JP2013107203A5 - - Google Patents

Description

In order to achieve such an object, a polishing apparatus according to the present invention includes a holding mechanism that holds an object to be polished, and a polishing member that polishes the object to be polished held by the holding mechanism. In the polishing apparatus configured to perform polishing processing of the object to be polished by moving the polishing member in contact with the surface to be polished of the object to be held, the polishing surface and the polishing member A flow meter for measuring the flow rate of the polishing liquid supplied to the contact portion with the light, a light detection unit for detecting reflected light from the surface to be polished irradiated with probe light , and the flow meter measured by the flow meter based on said reflected light information flow and is detected in the light detecting portion of the polishing solution, the formed and a supply determination section determines the supply state of the polishing liquid to abutment.

Claims (9)

A holding mechanism for holding an object to be polished; and a polishing member for polishing the object to be polished held by the holding mechanism; and the polishing member is disposed on a surface to be polished of the object to be polished held by the holding mechanism. In a polishing apparatus configured to perform a polishing process of the object to be polished by moving relatively while abutting,
A flow meter for measuring a flow rate of a polishing liquid supplied to a contact portion between the surface to be polished and the polishing member ;
A light detection unit for detecting reflected light from the surface to be polished irradiated with probe light ;
On the basis of the information of said detected reflected light to the flow rate and the light detecting portion of the polishing liquid which has been measured by the flow meter, and a supply determination section determines the supply state of the polishing liquid to said contact portion A polishing apparatus characterized by comprising. When the time from when the supply of the polishing liquid starts until the light amount of the reflected light detected by the light detection unit decreases below a predetermined set light amount is longer than a predetermined set time, The polishing apparatus according to claim 1, wherein the polishing apparatus determines that the supply amount of the polishing liquid to the contact portion is insufficient. The supply determination unit is arranged on the light detection unit when the polishing liquid is supplied to the contact part with respect to the amount of the reflected light detected by the light detection unit before the supply of the polishing liquid is started. 3. The method according to claim 1, wherein when the detected decrease amount of the reflected light is smaller than a predetermined set amount, the supply amount of the polishing liquid to the contact portion is determined to be insufficient. The polishing apparatus according to 1. The supply determination unit determines that the supply amount of the polishing liquid to the contact portion is insufficient when the amount of the reflected light detected by the light detection unit exceeds a predetermined reference light amount. The polishing apparatus according to any one of claims 1 to 3 . A polishing process control unit configured to perform control to stop the polishing process of the object to be polished when the supply determination unit determines that the supply amount of the polishing liquid to the contact part is insufficient. The polishing apparatus according to any one of claims 1 to 4, wherein 6. The apparatus according to claim 1, further comprising an end point detection unit that detects an end point of the polishing process based on information of the reflected light detected by the light detection unit. Polishing equipment. The polishing apparatus according to claim 1, further comprising a polishing liquid supply mechanism that supplies a polishing liquid to a contact portion between the surface to be polished and the polishing member. The polishing apparatus according to claim 1, further comprising an illumination unit that irradiates the surface to be polished with probe light. The polishing apparatus according to claim 1, further comprising an air supply unit that blows an air flow at a position of the surface to be polished to which the probe light is irradiated.