JP2013105805A - Print inspection device and print inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a print inspection device and a print inspection method capable of increasing the total quality management and productivity by reasonably balancing the relation between the accuracy of detection of defect as a target of print inspection and the maintenance of the facility operation rate.SOLUTION: In a print inspection process of a board after solder printing, when a defect such as too-large print area on specific components such as a CSP component which are difficult to be repaired is detected, a mounting work prohibition command C1 is read out from a piece of work command selection data 44d and is output to an electronic component mounting device to prohibit the mounting work of the electronic component to the print position. The defective electronic component is re-flown and manually repaired. With this, ordinary work can be continued on the other components excluding the specific components which are difficult to be repaired without suspension of equipment.

Description

  The present invention relates to a printing inspection apparatus and a printing inspection for inspecting a printing state of a solder paste printed on an electrode for electronic component bonding in an electronic component mounting system for manufacturing a mounting substrate by mounting electronic components on a substrate by solder bonding. It is about the method.

  An electronic component mounting system for manufacturing a mounting substrate by mounting electronic components on a substrate by solder bonding includes a printing device for printing solder for component bonding, a printing inspection device for inspecting the printed state of solder on the printed substrate, and solder A plurality of electronic component mounting devices such as an electronic component mounting device for mounting electronic components on a printed circuit board are connected. In such an electronic component mounting system, for the purpose of managing the mounting quality with high reliability, a printing inspection for inspecting the printing state of the solder is performed (for example, see Patent Document 1). In the example shown in Patent Document 1, a print inspection is performed by recognizing an image of a metal mask or a substrate by moving a line sensor together with a print head in a solder printing apparatus. In addition, a configuration in which a dedicated print inspection device that is independent from the printing device is provided on the downstream side of the printing device is also widely used.

JP-A-7-040526

  However, in the prior art, including the above-mentioned patent document examples, how to assume the balance between the defect detection aspect intended for the print inspection and the equipment operation rate required at the production site of electronic component mounting There is no clear guideline, and it was difficult to maintain productivity and maintain productivity while ensuring the final product quality. That is, in the detection of the printing state in the print inspection, the quality is determined by detecting the printing area and printing position of the solder and comparing the detection result with the determination reference value.

  For example, if the print area is out of the upper and lower limit range of the determination reference value, a failure determination is made. At this time, if the printing area is smaller than the lower limit, after performing a coping operation such as mask cleaning, overprinting is performed again to execute the printing operation on the same substrate, and the situation where the printing apparatus stops operating is reached. Absent. However, when the printing area is larger than the upper limit, there is a high risk of causing defects due to excessive solder in the subsequent process, so printing is performed by a feedback signal from the print inspection apparatus to prevent the board from being carried into the subsequent process. The operation of the device was stopped.

  This operation stop state is continued until the restart operation is performed after the operator who has received the notification of the operation stop performs the appropriate coping work. For this reason, when the operator does not take a timely action, the operation stop state of the printing apparatus continues for a long time, and as a result, the devices on the downstream side also stop operating sequentially, and the electronic component mounting system As a result, the overall capacity utilization rate declined, preventing improvement in productivity. As described above, in the conventional print inspection apparatus, the relationship between the accuracy of defect detection intended for the print inspection and the maintenance of the equipment operation rate is reasonably balanced to improve the total quality control and productivity. There was a problem that it was difficult.

  Accordingly, the present invention provides a printing inspection apparatus capable of realizing a total balance between quality control and productivity by rationally balancing the relationship between the accuracy of defect detection intended for printing inspection and the maintenance of equipment operation rate. It is another object of the present invention to provide a printing inspection method.

