JP2013101245A - Flexible optoelectronic interconnection module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flexible optoelectronic interconnection module capable of suppressing electromagnetic noise emission.SOLUTION: The flexible optoelectronic interconnection module according to an embodiment includes: a flexible optoelectronic wiring board 10 including an optical interconnection path 12, a first electrical wire 11i, a second electrical wire 11a, and third electrical wires 11c and 11e; an optical semiconductor element 13a mounted on the flexible optoelectronic interconnection board, electrically connected to the first electrical wire, and optically coupled with the optical interconnection path; a drive IC 14a that is mounted on the flexible optoelectronic interconnection board, electrically connected to the first electrical wire, the second electrical wire, and the third electrical wires, drives the optical semiconductor element via the first electrical wire, inputs/outputs an electric signal via the second electrical wire, and receives a power supply potential and a ground potential via the third electrical wires; fourth electrical wires 11g and 11h extending from one end to the other end of the flexible optoelectronic interconnection module; and a shield wire 11k disposed between a circuit area 15a where the optical semiconductor element and the drive IC are mounted, and the fourth electrical wires.

Description

  Embodiments described herein relate generally to a flexible photoelectric wiring module having shield wiring.

  A flexible wiring board having flexibility is used as wiring disposed on a mechanically movable part or a curved surface part of an electronic device. In addition, by improving the performance of electronic devices such as bipolar transistors and field effect transistors, the operating speed of large-scale integrated circuits (LSIs) has been dramatically improved. It has become a problem. In order to cope with such a problem, a flexible photoelectric wiring module for wiring a high-speed signal with light has been proposed.

JP 2009-80451 A

  A flexible photoelectric wiring module capable of suppressing electromagnetic noise radiation is provided.

  A flexible photoelectric wiring module according to an embodiment is mounted on a flexible flexible photoelectric wiring board having an optical wiring path, a first electric wiring, a second electric wiring, and a third electric wiring, and the flexible photoelectric wiring board. An optical semiconductor element electrically connected to the first electrical wiring and optically coupled to the optical wiring path; and mounted on the flexible photoelectric wiring board; and the first electrical wiring and the second electrical wiring Electrically connected to the wiring and the third electrical wiring, drive the optical semiconductor element via the first electrical wiring, input and output electrical signals via the second electrical wiring, A driving IC to which a power supply potential and a ground potential are supplied via a third electric wiring; a fourth electric wiring extending from one end of the flexible photoelectric wiring module to the other end; the optical semiconductor element; and the driving IC; Is And the shielding wire disposed between the and the circuit region fourth electrical wires that is, comprises a.

The schematic block diagram of the flexible photoelectric wiring module concerning 1st Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 2nd Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 2nd Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 3rd Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 3rd Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 3rd Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 4th Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 4th Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 5th Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 5th Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 6th Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 7th Embodiment.

  The flexible photoelectric wiring module according to the embodiment can be used as a wiring module for transmitting a video signal output from an information processor to a display in an electronic device such as a mobile phone or a notebook PC.

  In the flexible photoelectric wiring module according to the embodiment, an optical semiconductor element and a driving IC for driving the optical semiconductor element are mounted on a flexible photoelectric wiring board having an optical wiring path and an electrical wiring. The flexible photoelectric wiring module converts an electrical signal input from one end (for example, the application processor side) into an optical signal and transmits the optical signal, and converts the optical signal into an electrical signal at the other end (for example, the display side) and outputs it. Optical signals do not emit electromagnetic noise. For this reason, a flexible photoelectric wiring module that optically transmits a signal can reduce electromagnetic noise emission compared to a flexible wiring module that electrically transmits a signal.

  While optical signal transmission is possible in this way, the flexible photoelectric wiring module still requires electrical wiring (power wiring) for supplying power from one end to the other. Therefore, when electromagnetic noise is radiated from the optical semiconductor element, the driving IC, the electric wiring for inputting / outputting signals, and the electric wiring for supplying power to the driving IC and coupled to the above power wiring, this power wiring becomes a noise source. Electromagnetic noise is radiated from the entire flexible photoelectric wiring module.

  Therefore, in the flexible photoelectric wiring module according to the embodiment, by forming a guard wiring that shields electromagnetic noise and mounting a shield that shields electromagnetic noise, an optical semiconductor element, a driving IC, electric wiring for inputting and outputting signals, The electromagnetic noise radiated from the electric wiring that supplies power to the drive IC is suppressed from being coupled to the above-described power supply wiring. Thereby, electromagnetic noise radiation from the flexible photoelectric wiring module can be suppressed, and the merit of optical wiring that does not radiate electromagnetic noise can be enjoyed to the maximum.

  Hereinafter, the present embodiment will be described with reference to the drawings. Here, some specific materials and configurations will be described as examples, but any material or configuration having a similar function can be implemented. Therefore, it is not limited to the following embodiment.

[1] First Embodiment A schematic configuration of a flexible photoelectric wiring module according to the first embodiment will be described with reference to FIG. 1A is a top view of the flexible photoelectric wiring module, FIG. 1B is a cross-sectional view in the wiring length direction along the line IB-IB in FIG. 1A (near the circuit region), and FIG. c) is a partially enlarged view showing a modified example of the shield wiring.

[1-1] Flexible Photoelectric Wiring Module As shown in FIG. 1A, the flexible photoelectric wiring module of the first embodiment includes an electric wiring 11 (11a to 11j) and an optical wiring path (optical waveguide core) 12. An optical semiconductor element 13 (light emitting element 13a, light receiving element 13b) and driving IC 14 (14a, 14b) are mounted on the flexible photoelectric wiring board 10 having the same. The electrical wiring 11 includes a signal input wiring 11a, a signal output wiring 11b, a power supply wiring 11c and a ground wiring 11e of the driving IC 14a, a power supply wiring 11d and a ground wiring 11f of the driving IC 14b, a wiring 11i connecting the light emitting element 13a and the driving IC 14a, and light reception. A wiring 11j connecting the element 13b and the driving IC 14b, other electric wirings 11g and 11h extending from one end of the flexible photoelectric wiring board 10 to the other end, and shield wirings 11k and 11l are provided. The circuit region 15 (15a, 15b) on which the optical semiconductor element 13 and the driving IC 14 are mounted is located in the end region of the flexible photoelectric wiring board 10.

  In the flexible photoelectric wiring module of the present embodiment, the driving IC 14a drives the light emitting element 13a in accordance with the electric signal input from the electric wiring 11a, and the driving IC 14b amplifies the light receiving current generated by the light receiving element 13b, thereby causing the electric wiring 11b. High-speed signal transmission (for example, 3 Gbps) is possible by outputting an electrical signal. In addition, using the other electrical wirings 11g and 11h, power supply from one end of the flexible photoelectric wiring module to the other end, and low-speed signal transmission such as I2C (Inter-Integrated Circuit) or SPI (Serial Peripheral Interface) (for example, 10 kbps) is possible.

[1-2] Shield Wiring As shown in FIG. 1A, in the flexible photoelectric wiring module of the present embodiment, a circuit region in which the optical semiconductor element 13 (13a, 13b) and the driving IC 14 (14a, 14b) are mounted. Shield wirings 11k and 11l are formed so as to surround 15 (15a and 15b). The shield wirings 11k and 11l function as electromagnetic shields, and the optical semiconductor element 13, the driving IC 14, the signal input wiring 11a, the signal output wiring 11b, the power wiring 11c and the ground wiring 11e of the driving IC 14a, and the power wiring 11d and the ground of the driving IC 14b. Electromagnetic noise coupling from the wiring 11f to the other electrical wirings 11g and 11h connecting one end and the other end of the flexible photoelectric wiring module can be suppressed, and electromagnetic noise radiation from the flexible photoelectric wiring module can be greatly suppressed. is there.

