JP2013081103A - High frequency module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high frequency module which is configured so as to suppress an unnecessary high frequency signal to propagate through a transmission line and reduce an unnecessary high frequency signal emitted from a through hole.SOLUTION: Branch lines 130, 140 are provided which are branched at branch connections 131, 141 from respective bias lines 123, 124 and merged at merging parts 132, 142. Electric lengths L1, L2 are set by the difference (L2-L1) between the electric length L2 of the branch line 140 and the electric length L1 of the bias line 124 from the branch connection 141 to the merging part 142 so as to be almost equal to 1/2 of an effective wave length λg of an unnecessary high frequency signal or odd number times thereof.

Description

  The present invention relates to a high-frequency module used in a wireless communication device, and more particularly to a high-frequency module that suppresses deterioration of high-frequency characteristics and radiation to the outside due to unnecessary electromagnetic waves.

  A high-frequency module is configured by mounting discrete components such as transistors and diodes, integrated components such as ICs, and the like on a high-frequency substrate. There are various types of high-frequency substrates depending on the requirements of the module. For example, as shown in FIG. 8, signal wiring layers 901 and 904 formed on the substrate surface, and an earth layer 902 formed inside the substrate, There is a multi-layered substrate 900 composed of a power supply wiring layer, an internal signal wiring layer 903, and the like. An insulator 905 is filled between each layer of the high-frequency substrate 900, and various insulators are used depending on the requirements of the high-frequency module.

  Electronic components such as discrete components and integrated components are generally mounted on the signal wiring layers 901 and 904 on the surface of the substrate, for supplying power from the internal power wiring layer 903 and transmitting signals to and from the internal signal wiring layer 903. In addition, a through hole 906 that electrically connects the layers in the vertical direction (thickness direction) of the high-frequency substrate 900 is formed. The through hole 906 includes a through through hole that penetrates all the layers from the upper surface to the lower surface of the substrate and an interlayer through hole that partially penetrates the interlayer.

  A signal line is connected to a discrete component, an integrated component, or the like. When a signal passing through the signal line is biased, a bias circuit is connected to the signal line. The bias circuit is also connected to the power supply line to apply a bias, but in order to prevent leakage of signals passing through the signal line to the power supply line via the bias circuit, Various ideas have been made (for example, Patent Documents 1 and 2).

  On the other hand, high-frequency modules such as wireless communication devices and radar devices have a wide dynamic range of signal strength, so even if a signal leaks slightly to the power line via the bias circuit, another discrete signal is connected via the power line. There is a possibility that the communication quality and the detection accuracy of an object may be deteriorated by coupling / interference with components or integrated components.

  In addition, when the through hole that electrically connects the layers of the substrate is formed as a through hole, a leakage signal may be radiated to the outside through the through hole. Since the interlayer through hole that partially connects the layers of the substrate is expensive to manufacture, it is preferable to use the through through hole in order to reduce the cost. However, by using the through hole, unnecessary waves may be radiated to the outside and exceed the regulation value. For this reason, various devices have been conventionally used in order to suppress radiation of unnecessary waves (for example, Patent Document 3).

  Patent Document 1 discloses a technique in which a rectangular or radial open stub 913 is formed on a bias line 912 in order to prevent leakage of a high-frequency signal from the signal line 911 to the bias line 912 as shown in FIG. It is disclosed. Patent Document 2 describes a technique for suppressing unnecessary radiation radiated from a pattern wiring by forming a loop circuit having both ends closed by resistors on a printed circuit board. Furthermore, Patent Document 3 describes a technique for covering both ends of a through hole with a VIA cap in order to suppress radiation noise generated in the through hole formed in the substrate.

JP 2009-284120 A JP 2004-022735 A JP 2001-177287 A

  However, the above conventional techniques have the following problems. The open stub 913 described in Patent Document 1 is formed by etching a copper foil pattern in accordance with the electrical length. However, the size of the open stub 913 varies due to variations in etching during manufacturing. The variation in the size of the open stub 913 becomes a variation in the electrical length, and there is a problem that the suppression effect of the high-frequency signal leaking to the bias line 912 due to the change in the electrical length is reduced.

