JP2013104945A - Flexible photoelectric wiring module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable suppression of electromagnetic noise radiation.SOLUTION: The flexible photoelectric wiring module includes: a flexible photoelectric wiring board 10 which has an optical wiring line 12, a first electric wiring 11i, a second electric wiring 11a and third electric wirings 11c and 11e, and has flexibility; an optical semiconductor element 13a which is mounted on the flexible photoelectric wiring board, is electrically connected to the first electric wiring, and is optically coupled to the optical wiring line; a drive IC 14a which is mounted on the flexible photoelectric wiring board, is electrically connected to the first electric wiring, the second electric wiring and the third electric wirings, drives the optical semiconductor element through the first electric wiring, inputs/outputs an electric signal through the second electric wiring, and is supplied with a power source potential and a ground potential through the third electric wirings; a fourth electric wiring 11g extending from one end to the other end of the flexible photoelectric wiring module; and a frequency filter 15 which is electrically connected to the fourth electric wiring.

Description

  Embodiments described herein relate generally to a flexible photoelectric wiring module equipped with a frequency filter.

  A flexible wiring board having flexibility is used as wiring disposed on a mechanically movable part or a curved surface part of an electronic device. In addition, by improving the performance of electronic devices such as bipolar transistors and field effect transistors, the operating speed of large-scale integrated circuits (LSIs) has been dramatically improved. It has become a problem. In order to cope with such a problem, a flexible photoelectric wiring module for wiring a high-speed signal with light has been proposed.

JP 2009-80451 A

  A flexible photoelectric wiring module capable of suppressing electromagnetic noise radiation is provided.

  A flexible photoelectric wiring module according to an embodiment is mounted on a flexible flexible photoelectric wiring board having an optical wiring path, a first electric wiring, a second electric wiring, and a third electric wiring, and the flexible photoelectric wiring board. An optical semiconductor element electrically connected to the first electrical wiring and optically coupled to the optical wiring path; and mounted on the flexible photoelectric wiring board; and the first electrical wiring and the second electrical wiring Electrically connected to the wiring and the third electrical wiring, drive the optical semiconductor element via the first electrical wiring, input and output electrical signals via the second electrical wiring, A drive IC to which a power supply potential and a ground potential are supplied via a third electrical wiring, a fourth electrical wiring extending from one end to the other end of the flexible photoelectric wiring module, and an electrical connection to the fourth electrical wiring Connected to Includes and the wave number filter, the.

The schematic block diagram of the flexible photoelectric wiring module concerning 1st Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 1st Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 2nd Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 3rd Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 3rd Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 3rd Embodiment. The schematic block diagram of the flexible photoelectric wiring module concerning 4th Embodiment.

  The flexible photoelectric wiring module according to the embodiment can be used as a wiring module for transmitting a video signal output from an information processor to a display in an electronic device such as a mobile phone or a notebook PC.

  In the flexible photoelectric wiring module according to the embodiment, an optical semiconductor element and a driving IC for driving the optical semiconductor element are mounted on a flexible photoelectric wiring board having an optical wiring path and an electrical wiring. The flexible photoelectric wiring module converts an electrical signal input from one end (for example, the application processor side) into an optical signal and transmits the optical signal, and converts the optical signal into an electrical signal at the other end (for example, the display side) and outputs it. Optical signals do not emit electromagnetic noise. For this reason, a flexible photoelectric wiring module that optically transmits a signal can reduce electromagnetic noise emission compared to a flexible wiring module that electrically transmits a signal.

  While optical signal transmission is possible in this way, the flexible photoelectric wiring module still requires electrical wiring (power wiring) for supplying power from one end to the other. Therefore, when electromagnetic noise is radiated from the optical semiconductor element, the driving IC, the electric wiring for inputting / outputting signals, and the electric wiring for supplying power to the driving IC and coupled to the above power wiring, this power wiring becomes a noise source. Electromagnetic noise is radiated from the entire flexible photoelectric wiring module.

  Therefore, in the flexible photoelectric wiring module according to the embodiment, by mounting a filter, when noise is coupled to an electric wiring such as a power supply wiring, the noise is prevented from conducting through the electric wiring. Thereby, electromagnetic noise radiation from the flexible photoelectric wiring module can be suppressed, and the merit of optical wiring that does not radiate electromagnetic noise can be enjoyed to the maximum.

  Hereinafter, the present embodiment will be described with reference to the drawings. Here, some specific materials and configurations will be described as examples, but any material or configuration having a similar function can be implemented. Therefore, it is not limited to the following embodiment.

[1] First Embodiment A schematic configuration of a flexible photoelectric wiring module according to the first embodiment will be described with reference to FIGS. 1A and 1B. 1A (a) is a top view of the flexible photoelectric wiring module, FIG. 1A (b) is a cross-sectional view in the wiring length direction along the line IAB-IAB in FIG. 1A, and FIG. 1A (c) is a frequency diagram. It is an enlarged view near a filter. FIGS. 1B (a) to 1 (d) are enlarged views in the vicinity of the driving IC for explaining an arrangement example of frequency filters.