  The shield wirings 11k and 11l are desirably given a ground potential, for example, using an external circuit. At this time, for example, a ground potential may be applied to at least one of both ends of the shield wiring 11k and at least one of both ends of the shield wiring 11l.

  At least one of the both ends of the shield wiring 11k and at least one of the both ends of the shield wiring 11l are not limited to being positioned at the end of the flexible photoelectric wiring board 10, respectively, and may be positioned in the vicinity of the drive IC 14, for example.

  The planar shape of the shield wirings 11k and 11l is, for example, U-shaped, but can be changed to various shapes. Further, the shield wirings 11k and 11l do not need to surround all four sides of the circuit region 15, and the shield wirings may be disposed at least between the electric wirings for which electromagnetic noise coupling is to be prevented.

  Specifically, if a shield wiring is arranged between the electric wiring 11a or 11b and the electric wiring 11h or 11g, electromagnetic noise coupling from the electric wiring 11a or 11b to the electric wiring 11h or 11g can be suppressed. If a shield wiring is arranged between the electrical wiring 11c or 11e and the electrical wiring 11h or 11g, electromagnetic noise coupling from the electrical wiring 11c or 11e to the electrical wiring 11h or 11g can be suppressed. If a shield wiring is arranged between the electrical wiring 11d or 11f and the electrical wiring 11h or 11g, electromagnetic noise coupling from the electrical wiring 11d or 11f to the electrical wiring 11h or 11g can be suppressed. If a shield wiring is arranged between the electrical wiring 11i or 11j and the electrical wiring 11h or 11g, electromagnetic noise coupling from the electrical wiring 11i or 11j to the electrical wiring 11h or 11g can be suppressed. If a shield wiring is arranged between the driving IC 14a or 14b and the electric wiring 11h or 11g, electromagnetic noise coupling from the driving IC 14a or 14b to the electric wiring 11h or 11g can be suppressed. If a shield wiring is arranged between the optical semiconductor element 13a or 13b and the electrical wiring 11h or 11g, electromagnetic noise coupling from the optical semiconductor element 13a or 13b to the electrical wiring 11h or 11g can be suppressed.

  However, in general, various paths exist in the electromagnetic noise coupling at the same time. Therefore, the effect of suppressing the electromagnetic noise coupling is small only by suppressing the electromagnetic noise coupling of some paths. Therefore, the shield wiring so as to surround at least three sides of the circuit region 15 (the upper and lower sides of the circuit region 15 in FIG. 1A and the side on the central side along the wiring length direction of the flexible photoelectric wiring board 10). It is desirable to form.

  The circuit region 15 is disposed adjacent to the upper end or the lower end of the flexible photoelectric wiring board 10 (the upper side or the lower side in FIG. 1A), and the circuit region 15 has other on the upper side or the lower side. If there is no electrical wiring 11g or 11h, the shield wiring is at least two sides of the circuit region 15 (the other side of the central side and the other of the upper side or the lower side along the wiring length direction of the flexible photoelectric wiring board 10). 11g or 11h may be arranged on the side). For example, as shown in FIG. 1C, the circuit region 15b is arranged adjacent to the lower end of the flexible photoelectric wiring board 10, and the electric wiring 11h in FIG. 1A is not provided on the lower side of the circuit region 15b. The shield wiring 11l only needs to be arranged on the two sides of the circuit region 15 (the side on the central portion side along the wiring length direction of the flexible photoelectric wiring board 10 and the side on the side where the electric wiring 11g is arranged). The planar shape of the shield wiring 11l is, for example, L-shaped.

  The shield wirings 11k and 11l are not limited to being formed continuously, and may be partially divided. However, in order to sufficiently suppress the electromagnetic noise coupling to the other electric wirings 11g and 11h, it is desirable that the shield wirings 11k and 11l are continuously formed so as to surround at least the optical semiconductor element 13 and the driving IC 14. .

  In FIG. 1A, one circuit region 15a, 15b is surrounded by one shield wire 11k, 11l, but may be surrounded by a plurality of shield wires. The shield wirings 11k and 11l are not limited to the same symmetrical shape and number, and may be different shapes and numbers.

  As the shield wirings 11k and 11l, an electric wiring formed simultaneously with the electric wirings 11a to 11j using a process for forming the electric wiring 11 described later may be used, or a wiring layer, a film thickness different from the electric wirings 11a to 11j, Electrical wiring formed of a material may be used.

[1-3] Flexible Photoelectric Wiring Board As shown in FIG. 1B, the flexible photoelectric wiring board 10 includes a base film 20 (for example, polyimide, thickness 25 μm), an electric wiring 11 (including shield wirings 11k and 11l). (For example, rolled Cu, thickness 12 μm), optical wiring path (optical waveguide core) 12 (for example, thickness 30 μm), optical waveguide cladding 21 (21a, 21b) (for example, total thickness 50 μm), coverlay 22 (for example, polyimide, The laminate structure has a thickness of 25 μm) laminated and bonded together. Moreover, the flexible photoelectric wiring board 10 has flexibility, for example, is 10 mm in width and 150 mm in length.

[1-4] Electrical wiring As shown in FIG. 1B, the Cu foil used as the electrical wiring 11 (including the shield wirings 11k and 11l) is integrated with the base film 20 via an adhesive layer, What is necessary is just to use what heat-pressed the Cu foil directly on the base film 20 after roughening the surface. The electrical wiring 11 may be formed by patterning a Cu foil laminated on the base film 20, and a part thereof may be plated with, for example, Ni / Au (for example, 5 μm / 0.3 μm in thickness) and used as an electrical connection terminal. . A part of the electrical wiring 11 is connected to the optical semiconductor element 13 and the driving IC 14 and can transmit an optical signal by electrical input / output. Note that the patterning shape of the electrical wiring 11 can be changed as needed. Further, it is desirable that the surface of the electrical wiring 11 is insulated by laminating a cover lay or a photoresist, except for electrical connection terminals, heat dissipation lands and the like.

[1-5] Optical Wiring As shown in FIG. 1B, the optical waveguide core 12 and the optical waveguide cladding 21 are transparent materials (for example, acrylic resin and epoxy resin) with respect to the optical transmission wavelength. These constitute an optical wiring layer. In order to form this optical wiring layer, a first optical waveguide clad 21a (for example, thickness 10 μm) and an optical waveguide core 12 are laminated and bonded in order on the base film 20, and the above-described patterning pattern of the electric wiring 11 is formed. In addition, the optical waveguide core 12 is patterned. Subsequently, the second optical waveguide clad 21b (for example, 40 μm thick) is laminated on the patterned optical waveguide core 12 and bonded together. Since the optical waveguide core 12 has a higher refractive index than the optical waveguide cladding 21, the light incident on the optical waveguide core 12, which is an optical wiring path, is confined in the optical waveguide core 12 and propagates.