  Further, in the radiation signal suppression technology described in Patent Document 2, an unnecessary radiation signal radiated from a through hole or other part is resonated by a loop circuit, and the generated current is converted into thermal energy by a resistor to consume power. The effect such as is obtained. However, an unnecessary signal propagating through the bias line and the through hole instead of the radiated wave cannot be absorbed by the loop circuit.

  Furthermore, in the technique using the VIA cap described in Patent Document 3, in order to suppress the high-frequency signal leaked to the bias line from being radiated through the through-hole, all the through-holes requiring countermeasures are required. It is necessary to provide a VIA cap. Therefore, it is difficult to apply the VIA cap to a high-frequency module having a complicated structure with many through holes.

  The present invention has been made to solve the above-described problem, and suppresses unnecessary high-frequency signals propagating through the line, and reduces high-frequency signals radiated from the through holes. The purpose is to provide modules.

  A first aspect of the high-frequency module according to the present invention is a high-frequency module having a substrate and a predetermined line routed on a surface layer or an internal layer of the substrate, for branching from the predetermined line. A branch line having a junction part and a junction part for rejoining the predetermined line, and between an electrical length of the branch line and an electrical length from the branch part to the junction part of the predetermined line The length of the branch line is determined so as to have a predetermined electrical length difference.

  In another aspect of the high frequency module of the present invention, when the effective wavelength of an unnecessary high frequency signal propagating through the predetermined line is λg, the predetermined electrical length difference is substantially equal to λg / 2 or an odd multiple thereof. It is characterized by that.

  Another aspect of the high frequency module of the present invention is characterized in that the branch line is formed on a surface of the substrate.

  Another aspect of the high-frequency module of the present invention is characterized in that the junction portion is provided at a connection point where the predetermined line is connected to a through hole.

  In another aspect of the high frequency module of the present invention, a first through hole and a second through hole, each of which is connected to a different position of the predetermined line, and the predetermined line of the substrate are routed. A connection line that is arranged in a layer different from the first layer and electrically connects the first through hole and the second through hole, and the predetermined line, the first through hole, The connection point with each of the second through holes is the branch part and the junction part, and the branch line is a line from the branch part to the connection point with the connection line of the first through hole. And a line from a connection point between the connection line and the connection line of the second through hole to the junction.

  Another aspect of the high frequency module of the present invention is characterized in that the first through hole and the second through hole are through through holes penetrating the substrate.

  In another aspect of the high-frequency module of the present invention, the first through hole and the second through hole are interlayer through holes in which at least one end is formed up to an inner layer of the substrate. .

  In another aspect of the high frequency module of the present invention, when an unnecessary high frequency signal having two or more different frequencies propagates through the predetermined line, one or more other branch lines whose both ends are connected to different positions of the branch line are provided. And the difference between the electrical length of each line from the branch part to the junction part via the another branch line and the electrical length from the branch part to the junction part of the predetermined line is 2 It is characterized by being approximately equal to ½ of the effective wavelength corresponding to any one of the above different frequencies or an odd multiple thereof.

  Another aspect of the high frequency module of the present invention is characterized in that the predetermined line is a bias line connected to a signal line through which a high frequency signal propagates.

  ADVANTAGE OF THE INVENTION According to this invention, while suppressing the unnecessary high frequency signal which propagates a track | line, the high frequency module comprised so that it may reduce that an unnecessary high frequency signal is radiated | emitted from a through hole can be provided.

