JP2013086333A - Film forming method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of forming a high homogeneous thin film by molding and taking out a film forming workpiece not to make a molding mark or a taking out mark on a film forming surface.SOLUTION: When the film forming workpiece (W1) molded by injection molding is taken out, a mold is opened to leave the film forming surface (M1) of the film forming workpiece on a movable side mold (5) and the film forming workpiece is taken out from the movable side mold (5) by adsorbing a non-film forming part (M'1) exposed by opening the mold. In such a case, the film forming workpiece is peeled off by blowing compressed air (24, 24) between the edge part of the film forming workpiece (W1) and a parting face (P) of the movable side mold (5), to which the edge part is stuck, to break the vacuum adsorptive power.

Description

  The present invention relates to a film forming method for carrying a resin film forming work into a film forming chamber, and forming a thin film on a predetermined surface of the carried work, and is particularly characterized by injection molding for forming a film forming work. It is related with the film-forming method which has this.

  As a product having a thin film on the order of several μm on a part of the surface of the film forming work, for example, a front lamp equipped in an automobile can be cited. The front lamp is manufactured by a vapor deposition apparatus or a film forming apparatus. The film forming apparatus generates a magnetic disk, generates a metal film on a recording surface of a CD / DVD, generates a transparent electrode of a liquid crystal display device, and generates a photocatalytic film. It has also been applied. In a product having such a thin film, a film forming work is formed by injection molding, set in a dedicated film forming chamber, and then a thin film is formed by a film forming element as described later.

  A vapor deposition method or a film forming method for forming a thin film on the surface of the film forming work is well known in the art. For example, the surface of the film forming work and the target material are opposed to each other, and the pressure is about several to several tens of Pa. A sputtering method in which a negative voltage of several kV is applied to the target material in an argon gas atmosphere and then discharged to form a thin film, and the target material is irradiated with an electron beam generated from an electron gun in a vacuum chamber to heat evaporation. Electron beam evaporation method for forming a film on the surface of a workpiece, ion plating method for applying a negative voltage of several kV to the workpiece and vacuum deposition under a pressure of several Pa of argon gas, plasma film forming method, etc. are known Chemical vapor deposition is also known. As target materials used in such a film forming method, compound targets such as oxides, nitrides, and carbides are known, and metal targets, powder targets, and the like are also known.

JP 2008-221575 A

  In Patent Document 1, the inner surface of one half-hollow body of a pair of half-hollow bodies formed by the fixed-side mold and the moving mold, that is, the surface of the film forming work is left in the fixed-side mold. A film forming apparatus for covering a deposition chamber provided with deposition elements such as a target electrode, a substrate electrode, and a vacuum suction tube, and depositing in a fixed mold is shown.

  According to the vapor deposition apparatus shown in Patent Document 1, it is possible to deposit in a mold using a vapor deposition chamber without taking out a workpiece from the mold, so that there is no molding trace on the surface to be deposited. . Moreover, it is not contaminated by dirt, dust, or the like, and an effect is obtained that a product having a high-quality thin film with a good vapor deposition state can be obtained. Moreover, since vapor deposition is performed in the mold while remaining in the mold, inventory management of the semi-hollow body becomes unnecessary. Furthermore, it is possible to obtain an effect that automatic molding can be performed at low cost without using a special mold only by preparing a vapor deposition apparatus.

  However, there are also points to be improved. For example, the timing of forming a workpiece with a mold is different from the timing of vapor deposition using a vapor deposition chamber, so that a waiting time occurs to match the timing, and efficient production cannot be performed. Further, since the vacuum chamber must be formed inside the vapor deposition chamber by bringing the opening of the deposition chamber into close contact with the parting surface of the mold, there is also a problem of sealing. That is, since the degree of vacuum affects the quality of the product, high sealing performance is required. However, the opening of the deposition chamber and the parting surface of the mold are different from each other according to the purpose. As a result, the seal becomes a problem.

For the reasons as described above, it can be said that it is preferable that the film-forming workpiece formed by the mold is taken out from the mold, carried into a dedicated film forming apparatus, and then formed into a film. However, the film forming work is manufactured by injection molding, but the injection molded product is designed so that when the movable mold is opened, the ejector pin protrudes and the molded product is removed from the mold. The film formation surface is damaged. Such a flaw becomes fatal for a thin film product on the order of several μm even if it is shallow.
Therefore, according to the present invention, when a film forming work is formed by injection molding or taken out from a mold, a thin film product can be obtained in which the film forming surface does not have injection molding marks, that is, has a highly homogeneous thin film. It aims at providing the film-forming method.