  By forming the optical wiring layer as described above, the alignment of the optical waveguide core 12 and the electric wiring 11 can be performed with very high accuracy. Thereby, in the flexible photoelectric wiring board 10, for example, compared with the composite type flexible photoelectric wiring board in which the optical flexible wiring board formed individually and the electric flexible wiring board are aligned and bonded together, the optical semiconductor element 13 and The alignment accuracy with the optical waveguide core 12 can be increased. Furthermore, the relative position fluctuation between the optical semiconductor element 13 and the optical waveguide core 12 due to temperature change can be reduced, and a flexible photoelectric wiring module with high productivity and reliability can be realized.

  The optical waveguide core 12 described above can also be formed by pattern exposure on an optical waveguide film using a resin whose refractive index changes when exposed to light as the optical waveguide film. In the optical wiring layer forming method described above, an example is shown in which the electrical wiring 11 is first formed and the optical waveguide core 12 is formed by patterning in alignment with the patterning shape of the electrical wiring 11. It is also possible to pattern the electrical wiring 11 by forming a wiring layer and aligning it with the patterning shape of the optical waveguide core 12. Note that the number of optical waveguide cores 12 and the patterning shape can be appropriately changed as necessary.

  At both ends of the optical waveguide core 12, 45 degree mirrors are provided. As a result, light propagating through the optical waveguide core 12 is taken out in a direction substantially perpendicular to the surface of the flexible photoelectric wiring board 10, and light incident from the direction substantially perpendicular to the surface of the flexible photoelectric wiring board 10 is taken as the optical waveguide. It can be coupled to the core 12. The 45-degree mirror can be formed by, for example, laser ablation, dicing, pressing, or the like, and metal (for example, Au) may be vapor-deposited on the mirror surface in order to improve reflectivity. The angle of the 45-degree mirror (the angle with respect to the light traveling direction) does not have to be exactly 45 degrees, but is preferably within the range of 30 to 60 degrees.

[1-6] Optical Semiconductor Element The optical semiconductor element 13 uses a light emitting element 13a or a light receiving element 13b fabricated on a GaAs substrate, for example, and has a light emission or light reception wavelength of, for example, 850 nm. As the light emitting element 13a, for example, a surface emitting laser (Vertical Cavity Surface Emitting LASER: VCSEL) can be used. For example, a PIN photodiode (PD) can be used as the light receiving element 13b.

  The optical semiconductor element 13 is mounted by using, for example, an ultrasonic flip chip mounting method so that the light emitting portion or the light receiving portion faces the 45 degree mirror formed on the optical waveguide core 12. Thereby, the light emitting element 13a mounted on one end side of the optical waveguide core 12 and the light receiving element 13b mounted on the other end side are optically coupled through the optical waveguide core 12, and one end side and the other of the flexible photoelectric wiring module are connected. Optical signal transmission can be performed between the end sides. Further, the optical semiconductor element 13 is electrically connected to the electrical wiring 11 (11i, 11j) via the Au bumps 17 formed on the optical semiconductor element 13, thereby transmitting an optical signal by electrical input / output. Is possible. As an electrical connection method, for example, bump connection by solder bumps or wire bonding connection may be used.

  The optical semiconductor element 13 may be formed on a compound semiconductor (for example, GaAlAs / GaAs, InGaAs / InP, SiGe, etc.) or a substrate of Si, Ge, etc. It can be changed. Further, as the optical semiconductor element 13, an array chip in which a plurality of optical elements are formed in one chip may be used, or an optical semiconductor element in which both a light emitting element and a light receiving element are formed in one chip. It may be used. Furthermore, as the optical semiconductor element 13, an optical semiconductor element capable of emitting and receiving light with one element may be used.

  In FIG. 1A, one light emitting element 13a is mounted on one end side of the flexible photoelectric wiring board 10 and one light receiving element 13b is mounted on the other end side. However, another optical semiconductor element is mounted. May be. In FIG. 1 (a), the transmission direction of the optical signal is a single direction from one end side to the other end side of the flexible photoelectric wiring board 10, but a light receiving element is mounted on one end side and a light emitting element is mounted on the other end side. The optical signal transmission in the opposite direction to that shown in FIG. 1A may be performed, or a light emitting element and a light receiving element are mounted on one end side, and a light receiving element and a light emitting element are mounted on the other end side to perform bidirectional optical signal transmission. May be.

  Further, as the light emitting element 13a which is the optical semiconductor element 13, various light emitting elements such as a light emitting diode and a semiconductor laser can be used. As the light receiving element 13b which is the optical semiconductor element 13, various light receiving elements such as a PIN photodiode, an MSM photodiode, an avalanche photodiode, and a photoconductor can be used.

[1-7] Drive IC
The driving IC 14 is mounted on the flexible photoelectric wiring board 10 by using, for example, an ultrasonic flip chip mounting method, and is electrically connected to the electric wiring 11 (11a, 11b) through the Au bump 17 formed on the driving IC 14. Yes. The drive IC 14a supplies a bias current and a drive current to the light emitting element 13a in accordance with an electric signal input from the electric wiring 11a. The driving IC 14b applies a reverse bias voltage to the light receiving element 13b, amplifies the light receiving current generated by the light receiving element 13b, and outputs an electric signal to the electric wiring 11b. The drive IC 14 may be a drive IC (transceiver) having both functions of the drive ICs 14a and 14b. Further, for example, another circuit function such as a serialization function for converting a parallel electric signal into a serial electric signal and a deserialization function for converting a serial electric signal into a parallel electric signal may be provided. If the drive IC 14a for the light emitting element 13a is equipped with a serialization function and the drive IC 14b for the light receiving element 13b is equipped with a deserialization function, a plurality of electrical input signals are converted into a small number of optical signals and transmitted. can do.

[1-8] Others An underfill resin 18 is applied to the bottom and side surfaces of the optical semiconductor element 13 and the driving IC 14. The underfill resin 18 is, for example, an epoxy resin, and is solidified by, for example, heating or ultraviolet irradiation. With the underfill resin 18, the electrical connection between the electrical wiring 11, the optical semiconductor element 13, and the driving IC 14 can be held with high reliability. In addition, the gap formed between the optical semiconductor element 13 and the optical waveguide core 12 is filled to improve the optical coupling efficiency, and the reflection of light in the gap formed between the optical semiconductor element 13 and the optical waveguide core 12 is suppressed. It is possible to perform optical coupling with high efficiency and high reliability.

  The underfill resin used for filling the gap formed between the optical semiconductor element 13 and the optical waveguide core 12 and the underfill resin used for maintaining the electrical connection between the electrical wiring 11, the optical semiconductor element 13 and the driving IC 14 are as follows. Different resins may be used. In any case, it is desirable that the underfill resin used for filling the gap formed between the optical semiconductor element 13 and the optical waveguide core 12 is transparent to the optical transmission wavelength.

  A coverlay 22 is laminated on the second optical waveguide clad 21b via an adhesive layer made of, for example, an epoxy resin. As a result, the optical wiring layer can be protected.

  For example, a reinforcing plate made of polyimide having a thickness of 100 μm may be further laminated on the back surfaces of both ends of the flexible photoelectric wiring module including the circuit region 15. Thereby, the flexibility of the chip mounting portion is reduced, the mounting of the optical semiconductor element 13 and the driving IC 14 is facilitated, and the optical semiconductor element 13 and the driving IC 14 are damaged due to the bending of the flexible photoelectric wiring board. Can be prevented.

