JP2013100917A - Reaction absorbing device and semiconductor assembling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a reaction absorbing device which is reduced in weight, and a high-productivity high-quality semiconductor assembling device which uses the weight-reduced reaction absorbing device and is shortened in processing time.SOLUTION: This reaction absorbing device is characterized by comprising: a device base; a support fixed to the device base; a counter mechanism including a first ball screw, a load unit which is moved to a prescribed direction by the first ball screw and uses a processing head for assembling at least a semiconductor as a load, a second ball screw which generates a reaction force in a direction reverse to the prescribed direction, and a drive unit having a power source for driving the first ball screw and the second ball screw; and a reaction absorbing unit including the support and a support member for movably supporting the counter mechanism by the second ball screw.

Description

  The present invention relates to a semiconductor assembly apparatus and a reaction absorption apparatus, and more particularly to a semiconductor assembly apparatus that can provide a reaction absorption apparatus that is reduced in weight and has a high productivity operation rate.

  One type of semiconductor manufacturing apparatus is a die bonder that bonds a semiconductor chip (die) to a substrate such as a lead frame. In the die bonder, the die is vacuum-adsorbed by a bonding head, and the die is raised at a high speed, horizontally moved, and lowered to be mounted on a substrate.

  Generally, when the speed of the apparatus is increased, vibration due to a high-speed moving object increases, and it becomes difficult for the apparatus to obtain a target accuracy. As a conventional example of a reaction absorbing device that reduces this vibration, there is one described in Patent Document 1. In Patent Document 1, as shown in FIG. 7, a counterweight cw is added, two types of ball screws n1 and n2 having different leads are driven by a motor m, and a load f of a processing head (for example, a bonding head) is determined. The counterweight cw is moved in the opposite direction as indicated by the arrow to prevent the occurrence of vibration.

JP 2004-263825 A

  In general, there is an inversely proportional relationship between the mass of the counterweight and the driving force, and the above prior art requires a momentum opposite to that of driving in order to obtain the effect of damping. For example, when the load and the counterweight have the same mass, the counterweight needs only the same drive energy as the load drive, and the output of the drive motor is required twice. In order to reduce the driving energy of the counterweight, the counter mass may be increased (the driving energy is ½ when the counter mass is doubled), but this increases the weight of the reaction absorber. Further, the total weight of the drive system that supplies the drive energy and the counter unit also increases.

The present invention has been made in view of the above problems, and a first object of the present invention is to provide a reaction absorbing device that is reduced in weight.
A second object of the present invention is to provide a semiconductor assembly apparatus that uses a reaction absorber that is reduced in weight and has a shorter processing time and higher productivity or quality.

In order to achieve the first object of the present invention, a base, a support fixed to the base, a power source, and a load unit that is loaded with a processing head that is moved by the power source and assembles at least a semiconductor, A counter mechanism that includes the power source and the load unit and moves in the opposite direction with respect to the load unit by the power source; and a support member that is provided on the support and supports the counter mechanism movably. It has the first feature.
The load unit moves the operation of the power source through a first ball screw, and the counter mechanism is movably supported by the support through a second ball screw. To do.
An apparatus base, a support fixed to the apparatus base, a first ball screw, a load unit that is moved in a predetermined direction by the first ball screw and has at least a processing head for assembling a semiconductor, and the predetermined direction; A counter mechanism unit comprising: a second ball screw that generates a reaction force in a reverse direction; a drive unit having a power source that drives the first ball screw and the second ball screw; and the support body. And a reaction absorption unit including a support member that movably supports the counter mechanism by the second ball screw.
In order to achieve the above object, the first ball screw and the second ball screw are arranged in a straight line and have lead screws in the same direction.

  The device base is fixed so as not to move, and the counter mechanism moves along the device base.

  The power source may be directly or indirectly connected to one end of one of the first ball screw or the second ball screw, or one end of each of the first ball screw or the second ball screw. Drive. Here, indirect means that a ball screw is coupled to a power source via a gear mechanism, a belt mechanism, or the like. The term “directly” means that the ball screw is directly coupled to the power source without using a gear mechanism or a belt mechanism.

  The first ball screw and the second ball screw are arranged in parallel to each other.

  The lead of the first ball screw is larger than the lead of the second ball screw.

  In order to achieve the second object of the present invention, in addition to the above features, the semiconductor assembling apparatus is a die bonder, and at least one of a bonding head, a preform head, and a wafer ring holder included in the die bonder. The reaction absorbing device is applied to a moving device.

