JP2013102015A - Electronic device and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain means which reduces an electronic device in size, in height and in cost.SOLUTION: The electronic device is provided with a first electronic element 20 and an insulating substrate 11 which mounts the first electronic element 20 thereto. The insulating substrate 11 is provided with mounting terminals 13 on other principal surface while having electrode pads 12 which mount the first electronic element 20 thereto on one principal surface. Terminals provided on the first electronic element 20 and the electrode pads 12 are conductively connected to one another via connecting conductive members 15.

Description

  The present invention relates to an electronic device and an electronic apparatus, and more particularly to an improvement in a structure for supporting and fixing an electronic element in a container of the electronic device.

Piezoelectric vibrators, particularly AT-cut quartz vibrators, have a cubic curve with a vibration mode of thickness shear vibration, suitable for miniaturization and high frequency, and excellent frequency temperature characteristics. Used in. In recent years, there is a strong demand for further downsizing and lowering the height of piezoelectric vibrators.
Patent Document 1 discloses a surface-mount piezoelectric device with improved impact resistance. A surface-mount type piezoelectric device includes a crystal resonator element, a container having a recess for housing the crystal resonator element, and an end surface at the upper end of the container, that is, a lid body that seals the end surface on the opening side of the container. ing. The quartz resonator element includes a strip-shaped AT-cut quartz substrate, an excitation electrode disposed substantially at the center of both main surfaces of the quartz substrate, and a lead extending from each excitation electrode to one end in the longitudinal direction of the quartz substrate. And an electrode. The surface mount type piezoelectric device is supported in a cantilever state by means of a conductive adhesive on an electrode pad formed on the inner bottom surface of the concave portion of the container with one end in the longitudinal direction of the crystal resonator element, The end face is hermetically sealed with a lid. The electrode pad is composed of a flat portion and a projecting portion, and it is disclosed that the adhesive strength between the crystal resonator element and the electrode pad is improved by applying a conductive adhesive to the electrode pad. An embodiment is also disclosed in which the electrode pad is flattened, a conductive adhesive including a small spherical body is applied on the upper surface thereof, and the quartz resonator element is held.

  Patent Document 2 discloses a method for manufacturing a piezoelectric vibrating piece that accurately positions the piezoelectric vibrating piece using bumps. This manufacturing method is a method of manufacturing a piezoelectric vibrating piece having an electrode forming step of integrally forming electrode pads on the front and back surfaces of the base portion of the piezoelectric body and the excitation electrode of the vibrating portion of the piezoelectric body. The electrode pad and the excitation electrode each have a base layer such as chromium or nickel and a gold layer on the surface layer side of the base layer. On the electrode pad, a thicker gold layer is formed on the surface gold layer. Further, a gold layer serving as a weight is formed on the excitation electrode near the tip of the vibration part, and this film formation is used for adjusting the frequency of the piezoelectric vibrating piece. By thickening the gold layer of the electrode pad, it is possible to prevent the bump from reaching the base layer when bonding to the connection electrode of the package using the bump, so that the possibility of peeling of the joint portion can be greatly reduced. Are disclosed.

JP 2005-117092 A JP 2007-96899 A

However, when the means disclosed in Patent Document 1 is used, the impact resistance is improved, but it is difficult to accurately position and support the crystal vibrating element with respect to a predetermined position of the container, which causes a problem in miniaturization of the piezoelectric device. was there. Further, as disclosed in Patent Document 2, when the piezoelectric vibrating piece is bonded to the connection electrode of the package using the gold bump, the shape of the gold bump changes depending on the pressure, time, and the like to be applied. There is a problem that it is difficult to accurately support the at a predetermined height.
The present invention has been made to solve the above problem, and it is an object of the present invention to provide a small and low-profile electronic device that accurately supports a first electronic element at a predetermined position of an insulating substrate.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 An electronic device according to the present invention includes an electronic element having a terminal, an insulating substrate having an electrode pad for mounting the electronic element on one main surface, the terminal, and the electrode pad. A metal lump that is electrically connected to each other.

  According to this configuration, a predetermined space is provided between the insulating substrate and the electronic element to support the electronic element, and the terminal of the electronic element and the electrode pad of the insulating substrate are electrically connected by the metal block. For this reason, it is possible to reduce the size and height, and it is possible to form a wiring circuit on the surface of the insulating substrate facing the electronic element.

  Application Example 2 The electronic device according to Application Example 1, wherein the electronic device is a vibration element.

  According to this configuration, a predetermined space is provided between the insulating substrate and the vibration element is supported, and the vibration element and the electrode pad of the insulating substrate are electrically connected to each other by the metal block, thereby reducing the size and the height. This has the effect that an electronic device can be configured.

[Application Example 3] The electronic device according to Application Example 1 or 2, wherein in the electronic device, the metal block is a metal ball partially accommodated in a concave portion of the terminal. It is.

  According to this configuration, a metal lump, that is, a metal ball (connecting conductive member) is fitted into the recess formed in the piezoelectric substrate, and the metal ball (connecting conductive member) is formed on the electrode pad formed on the insulating substrate. Since fixing is performed using conductive adhesion or the like, the piezoelectric substrate can be accurately fixed to a predetermined position on the insulating substrate, so that there is an effect that a small and low-profile electronic device can be obtained.