[1-1] Flexible Photoelectric Wiring Module As shown in FIG. 1A (a), the flexible photoelectric wiring module of the first embodiment includes an electric wiring 11 (11a to 11j) and an optical wiring path (optical waveguide core) 12. An optical semiconductor element 13 (light emitting element 13a, light receiving element 13b), a driving IC 14 (14a, 14b), and a frequency filter 15 (15a, 15b) are mounted on the flexible photoelectric wiring board 10 having the same. The electrical wiring 11 includes a signal input wiring 11a, a signal output wiring 11b, a power supply wiring 11c and ground wiring 11e of the driving IC 14a, a power supply wiring 11d and ground wiring 11f of the driving IC 14b, a wiring 11i connecting the light emitting element 13a and the driving IC 14a, and light reception. A wiring 11j for connecting the element 13b and the driving IC 14b and other electrical wirings 11g and 11h extending from one end to the other end of the flexible photoelectric wiring board 10 are provided. The region where the optical semiconductor element 13 and the driving IC 14 are mounted is located in a pair of end regions A (A1, A2) that are separated in the wiring length direction, and a wiring region B is provided between the end regions A. Yes.

  In the flexible photoelectric wiring module of the present embodiment, the driving IC 14a drives the light emitting element 13a in accordance with the electric signal input from the electric wiring 11a, and the driving IC 14b amplifies the light receiving current generated by the light receiving element 13b, thereby causing the electric wiring 11b. High-speed signal transmission (for example, 3 Gbps) is possible by outputting an electrical signal. In addition, using the other electrical wirings 11g and 11h, power supply from one end of the flexible photoelectric wiring module to the other end, and low-speed signal transmission such as I2C (Inter-Integrated Circuit) or SPI (Serial Peripheral Interface) (for example, 10 kbps) is possible.

[1-2] Frequency Filter In the flexible photoelectric wiring module of the first embodiment, the frequency filter 15 (15a, 15b) is electrically connected to the electrical wirings 11g, 11h. The frequency filter 15 is composed of, for example, a chip ferrite bead, a chip capacitor, a chip inductor, or a combination thereof.

  As shown in FIGS. 1A (a) and 1B (a) to (d), the end regions A1 and A2 include input / output regions A11 and A21, drive IC regions A12 and A22, and optical element regions A13 and A23. It is divided into. 1B (a) to (d), the frequency filter 15a (15b) is replaced with an input / output area A11 (A21), a drive IC area A12 (A22), an optical element area A13 (A23), and a wiring area. The effect when arranged in B will be described. The frequency filter 15a, 15b is flexible in the case of the frequency filter 15a in which of the input / output regions A11, A21, the driving IC regions A12, A22, the optical element regions A13, A23, and the wiring region B. Judgment is based on the position of the side surface facing the end A10 side on the end region A1 side of the photoelectric wiring board 10, or in the case of the frequency filter 15b, the position of the side surface facing the end A20 side on the end region A2 side of the flexible photoelectric wiring board 10. It is desirable to do.

  FIG. 1B (a) shows a case where a frequency filter 15a is mounted in the input / output area A11. In this figure, the side surface on the end A10 side of the flexible photoelectric wiring board 10 among the side surfaces of the frequency filter 15a is the end of the flexible photoelectric wiring board 10 than the side surface on the end A10 side of the flexible photoelectric wiring board 10 among the side surfaces of the drive IC 14a. Located on the A10 side. In this case, noise directly input from an external circuit connected to the flexible photoelectric wiring board 10 or noise generated at a connection portion (for example, an FPC connector connection portion) between the flexible photoelectric wiring board 10 and the external circuit is caused by the wiring region B. Can be suppressed. In addition, it is possible to partially suppress the noise generated from the input / output area A11 from being coupled to the wiring area B.

  FIG. 1B (b) shows a case where the frequency filter 15a is mounted in the drive IC area A12. In this figure, the frequency filter 15a is disposed in the side region of the drive IC 14a in the direction perpendicular to the wiring length direction, and the side surface on the end A10 side of the flexible photoelectric wiring board 10 among the side surfaces of the frequency filter 15a is the side surface of the drive IC 14a. Among them, it is located closer to the end A20 side of the flexible photoelectric wiring board 10 than the side face on the end A10 side of the flexible photoelectric wiring board 10, and more flexible than the side face on the end A20 side of the flexible photoelectric wiring board 10 among the side faces of the driving IC 14a. It is located on the end A10 side of the photoelectric wiring board 10. In this case, in addition to the effect obtained when the frequency filter 15a is mounted in the input / output region A11, it is possible to more efficiently suppress the noise generated from the input / output region A11 from being coupled to the wiring region B. . In addition, it is possible to partially suppress noise generated from the drive IC 14a from being coupled to the wiring region B.

  FIG. 1B (c) shows a case where the frequency filter 15a is mounted in the optical element region A13. In this figure, the frequency filter 15a is arranged in the side surface region of the optical semiconductor element 13a in the direction perpendicular to the wiring length direction, and the side surface on the end A10 side of the flexible photoelectric wiring board 10 among the side surfaces of the frequency filter 15a is the driving IC 14a. The side of the flexible photoelectric wiring board 10 is located closer to the end A20 of the flexible photoelectric wiring board 10 than the side of the flexible photoelectric wiring board 10 on the side A20, and the side of the optical semiconductor element 13a is closer to the end A20 of the flexible photoelectric wiring board 10. It is located on the end A10 side of the flexible photoelectric wiring board 10 from the side surface. In this case, in addition to the effect obtained when the frequency filter 15a is mounted in the drive IC area A12, it is possible to more efficiently suppress the noise generated from the drive IC area A12 from being coupled to the wiring area B. . In addition, it is possible to partially suppress the noise generated from the optical semiconductor element 13a and the electric wiring 11i from being coupled to the wiring region B.

