JP2013084796A - Led device, manufacturing method of the same, and phosphor dispersion liquid used for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase film strength of a seal layer for sealing an LED chip and improve durability of an LED device.SOLUTION: The LED device comprises: an LED light-emitting element which emits light of a specific wavelength; and a wavelength conversion part which converts light of the specific wavelength of the LED light-emitting element into light of another specific wavelength, wherein the wavelength conversion part is a layer comprising: a fluorescent substance; aluminum silicate; and a binder, and the aluminum silicate is preferably imogolite.

Description

  The present invention relates to an LED device, a manufacturing method thereof, and a phosphor dispersion liquid used therefor.

  Light-emitting elements (LED elements) using LED chips have been increasingly applied to various applications as the demand for higher luminance and energy saving of light-emitting elements increases. In particular, a white LED element that emits white light by combining blue light and yellow light by combining a blue LED chip and a phosphor that emits yellow light by receiving blue light is known. Such white LED elements have come to be used as lighting for electric lights that require white light, backlights for liquid crystal display devices, and the like.

  In addition, as a white LED element that combines an LED chip and a phosphor, a white LED is formed by further combining an LED chip that emits ultraviolet light and a phosphor that emits blue, green, and red light by ultraviolet light. A white LED element, a white LED element that emits white light by combining an LED chip that emits blue light and a phosphor that emits red and green light has been studied.

  As an illumination configuration combining an LED chip and a phosphor, a configuration in which the LED chip is sealed with a cured resin layer (silicone resin or the like) in which the phosphor is dispersed has been developed. Further, in order to uniformly disperse the phosphor particles in the sealing layer, it has been proposed that the liquid sealing material used as the raw material for the sealing layer contains the phosphor particles and the anti-settling material for the phosphor particles. (See Patent Document 1). Thereby, sedimentation of phosphor particles having a high specific gravity is prevented. Furthermore, after providing the phosphor particle-containing sealing layer around the LED chip, the sealing layer is cured while rotating the light emitting device, thereby reducing the chromaticity difference, that is, the color unevenness in the light emitting device. It has been proposed (see Patent Document 1).

  When the illuminating device in which the LED chip is sealed with the cured resin layer as described above is applied to an illuminating device (such as an automobile headlight) that requires high brightness, the cured resin layer may be thermally deteriorated. This is because the amount of heat generated from the LED chip is increased as compared with the prior art. On the other hand, the structure which seals an LED chip with the ceramic layer which the fluorescent substance disperse | distributed as a structure of the illumination which combined LED and the fluorescent substance is also proposed (refer patent document 2).

  On the other hand, imogolite is known as one of nanomaterials (see Patent Document 3). Imogolite is known to be useful as a dehydrating agent, for example.

JP 2004-153109 A JP 2000-349347 A JP 2000-128520 A

  As described in Patent Document 2, the LED chip is sealed with a ceramic layer in which a phosphor is dispersed, whereby the durability of the LED element is increased to some extent. However, in recent years, it is required to further improve the durability of the LED light emitting device. ing. One means for increasing the durability of the LED light-emitting device is to increase the film strength of the layer that seals the LED chip.

  Here, it has been found that the improvement of the film strength of the sealing layer and the uniform dispersion of the phosphor particles in the sealing layer can be realized by adding appropriate inorganic particles to the sealing layer. Therefore, an object of the present invention is to increase the film strength of the sealing layer and improve the durability of the LED device by blending appropriate inorganic particles in the phosphor layer covering the LED chip.

1st of this invention is related with the LED apparatus shown below.
[1] An LED device having an LED light emitting element that emits light of a specific wavelength, and a wavelength conversion part that converts light of a specific wavelength from the LED light emitting element into light of another specific wavelength,
The said wavelength conversion site | part is an LED device which is a layer containing fluorescent substance, aluminum silicate, and a binder.
[2] The LED device according to [1], wherein the aluminum silicate is imogolite.
[3] The LED device according to [1], wherein the content of the aluminum silicate compound in the wavelength conversion site is 0.5 wt% or more and 20 wt% or less.
[4] The LED device according to [1], wherein the binder is a transparent ceramic.
[5] The LED device according to [1], wherein the binder is a silicone resin.
[6] The LED device according to [1], wherein the wavelength conversion site is a layer further including oxide fine particles.

2nd of this invention is related with the manufacturing method etc. of the LED device shown below.
[7] A phosphor dispersion containing a phosphor, aluminum silicate, a binder or a binder precursor, and a solvent.
[8] A step of preparing an LED chip mounting package including a package and an LED chip having a light emitting surface arranged in the package; and the phosphor dispersion liquid according to [7] on the light emitting surface of the LED chip. And a step of forming a phosphor layer by applying and drying the substrate.

[9] A phosphor dispersion containing a phosphor, aluminum silicate, and a solvent.
[10] A step of preparing an LED chip mounting package including a package and an LED chip having a light emitting surface arranged in the package; and the phosphor dispersion liquid according to [9] on the light emitting surface of the LED chip. And a step of disposing a phosphor to dispose a phosphor; and a step of coating and drying a solution containing a binder or a binder precursor on the light emitting surface of the LED chip to form a phosphor layer. Device manufacturing method.

  In the LED device of the present invention, uneven color of the emitted light (preferably white light) is suppressed, and the durability is high, and the light emission characteristics can be maintained.

It is a figure which shows the cross section of a LED device roughly. It is a figure which shows the outline | summary of a coating device. It is a figure which shows a mode that several LED apparatus is manufactured continuously using a coating device.

1. About LED device The LED device (semiconductor light-emitting device) of the present invention has an LED light-emitting element and a wavelength conversion part. FIG. 1 is a cross-sectional view illustrating an example of the LED device 100. The LED light emitting element connects a package (LED substrate) 1 having a recess 11, a metal part (metal wiring) 2, an LED chip 3 disposed in the recess 11 of the package 1, and the metal part 2 and the LED chip 3. A protruding electrode 4. Thus, the aspect which connects the metal part 2 and LED chip 3 via the protruding electrode 4 is called flip chip type.

  The package 1 is, for example, a liquid crystal polymer or ceramic, but the material is not particularly limited as long as it has insulating properties and heat resistance.