  Application Example 4 In the electronic device according to Application Example 1 or 2, in the electronic device, the metal lump is a metal ball partially accommodated in a through hole of the terminal. It is a device.

  According to this configuration, a part of the metal ball (connecting conductive member) is fitted into the through-hole formed in the piezoelectric substrate, and the metal ball (connecting conductive member) is conductive to the electrode pad formed on the insulating substrate. Since the piezoelectric substrate can be fixed to a predetermined position on the insulating substrate with high accuracy by using adhesive bonding or the like, there is an effect that a small and low-profile electronic device can be obtained.

  Application Example 5 According to Application Example 1 or 2, in the electronic device, the metal lump is a metal ball that is at least partially bonded to a side wall of a protruding portion of the terminal. It is an electronic device of description.

  According to this configuration, a metal ball (connecting conductive member) is brought into contact with the protrusion formed on the piezoelectric substrate, and conductive adhesion or the like is applied to the electrode pad formed on the insulating substrate with the metal ball (connecting conductive member). Since it is used and fixed, the piezoelectric substrate can be accurately fixed to a predetermined position on the insulating substrate, so that there is an effect that a small and low-profile electronic device can be obtained.

  Application Example 6 In the electronic device, any one of Application Examples 1 to 5 is characterized in that the metal lump is a metal ball partially accommodated in a recess of the insulating substrate. The electronic device according to the item.

  According to this configuration, since the connection conductive member is fitted into both the concave portion formed in the insulating substrate and the concave portion formed in the electronic element or the piezoelectric substrate, the electronic device is configured. Since the electronic element or the piezoelectric substrate can be accurately fixed to the position, there is an effect that a small and low-profile electronic device can be obtained.

  Application Example 7 An electronic apparatus according to the present invention is an electronic apparatus including the electronic device according to any one of Application Examples 1 to 6.

  According to this configuration, when an electronic apparatus is configured using the above-described electronic device, there is an effect that an electronic apparatus having a small and stable reference frequency source can be configured.

It is the schematic which showed the structure of the electronic device 1 of embodiment which concerns on this invention, (a) is a top view, (b) is sectional drawing, (c) is a bottom view. FIG. 3 is a cross-sectional view showing the configuration of the electronic device 2. (A) is sectional drawing which showed the structure of the electronic device 3, (b) is an expanded perspective view of the back side of a 1st electronic element. (A) is sectional drawing which showed the structure of the electronic device 4, (b) is a top view of a 1st electronic element. (A) is sectional drawing of the principal part which showed the structure of the electronic device 5, (b) is a top view of the principal part of a 1st electronic element. (A) is a rear view of the principal part of a 1st electronic device on the side facing the insulating substrate, (b) is a back view of the principal part of the 1st electronic device which concerns on other embodiment. (A) is sectional drawing which shows the structure of the electronic device 6, (b) is a top view of the side (surface) facing the 1st electronic element of an insulated substrate. (A) is a top view which shows the structure of the electronic device 7, (b) is QQ sectional drawing of (a). The figure explaining a coordinate axis and a cutting angle. (A) is a top view of a piezoelectric vibration element, (b) is QQ sectional drawing of (a). (A) is the top view which showed the structure of the electronic device 8, (b) is sectional drawing of QQ of (a). (A) is the top view which showed the structure of the electronic device 9, (b) is QQ sectional drawing of (a). (A) is the top view which showed the structure of the electronic device 9a, (b) is QQ sectional drawing of (a). FIG. 10 is a schematic diagram of an electronic apparatus according to the invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic view showing the configuration of an electronic device 1 according to an embodiment of the present invention, where FIG. 1 (a) is a plan view, and FIG. 1 (b) is a longitudinal section of QQ in FIG. FIG. 2C is a plan view of the first main surface (the side facing the first electronic element 20) of the insulating substrate 11. FIG.
The electronic device 1 includes a first electronic element 20, an insulating substrate 11 on which the first electronic element 20 is mounted, a plurality of terminal electrodes of the first electronic element 20, and a plurality of electrode pads 12 on the insulating substrate 11. A plurality of metal blocks (hereinafter referred to as connecting conductive members) 15 that are fixed and conductive, respectively.
For example, the insulating substrate 11 includes a plurality of element mounting electrode pads 12 on one main surface of a rectangular ceramic substrate, and a plurality of mounting terminals 13 on the other main surface. In FIG. 1, a small number of electrode pads 12 are shown in a simplified manner. The electrode pad 12 on one main surface (front surface) and the mounting terminal 13 on the other main surface (back surface) are a via electrode that penetrates the insulating substrate 11 (a conductor in which a through-hole (via hole) is filled with a via electrode paste). 14 is conductively connected.
A terminal electrode provided on one main surface of the first electronic element 20 (a surface facing the insulating substrate 11 in the embodiment shown in FIG. 1) is formed on the surface of the insulating substrate 11 via the connecting conductive member 15. The electrode pad 12 is conductively connected.
The connecting conductive member (metal lump) 15 is thick enough to form a space (S) between the main surface of the insulating substrate 11 and the opposing surface of the first electronic element 20.

