paste of upper surface electrode 2 is applied by screen printing so as to overlap a part of upper surface electrode 2 facing in one direction within the region surrounded by first groove 11 and second groove 12. . Thereafter, the material paste is baked to form the resistor 3. In this way, the resistor 3 is formed on the upper surface of the material substrate 100 so as to connect the upper surface electrode 2 to the center of one chip resistor. Thereby, a plurality of resistors 3 extending in one direction so as to be in contact with the upper surface electrode 2 are formed on the upper surface of the strip-shaped insulating substrate 10.

  In addition, although the case where the resistor 3 was formed after the upper surface electrode 2 was formed was described above, the order in which the upper surface electrode 2 and the resistor 3 are formed is not limited to this. That is, the resistor 3 may be formed first, and then the upper surface electrode 2 may be formed.

  When the lower surface electrode 8 (FIG. 6) is formed, the lower surface electrode 8 is formed in the same manner as the upper surface electrode 2 after the upper surface electrode 2 is formed or before the upper surface electrode 2 is formed.

  Referring to FIG. 12, a glass paste as a material for undercoat 6a (FIG. 2) is applied by screen printing so as to cover resistor 3. At the same time, glass paste as a material of the raised portion 5 is applied on the first groove 11 by screen printing at the positions of both end portions of one chip resistor. Thereafter, these glass pastes are baked to form the undercoat 6a and the raised portions 5 at the same time. Thereby, a plurality of raised portions 5 are formed on the first groove 11.

  These glass coats may be made of the same material. Thereby, the undercoat 6a and the raised part 5 are formed in a lump. Thereafter, a trimming groove is formed on the undercoat 6a by laser irradiation or the like in order to adjust the resistance value. Thereby, trimming adjustment is performed so that the resistance value becomes a predetermined value.

  A glass paste or a resin paste as a material of the top coat 6b (FIG. 2) is applied by screen printing so as to cover the undercoat 6a. Thereafter, in the case of a glass paste, the glass paste is baked to form the top coat 6b. In the case of a resin paste, the resin paste is solidified to form a top coat 6b. In this way, the cover coat 6 is formed so as to cover the resistor 3. Since the cover coat 6 is formed in each region constituting one chip resistor, the cover coat 6 is not formed on the first groove 11 and the second groove 12. For this reason, the cover coat 6 does not prevent the chip resistors from being divided.

  When the middle coat 6c (FIG. 5) is formed, a glass paste as a material for the middle coat 6c is applied by screen printing so as to cover the undercoat 6a. Thereafter, the glass paste is baked to form the middle coat 6c. Thereafter, a top coat 6b is formed so as to cover the middle coat 6c.

  Subsequently, the strip-shaped insulating substrate 10 indicated by P1 in FIG. 12 is divided by dicing along the second groove 12. Further, instead of dicing, the strip-shaped insulator substrate 10 may be divided by breaking along the second grooves 12.

  Referring to FIG. 13 and FIG. 14, the strip-shaped insulating substrate 10 is in the direction of the arrow in the drawing so that the end faces in one direction of the strip-shaped insulating substrate 10 are in contact with the conductive paste that is the electrode material 4 a of the side electrode 4 one by one. Move to. And the electrode material 4a is apply | coated to the both end surfaces of the strip | belt-shaped insulating substrate 10 by immersing the end surface of the strip | belt-shaped insulating substrate 10 one by one in the electrode material 4a mounted on the table 20. FIG. When the end surface of the strip-shaped insulating substrate 1 is immersed in the electrode material 4 a, the electrode material 4 a crawls up in the first groove 11, but since the first groove 11 is blocked by the raised portion 5, the electrode material 4 a Can't crawl up further. For this reason, it is prevented that the electrode material 4a is connected by the 1st groove | channel 11 by the protruding part 5. FIG. In addition, the electrode material 4a may be applied so as to cover a part of the protruding portion 5 on the end surface side in one direction of the insulating substrate 1. The conductive paste may be applied to the end surface with a roller instead of the dip. Even in this case, there is a possibility that the electrode material 4a creeps up, so it is necessary to provide a raised portion 5.

  The conductive paste is baked to form the side electrodes 4 on both end faces in one direction of the strip-like insulating substrate 10. The side electrode 4 is formed so as to cover a part of the upper surface and the lower surface of the strip-shaped insulating substrate 10. Note that the side electrode 4 may be formed so as to cover a part of the protruding portion 5 on the end surface side in one direction of the insulating substrate 1.