  According to the present invention, the film forming workpiece is formed by injection molding. As is well known in the art, a fixed side mold and a movable side mold are applied to this injection molding, and inserts are used as necessary. Moreover, it can also shape | mold from a different kind of resin by 1st and 2nd shaping | molding. As a result, a workpiece having a complicated shape can be automatically formed. When forming a film forming workpiece in this way, a non-film forming part other than the film forming surface is sucked and a gripping part is integrally formed by a robot or a part other than the film forming surface. Is picked up by a robot, taken out from the mold, and carried into the film forming chamber.

  The film forming work is carried into the film forming chamber, and is placed on the film forming table so that the film forming surface or the film forming part of the film forming work faces the target material. Then, the robot or the like is removed as necessary. At this time, unnecessary gates are cut off. Next, the film formation element is activated to form a film as is well known.

  That is, in order to achieve the above object, the invention according to claim 1 is a molding process in which a film-forming workpiece is injection-molded by a pair of molds, and the film-forming workpiece molded in the molding process is separated from the mold. In the method comprising a take-out step to be taken out and a film-formation step in which the film-forming work taken out in the take-out step is carried into a film-forming chamber to form a film, at the time of the take-out step, the film-forming surface of the film-forming work The mold is opened so that it remains in the mold, and the non-film forming part exposed by opening the mold is sucked or the sprue part of the non-film forming part is held and the film forming work is taken out from the one mold. Composed. According to a second aspect of the present invention, in the method according to the first aspect, an edge portion of the film-forming workpiece and a parting surface of the one mold to which the edge portion is attached during the extraction step. It is configured to blow compressed air in between.

  According to a third aspect of the present invention, there is provided a molding step in which a film-forming workpiece is injection-molded by a pair of molds, a film-drawing workpiece molded in the molding step is taken out of the die, and the step is taken out. In the method comprising the film forming step of bringing the formed film forming work into the film forming chamber and forming the film, the film forming work is formed by the side gate and integrated with the film forming work during the forming step. A gripping part is formed on the non-film-forming surface side, and the mold is opened so that the non-film-forming surface of the film-forming workpiece remains in one mold during the unloading process, and the gripping part on the non-film-forming surface side is The film forming workpiece is taken out from the one mold by being pushed out by an eject pin. According to a fourth aspect of the present invention, in the method according to the third aspect, when the gripping part on the non-film-forming surface side is pushed out with an eject pin during the extraction step, the non-film-forming surface side can be directly connected to another eject pin. The invention according to claim 5 is configured to extrude, and in the method according to claim 3 or 4, when the film forming work is pushed out by a predetermined amount during the taking out step, the holding part is held and taken out. Composed.

  As described above, according to the present invention, the molding process for injection-molding the film-forming work, the taking-out process for taking out the film-forming work formed in the molding process from the mold, and the film-forming taken out in the taking-out process. A film forming process for carrying a film into a film forming chamber, and opening the mold so that the film forming surface of the film forming work remains in one mold during the take-out process. The exposed non-film forming part is sucked or the sprue part of the non-film forming part is held and the film forming work is taken out from the one mold, that is, the film is taken out from the mold without touching the film forming surface. Since film formation is carried into the chamber, a thin film product having a highly homogeneous thin film can be obtained. According to the second aspect of the present invention, compressed air is blown between the edge of the film-forming workpiece and the parting surface of the one mold to which the edge is attached during the take-out process. The vacuum force between the film-forming workpiece and the mold is broken by the air, and even a large film-forming workpiece can be easily peeled off or taken out.

  According to another invention, the film forming work is formed by the side gate, and the grip portion is formed on the non-film forming surface side integrally with the film forming work, and the film forming work is not formed during the unloading process. The mold is opened so that the film surface remains in one mold, and the gripping part on the non-film-formation surface side is pushed out by the eject pin, and the film-forming work is taken out from the one mold. No molding marks remain on the film-forming surface of the film workpiece. Therefore, the effect that the thin film product which has the highly homogeneous thin film similar to the said invention can be obtained is acquired. According to the invention described in claim 4, when the gripping portion on the non-film-forming surface side is pushed out with the eject pin during the unloading process, the non-film-forming surface side is pushed out directly with another eject pin, so that the film forming work is more reliably performed. Can be taken out. According to the fifth aspect of the present invention, when the film forming work is pushed out by a predetermined amount, the gripping portion is gripped and taken out, so that the takeout is reliable and the gripping state can be carried into the film forming chamber. it can.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the shaping | molding state of the film-forming workpiece | work concerning the 1st Embodiment of this invention, The (a) is sectional drawing which shows the state in the middle of shaping | molding with a metal mold | die closed, (i) is a metal mold | die It is sectional drawing which shows the state which opened and adsorb | sucks the film-forming workpiece | work. It is sectional drawing which shows the state which carried in the film-forming workpiece | work concerning the 1st Embodiment of this invention in the film-forming chamber. It is a figure which shows the shaping | molding state of the film-forming workpiece | work concerning the 2nd Embodiment of this invention, The (a) is sectional drawing which shows the state in the middle of shaping | molding with a metal mold | die closed, (i) is a metal mold | die FIG. 3 is a cross-sectional view showing a state in which the film-forming workpiece is protruded by opening. It is sectional drawing which shows the state which carried in the film-forming workpiece | work concerning the 2nd Embodiment of this invention into the film-forming chamber.