[1-9] Effect As described above, according to the first embodiment, the optical semiconductor elements 13a and 13b, the optical semiconductor elements 13a, The drive ICs 14a and 14b for driving 13b are mounted, and shield wirings 11k and 11l are provided so as to surround the circuit regions 15a and 15b in which the optical semiconductor elements 13a and 13b and the drive ICs 14a and 14b are mounted. The shield wirings 11k and 11l function as guard wirings that shield electromagnetic noise. For this reason, the electromagnetic noise radiated from the optical semiconductor elements 13a and 13b, the drive ICs 14a and 14b, the signal input / output wirings 11a and 11b, the power supply wirings 11c and 11d, and the ground wirings 11e and 11f Coupling to the other electrical wirings 11g and 11h connecting the ends can be suppressed. Thereby, electromagnetic noise radiation from the flexible photoelectric wiring module can be suppressed.

[2] Second Embodiment In the second embodiment, metal shields 16a and 16b are further mounted on the shield wirings 11k and 11l, and electromagnetic noise radiation can be further suppressed as compared with the first embodiment. This is an example.

  Below, the schematic structure of the flexible photoelectric wiring module concerning 2nd Embodiment is demonstrated using FIG. 2A and 2B. 2A (a) and 2B (a) are top views of the flexible photoelectric wiring module, and FIG. 2A (b) is a cross-sectional view in the wiring length direction along the line IIAB-IIAB in FIG. 2A (circuit area). FIG. 2B (b) is a cross-sectional view (near the circuit region) in the wiring length direction along the line IIBB-IIBB in FIG. 2B (a). 2A and 2B, the same components as those in FIG. 1 are denoted by the same reference numerals, and detailed description of the same components is omitted.

[2-1] Metal Shield As shown in FIGS. 2A and 2B, in the second embodiment, the metal shield 16 (16a, 16b) is mounted on the shield wirings 11k, 11l, and the metal shields 16a, 16b. Are electrically connected to the shield wirings 11k and 11l by, for example, solder mounting. Here, it is desirable that the shield wirings 11k and 11l are given a ground potential, for example, using an external circuit. For example, a ground potential can be applied directly to the metal shields 16a and 16b using an external circuit.

  In the example shown in FIG. 2A, the metal shields 16a and 16b are provided so as to completely cover the circuit regions 15a and 15b in which the optical semiconductor elements 13a and 13b and the drive ICs 14a and 14b are mounted. The ends of the metal shields 16 a and 16 b on the end side of the flexible photoelectric wiring board 10 extend to the end of the flexible photoelectric wiring board 10.

  In the example shown in FIG. 2B, the metal shields 16a and 16b are provided so as to cover part of the circuit regions 15a and 15b on which the optical semiconductor elements 13a and 13b and the drive ICs 14a and 14b are mounted. That is, the metal shields 16a and 16b cover a part of the optical semiconductor elements 13a and 13b and the drive ICs 14a and 14b, and the end portions of the metal shields 16a and 16b on the end side of the flexible photoelectric wiring board 10 are connected to the drive ICs 14a and 14b. Is located above.

  The metal shield 16 may be made by press-molding various metal materials such as Al, Cu, and stainless steel. Further, the metal shield 16 may be subjected to a surface treatment such as Au plating. Furthermore, a radio wave absorbing material may be applied to the surface of the metal shield 16 or an electromagnetic shielding sheet may be attached.

  The metal shield 16 may partially have a hole, a slit, or the like. Further, in the structure of FIG. 2A, a projecting portion projecting downward may be provided at the end of the metal shield 16 on the end side of the flexible photoelectric wiring board 10 to enhance the shielding effect.

  As shown in FIG. 2B, the metal shield 16 may be provided so as to cover a part of the circuit regions 15a and 15b, but in order to sufficiently suppress electromagnetic noise coupling to the other electric wirings 11g and 11h. Is preferably provided so as to cover at least the circuit region 15 (the optical semiconductor element 13 and the driving IC 14).

[2-2] Effect As described above, in the second embodiment, the flexible photoelectric wiring is provided by providing the shield wirings 11k and 11l so as to surround the circuit regions 15a and 15b, as in the first embodiment. It is possible to suppress electromagnetic noise radiation from the module.

  Furthermore, in the second embodiment, metal shields 16a and 16b are also mounted so as to cover the circuit regions 15a and 15b. The metal shields 16a and 16b function as electromagnetic shields similarly to the shield wirings 11k and 11l. For this reason, the electromagnetic noise radiated from the optical semiconductor elements 13a and 13b, the drive ICs 14a and 14b, the signal input / output wirings 11a and 11b, the power supply wirings 11c and 11d, and the ground wirings 11e and 11f wraps around the space, and the flexible photoelectric Coupling to the other electrical wirings 11g and 11h connecting one end and the other end of the wiring module can also be suppressed. As a result, electromagnetic noise radiation can be further suppressed as compared with the first embodiment.

  In the flexible photoelectric wiring module of the second embodiment, the metal shields 16a and 16b are mounted on the shield wirings 11k and 11l. For this reason, the size of the metal shields 16a and 16b can be minimized and the cost can be reduced as compared with the case where the metal shield is mounted on a mounting substrate or the like on which the flexible photoelectric wiring module is mounted.

[3] Third Embodiment The third embodiment is an example in which a flexible electric wiring board is used and the cost of the flexible photoelectric wiring module is reduced as compared with the first embodiment.

  Below, the schematic structure of the flexible photoelectric wiring module concerning 3rd Embodiment is demonstrated using FIG. 3A thru | or FIG. 3C. 3A (a), FIG. 3B (a) and FIG. 3C (a) are top views of the flexible photoelectric wiring module, and FIG. 3A (b) is a wiring length direction along the line IIIAB-IIIAB in FIG. 3A (a). FIG. 3B (b) is a cross-sectional view in the wiring length direction along the line IIIBB-IIIBB of FIG. 3B (a) (near the circuit region), and FIG. 3C (b) is FIG. It is sectional drawing (circuit area vicinity) of the wiring length direction along the IIICB-IIICB line | wire of (a). 3A to 3C, the same parts as those in FIG. 1 are denoted by the same reference numerals, and detailed description of the same components is omitted.

[3-1] Flexible Photoelectric Wiring Module As shown in FIGS. 3A to 3C, in the flexible photoelectric wiring module of the third embodiment, the flexible photoelectric wiring board 10 (for example, 1 mm in width and 10 mm in length) attaches the adhesive sheet 40. It is mounted on a flexible electrical wiring board 30 (for example, a width of 10 mm and a length of 150 mm). The signal input wiring 11a, the signal output wiring 11b, the power supply wirings 11c and 11d, and the ground wirings 11e and 11f of the flexible photoelectric wiring board 10 are the signal input wiring 31a, the signal output wiring 31b, and the power supply wiring 31c of the flexible electrical wiring board 30, respectively. , 31d, and ground wirings 31e, 31f and wire bonding 41, respectively.

  In the flexible photoelectric wiring module of this embodiment, high-speed signal transmission is performed by the optical wiring of the flexible photoelectric wiring board 10, and power supply and low-speed signal transmission are performed by the electric wiring 31 of the flexible electric wiring board 30. The area of 10 is minimized. Thereby, cost reduction is possible compared with the case where all the electrical wiring and optical signal transmission are performed only by the flexible photoelectric wiring board 10. FIG.