  FIG. 1B (d) shows a case where the frequency filter 15a is mounted in the wiring region B. In this figure, the side surface on the end A10 side of the flexible photoelectric wiring board 10 among the side surfaces of the frequency filter 15a is more flexible than the side surface on the end A20 side of the flexible photoelectric wiring board 10 among the side surfaces of the optical semiconductor element 13a. Is located on the end A20 side. In this case, in addition to the effect obtained when the frequency filter 15a is mounted in the optical element region A13, it is possible to more efficiently suppress the noise generated from the optical element region A13 from being coupled to the wiring region B. .

  Here, the frequency filters 15a and 15b can be arranged at arbitrary positions in the wiring length direction on the electric wirings 11g and 11h in the wiring region B, but are arranged away from the end regions A1 and A2. In addition, electromagnetic noise may be radiated from a region between the end regions A1 and A2 and the frequency filters 15a and 15b in the electrical wirings 11g and 11h. Therefore, the frequency filters 15a and 15b are arranged in the wiring region B and close to the end regions A1 and A2, so that the effect of suppressing electromagnetic noise radiation can be enjoyed to the maximum. Become. That is, it is desirable that the frequency filter 15a is disposed at the end portion on the end region A1 side in the wiring region B, and the frequency filter 15b is disposed at the end portion on the end region A2 side in the wiring region B. . Of the side faces of the frequency filter 15a (15b), the side face on the end A10 (A20) side of the flexible photoelectric wiring board 10 is the side face on the end A20 (A10) side of the flexible photoelectric wiring board 10 among the side faces of the optical semiconductor elements 13a and 13b. May be on the same plane.

  In FIG. 1B (a) to (d), only one frequency filter 15a is mounted on the plurality of electrical wirings 11g, but the present invention is not limited to this. For example, the frequency filters 15a and 15b may be mounted one by one on all the electrical wirings in the electrical wirings 11g and 11h, or two or more frequency filters 15a and 15b may be mounted on one electrical wiring in the electrical wirings 11g and 11h. Further, the frequency filters 15a and 15b may be disposed at the same symmetrical position between the end regions A1 and A2, or may be disposed at different positions. The number, size, shape, type, and the like of the frequency filters 15a and 15b may be the same or different between the end regions A1 and A2.

  As shown in FIG. 1A (c), when the frequency filter 15a is inserted in series, for example, the frequency filter 15a is mounted on a divided region of the electrical wiring 11h and connected to the electrical wiring 11h via the electrical connection terminal 19. . When inserting in parallel, it connects between two different electric wirings among the electric wirings 11h. The width of the frequency filter 15a (the width in the direction perpendicular to the wiring length direction of the electric wiring 11h) may be larger than the width of the electric wiring 11h, or may be the same or smaller.

[1-3] Flexible photoelectric wiring board As shown in FIG. 1A (b), the flexible photoelectric wiring board 10 includes a base film 20 (for example, polyimide, thickness 25 μm), an electric wiring 11 (11a to 11j) (for example, rolled Cu). , Thickness 12 μm), optical wiring path (optical waveguide core) 12 (for example, thickness 30 μm), optical waveguide cladding 21 (21a, 21b) (for example, total thickness 50 μm), coverlay 22 (for example, polyimide, thickness 25 μm) Are laminated and bonded together. Moreover, the flexible photoelectric wiring board 10 has flexibility, for example, is 10 mm in width and 150 mm in length.

[1-4] Electric Wiring As shown in FIG. 1A (b), the Cu foil used as the electric wiring 11 is integrated with the base film 20 through an adhesive layer, or the surface of the Cu foil is roughened to form a base film. What was directly heat-pressed to 20 may be used. The electrical wiring 11 may be formed by patterning a Cu foil laminated on the base film 20, and a part thereof may be plated with, for example, Ni / Au (for example, 5 μm / 0.3 μm in thickness) and used as an electrical connection terminal. . A part of the electrical wiring 11 is connected to the optical semiconductor element 13 and the driving IC 14 and can transmit an optical signal by electrical input / output. Note that the patterning shape of the electrical wiring 11 can be changed as needed. Further, it is desirable that the surface of the electrical wiring 11 is insulated by laminating a cover lay or a photoresist, except for electrical connection terminals, heat dissipation lands and the like.

[1-5] Optical Wiring As shown in FIG. 1A (b), the optical waveguide core 12 and the optical waveguide cladding 21 are transparent materials (for example, acrylic resin and epoxy resin) with respect to the optical transmission wavelength. These constitute an optical wiring layer. In order to form this optical wiring layer, a first optical waveguide clad 21a (for example, thickness 10 μm) and an optical waveguide core 12 are laminated and bonded in order on the base film 20, and the above-described patterning pattern of the electric wiring 11 is formed. In addition, the optical waveguide core 12 is patterned. Subsequently, the second optical waveguide clad 21b (for example, 40 μm thick) is laminated on the patterned optical waveguide core 12 and bonded together. Since the optical waveguide core 12 has a higher refractive index than the optical waveguide cladding 21, the light incident on the optical waveguide core 12, which is an optical wiring path, is confined in the optical waveguide core 12 and propagates.

  By forming the optical wiring layer as described above, the alignment of the optical waveguide core 12 and the electric wiring 11 can be performed with very high accuracy. Thereby, in the flexible photoelectric wiring board 10, for example, compared with the composite type flexible photoelectric wiring board in which the optical flexible wiring board formed individually and the electric flexible wiring board are aligned and bonded together, the optical semiconductor element 13 and The alignment accuracy with the optical waveguide core 12 can be increased. Furthermore, the relative position fluctuation between the optical semiconductor element 13 and the optical waveguide core 12 due to temperature change can be reduced, and a flexible photoelectric wiring module with high productivity and reliability can be realized.