  The LED chip 3 is, for example, a blue LED. Examples of the configuration of the blue LED include an n-GaN compound semiconductor layer (clad layer), an InGaN compound semiconductor layer (light emitting layer), and a p-GaN compound semiconductor layer (clad layer) stacked on the LED substrate 1. ) And a transparent electrode layer. The LED chip 3 has a surface of, for example, 200 to 300 μm × 200 to 300 μm, and the height of the LED chip 3 is 50 to 200 μm.

  In the LED device 100 shown in FIG. 1, one LED chip 3 is disposed in the recess 11 of the package 1; however, a plurality of LED chips 3 may be disposed in the recess 11 of the package 1.

About the wavelength conversion part 6 Furthermore, the LED device 100 has the wavelength conversion part 6 that covers the light emitting surface of the LED chip 3. The wavelength conversion part 6 is a layer containing phosphor particles, inorganic particles containing aluminum silicate, and a binder (transparent ceramic or transparent organic resin). The wavelength conversion site 6 may further contain inorganic particles such as tabular particle oxide fine particles. The wavelength conversion part 6 should just cover the light emission surface (at least the upper surface of LED chip 3) of LED chip 3, and as shown in FIG. 1, it may cover the upper surface and side surface of LED chip 3. preferable. This is because light can also be emitted from the side surface of the LED chip 3.

  The wavelength conversion portion 6 is a layer that receives light (excitation light) emitted from the LED chip 3 and emits fluorescence. By mixing excitation light and fluorescence, light of a desired color is emitted from the LED device 100. For example, if the light from the LED chip 3 is blue and the fluorescence from the wavelength conversion site 6 is yellow, the LED device 100 can be a white LED light-emitting device.

Phosphor Particles The phosphor particles contained in the wavelength conversion site 6 are excited by outgoing light having a specific wavelength (excitation wavelength) from the LED of the LED chip, and emit fluorescence having a wavelength different from the excitation wavelength. When blue light is emitted from the LED chip, the phosphor particles emit yellow fluorescence, whereby a white LED element is obtained. Examples of phosphors that emit yellow fluorescence include YAG (yttrium, aluminum, garnet) phosphors. The YAG phosphor can emit excitation light composed of blue light (wavelength 420 nm to 485 nm) emitted from the blue LED chip and emit yellow light (wavelength 550 nm to 650 nm).

  For example, phosphors can be obtained by, for example, 1) mixing an appropriate amount of a fluoride such as ammonium fluoride as a flux into a mixed raw material having a predetermined composition, and pressing to obtain a molded body. It can be manufactured by packing and firing in air at a temperature range of 1350 to 1450 ° C. for 2 to 5 hours to obtain a sintered body.

  A mixed raw material having a predetermined composition is obtained by sufficiently mixing the oxides of Y, Gd, Ce, Sm, Al, La, and Ga, or compounds that easily become oxides at high temperatures in a stoichiometric ratio. Can do. Alternatively, the mixed raw material having a predetermined composition is a coprecipitation oxidation obtained by firing a solution obtained by dissolving a rare earth element of Y, Gd, Ce, and Sm in an acid in a stoichiometric ratio and coprecipitating with oxalic acid. It can be obtained by mixing a material with aluminum oxide and gallium oxide.

  The type of the phosphor is not limited to the YAG phosphor, and other phosphors such as a non-garnet phosphor that does not contain Ce can also be used.

  The average particle diameter of the phosphor particles is preferably 1 μm or more and 50 μm or less, and more preferably 10 μm or less. The larger the particle size of the phosphor, the higher the light emission efficiency (wavelength conversion efficiency). On the other hand, if the particle size of the phosphor is too large, a gap generated at the interface between the phosphor and the binder in the phosphor layer increases, and the film strength of the phosphor layer decreases. The average particle diameter of the phosphor can be measured, for example, by a Coulter counter method.

  The concentration of the phosphor in the layer (phosphor layer) constituting the wavelength conversion site 6 varies depending on the type of binder contained therein. When the binder is a transparent ceramic, the mass of the phosphor contained in the layer constituting the wavelength conversion site 6, the mass of the ceramic as the binder, and inorganic particles containing aluminum silicate (tabular particles or oxides) It is preferable that it is 60 mass% or more and 95 mass% or less with respect to the total mass with the mass of microparticles | fine-particles etc. are included. Basically, the higher the concentration of the phosphor particles in the layer constituting the wavelength conversion site 6, the better. This is because if the concentration of the phosphor in the layer constituting the wavelength conversion site 6 is increased, the binder content decreases, and the distribution of the phosphor particles in the layer tends to be uniform. Further, when the concentration of the phosphor is increased, a necessary amount of the phosphor can be disposed in the LED device even if the layer is thinned.

  Moreover, when the density | concentration of the fluorescent substance particle in the layer which comprises the wavelength conversion site | part 6 is high, since fluorescent substance particles mutually adhere, the film | membrane intensity | strength of a layer can be raised. Furthermore, if the concentration of the phosphor particles in the layer constituting the wavelength conversion site 6 is high, the heat generated from the phosphor is easily dissipated from the layer.

  On the other hand, if the concentration of the phosphor in the layer constituting the wavelength conversion site 6 is too high (greater than 95% by mass), the binder content may be extremely reduced, and phosphor particles may bind to each other. There are cases where it is not possible.

About aluminum silicate The layer (phosphor layer) which comprises the wavelength conversion site | part 6 contains the inorganic particle containing aluminum silicate. Aluminum silicate is a hydrated aluminum silicate that has silicon (Si), aluminum (Al), oxygen (O), and hydrogen (H) as its main constituent elements and is assembled with a number of Si-O-Al bonds. is there. Typically, it is represented by the composition formula: SiO ₂ .Al ₂ O ₃ .2H ₂ O or (OH) ₃ Al ₂ O ₃ SiOH.

  An example of aluminum silicate is a tubular aluminum silicate called imogolite. Imogolite has, for example, a tubular shape having an outer diameter of 2.0 to 2.5 nm, an inner diameter of 1.0 to 1.5 nm, and a length of 5 to 6 μm.

