JP2013094716A - Chip component cleaning apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip component cleaning apparatus capable of surely and efficiently eliminating foreign matter sticking to chip components.SOLUTION: The chip component cleaning apparatus includes a cylindrical cleaning apparatus body 10 having a supply part 2 and a discharge part 3 for chip components, designed to form at least part of an outer peripheral wall 4 using a ventilating member for allowing gas to pass through, and rotated around an axis in an inclined attitude, and a gas spray nozzle 5 disposed near the cleaning apparatus body to spray gas to chip components 1 with the foreign matter sticking thereto, inside the cleaning apparatus body, through the outer peripheral wall of the cleaning apparatus body. The cleaning apparatus body is rotated in the inclined attitude, and the chip components supplied from the supply part pass through the inside of the cleaning apparatus body toward the discharge part while rolling. Further, gas is sprayed from the gas spray nozzle to the chip components passing through the cleaning apparatus body while rolling, to eliminate the foreign matter sticking to the chip components.

Description

  The present invention relates to a chip component purification apparatus for removing foreign matters attached to chip components, and more particularly to a chip component purification device for removing foreign matters attached to chip components by blowing gas.

  For example, when manufacturing a chip-type multilayer ceramic electronic component such as a multilayer ceramic capacitor, a chip component (multilayer ceramic capacitor element) at a stage before forming an external electrode has an internal electrode on the end surface where the external electrode is to be formed. It has an exposed structure. In the manufacturing process of such a chip type multilayer ceramic electronic component, for example, blasting is performed by spraying alumina powder in order to reliably expose the internal electrode to the end surface of the chip component and improve the conduction reliability with the external electrode. A method of performing processing may be used.

  The chip parts subjected to such a blasting process have a powder such as alumina used for the blasting process attached to the surface, and this powder is poorly applied when a conductive paste for forming an external electrode is applied. This is the cause.

  As one of the methods for solving such a problem caused by adhesion of foreign matter to a chip component, a blow cleaning apparatus has been proposed in which foreign matter attached to a workpiece is removed by blowing a gas ( Patent Document 1).

  As shown in FIGS. 6A and 6B, the blow cleaning apparatus 101 includes a plurality of gas discharge units 110 having a plurality of discharge ports 111 and a plurality of positions at which gas discharged from the plurality of discharge ports 111 is blown. And a workpiece storage unit 120 for holding the workpiece 125. And the workpiece | work accommodating part 120 supports the several workpiece | work 125 arrange | positioned in the tray 121 which arrange | positions the some workpiece | work 125 so that the to-be-cleaned site | part of each workpiece | work 125 and each discharge port 111 may oppose. And a work presser (not shown) formed in a net shape.

  According to this blow cleaning apparatus, the work 125 is supported by the support member (work presser) of the work storage unit 120, and the gas is discharged from the discharge port 111 of the gas discharge unit 110 to be sprayed on the portion to be cleaned of the work 125. Therefore, foreign matters can be reliably removed without dropping the work 125, and the discharged gas is blown over the entire portion to be cleaned of the work 125 because the work presser is net-like. It is said that effects such as efficient removal of foreign matter can be obtained.

  However, in the blow cleaning apparatus of Patent Document 1, since the workpiece conveyed in the same posture is blown from one direction, there is a portion where the workpiece does not blow, and foreign matter remains depending on the portion. There is a problem.

JP 2008-132417 A

  The present invention solves the above-described problems, and an object of the present invention is to provide a chip component purification apparatus that can reliably and efficiently remove foreign matters adhering to a chip component.

In order to solve the above problems, the chip component purification apparatus of the present invention is:
A purification device main body that is cylindrical and includes a supply part for chip parts, a discharge part, and at least a part of the outer peripheral wall is made of a gas-permeable member that allows gas to pass through, and rotates around an axis in an inclined posture. ,
A gas blowing nozzle that is disposed in the vicinity of the purifying device main body and blows gas to the chip component to which foreign matter has adhered, inside the purifying device main body through the outer peripheral wall of the purifying device main body,
While rotating the purification device main body in an inclined posture and passing the inside of the purification device main body toward the discharge portion while rolling the chip component supplied from the supply unit,
It is configured to remove foreign matters attached to the chip component by blowing gas from the gas blowing nozzle to the chip component passing through the purification device main body while rolling.