  The optical waveguide core 12 described above can also be formed by pattern exposure on an optical waveguide film using a resin whose refractive index changes when exposed to light as the optical waveguide film. In the optical wiring layer forming method described above, an example is shown in which the electrical wiring 11 is first formed and the optical waveguide core 12 is formed by patterning in alignment with the patterning shape of the electrical wiring 11. It is also possible to pattern the electrical wiring 11 by forming a wiring layer and aligning it with the patterning shape of the optical waveguide core 12. Note that the number of optical waveguide cores 12 and the patterning shape can be appropriately changed as necessary.

  At both ends of the optical waveguide core 12, 45 degree mirrors are provided. As a result, light propagating through the optical waveguide core 12 is taken out in a direction substantially perpendicular to the surface of the flexible photoelectric wiring board 10, and light incident from the direction substantially perpendicular to the surface of the flexible photoelectric wiring board 10 is taken as the optical waveguide. It can be coupled to the core 12. The 45-degree mirror can be formed by, for example, laser ablation, dicing, pressing, or the like, and metal (for example, Au) may be vapor-deposited on the mirror surface in order to improve reflectivity. The angle of the 45-degree mirror (the angle with respect to the light traveling direction) does not have to be exactly 45 degrees, but is preferably within the range of 30 to 60 degrees.

[1-6] Optical Semiconductor Element The optical semiconductor element 13 uses a light emitting element 13a or a light receiving element 13b fabricated on a GaAs substrate, for example, and has a light emission or light reception wavelength of, for example, 850 nm. As the light emitting element 13a, for example, a surface emitting laser (Vertical Cavity Surface Emitting LASER: VCSEL) can be used. For example, a PIN photodiode (PD) can be used as the light receiving element 13b.

  The optical semiconductor element 13 is mounted by using, for example, an ultrasonic flip chip mounting method so that the light emitting portion or the light receiving portion faces the 45 degree mirror formed on the optical waveguide core 12. Thereby, the light emitting element 13a mounted on one end side of the optical waveguide core 12 and the light receiving element 13b mounted on the other end side are optically coupled through the optical waveguide core 12, and one end side and the other of the flexible photoelectric wiring module are connected. Optical signal transmission can be performed between the end sides. Further, the optical semiconductor element 13 is electrically connected to the electrical wiring 11 (11i, 11j) via the Au bumps 17 formed on the optical semiconductor element 13, thereby transmitting an optical signal by electrical input / output. Is possible. As an electrical connection method, for example, bump connection by solder bumps or wire bonding connection may be used.

  The optical semiconductor element 13 may be formed on a compound semiconductor (for example, GaAlAs / GaAs, InGaAs / InP, SiGe, etc.) or a substrate of Si, Ge, etc. It can be changed. Further, as the optical semiconductor element 13, an array chip in which a plurality of optical elements are formed in one chip may be used, or an optical semiconductor element in which both a light emitting element and a light receiving element are formed in one chip. It may be used. Furthermore, as the optical semiconductor element 13, an optical semiconductor element capable of emitting and receiving light with one element may be used.

  In FIG. 1A (a), one light emitting element 13a is mounted on one end side of the flexible photoelectric wiring board 10 and one light receiving element 13b is mounted on the other end side. However, another optical semiconductor element is mounted. May be. In FIG. 1A (a), the transmission direction of the optical signal is a single direction from one end side to the other end side of the flexible photoelectric wiring board 10, but a light receiving element is mounted on one end side and a light emitting element is mounted on the other end side. Optical signal transmission in the opposite direction to FIG. 1A (a) may be performed, or bidirectional light signal transmission is performed by mounting a light emitting element and a light receiving element on one end side and a light receiving element and a light emitting element on the other end side. May be.

  Further, as the light emitting element 13a which is the optical semiconductor element 13, various light emitting elements such as a light emitting diode and a semiconductor laser can be used. As the light receiving element 13b which is the optical semiconductor element 13, various light receiving elements such as a PIN photodiode, an MSM photodiode, an avalanche photodiode, and a photoconductor can be used.

[1-7] Drive IC
The driving IC 14 is mounted on the flexible photoelectric wiring board 10 by using, for example, an ultrasonic flip chip mounting method, and is electrically connected to the electric wiring 11 (11a, 11b) through the Au bump 17 formed on the driving IC 14. Yes. The drive IC 14a supplies a bias current and a drive current to the light emitting element 13a in accordance with an electric signal input from the electric wiring 11a. The driving IC 14b applies a reverse bias voltage to the light receiving element 13b, amplifies the light receiving current generated by the light receiving element 13b, and outputs an electric signal to the electric wiring 11b. The drive IC 14 may be a drive IC (transceiver) having both functions of the drive ICs 14a and 14b. Further, for example, another circuit function such as a serialization function for converting a parallel electric signal into a serial electric signal and a deserialization function for converting a serial electric signal into a parallel electric signal may be provided. If the drive IC 14a for the light emitting element 13a is equipped with a serialization function and the drive IC 14b for the light receiving element 13b is equipped with a deserialization function, a plurality of electrical input signals are converted into a small number of optical signals and transmitted. can do.

[1-8] Others An underfill resin 18 is applied to the bottom and side surfaces of the optical semiconductor element 13 and the driving IC 14. The underfill resin 18 is, for example, an epoxy resin, and is solidified by, for example, heating or ultraviolet irradiation. With the underfill resin 18, the electrical connection between the electrical wiring 11, the optical semiconductor element 13, and the driving IC 14 can be held with high reliability. In addition, the gap formed between the optical semiconductor element 13 and the optical waveguide core 12 is filled to improve the optical coupling efficiency, and the reflection of light in the gap formed between the optical semiconductor element 13 and the optical waveguide core 12 is suppressed. It is possible to perform optical coupling with high efficiency and high reliability.