It is a top view which shows the structure of the high frequency module which concerns on 1st Embodiment of this invention. It is a graph which shows the simulation result of the passage characteristic of the high frequency signal in a bias line. It is the top view and sectional drawing which show the structure of the high frequency module which concerns on 2nd Embodiment of this invention. It is a top view which shows the structure of the high frequency module which concerns on 3rd Embodiment of this invention. It is the top view and sectional view showing the composition of the high frequency module concerning a 4th embodiment of the present invention. It is the top view and sectional view showing the composition of the high frequency module concerning a 5th embodiment of the present invention. It is the top view and sectional drawing which show another structural example of the high frequency module which concerns on 5th Embodiment of this invention. It is sectional drawing which shows an example of the board | substrate of the conventional multilayer structure. It is a top view which shows the bias line which added the conventional open stub.

  A high-frequency module according to a preferred embodiment of the present invention will be described in detail with reference to the drawings. In addition, about each component which has the same function, the same code | symbol is attached | subjected and shown for simplification of illustration and description.

(First embodiment)
A high-frequency module according to a first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a plan view showing the configuration of the high-frequency module according to the first embodiment. The high-frequency module 100 of this embodiment includes a field effect transistor (FET) 110 mounted on the surface of a high-frequency substrate 150. Here, the case where the high-frequency module 100 includes the FET 110, which is a discrete component, will be described as an example of the electronic component. However, the following description can be similarly applied to an electronic component other than the FET.

  The FET 110 includes a source 111, a gate 112, and a drain 113, and a first signal line 121 and a second signal line 122 are connected to the gate 112 and the drain 113, respectively. When the FET 110 is operated as an amplifier, it is necessary to apply a predetermined DC voltage to the gate 112 and the drain 113, respectively. Therefore, bias lines 123 and 124 are connected to the first signal line 121 and the second signal line 122, respectively. The bias lines 123 and 124 are each connected to a DC power source via a bias circuit (not shown).

  A high frequency signal is propagated to the first signal line 121 and input to the gate 112. Further, the high-frequency signal output from the drain 113 is propagated to the second signal line 122. Hereinafter, the effective wavelength of the high-frequency signal propagating through the first signal line 121 and the second signal line 122 is λg.

  There is a possibility that the high-frequency signal propagating through the first signal line 121 and the second signal line 122 leaks to the bias lines 123 and 124 connected to the respective signal lines. If a high-frequency signal leaks to the bias lines 123 and 124, the bias lines 123 and 124 will be coupled to or mixed with other discrete components or integrated components via the power supply line, resulting in a decrease in communication quality or detection of an object. There arises a problem that the accuracy is lowered. Hereinafter, the high-frequency signal leaked to the bias lines 123 and 124 is referred to as an unnecessary high-frequency signal.

  Therefore, in the high frequency module 100 of the present embodiment, branch lines 130 and 140 branched from the bias lines 123 and 124 are provided in order to prevent unnecessary high frequency signals from leaking to the power source side. The branch lines 130 and 140 have branch parts 131 and 141 branched from the bias lines 123 and 124, respectively, and junction parts 132 and 142 joined again to the bias lines 123 and 124, respectively. The branch portions 131 and 141 are on the upstream side in the direction in which unnecessary high-frequency signals propagate through the bias lines 123 and 124, respectively, and the junction portions 132 and 142 are on the downstream side.

  Hereinafter, for the sake of simplicity of explanation, the branch line 140 provided to suppress unnecessary high-frequency signals leaking from the second signal line 122 on the drain 113 side to the bias line 124 will be described. For the branch line 130 provided to suppress an unnecessary high-frequency signal leaking from the first signal line on the gate 112 side to the bias line 123, the propagation of the high-frequency signal is suppressed in the same manner as described below.

  An unnecessary high-frequency signal leaked from the second signal line 122 to the bias line 124 branches and propagates to the bias line 124 and the branch line 140 at the branching unit 141. Unnecessary high-frequency signals propagating through the bias line 124 and the branch line 140 are combined at the combining unit 142. When the electrical length of the bias line 124 from the branch part 141 to the junction part 142 is L1, and the electrical length of the branch line 140 is L2, the magnitudes of the electrical lengths L1 and L2 are made different from each other. When an unnecessary high-frequency signal propagating through the branch line 140 and an unnecessary high-frequency signal propagating through the branch line 140 are combined at the junction 142, the phases can be made different from each other.