As the air-permeable member, a mesh-like (net-like) material made of metal or resin, a material such as punching metal in which a large number of through holes are formed in a non-breathable plate-like material, or a gas can be passed. Various materials such as easily porous materials can be used. However, it is preferable to use a mesh-like (net-like) material as the air-permeable member because there is no fear that chip parts will spill out and there is little resistance when gas passes through.
However, in order to maintain the shape of the purification device main body, for example, a plate-like metal material or the like can be used for a part of the outer peripheral wall.
Moreover, although there is no restriction | limiting in particular in the kind of gas sprayed on a chip component, Usually, it is preferable to use air.

  Moreover, in the chip | tip component purification apparatus of this invention, it is preferable that the cross-sectional shape at the time of cut | disconnecting the said purification apparatus main body to the direction orthogonal to an axial direction is a polygon.

  Moreover, it is preferable that the gas blowing port of the gas blowing nozzle has a flat shape such that the axial direction of the purification device main body is the longitudinal direction.

  In addition, it is desirable that a plurality of the gas spray nozzles are arranged along the axial direction of the purification device main body.

  Moreover, it is preferable that the one end part of the said purification apparatus main body is made into the opening part, and the said opening part is made into the discharge part of a chip component.

  Moreover, it is preferable that the purification apparatus main body includes a foreign matter discharging means for discharging the foreign matter removed from the chip component to the outside of the system.

  The chip component purification apparatus of the present invention is cylindrical, includes a chip component supply unit and a discharge unit, and at least a part of the outer peripheral wall is made of a gas-permeable member that allows gas to pass through. A purification device body that rotates around the center and a gas blowing nozzle that is disposed in the vicinity of the purification device body and blows gas to the internal chip components through the outer peripheral wall of the purification device body, and is purified in an inclined posture. While rotating the device main body and rolling the chip component supplied from the supply unit, the inside of the purification device main body is passed toward the discharge unit, and gas is blown from the gas blowing nozzle to the chip component passing through the purification device main body. Since the spraying is performed, the gas can be sprayed uniformly on the entire surface of the chip component, and the foreign matter adhering to the chip component can be efficiently and surely removed.

  That is, since the purification device main body rotates in an inclined posture, the chip component passes through the purification device main body toward the discharge portion while rolling, so that the chip component that rolls by blowing gas from the gas blowing nozzle It is possible to spray gas over the entire surface of the substrate, and foreign matters adhering to the chip component can be reliably removed.

  In addition, if the rotational speed of the purification device body is too slow, the dispersion and rolling of the chip parts will be insufficient, and the uniformity of foreign matter removal will tend to decrease, and if the rotational speed of the purification device body is too fast Since the rolling of the chip part becomes excessive and the chip part is damaged, it is not preferable. Therefore, normally, it is desirable to set an appropriate rotation speed in consideration of the dimensions of the chip parts and the inclination of the purification device body.

  In addition, by setting the amount of chip parts to be supplied to the purifier main body to an appropriate amount, it is possible to roll the chip parts reliably and evenly blow gas to an appropriate amount of chip parts from the gas blowing nozzle. This makes it possible to remove foreign matter with high reliability.

  In addition, when the cross-sectional shape of the purification device main body cut in a direction orthogonal to the axial direction is a polygon, the internal chip components can be efficiently rolled by rotating the purification device main body. Therefore, it is possible to blow the gas uniformly on the surface of the chip component more reliably, and the present invention can be further effectively realized.

  Moreover, the shape of the tip part from which the gas of the gas blowing nozzle blows is a flat shape in which the direction along the axial direction of the purification device main body is the longitudinal direction, so that the unit in the axial direction of the purification device main body per unit nozzle It is possible to widen the gas blowing range and efficiently blow the gas to the chip parts passing through the purification device main body.

  In addition, a plurality of gas spray nozzles are arranged along the axial direction of the purifier main body, thereby widening the gas spray range in the axial direction of the purifier main body and passing through the purifier main body. Gas can be efficiently blown onto the component, and foreign substances adhering to the chip component can be efficiently removed accordingly.

  In addition, by using one end of the purification device main body as an opening, and using this opening as a discharge part for chip parts, it is possible to simplify the structure of the apparatus and provide a chip part purification apparatus with excellent economy. become.

Further, by providing a foreign matter discharging means for discharging the foreign matter removed from the chip component to the outside of the system in the purification device main body, it is possible to prevent the foreign matter from reattaching to the chip component and further improve the reliability of foreign matter removal. be able to.
The foreign matter discharging means can be configured to discharge only the foreign matter, and the foreign matter is sucked and discharged out of the system together with part or almost all of the gas blown from the gas blowing nozzle. A configuration is also possible.