The insulating substrate 11 is formed by firing, for example, an alumina ceramic (Al ₂ O ₃ ) material, and the electrode pad 12, the mounting terminal 13, and the via electrode 14 are formed using, for example, a tungsten (W) material. The surfaces of the pads 12 and the mounting terminals 13 are gold plated with nickel plating as a base.
The connection conductive member (metal lump) 15 is a spherical metal ball, a metal rectangular parallelepiped, a metal cylinder, a plated resin ball, or the like. A cream solder, a conductive adhesive, or the like is applied to the electrode pad 12 formed on the surface of the insulating substrate 11, and the conductive member 15 for connection is placed on the electrode pad 12, and fixed by heating. Furthermore, cream solder, a conductive adhesive, or the like is applied to the upper portion of the connecting conductive member 15, and the first electronic element 20 is placed by combining the connecting conductive member 15 and the terminal electrode of the first electronic element 20. Then, heat treatment is performed to fix the two and to conduct electricity. Although the bonding and fixing between the insulating substrate 11 and the connecting conductive member 15 and the bonding and fixing between the connecting conductive member 15 and the first electronic element 20 have been described separately, they may be performed simultaneously in the same process. .
Application of cream solder, conductive adhesive, etc. to the electrode pad 12 provided on the insulating substrate 11 and placement and alignment of the conductive member 15 for connection are compared using a mechanical device equipped with a digital camera. Can be done easily.

2 is a cross-sectional view showing a configuration of an electronic device 2 which is a modification of the electronic device 1 of the embodiment shown in FIG. 1, and a plan view thereof is substantially the same as FIG. The electronic device 2 shown in FIG. 2 includes an insulating substrate 11 for mounting elements, a first electronic element 20a and a second electronic element 20b mounted on the insulating substrate 11, and a first electronic element 20a and the insulating substrate 11. And a conductive member for connection 15 having a thickness for conducting a conductive connection. The insulating substrate 11 has a plurality of first electrode pads 12 and a plurality of second electrode pads 16 on one main surface (front surface), and at each corner of the other main surface (back surface). A plurality of mounting terminals 13 are provided. The first and second electrode pads 12 on one main surface (front surface) and the mounting terminals 13 on the other main surface (back surface) are formed by a plurality of via electrodes 14 formed inside the wall of the insulating substrate 11. , Each of which is conductively connected.
For example, the second electronic element 20b is connected and fixed to the second electrode pad 16 through a metal bump, and the first electronic element 20a is connected to the first electrode pad 12 through a conductive member 15 for connection. Connection is fixed. That is, the terminal electrodes on the back surface (the surface facing the insulating substrate 11) of the second electronic element 20b are electrically connected to the second electrode pads 16 via the metal bumps. The terminal electrodes on the back surface of the first electronic element 20a (the surface on the side facing the insulating substrate 11) are spaced apart above the second electronic element 20b and overlap to form a thick connection conductive member. The first electrode pads 12 are electrically connected to each other via 15. The connecting conductive member 15 having a sufficient thickness is used by providing a space portion between the first electronic element 20a and the second electronic element 20b, so that they are in contact with each other and have electrical characteristics. This is to avoid deterioration. Also, solder, conductive adhesive, or the like is interposed between the first electrode pad 12 and the connecting conductive member 15 and between the connecting conductive member 15 and the terminal electrode of the first electronic element 20a. And fulfills the function of electrical continuity.

FIG. 3A is a cross-sectional view showing a configuration of an electronic device 3 which is a modification of the electronic device 2 of the embodiment shown in FIG. The electronic device 3 is different from the configuration of the electronic device 2 in that a plurality of concave portions 22 for fixing and connecting are provided on one main surface (a surface facing the insulating substrate 11) of the first electronic element 20a. is there. By providing the concave portion 22, the positional accuracy of bonding and fixing and the stability of fixing are improved. FIG. 3B is an enlarged perspective view of the first electronic element 20a, and a recess 22 is formed on one main surface. Although not shown in the drawing, a wiring conductor for connection is formed on the wall surface of the recess 22. The length of the recess 22 is L, the width is W, and the depth D, and these values are set according to the shape of the conductive member 15 for connection. When the connecting conductive member 15 has a spherical shape, the length L and the width W are set to be substantially equal, slightly larger than the diameter of the connecting conductive member 15, and the depth D is preferably set to about a radius. Thereby, a part of the conductive member 15 for connection can be protruded from the recessed part 22.
Even when the connecting conductive member 15 is spherical, the length L of the recess 22 is made larger than the width W to compensate for a positional error when the connecting conductive member 15 is fixed to the first electrode pad 12 of the insulating substrate 11. You may do it.

  For connection between the second electrode pad 16 of the insulating substrate 11 and the terminal electrode of the second electronic element 20b, a stud bump is formed on the second electrode pad 16, and the terminal electrode of the electronic element 20b is applied to the stud bump. It is performed by applying ultrasonic waves while pressing from above in the contact state. And cream solder, a conductive adhesive, etc. are apply | coated to the recessed part 22 provided in one main surface of the 1st electronic element 20a, and a part of the electrically-conductive member 15 for a connection is fitted to this. This is turned over and cream solder, a conductive adhesive or the like is applied to the other end of the connecting conductive member 15, placed on the first electrode pad 12 formed on the insulating substrate 11, and heated to cream solder, A conductive adhesive or the like is cured and fixed, and electrical connection between the first electrode pad 12 and the terminal electrode of the first electronic element 20a is achieved.