  The flexible electrical wiring board 30 may be a two-layer board. In this case, shield wirings 11k and 11l are formed on the surface of the base film (surface on which the flexible photoelectric wiring board 10 is mounted), and island-shaped wiring (solid) including a region surrounded by the shield wirings 11k and 11l on the back surface of the base film. Wiring) and connecting these electrical wirings with through vias, it is possible to suppress electromagnetic noise radiation from the back surface of the flexible photoelectric wiring module and further suppress electromagnetic noise radiation from the flexible photoelectric wiring module. is there.

  Moreover, in the flexible photoelectric wiring module of this embodiment, although the back surface of the flexible photoelectric wiring board 10 was mounted on the surface of the flexible electrical wiring board 30, the surface of the flexible photoelectric wiring board 10 is mounted on the surface of the flexible electrical wiring board 30. Alternatively, the front surface of the flexible photoelectric wiring board 10 may be mounted on the back surface of the flexible electrical wiring board 30, or the back surface of the flexible photoelectric wiring board 10 may be mounted on the back surface of the flexible electrical wiring board 30.

  Further, in the flexible photoelectric wiring module of this embodiment, the wire bonding 41 is used for the electrical connection between the electric wiring 11 of the flexible photoelectric wiring board 10 and the electric wiring 31 of the flexible electric wiring board 30. Alternatively, the electrical wiring 11 and the electrical wiring 31 may be connected using an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP).

[3-2] Shield wiring In the third embodiment, similarly to the first and second embodiments, circuit regions 15a and 15b are formed using the shield wirings 11m, 11n, 31k, 31l, 31m, 31n, 31o, and 31p. Is surrounded.

  In the example shown in FIG. 3A, the shield wirings 31k and 31l are formed on the flexible electrical wiring board 30. When viewed from above in the direction perpendicular to the surface of the flexible photoelectric wiring board 10, the circuit regions 15a and 15b are formed. It is arranged to surround.

  In the example shown in FIG. 3B, a shield wiring 31m is provided between the electric wirings 31a, 31c, 31e and the electric wiring 31g on the flexible electric wiring board 30, and a shield wiring is provided between the electric wirings 31b, 31d, 31f and the electric wiring 31g. 31n is a shield wiring 31o between the electrical wirings 31a, 31c, 31e and the electrical wiring 31h, and a shield wiring 31p is disposed between the electrical wirings 31b, 31d, 31f and the electrical wiring 31h. Further, on the flexible photoelectric wiring board 10, shield wirings 11 m and 11 n are arranged closer to the center of the flexible photoelectric wiring board 10 than the optical semiconductor element 13. The shield lines 31m and 11m, the shield lines 11m and 31o, the shield lines 31n and 11n, and the shield lines 11n and 31p are electrically connected, for example, by wire bonding. Thereby, the shield wirings 31m, 11m, and 31o are arranged so as to surround the circuit region 15a when viewed from above in the direction perpendicular to the surface of the flexible photoelectric wiring board 10, and the shield wirings 31n, 11n, and 31p are flexible photoelectric photoelectrics. Arranged so as to surround the circuit region 15b when viewed from above in a direction perpendicular to the surface of the wiring board 10. The shield wirings 31m and 31o, 31n and 31p may be a single wiring, such as the shield wirings 31k and 31l in FIG. 3A.

  In the example shown in FIG. 3C, shield wirings 11m and 11n are arranged on the flexible photoelectric wiring board 10 so as to surround the circuit regions 15a and 15b, and both ends of the shield wirings 31m and 31n on the flexible electrical wiring board 30 are arranged. , 31o, 31p are electrically connected. Thereby, the shield wirings 31m, 11m, and 31o are arranged so as to surround the circuit region 15a when viewed from above in the direction perpendicular to the surface of the flexible photoelectric wiring board 10, and the shield wirings 31n, 11n, and 31p are flexible photoelectric photoelectrics. Arranged so as to surround the circuit region 15b when viewed from above in a direction perpendicular to the surface of the wiring board 10.

  In the example of FIG. 3A, external circuits are used for the shield wirings 31k and 31l, in the example of FIG. 3B, the shield wirings 31m, 31n, 31o, and 31p, and in the example of FIG. 3C, the shield wirings 31m, 31n, 31o, and 31p are used. For example, it is desirable to apply a ground potential. For example, a ground potential may be applied to at least one of both ends of the shield wiring 31k, at least one of both ends of the shield wiring 31l, one of the shield wirings 31m and 31o, or one of the shield wirings 31n and 31p.

  At least one of both ends of the shield wirings 31k and 31l in FIG. 3A and one end of the shield wirings 31m, 31n, 31o, and 31p in FIGS. 3B and 3C are limited to be positioned at the end portions of the flexible electrical wiring board 30, respectively. For example, it may be located near the driving IC 14.

  The planar shape of the shield wiring 31k and the shield wiring 31l in FIG. 3A and the shield wirings 31m, 11m, and 31o and the shield wirings 31n, 11n, and 31p in FIGS. 3B and 3C are, for example, U-shaped, but can be changed to various shapes. Is possible. For example, the shield wirings 31k and 31l may be island-shaped wirings (solid wirings) including the lower portions of the circuit regions 15a and 15b of the flexible photoelectric wiring board 10 in a region that does not overlap with the electrical wirings 31a to 31f. This island-shaped wiring is arranged so as to overlap the circuit regions 15a and 15b by projection in the direction perpendicular to the surface of the flexible photoelectric wiring board 10, and is electrically connected to the shield wiring. Thereby, electromagnetic noise radiation from the back surface of the flexible photoelectric wiring module can be suppressed, and electromagnetic noise radiation from the flexible photoelectric wiring module can be further suppressed.

  The shield wiring 31k and the shield wiring 31l in FIG. 3A, and the shield wirings 31m, 11m, and 31o and the shield wirings 31n, 11n, and 31p in FIGS. 3B and 3C are not limited to being formed continuously, but are partially divided. May be. However, in order to sufficiently suppress the electromagnetic noise coupling to the other electric wirings 31g and 31h, the shield wiring 31k and the shield wiring 31l in FIG. 3A, and the shield wirings 31m, 11m, and 31o in FIG. 3B and FIG. It is desirable that 31n, 11n, and 31p are continuously formed so as to surround at least the optical semiconductor element 13 and the driving IC.

  The shield wiring 31k and the shield wiring 31l in FIG. 3A, the shield wirings 31m, 11m, and 31o and the shield wirings 31n, 11n, and 31p in FIGS. 3B and 3C are connected to the flexible photoelectric wiring board 10 and the circuit regions 15a and 15b. A plurality of flexible electrical wiring boards 30 may be formed. Further, the shield wiring 31k and the shield wiring 31l in FIG. 3A, and the shield wirings 31m, 11m, and 31o and the shield wirings 31n, 11n, and 31p in FIG. 3B and FIG. 3C are limited to the same symmetrical shape and number. Alternatively, different shapes and numbers may be used.

  In this embodiment, the shield wirings 11m, 11n of the flexible photoelectric wiring board 10 and the shield wirings 31m, 31n, 31o, 31p of the flexible electric wiring board 30 are electrically connected using wire bonding. When the metal shield described in the second embodiment is mounted on the shield wiring, the shield wirings are naturally electrically connected via the metal shield. Therefore, at this stage, the shield wiring 11m of the flexible photoelectric wiring board 10 is used. , 11n and the shield wirings 31m, 31n, 31o, 31p of the flexible electrical wiring board 30 may not be electrically connected.

