JP2013082038A - Punching apparatus and punching method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a punching apparatus capable of preventing a punching chip in each through hole of a plurality of simultaneously formed through holes from remaining therein, improving the quality of each through hole, and extending the service life of a forming die, in the punching apparatus simultaneously forming the plurality of through holes in a base material.SOLUTION: A punching apparatus 10 includes: a first forming die 11 having a plurality of pins 116 for punching; a second forming die 12 disposed opposite the first forming die 11 and having a plurality of holes 12a corresponding to the plurality of pins 116 in the first forming die 11; and a first vibration providing means 14 disposed in contact with the major surface of the first forming die 11 opposite the second forming die 12 and providing ultrasonic vibration to the first forming die 11 in a direction parallel to the movement direction of the first forming die 11.

Description

  The present invention relates to a drilling device and a drilling method using the same, and more particularly to a drilling device that simultaneously forms a plurality of through holes in a substrate and a drilling method using the same.

  In recent years, with the increase in brightness and whiteness of light-emitting devices having light-emitting elements such as light-emitting diode elements, light-emitting devices having light-emitting elements are used for backlights of mobile phones and large liquid crystal TVs. A substrate in such a light-emitting device is required to have high thermal conductivity, to quickly dissipate heat generated from the light-emitting element, and to have high reflectance and good productivity. For example, a glass ceramic substrate is known as one that meets such requirements (see, for example, Patent Document 1).

  By the way, a substrate used in a small device such as a light emitting device is efficiently manufactured by manufacturing a connection substrate having a large number of substrate regions to be a substrate and then dividing the substrate into individual substrates. In addition, for example, the connecting substrate manufactures a plurality of green sheets having a large number of substrate regions, and each green sheet is formed with a predetermined through-hole serving as a connection via, a thermal via, a frame portion surrounding the light emitting element, and the like. To do. Next, after filling the through holes serving as connection vias and thermal vias with the conductive paste, the green sheets are stacked and integrated and fired. In the case of a glass ceramic substrate, a green sheet made of a glass ceramic composition that is a mixture of glass powder and ceramic powder such as alumina powder is used.

  Formation of the through hole in the green sheet is generally performed using a punching apparatus. The punch processing apparatus has one punch and a die driven by driving means, and forms a large number of through holes one by one. In addition, it is known to provide vibration applying means for applying ultrasonic vibration to the punched portion in order to prevent residual scraps during punching (for example, see Patent Document 2).

International Publication No. 2009/128354 Pamphlet JP 2006-043804 A

  2. Description of the Related Art Conventionally, as a punching apparatus used for forming a through hole in a green sheet, an apparatus having one punch and a die is known. However, it is necessary to form a large number of through holes in the connection board, and it is required to form a plurality of through holes at the same time in order to improve the productivity of the connection board.

  As a method for simultaneously forming a plurality of through holes, for example, a method using a mold having a plurality of holes for drilling and a mold having holes corresponding to these pins can be considered. According to such a method, it is possible to form, for example, about 10 times as many through holes in the same time as in the case where the through holes are formed by one punch.

  However, when a mold having a plurality of pins is used, the state of positional relationship, etc. is adjusted to the optimum state for all the combinations of the pins in one mold and the corresponding holes in the other mold. Is not easy. For this reason, scraps are likely to adhere to the tip portions of some pins, and by pulling out the pins, scraps are likely to remain in the through-holes of the green sheet, and the quality of the through-holes is likely to deteriorate. In addition, the pins and holes are worn out and the mold life tends to be shortened.

  The present invention was made in order to solve the above-mentioned problem, and while suppressing the remaining of scraps in each through-hole of a plurality of through-holes formed simultaneously, the quality of each through-hole can be improved, It is another object of the present invention to provide a drilling device that can extend the life of the mold. Another object of the present invention is to provide a drilling method using such a drilling apparatus.

  The punching device of the present invention includes a first molding die having a plurality of punching pins and a plurality of pins corresponding to the plurality of pins in the first molding die. A second molding die having a hole and a first molding die arranged in contact with a main surface opposite to the second molding die side, and a moving direction of the first molding die on the first molding die And first vibration applying means for applying ultrasonic vibration in at least a parallel direction.

  The drilling method of the present invention is a drilling method for forming a through-hole penetrating in a thickness direction in a base material using the above-described drilling device, and the tips of a plurality of drilling pins in the drilling device The through hole is formed in the base material while applying ultrasonic vibration so that the longitudinal amplitude of the pin is in the range of 1 to 10 μm.

  According to the punching device of the present invention, it is possible to suppress the remaining of scraps in a plurality of through holes formed at the same time, improve the quality of each through hole, and extend the life of the mold. Further, according to the drilling method of the present invention, by using the drilling device of the present invention, it is possible to suppress the remaining of scraps in each through-hole of a plurality of through-holes formed at the same time, and the quality of each through-hole. And the life of the mold can be extended.

The principal part sectional view showing one embodiment of the punching device of the present invention. The expanded sectional view of the joint part in a drilling apparatus. Explanatory drawing explaining the drilling method. Explanatory drawing explaining the drilling method. The top view which shows an example of the connection board | substrate with which the drilling method is applied. The top view which expands and shows the separate board | substrate shown in FIG. FIG. 7 is a cross-sectional view taken along line A-A ′ of the individual substrate shown in FIG. 6. The partial top view of the green sheet for upper layers used as the main-body part of a connection board | substrate. The partial top view of the green sheet for intermediate | middle layers used as the main-body part of a connection board | substrate. The partial top view of the green sheet for lower layers used as the main-body part of a connection board | substrate.

Hereinafter, embodiments of the hole punching device of the present invention will be described.
FIG. 1 is a cross-sectional view of an essential part showing an embodiment of a punching device.