  The phase difference between the unnecessary high-frequency signal propagating through the bias line 124 and the unnecessary high-frequency signal propagating through the branch line 140 is set to 180 ° or an odd multiple thereof, so that the two unnecessary high-frequency signals have opposite phases. By doing so, both can be combined and canceled. Therefore, it is preferable to set the difference between the electrical lengths L1 and L2 so that the two unnecessary high-frequency signals have opposite phases at the junction 142. That is, the electrical lengths L1 and L2 are preferably set so that the electrical length difference (L2−L1) is approximately equal to λg / 2. Alternatively, the electrical lengths L1 and L2 may be set so that the electrical length difference (L2−L1) is substantially equal to n · (λg / 2). Here, n is an odd integer.

  In the high-frequency module 100 of the present embodiment, the effect of suppressing unnecessary high-frequency signals by providing the branch line 140 will be described below with reference to FIG. FIG. 2 shows a result obtained by simulating the pass characteristics of the high frequency signal in the bias line 124 with the center frequency of the high frequency signal being 20 GHz. FIG. 6A shows a simulation result of the pass characteristics when the branch line 140 of the present embodiment is provided, and FIG. 6B shows an open circuit as illustrated in FIG. The simulation result when a stub is provided is shown.

  The simulation results shown in FIG. 2 are obtained on the assumption of manufacturing errors when the branch line 140 and the open stub are formed by etching the copper foil pattern. Reference numeral 11 indicates a simulation result when there is no manufacturing error of the branch line 140 and the open stub, reference numeral 12 indicates a simulation error when the manufacturing error is +50 μm, and reference numeral 13 indicates a simulation result when the manufacturing error is −50 μm. .

  In FIG. 2, the frequency width in which the high-frequency signal passing characteristic in the bias line is suppressed to −20 dB or less, that is, the frequency width in which isolation of 20 dB is ensured is indicated by double arrows 14 and 15. From the figure, the frequency width 14 when the branch line 140 of this embodiment is provided is wider than the frequency width 15 when the conventional open stub is provided, and is wider in the high-frequency module 100 of this embodiment. It can be seen that unnecessary high frequency signals can be suppressed by the frequency width.

  In order to suppress unnecessary high-frequency signals in the high-frequency module 100 of the present embodiment, it is necessary to form the branch line 140 with high precision so that the electrical length of the branch line 140 becomes a predetermined length. A manufacturing error of the branch line 140 may occur in the width direction due to etching or the like, but the possibility of affecting the length in the longitudinal direction is extremely small. As a result, the branch line 140 can be formed with high accuracy so that the electrical length becomes a predetermined length. On the other hand, in the open stub 913 as shown in FIG. 9, a manufacturing error due to etching or the like directly affects the electrical length of the open stub 913.

  In the high-frequency module 100 of the present embodiment configured as described above, the branch line 130 having both ends of the branch portions 131 and 141 and the junction portions 132 and 142 are respectively connected to the bias lines 123 and 124 through which unnecessary high-frequency signals propagate. 140, and the difference between the electrical lengths of the bias lines 123 and 124 from the branch portions 131 and 141 to the junction portions 132 and 142 and the electrical lengths of the branch lines 130 and 140 is λg. By making it approximately equal to / 2 or an odd multiple thereof, unnecessary high-frequency signals propagating through the bias lines 123 and 124 can be suppressed. The high-frequency module 100 of this embodiment can obtain an excellent high-frequency characteristic by suppressing unnecessary high-frequency signals only by adding a simple configuration such as the branch lines 130 and 140.