  Embodiments of the present invention will be described below. The film-forming workpiece W1 according to the first embodiment has a hemispherical shape obtained by cutting a hollow sphere in the diameter direction, or a semicylindrical shape obtained by cutting a cylindrical body in the axial direction. The inner peripheral surface is a film formation surface M1. Therefore, the film forming surface M1 on the inner peripheral surface is injection-molded so as not to have a molding mark, and is carried into the film forming chamber.

  Since the film forming workpiece W1 can be injection-molded as is well known in the art, details of the mold are not shown, but the molding mold according to the first embodiment is shown in FIG. As shown in FIG. 1, the fixed side mold 1 and the movable side mold 5 that is opened and closed with respect to the fixed side mold 1 are included. On the parting surface P side of the fixed mold 1, a concave portion 2 for forming a convex outer peripheral surface on the outside of the molding workpiece W <b> 1 is formed. A sprue 3 is opened in the recess 2. As will be described later, when the film-forming workpiece W1 is removed from the movable mold 5, the sprue 3 near the recess 2 is cut off in order to use the sprue 3 'formed by the sprue 3 for suction or gripping. The area is relatively large and there is no conventional gate with a narrowed cross section.

  A hemispherical core 6 is provided on the parting surface P side of the movable mold 5. The core 6 is paired with the concave portion 2 of the fixed mold 1, and the diameter or size thereof is smaller than the diameter of the concave portion 2 by a predetermined amount. The inner peripheral surface of the inner concave formed by the core 6 is a film formation surface M1.

  A main part of the first embodiment of the take-out device for the forming workpiece W1 is shown in FIG. According to the present embodiment, the take-out device 10 is composed of an adsorption device 11 and a peeling device 21. The suction device 11 includes a main suction pipe 12 and a plurality of branch suction pipes 13, 13,... Branched from the suction pipe 12, and the tips of the plurality of branch suction pipes 13, 13,. This is a non-film-forming portion of W1, that is, an adsorption portion that adsorbs the outer peripheral surface M′1 and the sprue portion 3 ′. The peeling device 21 includes a main pressure pipe 22 and a plurality of branch pressure pipes 23, 23,... Branched from the pressure pipe 22, and a nozzle 24 is provided at the tip of these branch pressure pipes 23, 23,. , 24,... Are provided. These nozzles 24, 24,... Are directed between the parting surface P of the movable mold 5 and the opening peripheral edge of the molding work W1. Although the suction device 11 and the peeling device 21 are not shown in the figure, they are preferably attached to the chuck of the robot so as to be handled individually. According to the embodiment shown in FIG. 1, the nozzles 24, 24,... Are inserted on the parting surface P side of the mold, but are molded from the inside of the movable mold 5. It can also be formed as a plurality of air blowing holes or circumferential grooves directed to the opening periphery of the work W1. If it implements in this way, the taking-out apparatus 10 becomes only the adsorption | suction apparatus 11, and becomes a simple structure.

  As described above, the film forming apparatus 50 is conventionally known as a sputtering film forming apparatus, an electron beam vapor deposition apparatus, an ion plating film forming apparatus or the like, and the sputtering type film forming apparatus is also a direct current type, high frequency type, magnetron. The DC sputtering film forming apparatus 50 is schematically shown in FIG. A flat film formation table (substrate electrode) 52 is provided below the film formation chamber 51, and a target mounting table (target electrode) 53 is provided above and opposite to the film formation table 52. A target 54 is attached to the target mounting base 53. A DC power supply 55 connected to the film forming table 52 and the target mounting table 53 is disposed outside the film forming chamber 51. The film forming chamber 51 is connected with a vacuum source 56 including a rotary pump necessary for vacuum film formation, an inert gas tank 57 or an inert gas supply source 57 for producing an inert gas such as carbon dioxide. Yes. The inlet / outlet for the film-forming workpiece W1 is provided on the front side of the film-forming chamber 51 for easy operation, but is not shown in the drawing together with the front door and the like.