  4A and 4B are diagrams showing a configuration of an electronic device 4 which is a modification of the electronic device 3 of the embodiment shown in FIG. 3, wherein FIG. 4A is a cross-sectional view, and FIG. 4B is an electronic element. It is a top view of 20a. The difference from the electronic device 3 is that a plurality of through holes 24 are formed at positions on the main surface of the electronic element 20 a corresponding to the connecting conductive member 15 mounted on the insulating substrate 11. The dimension of the opening surface of the through-hole 24 is L in length and W in width, and these values depend on the shape of the conductive member 15 for connection. In the embodiment shown in FIG. 4, the connecting conductive member 15 has a spherical shape, and the shape dimension of the opening surface of the through hole 24 is set slightly smaller than the spherical diameter of the connecting conductive member 15. For this reason, a part of the conductive member 15 for connection protrudes from the lower surface of the electronic element 20a. In this way, the first electronic element 20a is spaced apart and fixed in parallel above the second electronic element 20b.

FIG. 5A is an enlarged cross-sectional view of a main part of the electronic device 5 of the fifth embodiment. That is, it is an enlarged view of a cross section at a connection portion between the insulating substrate 11 and the first electronic element 20a. The electronic device 5 includes a first electronic element 20a, a second electronic element 20b, a first electronic element 20a, and a second electronic element 20b on a first main surface (opposing the first electronic element 20a). And a conductive member 15 for connection for electrically connecting the terminal on the first electronic element 20a side and the electrode pad 12 on the insulating substrate 11 side.
FIG. 5B is a configuration diagram of the second main surface (the surface facing the insulating substrate 11) of the first electronic element 20a. On the second main surface (back surface) of the first electronic element 20a, a plurality of protrusions 26 protruding perpendicularly to the second main surface are formed, and a protrusion A is formed. The protrusion A has a structure having a rectangular parallelepiped protrusion 26 on each side of the virtual quadrilateral. The protrusion A surrounds the connecting conductive member 15 and is formed so that the wall surface of the protrusion 26 and the wall surface of the connecting conductive member 15 are in contact with each other. The height of the protrusion 26 is set lower than the height of the connecting conductive member 15. This is to provide a space between the second electronic element 20b and the first electronic element 20a. A metal film that is electrically connected to the electrode terminal of the first electronic element 20a is formed inside the protrusion A, and cream solder, a conductive adhesive, or the like is applied to the inside of the protrusion A to connect the conductive member 15 for connection. Are connected to the first electrode pad 12 of the insulating substrate via cream solder, a conductive adhesive, or the like, so that the first electronic element 20a and the first electrode pad 12 are electrically connected. .
The shape, arrangement, and number of the plurality of protrusions 26 are not limited to the illustrated example, and any configuration can be used as long as the connection conductive member 15 can be surrounded and fixed in a protruding state. good. Moreover, you may comprise the projection part A from a hollow square pillar body and a hollow cylindrical body.

FIG. 6A is a modification of the electronic device 5 shown in FIG. 5, and the protrusion A formed on the second main surface (back surface) of the first electronic element 20a is the protrusion A shown in FIG. On the other hand, it is configured to rotate 45 degrees around the center line C of the protrusion A.
FIG. 6B is a modification of the electronic device 5 shown in FIG. 6A, and the protrusion A formed on the second main surface (back surface) of the first electronic element 20a is shown in FIG. The protrusion A shown in FIG. 2 is a protrusion A having a configuration in which the two protrusions 26 near the center are removed, leaving only the protrusions near the center. Further, the protrusion A shown in FIG. 6A may be formed by removing the two protrusions 26 on the outer side and leaving only the protrusion on the outer center. In short, any structure may be used as long as the connecting conductive member 15 is not easily moved by the protrusion A.

  FIG. 7 is a schematic view showing a modification of the electronic device 3 shown in FIG. 3, where FIG. 7A is a longitudinal sectional view, and FIG. 7B is a first main surface of the insulating substrate 11. That is, it is a back view of the surface facing the first electronic element 20a. The electronic device 6 shown in FIG. 7 is different from the electronic device 3 in that concave portions 22a and 22b are formed along the short direction near the end portion of the insulating substrate 11 in the longitudinal direction. One electrode pad 12a, 12b is embedded. At this time, the depth of the recesses 22a and 22b and the thickness of the electrode pads 12a and 12b are set so that the upper ends of the electrode pads 12a and 12b are lower than the opening surfaces of the recesses 22a and 22b. A metal film is formed on the wall surfaces of the recesses 22a and 22b. By forming recesses 22a and 22b on one main surface of the insulating substrate 11, and fitting the connecting conductive member 15 into the recesses 22a and 22b, the first electronic element is placed at a predetermined position on the insulating substrate 11. 20 can be accurately supported, and there is an effect that a reduction in size and a reduction in height are possible.