(Second Embodiment)
A high-frequency module according to a second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a plan view and a cross-sectional view illustrating the configuration of the high-frequency module according to the second embodiment. The substrate 250 used in the high-frequency module 200 of the present embodiment has a multilayer structure as shown in FIG. 5B, and signal wiring layers 251 and 254 are provided on both surfaces of the substrate 250, Are provided with a ground layer 252 and a power supply wiring layer 253. A dielectric 259 is filled between the layers. Note that the multilayer structure of the substrate 250 is not limited to that shown in FIG. 3, and may be a structure in which another signal wiring layer is provided inside the substrate 250 (the same applies to other embodiments described below). Is).

  Also in the present embodiment, as in the first embodiment, it is assumed that the bias line 223 is formed in the signal wiring layer 251 as an example. Then, in order to connect the bias line 223 to the power supply line 225 of the power supply wiring layer 253, a through formed by penetrating the substrate 250 from one surface (signal wiring layer 251) to the other surface (signal wiring layer 254). A hole 260 is provided. A bias line 223 of the signal wiring layer 251 and a power supply line 225 of the power supply wiring layer 253 are electrically connected to the through hole 260.

  Similar to the first embodiment, when an unnecessary high-frequency signal is propagated to the bias line 223, the through-through hole 260 connected to the bias line 223 may become a radiation source of the unnecessary high-frequency signal. That is, when an unnecessary high-frequency signal propagating through the bias line 223 leaks into the through-hole 260, an unnecessary high-frequency signal is radiated from the through-through hole 260 to adversely affect the surrounding electronic components or the like. There is a risk of exceeding the regulation value.

  Therefore, in the high frequency module 200 of the present embodiment, in order to prevent unnecessary high frequency signals from leaking into the through-hole 260, a branch line 230 having a branch portion 231 and a junction portion 232 is formed on the bias line 223. Yes. Also in the present embodiment, the difference between the electrical length L1 from the branch part 231 to the junction part 232 of the bias line 223 and the electrical length L2 of the branch line 230 is λg / 2 or an odd multiple thereof. .

  In the high-frequency module 200 of the present embodiment, a merging portion 232 is further formed at the upper end of the through hole 260. That is, the junction 232 of the branch line 230 is connected to the upper end of the through hole 260 to which the bias line 223 is connected. By forming the branch line 230 in this way, an unnecessary high-frequency signal propagating through the bias line 223 from the left side of the drawing toward the through hole 260 is distributed to the two lines by the branch part 231, and then is transmitted to the through through hole 260. The unnecessary high-frequency signal that has propagated through the bias line 223 and the unnecessary high-frequency signal that has propagated through the branch line 230 cancel each other out at the junction 232 immediately before leaking. As a result, unnecessary high-frequency signals that leak into the through-holes 260 can be reduced, and unnecessary high-frequency signals can be prevented from being radiated from the through-through holes 260.

(Third embodiment)
A high-frequency module according to a third embodiment of the present invention will be described with reference to FIG. FIG. 4 is a plan view showing the configuration of the high-frequency module according to the third embodiment. The high frequency module 300 according to the present embodiment has the same structure as the high frequency module 200 according to the second embodiment. The branch line 330 is branched and connected to the bias line 223, and the junction 332 is the upper end of the through hole 260. Is formed.

  The high-frequency signal propagating through the signal line to which the bias line 223 is connected is generated using a predetermined high-frequency signal generator, and a multiplier may be used to set the high-frequency signal to a predetermined high-frequency frequency. . As an example, in order to generate a high frequency signal of 20 GHz, a signal generator that generates a high frequency signal of 10 GHz and a multiplier that doubles the frequency 10 GHz of the high frequency signal generated by the signal generator can be used. In this case, the unnecessary high-frequency signal propagating through the bias line 223 may include a 10-GHz high-frequency signal having a half frequency in addition to the 20-GHz high-frequency signal.

  Accordingly, when there is a possibility that an unnecessary high-frequency signal having two or more frequencies propagates through the bias line 223, it is necessary to provide two or more branch lines corresponding to the respective frequencies. However, since an electronic component or the like is arranged on the signal wiring layer 251 forming the branch line, the installation space for the branch line is restricted.