  The printing inspection apparatus according to the present invention is an electronic component mounting system configured by connecting a plurality of electronic component mounting devices and mounting the electronic components on a substrate by solder bonding to manufacture a mounting substrate. Based on the detection result of detecting the printing state including at least the printing area and the printing position of the solder paste printed on the component bonding electrode, a determination process is executed for a predetermined determination item, and based on the determination result of the determination process A print inspection apparatus that outputs a derived work command to the electronic component mounting apparatus defined in advance according to the determination result, based on image data obtained by imaging the board on which the solder paste is printed A printing state detection processing unit for detecting a printing state and outputting the detection result; and a determination criterion data stored in advance for each of the determination items. A determination processing unit that executes the determination process by comparing with the data, and a work command derivation processing unit that derives the work command by comparing the determination result of the determination process with work command selection data stored in advance. And the work command selection data includes the electronic component mounting system in the case where a failure determination is made for a specific determination item specified in advance for a print site corresponding to the specific electronic component specified in advance. A mounting prohibition command is output that is output to the electronic component mounting apparatus, and instructs to prohibit execution of the mounting operation of the electronic component on the print site.

  The printing inspection method of the present invention is an electronic component mounting system configured by connecting a plurality of electronic component mounting apparatuses and mounting the electronic components on a substrate by solder bonding to manufacture a mounting substrate. Based on the detection result of detecting the printing state including at least the printing area and the printing position of the solder paste printed on the component bonding electrode, a determination process is executed for a predetermined determination item, and based on the determination result of the determination process A print inspection method for outputting a derived work command to the electronic component mounting apparatus defined in advance according to the determination result, based on image data obtained by imaging a board on which the solder paste is printed A printing state detection step of detecting a printing state and outputting the detection result; and a step of comparing the detection result with determination criterion data stored in advance for each of the determination items. A determination step for executing the determination process, and a work command derivation step for deriving the work command by comparing a determination result of the determination process with work command selection data stored in advance. When a failure determination is made for a specific determination item specified in advance for a print site corresponding to a specific electronic component specified in advance in the step, the electronic command among the work commands included in the work command selection data A mounting prohibition command for instructing prohibition of the execution of the mounting operation of the component on the print site is derived and output to the electronic component mounting apparatus.

  According to the present invention, when a failure determination is made with respect to a specific determination item for a specific electronic component that is defined in advance, among the work commands included in the work command selection data, By deriving a mounting prohibition command for instructing prohibition of mounting work and outputting it to the electronic component mounting device, other electronic components excluding specific electronic components that are difficult to repair work normally. It is possible to continue and rationally balance the relationship between the accuracy of defect detection intended for the print inspection and the maintenance of the equipment operation rate, thereby realizing total quality control and productivity improvement.

The top view of the electronic component mounting system of one embodiment of this invention The block diagram which shows the structure of the control system of the electronic component mounting system of one embodiment of this invention Explanatory drawing of the data for the determination and work command memorize | stored in the printing inspection apparatus of one embodiment of this invention The flowchart which shows the electronic component mounting process of one embodiment of this invention FIG. 3 is a flowchart of print inspection processing by the print inspection apparatus according to the embodiment of the present invention. The flowchart of the processing work based on the work command in the electronic component mounting method of one embodiment of the present invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the configuration of the electronic component mounting system 1 will be described with reference to FIG. The electronic component mounting system 1 has a function of mounting electronic components on a substrate by solder bonding to manufacture a mounting substrate, and is configured by connecting a plurality of electronic component mounting devices in series. Here, the printing device M1, the printing inspection device M2, and the electronic component mounting device M3 are connected in series, and a reflow device (not shown) for melting solder is connected to the downstream side of the electronic component mounting device M3. Has been.

  Hereinafter, the configuration of each apparatus will be described. The printing apparatus M1 has a function of printing a solder paste on an electrode for joining electronic components formed on a substrate 4 to be mounted. Substrate transport for transporting the substrate 4 in the substrate transport direction on the upper surface of the base 2 A substrate positioning unit 5 that positions and holds the mechanism 3 and the transported substrate 4 is disposed. A mask plate 15 extended on the mask frame 14 is disposed above the substrate positioning unit 5, and a squeegee unit 13 held by the moving beam 12 is disposed above the mask plate 15 by the Y-axis table 11. A screen printing unit 36 (see FIG. 2) configured to be driven horizontally is disposed.