  As in the embodiment shown in FIG. 1, a predetermined space is provided between the insulating substrate 11 and the first electronic element 20 to support the first electronic element 20, and the terminals of the first electronic element 20 Can be electrically and electrically connected to the electrode pad of the insulating substrate, so that the size and the height can be reduced, and the wiring circuit is provided on the surface of the insulating substrate facing the electronic element using the space. There is an effect that can be formed.

FIG. 8 is a schematic view showing the configuration of the electronic device 7 according to the embodiment of the present invention. FIG. 8A is a plan view in which the lid member 18 is omitted, and FIG. 8B is a plan view of FIG. It is QQ sectional drawing. The electronic device 7 includes a first electronic element (piezoelectric vibration element) 20a that determines a frequency, a container 10 that houses the piezoelectric vibration element (first electronic element) 20a, and a piezoelectric vibration element (first electronic element) 20a. And a conductive member 15 for connection that connects the insulating substrate 11 of the container 10. The container 10 includes an insulating substrate 11 and a lid member 18 that forms a storage space for storing the piezoelectric vibration element 20 a on the insulating substrate 11.
A pair of first electrode pads 12a and 12b on which the piezoelectric vibration element 20a is mounted is formed on the insulating substrate 11 along the short direction near one end of the first main surface (front surface) in the longitudinal direction. Has been. Mounting terminals 13 (13a, 13b, 13c, 13d) are provided at the corners of the second main surface (back surface) opposite to the first main surface.
The pair of first electrode pads 12a and 12b and the mounting terminals 13a and 13b are electrically connected by the via electrode 14, respectively. One of the mounting terminals, for example, 13c, is conductively connected to the seal ring 19 by the via electrode.
For example, the lid member 18 is a lid in which a metal plate is pressed into a reverse concave shape (reverse saddle shape) and a flange portion 18a is formed on an outer edge portion.

  The piezoelectric vibration element 20a (first electronic element) used in the embodiment of FIG. 8 includes, for example, an AT cut crystal vibration element. A piezoelectric material such as quartz belongs to the trigonal system and has crystal axes X, Y, and Z orthogonal to each other as shown in FIG. The X axis, the Y axis, and the Z axis are referred to as an electric axis, a mechanical axis, and an optical axis, respectively. The AT cut quartz crystal substrate 32 is a flat plate cut out from the quartz crystal along a plane obtained by rotating the XZ plane around the X axis by an angle θ. In the case of the AT-cut quartz substrate 32, θ is approximately 35 ° 15 ′. Note that the Y-axis and the Z-axis are also rotated by θ around the X-axis to be the Y′-axis and the Z′-axis, respectively. Accordingly, the AT-cut quartz substrate 32 has crystal axes X, Y ′, and Z ′ that are orthogonal to each other. The AT-cut quartz substrate 32 has a Y′-axis thickness direction, and an XZ ′ plane (plane including the X-axis and Z′-axis) orthogonal to the Y′-axis is a main surface, and thickness-shear vibration is the main vibration. Excited. For example, a BT cut or the like can be used although the cut angle is different from the AT cut.

  That is, the example of the piezoelectric substrate 32 shown in FIG. 8 is centered on the X axis of the orthogonal coordinate system composed of the X axis (electric axis), the Y axis (mechanical axis), and the Z axis (optical axis) as shown in FIG. The Z axis is tilted in the -Y direction of the Y axis is the Z 'axis, the Y axis is tilted in the + Z direction of the Z axis is the Y' axis, and the plane is parallel to the X and Z 'axes. And an AT-cut quartz substrate having a thickness in a direction parallel to the Y ′ axis.

The external shape of the AT-cut quartz substrate is generally a rectangular shape whose longitudinal direction is the X-axis direction, and the resonance frequency depends on the thickness in the Y′-axis direction. When the frequency is high and the X-side ratio (X / t, X is the length in the X-axis direction, t is the thickness) or the Z-side ratio (Z / t, Z is the length in the Z′-axis direction) is large As shown in FIG. 8, a flat-plate crystal substrate 32 is used. Further, when the frequency is low and the X-side ratio (X / t) or the Z-side ratio (Z / t) is small, a mesa crystal substrate (a crystal substrate having a thicker central portion than the peripheral portion) 32 is used. It is done. FIG. 10 shows an example of a mesa-type crystal resonator element. FIG. 10A is a plan view and FIG. 10B is a QQ cross-sectional view.
The mesa-type quartz substrate 32 includes an excitation part 33 that is located at the center and serves as a main vibration area, and a peripheral part 34 that is thinner than the excitation part 33 and is formed along the peripheral edge of the excitation part 33. have. That is, the vibration region extends over the excitation portion 33 and a part of the peripheral portion 34. In the example shown in FIG. 10, there are two steps in the longitudinal direction (lateral direction in the drawing) of the piezoelectric substrate 32, and one step in the short direction (vertical direction in the drawing) as shown in FIG. 9B. This is an example of a piezoelectric vibration element 20a using a mesa-type piezoelectric substrate in which a step is formed.

In the piezoelectric vibration element 20 a, excitation electrodes 35 a and 35 b are formed on the front and back of the excitation unit 33 of the quartz substrate 32, and toward the terminal electrodes 38 a and 38 b provided at the end of the quartz substrate 32 from the excitation electrodes 35 a and 35 b. Extending lead electrodes 36a and 36b are formed.
When an alternating voltage is applied to the excitation electrodes 35a and 35b, the crystal resonator element 20a is excited in a specific vibration mode, for example, in the case of the AT cut crystal resonator element 20a, the thickness shear mode.