  Therefore, in the high frequency module 300 of the present embodiment, another branch line is provided in the middle of the branch line 330 in order to suppress propagation of unnecessary high frequency signals having two or more frequencies without increasing the installation space of the branch line. 333 is provided. Although the case where there are two unnecessary high-frequency signal frequencies will be described here, a branch path can be formed in the same manner when there are three or more frequencies. In the following, for simplicity of explanation, it is assumed that two types of signals of 10 GHz and 20 GHz propagate through the bias line 223 as unnecessary high-frequency signals.

  In the branch line 330 shown in FIG. 4, the branch part 331 passes through a part 330 a of the branch line 330, passes through another branch line 333, and further passes through another part 330 b of the branch line 330 to join the junction part 332. The electrical length L3 of the line leading to is shorter than the electrical length L2 of the line passing only the branch line 330 without passing through another branch line 333. Accordingly, the difference (L3−L1) between the electrical length L3 and the electrical length L1 from the branching portion 331 to the junction portion 332 of the bias line 223 is 1/2 of the effective wavelength of the 20 GHz high frequency signal or an odd multiple thereof. Another branch line 333 is formed so that Further, the branch line 330 is formed so that the electrical length difference (L2−L1) is ½ of the effective wavelength of the 10 GHz high frequency signal or an odd multiple thereof.

  By forming the branch line 330 and the other branch line 333 used in the high frequency module 300 of the present embodiment as described above, only the installation space of the branch line 330 for reducing unnecessary high frequency signals on the low frequency side is provided. Another branch line 333 for reducing unnecessary high frequency signals on the high frequency side can be formed, and the space of the substrate can be used effectively.

(Fourth embodiment)
A high frequency module according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 5 is a plan view and a cross-sectional view showing the configuration of the high-frequency module of the fourth embodiment. Also in the high frequency module 400 of the present embodiment, a multilayer substrate is used as the substrate 450, the signal wiring layers 451 and 454 are provided on both surfaces of the substrate 450, and the ground layer 452 and the power supply wiring layer 453 are provided inside the substrate 450. Yes.

  In the first to third embodiments, the branch line for suppressing unnecessary high-frequency signals is formed on the signal wiring layer that is the surface of the substrate. However, in a high-frequency module in which discrete components, integrated components, and the like are highly integrated in the signal wiring layer, it may not be possible to secure a sufficient space for forming a branch line in the signal wiring layer. Therefore, in the high-frequency module 400 of the present embodiment, the branch line is formed inside the substrate instead of the signal wiring layer.

  In the high frequency module 400 of this embodiment, branch lines for reducing unnecessary high frequency signals are formed using the through holes 461 and 462 and the power supply wiring layer 453 inside the substrate. Here, the through holes 461 and 462 are interlayer through holes formed in a section from the signal wiring layer 451 to the power supply wiring layer 453.

  The interlayer through holes 461 and 462 are connected to the bias line 423 through the signal wiring layer 451. When an unnecessary high-frequency signal propagates through the bias line 423 from the left side to the right side of the drawing, the connection point between the interlayer through hole 461 and the bias line 423 becomes the branching portion 431 and the connection point between the interlayer through hole 462 and the bias line 423 joins. Part 432. The interlayer through holes 461 and 462 are electrically connected by a connection line 434 in the power supply wiring layer 453. As a result, the branch line 430 used in the present embodiment is configured by a line extending from the branch part 431 to the junction part 432 through the interlayer through hole 461, the connection line 434, and the interlayer through hole 462 sequentially.

  From the above, the electrical length L2 of the branch line 430 is the sum of the electrical lengths of the interlayer through holes 461 and 462 and the electrical length of the connection line 434. The difference (L2−L1) between the electrical length L2 of the branch line 430 and the electrical length L1 of the bias line 423 from the branch part 431 to the junction part 432 is ½ of the effective wavelength λg of the unnecessary high-frequency signal. Alternatively, the electrical lengths L1 and L2 are set so as to be an odd multiple thereof.