ADVANTAGE OF THE INVENTION According to this invention, the reaction absorber which aimed at weight reduction can be provided.
In addition, according to the present invention, it is possible to provide a semiconductor assembly apparatus having a high productivity and quality with a shorter processing time by using a reaction absorber that is reduced in weight.

It is a figure showing the basic composition of the X reaction absorption device which is a 1st embodiment of the present invention. It is a figure which shows the operation example of the X reaction absorbing device shown in FIG. It is the conceptual diagram which looked at the die bonder which is one Embodiment of this invention from the top, and the figure which shows the bonding head part. It is a figure which shows the basic composition of the Z reaction absorption device which is the 2nd Embodiment of this invention. It is a figure which shows the basic composition of the reaction absorber which is the 3rd Embodiment of this invention. It is a figure which shows the basic composition of the reaction absorber which is the 4th Embodiment of this invention. It is a figure which shows the prior art example of a reaction absorber.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings, taking a die bonder as an example of a semiconductor assembly apparatus.
FIG. 3 is a conceptual view of the die bonder 10 according to an embodiment of the present invention as viewed from above, and a view showing the bonding head portion 32. The die bonder is roughly divided into a wafer supply unit 1, a work supply / conveyance unit 2, and a die bonding unit 3.

  The wafer supply unit 1 includes a wafer cassette lifter 11 and a wafer ring holder 12. The wafer cassette lifter 11 has a wafer cassette (not shown) filled with a wafer ring, and supplies the wafer ring to the wafer ring holder 12. The wafer ring holder 12 stretches the wafer tape holding the wafer ring downward during bonding processing described later, widens the distance between the dies, and pushes up the die from below the die by the push-up portion to improve the pick-up property of the die. . Further, the wafer ring holder 12 is arranged on an XY linear motion table, and after the pickup, moves linearly to the next die position to prepare for the next pickup.

The workpiece supply / conveyance unit 2 includes a stack loader 21, a frame feeder 22, and an unloader 23. The workpiece (lead frame) supplied to the frame feeder 22 by the stack loader 21 is conveyed to the unloader 23 through two processing positions on the frame feeder 22.
The die bonding unit 3 includes a preform unit 31 and a bonding head unit 32. The preform unit 31 applies a die adhesive to the work conveyed by the frame feeder 22. The bonding head unit 32 picks up the die from the wafer ring holder 12 and moves up, and moves the die in parallel to a bonding point on the frame feeder 22. Then, the bonding head unit 32 lowers the die and bonds it onto the workpiece coated with the die adhesive.

  The bonding head unit 32 includes an X reaction absorbing device 6 that moves the bonding head (see 32a in FIG. 4) between the pickup position in the wafer ring holder 12 and the bonding point, that is, the X reaction absorbing device 6, and the X reaction absorbing device 6. The Z reaction absorber 7 is fixed (becomes a load) and moves the bonding head 32a up and down (Z direction).

  Hereinafter, an embodiment of a reaction absorber which is a feature of the invention will be described with reference to the drawings. FIG. 1 is a diagram showing a basic configuration of an X reaction absorbing device 6 according to the first embodiment. FIG. 2 is a diagram illustrating a state in which the load unit 62 that fixes the Z reaction absorbing device 7 is moved in the right direction.

  The X reaction absorbing device 6 is roughly classified as a movement target, a load unit 62 shown in a broken line frame, a drive unit 61 that moves the load unit in the left-right direction as shown by an arrow in FIG. 1, and vibration caused by the load unit. A reaction absorbing unit 63 serving as a counter to be reduced, and a device base 64 that supports or fixes them are provided.

The drive unit 61 is connected to a load-side ball screw 61a that moves the load unit 62, a reaction-side absorption-side ball screw 61b that is connected to the load-side ball screw 61a by a connecting portion 61f, and moves the reaction-absorption unit 63, and both ball screws A drive motor 61c to be driven, a U-shaped drive fixing plate 61d that supports the drive motor and both ball screws, and a base guide 61e that enables the drive fixing plate to move on the apparatus base 64.
The load unit 62 includes a load fixing base 62a that fixes or supports the reaction absorbing device 7 that is a load having a bonding head 32a (see FIG. 3) at the tip, and a load that is fixed to the load fixing base and moves on the load side ball screw. It has a nut 62b and a load guide 62c that smoothly moves the load unit 62 on the drive fixing plate 61d by the load nut. With this configuration, the load unit 62 moves in the left-right direction as indicated by the arrows in FIG. 1 by the rotation of the load-side ball screw 61a.