  The content of the aluminum silicate in the layer constituting the wavelength conversion site 6 is preferably 0.5% by weight to 20% by weight, and more preferably 1% by weight to 12% by weight. Aluminum silicate has the effect of improving the film strength of the layer constituting the wavelength conversion site 6, but if the content of aluminum silicate is too small, the film strength may not be sufficiently increased. When the content of aluminum silicate is too large, the content of the phosphor particles is relatively lowered, so that the distribution of the phosphor particles in the layer may not be uniform.

  Further, as will be described later, a phosphor dispersion liquid is applied to form the wavelength conversion site 6. When aluminum silicate (especially imogolite) is contained in the phosphor dispersion liquid, the viscosity of the phosphor dispersion liquid increases, and sedimentation of the phosphor in the phosphor dispersion liquid is suppressed.

About the oxide fine particles The layer constituting the wavelength conversion site 6 may contain inorganic particles other than aluminum silicate. Examples of inorganic particles other than aluminum silicate include oxide fine particles and tabular particles. The oxide fine particles can be fine particles such as silicon oxide, titanium oxide, and zinc oxide. In particular, when the binder in the wavelength changing portion 6 is a ceramic that is a cured product of a silicon-containing organic compound such as siloxane, the oxide fine particles may be silicon oxide from the viewpoint of stability with respect to the formed ceramic. preferable.

  The oxide fine particles serve as a filler that fills a gap generated at the interface between the binder and the phosphor in the layer constituting the wavelength conversion site 6 and can function as a film reinforcing agent that improves the film strength of the layer.

  The average particle diameter of the oxide fine particles is preferably 0.001 μm or more and 50 μm or less in consideration of the respective effects described above. The average particle diameter of the oxide fine particles can be measured, for example, by a Coulter counter method.

  As for content of the oxide microparticles | fine-particles in the layer which comprises the wavelength conversion site | part 6, 0.1 to 8 mass% is more preferable. When the content of the oxide fine particles in the wavelength conversion site 6 is less than 0.1% by mass or exceeds 8% by mass, the film strength of the layer constituting the wavelength conversion site 6 is not sufficiently increased.

  The surface of the oxide fine particles may be treated with a silane coupling agent or a titanium coupling agent. By the surface treatment, the compatibility of the oxide fine particles with the organometallic compound and the organic solvent is increased.

Tabular grains Typical examples of the tabular grains contained in the layer constituting the wavelength conversion site 6 include layered clay mineral fine particles. The main component of the layered clay mineral fine particles is a layered silicate mineral, preferably a swellable clay mineral having a mica structure, a kaolinite structure, a smectite structure, etc., and a swellable clay mineral having a smectite structure rich in swelling properties. More preferred. Since the layered clay mineral fine particles have a flat plate shape, the film strength of the ceramic layer constituting the wavelength conversion site 6 can be improved.

  Further, as will be described later, a phosphor dispersion liquid is applied to form a ceramic layer. When tabular particles are contained in the phosphor dispersion liquid, the viscosity of the phosphor dispersion liquid is increased, and sedimentation of the phosphor in the phosphor dispersion liquid is suppressed. The tabular grains exist as a card house structure in the phosphor dispersion liquid, and the viscosity of the phosphor dispersion liquid can be significantly increased with a small amount.

  The tabular grain content in the layer constituting the wavelength conversion site 6 is preferably 0% by mass or more and 8% by mass or less, and more preferably 0.1% by mass or more and 8% by mass or less. When the content of the tabular grains in the wavelength conversion site 6 exceeds 8% by mass, the strength of the ceramic layer is lowered.

  In consideration of compatibility with the organic solvent in the phosphor dispersion liquid, the surface of the layered clay mineral fine particles may be modified (surface treatment) with an ammonium salt or the like.

About Binder The binder contained in the layer constituting the wavelength conversion site 6 binds the phosphor particles together. The binder is an organic resin such as a silicone resin, or a transparent ceramic such as glass. More specifically, the ceramic may be polysiloxane or polysilazane. By using a transparent ceramic as a binder, the heat resistance of the wavelength conversion part 6 can be improved as compared with the case where an organic resin is used as a binder.

  The ceramic content in the layer constituting the wavelength conversion part 6 is preferably 3% by mass or more and 35% by mass or less, and more preferably 10% by mass or more and 30% by mass or less. If the content of the binder (transparent ceramic) in the phosphor layer 6 is less than 3% by mass, the amount of ceramic as the binder is too small, and the strength of the layer constituting the wavelength conversion part 6 after heating and firing is lowered. On the other hand, when the content of the binder (transparent ceramic) exceeds 40% by mass, the content of aluminum silicate and inorganic fine particles is relatively lowered. When the content of the inorganic fine particles is relatively lowered, the strength of the layer constituting the wavelength conversion site 6 is lowered. In addition, when the content of the layered clay mineral fine particles in the layer constituting the wavelength conversion site 6 is relatively lowered, the content of the layered clay mineral fine particles in the phosphor dispersion liquid is likely to be lowered, and the viscosity of the phosphor dispersion liquid is also lowered. It's easy to do.

About the thickness of the layer which comprises the wavelength conversion site | part 6, Since the thickness of the layer which comprises the wavelength conversion site | part 6 is set according to the quantity of the fluorescent substance which a semiconductor light-emitting device requires, it is not specifically limited. However, the thickness of the layer constituting the wavelength conversion part 6 is preferably 150 μm or less, and more preferably 100 μm or less. When the thickness of the layer constituting the wavelength conversion part 6 exceeds 150 μm, the concentration of the phosphor particles in the wavelength conversion part 6 is usually excessively low, so that it is difficult to disperse the phosphor particles uniformly or the film strength is high. It is low.

  Although the minimum of the thickness of the layer which comprises the wavelength conversion site | part 6 is not restrict | limited in particular, Usually, it is 15 micrometers or more, Preferably it is 30 micrometers or more. Since the size (particle diameter) of the phosphor particles is usually 10 μm or more, it may be difficult to make the thickness of the layer constituting the wavelength conversion site 6 less than 15 μm.

  The thickness of the layer constituting the wavelength conversion part 6 means the maximum thickness L (see FIG. 1) of the layer disposed on the upper surface of the LED chip 3. The thickness of the layer can be measured using a laser holo gauge.

2. About the manufacturing method of an LED device An LED device can be manufactured through the process of forming a fluorescent substance layer by apply | coating a fluorescent substance dispersion liquid. Depending on the mode of the phosphor dispersion liquid used here, the manufacturing method of the LED device can be roughly divided into two.