[3-3] Flexible Electric Wiring Board As shown in FIGS. 3A (b), 3B (b), and 3C (b), the flexible electric wiring board 30 has flexibility, and the electric wiring 31 (For example, rolled Cu foil, thickness 12 μm), base film 32 (for example, polyimide, thickness 25 μm), reinforcing plate 33 (for example, polyimide, thickness 100 μm), and the like. The flexible electrical wiring board 30 has a laminated structure in which an electrical wiring 31, a base film 32, and a reinforcing plate 33 are laminated and bonded, and has a width of 10 mm and a length of 150 mm, for example.

  The Cu foil used as the electrical wiring 31 may be one that is integrated with the base film 32 via an adhesive layer, or one that is surface-roughened and directly thermocompression bonded to the base film 32. The electrical wiring 31 may be formed by patterning a Cu foil laminated on the base film 32, and a part thereof may be plated with, for example, Ni / Au (for example, 5 μm / 0.3 μm in thickness) and used as an electrical connection terminal. . Note that the patterning shape of the electrical wiring 31 can be changed as needed. Further, it is desirable that the surface of the electrical wiring 31 is insulated by laminating a cover lay or a photoresist, except for the electrical connection terminals and the radiating land.

  The adhesive sheet 40 adheres and fixes the flexible photoelectric wiring board 10 and the flexible electric wiring board 30. As the adhesive sheet 40, for example, a pressure-sensitive adhesive made of an epoxy resin, an acrylic resin, a polyester resin, or the like, or a substrate made of a resin film such as polyimide or a metal foil such as Al or Cu is used. What formed the adhesive layer which consists of said adhesive on both surfaces etc. can be used. The thickness of the adhesive sheet 40 is 50 μm, for example. 3A (b), FIG. 3B (b), and FIG. 3C (b), the adhesive sheet 40 is provided in the vicinity of the mounting portion of the optical semiconductor element 13 and the driving IC 14 located at both ends of the flexible photoelectric wiring board 10. However, one adhesive sheet from one end to the other end of the flexible photoelectric wiring board may be provided. Further, instead of using the adhesive sheet 40, the flexible photoelectric wiring board 10 may be fixed to the flexible electric wiring board 30 with a mold resin, for example.

[3-4] Effect As described above, in the third embodiment, similarly to the first embodiment described above, the shield wirings 11m, 11n, 31k, 31l, 31m, and 31n so as to surround the circuit regions 15a and 15b. , 31o and 31p can suppress electromagnetic noise radiation from the flexible photoelectric wiring module.

  Further, in the third embodiment, high-speed signal transmission is performed by the optical wiring of the flexible photoelectric wiring board 10, and power supply and low-speed signal transmission are performed by the electric wiring 31 of the flexible electric wiring board 30. Thereby, since the area of the flexible photoelectric wiring board 10 can be suppressed to a necessary minimum, the cost can be reduced as compared with the case where all the electrical wiring and optical signal transmission are performed only by the flexible photoelectric wiring board 10.

[4] Fourth Embodiment In the fourth embodiment, metal shields 16a and 16b are further mounted on the shield wirings 31k and 31l, and electromagnetic noise radiation can be further suppressed as compared with the third embodiment. This is an example.

  Below, the schematic structure of the flexible photoelectric wiring module concerning 4th Embodiment is demonstrated using FIG. 4A and 4B. 4A (a) and 4B (a) are top views of the flexible photoelectric wiring module, and FIG. 4A (b) is a cross-sectional view in the wiring length direction along the IVAB-IVAB line in FIG. 4A (circuit area). FIG. 4B (b) is a cross-sectional view (in the vicinity of the circuit region) in the wiring length direction along the line IVBB-IVBB in FIG. 4B (a). 4A and 4B, the same parts as those in FIGS. 1 to 3C are denoted by the same reference numerals, and detailed description of the same configuration is omitted.

[4-1] Metal Shield As shown in FIGS. 4A and 4B, in the fourth embodiment, the metal shield 16 (16a, 16b) is mounted so as to cover the circuit regions 15a, 15b. The metal shields 16a and 16b are electrically connected to the shield wirings 31k and 31l, for example, by solder mounting. Here, it is desirable that the shield wirings 31k and 31l are given a ground potential, for example, using an external circuit. For example, a ground potential can be applied directly to the metal shields 16a and 16b using an external circuit.

  In the example shown in FIG. 4A, the metal shields 16a and 16b are provided so as to completely cover the circuit regions 15a and 15b in which the optical semiconductor elements 13a and 13b and the drive ICs 14a and 14b are mounted. The ends of the metal shields 16 a and 16 b on the end side of the flexible electrical wiring board 30 extend to the end of the flexible electrical wiring board 30.

  In the example shown in FIG. 4B, the metal shields 16a and 16b are provided so as to cover part of the circuit regions 15a and 15b on which the optical semiconductor elements 13a and 13b and the drive ICs 14a and 14b are mounted. That is, the metal shields 16a and 16b cover a part of the optical semiconductor elements 13a and 13b and the drive ICs 14a and 14b, and the end portions of the metal shields 16a and 16b on the end side of the flexible electrical wiring board 30 are connected to the drive ICs 14a and 14b. Is located above.

  In the present embodiment, the flexible photoelectric wiring board 10 causes a step on the surface of the flexible photoelectric wiring module. In order to prevent the metal shield 16 from floating from the surface of the flexible photoelectric wiring module due to the step, it is desirable to apply a counterbore process to the portion of the metal shield 16 where the flexible photoelectric wiring board 10 contacts.

  As shown in FIG. 4B, the metal shield 16 may be provided so as to cover a part of the circuit regions 15a and 15b, but in order to sufficiently suppress electromagnetic noise coupling to the other electric wirings 11g and 11h. Is preferably provided so as to cover at least the circuit region 15 (the optical semiconductor element 13 and the driving IC 14).

[4-2] Effect As described above, in the fourth embodiment, similarly to the above-described first embodiment, the shield wirings 31k and 31l are provided so as to surround the circuit regions 15a and 15b, thereby allowing flexible photoelectric wiring. It is possible to suppress electromagnetic noise radiation from the module.

  Furthermore, in the fourth embodiment, similarly to the second embodiment described above, a metal shield 16 that functions as an electromagnetic shield is also mounted so as to cover the circuit regions 15a and 15b. For this reason, it can suppress that electromagnetic noise couple | bonds around a space. Thereby, electromagnetic noise radiation can be further suppressed.

  Further, in the fourth embodiment, as in the third embodiment described above, high-speed signal transmission is performed by the optical wiring of the flexible photoelectric wiring board 10, and power supply and low-speed signal transmission are performed by the electric wiring 31 of the flexible electric wiring board 30. It is configured to do. Thereby, since the area of the flexible photoelectric wiring board 10 can be suppressed to a necessary minimum, the cost can be reduced as compared with the case where all the electrical wiring and optical signal transmission are performed only by the flexible photoelectric wiring board 10.

[5] Fifth Embodiment The fifth embodiment is different from the third and fourth embodiments in the mounting method of the flexible photoelectric wiring board 10 and the flexible electric wiring board 30. That is, in the flexible photoelectric wiring modules of the third and fourth embodiments, the back surface of the flexible photoelectric wiring board 10 is mounted on the front surface of the flexible electrical wiring board 30, but in the flexible photoelectric wiring module of this embodiment, the flexible photoelectric wiring module is flexible. The surface of the board 10 is mounted on the back surface of the flexible electrical wiring board 30.