  By the way, if the bias line 423 and the connection line 434 from the branch part 431 to the junction part 432 are both formed in a straight line, the electrical lengths of both are substantially equal. As a result, the electrical length difference (L2-L1) is substantially equal to the sum of the electrical lengths of the interlayer through holes 461 and 462. Therefore, the electrical length of the interlayer through holes 461 and 462 needs to be adjusted so that the electrical length difference (L2−L1) is ½ of the wavelength λg or an odd multiple thereof. However, since the distance between the layers of the substrate 450 (the thickness of the dielectric layer between the layers) is usually selected from predetermined values, it is difficult to arbitrarily adjust the distance so as to be a predetermined size.

  Therefore, in the high-frequency module 400 of the present embodiment, the connection line 434 is not linear between the interlayer through holes 461 and 462 in order to make it possible to arbitrarily adjust the electrical length L2 of the branch line 430. The line length is adjusted by appropriately arranging on the layer 453. Thus, the length of the connection line 434 is adjusted on the power supply wiring layer 453 so that the electrical length difference (L2−L1) is ½ of the wavelength λg or an odd multiple thereof. Instead of adjusting the length of the line 434 on the power supply wiring layer 453, another line branched from the interlayer through hole 461 or 462 on the ground layer 452 other than the power supply wiring layer 453 is provided. It is also possible to adjust the electrical length L2.

  As described above, in the high-frequency module 400 according to the present embodiment, the branch line 430 is formed not in the signal wiring layer 451 but in the substrate 450, so that a space for forming the branch line 430 can be easily formed. It can be secured.

(Fifth embodiment)
A high frequency module according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 6 is a plan view and a cross-sectional view showing the configuration of the high-frequency module of the fifth embodiment. In the high frequency module 400 of the fourth embodiment, interlayer through holes 461 and 462 are provided in order to form the branch line 430. On the other hand, in the high frequency module 500 of this embodiment, the branch line is formed using the through through hole that can be formed at a lower cost.

  The high-frequency module 500 of this embodiment includes through-through holes 561 and 562 that penetrate through the entire thickness direction of the substrate 550 from the signal wiring layer 551 to the signal wiring layer 554. The through through holes 561 and 562 are connected to the bias line 523 on the signal wiring layer 551, and when an unnecessary high frequency signal propagates through the bias line 523 from the left side to the right side of the drawing, the through through hole 561 and the bias line 523 Is a junction 531, and a junction between the through-hole 562 and the bias line 523 is a junction 532.

  Further, on the signal wiring layer 554, a connection line 534 that electrically connects the through through holes 561 and 562 is formed. The branch line 530 used in this embodiment is formed of a line extending from the branch part 531 to the junction part 532 via the through through hole 561, the connection line 534, and the through through hole 562.

  Also in this embodiment, the difference (L2−L1) between the electrical length L2 of the branch line 530 and the electrical length L1 of the bias line 523 from the branch part 531 to the junction part 532 is the effective wavelength λg of the unnecessary high-frequency signal. The branch line 530 is formed to be 1/2 or an odd multiple thereof. Since the lengths of the through-holes 561 and 562, that is, the thickness of the substrate 550 are determined by mechanical requirements, the thickness of the substrate 550 is set so that the electrical length difference (L2−L1) satisfies the above condition. It is difficult to arbitrarily choose. Therefore, the electrical length L2 can be adjusted by appropriately arranging the connection line 534 on the signal wiring layer 554.

  Even when the through-through holes 561 and 562 are used, the connection line 534 that electrically connects the two may be formed in a layer inside the substrate 550 other than the signal wiring layer 554. An example is shown in FIG. In FIG. 7, the connection line 534 is formed on the power supply wiring layer 553. Accordingly, the branch line 530 ′ passes through the through-hole 561 from the branch portion 531 to the connection portion with the connection line 534, and the connection line 534 and the connection portion between the connection line 534 and the junction portion 532. The electrical length L2 can be adjusted to be shorter than that of the branch line 530 shown in FIG.