  The punching device 10 includes, for example, an upper mold 11 serving as a first mold, a lower mold 12 serving as a second mold, a machine base 13 used for fixing and moving the upper mold 11, and an upper mold 11. First vibration applying means 14 for applying ultrasonic vibration and second vibration applying means 15 for applying ultrasonic vibration to the lower mold 12 are provided.

  In addition, in FIG. 1, the base material 20 which is a workpiece is shown collectively. Further, the perforating apparatus 10 has the first vibration applying unit 14 that applies ultrasonic vibration to the upper mold 11, but the second vibration applying unit 15 that applies ultrasonic vibration to the lower mold 12. Is not necessarily an essential configuration, and can be provided as necessary.

  The upper mold 11 includes, for example, a mold main body 113 including a backing plate 111 and a pin holder 112, a substrate fixing plate 114, a plurality of elastic bodies 115, and a plurality of holes 116 for punching. Hereinafter, the lower mold 12 side of the pin 116 is referred to as a front end side, and the opposite side is referred to as a rear end side.

  The mold body 113 is configured to be fixed so that the pin holder 112 contacts the lower surface of the backing plate 111. The pin holder 112 is provided with a hole portion 112a composed of a small diameter portion provided on the lower surface side and a large diameter portion provided on the upper surface side, and the rear end side of the pin 116 is accommodated in the hole portion 112a. Yes. The pin 116 includes, for example, a shaft portion and a flange portion provided on the rear end side of the shaft portion, and a step portion between the small diameter portion and the large diameter portion of the hole portion 112a and the lower surface of the backing plate 111. It is fixed by pressing the buttocks.

  The base material fixing plate 114 has a function of fixing the base material 20 when the through hole is formed in the base material 20 and separating the base material 20 from the upper mold 11 after forming the through hole. The mold body 113 is disposed below the mold body 113 with an interval, and is disposed between the mold body 113 and the elastic body 115 so as to be movable in the vertical direction, which is the moving direction of the first mold 11. Has been.

  The substrate fixing plate 114 is provided with a through-hole 114a for accommodating the tip of the pin 116 so as to protrude. Usually, the vertical position of the substrate fixing plate 114 is adjusted so that the lower surface of the substrate fixing plate 114 and the tip surface of the pin 116 are located on the same plane. In addition, when the space between the mold main body 113 and the base material fixing plate 114 is reduced and brought into contact, the protruding amount of the tip of the pin 116 protruding from the lower surface of the base material fixing plate 114 is the base material. The distance between the mold main body 113 and the base material fixing plate 114, the thickness of the base material fixing plate 114, the length of the pins 116, and the like are adjusted so that the thickness is 20 or more.

The planar shape of the upper mold 11 is not necessarily limited, but a square shape or a rectangular shape is preferable, and the area is preferably 15 to 100 cm ² . By setting the area to 15 cm ² or more, a sufficient number of pins 116 can be arranged. Moreover, it can suppress that sufficient ultrasonic vibration is not provided to each pin 116 by an excessive mass increase etc. by making an area into 100 cm < ² > or less. The area is preferably 15~50cm ^2, 16~19cm ² is more preferable. Moreover, the total mass of the upper mold 11 is preferably 200 to 500 g. By setting it within such a mass range, it is possible to arrange a sufficient number of pins 116 and to prevent a sufficient ultrasonic vibration from being applied to each pin 116 due to an excessive increase in mass or the like.

The cross-sectional shape of each pin 116, that is, the cross-sectional shape in a plane perpendicular to the longitudinal direction of the pin 116 can be appropriately selected according to the shape of the through hole required for the base material 20, for example, circular shape, elliptical shape, square shape Shape, rectangular shape or the like. Further, the cross-sectional area of each pin 116 can be appropriately selected according to the size of the through-hole required for the base material 20, but is preferably 0.01 to 2.30 mm ² . Note that the cross-sectional shape and cross-sectional area of each pin 116 may be the same or different.

  The number of pins 116 is not particularly limited as long as it is plural, and can be appropriately selected according to the size of the upper mold 11, the number of through holes required for the base material 20, and the like. The number is preferable, 30 to 150 is more preferable, and 60 to 90 is more preferable. By setting the number of pins 116 to two or more, the through holes can be formed more efficiently than the conventional one consisting of one punch. Further, by setting the number of pins 116 to 200 or less, sufficient ultrasonic vibration can be applied to each pin 116.

  Ultrasonic vibration is applied to the upper mold 11 by the first vibration applying means 14 in a direction parallel to the moving direction of the upper mold 11, that is, in the vertical direction. By applying ultrasonic vibration to the upper mold 11, it is possible to suppress the remaining of scraps in each through hole of the plurality of through holes simultaneously formed in the base material 20, and to improve the quality of each through hole. The service life of the upper mold 11 and the lower mold 12 can be extended. When the first vibration applying means 14 applies vibration in the circumferential direction, that is, in the horizontal direction in addition to the ultrasonic vibration in the vertical direction, it is possible to further suppress the remaining of the scraps.

  At this time, it is preferable to apply ultrasonic vibration so that the amplitude at the tip of each pin 116 is in the range of 1 to 10 μm. Here, this amplitude is the longitudinal direction of the pin 116, that is, the amplitude in the vertical direction. On the other hand, the horizontal amplitude is preferably 3% or less with respect to the vertical amplitude. Note that the amplitude of each pin 116 may be the same as or different from each other as long as it is at least within the above range.

  By applying vibration with an amplitude of 1 μm or more in the vertical direction of the tip of each pin 116, it is possible to prevent the gathering of scraps on the pin, and effectively to the plurality of through holes formed simultaneously on the base material 20. Residual scraps can be suppressed and the quality of each through-hole can be improved. In addition, since the gathering of scraps on the pins is suppressed, wear of the pins and the mold is reduced, and the life of the upper mold 11 and the lower mold 12 can be extended. Further, it is sufficient if the amplitude in the vertical direction is about 10 μm, and if it exceeds this, the possibility of pin breakage or breakage is increased, which is not preferable. The vertical amplitude at the tip of each pin 116 is more preferably in the range of 2 to 8 μm, and still more preferably in the range of 3 to 7 μm. In addition, when the horizontal amplitude exceeds 3% with respect to the vertical amplitude, it is difficult to obtain a desired hole shape. Preferably it is 2% or less.