  The schematic configuration of the flexible photoelectric wiring module according to the fifth embodiment will be described below with reference to FIGS. 5A and 5B. 5A (a) and 5B (a) are top views of the flexible photoelectric wiring module, and FIG. 5A (b) is a cross-sectional view in the wiring length direction along the VAB-VAB line in FIG. 5A (circuit area). FIG. 5B (b) is a cross-sectional view in the wiring length direction along the VBB-VBB line in FIG. 5B (a) (near the circuit region). 5A and 5B, the same parts as those in FIGS. 1 to 4B are denoted by the same reference numerals, and detailed description of the same configuration is omitted.

[5-1] Flexible Photoelectric Wiring Module As shown in FIGS. 5A and 5B, in the flexible photoelectric wiring module of the fifth embodiment, the flexible photoelectric wiring board 10 (for example, 1 mm in width and 10 mm in length) is bonded to the adhesive sheet 40. The circuit area 15a, 15b of the flexible photoelectric wiring board 10 is exposed from the through holes 50a, 50b provided in the flexible electric wiring board 30. Has been. The signal input wiring 11a, the signal output wiring 11b, the power supply wirings 11c and 11d, and the ground wirings 11e and 11f of the flexible photoelectric wiring board 10 are the signal input wiring 31a, the signal output wiring 31b, and the power supply wiring 31c of the flexible electrical wiring board 30, respectively. , 31d, and ground wirings 31e, 31f and wire bonding 41, respectively.

  In the example of FIG. 5A, shield wirings 31k and 31l surrounding the circuit regions 15a and 15b are provided on the flexible electrical wiring board 30 as in the third embodiment. In the example of FIG. 5B, the circuit regions 15a and 15b are covered with metal shields 16a and 16b, as in the fourth embodiment.

[5-2] Effects As described above, in the fifth embodiment, flexible photoelectric wiring is provided by providing shield wirings 31k and 31l so as to surround the circuit regions 15a and 15b, as in the third embodiment described above. It is possible to suppress electromagnetic noise radiation from the module.

  In the fifth embodiment, similarly to the above-described fourth embodiment, a metal shield 16 that functions as an electromagnetic shield is also mounted so as to cover the circuit regions 15a and 15b. For this reason, it can suppress that electromagnetic noise couple | bonds around a space. Thereby, electromagnetic noise radiation can be further suppressed.

  Further, in the fifth embodiment, as in the third and fourth embodiments described above, high-speed signal transmission is performed by the optical wiring of the flexible photoelectric wiring board 10, and power is supplied by the electric wiring 31 of the flexible electric wiring board 30. It is configured to perform low-speed signal transmission. Thereby, since the area of the flexible photoelectric wiring board 10 can be suppressed to a necessary minimum, the cost can be reduced as compared with the case where all the electrical wiring and optical signal transmission are performed only by the flexible photoelectric wiring board 10.

  Further, in the fifth embodiment, the circuit areas 15 a and 15 b of the flexible photoelectric wiring board 10 are mounted so as to be exposed from the through holes 50 a and 50 b of the flexible electric wiring board 30. For this reason, there exists an advantage that the thickness of a flexible photoelectric wiring module can be reduced compared with 3rd Embodiment.

[6] Sixth Embodiment The sixth embodiment can facilitate the fixing to the mounting substrate as compared with the second embodiment.

  Below, the schematic structure of the flexible photoelectric wiring module concerning 6th Embodiment is demonstrated using FIG. In FIG. 6, the same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description of the same components is omitted.

[6-1] Flexible Photoelectric Wiring Module As shown in FIG. 6, the flexible photoelectric wiring module of the sixth embodiment has terminals around the metal shield 16 (16a, 16b) (portions in contact with the shield wirings 11k, 11l). 62 is formed, and the terminal 62 is passed through the through via 63 formed in the mounting substrate 60, for example, and connected by soldering. Thereby, the flexible photoelectric wiring module is fixed to the mounting substrate 60 (60a, 60b) by the metal shield 16.

  The terminal 62 of the metal shield 16 is connected to the ground of the mounting substrate 60. As a result, the shield wirings 11k and 11l are also connected to the ground. For this reason, it is not necessary to provide a dedicated electrical connection terminal for applying a ground potential to the shield wirings 11k and 11l.

  As the mounting substrate 60 on which the flexible photoelectric wiring module is mounted, for example, a printed wiring substrate using FR4 as a core material can be used. The electrical wiring 61 can be formed of Cu similarly to the shield wirings 11k and 11l, and the surface thereof may be plated with, for example, Ni / Au (for example, thickness 5 μm / 0.3 μm). The electrical wiring 61 is an island-shaped wiring (solid wiring) including a region surrounded by the shield wirings 11k and 11l when viewed from above in a direction perpendicular to the surface of the flexible photoelectric wiring board 10. Electromagnetic noise radiation from the back surface of the flexible photoelectric wiring module can be suppressed, and electromagnetic noise radiation from the flexible photoelectric wiring module can be further suppressed.

  The sixth embodiment can also be applied to the flexible photoelectric wiring module on which the flexible electric wiring board 30 is mounted, which has been described in the third to fifth embodiments.

[6-2] Effects As described above, in the sixth embodiment, similarly to the above-described first embodiment, the shield wirings 11k and 11l are provided so as to surround the circuit region 15, so that the flexible photoelectric wiring module can be used. It is possible to suppress electromagnetic noise radiation.

  In the sixth embodiment, similarly to the second embodiment described above, a metal shield 16 that functions as an electromagnetic shield is also formed so as to cover the circuit region 15. For this reason, it can suppress that electromagnetic noise couple | bonds around a space. Thereby, electromagnetic noise radiation can be further suppressed.

  In the sixth embodiment, the terminals 62 of the metal shield 16 are soldered through the through vias 63 of the mounting board 60. Thereby, the process of mounting the metal shield 16 on the flexible photoelectric wiring board 10 and the process of mounting the flexible photoelectric wiring module on the mounting substrate 60 can be performed simultaneously, and the number of processes can be reduced. Thereby, it is possible to reduce process cost and member cost.

  Further, in the sixth embodiment, by connecting the terminal 62 of the metal shield 16 to the ground of the mounting substrate 60, the electrical connection terminal for applying the ground potential to the shield wirings 11k and 11l can be omitted. Thereby, the area of a flexible photoelectric wiring module can be reduced, and cost can be reduced.

  In the sixth embodiment, electromagnetic noise radiation from the back surface of the flexible photoelectric wiring module can be suppressed by forming the electrical wiring 61 having a shield function on the mounting substrate 60. Thereby, it is possible to further reduce electromagnetic noise radiation from the flexible photoelectric wiring module.

[7] Seventh Embodiment The seventh embodiment is an example in which the flexibility or twistability of the wiring region of the flexible photoelectric wiring module is improved.

  A schematic configuration of the flexible photoelectric wiring module according to the seventh embodiment will be described with reference to FIG. In FIG. 7, only the outer shapes of the flexible photoelectric wiring board 10 and the flexible electric wiring board 30 are shown, and other portions are omitted. However, the specific configuration applies the configuration of the other embodiment described above. It is possible.

  As shown in FIG. 7A, in the flexible photoelectric wiring module of the seventh embodiment, a through slit 70 (for example, a width of 0.1 mm) parallel to the wiring direction of the flexible electric wiring board 30 is provided, and the flexible electric wiring board is provided. The 30 wiring regions are divided into a plurality of fine lines (for example, 1 mm in width), and the flexible photoelectric wiring board 10 is mounted on one divided thin line.