It is a front view showing typically the composition of the chip parts purification device concerning the embodiment of the present invention. It is a figure which shows the cross section of the direction orthogonal to the axial direction of the purification apparatus main body which comprises the chip | tip component purification apparatus concerning embodiment of this invention. It is a top view which shows typically the principal part structure of the chip component purification apparatus concerning embodiment of this invention. In the chip | tip component purification apparatus concerning embodiment of this invention, it is a figure (front view) for demonstrating the mechanism for rotating a purification apparatus main body in the inclined state. In the chip | tip component purification apparatus concerning embodiment of this invention, it is a figure (side view) for demonstrating the mechanism for rotating a purification apparatus main body in the inclined state. It is a figure which shows the conventional chip component purification apparatus (blow cleaning apparatus), (a) is a top view, (b) is a front view.

  Embodiments of the present invention will be described below to describe the features of the present invention in more detail.

[Embodiment 1]
FIG. 1 is a front view schematically showing a main part configuration of a chip part purification apparatus according to an embodiment (Embodiment 1) of the present invention, FIG. 2 is a side sectional view, and FIG. 3 is a plan view.

  In this embodiment, after the blasting process, the surface of the multilayer ceramic capacitor element (chip component) having a powder such as alumina used for the blasting process adhered to the surface is adhered to the surface. A chip component purification apparatus for removing and purifying foreign matters will be described as an example.

  As shown in FIGS. 1 to 3, this chip component purification device is a hexagonal cylinder, and is provided with a chip component supply port (supply unit) 2 and a discharge port (discharge) for removing the chip component 1 after removing foreign matter. Part) 3, and at least a part of the outer peripheral wall 4 is made of a net-like member (breathable member) that does not obstruct the passage of gas, and can be rotated around an axis in an inclined posture. A cage-like purification device main body 10 is provided.

  Furthermore, this chip component purification apparatus is configured to have a plurality of gas (air in this embodiment) disposed in the vicinity of the purification apparatus main body 10 and sprays the chip parts 1 inside through the outer peripheral wall 4 of the purification apparatus main body 10. A gas blowing nozzle 5 and foreign matter discharging means 6 for discharging foreign matter removed from the chip component 1 in the purification apparatus main body 10 to the outside of the system are provided.

In addition, the chip component purification apparatus according to the first embodiment has dimensions as follows:
Length dimension: 0.6-4.5mm
Width dimension: 0.3-3.2 mm
Thickness dimension: 0.3-2.8mm
This is a chip part purification device suitable for use in removing foreign substances adhering to a certain degree of chip parts.

As the purification device main body 10, a cylindrical structure having a hexagonal cross-sectional shape in a direction orthogonal to the longitudinal direction (axial direction) that is the direction of arrow A in FIG. 1 is used. In addition, by making the cross-sectional shape polygonal, when the purification device main body is rotated, it is possible to efficiently roll the internal chip component and to uniformly blow gas onto the surface of the chip component.
However, the cross-sectional shape may not be a hexagon but may be a polygon less than a hexagon or a polygon exceeding a hexagon.
The dimensions of each side of the cross section of the purification device main body 10 (the dimension of one side of the hexagon) are larger than any of the length, width, and thickness of the chip component, so that the chip component can efficiently roll. Desirable from.

Moreover, the outer peripheral wall 4 of the purification apparatus main body 10 is comprised from the member (net-like member) formed from the metal net-like material which does not prevent passage of gas. However, it goes without saying that a metal material that is not a net-like member can be used for a part of the outer peripheral wall as a skeleton forming material for maintaining the shape of the purification device main body 10.
Note that the mesh size of the mesh member (when using a punching metal or other material in which a large number of through-holes are formed in a plate-like material), the size of the chip parts will not spill. is necessary.

Further, in the first embodiment, the purification device main body 10 has an inclination of about 8 ° with respect to the horizontal direction from the supply port 2 toward the discharge port 3 (downhill toward the discharge port 3 from the supply port 2). Is given).
In addition, it is desirable that the inclination of the purification apparatus main body 10 is normally given an inclination such that the supply port 2 side is higher than the discharge port 3 side in a range of 5 to 10 ° with respect to the horizontal direction. .
The range of 5 to 10 ° is preferable because if the inclination angle exceeds this range, the speed at which the chip component 1 passes through the purification device main body 10 is too high, and the foreign matter removal state varies. In addition, if the inclination angle is less than this range, it takes too much time for the chip component 1 to pass through the purification device main body 10, and the productivity (efficiency) is lowered.