  The lower mold 12 is provided with a plurality of holes 12 a corresponding to the pins 116 of the upper mold 11. The cross-sectional shape in the thickness direction of the hole 12a is not necessarily limited, but is, for example, a cylindrical shape in which the diameter of the upper portion is reduced with respect to the lower portion. Although not shown, normally, a lower part of the lower molding die 12 is provided with a dust suction device for sucking and removing punches punched from the base material 20.

  On the upper surface of the upper mold 11, a machine base 13 mainly used for supporting the upper mold 11 and driving in the vertical direction is provided. The machine base 13 includes, for example, a cylindrical portion 13a and a plate-like mounting base 13b provided below the cylindrical portion 13a. The upper mold 11 and the machine base 13 are fixed by, for example, fixing the backing plate 111 and the mounting base 13b of the upper mold 11 with bolts or the like. A vibration shielding sheet 16 for suppressing the propagation of ultrasonic vibrations to the machine base 13 is preferably disposed between the upper mold 11 and the machine base 13.

  The vibration shielding sheet 16 is not particularly limited as long as it has an effect of shielding the propagation of ultrasonic vibrations from the upper mold 11 to the machine base 13. For example, a resin sheet such as a polytetrafluoroethylene sheet is suitable. Used for. The vibration shielding sheet 16 is preferably disposed substantially over the entire portion excluding the substantial contact portion between the upper mold 11 and the machine base 13, that is, the portion where the first vibration applying means 14 is disposed. Is preferably 10 to 100 μm. By setting the thickness of the vibration shielding sheet 16 to 10 μm or more, propagation of ultrasonic vibration from the upper mold 11 to the machine base 13 can be effectively shielded. Further, from the viewpoint of shielding the propagation of ultrasonic vibration, a thickness of about 100 μm is sufficient.

  The first vibration applying means 14 for applying ultrasonic vibration to the upper mold 11 is disposed inside the machine base 13 so as to come into contact with the upper mold 11. For example, the ultrasonic vibrator 141, the booster horn 142, and The joint portion 143 is configured. An oscillator (not shown) is connected to the ultrasonic transducer 141, and an electrical signal of 37 to 42 kHz, preferably an electrical signal of about 40 kHz, amplified by the oscillator is transmitted to the ultrasonic transducer 141 to generate mechanical vibration energy. Converted. Examples of the ultrasonic vibrator 141 include a piezoelectric element that converts an electrical signal into mechanical vibration energy, a ferrite magnetostrictive vibrator, and a quartz vibrator.

  The booster horn 142 has an amplitude conversion function, and the shape thereof is not particularly limited, and may be any of a cylindrical horn, a prismatic horn, a composite horn, and the like. Especially, the shape used as an axis object is preferred. The booster horn 142 is generally composed of a material such as steel, a stainless alloy, a titanium alloy, or an aluminum alloy. However, the material can be appropriately selected as necessary, and is not particularly limited.

  The joint portion 143, for example, efficiently transmits the mechanical vibration energy of the booster horn 142 to the upper mold 11, has an amplitude conversion function, and should be a second booster horn.

  FIG. 2 is a cross-sectional view showing the joint portion 143 in an enlarged manner. The joint portion 143 has, for example, a first shaft portion 143a and a second shaft portion 143b at both ends in the vertical direction, respectively, and has a large-diameter portion 143c and a small-diameter portion 143d in this order in the middle portion. doing. For example, the first shaft portion 143a, the second shaft portion 143b, the large diameter portion 143c, and the small diameter portion 143d have the diameters in the order of the large diameter portion 143c, the small diameter portion 143d, the second shaft portion 143b, and the first shaft portion 143a. It is formed to be smaller. It is preferable that the joint portion 143 also has a shape that is an axial object like the booster horn 142.

  The first shaft portion 143a is, for example, a screw portion used for fixing to the booster horn 142, and specifically, a screw portion having a diameter of about 8 mm. The joint portion 143 and the booster horn 142 are fixed by, for example, screwing using the first shaft portion 143a. The upper mold 11 and the joint portion 143 are fixed by, for example, fixing with a bolt or the like using a through-hole provided so as to penetrate the large diameter portion 143c and the small diameter portion 143d of the joint portion 143. . At this time, it is preferable to fix the booster horn 142, the joint part 143, and the upper mold 11 so that the deviation of each central axis is 100 μm or less. If the deviation of the central axis exceeds 100 μm, it may be difficult to transmit the ultrasonic vibration to the upper mold 11 satisfactorily. Preferably it is 50 micrometers or less, More preferably, it is 20 micrometers or less.

  The joint portion 143 is fixed so that the upper surface of the large-diameter portion 143 c is in contact with the lower surface of the booster horn 142 and the lower surface of the small-diameter portion 143 d is in contact with the upper surface of the upper mold 11. For example, the upper surface of the large-diameter portion 143c and the lower surface of the small-diameter portion 143d preferably have a maximum height roughness Rz defined by JIS B 0601: 2001 of 0.8 μm or less. By setting it as such surface roughness, ultrasonic vibration can be transmitted efficiently, for example, ultrasonic vibration can be transmitted to each pin 116 equally.

Diameter _{d 1} of the large-diameter portion 143c, the diameter _{d 2} of the small diameter portion 143d, the large-diameter portion 143c and a small diameter portion height _{h 1} summed in 143d, the small diameter portion height _{h 2} of the 143d is, for example, the upper molding The total mass (for example, 300 g) of the mold 11 and the joint part 143 is adjusted so as to have a resonance frequency of 40 kHz.