  A first manufacturing method of an LED device is a phosphor dispersion liquid (“one-liquid type phosphor dispersion) containing phosphor particles, inorganic particles containing aluminum silicate, a binder or a binder precursor, and a solvent. Liquid)).

  A second manufacturing method of the LED device includes: a phosphor dispersion liquid containing phosphor particles, inorganic particles containing aluminum silicate, and a solvent (referred to as “two-liquid type phosphor dispersion liquid”); A solution containing a binder or a binder precursor (referred to as “binder solution”) is used. The two-component type phosphor dispersion liquid usually does not contain a binder and a binder precursor.

[First manufacturing method of LED device (1 liquid type phosphor dispersion liquid)]
A first manufacturing method of an LED device includes: 1) a step of preparing an LED chip mounting package including a package and an LED chip having a light emitting surface arranged in the package; and 2) a light emitting surface of the LED chip. And applying and drying a one-component phosphor dispersion to form a phosphor layer.

  The LED chip mounting package 90 includes the package 1 and the LED chip 3 arranged on the package 1 (see FIG. 2). A phosphor dispersion liquid is applied to the light emitting surface of the LED chip 3 of the LED chip mounting package 90.

About 1 liquid type phosphor dispersion liquid 1 liquid type phosphor dispersion liquid contains phosphor particles, aluminum silicate, a binder or a binder precursor, and a solvent. It may contain inorganic particles (oxide fine particles, tabular particles, etc.). The types of phosphor particles, aluminum silicate, tabular particles, and oxide particles are as described above.

  The binder contained in the one-component type phosphor dispersion liquid is a transparent organic resin such as a silicone resin. On the other hand, the binder precursor is, for example, an organometallic compound. The organometallic compound becomes a transparent ceramic (preferably a glass ceramic) through a sol-gel reaction. The produced ceramic binds inorganic particles including phosphor and aluminum silicate to constitute a phosphor layer for sealing the LED chip.

  Examples of organometallic compounds include metal alkoxides, metal acetylacetonates, metal carboxylates, and the like, but metal alkoxides that are easily gelled by hydrolysis and polymerization reactions are preferred. There is no limitation on the type of metal as long as a translucent glass ceramic can be formed. From the viewpoint of the stability of the formed glass ceramic and the ease of production, it is preferable to contain silicon. A plurality of types of organometallic compounds may be combined.

  The metal alkoxide may be a single molecule such as tetraethoxysilane, or may be a polysiloxane in which an organosiloxane compound is linked in a chain or a ring; however, according to the polysiloxane, the viscosity of the phosphor dispersion liquid can be increased. .

Another example of the organometallic compound includes polysilazane (also referred to as silazane oligomer). Polysilazane can be represented by the general formula: (R ₁ R ₂ SiNR ₃ ) _n . In the formula, R ₁ , R ₂ and R ₃ each independently represent a hydrogen atom or an alkyl group, an aryl group, a vinyl group or a cycloalkyl group, but at least one of R ₁ , R ₂ and R ₃ is It is a hydrogen atom, preferably all are hydrogen atoms, and n represents an integer of 1 to 60. The molecular shape of polysilazane may be any shape, for example, linear or cyclic.

  The one-component type phosphor dispersion liquid may contain a reaction accelerator together with an organometallic compound (particularly, polysilazane). The reaction accelerator may be an acid or a base. Specific examples of reaction accelerators include bases such as triethylamine, diethylamine, N, N-diethylethanolamine, N, N-dimethylethanolamine, triethanolamine, triethylamine, hydrochloric acid, oxalic acid, fumaric acid, sulfonic acid, Examples include, but are not limited to, acetic acid, metal carboxylates including nickel, iron, palladium, iridium, platinum, titanium, and aluminum. A particularly preferred reaction accelerator is a metal carboxylate, and the addition amount is preferably 0.01 to 5 mol% based on polysilazane.

  The polysilazane concentration in the one-component phosphor dispersion is preferably higher, but when the polysilazane concentration is increased, the storage period of the binder solution is shortened. Therefore, the concentration of polysilazane in the one-liquid type phosphor dispersion liquid is preferably 5 to 50 wt% (mass%).

  When a polysilazane solution is blended with a one-component phosphor dispersion, the phosphor dispersion is applied, and the coating is heated or irradiated with light to make the coating a ceramic film. It is preferable. The temperature at which the coating film is heated is preferably 150 ° C. to 500 ° C., and more preferably 150 ° C. to 350 ° C., from the viewpoint of suppressing the deterioration of the glass material used as the substrate of the LED chip. In particular, after the coating film is irradiated with UVU radiation (eg, excimer light) containing a wavelength component in the range of 170 to 230 nm and cured, heat curing is further performed to further improve the moisture penetration preventing effect. it can.

  The solvent of the one-component type phosphor dispersion liquid preferably contains alcohols. The alcohol may be a monohydric alcohol such as methanol, ethanol, propanol, or butanol, or a dihydric or higher polyhydric alcohol. Two or more alcohols may be combined. If a divalent or higher alcohol is used as a solvent, it is easy to increase the viscosity of the phosphor dispersion and to prevent sedimentation of the phosphor particles as the dispersoid.

  The boiling point of the solvent is preferably 250 ° C. or lower. This is to facilitate drying of the dispersion solvent from the phosphor dispersion. If the boiling point is too high, the dispersion solvent evaporates slowly, and when the dispersion solution is applied to form a coating film, the phosphor flows in the coating film.

  Any polyhydric alcohol can be used as long as it can be used as a solvent; for example, ethylene glycol, propylene glycol, diethylene glycol, glycerin, 1,3-butanediol, and 1,4-butane. Examples include diols, and ethylene glycol, propylene glycol, 1,3-butanediol, 1,4-butanediol, and the like are preferable.

  The concentration of the phosphor in the one-component phosphor dispersion is based on the sum of the mass of the phosphor particles, the mass of the inorganic particles containing aluminum silicate, and the mass of the binder or binder precursor cured product. 60 to 95% by mass is preferable. By coating and drying such a phosphor dispersion liquid on the light emitting surface of the LED chip, a wavelength conversion site composed of a high-density phosphor layer can be obtained.