  The upper surface of the mask plate 15 supplied from the upstream side (arrow a) and brought into contact with the lower surface of the mask plate 15 by the substrate positioning portion 5 and driving the Y-axis table 11 to supply the solder paste. Then, by sliding the squeegee unit 13, solder paste is printed on the component connection electrodes formed on the substrate 4 through the pattern holes provided in the mask plate 15. Further, the printing apparatus M1 is provided with a mask cleaning mechanism 16, and screen printing is performed by causing a cleaning head (not shown) provided in the mask cleaning mechanism 16 to slide on the lower surface of the mask plate 15. The solder paste adhered to the lower surface of the mask plate 15 in the process of repeatedly executing is wiped off by the cleaning sheet.

  The print inspection apparatus M2 has a function of receiving the substrate 4 after the printing operation is executed by the printing apparatus M1 and performing a print inspection for detecting the printing state of the solder paste printed on the substrate 4. On the upper surface of the base 2 of the printing inspection apparatus M2, a substrate transport mechanism 3 and a substrate positioning unit 6 connected to the printing apparatus M1 are disposed. Further, an inspection camera 17 that is horizontally moved by a camera moving mechanism including a Y-axis table 11 and a moving beam 18 is disposed above the substrate positioning unit 6. By driving the camera moving mechanism, the camera 17 moves in the horizontal direction above the substrate 4 and images an arbitrary position of the substrate 4. Then, the imaging result is recognized by the recognition processing unit 43 (see FIG. 2), and the recognition processing result is detected by the printing state detection processing unit 45, whereby the print inspection is executed.

  In this print inspection, a determination process is executed for a predetermined determination item based on a detection result of detecting a print state including at least a print area and a print position deviation amount, and the determination is performed based on the determination result of the determination process. It has a function of outputting a work command to an electronic component mounting apparatus defined in advance according to the determination result. Further, in the print inspection apparatus M2, misregistration amount data indicating the misregistration state from the normal position of the solder paste printing position on the board is created and stored for each individual board 4 along with the result of determining whether the printing state is good or bad. . The positional deviation amount data is transmitted to the downstream electronic component mounting apparatus M3, and the electronic component mounting apparatus M3 mounts the component when mounting the electronic component on the board 4 based on the solder positional deviation amount data. Position correction is performed.

  A configuration of the electronic component mounting apparatus M3 will be described. A substrate transport mechanism 19 is disposed in the center of the base 20 in the substrate transport direction (X direction). The substrate transport mechanism 19 transports the substrate 4 delivered from the print inspection apparatus M2, and positions the substrate 4 on a mounting stage for performing component mounting work by a component mounting mechanism 55 (see FIG. 2) described below. Component supply units 23A and 23B are provided outside the substrate transport mechanism 19, and a plurality of tape feeders 24 are arranged in parallel in the component supply units 23A and 23B. The tape feeder 24 feeds the electronic component to the component pickup position by pitch-feeding the carrier tape holding the electronic component mounted on the substrate 4.

  A Y-axis movement table 21 is disposed at the end of the base 20 on the X direction side. The two X-axis movement tables 22A and 22B coupled to the Y-axis movement table 21 are respectively mounted with a mounting head 25A. , 25B. The mounting heads 25A and 25B include a plurality of unit mounting heads, and hold electronic components by vacuum suction using suction nozzles mounted on the unit mounting heads.

  By driving the Y-axis movement table 21 and the X-axis movement tables 22A and 22B, the mounting heads 25A and 25B move horizontally in the X direction and the Y direction. Thereby, the mounting heads 25A and 25B suck and take out the electronic components from the tape feeders 24 of the component supply units 23A and 23B, respectively, and transfer and mount them on the substrate 4 positioned on the mounting stage of the substrate transport mechanism 19. The Y-axis movement table 21, the X-axis movement tables 22A and 22B, and the mounting heads 25A and 25B pick up electronic components from the component supply units 23A and 23B, and solder is applied based on the inspection result data transmitted from the print inspection apparatus M2. A component mounting mechanism 55 to be mounted on the printed board 4 is configured.