Here, the relationship between the diameter d ₂ of the diameter d ₁ and a small-diameter portion 143d of the large diameter portion 143c is according to the function as a booster horn for amplitude expansion. On the other hand, the relationship between the large diameter portion 143c and small diameter total height of the portion 143d _{h 1} and the small-diameter portion height _{h 2} of 143d, in accordance with connection with the adjustment, and the upper mold 11 to the resonance frequency 40kHz Is.

Specifically, the diameter _{d 1} and the diameter _{d 2,} it is preferable to satisfy the relationship _{d 1} = 1.25D _2. By satisfying such a relationship, an amplitude expansion function can be obtained effectively. On the other hand, the height _{h 1} to the height _{h 2,} preferably satisfy the relation of _{h 1} = _{3.4~4.0h 2.} By satisfying such a relationship, adjustment to the resonance frequency of 40 kHz is facilitated, and connection with the upper mold 11 can be effectively performed.

  According to such first vibration applying means 14, the mechanical vibration generated by the ultrasonic vibrator 141 can be appropriately converted to the upper mold 11 by converting the amplitude by the booster horn 142 and the joint portion 143. That is, mechanical vibration can be appropriately transmitted to the tip of each pin 116 via the backing plate 111.

As described above, it is preferable that the first vibration applying unit 14 applies ultrasonic vibration so that the amplitude at the tip of each pin 116 is in the range of 1 to 10 μm. Adjustment of the amplitude can be carried out ratio of the diameter of both ends in the booster horn 142, by adjustment of the ratio of the diameter d ₁ and the diameter d ₂ at the joint portion 143. For example, by adjusting the amplitude on the upper surface of the joint portion 143 (the upper surface of the large diameter portion 143c) to about 12 μm, the amplitude at the tip portion of each pin 116 can be in the range of 1 to 2 μm.

  The second vibration applying means 15 for applying ultrasonic vibration to the lower mold 12 can be provided as necessary. The 2nd vibration provision means 15 is arrange | positioned in contact with the side part of the lower shaping | molding die 12, and is comprised from the ultrasonic transducer | vibrator 151, the booster horn 152, etc., for example. By applying horizontal ultrasonic vibration to the lower mold 12, it is possible to more effectively suppress the remaining of scraps in a plurality of through holes simultaneously formed in the base material 20 and to improve the quality of each through hole. Can be good. By suppressing the gathering of scraps on the pins, the wear of the pins and the die is reduced, and the life of the upper mold 11 and the lower mold 12 can be extended.

  The basic configuration of the ultrasonic transducer 151, booster horn 152, and the like can be the same as that of the ultrasonic transducer 141 and booster horn 142 in the first vibration applying unit 14. An oscillator (not shown) is connected to the ultrasonic transducer 151, and an electrical signal of 37 to 42 kHz, preferably about 40 kHz, amplified by this oscillator is transmitted.

  Although depending on the clearance dimension between the lower mold 12 and the pin 116, the second vibration applying means 15 applies ultrasonic vibration so that the horizontal amplitude in the lower mold 12 is in the range of 1 to 5 μm. It is preferable. By giving such amplitude vibration, it is possible to more effectively suppress the residue of scraps in the plurality of through-holes simultaneously formed in the base material 20 and improve the quality of each through-hole. The service life of the upper mold 11 and the lower mold 12 can be extended. The horizontal amplitude of the lower mold 12 is more preferably 1 to 4 μm, and more preferably 1 to 3 μm. The amplitude can be adjusted by adjusting the ratio of the diameters at both ends of the booster horn 152 or the like.

  As mentioned above, although one Embodiment of the punching apparatus 10 was demonstrated, the structure of the punching apparatus 10 can be suitably changed in the limit which is not contrary to the objective of this invention as needed. For example, the first vibration applying unit 14 includes the ultrasonic vibrator 141, the booster horn 142, and the joint portion 143. However, the first vibration applying unit 14 is not necessarily provided as long as it can appropriately apply ultrasonic vibration to the upper mold 11. It is not restricted to such a configuration.

Next, a drilling method using the drilling device 10 will be described.
First, the base material 20 is disposed between the upper mold 11 and the lower mold 12 (FIG. 3A). Thereafter, the machine base 13 is moved downward by a driving means (not shown) to move the upper mold 11 fixed to the machine base 13 downward, and the base material fixing plate 114 is placed on the upper surface of the base material 20. Are brought into contact ((b) in FIG. 3).

  When the machine base 13 is moved downward in this state, the distance between the base material fixing plate 114 and the mold main body 113 is reduced, and at the same time, the base plate fixing plate 114 is pushed by the mold main body 113. The tip of the pin 116 protrudes from the lower surface, and the base material 20 in this portion is punched out ((FIG. 3C)) The scraps punched out from the base material 20 are sucked and removed by a dust suction device (not shown).

  Further, when the machine base 13 is moved upward after punching the base material 20, the vertical position of the base material fixing plate 114 is maintained by the repulsive force of the elastic body 115, that is, the base material fixing plate. 114, while the base material 20 is fixed, the other part moves upward, and the pin 116 is pulled out from the base material 20 ((d) in FIG. 4). The base material fixing plate 114 is pulled away from the base material 20. At this time, by using a material having a repulsive force of a certain level or more as the elastic body 115, the base material fixing plate 114 is caused by the repulsive force of the elastic body 115. The substrate fixing plate 114 can be satisfactorily pulled away from the base material 20 in order to move away from the base material 20. After completion of such a series of operations, the base material 20 is moved. To form a through hole in the substrate 20 by performing the same operation again.

  In such a series of drilling steps, at least the first vibration applying means 14 applies ultrasonic vibration to the upper mold 11, so that the scraps punched from the base material 20 adhere to the tips of the pins 116. When pulling out each pin 116 from the substrate 20, it can be suppressed that the scraps remain in each through hole in accordance with the extraction of each pin 116, and the quality of each through hole can be improved, Furthermore, the life of the mold can be extended.