  Further, as shown in FIG. 5, the purification device main body 10 is configured to be rotated in the direction of the arrow B by the driving force of the motor 12 transmitted via the belt 11. That is, in the chip component purification apparatus of the first embodiment, as shown in FIGS. 4 and 5, the flange 20 provided in the purification apparatus body 10 is held by the driving side roller 21 and the driven side roller 22. The drive force of the motor 12 is transmitted to the drive side roller 21 by the belt 11 and the drive side roller 21 is rotated so that the purification device main body 10 can be rotated in the direction of arrow B.

And the inclination of the purification apparatus main body 10 can be controlled by adjusting the height of the drive side roller 21 and the driven side roller 22.
Further, as schematically shown in FIG. 4, the driving side roller 21 and the driven side roller 22 are each configured by combining two rollers, the side shape is H-shaped (see FIG. 4), and the groove width C However, since it is formed larger than the thickness D of the flange 20 provided in the purification device main body 10, the purification device main body 10 can be smoothly rotated even when the inclination of the purification device main body 10 is increased.
However, the purification apparatus main body 10 can be configured not to use the belt 11 but to rotate by gear driving.
In addition, when the rotational speed of the purification apparatus main body 10 is too slow, the dispersion | distribution and rolling of the chip component 1 will become inadequate, and there exists a tendency for the uniformity of a foreign material removal to fall. Moreover, when the rolling speed of the purification apparatus main body 10 is too fast, the rolling of the chip component 1 becomes excessive, and the chip component 1 may be damaged, which is not preferable.
Therefore, although the rotation speed of the purification apparatus main body 10 is related to the inclination angle, it is usually desirable to set the rotation speed within a range of 15 to 25 rotations / minute.

Further, the gas spray nozzle 5 is more than the center of the side surface of the purifier main body 10 so that the compressed air can be efficiently sprayed to the chip component 1 that mainly rolls in the lower portion inside the purifier main body 10. It arrange | positions so that compressed air can be sprayed toward a lower position.
The gas spray nozzle 5 can adjust the spray angle in the vertical direction, and is configured to be able to spray gas to a predetermined position in the vertical direction of the purification apparatus main body 10.

  As shown in FIGS. 1 and 3, the distal end side of the gas blowing nozzle 5 has a flat shape such that the axial direction of the purification device main body 10 (the direction of arrow A in FIG. 1) is the longitudinal direction. In addition, a plurality of gas spray nozzles 5 are arranged along the axial direction of the purification device main body 10 (the direction of arrow A in FIG. 1).

  In this way, the plurality of gas spray nozzles 5 are arranged, and the shape of the tip side of the gas spray nozzle 5 is made flat so that the axial direction of the purifier main body 10 is the longitudinal direction, thereby purifying the purifier. From the upstream side to the downstream side of the main body 10, compressed air can be blown from the gas blowing nozzle 5 in a nearly continuous state.

  In addition, on the supply port (supply unit) 2 side of the purification device main body 10 to which the chip component 1 is supplied, a charging box 13 and a parts feeder 14 into which the chip component 1 is loaded are disposed. The inserted chip component 1 is configured to be supplied to the purification apparatus main body 10 at a predetermined pace via the parts feeder 14.

  In addition, a receptacle 16 for receiving the chip component 1 is disposed in the discharge port (discharge unit) 3 for taking out the chip component 1 after removing the foreign matter. 15 is configured to accumulate in the receiver 16 through 15.

  Further, the foreign matter discharging means 6 for discharging the foreign matter removed from the chip component 1 to the outside of the system described above is disposed in the lower side of the purifier main body 10 and is narrowed down toward the lower side. Receiver 6a, and a suction nozzle 6b that is provided below the receiver 6a and sucks foreign matter together with a part of the gas blown from the gas blowing nozzle and discharges it to the outside.

  Next, a method for purifying a chip part using the chip part purification apparatus of the first embodiment will be described below.