  Component recognition cameras 26A and 26B are provided on the movement paths of the mounting heads 25A and 25B, and the mounting heads 25A and 25B holding electronic components move above the component recognition cameras 26A and 26B, thereby The recognition cameras 26A and 26B capture and recognize the electronic components held by the mounting heads 25A and 25B from below.

  Next, the configuration of the control system of the electronic component mounting system 1 will be described with reference to FIG. In FIG. 2, a printing apparatus M 1, a print inspection apparatus M 2, and an electronic component mounting apparatus M 3 are connected to each other via a LAN line 30, and the LAN line 30 is further connected to a management computer 31. The management computer 31 manages the overall operation of the electronic component mounting system 1.

  The printing apparatus M1 includes a communication unit 32, a print control unit 33, a print data storage unit 34, and a mechanism drive unit 35. The communication unit 32 exchanges signals with the management computer 31 and other devices via the LAN line 30. The print control unit 33 controls a printing operation by the printing apparatus M1 based on a control signal received via the communication unit 32. The print data storage unit 34 stores print data necessary for execution of the printing work for each substrate type. The mechanism driving unit 35 is controlled by the print control unit 33 to control the substrate transport mechanism 3, the substrate positioning unit 5, the screen printing unit 36, and the mask cleaning mechanism 16.

  The print inspection apparatus M2 includes a communication unit 41, an inspection control unit 42, a recognition processing unit 43, a storage unit 44, a print state detection processing unit 45, a determination processing unit 46, a work command derivation processing unit 47, an operation / input unit 48, a display. A portion 49 is provided. The communication unit 41 exchanges signals with the management computer 31 and other devices via the LAN line 30. The inspection control unit 42 controls the print inspection work executed by the print inspection apparatus M2. The recognition processing unit 43 performs recognition processing on the printed image of the substrate 4 captured by the camera 17.

  The storage unit 44 stores specific part data 44a, determination item data 44b, determination reference data 44c, and work command selection data 44d, in addition to an inspection program and inspection result data indicating an inspection result necessary for executing a print inspection. . Here, each of these data will be described with reference to FIG. The specific component data 44a is data indicating a specific component that is defined in advance as an electronic component that should be handled differently from other components in a component mounting operation performed in response to a print inspection and a print inspection result by the print inspection apparatus M2. is there.

  Here, Pa (CSP: chip size package) and Pb (FPC: flexible printed circuit board) are exemplified. Each of these electronic components has a characteristic that the degree of difficulty in repair work after soldering by reflow is high. Further, Pc (chip component, lead component) has a characteristic that repair work after soldering can be performed relatively easily. In the present embodiment, component mounting / reflow is performed on the printed part corresponding to the specific electronic component specified in advance on the substrate 4 while maintaining the specified specific determination item, for example, an excessive print area. When a defect is determined for a determination item that requires a difficult repair operation to be performed, the repair operation is easily and efficiently performed, and the overall device operation rate of the electronic component mounting system 1 is minimized. It is defined from the viewpoint of maintaining.

The determination item data 44b and the determination reference data 44c indicate data on items to be determined in the print inspection and threshold values that are determination criteria. Here FIG. 3 (b) (i) "Print area under-" printing area A of the printed solder paste S the electrode 4a as the target indicates that less than the lower limit value A _L of the provisions shown in (so-called "blurring" On the contrary, “print area excessive” (so-called “smear”) indicating that the print area A of the printed solder paste S is larger than the prescribed upper limit value A _U is exemplified. Further, FIG. 3 (b) positional deviation amount D to the electrode 4b of the printed solder paste S shown in (b) is, the allowable range D indicate exceeding _U "position shift out of tolerance" is the judgment items ing.

  The work command selection data 44d is data that predefines a work command that is selected according to the inspection result of the print inspection performed by the print inspection apparatus M2. That is, four types of work instructions described below are defined in advance in accordance with the combination of (component type) and (determination item, determination result) of the electronic component to be inspected.