  Next, a film formation example according to the above embodiment will be described. As shown in FIG. 1A, the movable side mold 5 is clamped to the fixed side mold 1. Then, the cavity 4 for forming the film-forming workpiece W1 is constituted by the concave portion 2 of the fixed mold 1 and the core 6 of the movable mold 5. Molten resin is injected from the injection unit through the sprue 3 toward the cavity 4. A stage in the middle of injection and filling is shown in FIG. The movable mold 5 is opened after cooling and solidification.

  When the movable mold 5 is opened, the film forming surface M1 is opened in a state where it is attached to the surface of the core 6 of the movable mold 5. In order to open in such a state, for example, the molding work W1 may be peeled from the stationary mold 1 by blowing air from the stationary mold 1 to the molding work W1. In this way, the molding work W1 is left open in the movable mold 5, and the take-out device 10 is inserted toward the film-forming work W1 by an articulated robot (not shown), for example. The suction part at the tip of the branch suction pipes 13, 13,... Is in contact with the outer peripheral surface of the film forming work W1, that is, the non-film forming surface M'1. At the same time, the nozzles 24, 24,... Of the branch pressure pipes 23, 23,... Are positioned between the parting surface P of the movable mold 5 and the opening peripheral edge of the forming workpiece W1. A state in which the take-out device 10 is thus mounted is shown in FIG. The inside of the main suction pipe 12 is set to a negative pressure. As a result, the film-forming workpiece W1 is adsorbed by the adsorbing portion. At the same time, compressed air is supplied from the main pressure pipe 22 to the nozzles 24, 24,. Then, the take-out device 10 is driven in a direction away from the parting surface P. The film-forming work W1 is peeled off by the suction portions of the branch suction pipes 13, 13,. At this time, a suction force by a vacuum force acts between the inner peripheral surface M1 of the film-forming workpiece W1 and the core 6 of the movable mold 5, but the vacuum is applied by the compressed air supplied from the nozzles 24, 24,. Is destroyed. Thereby, it can take out easily, without damaging the internal peripheral surface M1 of the film-forming workpiece | work W1.

  In the state of being adsorbed by the adsorption device 11, it is carried into the film formation chamber 51 and placed on the film formation table 52. When placed, the film-forming surface M1 of the film-forming workpiece W1 faces the target material 54. Retreat the robot. Moreover, the adsorption | suction apparatus 11 is removed as needed. The front door of the film forming chamber 51 is closed. Activate the deposition element. That is, the vacuum source 56 and the inert gas supply source 57 are appropriately driven to make the inside of the film forming chamber 51 an inert gas atmosphere of about several Pa to several tens Pa. Then, a negative voltage is applied to the target mounting base 53 and a positive voltage is applied to the film forming base 52 to cause discharge. Then, the target particles reach the film forming surface M1 of the film forming work W1, and a thin film is formed as conventionally known.

  When the film forming operation is completed, the film forming element is stopped, the front door is opened, and the suction device 11 described above is used, or the film is taken out by another handling device such as a robot. When the sprue portion 3 ′ interferes with the product, it is cut and discarded. Thereafter, the film is formed in the same manner.

  3 and 4, a second embodiment of the present invention, that is, an example in which the outer peripheral surface that is convex outside the hemispherical body or the semicylindrical body is the film formation surface M2 will be described. Also in the present embodiment, the fixed side mold 31 and the movable side mold 35 are used. On the parting surface P side of the fixed-side mold 31, a recess 32 for forming the film-forming surface M2 of the film-forming workpiece W2 is formed. Since the concave portion 32 is a surface for forming the film formation surface M2, the sprue 33 or the gate is a side gate that is removed from the concave portion 32 so as not to form a molding mark.

  On the parting surface P side of the movable mold 35 that is opened and closed with respect to the fixed mold 31, a core 36 that is paired with the recess 32 of the fixed mold 31 is provided. Since the surface formed by the core 36 is the non-film-forming surface M′2, the film-forming work W2 is taken out using the surface M′2. That is, a relatively large-diameter through hole 37 and relatively small-diameter through holes 38 and 38 are opened on the surface of the core 36. A main ejector pin 40 is inserted into the large-diameter through hole 37, and short auxiliary ejector pins 41, 41 are inserted into the later-described ejector plate side of the small-diameter through holes 38, 38, in other words, at the rear end. It is like that. At the tip of the small-diameter through-hole 38, a resin gripping part or extrusion part is formed integrally with the film-forming workpiece W2. The rear end portions of the main ejector pin 40 and the auxiliary ejector pins 41 and 41 are attached to an ejector plate 42 provided on the movable side mold 35. Therefore, when the ejector plate 42 is driven, the main ejector pin 40 protrudes from the top surface of the core 36, and at the same time, the grip portion formed by the small-diameter through hole 38 is protruded by the auxiliary ejector pins 41, 41. Become.