(1) First, the chip component 1 is loaded into the loading box 13.
(2) The chip component 1 put into the throwing box 13 is carried from the throwing box 13 to the parts feeder 14 and sent from the parts feeder 14 to the purification apparatus main body 10.
At this time, the purification apparatus main body 10 is rotated at a speed of 15 to 25 rotations / minute while being inclined by about 8 ° with respect to the horizontal direction.
(3) The chip component 1 supplied to the rotating purifier main body 10 is conveyed toward the discharge unit 3 while rolling in the purifier main body 10, and in the process, gas ( Air) is blown uniformly, so that foreign matters are reliably removed.
(4) The foreign matter removed from the chip component 1 is discharged out of the system by the foreign matter discharging means 6.
(5) The chip component 1 discharged from the discharge unit 3 of the purification device main body 10 is stored in the receiver 16 through the chute 15. Thereafter, the chip component 1 from which the foreign matter has been removed is provided to the next process.

  As described above, when the foreign matter removal is performed using the chip component purification apparatus of the first embodiment, the foreign matter adhered to the chip component 1 by rolling the chip component 1 uniformly while blowing the gas over the entire surface. Can be removed efficiently and reliably.

  Moreover, since the shape of the front-end | tip part which gas blows out of the gas spray nozzle 5 is made into the flat shape where the direction along the axial direction of the purification apparatus main body 10 becomes a longitudinal direction, the purification apparatus main body 10 per unit nozzle is Since the gas spraying range in the axial direction is widened and a plurality of gas spraying nozzles 5 are arranged along the axial direction of the purification device main body 10, the gas spraying range in the axial direction of the purification device main body 10 is increased. This makes it possible to remove the foreign matter adhering to the chip component 1 efficiently.

  In addition, since the chip component purification apparatus according to the first embodiment includes the foreign matter discharging means 6 for discharging the foreign matter removed from the chip component 1 to the outside of the system, the foreign matter is prevented from reattaching to the chip component 1. Thus, the reliability of foreign matter removal can be further improved.

  In the first embodiment, the foreign matter adhering to the surface is removed and purified from the multilayer ceramic capacitor element (chip component) in which the powder such as alumina used for the blasting treatment adheres as a foreign matter on the surface. However, there is no particular restriction on the type of the chip component, and the present invention is also applicable to the case of removing foreign substances adhering to the surface from other types of chip components. Is possible.

  The invention of the present application is not limited to the above embodiment in other respects as well, and the purification device main body rotates in a specific configuration of the purification device main body, the arrangement and structure of the gas blowing nozzle, and an inclined posture. Various applications and modifications can be made within the scope of the invention with respect to the mechanism for causing the movement to occur.

1 Chip component 2 Supply port (supply part)
3 discharge port (discharge section)
DESCRIPTION OF SYMBOLS 4 Outer peripheral wall 5 Gas spray nozzle 6 Foreign matter discharge means 6a Receiver 6b Suction nozzle 10 Purifier main body 11 Belt 12 Motor 13 Input box 14 Parts feeder 15 Chute 16 Receiver 20 Hook 21 Driving side roller 22 Driven side roller A Purifier main body Arrow indicating the longitudinal direction (axial direction) of the material B arrow indicating the rotational direction of the purification device body C width of the groove of the roller D thickness of the collar

Claims (6)

A purification device main body that is cylindrical and includes a supply part for chip parts, a discharge part, and at least a part of the outer peripheral wall is made of a gas-permeable member that allows gas to pass through, and rotates around an axis in an inclined posture. ,
A gas blowing nozzle that is disposed in the vicinity of the purifying device main body and blows gas to the chip component to which foreign matter has adhered, inside the purifying device main body through the outer peripheral wall of the purifying device main body,
While rotating the purification device main body in an inclined posture and passing the inside of the purification device main body toward the discharge portion while rolling the chip component supplied from the supply unit,
A chip component configured to remove foreign matter adhering to the chip component by blowing gas from the gas blowing nozzle to the chip component passing through the purification device main body while rolling. Purification equipment.   2. The chip part purification device according to claim 1, wherein the purification device main body has a polygonal cross-sectional shape when cut in a direction orthogonal to the axial direction.   3. The chip part purification apparatus according to claim 1, wherein the gas blowing port of the gas blowing nozzle has a flat shape such that an axial direction of the purification apparatus main body is a longitudinal direction.   The chip part purification apparatus according to any one of claims 1 to 3, wherein a plurality of the gas spray nozzles are disposed along an axial direction of the purification apparatus main body.   5. The chip component purification device according to claim 1, wherein one end portion of the purification device main body is an opening, and the opening is a discharge portion for the chip component.   6. The chip part purifying apparatus according to claim 1, further comprising a foreign matter discharging means for discharging the foreign matter removed from the chip part to the outside of the system in the purifying apparatus main body.

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