Both the reaction absorbing side ball screw 61b and the load side ball screw 61a described above are cut in the forward (same) direction. Further, the lead ratio M between the lead Rh of the reaction absorbing side ball screw 61b and the lead Rd of the load side ball screw 61a has the relationship of the formula (1).
R = Rd / Rh: R> 1 (1)
The reaction absorbing unit 63 has a reaction absorbing nut 63a (support member) that moves on one side of the reaction absorbing ball screw 61b on one end side, and a reaction absorber 63b (support) that is fixed to the apparatus base 64 on the other end side.
The device base 64 is fixed to the bonding head portion 32, and fixes the reaction absorbing unit 63 as described above. Further, the apparatus base supports a counter mechanism portion 8 having a drive unit 61 and a load unit 62 shown in a thick frame so as to be movable in a direction indicated by an arrow by a base guide 61e.

FIG. 2 is a diagram illustrating an operation example of the reaction absorbing device 6 having such a configuration. FIG. 2 shows an example in which the load unit 62 is moved in the right direction indicated by the arrow A by rotating the load side ball screw 61a and the reaction absorbing side ball screw 61b forward (in the same direction). When moving to the left, the opposite operation is performed as shown in parentheses.
In the case of FIG. 2, the load unit 62 moves in the right (left) direction due to the rotation of the load side ball screw 61a and the reaction absorption side ball screw 61b, and the reaction absorption unit 63 also tries to move in the right (left) direction. . However, since the reaction absorption unit 63 is fixed by the apparatus base 64, the reaction absorption side ball screw 61b receives the reaction force and moves to the left as shown by the arrow C. As a result, the counter mechanism 8 shown within the bold frame moves on the apparatus base 64 in the left (right) direction indicated by the arrow B by the base guide 61e.

  In this case, the load unit 62 also tries to move in the left (right) direction as the drive unit 61 moves. However, the load-side ball screw 61a has a larger lead (movement amount) than the relationship of the equation (1). The load unit 62 moves in the right (left) direction indicated by the arrow A. A sufficient operating range can be obtained by setting the lead ratio R shown in Formula (1) to an appropriate value.

  In the present embodiment, as described above, the counter mechanism unit 8 including the drive unit 61 and the load unit 62 indicated by the thick black frame illustrated in FIG. 2 serves as a counter load that moves in the opposite direction to the load unit 62. That is, the mass Km of the counter mechanism unit 8 that occupies almost the entire reaction absorbing device serves as a counter load that absorbs vibration. This is a feature of the first embodiment. If the ratio of the mass Km to the mass Fm of the load unit 62 indicated by the broken line is M (= Km / Fm), the ratio M: R of the lead ratio R shown in the equation (1) approaches as M: R approaches 1. The vibration will be canceled out. In particular, when increasing the degree of cancellation, the M: R ratio is preferably in the range of 0.95 to 1.05. In the description of the first embodiment, the load side ball screw 61a and the reaction absorbing side ball screw 61b are rotated in the same direction, but may be reversed.

  According to the first embodiment of the present invention described above, the vibration opposite to the vibration generated by the load unit is generated by the reaction absorbing unit, and the vibration during operation can be reduced or offset.

  According to the first embodiment of the present invention described above, it is not necessary to add mass as a counter, and the reaction absorber can be reduced in weight and size. As a result, the reaction absorber can be driven at higher speed. Further, since the reaction absorber can be reduced in weight and size, the time until vibration is reduced or canceled can be shortened, and the tact time can be shortened. Since the time until the vibration is reduced or canceled is short, the bonding head can execute the next process after the vibration is eliminated without sacrificing the tact time, so that the quality can be improved.

  FIG. 4 is a diagram showing a basic configuration of the Z reaction absorbing device 7 according to the second embodiment of the present invention. The Z reaction absorbing device 7 has a function of moving the die up and down to attract and bond the die by the bonding head 32a. The basic configuration of the Z reaction absorbing device 7 is basically the same as that of the first embodiment shown in FIG. 1, but has some differences. Hereinafter, the difference will be mainly described. In FIG. 4, components having the same functions as those in the first embodiment are denoted by the same reference numerals.