  First, the mounting work prohibition command C1 is determined when a defect determination (excessive print area) is made with respect to (CSP part), which is a specific part preliminarily specified in the specific part data 44a, or similarly specified in advance. When it is determined that the component (FPC component) is (outside the allowable range of displacement), it is output to the electronic component mounting apparatus M3. Since all of these electronic components are difficult to repair after soldering, in the case of such a printing defect, mounting of the electronic component on the printed part where the defect is determined is prohibited. The substrate 4 is manually mounted by the operator after the reflow process.

  Next, the printing operation continuation command C2 is output to the printing apparatus M1 when a failure determination (too small printing area) is made for any one of all the component types. In this case, after the mask cleaning mechanism 16 is driven and the mask cleaning is executed in the printing apparatus M1, overprinting is performed to perform screen printing on the substrate 4 again.

  Next, the printing work stop command C3 is output to the printing apparatus M1 when a failure determination (excessive printing area) is made for any one of all the component types. In this case, the printing apparatus M1 stops the printing operation, notifies that, and enters a standby state until the operator takes action in response to the notification. The mounting operation execution command C4 is an electronic component mounting apparatus when any failure determination is made on a specific component that is preliminarily specified as repair after solder bonding, such as a chip component and a lead component, is relatively easy. Output to M3. In this case, the electronic component mounting apparatus M3 executes the mounting operation of the electronic component on the print site that is the target of the failure determination regardless of the failure determination. And about a defective site | part, the repair which corrects a defect separately after reflow is performed.

  That is, in the work command selection data 44d, a failure is determined for a specific determination item (excessive print area) specified in advance for a print site corresponding to a specific electronic component specified in advance, such as a CSP component or an FPC component. In this case, there is included a mounting work prohibition command C1 that is output to the electronic component mounting apparatus M3 and instructs the execution prohibition of the mounting operation of the electronic component on the print site.

  Further, in the work command selection data 44d, when a failure determination (print area is too small) is made for a specific determination item defined in advance for a printing part corresponding to any electronic component, the printing apparatus M1 is notified. Print job continuation command C2 for instructing to continue the print job after executing a predetermined coping operation (mask cleaning) corresponding to the content of the defect determination that is output, specified for the print site corresponding to one of the electronic components When a defect determination (excessive printing area) is made with respect to the determination item, a printing work stop command C3 that is output to the printing apparatus M1 and instructs to stop the printing work by the printing apparatus M1, a chip part, a lead part, etc. When a defect determination is made for any one of the determination items for a print site corresponding to a predetermined specific component, the electronic component mounting apparatus M3 And is output, includes a mounting operation execution command C4 that directs the execution of the mounting operation to the print site despite defective judgment the electronic component.

  In the electronic component mounting method by the electronic component mounting system 1 shown in the present embodiment, the work commands of the mounting work prohibition command C1 to the mounting work execution command C4 are appropriately selected and used properly. As a method for properly using the print job, the print job continuation command C2 may be applied to any type of component without any problem. Therefore, the print job continuation command C2 may be fixedly applied. The other mounting work prohibition command C1, printing work stop command C3, and mounting work execution command C4 are appropriately selected and applied. For example, when a CSP part or FPC part as a specific part is frequently targeted, only the mounting work prohibition command C1 and the printing work continuation command C2 are always fixed and applied. Thereby, repair work with high difficulty can be avoided. Further, every time the part type is changed by switching the production lot, one of the mounting work prohibition command C1, the printing work stop command C3, and the mounting work execution command C4 may be selected.

  The print state detection processing unit 45 detects a print state based on image data obtained by imaging the substrate 4 on which the solder paste is printed, and outputs a detection result. The determination processing unit 46 performs a determination process for a predetermined determination item by comparing the output detection result with the determination reference data 44c stored in advance in the storage unit 44 for each determination item. The work command derivation processing unit 47 compares the determination result obtained by the determination processing unit 46 with the work command selection data 44d stored in the storage unit 44 in advance, so that the printing device M1 and the electronic component mounting device M3 correspond to the determination result. A work command to be commanded is derived.