  Subsequently, dicing or breaking is performed along the first groove 11 to divide the strip-like insulating substrate 10 into individual chip resistors indicated by P2 in FIG. Thereby, the strip-shaped insulating substrate 10 is divided along the first groove 11 so that each of the chip resistors has the upper surface electrode 2, the resistor 3, the side surface electrode 4, and the raised portion 5. A plating layer 7 is formed on the surface of the side electrode 4 so that a solder plating layer or a tin plating layer is superimposed on the nickel plating layer. Thereby, the chip resistor shown in FIG. 1 is formed.

  The first groove 11 and the second groove 12 may be formed on the lower surface of the material substrate 100. The first groove 11 and the second groove 12 are formed at positions overlapping the upper surface when viewed from the lower surface. Thereby, since the thickness of the material substrate 100 becomes thin at the positions of the first groove and the second groove 12 on both the upper surface and the lower surface, the chip resistor can be easily divided. In this case, it is preferable that the raised portion 5 is also formed in the first groove 11 on the lower surface in order to prevent conduction between the side surface electrodes 4 on the lower surface.

  Furthermore, a state where one chip resistor is formed will be described with reference to FIGS. 15-20, each figure (A) is sectional drawing corresponding to FIG. 2, Each figure (B) is sectional drawing corresponding to FIG.

  As shown in FIGS. 15A and 15B, the upper surface electrodes 2 are formed at both ends on the upper surface of the insulating substrate 1. Thereafter, as shown in FIGS. 16A and 16B, a resistor 3 is formed on the upper surface of the insulating substrate 1 between the pair of upper surface electrodes 2. Next, as shown in FIGS. 17A and 17B, an undercoat 6 a is formed so as to cover the resistor 3. Further, the raised portion 5 is formed on the concave portion 1 a of the insulating substrate 1. The raised portion 5 is formed up to a position higher than the upper surface of the insulating substrate 1. The raised portion 5 is formed to fill the recess 1a. Thereafter, as shown in FIGS. 18A and 18B, a top coat 6b is formed on the undercoat 6a. Next, as shown in FIGS. 19A and 19B, the side electrodes 4 are formed so as to cover both side surfaces of the insulating substrate 1. Thereafter, as shown in FIGS. 20A and 20B, a plating layer 7 is formed so as to cover side electrode 4.

  Note that, depending on the viscosity of the paste when the paste that becomes the raised portion 5 is printed, the raised portion 5 is not completely embedded in the first groove 11, and a gap is formed between the inner surface of the first groove 11 and the raised portion 5. Cases can also occur. However, even in this case, since the electrode material of the side electrode 4 can be prevented from flowing through the first groove 11 by the raised portion 5, the effect of suppressing the short-circuit of the side electrode 4 is sufficient.

  Further, the top coat 6b is usually colored black or the like, not limited to resin and glass. Therefore, it is preferable to form the raised portion 5 simultaneously with the undercoat 6a rather than forming the raised portion 5 simultaneously with the top coat 6b.

Next, the effect of the present invention will be described in comparison with a comparative example.
With reference to FIG. 21 and FIG. 22, the raised portion 5 is not formed in the comparative example. Therefore, when the side surface electrode 4 is formed and the end surface in one direction of the strip-shaped insulating substrate 10 is immersed in the electrode material 4 a, the electrode material 4 a scoops up the first groove 11. As a result, the electrode material 4 a flows into the first groove 11, and the electrode material 4 a is connected in the first groove 11. In this state, the electrode material 4a is baked to form the side electrodes 4 in a connected state. For this reason, the side surface electrodes 4 are electrically connected. Even when the side electrodes 4 are not completely connected by the first grooves 11, the side electrodes 4 may be electrically connected to each other through the plating layer 8 formed on the side electrodes 4.

  On the other hand, in the chip resistor according to one embodiment of the present invention, since the raised portion 5 is formed on the recessed portion 1a on the upper surface of the insulating substrate 1, the electrode material of the side electrode 4 is recessed beyond the raised portion 5. It can suppress flowing through 1a. Thereby, it can prevent that the side electrodes 4 are electrically connected by connecting the electrode material 4a of the side electrode 4 via the recessed part 1a. For this reason, conduction between the side electrodes 4 can be prevented.

  In the chip resistor according to the embodiment of the present invention, since the raised portion 5 is formed so as to reach a position higher than the upper surface of the insulating substrate 1, the electrode material 4a of the side electrode 4 extends beyond the raised portion 5 to form the recess 1a. Can be further suppressed.

  In the chip resistor according to the embodiment of the present invention, since the raised portions 5 are formed at both ends in one direction on the upper surface of the insulating substrate 1, the electrode material of the side electrode 4 is formed at both ends of the upper surface of the insulating substrate 1. It can suppress that 4a flows over the recessed part 1a exceeding the protruding part 5. FIG. Thereby, the space | interval of the electrode materials 4a of the side electrode 4 in the recessed part 1a can fully be hold | maintained.