  Further, in addition to the vertical vibration mainly by the first vibration applying means 14, the horizontal vibration is mainly given by the second vibration applying means 15, thereby further attaching the scraps to the tip portion of each pin 116. It is possible to suppress, the remaining of scraps in each through hole can be suppressed, the quality of each through hole can be improved, and the life of the mold can be extended.

  The processing speed of the upper mold 11 (pin 116) in such a drilling method, that is, the vertical movement speed is not necessarily limited, but is preferably 100 to 200 mm / s. By setting the processing speed to 100 mm / s or more, a large number of through holes can be efficiently formed in the substrate 20. Further, by setting the processing speed to 200 mm / s or less, the load on the upper mold 11 and the like can be reduced, and the life of the upper mold 11 and the like can be extended.

  In addition, as the base material 20 to be punched by such a punching method, a typical example is a green sheet used for manufacturing a connection substrate for a light emitting device, and in particular, glass powder and ceramic powder are used. Although the green sheet which consists of a glass ceramic composition containing is mentioned as a typical thing, it is not necessarily restricted to such a thing, The green sheet which consists of common ceramic powders, such as an alumina powder, may be sufficient. Moreover, although it does not necessarily restrict | limit also about the thickness of the base material 20, as a green sheet used for manufacture of the connection board | substrate for light-emitting devices, 0.1-1 mm is preferable.

  Hereinafter, manufacture of the connection board | substrate for light-emitting devices using the green sheet which consists of a glass ceramic composition containing the above-mentioned glass powder and ceramic powder is demonstrated. First, the configuration of the connection board will be described.

FIG. 5 is a plan view illustrating an example of a connection board.
The connection substrate 30 has an individual substrate region 31 in the center, and a plurality of individual substrates 32 are arranged adjacent to each other in the individual substrate region 31. Dividing grooves 33 are provided on the boundary lines of adjacent individual substrates 32 and on the extended lines of these boundary lines, and divided holes 34 penetrating in the thickness direction are provided at four corners of each individual substrate 32.

  FIG. 6 is an enlarged plan view showing the individual substrate 32 shown in FIG. FIG. 7 is a cross-sectional view taken along line A-A ′ of the individual substrate 32 shown in FIG. 6.

  The individual substrate 32 is, for example, mounted with eight 2-wire type light emitting elements, and these are electrically connected in parallel. The individual substrate 32 has a substantially plate-shaped main body part 321, and a frame part 322 is formed on the main body part 321. A region surrounded by the frame portion 322 in the upper surface of the main body portion 321 becomes a mounting surface 323 on which the light emitting element is mounted, and a sealing material such as silicone resin is injected into the inside of the frame portion 322 after the light emitting element is mounted. And sealed.

  A wiring conductor 324 that is electrically connected to the light emitting element is provided on the mounting surface 323. The wiring conductor 324 includes a first electrode 324a and a second electrode 324b. The first electrode 324 a is one anode side or cathode side electrode disposed in the center of the mounting surface 323. The second electrode 324b is a plurality of electrodes disposed near the outer periphery of the mounting surface 323 and on the side opposite to the first electrode. The second electrodes 324b are formed in the same number as the light-emitting elements to be mounted, and are arranged at substantially equal intervals on the circumference surrounding the first electrodes 324a. Here, a portion on the circumference between the first electrode 324a and the second electrode 324b is a mounting portion T on which the light emitting element is actually mounted.

  A pair of external electrode terminals 325 corresponding to the anode side and the cathode side are provided on the lower surface of the individual substrate 32. The pair of external electrode terminals 325 are electrically connected to the first electrode 324 a and the second electrode 324 b through connection vias 326 formed inside the main body portion 321, respectively. In order to reduce the thermal resistance of the main body 321, a thermal via 327 and a heat radiation layer 328 are embedded in the main body 321.

Next, manufacture of the connection board | substrate 30 is demonstrated.
The connection substrate 30 is manufactured through steps A to D shown below.

(A) Green sheet production process A green sheet is produced using the glass ceramic composition containing glass powder and ceramic powder. As the green sheet, for example, a total of four green sheets, ie, an upper layer, a middle layer, and a lower layer for forming the main body portion 321 and a single green sheet for forming the frame portion 322 are manufactured. Each green sheet has a predetermined number of individual substrates 32 formed thereon.

  A green sheet is a glass-ceramic composition containing glass powder and ceramic powder, and a slurry is prepared by adding a binder and, if necessary, a plasticizer, a dispersant, a solvent, etc. And then dried.

  The glass powder preferably has a glass transition point (Tg) of 550 to 700 ° C. When Tg is less than 550 ° C., degreasing may be difficult, and when it exceeds 700 ° C., the shrinkage start temperature becomes high and the dimensional accuracy may be lowered.

  The glass powder is preferably one in which crystals precipitate when fired at 800 to 930 ° C. A sufficient mechanical strength can be obtained by the precipitation of crystals. Furthermore, the thing whose crystallization peak temperature (Tc) measured by DTA (differential thermal analysis) is 880 degrees C or less is preferable. When Tc is 880 ° C. or less, good dimensional accuracy can be obtained.

The glass powder is expressed in mol% on the basis of oxide, SiO ₂ is 57 to 65%, B ₂ O ₃ is 13 to 18%, CaO is 9 to 23%, Al ₂ O ₃ is ₃ to 8%, K those containing 0.5 to 6% of at least one of them in total selected from ₂ O and Na ₂ O are preferred. By using such a material, the surface flatness can be easily improved.