  The operation / input unit 48 is an input means such as a touch panel or a keyboard, and performs input processing for instructing the above-described work command selection mode in addition to input of operation commands and various data at the time of inspection execution. The display unit 49 is a display panel such as a liquid crystal panel, and displays an image acquired by the camera 17 and a guidance screen at the time of input by the mask cleaning mechanism 16. Therefore, the operation / input unit 48 and the display unit 49 become work command selection instruction means for instructing in advance which of the mounting work prohibition command C1, the printing work stop command C3, and the mounting work execution command C4 should be adopted. ing.

  The electronic component mounting apparatus M3 includes a communication unit 51, a mounting control unit 52, a mounting data storage unit 53, a mechanism driving unit 54, and a conveyance processing unit 56, respectively. The communication unit 51 exchanges signals with other devices and the management computer 31 via the LAN line 30. The mounting control unit 52 controls component mounting work by the electronic component mounting apparatus M3. The mounting data storage unit 53 stores data necessary for component mounting work for each board type. The mechanism driving unit 54 is controlled by the mounting control unit 52 to drive the substrate transport mechanism 19 and the component mounting mechanism 55.

  Next, an electronic component mounting method in which an electronic component is solder-bonded to the substrate 4 by the electronic component mounting system 1 including the printing apparatus M1, the print inspection apparatus M2, and the electronic component mounting apparatus M3 having the above-described configuration will be described with reference to FIGS. This will be described with reference to the flow. First, as shown in FIG. 4, the operation / input unit 48 is operated in the print inspection apparatus M2 to instruct the above-described work command selection mode (ST1). Here, which of the three work commands other than the fixedly applied print job continuation command C2 is selected is input. That is, the loading operation prohibition command C1 is applied by selecting the first selection mode, the loading operation execution command C4 is applied by selecting the second selection mode, and the printing operation is stopped by selecting the third selection mode. Command C3 is applied.

  Next, screen printing for the substrate 4 is executed by the printing apparatus M1 (ST2). Then, the substrate 4 after the screen printing is carried into the printing inspection apparatus M2, where the printing inspection is performed (ST3). Next, the substrate 4 after the print inspection is carried into the electronic component mounting apparatus M3, and the electronic component is mounted on the substrate 4 (ST4). The substrate 4 after mounting the components is sent to a reflow apparatus (not shown) (ST5), where it is heated to be soldered. Thereafter, post-treatment work such as supplementary mounting of unmounted components and repair of defective mounting components is performed (ST6).

  Here, the printing inspection process shown in the above (ST3) will be described with reference to FIG. First, the printed substrate 4 is imaged by the camera 17 to acquire image data (ST11). Next, the printing state of the solder paste S on the substrate 4 is detected based on the acquired image data, and the detection result is output (ST11) (printing state detection step). Here, the printing area A of the solder paste S and the printing position deviation amount D are detected.

  Next, a determination process for determining the presence / absence of a defect for each determination item is executed by comparing the detection result with the determination reference data 44c stored in advance for each determination item (ST13) (determination step). Then, by comparing these determination results with the work command selection data 44d stored in advance, a work command to be output to the printing device M1 and the electronic component mounting device M3 is derived (ST14) (work command deriving step). . The derived work command is output to each corresponding device (ST15).

  FIG. 6 shows processing executed based on such a work command. At this time, the process to be executed differs according to the selection mode selected in (ST1). That is, the selection mode designated in advance is determined (ST20), and if the first mode is selected, the mounting work prohibition command C1 is applied. Here, a defect determination is made for specific determination items (excessive print area, out of tolerance of misalignment) with respect to print parts corresponding to CSP parts and FPC parts which are specific electronic parts defined in advance in (determination step). Is performed, a mounting work prohibition command C1 among the work commands included in the work command selection data 44d is derived and output to the electronic component mounting device M3. As a result, the operation of mounting the specific component on the defective printing portion where the defectiveness determination has been made is prohibited (ST21). Then, the substrate 4 is sent to the reflow without mounting the specific parts corresponding to the print defect sites (ST22), and thereafter, the specific parts not mounted are replenished and mounted by hand (ST23).