  The underfill resin used for filling the gap formed between the optical semiconductor element 13 and the optical waveguide core 12 and the underfill resin used for maintaining the electrical connection between the electrical wiring 11, the optical semiconductor element 13 and the driving IC 14 are as follows. Different resins may be used. In any case, it is desirable that the underfill resin used for filling the gap formed between the optical semiconductor element 13 and the optical waveguide core 12 is transparent to the optical transmission wavelength.

  A coverlay 22 is laminated on the second optical waveguide clad 21b via an adhesive layer made of, for example, an epoxy resin. As a result, the optical wiring layer can be protected.

  For example, a reinforcing plate made of polyimide having a thickness of 100 μm may be further laminated on the back surfaces of both ends of the flexible photoelectric wiring module including the region where the optical semiconductor element 13 and the driving IC 14 are mounted. Thereby, the flexibility of the chip mounting portion is reduced, the mounting of the optical semiconductor element 13 and the driving IC 14 is facilitated, and the optical semiconductor element 13 and the driving IC 14 are damaged due to the bending of the flexible photoelectric wiring board. Can be prevented.

[1-9] Effect As described above, according to the first embodiment, the optical semiconductor elements 13 a and 13 b and the optical semiconductor elements 13 a and 13 b are added to the flexible photoelectric wiring board 10 having the optical wiring path 12 and the electric wiring 11. Are mounted, and the frequency filter 15 is electrically connected to the electrical wires 11g and 11h. As a result, electromagnetic noise generated by the operation of the optical semiconductor elements 13a and 13b and the drive ICs 14a and 14b in the end regions A1 and A2 and coupled to the electrical wirings 11g and 11h is conducted to the electrical wirings 11g and 11h in the wiring region B. It is possible to suppress this. For this reason, it is possible to significantly suppress electromagnetic noise radiation from the entire flexible photoelectric wiring module.

[2] Second Embodiment The second embodiment is an example in which a flexible electric wiring board is used and the cost of the flexible photoelectric wiring module is reduced as compared with the first embodiment.

  Below, the schematic structure of the flexible photoelectric wiring module concerning 2nd Embodiment is demonstrated using FIG. 2A is a top view of the flexible photoelectric wiring module, and FIG. 2B is a cross-sectional view in the wiring length direction along the line IIB-IIB in FIG. 2A. In FIG. 2, the same components as those in FIG. 1A are denoted by the same reference numerals, and detailed description of the same components is omitted.

[2-1] Flexible Photoelectric Wiring Module As shown in FIG. 2, in the flexible photoelectric wiring module of the second embodiment, the flexible photoelectric wiring board 10 (for example, 1 mm wide and 10 mm long) is flexible via the adhesive sheet 40. It is mounted on the electric wiring board 30 (for example, width 10 mm, length 150 mm), and the electric wiring 11 (11a to 11f) of the flexible photoelectric wiring board 10 and the electric wiring 31 (31a to 31f) of the flexible electric wiring board 30 are wire bonding 41. (41a, 41b) are electrically connected to each other. Circuit portions on which the optical semiconductor elements 13a and 13b and the driving ICs 14a and 14b of the flexible photoelectric wiring board 10 are mounted are arranged in the end regions A1 and A2.

  In the flexible photoelectric wiring module of the present embodiment, the area of the flexible photoelectric wiring board 10 is minimized, and part of power supply and low-speed signal transmission is performed by the electric wiring 31 of the flexible electric wiring board 30, thereby The cost can be reduced as compared with the embodiment. Although not shown in FIG. 2, an electrical wiring (corresponding to the electrical wirings 11g and 11h in FIG. 1A) extending from one end to the other end of the flexible photoelectric wiring board 10 is provided, thereby providing power supply and low-speed signal. Part of the transmission may be performed. In this case, it is desirable to insert a frequency filter also in this electrical wiring.

  In the flexible photoelectric wiring module of this embodiment, the back surface of the flexible photoelectric wiring board 10 is mounted on the surface of the flexible electric wiring board 30, but the surface of the flexible photoelectric wiring board 10 is mounted on the surface of the flexible electric wiring board 30. Alternatively, the front surface of the flexible photoelectric wiring board 10 may be mounted on the back surface of the flexible electrical wiring board 30, or the back surface of the flexible photoelectric wiring board 10 may be mounted on the back surface of the flexible electrical wiring board 30.

  Further, in the flexible photoelectric wiring module of this embodiment, the wire bonding 41 is used for the electrical connection between the electric wiring 11 of the flexible photoelectric wiring board 10 and the electric wiring 31 of the flexible electric wiring board 30. Alternatively, the electrical wiring 11 and the electrical wiring 31 may be connected using an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP).

[2-2] Frequency Filter As shown in FIG. 2A, in this embodiment, the frequency filters 15 a and 15 b are electrically connected to the electrical wirings 31 g and 31 h mounted on the flexible electrical wiring board 30. Yes. The frequency filter 15a is disposed at the end in the wiring region B on the end region A1 side, and the frequency filter 15b is disposed at the end in the wiring region B on the end region A2 side.

  Note that the frequency filters 15a and 15b in the second embodiment can be variously changed, such as the location, number, shape, and size, as in the first embodiment.