  A one-component phosphor dispersion is prepared by mixing a binder or a binder precursor and phosphor particles in a solvent, further mixing aluminum silicate, and, if necessary, other inorganic particles (flat plate-like). Particles or oxide particles).

Application of phosphor dispersion liquid A phosphor dispersion liquid is applied to the light emitting surface of the LED chip 3 of the LED chip mounting package 90. The application means is not particularly limited, and examples thereof include blade application, spin coat application, dispenser application, and spray application. In particular, spray coating is preferable because a thin coating film can be easily formed, and thus a thin ceramic layer can be easily formed.

  FIG. 2 shows an outline of a spray device for applying the phosphor dispersion liquid. The phosphor dispersion liquid 220 in the coating liquid tank 210 in the coating apparatus 200 shown in FIG. 2 is supplied with pressure to the head 240 through the connecting pipe 230. The phosphor dispersion liquid 220 supplied to the head 240 is discharged from the nozzle 250 and applied to the application target (the light emitting surface of the LED chip 3). The discharge of the coating liquid from the nozzle 250 is performed by wind pressure. An opening that can be freely opened and closed is provided at the tip of the nozzle 250, and the opening may be opened and closed to control on / off of the discharge operation.

In the application process of the phosphor dispersion liquid, the following operations (1) to (9) and condition settings are performed.
(1) Basically, the tip of the nozzle 250 is disposed immediately above the package 1 and the phosphor dispersion liquid 220 is sprayed from directly above the LED chip 3. When the LED chip 3 has a rectangular parallelepiped shape, the phosphor dispersion liquid 220 may be sprayed from directly above the LED chip 3 or from obliquely above the LED chip 3. By spraying obliquely from above, the phosphor dispersion liquid 220 can be appropriately applied to the corners of the LED chip 3. In this way, it is preferable to uniformly apply the phosphor dispersion liquid 220 also to the side surface of the LED chip 3.

  (2) The injection amount of the phosphor dispersion liquid 220 is controlled according to the viscosity of the confusion liquid and the target chromaticity. As long as the coating is performed under the same conditions, the spray amount is constant and the phosphor amount per unit area is constant. The variation with time of the spray amount of the phosphor dispersion liquid 220 is set to be within 10%, preferably within 1%. The injection amount of the phosphor dispersion liquid 220 is adjusted by the relative movement speed of the nozzle 250 with respect to the LED chip 3 and the injection pressure from the nozzle 250. In general, when the viscosity of the dispersion liquid is high, the relative movement speed of the nozzle is decreased and the injection pressure is set high. Although not particularly limited, the relative movement speed of the nozzle is usually about 30 mm / s to 200 mm / s; the injection pressure is usually about 0.01 MPa to 0.2 MPa.

  (3) The temperature of the nozzle 250 may be adjusted to adjust the viscosity when the phosphor dispersion liquid 220 is jetted. The package 1 may be in a room temperature environment, or the temperature of the package 1 may be controlled by providing a temperature adjustment mechanism on the moving table. If the temperature of the package 1 is set high at 30 to 100 ° C., the organic solvent in the phosphor dispersion liquid 220 injected into the package 1 can be volatilized quickly, and the phosphor dispersion liquid 220 drips from the package 1. Can be prevented. On the contrary, if the temperature of the package 1 is set as low as 5 to 20 ° C., the solvent can be volatilized slowly, and the phosphor dispersion liquid 220 can be uniformly applied along the outer wall of the LED chip 3. As a result, the film density and film strength of the wavelength conversion part 6 can be increased, and a dense film can be formed.

  (4) The environmental atmosphere (temperature / humidity) of the coating apparatus 200 is kept constant, and the injection of the phosphor dispersion liquid 220 is stabilized. In particular, when polysilazane is used as the organometallic compound, polysilazane has a hygroscopic property, and the phosphor dispersion liquid 220 itself may solidify. make low.

  (5) A mask corresponding to the shape of the LED chip 3 may be disposed between the coating apparatus 200 and the package 1, and the phosphor dispersion liquid 220 may be sprayed through the mask.

  (6) After spraying and applying the phosphor dispersion liquid 220 to one package 1, the same operation as described above is repeated for the next package 1 to fluoresce on the LED chips 3 of the plurality of packages 1. The body dispersion liquid 220 is sequentially sprayed and applied. 3A and 3B, the moving table 300 on which the plurality of LED chip mounting packages 90 are placed is moved relative to the nozzle 250 (in the direction of the arrow), but the discharge liquid 270 is discharged, and the LED chip mounting package 90 is discharged. A state in which the phosphor dispersion liquid is applied to each of these is shown. 3A is a view as seen from the side with respect to the discharge direction, and FIG. 3B is a view as seen from above in the discharge direction.

  In this case, the phosphor dispersion liquid 220 may be continuously ejected regardless of the switching of the package 1, or the ejection of the phosphor dispersion liquid 220 is temporarily stopped every time the package 1 is switched, The phosphor dispersion liquid 220 may be ejected intermittently. If the phosphor dispersion liquid 220 is continuously ejected, the ejection amount of the phosphor dispersion liquid 220 to each package 1 can be stabilized. If the phosphor dispersion liquid 220 is intermittently ejected, the amount of the phosphor dispersion liquid 220 used can be saved.

  (7) During the spraying / coating process, every time the phosphor dispersion liquid 220 is sprayed / coated on a certain number of packages 1, the chromaticity and luminance of white light are actually inspected, and the inspection result is fluorescence You may feed back to the injection amount of the body dispersion liquid 220, injection pressure, injection temperature, etc. (inspection process).

  (8) The nozzle 250 may be cleaned during the spraying / coating process. In this case, a cleaning tank storing a cleaning liquid is installed in the vicinity of the coating apparatus 200, and the tip of the nozzle 250 is placed during the suspension of the injection of the phosphor dispersion liquid 220 or the inspection of the chromaticity / luminance of white light. It is immersed in the cleaning tank to prevent the tip of the nozzle 250 from drying. Further, during the suspension of the spraying / coating process, the phosphor dispersion liquid 220 may be hardened and the spray holes of the nozzle 250 may be clogged, so that the nozzle 250 is immersed in the cleaning tank or the spraying / coating process is started. Sometimes it is preferable to clean the nozzle 250.