SiO ₂ becomes a glass network former. When the content of SiO ₂ is less than 57%, it is difficult to obtain a stable glass and the chemical durability may be lowered. On the other hand, when the content of SiO ₂ exceeds 65%, the glass melting temperature and Tg may be excessively increased. The content of SiO ₂ is preferably 58% or more, more preferably 59% or more, and particularly preferably 60% or more. Further, the content of SiO ₂ is preferably 64% or less, more preferably 63% or less.

B ₂ O ₃ is a glass network former. If the content of B ₂ O ₃ is less than 13%, there is a possibility that the glass melting temperature or Tg may be too high. On the other hand, when the content of B ₂ O ₃ exceeds 18%, it is difficult to obtain a stable glass, and the chemical durability may be lowered. The content of B ₂ O ₃ is preferably 14% or more, more preferably 15% or more. Further, the content of B ₂ O ₃ is preferably 17% or less, more preferably 16% or less.

Al ₂ O ₃ is added to increase the stability, chemical durability, and strength of the glass. If the content of Al ₂ O ₃ is less than 3%, the glass may become unstable. On the other hand, when the content of Al ₂ O ₃ exceeds 8%, the glass melting temperature and Tg may be excessively high. The content of Al ₂ O ₃ is preferably 4% or more, more preferably 5% or more. Further, the content of Al ₂ O ₃ is preferably 7% or less, more preferably 6% or less.

  CaO is added to increase glass stability and crystal precipitation, and to lower the glass melting temperature and Tg. When the content of CaO is less than 9%, the glass melting temperature may be excessively high. On the other hand, when the content of CaO exceeds 23%, the glass may become unstable. The content of CaO is preferably 12% or more, more preferably 13% or more, and particularly preferably 14% or more. Further, the content of CaO is preferably 22% or less, more preferably 21% or less, and particularly preferably 20% or less.

K ₂ O and Na ₂ O are added to lower Tg. When the total content of K ₂ O and Na ₂ O is less than 0.5%, the glass melting temperature and Tg may be excessively high. On the other hand, when the total content of K ₂ O and Na ₂ O exceeds 6%, chemical durability, particularly acid resistance may be lowered, and electrical insulation may be lowered. The total content of K ₂ O and Na ₂ O is preferably 0.8% or more and 5% or less.

  In addition, glass powder is not necessarily limited to what consists only of the said component, Other components can be contained in the range with which various characteristics, such as Tg, are satisfy | filled. When other components are contained, the total content is preferably 10% or less.

  The glass powder is obtained by producing a glass having the above composition by a melting method and pulverizing it by a dry pulverization method or a wet pulverization method. In the case of the wet pulverization method, it is preferable to use water or ethyl alcohol as a solvent. Examples of the pulverizer include a roll mill, a ball mill, and a jet mill.

  As ceramic powders, those conventionally used for glass ceramics can be used. For example, alumina powder or a mixture of alumina powder and ceramic powder having a higher refractive index than alumina (titania powder, zirconia powder, etc.) A powder is preferred. Hereinafter, a ceramic powder having a higher refractive index than alumina is referred to as a high refractive index ceramic powder.

  For example, the glass powder and the ceramic powder are blended so that the glass powder is 30 to 50% by mass and the ceramic powder is 50 to 70% by mass, and mixed to obtain a glass ceramic composition. Moreover, a binder, and a plasticizer, a dispersing agent, a solvent, etc. are added to this glass ceramic composition as needed, and it is set as a slurry.

  As the binder, for example, polyvinyl butyral, acrylic resin and the like can be suitably used. As the plasticizer, for example, dibutyl phthalate, dioctyl phthalate, butyl benzyl phthalate and the like can be used. As the solvent, organic solvents such as toluene, xylene, 2-propanol and 2-butanol can be suitably used.

  The slurry is formed into a sheet by a doctor blade method or the like, and dried to produce three green sheets of an upper layer, a middle layer, and a lower layer that become the main body 321. Similarly, a green sheet to be the frame portion 322 is produced.

(B) Unsintered conductor formation process On the surface and inside of the green sheet produced in the above process, an unsintered conductor, that is, unsintered wiring conductor 324, unsintered external electrode terminal 325, unsintered connection via 326, unsintered thermal via. 327, an unsintered heat dissipation layer 328, and the like are formed.

  As shown in FIG. 8, the first green electrode 324 a is formed on the upper layer green sheet 321 a at a position to be the center of each individual substrate 32. In addition, a ring-shaped unfired connection conductor 324c is formed so as to surround the first unfired electrode 324a, and eight second unfired electrodes 324b are extended from the unfired connection conductor 324c to the inside. Are formed at substantially equal intervals. Here, the abbreviation refers to a state that looks like that when observed with the naked eye or a state close to such a concept. Further, an unfired connection via 326 is formed so as to penetrate through the upper layer green sheet 321a at a predetermined position of the center of the first unfired electrode 324a and the unfired connection conductor 324c.

  The punching device 10 is used for forming the unfired connection via 326 in such an upper layer green sheet 321a, particularly for forming a through hole. In the figure, a broken line indicated by reference numeral 33 is a groove formation scheduled part where the divided groove 33 is formed in a subsequent process, and a broken line indicated by reference numeral 34 is a hole formation scheduled part where the divided hole 34 is formed in a subsequent process. It is. Such divided holes 34 can also be formed by using the punching device 10 as described later.

  As shown in FIG. 9, in the green sheet for the middle layer 321b, an unfired heat dissipation layer 328 is formed, and an unfired connection via 326 and an unfired thermal via 327 are formed so as to penetrate in the thickness direction. As shown in FIG. 10, the green sheet 321c for the lower layer is formed with an unfired connection via 326 and an unfired thermal via 327 so as to penetrate in the thickness direction, and an unfired external electrode terminal 325 is formed on the lower surface. Form. A punching device for forming such unfired connection vias 326 and unfired thermal vias 327 in the middle layer green sheet 321b and forming unfired connection vias 326 and unfired thermal vias 327 in the lower layer green sheet 321c, particularly for forming through holes. 10 is used.