A recess 22 as shown in FIG. 3 is formed in the electrode terminals 38 a and 38 b of the piezoelectric vibration element 20 a used in the electronic device 7 of the embodiment of FIG. 8, and electrodes are also formed on the inner wall surface and inner bottom surface of the recess 22. An electrode film connected to the terminals 38a and 38b is formed. Further, a through-hole 24 as shown in FIG. 4 may be formed in place of the concave portion 22, or a flat electrode terminal may be used.
A conductive adhesive or the like is applied to the recess 22 of the piezoelectric vibration element, and a conductive member 15 for connection (a metal ball in the embodiment shown in FIG. 8) is fitted to each of the recesses. It mounts on the 1st electrode pads 12a and 12b of the insulated substrate 11, and it hardens | cures by heating, and fixation and conduction | electrical_connection connection are aimed at. That is, the excitation electrodes 35a and 35b electrically connected to the electrode terminals 38a and 38b are electrically connected to the mounting terminals 13a and 13b via the pair of first electrode pads 12a and 12b. Further, the mounting terminal 13c is conductively connected to the seal ring 19 by the via electrode 14, and the mounting terminal 13c is grounded, so that the lid member 18 is grounded and has a shielding effect.
A lid member 18 is placed on a seal ring 19 provided on the first main surface (front surface) of the insulating substrate 11, and a laser is applied to the collar portion 18a of the lid member 18 in a vacuum or in an inert gas atmosphere. Both are welded and hermetically sealed to complete the electronic device 7.

As shown in the embodiment of FIG. 8, a predetermined space is provided between the insulating substrate 11 and the first electronic element (piezoelectric vibration element) 20a, and the surface of the insulating substrate 11 facing the first electronic element is provided. The wiring circuit can be formed, and the space for mounting the first electronic element on the insulating substrate can be hermetically sealed, so that an electronic device having a small size and a low profile can be configured.
Further, the connecting conductive member 15 is fitted into the recess 22 formed in the piezoelectric vibration element 20a, and the connecting conductive member 15 is conductively bonded to the first electrode pads 12a and 12b formed on the insulating substrate 11. Since the piezoelectric substrate 32 can be accurately fixed to a predetermined position on the insulating substrate 11, there is an effect that a small and low-profile electronic device can be obtained.
Further, a part of the conductive member for connection is fitted into the through hole formed in the piezoelectric vibration element 20a, and the conductive member for connection is conductively bonded to the first electrode pads 12a and 12b formed on the insulating substrate 11. For example, the piezoelectric substrate 32 can be accurately fixed to a predetermined position on the insulating substrate 11, so that an electronic device having a small size and a low profile can be obtained.

Further, the connecting conductive member 15 is brought into contact with the protrusion A formed on the piezoelectric vibration element 20a, and the connecting conductive member 15 is fixed to the first electrode pad formed on the insulating substrate 11 by using conductive adhesive or the like. Therefore, since the piezoelectric substrate 32 can be accurately fixed to a predetermined position on the insulating substrate 11, there is an effect that a small and low-profile electronic device can be obtained.
In addition, since the connecting conductive member is fitted into both the recesses 22a and 22b formed in the insulating substrate 11 and the recesses formed in the first electronic element 20a or the piezoelectric vibration element 20a, the electronic device is configured. Since the electronic element or the piezoelectric substrate can be accurately fixed to a predetermined position on the insulating substrate, there is an effect that a small and low-profile electronic device can be obtained.

FIG. 11 is a schematic view showing the configuration of the electronic device 8 according to the embodiment of the present invention, where FIG. 11 (a) is a plan view in which the lid member 18 is omitted, and FIG. 11 (b) is a plan view of FIG. It is QQ sectional drawing. The electronic device 8 includes a first electronic element (piezoelectric vibration element) 20a that determines a frequency, a second electronic element (temperature sensitive element) 20b, a piezoelectric vibration element (first electronic element) 20a, and a temperature sensitive element. (Second electronic element) A container 10 for accommodating 20b and a connecting conductive member 15 for connecting the piezoelectric vibration element (first electronic element) 20a and the insulating substrate 11 are provided. The container 10 includes the insulating substrate 11 already described with reference to FIG. 1, the lid member 18 that forms a storage space for storing the piezoelectric vibration element 20a and the temperature sensitive element (second electronic element) 20b on the insulating substrate 11, and It has.
A pair of first electrode pads 12a and 12b on which the piezoelectric vibration element 20a is mounted is formed on the insulating substrate 11 along the short direction near one end of the first main surface (front surface) in the longitudinal direction. Has been. Further, a pair of second electrode pads 16a and 16b on which the temperature sensitive element 20b is mounted are formed near the other end portion in the longitudinal direction of the first main surface (front surface) along the short direction. Mounting terminals 13 (13a, 13b, 13c, 13d) are provided at the corners of the second main surface (back surface) opposite to the first main surface.
The pair of first electrode pads 12a and 12b and the mounting terminals 13a and 13b are electrically connected by the via electrode 14, respectively. Further, the pair of second electrode pads 16 a and 16 b and the mounting terminals 13 b and 13 d are conductively connected by the via electrode 14. One of the mounting terminals, for example, 13c, is conductively connected to the seal ring 19 by the via electrode.
Since the cover member 18 has already been described, the description thereof is omitted.