  First, the load in the first embodiment is the Z reaction absorber 7 that moves the bonding head 32a up and down shown in FIG. 4, but the load in the second embodiment moves the tip of the Z reaction absorber up and down. It is a bonding head.

  Therefore, secondly, in the Z reaction absorbing device 7, the bonding head 32a moves up and down, and the load unit 62 having the bonding head is placed at the tip side and the reaction absorbing unit 63 is driven at the root so that the die can be easily attracted and bonded. It is provided near the motor 61c.

  Third, the device base 65 of the Z reaction absorbing device 7 is the load fixing base 62a of the X reaction absorbing device 6 or is fixed to the load fixing base 62a.

  Other configurations and operations are the same as those in the first embodiment. In FIG. 4, similarly to FIG. 2, the thick black frame indicates the counter mechanism unit 8 having the drive unit 61 and the load unit 62 that serve as a counter load, and the broken line frame indicates the load unit 62.

  Also in the second embodiment of the present invention described above, the vibration opposite to the vibration generated by the load unit is generated by the reaction absorbing unit, and the vibration during operation can be reduced or offset.

  In the second embodiment, the counter mechanism 8 serving as a counter load also moves up and down, so that the load capacity of the drive motor appears to increase. However, since the counter having the same mass needs to be moved up and down in the conventional example, the load capacity of the motor does not change.

  Also in the second embodiment of the present invention described above, it is not necessary to add mass as a counter, and the reaction absorber can be reduced in weight and size. As a result, the driving speed of the reaction absorbing device can be increased.

  Further, since the Z reaction absorbing device can be reduced in weight and size, the X reaction absorbing device 6 shown in the first embodiment can be further reduced in weight and size, and the entire bonding head portion 32 can be reduced in weight and size.

  3 is applied to the die bonder 10 having the two-degree-of-freedom linear motion operations of X and Z shown in the embodiment of the present invention, so that the waiting time and the low-speed driving time during die bonding are applied. Therefore, throughput can be improved. Moreover, since vibration during die bonding can be reduced, product quality, particularly die bonding accuracy, is improved.

In general, in the die bonder, in addition to the bonding head part, the preform head part has a linear motion of two degrees of freedom in the X and Z directions, and the wafer ring holder has a linear motion of two degrees of freedom in the X and Y directions. Note that X, Y, and Z are symbols given for ease of explanation, and the symbols themselves have no meaning.
Therefore, if the reaction absorbing device of the present invention described above is also applied to a preform head and a wafer ring holder, the waiting time and the low-speed driving time during die bonding can be further reduced, so that the throughput is improved. Further, since vibration during die bonding can be reduced, product quality, particularly die bonding accuracy, is further improved.

FIG. 5 shows a reaction absorbing device 9 that is a third embodiment applicable to the X reaction absorbing device 6 and the Z reaction absorbing device 7. In the third embodiment, the basic operation and configuration are the same as those in the first and second embodiments.
Hereinafter, the differences will be mainly described.

In the third embodiment, the load side ball screw 61a and the reaction absorbing side ball screw 61b are not arranged on a straight line but arranged in parallel. In order to drive in parallel, the driving force of the drive motor 61c is transmitted to the reaction absorption side ball screw 61b via gears 61f1 and 61f2. Since the driving force is transmitted by gears, the directions of the screw threads of the load side ball screw 61a and the reaction absorbing side ball screw 61b are provided in reverse. As a result, the reaction absorbing unit 63 tends to move in the same direction as the load unit 62. However, since the reaction absorbing unit 63 is fixed to the device base 64, it moves in the direction opposite to the load unit 62 with respect to the device base 64. As a result, the counter mechanism unit 8 shown in the bold frame is also moved in the direction opposite to the load unit 62 on the apparatus base 64 by the base guide 61e.
In FIG. 5, the driving force is transmitted by the gears. However, when the timing belt is used, the direction of the screw thread is the same, so that the operation similar to that in FIG. 5 can be performed.

  Therefore, also in the third embodiment, by using the counter mechanism 8 as a counter load, a vibration opposite to the vibration generated by the load unit 62 is generated by the reaction absorbing unit 63 to reduce or cancel the vibration during operation. be able to.

  Also in the third embodiment, since it is not necessary to provide a new counter, the reaction absorber can be reduced in weight and size. As a result, the driving speed of the reaction absorbing device can be increased.