  In the high-frequency module 500 of the present embodiment, two through-through holes are used for forming the branch line, and a line that electrically connects the two through-through holes is formed in any layer of the multilayer substrate, thereby branching. Propagation of unnecessary high-frequency signals can be suppressed by suitably adjusting the electrical length of the line.

  In the description of the above embodiment, the case where only one branch line is formed has been described. However, the present invention is not limited to this, and two or more branch lines may be formed on the bias line. Thereby, it is possible to further enhance the effect of suppressing the propagation of unnecessary high-frequency signals. Needless to say, the effective electrical length can be adjusted by adjusting the characteristic impedance of the branch line. Furthermore, it is also possible to provide a branch line having a branching part and a merging part for a signal line in which an unnecessary high-frequency signal other than the bias line may propagate, thereby forming the high-frequency module of the present invention.

  In addition, the description in this Embodiment shows an example of the high frequency module which concerns on this invention, and is not limited to this. The detailed configuration and detailed operation of the high-frequency module in the present embodiment can be changed as appropriate without departing from the spirit of the present invention.

100, 200, 300, 400, 500 High-frequency module 110 FET
111 Source 112 Gate 113 Drain 121 First signal line 122 Second signal line 123, 124, 223, 423, 523 Bias line 130, 140, 230, 330, 430, 530 Branch line 131, 141, 231, 331, 431, 531 Branch part 132, 142, 232, 332, 432, 532 Junction part 333 Another branch line 150, 250, 450, 550 Substrate 251, 254, 451, 454, 551, 554 Signal wiring layer 252, 452, 552 Ground layer 253, 453, 553 Power supply wiring layer 225 Power supply line 259 Dielectric 260, 461, 462, 561, 562 Through hole 434, 534 Connection line

Claims (9)

A high-frequency module having a substrate and a predetermined line arranged in a surface layer or an internal layer of the substrate,
A branch line having a branch part for branching from the predetermined line and a junction part for rejoining the predetermined line;
The length of the branch line is determined so as to have a predetermined electrical length difference between the electrical length of the branch line and the electrical length from the branch part to the junction part of the predetermined line. High frequency module. 2. The predetermined electrical length difference is substantially equal to λg / 2 or an odd multiple thereof, where λg is an effective wavelength of an unnecessary high-frequency signal propagating through the predetermined line. High frequency module. The high-frequency module according to claim 1, wherein the branch line is formed on a surface of the substrate. The high-frequency module according to claim 3, wherein the junction is provided at a connection point where the predetermined line is connected to a through hole. A first through hole and a second through hole, each having one end connected to a different position of the predetermined line;
A connection line that is wired in a layer different from the layer in which the predetermined line of the substrate is wired and electrically connects the first through hole and the second through hole;
Connection points between the predetermined line and each of the first through hole and the second through hole are the branch part and the junction part, respectively. The branch line extends from the branch part to the first through hole. A line extending from the connection point to the connection portion of the second through-hole, and a line extending from the connection line to the connection point. The high-frequency module according to claim 1 or 2, characterized in that 6. The high-frequency module according to claim 5, wherein the first through hole and the second through hole are through through holes that penetrate the substrate. 6. The high-frequency module according to claim 5, wherein the first through hole and the second through hole are interlayer through holes in which at least one end is formed up to a layer inside the substrate. When unnecessary high frequency signals of two or more different frequencies propagate through the predetermined line,
Comprising one or more other branch lines, both ends of which are connected to different positions of the branch line,
The difference between the electrical length of each line from the branch part to the junction part via the another branch line and the electrical length from the branch part to the junction part of the predetermined line is not less than 2 or more. 8. The high-frequency module according to claim 1, wherein the high-frequency module is substantially equal to ½ of an effective wavelength corresponding to any one of different frequencies or an odd multiple thereof. The high-frequency module according to any one of claims 1 to 8, wherein the predetermined line is a bias line connected to a signal line through which a high-frequency signal propagates.

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