[2-3] Flexible Electric Wiring Board As shown in FIG. 2B, the flexible electric wiring board 30 is flexible and has an electric wiring 31 (for example, rolled Cu foil, thickness 12 μm), base It is composed of a film 32 (for example, polyimide, thickness 25 μm), a reinforcing plate 33 (for example, polyimide, thickness 100 μm), and the like. The flexible electrical wiring board 30 has a laminated structure in which an electrical wiring 31, a base film 32, and a reinforcing plate 33 are laminated and bonded, and has a width of 10 mm and a length of 150 mm, for example.

  The Cu foil used as the electrical wiring 31 may be one that is integrated with the base film 32 via an adhesive layer, or one that is surface-roughened and directly thermocompression bonded to the base film 32. The electrical wiring 31 may be formed by patterning a Cu foil laminated on the base film 32, and a part thereof may be plated with, for example, Ni / Au (for example, 5 μm / 0.3 μm in thickness) and used as an electrical connection terminal. . Note that the patterning shape of the electrical wiring 31 can be changed as needed. Further, it is desirable that the surface of the electrical wiring 31 is insulated by laminating a cover lay or a photoresist, except for the electrical connection terminals and the radiating land.

  The adhesive sheet 40 adheres and fixes the flexible photoelectric wiring board 10 and the flexible electric wiring board 30. As the adhesive sheet 40, for example, a pressure-sensitive adhesive made of an epoxy resin, an acrylic resin, a polyester resin, or the like, or a substrate made of a resin film such as polyimide or a metal foil such as Al or Cu is used. What formed the adhesive layer which consists of said adhesive on both surfaces etc. can be used. The thickness of the adhesive sheet 40 is 50 μm, for example. In FIG. 2B, the adhesive sheet 40 is provided in the vicinity of the mounting portion of the optical semiconductor element 13 and the drive IC 14 located at both ends of the flexible photoelectric wiring board 10, but from one end to the other end of the flexible photoelectric wiring board. One adhesive sheet may be provided. Further, instead of using the adhesive sheet 40, the flexible photoelectric wiring board 10 may be fixed to the flexible electric wiring board 30 with a mold resin, for example.

[2-4] Effects As described above, in the second embodiment, the frequency filters 15a and 15b are electrically connected to the electrical wirings 31a and 31h, as in the first embodiment described above. For this reason, it is possible to suppress electromagnetic noise radiation of the flexible photoelectric wiring module.

  Further, in the second embodiment, the area of the flexible photoelectric wiring board 10 is suppressed to the minimum necessary, and the electric wiring 31 of the flexible electric wiring board 30 is configured to perform power supply and low-speed signal transmission. The cost can be reduced as compared with the embodiment.

[3] Third Embodiment The third embodiment improves the bendability or twistability of the wiring region B of the flexible photoelectric wiring module, and further suppresses a decrease in reliability due to the overlapping of the frequency filters 15a and 15b. This is an example.

  A schematic configuration of the flexible photoelectric wiring module according to the third embodiment will be described with reference to FIGS. 3A to 3C. 3A and 3B are top views of the flexible photoelectric wiring module. In FIG. 3C, only the outer shapes of the flexible photoelectric wiring board 10 and the flexible electric wiring board 30 are shown, and other portions are omitted, but the specific configuration may be applied to the configuration of another embodiment. Is possible.

[3-1] Flexible Photoelectric Wiring Module As shown in FIGS. 3A to 3C, in the flexible photoelectric wiring module of the third embodiment, the flexible photoelectric wiring board 10 or the flexible electric wiring board 30 penetrates in parallel to the wiring length direction. At least one slit 50 (for example, a width of 0.1 mm) is provided, and the wiring region B of the flexible photoelectric wiring board 10 or the flexible electric wiring board 30 is divided into a plurality of wiring fins 52 (thin lines) (for example, a width of 1 mm).

  In the example of FIG. 3A, the through slit 50 is formed in the flexible photoelectric wiring board 10 and is located between the frequency filters 15a and 15b. That is, the through slit 50 is positioned closer to the center of the flexible photoelectric wiring board 10 than the frequency filters 15a and 15b. The frequency filters 15 a and 15 b are disposed between the wiring fins 52 of the flexible photoelectric wiring 10 and the end regions A1 and A2 of the flexible photoelectric wiring board 10.

  In the example of FIG. 3B, the through slit 50 is formed in the flexible electrical wiring board 30 and is located between the frequency filters 15a and 15b. That is, the through slit 50 is located closer to the center of the flexible electrical wiring board 30 than the frequency filters 15a and 15b. The flexible photoelectric wiring board 10 is mounted on one divided wiring fin 52 in the flexible electric wiring board 30. The frequency filters 15 a and 15 b are disposed between the wiring fins 52 of the flexible electrical wiring 30 and the end regions A1 and A2 of the flexible electrical wiring board 30.

  In FIG. 3C (a), only the outer shape of the flexible photoelectric wiring board 10 and the flexible electric wiring board 30 and the through slit 50 are shown to simplify the description. As shown in FIG. 3C (b), the flexible photoelectric wiring module shown in FIG. 3C (a) has one end region A1, wiring region B, and the other end region A2 of the flexible photoelectric wiring module in a crank shape. The plurality of wiring fins 52 are stacked so that the front surface and the back surface of the adjacent wiring fins 52 face each other, and the plurality of wiring fins 52 are bundled using the bundle band 51. At this time, the bundle band 51 is located closer to the center of the flexible photoelectric wiring module than the frequency filters 15a and 15b. Thereby, the wiring area B can be handled as a bundle of thin flexible wiring boards. For this reason, in addition to the bending operation, it is possible to cope with a rotation operation, a twisting operation, and the like.