  (9) In the spraying / coating process, since the phosphor dispersion liquid 220 is sprayed in a mist form, when the organic solvent in the phosphor dispersion liquid 220 volatilizes, powders such as phosphor and inorganic fine particles may be scattered. . For this reason, the entire coating apparatus 200 is preferably covered with a housing or the like, and the spraying / coating process and the inspection process are performed while collecting and exhausting the air through the filter. If the phosphor is collected by a filter, the expensive phosphor can be reused.

  When the one-component phosphor dispersion is applied, the solvent contained therein is removed by drying. When a binder precursor (for example, an organometallic compound as a ceramic precursor) is contained in the one-component type phosphor dispersion liquid, the binder precursor (for example, a transparent ceramic) is subjected to a curing reaction by firing. Convert. Thereby, a wavelength conversion site composed of a layer containing phosphor (phosphor layer 6) is formed.

  Thus, the wavelength conversion part 6 is formed into a film, and the LED device 100 shown in FIG. 1 is obtained. Furthermore, after the wavelength conversion site 6 is formed, the wavelength conversion site 6 may be further covered with a protective layer. The protective layer may be formed using a spray device or a dispenser device. The LED device 100 is further provided with other optical components (such as a lens) and used as various optical members.

[Second Method for Manufacturing LED Device (2-Liquid Phosphor Dispersion)]
The second manufacturing method of the LED device includes 1) a step of preparing an LED chip mounting package including a package and an LED chip, and 2) applying a two-liquid type phosphor dispersion liquid to the light emitting surface of the LED chip to fluoresce it. And 3) a step of applying a solution containing a binder or a binder precursor (binder solution) to the light emitting surface of the LED chip to form a phosphor layer.

  The LED chip mounting package 90 is, for example, as shown in FIG.

About the two-component phosphor dispersion The two-component phosphor dispersion contains phosphor particles, aluminum silicate, and a solvent, and further contains inorganic particles other than aluminum silicate. Also good. On the other hand, it is preferable that the two-component phosphor dispersion does not contain a binder and a binder precursor.

  The two-component phosphor dispersion is the same as the one-component phosphor dispersion except that it does not contain a binder and a binder precursor. That is, each component (phosphor particles, inorganic particles containing aluminum silicate), the type of solvent, the concentration of each component, and the like may be adjusted in the same manner as the one-component phosphor dispersion. A two-component phosphor dispersion may be prepared in the same manner as a one-component phosphor dispersion. For example, phosphor particles are mixed in a solvent and aluminum silicate is further mixed. Depending on the case, it can be prepared by adding other inorganic particles (tabular particles or oxide particles).

  The two-component type phosphor dispersion liquid is applied to the light emitting surface of the LED chip 3 of the LED chip mounting package 90, and the application method can be the same as the one-component type phosphor dispersion liquid application method. In other words, blade coating, spin coating coating, dispenser coating, spray coating, and the like can be employed; in particular, spray coating is preferable because it is easy to form a thin coating film, and thus easily forms a thin ceramic layer.

  After the two-component type phosphor dispersion liquid is applied to the light emitting surface of the LED chip 3 of the LED chip mounting package 90, a solution containing the binder or the binder precursor (binder solution) is then applied to the light emitting surface of the LED chip 3. To do.

  The kind of binder or binder precursor contained in the binder solution is the same as the kind of binder or binder contained in the one-component phosphor dispersion. That is, examples of the binder precursor include organometallic compounds such as metal alkoxide, metal acetylacetonate, metal carboxylate, and polysilazane. The solvent contained in the binder solution is the same as the solvent contained in the one-component phosphor dispersion.

  Application of the binder solution to the light emitting surface of the LED chip 3 may be performed by spray application as in the case of the one-component phosphor dispersion. After application of the binder solution, the solvent contained therein is removed by drying. Moreover, when the binder precursor (for example, the organometallic compound as a ceramic precursor) is contained in the binder solution, it is made to harden and react by baking, and it converts into a binder (for example, transparent ceramic). Thereby, a wavelength conversion site composed of a layer containing phosphor (phosphor layer 6) is formed.

  The secondary type phosphor dispersion liquid and the binder solution may be alternately and repeatedly applied to the light emitting surface of the LED chip.

  Thus, the wavelength conversion part 6 is formed into a film, and the LED device 100 shown in FIG. 1 is obtained. Furthermore, after the wavelength conversion site 6 is formed, the wavelength conversion site 6 may be further covered with a protective layer. The protective layer may be formed using a spray device or a dispenser device. The LED device 100 is further provided with other optical components (such as a lens) and used as various optical members.

[Manufacture of LED chip mounting packages]
An LED chip mounting package 90 conceptually shown in FIG. 2 was prepared. Specifically, one blue LED chip (in a rectangular parallelepiped shape: 200 μm × 300 μm × 100 μm) is flip-chip mounted in the center of a housing portion of a circular package (opening diameter 3 mm, bottom surface diameter 2 mm, wall surface angle 60 °), and LED A chip mounting package was prepared.

[Fabrication of phosphor particles]
Yellow phosphor particles were prepared by the following procedure. A mixture obtained by sufficiently mixing phosphor raw materials having the composition shown below was filled in an aluminum crucible, and an appropriate amount of fluoride such as ammonium fluoride was mixed therewith as a flux. The filling is fired in a reducing atmosphere in which hydrogen-containing nitrogen gas is circulated in a temperature range of 1350 to 1450 ° C. for 2 to 5 hours to obtain a fired product ((Y0.72Gd0.24) 3Al5O12: Ce0.04). It was.

[Raw material composition of phosphor particles]
Y ₂ O ₃ ··· 7.41g
Gd ₂ O ₃ ... 4.01 g
CeO ₂ ... 0.63g
Al ₂ O ₃ ... 7.77 g

  The obtained baked product was pulverized, washed, separated, and dried to obtain a desired phosphor. The obtained phosphor was pulverized to obtain phosphor particles having a particle size of about 10 μm. The composition of the obtained phosphor particles was examined to confirm that it was the desired phosphor. When the emission wavelength with respect to the excitation light having a wavelength of 465 nm was examined, the peak wavelength was approximately 570 nm. The obtained phosphor particles were used in the following comparative examples and examples.