The concave portions 22 shown in FIG. 3 are formed in the electrode terminals 38a, 38b of the piezoelectric vibration element 20a used in the electronic device 8, and the electrode films that are continuous with the electrode terminals 38a, 38b on the inner wall surface and inner bottom surface of the concave portion Is formed. Further, instead of the recess 22, a through hole 24 as shown in FIG. 4 may be formed. The connecting conductive members 15 (metal balls in the embodiment shown in FIG. 11) are fitted into the recesses 22 to which the conductive adhesive or the like is applied, and then the insulating substrate 11 is reversed and the conductive adhesive is applied. It is placed on the first electrode pads 12a and 12b of the insulating substrate 11, heated and cured, and fixed and conductively connected. That is, the excitation electrodes 35a and 35b electrically connected to the electrode terminals 38a and 38b are electrically connected to the mounting terminals 13a and 13b via the pair of first electrode pads 12a and 12b. Further, a pair of terminal electrodes of the temperature sensitive element 20 b are bonded and fixed on the pair of second electrode pads 16 a and 16 b of the insulating substrate 11 via the conductive adhesive 40. The temperature sensing element 20b is electrically connected to the mounting terminals 13c and 13d via the second electrode pads 16a and 16b, and one mounting terminal, for example, 13c is often grounded on the main circuit board. Further, the mounting terminal 13c is electrically connected to the seal ring 19 by the via electrode 14, and by grounding the mounting terminal 13c, the lid member 18 is grounded and has a shielding effect.
As an example of the temperature sensitive element 20b, a thermistor or the like whose physical quantity, for example, electric resistance changes according to a temperature change is used. A change in the electrical resistance of the thermistor 20b is detected by an external circuit, and the temperature of the thermistor 20b is measured. The temperature of the piezoelectric vibration element 20a can be estimated from this temperature, and when used in combination with an external circuit, the piezoelectric vibration element 20a is excited and its frequency is compensated.
Since welding of the insulating substrate 11 and the lid member has already been described, a description thereof will be omitted.

  Since the electronic device 8 shown in the embodiment of FIG. 11 has an electronic element (second electronic element) 22b for detecting temperature, the temperature is compensated by using it together with an external oscillation circuit and a compensation circuit. An electronic device (piezoelectric oscillator) can be obtained.

12A and 12B are schematic views showing the configuration of the electronic device 9 according to the embodiment of the present invention. FIG. 12A is a plan view in which the lid member 18 is omitted, and FIG. 12B is a plan view of FIG. It is QQ sectional drawing. The electronic device 9 includes a piezoelectric vibration element 20a (first electronic element) that determines a frequency, an IC component 20b (second electronic element) that oscillates the piezoelectric vibration element 20a and compensates for the oscillated frequency, and piezoelectric vibration. And a container 10 that houses the element 20a and the IC component 20b. The container 10 includes an insulating substrate 11 serving as a bottom plate, and a lid member 18 that forms a storage space for storing electronic elements mounted on the circuit substrate on the insulating substrate 11.
On the insulating substrate 11, a pair of first electrode pads 12 a and 12 b are formed along the short direction near one end in the longitudinal direction of the first main surface (front surface). Further, a second electrode pad 16 for mounting an IC component is formed in a central region of the first main surface (surface), and a seal ring 19 is baked on the periphery of the first main surface. A plurality of mounting terminals 13 are provided on the second main surface (back surface) opposite to the first main surface. The pair of first electrode pads 12 a and 12 b and two of the mounting terminals 13 are conductively connected by a via electrode 14. The second electrode pad and the mounting terminal 132 (plurality) are conductively connected by the via electrode 14 (plurality). One of the mounting terminals is electrically connected to the seal ring 19 by the via electrode 14.

The second electrode pads 16 (plural) formed on the first main surface of the insulating substrate 11 and the external terminals of the IC component (second electronic element) 20b are connected by thermocompression bonding using, for example, metal bumps. Is done. The IC component 20b has a function of oscillating the piezoelectric vibration element 20a and compensating for the temperature characteristics of the oscillation frequency.
The electrode terminals 38a and 38b of the piezoelectric vibration element (first electronic element) 20a used in the electronic device 9 are formed with the recesses 22 as shown in FIG. Also, an electrode film connected to the electrode terminals 38a and 38b is formed. Further, instead of the recess 22, a through hole 24 as shown in FIG. 4 may be formed. A conductive adhesive or the like is applied to each concave portion 22 formed on the second main surface of the piezoelectric vibration element (first electronic element) 20a, and each of the conductive members 15 for connection (metal ball in the embodiment of FIG. 10) is applied. Then, the piezoelectric vibration element (first electronic element) 20a is inverted, placed on the first electrode pads 12a and 12b on the insulating substrate 11 coated with the conductive adhesive, and heated. Let it harden and secure fixed and conductive connection. The excitation electrodes 35a and 35b are electrically connected to the mounting terminal 13 via the first electrode pads 12a and 12b, respectively.