  The first green electrode 324a is electrically connected to one green heat dissipation layer 328 by a green connection via 326 penetrating through the upper layer green sheet 321a, and the green heat dissipation layer 328 includes the intermediate green sheet 321b and An unfired connection via 326 that penetrates the lower layer green sheet 321 c is electrically connected to one of the unfired external electrode terminals 325. The second unsintered electrode 324b is electrically connected to the other unsintered heat dissipation layer 328 by an unsintered connection via 326 that penetrates the upper layer green sheet 321a, and the unsintered heat dissipation layer 328 includes the intermediate layer green sheet 321b and It is electrically connected to the other unfired external electrode terminal 325 by the unfired connection via 326 that penetrates the lower layer green sheet 321c.

  Each green conductor is formed by applying or filling a conductor paste by screen printing. As the conductive paste, for example, a paste obtained by adding a vehicle such as ethyl cellulose to a metal powder mainly composed of copper, silver, gold or the like, and a solvent or the like as required can be used. As the metal powder, silver powder, metal powder composed of silver and platinum, or metal powder composed of silver and palladium are preferably used.

(C) Lamination process The upper layer green sheet 321a, the middle layer green sheet 321b, the lower layer green sheet 321c, and the green sheet to be the frame part 322, which are the main body part 321 obtained in the above process, are stacked in a predetermined order. The unfired connection board 30 is obtained by integration by thermocompression bonding. In addition, although not shown in figure, also about the green sheet used as the frame part 322, the through-hole in the frame part 322 is formed using a general punching apparatus etc., for example.

(D) Split groove and split hole forming step Split grooves 33 are formed on the boundary lines of the individual substrates 32 on the front and back surfaces of the unfired connecting substrate 30 using a green sheet cutting machine or the like. Further, a divided hole 34 that is a circular through hole is formed at the intersection of the divided grooves 33. The punching apparatus 10 is also used for forming such divided holes 34.

(E) Firing step The unfired connecting substrate 30 in which the dividing grooves 33 and the dividing holes 34 are formed is degreased with a binder or the like, if necessary, and then fired to sinter the glass ceramic composition. And

  Degreasing is held, for example, at a temperature of 500 to 600 ° C. for 1 to 10 hours. When the degreasing temperature is less than 500 ° C. or the degreasing time is less than 1 hour, the binder or the like may not be sufficiently removed. On the other hand, if the degreasing temperature is about 600 ° C. and the degreasing time is about 10 hours, the binder and the like can be sufficiently removed, and if it exceeds this, productivity and the like may be lowered.

  In the firing, the time can be appropriately adjusted in a temperature range of 800 to 930 ° C. in consideration of acquisition of a dense structure, division accuracy, and productivity. Specifically, holding at a temperature of 850 to 900 ° C. for 20 to 60 minutes is preferable, and a temperature of 860 to 880 ° C. is particularly preferable. By setting the baking temperature to 800 ° C. or higher, a dense structure can be obtained. On the other hand, by setting the firing temperature to 930 ° C. or less, a decrease in productivity due to deformation can be suppressed.

  Hereinafter, the present invention will be described more specifically with reference to examples.

(Production of green sheets)
In terms of mol% based on oxide, SiO ₂ is 60.4%, B ₂ O ₃ is 15.6%, Al ₂ O ₃ is 6%, CaO is 15%, K ₂ O is 1%, Na ₂ O. The raw materials are blended and mixed so as to be 2%. This raw material mixture was put in a platinum crucible and melted at 1600 ° C. for 60 minutes, and then the molten glass was poured out and cooled. This glass was pulverized with an alumina ball mill for 40 hours to produce a glass powder. In addition, ethyl alcohol was used as a solvent for pulverization.

  Next, the glass powder, alumina powder (manufactured by Showa Denko KK, trade name: AL-45H), zirconia powder (manufactured by Daiichi Rare Element Chemical Industry Co., Ltd., trade name: HSY-3F-J), and 38% by weight of glass powder. A glass ceramic composition was prepared by mixing and mixing the alumina powder at a ratio of 38 mass% and the zirconia powder at 24 mass%. 50 g of this glass ceramic composition, 15 g of an organic solvent (toluene, xylene, 2-propanol, 2-butanol mixed at a mass ratio of 4: 2: 2: 1), plasticizer (di-2-ethylhexyl phthalate) 2.5 g, 5 g of polyvinyl butyral as a binder (Denka Co., Ltd., trade name: PVK # 3000K) and 0.5 g of a dispersant (Bik Chemie, trade name: BYK180) were blended and mixed to prepare a slurry. .

  This slurry was applied onto a PET film by a doctor blade method and dried to produce a green sheet. The green sheet had a size of 172 mm × 172 mm and a thickness of 0.2 mm.

Example 1
As the drilling device, a device having a configuration as shown in FIG. 1 was prepared except that the second vibration applying means was not provided. Here, the planar shape of the upper mold is rectangular (47 mm × 36 mm), the thickness of the backing plate is 9 mm, the thickness of the pin holder is 6.5 mm, the thickness of the substrate fixing plate is 7 mm, and the pin holder and the substrate are fixed. The distance from the working plate was 2.7 mm, the tip surface of each pin was up to the position of the lower surface of the substrate fixing plate, and the mass of the entire upper mold was 262 g. The number of pins was 84, the cross-sectional shape of each pin was circular, and the cross-sectional area was 0.025 mm ² .

On the other hand, an oscillator was connected to the ultrasonic vibrator of the first vibration applying means, and an electric signal with an input voltage of 67.0 V, 0.17 A, and 40 kHz was applied. The booster horn was a truncated cone horn, the upper end diameter was 30 mm, and the lower end diameter was 25 mm. The joint portion adjusts the maximum height roughness Rz of the upper surface of the large diameter portion and the lower surface of the small diameter portion to 0.8 μm, the diameter d ₁ is 25 mm, the diameter d ₂ is 20 mm, the height h ₁ is 8 mm, and the height is high. The length h ₂ was 2 mm, and the mass was 47 g.