[Synthesis of aluminum silicate compound (imogolite)]
In a container with a stirrer having a capacity of 1 L, 250 ml of 0.1 mol / l sodium orthosilicate and 250 ml of 0.15 mol / l aluminum chloride hexahydrate were mixed. While stirring the mixture, 50 ml of 1N aqueous sodium hydroxide solution was added dropwise to the mixture. The solution at this time was heated by a plate heater to 90 ° C., and this temperature was maintained for 10 hours.

  Next, concentrated hydrochloric acid was added to the mixture to adjust the pH to 7.0. The generated sodium chloride was removed by washing with water, and concentrated hydrochloric acid was added again to adjust the pH to 4.0. This was heated to 100 ° C. and maintained for 24 hours to produce imogolite which is an aluminum silicate compound.

[Comparative Example 1]
To 7.5 g of “ceramic precursor solution A: tetraethoxysilane 14% by weight, isopropyl alcohol 86% by weight”, 0.05 g of phosphor particles and 0.04 g of silicon oxide (SiO ₂ made by Nippon Aerosil Co., Ltd.) RX300, particle size 7 nm) was mixed to prepare a mixed solution.

  Ten LED chip mounting packages were arranged side by side on the moving table of the spray device (see FIG. 2) (see FIG. 3). After applying the mixed solution on the package using a spray device, the mixture was heated at 150 ° C. for 1 hour to form a wavelength conversion site (phosphor layer). At this time, spraying conditions were such that an LED chip was placed directly under the nozzle, and the liquid mixture was discharged while reciprocating once at a pressure of 0.1 MPa while moving only the nozzle at a moving speed of 100 mm / s.

[Comparative Example 2]
The ceramic precursor solution A 3.0 g, and ethylene glycol 1.0 g, and the phosphor particles of 0.42 g, and silicon oxide 0.05 g (SiO ₂ Nippon Aerosil Co. RX300, particle size 7 nm), A mixed solution was prepared by mixing 0.02 g of smectite (Lucentite SWN, manufactured by Corp Chemical Co.).

  After applying the mixed solution on the package using the same coating apparatus as in Comparative Example 1, the wavelength conversion site (phosphor layer) was formed by heating at 150 ° C. for 1 hour. The spray coating conditions at this time were that an LED chip was placed directly under the nozzle, and the liquid mixture was discharged while reciprocating once at a pressure of 0.1 MPa while moving only the nozzle at a moving speed of 70 mm / s.

[Example 1]
To 3.0 g of ceramic precursor solution A, 1.0 g of 1,3-butanediol, 0.7 g of phosphor particles, and 0.18 g of imogolite were mixed to prepare a mixed solution.

  After applying the mixed solution on the package using the same coating apparatus as in Comparative Example 1, the wavelength conversion site (phosphor layer) was formed by heating at 150 ° C. for 1 hour. At this time, spraying conditions were such that an LED chip was placed directly under the nozzle, and the liquid mixture was discharged while reciprocating once at a pressure of 0.1 MPa while moving only the nozzle at a moving speed of 60 mm / s. The concentration of the aluminum silicate compound in the phosphor layer was 22% by weight.

[Example 2]
To 3.0 g of ceramic precursor solution A, 1.0 g of 1,3-butanediol, 1.5 g of phosphor particles, and 0.05 g of silicon oxide (RX300 manufactured by SiO ₂ Nippon Aerosil Co., Ltd., particle size) 7 nm) and 0.18 g of imogolite were mixed to prepare a mixed solution.

  After applying the mixed solution on the package using the same coating apparatus as in Comparative Example 1, the wavelength conversion site (phosphor layer) was formed by heating at 150 ° C. for 1 hour. The spray coating conditions at this time were that an LED chip was placed directly under the nozzle, and the liquid mixture was discharged while reciprocating once at a pressure of 0.1 MPa while moving only the nozzle at a moving speed of 70 mm / s. The concentration of the aluminum silicate compound in the phosphor layer was 9% by mass.

[Example 3]
3.0 g of isopropyl alcohol, 1.0 g of propylene glycol, 1.5 g of phosphor particles, 0.05 g of silicon oxide (RX300 manufactured by SiO ₂ Nippon Aerosil Co., Ltd., particle size 7 nm), 0.18 g The imogolite was mixed to prepare a mixed solution.

  After applying the mixed solution on the package using the same application apparatus as in Comparative Example 1, the phosphor was placed by heating at 150 ° C. for 1 hour. At this time, spraying conditions were such that an LED chip was placed directly under the nozzle, and the liquid mixture was discharged while reciprocating once at a pressure of 0.1 MPa while moving only the nozzle at a moving speed of 75 mm / s.

  Further, the ceramic precursor solution A as a second mixed solution was applied on the package and baked at 150 ° C. for 1 hour to form a wavelength conversion site (phosphor layer). At this time, spraying conditions were such that an LED chip was placed directly under the nozzle, and the liquid mixture was discharged while reciprocating once at a pressure of 0.1 MPa while moving only the nozzle at a moving speed of 100 mm / s. The concentration of the aluminum silicate compound in the phosphor layer was 10% by mass.

[Example 4]
1.5 g of “ceramic precursor B: 20% by mass of polysilazane (NN120 manufactured by AZ Electronic Materials Co., Ltd., 80% by mass of dibutyl ether)” and 1.0 g of phosphor particles and 0.05 g of silicon oxide (SiO 2 ₂ RX300 manufactured by Nippon Aerosil Co., Ltd., particle size 7 nm) and 0.13 g of imogolite were mixed to prepare a mixed solution.

  After applying the mixed solution on the package using the same coating apparatus as in Comparative Example 1, the wavelength conversion site (phosphor layer) was formed by heating at 150 ° C. for 1 hour. The spray coating conditions at this time were that an LED chip was placed directly under the nozzle, and the liquid mixture was discharged while reciprocating once at a pressure of 0.1 MPa while moving only the nozzle at a moving speed of 70 mm / s. The concentration of the aluminum silicate compound in the phosphor layer was 10% by mass.

[Example 5]
To 1.0g of isopropyl alcohol, and 1,3-butanediol 1.0g, phosphor particles of 1.5g, silicon oxide 0.05 g (SiO ₂ Nippon Aerosil Co. RX300, particle size 7 nm) and , 0.18 g of imogolite was mixed to prepare a mixed solution.