  Since the connecting conductive member 15 is interposed between the piezoelectric vibration element (first electronic element) 20a and the first electrode pads 12a and 12b, the piezoelectric vibration element 20a includes the IC component 20b (second electronic element). The element is fixed above the element. A lid member 38 is placed on the seal ring 19 formed on the first main surface of the insulating substrate 11, and the flange portion 18a formed on the outer peripheral edge of the lid member 18 in a vacuum or in an inert gas atmosphere. Is irradiated with a laser beam, and both are welded and hermetically sealed. In many cases, the seal ring 19 is connected to one of the mounting terminals 13 by a via electrode, a castellation electrode formed on the wall surface of the corner of the insulating substrate, or the like and grounded.

FIG. 13 is a schematic view showing the configuration of the electronic device 9a according to the embodiment of the present invention. FIG. 13 (a) is a plan view in which the lid member 18 is omitted, and FIG. 13 (b) is a plan view of FIG. It is QQ sectional drawing. The electronic device 9a is different from the electronic device 9 shown in FIG. The container 10 of the electronic device 9a is formed by laminating and firing a rectangular flat plate-like first insulating substrate 11a and a frame flat plate-like second insulating substrate 11b having a large through hole in the center. A piezoelectric vibration element includes a front portion of the first insulating substrate 11a and an annular second insulating substrate 11b having a bottom fixed to the front portion of the first insulating substrate 11a and having a hollow central portion. A housing portion for housing the (first electronic element) 20a and the IC component (second electronic element) 20b is formed.
The first insulating substrate 11a is configured similarly to the insulating substrate 11 shown in FIG. The second insulating substrate 11b is formed by using a ceramic material and providing a hollow in the center, and a seal ring 19 is baked on the upper periphery. Since the first main surface (front surface) of the first insulating substrate 11a and the hollow portion of the second insulating substrate 11b form a space for accommodating the piezoelectric vibration element 20a and the IC component 20b, the lid member 18 may be a flat metal plate (Kovar plate).

  As shown in the embodiment of FIGS. 12 and 13, the electronic devices 9 and 9a detect the temperature of the oscillation circuit that excites the piezoelectric vibration element (first electronic element) 20a and the piezoelectric vibration element, and Since the electronic element (second electronic element) 20b having a circuit for compensating the oscillation frequency is included, there is an effect that a temperature-compensated piezoelectric oscillator having a small size and a low profile can be obtained.

  7 corresponds to the first electrode pad of each of the insulating substrates 11 and 11a of the electronic device 7 shown in FIG. 7, the electronic device 8 shown in FIG. 11, the electronic device 9 shown in FIG. 12, and the electronic device 9a shown in FIG. 7 are formed in the portion, and the connecting conductive member 15 is fitted into the concave portion 22 formed in the piezoelectric vibration element 20a and the concave portions 22a and 22b of the insulating substrate 11, thereby insulating the substrate. The position of the piezoelectric vibration element 20a can be accurately arranged with respect to the predetermined position of 11, and the effect of reducing the size and the height is exhibited.

FIG. 14 is a schematic diagram showing a configuration of the electronic apparatus D according to the embodiment of the present invention. The electronic apparatus D has the above-described electronic device inside.
When an electronic apparatus is configured using the above electronic device, there is an effect that an electronic apparatus having a small and stable reference frequency source can be configured.

1, 2, 3, 4, 5, 6, 7, 8, 9, 9a ... electronic device, D ... electronic device, 10 ... container, 11 ... insulating substrate, 11a ... first insulating substrate, 11b ... second Insulating substrate, 12, 12a, 12b ... first electrode pad, 13, 13a, 13b, 13c, 13d ... mounting terminal, 14 ... via electrode, 15 ... metal lump (conductive member for metal lump connection), 16, 16a, 16b: second electrode pad, 18: lid member, 18a: collar, 19 ... seal ring, 20 ... electronic element, 20a ... first electronic element, 20b ... second electronic element, 22, 22a, 22b ... Recessed portion 24 ... through hole 26 ... projection 30 ... piezoelectric vibration element 32 ... piezoelectric substrate 33 ... excitation portion 34 ... peripheral portion 35a, 35b ... excitation electrode 36a, 36b ... lead electrode 38a, 38b ... Electrode terminal, A ... projection, C1, C2, C3 C4 ... castellations

Claims (7)

An electronic device having a terminal;
An insulating substrate having an electrode pad for mounting the electronic element on one main surface;
A metal block electrically connecting the terminal and the electrode pad;
An electronic device comprising:   The electronic device according to claim 1, wherein the electronic element is a vibration element.   3. The electronic device according to claim 1, wherein the metal block is a metal ball partially accommodated in a concave portion of the terminal.   The electronic device according to claim 1, wherein the metal block is a metal ball partially accommodated in a through hole of the terminal. 3. The electronic device according to claim 1, wherein the metal block is a metal ball that is at least partially joined to a side wall of a protruding portion of the terminal.   The electronic device according to any one of claims 1 to 5, wherein the metal block is a metal ball partially accommodated in a recess of the insulating substrate.   An electronic apparatus comprising the electronic device according to any one of claims 1 to 6.

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