  It is desirable that all the wiring fins 52 have substantially the same width and interval. Thereby, when a flexible photoelectric wiring module is bundled as mentioned above, it can suppress that tension | tensile_strength concentrates on one part wiring fin 52. FIG. Further, since all of the plurality of wiring fins 52 are pulled equally, the alignment of the plurality of wiring fins 52 is good in a region where the plurality of wiring fins 52 are bundled, and some of the wiring fins 52 do not fall apart. In addition, how to overlap the wiring fins 52 of the flexible photoelectric wiring module uses another method (for example, a plurality of wiring fins 52 are stacked so that the front surface and the front surface or the back surface and the back surface of the adjacent wiring fins 52 face each other). Also good.

  For example, a fluororesin-based seal tape can be used for the bundle band 51. It is desirable to use a tape without adhesive for the bundle band 51 so that each wiring fin 52 can move inside the bundle band 51. Thereby, the slack and stress of the wiring fin 52 can be removed. Note that the number of the bundle band 51 can be appropriately changed as necessary. For example, a bundle band that is continuous from one end to the other end of the bundled wiring fins 52 may be used instead of individual bundle lines. . Further, when there is no fear that the plurality of bundled wiring fins 52 may or may not be separated, the bundle band 51 may not be used. It is desirable that no electrical wiring be provided in the portion where the through slit 50 is formed.

  The entire surface of the flexible photoelectric wiring board 10 may be affixed to the flexible electric wiring board 30, or only the region near the end may be affixed to the flexible electric wiring board 30. Moreover, you may remove the wiring fin 52 of the flexible electrical wiring board 30 of the location which arrange | positions the flexible photoelectric wiring board 10. FIG. In this case, the flexible photoelectric wiring board 10 and the flexible electrical wiring board 30 are not overlapped in the wiring region, and the minimum bending radius when bending or sliding the wiring region B of the flexible photoelectric wiring module can be reduced. Furthermore, the flexible photoelectric wiring board 10 and the flexible electric wiring board 30 are not rubbed, and durability against repeated bending and sliding can be improved.

[3-2] Effects As described above, in the third embodiment, the frequency filters 15a and 15b are electrically connected to the electrical wirings 11a and 11h or 31a and 31h, as in the first and second embodiments described above. Connecting. For this reason, it is possible to suppress electromagnetic noise radiation of the flexible photoelectric wiring module.

  Further, in the second embodiment of FIGS. 3B and 3C, when all the electrical wiring and optical signal transmission are performed only by the flexible photoelectric wiring board 10 by minimizing the area of the flexible photoelectric wiring board 10. The cost can be reduced as compared.

  In the third embodiment, the frequency filters 15a and 15b connected to the electrical wirings 11a and 11h or 31a and 31h are arranged between the wiring fin 52 and the end regions A1 and A2. When the wiring fins 52 of the flexible photoelectric wiring module are stacked and bundled as shown in FIG. 3C (b), a bundle band 51 is provided on the center side of the flexible photoelectric wiring module with respect to the frequency filters 15a and 15b. Therefore, the frequency filters 15a and 15b do not overlap each other. For this reason, it becomes possible to prevent generation | occurrence | production of the unnecessary twist of a flexible photoelectric wiring module, and the short circuit between different electric wirings via the frequency filters 15a and 15b.

[4] Fourth Embodiment The fourth embodiment shows an example in which a plurality of frequency filters 15 are alternately shifted.

  Below, the schematic structure of the flexible photoelectric wiring module concerning 4th Embodiment is demonstrated using FIG. In FIG. 4, the same components as those in FIG. 1A are denoted by the same reference numerals, and detailed description of the same components is omitted.

[4-1] Frequency Filter As shown in FIG. 4, in the fourth embodiment, at the left end in the wiring region B, the electric wirings 11 g and 11 h that are adjacent vertically (in the direction perpendicular to the wiring length direction) are connected. The connected frequency filters 15a1 and 15a2 are arranged so as to be alternately shifted left and right (in the wiring length direction) (so as not to line up in the direction perpendicular to the wiring length direction). Similarly, the frequency filters 15b1 and 15b2 connected to the upper and lower adjacent electrical wirings 11g and 11h at the right end in the wiring region B are alternately shifted left and right (aligned in the direction perpendicular to the wiring length direction). Is arranged).

  In FIG. 4, the positional relationship between the frequency filters 15a1 and 15a2 in the wiring length direction may be reversed, or the positional relationship between the frequency filters 15b1 and 15b2 in the wiring length direction may be reversed. Further, the frequency filters 15a1, 15a2, 15b1, and 15b2 are not limited to being disposed in the wiring region B, but are disposed in the input / output regions A11 and A21, the driving IC regions A12 and A22, and the optical element regions A13 and A23. It is also possible to do. In the fourth embodiment, the flexible electrical wiring board 30 may be used as in the second embodiment, or the through slit 50 may be provided as in the third embodiment.

[4-2] Effects As described above, in the fourth embodiment, the frequency filters 15a1, 15a2, 15b1, and 15b2 are electrically connected to the electrical wirings 11a and 11h as in the first embodiment described above. For this reason, it is possible to suppress electromagnetic noise radiation of the flexible photoelectric wiring module.

  In the fourth embodiment, the frequency filters 15a1, 15a2, 15b1, and 15b2 connected to the adjacent electrical wirings 11g and 11h are alternately shifted. For this reason, when the flexible photoelectric wiring board 10 is rounded into a cylindrical shape with the wiring length direction as an axis, or when the wiring fins 52 separated by the through slits 50 are bundled as in the third embodiment, the frequency filter 15a1, It is possible to suppress interference between 15a2, 15b1, and 15b2.