  After applying the mixed solution on the package using the same application apparatus as in Comparative Example 1, the phosphor was placed by heating at 150 ° C. for 1 hour. At this time, spraying conditions were such that an LED chip was placed directly under the nozzle, and the liquid mixture was discharged while reciprocating once at a pressure of 0.1 MPa while moving only the nozzle at a moving speed of 70 mm / s.

  Further, a ceramic precursor solution B was applied to the phosphor layer as a second mixed solution and baked at 150 ° C. for 1 hour to form a phosphor layer. At this time, spraying conditions were such that an LED chip was placed directly under the nozzle, and the mixed liquid was discharged while reciprocating once at a pressure of 0.1 MPa while moving only the nozzle at a moving speed of 120 mm / s.

[Example 6]
To 3.0 g of isopropyl alcohol, 1.0 g of propylene glycol, 1.5 g of phosphor particles, 0.05 g of synthetic mica (Micromica MK-100 Corp Chemical), and 0.18 g of imogolite A mixed solution was prepared by mixing.

  After applying the mixed solution on the package using the same application apparatus as in Comparative Example 1, the phosphor was placed by heating at 150 ° C. for 1 hour. At this time, spraying conditions were such that an LED chip was placed directly under the nozzle, and the liquid mixture was discharged while reciprocating once at a pressure of 0.1 MPa while moving only the nozzle at a moving speed of 75 mm / s.

  Further, the ceramic precursor solution A as a second mixed solution was applied on the package and baked at 150 ° C. for 1 hour to form a wavelength conversion site (phosphor layer). At this time, spraying conditions were such that an LED chip was placed directly under the nozzle, and the liquid mixture was discharged while reciprocating once at a pressure of 0.1 MPa while moving only the nozzle at a moving speed of 100 mm / s. The concentration of the aluminum silicate compound in the phosphor layer was 10% by mass.

  The following evaluation was performed about the LED device obtained by each Example and the comparative example.

(Membrane strength measurement)
Five samples prepared in each example and comparative example were prepared, and the chromaticity of light emission was measured. The LED device after the measurement was subjected to a thermal shock test (-40 ° C./30 min） 150 ° C./30 min 1000 cycles), and then dropping the LED device from a height of 50 cm was repeated 50 times. Thereafter, the chromaticity of light emission of each LED device was measured. A spectral radiance meter CS-1000A manufactured by Konica Minolta Sensing Co., Ltd. was used as a measuring device for measuring the chromaticity of light emission.

Table 1 shows the x value of chromaticity and the chromaticity difference before and after the test. If peeling or the like of the film occurs during the deterioration test, the chromaticity before and after the test varies. Therefore, the superiority or inferiority of the film strength can be evaluated from the difference in chromaticity before and after the test. Evaluation was performed according to the following criteria.
Greater than 0.02 ×
Greater than 0.01 and less than or equal to 0.02
0.01 or less ... ◎

  The chromaticity shown in Table 1 is the CIE-XYZ color system in which the color space is expressed in the XYZ coordinate system, and is defined by a point where a straight line connecting a certain point and the origin intersects the plane x + y + z = 1. The chromaticity is represented by (x, y) coordinates, and the z coordinate obtained from the relationship of x + y + z = 1 is omitted. The chromaticity of white light is (0.33, 0.33). The closer the chromaticity is to this value, the closer to white light. When the x coordinate value decreases, the color becomes blueish white, and when the x coordinate value increases, the color becomes yellowish white.

  In Comparative Example 1 in which only silica is blended as the inorganic particles, it can be seen that the chromaticity difference before and after the test is large. Moreover, in Comparative Example 2 in which silica and smectite are combined as inorganic particles, it can be seen that the chromaticity difference before and after the test is considerably reduced as compared with Comparative Example 1.

  Furthermore, in Examples 1 to 6 in which imogolite was blended as inorganic particles, the chromaticity difference before and after the test was further reduced as compared with Comparative Example 2. Especially, in Examples 2-6 which combined imogolite, silica, or synthetic mica as an inorganic particle, the chromaticity difference before and behind a test is reduced more effectively.

  The LED device of the present invention has little variation in emission chromaticity and high durability. Therefore, it is useful as a semiconductor light emitting device such as an illumination.

DESCRIPTION OF SYMBOLS 1 Package 2 Metal part 3 LED chip 4 Projection electrode 6 Wavelength conversion part 90 LED chip mounting package 100 LED apparatus 200 Coating apparatus 210 Coating liquid tank 220 Phosphor dispersion liquid 230 Connection pipe 240 Head 250 Nozzle 270 Discharge liquid 300 Moving stand L Ceramic Layer thickness

Claims (10)

An LED device having an LED light emitting element that emits light of a specific wavelength, and a wavelength conversion part that converts light of a specific wavelength from the LED light emitting element into light of another specific wavelength,
The said wavelength conversion site | part is an LED device which is a layer containing fluorescent substance, aluminum silicate, and a binder.   The LED device according to claim 1, wherein the aluminum silicate is imogolite.   2. The LED device according to claim 1, wherein the content of the aluminum silicate compound in the wavelength conversion site is 0.5 wt% or more and 20 wt% or less.   The LED device according to claim 1, wherein the binder is a transparent ceramic.   The LED device according to claim 1, wherein the binder is a silicone resin.   The LED device according to claim 1, wherein the wavelength conversion site is a layer further containing oxide fine particles.   A phosphor dispersion liquid comprising a phosphor, an aluminum silicate, a binder or a binder precursor, and a solvent. Preparing an LED chip mounting package including a package and an LED chip having a light emitting surface disposed in the package;
Applying and drying the phosphor dispersion liquid according to claim 7 on the light emitting surface of the LED chip to form a phosphor layer;
A method for manufacturing an LED device, comprising:   A phosphor dispersion containing a phosphor, aluminum silicate, and a solvent. Preparing an LED chip mounting package including a package and an LED chip having a light emitting surface disposed in the package;
Applying the phosphor dispersion liquid according to claim 9 and drying the phosphor on the light emitting surface of the LED chip; and
Applying and drying a solution containing a binder or a binder precursor on the light emitting surface of the LED chip to form a phosphor layer; and
A method for manufacturing an LED device, comprising:

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