  In the chip resistor according to the embodiment of the present invention, since the raised portion 5 is formed so as to contact the side electrode 4, the electrode material 4 a of the side electrode 4 is formed by the raised portion 5 coming into contact with the side electrode 4. It can suppress flowing into a recessed part exceeding the protruding part 5. FIG.

  In the chip resistor according to the embodiment of the present invention, since the material of the raised portion 5 is made of an insulator, the side electrode 4 can be insulated by the raised portion 5.

  In the chip resistor according to the embodiment of the present invention, since the material of the raised portion 5 includes at least one of glass and resin, the raised portion 5 can be easily manufactured.

  In the chip resistor according to the embodiment of the present invention, since the raised portion 5 is formed of a material that is transparent to visible light, the raised portion 5 is formed on the recess 1a while ensuring the design. Is also visible. Thereby, reliability can be improved.

  In one embodiment of the present invention, the chip resistor further includes a cover coat 6 that covers the resistor 3, and the cover coat 6 and the raised portion 5 are formed of the same material. Can be protected. Further, since the cover coat 6 and the raised portion 5 can be formed at a time, productivity can be improved.

  In the chip resistor manufacturing method according to an embodiment of the present invention, since the plurality of raised portions 5 are formed on the first groove 11 on the upper surface of the strip-shaped insulating substrate 10, both side surfaces of the strip-shaped insulating substrate 10 are formed on the electrode material 4a. It is possible to prevent the electrode material 4a from flowing through the first groove 11 beyond the raised portion 5 when brought into contact with the upper portion. Thereby, it can prevent that the side electrodes 4 are electrically connected by the electrode material 4a being connected via the 1st groove | channel 11. FIG. For this reason, conduction between the side electrodes 4 can be prevented.

  In the manufacturing method of the chip resistor according to the embodiment of the present invention, the cover coat 6 is formed so as to cover the resistor 3, and the cover coat 6 and the raised portion 5 are formed simultaneously. For this reason, the resistor 3 can be protected by the cover coat 6. Further, since the cover coat 6 and the raised portion 5 can be formed at the same time, productivity can be improved.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be applied particularly advantageously to a chip resistor having a side electrode and a manufacturing method thereof.

  DESCRIPTION OF SYMBOLS 1 Insulation board | substrate, 1a Recessed part, 2 Upper surface electrode, 3 Resistor, 4 Side electrode, 4a Electrode material, 5 Raised part, 6 Cover coat, 6a Undercoat, 6b Top coat, 6c Middle coat, 7 Plating layer, 8 Lower surface electrode DESCRIPTION OF SYMBOLS 10 Strip | belt-shaped insulated substrate, 11 1st groove | channel (groove), 12 2nd groove | channel, 20 Table, 100 material board | substrate.

Claims (10)

An insulating substrate having recesses extending in one direction on both edges in the other direction intersecting with one direction on the upper surface;
A resistor formed on the upper surface of the insulating substrate;
An upper surface electrode electrically connected to the resistor and formed on the upper surface of the insulating substrate;
Side electrodes that are electrically connected to the upper surface electrode and are formed so as to respectively cover both side surfaces of the insulating substrate in one direction;
A chip resistor comprising a raised portion formed on the recess.   The chip resistor according to claim 1, wherein the raised portion is formed to reach a position higher than the upper surface.   3. The chip resistor according to claim 1, wherein the raised portions are formed at both end portions of the upper surface in the one direction.   The chip resistor according to claim 1, wherein the raised portion is formed so as to be in contact with the side electrode.   The chip resistor according to claim 1, wherein the material of the raised portion is made of an insulator.   The chip resistor according to claim 5, wherein the material of the raised portion includes at least one of glass and resin.   The chip resistor according to claim 1, wherein the raised portion is made of a material transparent to visible light. Further comprising a cover coat covering the resistor,
The chip resistor according to claim 1, wherein the cover coat and the raised portion are formed of the same material. Preparing a strip-shaped insulating substrate having a groove extending in one direction on the upper surface;
Forming a plurality of upper surface electrodes on the upper surface of both end portions in one direction of the strip-shaped insulating substrate;
Forming a plurality of resistors extending in one direction so as to be in contact with the upper surface electrode on the upper surface of the strip-shaped insulating substrate;
Forming a plurality of raised portions on the groove;
Forming each side electrode by bringing both side surfaces in the one direction of the strip-shaped insulating substrate into contact with an electrode material;
A method of manufacturing a chip resistor, comprising: dividing the strip-like insulating substrate along the groove so that each has the upper surface electrode, the resistor, the raised portion, and the side electrode. Further comprising a step of forming a cover coat so as to cover the resistor,
The method for manufacturing a chip resistor according to claim 9, wherein the cover coat and the raised portion are formed simultaneously.

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