  Each embodiment mentioned above can be variously changed. For example, FPC, FFC (Flexible Flat Cable), or the like can be applied to the flexible electrical wiring board 30. In addition to polyimide, a liquid crystal polymer or another resin can be used for the base film of the flexible electrical wiring board 30 and the flexible photoelectric wiring board 10. The electrical wiring 31 of the flexible electrical wiring board 30 may be a single layer or multiple layers. The electrical wiring 11 and the optical wiring layer of the flexible photoelectric wiring board 10 may be a single layer or multiple layers.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 10 ... Flexible photoelectric wiring board, 11 ... Electric wiring, 12 ... Optical wiring path, 13 ... Optical semiconductor element, 14 ... Drive IC, 15 ... Frequency filter, 17 ... Bump, 18 ... Underfill resin, 19 ... Electrical connection terminal, DESCRIPTION OF SYMBOLS 20 ... Base film, 21 ... Cladding, 22 ... Cover film, 30 ... Flexible electric wiring board, 31 ... Electric wiring, 32 ... Base film, 33 ... Reinforcement board, 40 ... Adhesive sheet, 41 ... Bonding wire, 50 ... Through slit , 51 ... Bundled wire band, 52 ... Wiring fins.

Claims (7)

A flexible flexible photoelectric wiring board having an optical wiring path, a first electrical wiring, a second electrical wiring, and a third electrical wiring;
An optical semiconductor element mounted on the flexible photoelectric wiring board, electrically connected to the first electrical wiring, and optically coupled to the optical wiring path;
Mounted on the flexible photoelectric wiring board, electrically connected to the first electric wiring, the second electric wiring, and the third electric wiring, and the optical semiconductor element via the first electric wiring A drive IC that inputs / outputs electrical signals via the second electrical wiring and is supplied with a power supply potential and a ground potential via the third electrical wiring;
A flexible flexible electrical wiring board having a fourth electrical wiring electrically connected to the second electrical wiring and a fifth electrical wiring electrically connected to the third electrical wiring;
A plurality of sixth electric wirings mounted on the flexible photoelectric wiring board or the flexible electric wiring board and extending from one end to the other end of the flexible photoelectric wiring board or the flexible electric wiring board;
A plurality of frequency filters electrically connected to the sixth electrical wiring;
Comprising
The flexible photoelectric wiring board or the flexible electric wiring board is provided with a pair of end regions spaced in the wiring length direction of the sixth electric wiring and a wiring region sandwiched between the end regions,
The wiring region is divided into a plurality of wiring fins by at least one through slit,
The optical semiconductor element, the driving IC, and the frequency filter are mounted in the end region,
Of the side surfaces of the frequency filter, the side surface opposite to the wiring region side is the side surface of the optical semiconductor element mounted on the end region on the same side as the frequency filter than the side surface on the wiring region side. Is located on the wiring area side,
Two different frequency filters among the plurality of frequency filters are arranged so as not to line up in a direction perpendicular to a wiring length direction of the sixth electric wiring. A flexible flexible photoelectric wiring board having an optical wiring path, a first electrical wiring, a second electrical wiring, and a third electrical wiring;
An optical semiconductor element mounted on the flexible photoelectric wiring board, electrically connected to the first electrical wiring, and optically coupled to the optical wiring path;
Mounted on the flexible photoelectric wiring board, electrically connected to the first electric wiring, the second electric wiring, and the third electric wiring, and the optical semiconductor element via the first electric wiring A drive IC that inputs / outputs electrical signals via the second electrical wiring and is supplied with a power supply potential and a ground potential via the third electrical wiring;
A fourth electric wiring extending from one end of the flexible photoelectric wiring module to the other end;
A frequency filter electrically connected to the fourth electrical wiring;
A flexible photoelectric wiring module comprising: A flexible flexible electric wiring board further comprising a fifth electric wiring electrically connected to the second electric wiring and a sixth electric wiring electrically connected to the third electric wiring. Equipped,
The flexible photoelectric wiring module according to claim 2, wherein the fourth electric wiring and the frequency filter are mounted on the flexible electric wiring board. The fifth electrical wiring electrically connected to the second electrical wiring, the sixth electrical wiring electrically connected to the third electrical wiring, and the fourth electrical wiring are electrically connected. A flexible electric wiring board having a seventh electric wiring,
The flexible photoelectric wiring module according to claim 2, wherein the frequency filter is electrically connected to the fourth electric wiring of the flexible photoelectric wiring board or the seventh electric wiring of the flexible electric wiring board. The flexible photoelectric wiring board or the flexible electric wiring board is provided with a pair of end regions spaced in the wiring length direction of the fourth electric wiring and a wiring region sandwiched between the end regions,
The wiring region is divided into a plurality of wiring fins by at least one through slit,
The flexible photoelectric wiring module according to claim 2, wherein the frequency filter is mounted in the end region.   6. The frequency filter according to claim 2, wherein the frequency filter is disposed in a region on a side surface side of the optical semiconductor element in a direction perpendicular to a wiring length direction of the fourth electric wiring among side surfaces of the optical semiconductor element. The flexible photoelectric wiring module according to item 1.   The side surface of the side surface of the frequency filter opposite to the wiring region side is located closer to the wiring region side than the side surface of the optical semiconductor element on the wiring region side. The flexible photoelectric wiring module of any one of Claims.

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