  Furthermore, according to the third embodiment, the load unit 62 and the reaction absorbing unit 63 are arranged above and below the apparatus base 64 in the drawing. As a result, the length of the reaction absorbing device in the moving direction can be shortened. In addition, arrangement | positioning is not restricted to what is shown in FIG. 5, For example, you may arrange | position the load unit 62 and the reaction absorption unit 63 back and forth on the apparatus base 64 in the drawing depth direction.

In the above description, the die bonder has been described as an example of the semiconductor assembly apparatus. However, the present invention can be applied to other semiconductor assembly apparatuses in which the processing head operates at high speed.
A reaction absorbing device 5 according to the fourth embodiment is shown in FIG. In the fourth embodiment, the reaction absorption side ball screw 61b is disposed on the left side of the drive motor 61c, and the load side ball screw 61a is disposed on the right side of the drive motor 61c. At this time, the drive motor 61c, the load side ball screw 61a, and the reaction absorption side ball screw 61b are arranged in a straight line so that the rotation centers of the motor 61c, the load side ball screw 61a, and the reaction absorption side ball screw 61b coincide with each other. One end of each of the load side ball screw 61a and the reaction absorbing side ball screw 61b is rotatably supported by the driving fixed plate 61d.
Also in the fourth embodiment, the basic operation is the same as in the first and second embodiments.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

1: Wafer supply unit 2: Workpiece supply / conveyance unit 3: Die bonding unit 5, 9: Reaction reaction absorption device 6: X reaction reaction absorption device 7: Z reaction absorption device 8: Counter mechanism unit 10: Die bonder 12: Wafer ring holder 32 : Bonding head part 32a: Bonding head 61: Drive unit 61a: Load side ball screw 61b: Reaction absorption side ball screw 61c: Drive motor 61d: Drive fixing plate 61e: Base guide 61f1, 61f2: Gear 62: Load unit 62a: Load fixing base 62b: Load nut 62c: Load guide 63: Reaction absorption unit 63a: Reaction absorption nut (support member)
63b: Reaction absorber (support) 64, 65: Device base Fm: Mass of load unit 62 Km: Mass of counter mechanism R: Lead ratio of load side ball screw to reaction absorption side ball screw.

Claims (11)

Base and
A support fixed to the base;
Power source,
A load unit that moves by the power source and loads at least a processing head for assembling a semiconductor;
A counter mechanism that includes the power source and the load unit and moves in the opposite direction with respect to the load unit by the power source;
A support member provided on the support body and movably supporting the counter mechanism;
A recoil absorber. The load unit moves the operation of the power source through the first ball screw,
The recoil absorbing device according to claim 1, wherein the counter mechanism is movably supported by the support via a second ball screw. A device base,
A support fixed to the device base;
A first ball screw, a load unit that is moved in a predetermined direction by the first ball screw and uses as a load at least a processing head for assembling a semiconductor, and a second ball screw that generates a reaction force in a direction opposite to the predetermined direction A counter mechanism comprising: a drive unit having a power source for driving the first ball screw and the second ball screw;
A reaction absorption unit comprising the support and a support member that movably supports the counter mechanism by the second ball screw;
A recoil absorber.   The recoil absorbing device according to claim 2 or 3, wherein the first ball screw and the second ball screw are arranged in a straight line and have lead screws in the same direction.   The recoil absorbing device according to claim 1 or 3, wherein the device base is fixed so as not to move, and the counter mechanism portion moves along the device base.   The power source may be directly or indirectly connected to one end of one of the first ball screw or the second ball screw, or one end of each of the first ball screw or the second ball screw. The recoil absorbing device according to claim 2 or 3, wherein the recoil absorbing device is driven in a mechanical manner.   The reaction absorber according to claim 2 or 3, wherein the first ball screw and the second ball screw are arranged in parallel to each other.   The recoil absorbing device according to claim 2 or 3, wherein the lead of the first ball screw is larger than the lead of the second ball screw.   A semiconductor assembling apparatus comprising the recoil absorbing device according to claim 1, wherein a semiconductor is assembled by the processing head.   The semiconductor assembling apparatus is a die bonder, and the reaction absorbing device is applied to at least one linear motion device among a bonding head, a preform head, and a wafer ring holder included in the die bonder. Semiconductor assembly equipment.   The semiconductor assembly apparatus according to claim 10, wherein the linear motion device has two degrees of freedom orthogonal to each other.

Images