  Next, the operation of the second embodiment will be described. Retract the ejector plate 42 as shown in FIG. Then, the movable mold 35 is clamped with respect to the fixed mold 31. Then, the cavity 34 for forming the film-forming workpiece W <b> 2 is constituted by the recess 32 of the fixed-side mold 31 and the core 36 of the movable-side mold 35. At the same time, cavities 44 and 44 for forming the gripping portion are formed by the inner peripheral surfaces of the small-diameter through holes 38 and 38 and the tip portions of the auxiliary ejector pins 41 and 41. The cavities 44 and 44 communicate with the cavity 34 for forming the film-forming workpiece W2. The molten resin is injected from the injection unit. A stage in the middle of injection filling with the molten resin is shown in FIG. Thereby, the film-forming workpiece W2 and the gripping portions H and H are integrally formed.

  The movable mold 35 is opened after cooling and solidifying. Then, the ejector plate 42 is driven. The main ejector pin 40 directly projects the auxiliary ejector pins 41 and 41 through the gripping portions H and H, and the film forming work W2 is projected. The gripping part H is gripped by a chuck RT of the robot and taken out from the movable mold 35. Processing such as cutting off the sprue portion 33 'is carried into the film forming apparatus 50 to form a film as described above. If necessary, the gripping portions H and H are cut off and commercialized.

  According to the present embodiment, the film formation surfaces M1 and M2 are described as convex surfaces or concave surfaces. However, the film formation surfaces M1 and M2 may be planar or even “surfaces having partial deformation portions” such as convex portions and concave portions. It is clear that a film can be formed. Further, as will be apparent to those skilled in the art, the take-out device can be implemented with only the adsorption device. Furthermore, it is apparent that the present invention can be implemented without the main ejector pin depending on the size of the film forming work. Further, instead of opening the movable mold, the fixed mold can be opened. When the film forming work is small, the sprue portion 33 'can be grasped and taken out.

W1, W2 Film-forming work M1, M2 Film-forming surface M'1, M'2 Non-film-forming surface H Gripping part (extrusion part)
DESCRIPTION OF SYMBOLS 1 Fixed side metal mold | die 2 Recessed part 4 Cavity 5 Movable side metal mold 6 Core 10 Take-out device 11 Adsorption device 21 Peeling device 31 Fixed side metal mold 32 Recessed part 34 Cavity 35 Movable side metal mold 36 Core 40 Main ejector pin 41 Auxiliary ejector pin 50 Deposition equipment 51 Deposition chamber

Claims (5)

A molding process in which a film-forming workpiece is injection-molded by a pair of molds, an extraction process in which the film-forming workpiece molded in the molding process is taken out from the mold, and a film-forming work taken out in the extraction process is formed into a film In a method comprising a film forming process of carrying into a chamber and forming a film
During the unloading process, the mold is opened so that the film-forming surface of the film-forming workpiece remains in one mold, and the non-film-forming part exposed by opening the mold is adsorbed or the sprue part of the non-film-forming part is held. The film forming method is characterized in that the film forming work is removed from the one mold. 2. The method according to claim 1, wherein compressed air is blown between an edge portion of the film forming workpiece and the parting surface of the one mold to which the edge portion is attached during the extraction step. A film forming method. A molding process in which a film-forming workpiece is injection-molded by a pair of molds, an extraction process in which the film-forming workpiece molded in the molding process is taken out from the mold, and a film-forming work taken out in the extraction process is formed into a film In a method comprising a film forming process of carrying into a chamber and forming a film,
During the molding step, the film forming work is formed by the side gate, and the gripping part is formed on the non-film forming surface side integrally with the film forming work,
At the time of the unloading step, the mold is opened so that the non-film-forming surface of the film-forming work remains in one mold, and the gripping part on the non-film-forming surface side is pushed out by an eject pin to remove the film-forming work from the one of the molds. A film forming method characterized by being taken out from a mold. 4. The film forming method according to claim 3, wherein, when the gripping portion on the non-film-forming surface side is pushed out by an eject pin during the extraction step, the non-film-forming surface side is also pushed out directly by another eject pin. . 5. The film forming method according to claim 3, wherein when a predetermined amount of the film forming workpiece is pushed out during the taking out step, the holding part is held and taken out.