  As shown in FIG. 7B, the flexible photoelectric wiring module shown in FIG. 7A has one end region, a wiring region, and the other end region of the flexible photoelectric wiring module in a crank shape. A plurality of fine lines are overlapped so that the front and back surfaces of adjacent fine lines are opposed to each other, and a plurality of fine lines are bundled using a bundle band 71. Thereby, a wiring area | region can be handled as a thin flexible wiring board of 1 bundle. For this reason, in addition to the bending operation, it is possible to cope with a rotation operation, a twisting operation, and the like.

  Note that it is desirable that the widths and intervals of all the thin lines are substantially equal. Thereby, when a flexible photoelectric wiring module is bundled as mentioned above, it can suppress that a tension | tensile_strength concentrates on one part thin wire. In addition, since all of the plurality of fine lines are pulled equally, the alignment of the plurality of fine lines is good in a region where the plurality of fine lines are bundled, and some of the fine lines are not scattered. In addition, you may use the other method (For example, a several thin wire | line is overlap | superposed so that the surface and surface of an adjacent fine wire, or a back surface and a back surface may oppose) how to overlap the thin line of a flexible photoelectric wiring module.

  For example, a fluorine resin seal tape can be used for the bundle band 71. It is desirable to use a tape without an adhesive for the bundle band 71 so that each thin line can move inside the bundle band 71. Thereby, the slack and stress of a thin wire | line can be removed. Note that the number of the bundled strips 71 can be appropriately changed as necessary, and for example, a bundled strip that is continuous from one end to the other end of the bundled thin wires may be used instead of individual bundled strips. In addition, when there is no fear that a plurality of bundled thin lines may be separated or when it may be separated, the bundle band 71 may not be used. It is desirable that no electrical wiring be provided in the portion where the through slit 70 is formed.

  The entire surface of the flexible photoelectric wiring board 10 may be affixed to the flexible electric wiring board 30, or only the region near the end may be affixed to the flexible electric wiring board 30. Moreover, you may remove the thin wire | line of the flexible electrical wiring board 30 of the location which arrange | positions the flexible photoelectric wiring board 10. FIG. In this case, the flexible photoelectric wiring board 10 and the flexible electrical wiring board 30 are not overlapped in the wiring region, and the minimum bending radius when bending or sliding the wiring region of the flexible photoelectric wiring module can be reduced. Furthermore, the flexible photoelectric wiring board 10 and the flexible electric wiring board 30 are not rubbed, and durability against repeated bending and sliding can be improved.

  Each embodiment mentioned above can be variously changed. For example, FPC, FFC, or the like can be applied to the flexible electrical wiring board 30. In addition to polyimide, a liquid crystal polymer or another resin can be used for the base film of the flexible electrical wiring board 30 and the flexible photoelectric wiring board 10. The electrical wiring 31 of the flexible electrical wiring board 30 may be a single layer or multiple layers. The electrical wiring 11 and the optical wiring layer of the flexible photoelectric wiring board 10 may be a single layer or multiple layers.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 10 ... Flexible photoelectric wiring board, 11 ... Electric wiring, 11k, 11l ... Shield wiring, 12 ... Optical wiring path, 13 ... Optical semiconductor element, 14 ... Drive IC, 15 ... Circuit area | region, 16 ... Metal shield, 17 ... Bump, 18 ... Underfill resin, 20 ... Base film, 21 ... Clad, 22 ... Cover film, 30 ... Flexible electrical wiring board, 31 ... Electric wiring, 31k, 31l ... Shield wiring, 32 ... Base film, 33 ... Reinforcement plate, 40 DESCRIPTION OF SYMBOLS ... Adhesive sheet, 41 ... Bonding wire, 50 ... Through hole, 60 ... Mounting board, 61 ... Electrical wiring, 62 ... Terminal, 63 ... Through via, 70 ... Through slit, 71 ... Bundling band.

Claims (5)

A flexible flexible photoelectric wiring board having an optical wiring path, a first electrical wiring, a second electrical wiring, and a third electrical wiring;
An optical semiconductor element mounted on the flexible photoelectric wiring board, electrically connected to the first electrical wiring, and optically coupled to the optical wiring path;
Mounted on the flexible photoelectric wiring board, electrically connected to the first electric wiring, the second electric wiring, and the third electric wiring, and the optical semiconductor element via the first electric wiring A drive IC that inputs and outputs electrical signals via the second electrical wiring and is supplied with a power supply potential and a ground potential via the third electrical wiring;
The flexible photoelectric wiring board is mounted, and may include a fourth electric wiring electrically connected to the second electric wiring and a fifth electric wiring electrically connected to the third electric wiring. Flexible flexible electrical wiring boards;
A sixth electric wiring extending from one end to the other end of the flexible photoelectric wiring board or the flexible electric wiring board;
A shield wiring disposed between at least a part of a region where the optical semiconductor element and the driving IC are mounted and at least a part of the first to third electrical wirings and the sixth electrical wiring;
A metal shield mounted on at least one of the flexible photoelectric wiring board and the flexible electrical wiring board, electrically connected to the shield wiring, and covering at least a part of the region;
A mounting substrate having electrical wiring and through vias, on which at least one of the flexible photoelectric wiring board and the flexible electrical wiring board is mounted;
A terminal electrically connected to the metal shield;
Comprising
The flexible electrical wiring board is disposed so as to overlap the region when projected in a direction perpendicular to the surface of the flexible photoelectric wiring board, and has an island-shaped electrical wiring electrically connected to the shield wiring. And
The flexible photoelectric wiring module, wherein the terminal of the metal shield is disposed and fixed in the through via of the mounting substrate. A flexible flexible photoelectric wiring board having an optical wiring path, a first electrical wiring, a second electrical wiring, and a third electrical wiring;
An optical semiconductor element mounted on the flexible photoelectric wiring board, electrically connected to the first electrical wiring, and optically coupled to the optical wiring path;
Mounted on the flexible photoelectric wiring board, electrically connected to the first electric wiring, the second electric wiring, and the third electric wiring, and the optical semiconductor element via the first electric wiring A drive IC that inputs and outputs electrical signals via the second electrical wiring and is supplied with a power supply potential and a ground potential via the third electrical wiring;
A fourth electric wiring extending from one end to the other end of the flexible photoelectric wiring module;
A shield wiring disposed between a region where the optical semiconductor element and the driving IC are mounted and the fourth electrical wiring;
A flexible photoelectric wiring module comprising:   The flexible photoelectric wiring board is mounted, and may include a fifth electrical wiring electrically connected to the second electrical wiring and a sixth electrical wiring electrically connected to the third electrical wiring. The flexible photoelectric wiring module according to claim 2, further comprising a flexible flexible electrical wiring board.   The flexible electrical wiring board has an island-shaped electrical wiring that is disposed so as to overlap the region in a projection in a direction perpendicular to the surface of the flexible photoelectric wiring board and is electrically connected to the shield wiring. The flexible photoelectric wiring module according to claim 3.   5. The device according to claim 2, further comprising a metal shield mounted on at least one of the flexible photoelectric wiring board and the flexible electrical wiring board, electrically connected to the shield wiring, and covering at least a part of the region. A flexible photoelectric wiring module according to claim 1.

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