  Using such a perforating apparatus, a total of 420 through-holes were formed in the above-described green sheet. At this time, the processing speed of the upper mold (pin), that is, the moving speed in the vertical direction was set to 200 mm / s. The vertical amplitude at the upper surface of the joint (the upper surface of the large diameter portion) was 12 μm, and the vertical amplitude at the tip of the pin was 2 μm. The amplitude was measured with an amplitude measuring instrument (model: LASER VIBROMETER LV-1610, manufacturer: ONO SOKKI).

  Regarding the processing of such a green sheet, as shown below, the quality of the scraps, the through holes, and the mold life were evaluated.

(Trash)
About the green sheet in which the through-hole was formed, it observed using a microscope (model: VW-6000 maker: KEYENCE), and the thing with less than 1% of scrap remaining with respect to 420 through-holes is "◎" The case where the scrap remaining was less than 3% was evaluated as “◯”, and the case where the scrap remaining was 3% or more was evaluated as “x”.

(Through hole quality)
The green sheet on which the through hole was formed was observed using a microscope (model: VW-6000, manufacturer: KEYENCE), and the size of the burr of the through hole relative to the cross-sectional area of the pin was less than 1.2%. The product was evaluated as “、 ２”, less than 2% as “◯”, and more than 2% as “x”.

(Mold life)
Assuming that the number of drilling holes where the size of the burr of the through hole with respect to the cross-sectional area of the pin exceeds 2% is the mold life, “◎” means that the number of drilling is over 200,000 times What was there was “◯”, and what was less than 200,000 times was “x”.

(Example 2)
Example 1 except that the shape of the booster horn was changed and the vertical amplitude at the upper surface of the joint (upper surface of the large diameter portion) was adjusted to 21 μm and the vertical amplitude at the tip of the pin was adjusted to 3 to 4 μm. A through hole was formed in the green sheet and evaluated. The booster horn had an upper end diameter of 30 mm and a lower end diameter of 12.5 mm.

(Example 3)
As shown in FIG. 1, through-holes were formed in the green sheet and evaluated in the same manner as in Example 1 except that the second vibration applying means was provided in the lower mold. Note that an oscillator was connected to the ultrasonic vibrator of the second vibration applying means, and an electric signal with an input voltage of 67.0 V, 0.17 A, and 40 kHz was applied. The booster horn was a truncated cone horn, the diameter on the ultrasonic transducer side was 30 mm, and the diameter on the lower mold side was 25 mm. At this time, the horizontal amplitude in the lower mold was 2 μm.

(Comparative Example 1)
A through hole was formed in the green sheet and evaluated in the same manner as in Example 1 except that no ultrasonic vibration was applied.

  Table 1 shows the evaluation results of the scraps, the quality of the through holes, and the mold life.

  As is clear from Table 1, by applying ultrasonic vibration to the upper mold, particularly the tip of the pin, when a plurality of through-holes are simultaneously formed in the green sheet, it is possible to suppress residual chips in each through-hole. In addition, the quality of each through hole can be improved, and the life of the mold can be extended. In addition, by setting the amplitude at the tip of the pin to 3 to 4 μm, it is possible to effectively suppress the remaining of scraps in each through hole, improve the quality of each through hole, and extend the life of the mold. it can.

  DESCRIPTION OF SYMBOLS 10 ... Hole punching device, 11 ... 1st shaping | molding die (upper shaping | molding die), 12 ... 2nd shaping | molding die (lower shaping | molding die), 13 ... Machine stand, 14 ... 1st vibration provision means, 15 ... 2nd vibration provision means 16 ... Ultrasonic vibration shielding sheet, 20 ... Base material, 111 ... Backing plate, 112 ... Pin holder, 113 ... Mold body, 114 ... Base plate fixing plate, 115 ... Elastic body, 116 ... Pin, 141 ... Super Sonic transducer 142 ... Booster horn 143 Joint part 151 ... Ultrasonic transducer 152 ... Booster horn

Claims (6)

A first mold having a plurality of drilling pins;
A second mold that is disposed opposite to the first mold and has a plurality of holes corresponding to the plurality of pins in the first mold;
The first mold is disposed in contact with the main surface opposite to the second mold side, and the first mold is subjected to ultrasonic vibration in a direction at least parallel to the moving direction of the first mold. A perforating apparatus comprising first vibration applying means for applying.   The first mold is disposed on the mold body with a space on the second mold side of the mold body, and the substrate is fixed in a direction parallel to the moving direction of the first mold. Plate, the ends of the plurality of pins opposite to the second mold side are fixed to the mold body, and the ends of the plurality of pins on the second mold side are The perforating apparatus according to claim 1, wherein the perforating apparatus is accommodated in a through hole provided in the base plate fixing plate.   The said 1st vibration provision means provides an ultrasonic vibration so that the amplitude of the longitudinal direction of the said pin may exist in the range of 1-10 micrometers in the front-end | tip part of these pins. Drilling device.   The hole according to any one of claims 1 to 3, further comprising a second vibration applying unit that is disposed in contact with a side surface portion of the second mold and applies a horizontal ultrasonic vibration to the second mold. Opening device.   The perforating apparatus according to claim 4, wherein the second vibration applying means applies ultrasonic vibration so that the horizontal amplitude of the second mold is within a range of 1 to 5 µm. A drilling method for forming a through-hole penetrating in a thickness direction in a substrate using the drilling device according to any one of claims 1 to 5,
Forming the through-holes in the base material while applying ultrasonic vibrations so that the longitudinal amplitudes of the pins are in the range of 1 to 10 μm at the tip portions of the plurality of drilling pins in the drilling device A drilling method characterized by:

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