  If the second mode is selected in (ST20), the mounting work execution command C4 is applied. That is, if any defect determination is made for a printed part corresponding to a chip part or lead part which is a specific electronic part defined in advance in (determination step), it is included in the work command selection data 44d. The mounting work execution command C4 is derived from the work commands to be output and output to the electronic component mounting device M3. As a result, a specific component mounting operation such as a chip component or a lead component is performed on a defective print portion regardless of the failure determination (ST24). Then, the substrate 4 is sent to the reflow in a state where the specific parts corresponding to these defective printing parts are mounted (ST25), and thereafter, the defective parts corresponding to the defective printing parts are repaired (ST26). In this repair work, since the object is a chip part or the like, the work can be easily executed.

  If the third mode is selected in (ST20), the printing work stop command C3 is applied. That is, in the case where (printing area excessive) defect determination is made for any electronic component in (determination step), the print work stop command C3 is derived from the work commands included in the work command selection data 44d. And output to the printing apparatus M1. As a result, the printing apparatus M1 stops the printing operation (ST27), and notifies that (ST28). Then, a predetermined coping operation is executed by the operator who has received this notification.

  Note that, when a defective print area is determined to be too small for any of the electronic components, the print job continuation command C2 is always derived from the work commands included in the work command selection data 44d and output to the printing apparatus M1. Then, after performing mask cleaning, which is a coping operation corresponding to the print area being too small, screen printing is performed again on the same substrate 4.

  As described above, in the print inspection in the electronic component mounting system shown in the present embodiment, a specific specified in advance such as an excessive print area for a specific electronic component having a high repair difficulty such as a predetermined CSP component. When a failure is determined for the determination item, a mounting work prohibition command C1 for instructing prohibition of execution of the mounting operation of the electronic component on the print site is derived from the work commands included in the work command selection data 44d. The electronic component is output to the component mounting apparatus M3, and the electronic component is replenished manually after reflow.

  As a result, it is possible to reduce work labor caused by repairing specific electronic components such as CSP components and FPC components, which are difficult to repair after soldering, and to the same components that are unavoidable for repair operations. It is possible to stabilize the mounting quality by eliminating thermal damage caused by repeated heating multiple times. Furthermore, with respect to other electronic components other than these specific electronic components, the printing work arrow component mounting operation can be continued as usual without causing the device to stop, and the accuracy and equipment of defect detection intended for the print inspection It is possible to achieve a total balance between quality control and productivity by rationally balancing the relationship with maintenance of availability.

  Further, the work command selection data 44d includes the above-described print work continuation command C2, print work stop command C3, and mounting work execution command C4, and according to the work command selection instruction instructed prior to the work command derivation step, By selectively adopting one of the prohibition command C1, the printing work stop command C3, and the mounting work execution command C4, characteristics of the substrate, electronic components, solder joint material, etc. used in the target product, and the product are required. It is possible to realize a flexible and appropriate production method according to the mounting quality level.

  The print inspection apparatus and the print inspection method of the present invention achieve a total balance between quality control and productivity by rationally balancing the relationship between the accuracy of defect detection and the maintenance of equipment operation rate, which are the objectives of print inspection. This is advantageous in that it can be used, and is useful in the field of manufacturing a mounting substrate by connecting a plurality of electronic component mounting apparatuses to each other and mounting the electronic component on the substrate by solder bonding.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting system 4 Board | substrate 4a, 4b Electrode 17 Camera 23A, 23B Component supply part 25A, 25B Mounting head M1 Printing apparatus M2 Printing inspection apparatus M3 Electronic component mounting apparatus

Claims (6)

In an electronic component mounting system that is configured by connecting a plurality of electronic component mounting apparatuses and mounting the electronic components on the substrate by solder bonding, and printed on the electrodes for bonding the electronic components formed on the substrate. A determination process is performed for a predetermined determination item based on a detection result of detecting a printing state including at least a printing area and a printing position of the solder paste, and a work command derived based on the determination result of the determination process is determined based on the determination result. A printing inspection apparatus that outputs to the electronic component mounting apparatus defined in advance according to a result,
A printing state detection processing unit that detects a printing state based on image data obtained by imaging the substrate on which the solder paste is printed and outputs the detection result;
A determination processing unit that executes the determination process by comparing the detection result of the determination process with the determination reference data stored in advance for each determination item;
A work command derivation processing unit for deriving the work command by comparing the determination result of the determination process with work command selection data stored in advance;
The work command selection data includes an electronic component mounting of the electronic component mounting system in the case where a failure determination is made for a specific determination item specified in advance for a print region corresponding to the specific electronic component specified in advance. A printing inspection apparatus, comprising: a mounting prohibition command that is output to the apparatus and commands to prohibit execution of a mounting operation of the electronic component on the printing site.   The work command selection data is output to the printing apparatus of the electronic component mounting system when a failure determination is made for a specific determination item defined in advance for a printing region corresponding to any electronic component. 2. The print inspection apparatus according to claim 1, further comprising: a print work continuation command for instructing continuation of the print work after executing a predetermined coping work corresponding to the content of the defect determination. Further, the work command selection data is output to the printing apparatus when a failure determination is made for a specific determination item defined in advance for a printing region corresponding to any electronic component, and the printing apparatus In response to a print job stop command for instructing a stop of the print job according to the above, and when a defect determination is made for any of the determination items with respect to a print portion corresponding to a predetermined specific electronic component, the electronic component mounting device And a mounting work execution command for instructing execution of mounting work on the printed part of the electronic component in spite of the defect determination,
3. A work command selection instruction means for instructing in advance which of the mounting prohibition command, the printing work stop command, and the mounting work execution command should be selectively employed. Printing inspection equipment. In an electronic component mounting system that is configured by connecting a plurality of electronic component mounting apparatuses and mounting the electronic components on the substrate by solder bonding, and printed on the electrodes for bonding the electronic components formed on the substrate. A determination process is performed for a predetermined determination item based on a detection result of detecting a printing state including at least a printing area and a printing position of the solder paste, and a work command derived based on the determination result of the determination process is determined based on the determination result. A printing inspection method for outputting to the electronic component mounting apparatus defined in advance according to a result,
A printing state detection step of detecting a printing state based on image data obtained by imaging the board on which the solder paste is printed and outputting the detection result;
A determination step of executing the determination process by comparing the detection result with determination criterion data stored in advance for each determination item;
A work command derivation step for deriving the work command by comparing the determination result of the determination process with work command selection data stored in advance,
Of the work commands included in the work command selection data, when a failure determination is made for a specific determination item specified in advance for a print site corresponding to a specific electronic component specified in the determination step A printing inspection method, comprising: deriving a mounting prohibition command for instructing execution prohibition of mounting operation of the electronic component on the print site and outputting the command to the electronic component mounting apparatus.   In a case where a failure determination is made for a specific determination item defined in advance for a print site corresponding to any electronic component in the determination step, a predetermined coping operation corresponding to the content of the failure determination is performed. The printing inspection method according to claim 4, wherein a printing work continuation command for instructing continuation of the printing work is output to the printing apparatus later. The work command selection data is output to the printing apparatus when a defect determination is made for any one of the determination items for a print site corresponding to any electronic component, and the print operation of the printing apparatus is performed. When a failure determination is made for any of the determination items with respect to a print work stop command for instructing a stop and a print portion corresponding to a predetermined specific electronic component, the electronic component mounting apparatus is output, A mounting operation execution command for instructing execution of the mounting operation of the electronic component on the print site in spite of the defect determination;
5. The apparatus according to claim 4, wherein any one of the mounting prohibition command, the printing work stop command, and the mounting work execution command is selectively adopted in accordance with a work command selection instruction instructed prior to the work command derivation step. The printing inspection method according to any one of 5.

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