JP2013080632A - Contact pin connection structure and contact pin connection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact pin connection structure and a contact pin connection method which do not affect, when a contact pin is inserted in a hole formed on an insulating layer on a conductive pattern, a portion on the front surface side corresponding to the hole.SOLUTION: A contact pin connection structure comprises: a contact pin which includes a conductive pattern, an insulating layer provided on the conductive pattern, and a conductive material inserted in a hole formed on the insulating layer, and which is electrically connected, at the bottom of the hole, to the conductive pattern; a pin support part which supports, at the bottom of the hole, the contact pin; and conductive paste which electrically connects, at the bottom of the hole, the contact pin to the conductive pattern.

Description

  The present invention relates to a contact pin connection structure and a connection method for electrically connecting a contact pin to a conductive pattern. In particular, the present invention relates to a contact pin connection structure and a connection method for electrically connecting a contact pin to a two-dimensional conductive pattern.

  In the electrical connection between the contact pin and the conductive pattern, when the conductive pattern is exposed, a conductive paste, for example, a silver paste is applied to the contact pin or the conductive pattern, and both are brought into contact to be electrically connected. be able to.

On the other hand, when the conductive pattern is covered with an insulating layer and a part of the conductive pattern is electrically connected to the contact pin, a hole reaching the conductive pattern is provided in the insulating layer, and the contact pin is used as a hole. Insert and electrically connect to the conductive pattern. In this case, a silver paste is inserted in the hole in advance and the contact pin is inserted into the hole to electrically connect the contact pin and the conductive pattern via the silver paste, or the contact pin is provided in the insulating layer. In some cases, a silver paste is injected into the hole after the hole is inserted into the hole to electrically connect the contact pin and the conductive pattern.
In some cases, the conductive pattern is not exposed to the surface as it is, and a base film is provided on the surface. For example, when a thin base film is provided on the surface of the conductive pattern and an insulating layer made of resin is provided on the back side, a contact pin is inserted into a hole provided in the insulating layer on the back side to connect the contact pin and the conductive pattern. Connect electrically.

JP 2010-206792 A

  In the resin molded product in which the insulating layer made of resin, the conductive pattern, and the thin base film are integrated by simultaneous molding when viewed from the back side, the bottom of the hole provided in the insulating layer on the back side is electrically conductive. Only the pattern and the base film are present. Therefore, as a matter of course, since there is no support of the insulating layer made of a molding resin on the back surface side of the base film, there is a possibility that when applying force from the surface, the conductive pattern is broken around the hole and the base film is cracked. . Also, the part corresponding to the hole part on the front side may appear to swell due to the pressing by the contact pin inserted into the hole from the back side or due to the shrinkage difference between the base film and the molding resin around the hole. There is also a risk of losing a sense of unity in appearance. Furthermore, when inserting contact pins into the holes from the back side, the contact pins are directly pressed against the conductive pattern and the base film, so that pin marks may remain on the conductive pattern and eventually pin marks may remain on the base film. . In addition, there is a possibility that the contact pin inserted into the hole breaks the conductive pattern, and the base film is cracked accordingly, and further, the contact pin penetrates the conductive pattern and the base film.

  Therefore, an object of the present invention is to provide a contact pin connection structure and a contact pin that do not affect the portion corresponding to the hole portion on the surface side when the contact pin is inserted into the hole provided in the insulating layer on the conductive pattern. Is to provide a connection method.

The contact pin connection structure according to the first aspect of the present invention includes a conductive pattern,
An insulating layer provided on the conductive pattern;
A contact pin made of a conductive material inserted in a hole provided in the insulating layer, the contact pin being electrically connected to the conductive pattern at the bottom of the hole;
A pin support for supporting the contact pin at the bottom of the hole;
A conductive paste electrically connecting the contact pin and the conductive pattern at the bottom of the hole;
Is provided.

  In the contact pin connection structure according to the first aspect, the contact pin is inserted into a hole formed in an insulating layer provided on the conductive pattern, and the contact pin and the conductive pattern are formed at the bottom of the hole. And may be electrically connected via the conductive paste.

  In the contact pin connection structure according to the first aspect, the contact pin may have an uneven portion that fits into the uneven portion of the pin support portion. Accordingly, the support portion is fitted to the contact pin to fix the contact pin.

  In the contact pin connection structure according to the first aspect, the pin support portion may include a tapered portion in which at least a part of the inner surface of the hole is inclined toward the bottom.

  In the contact pin connection structure according to the first aspect, the cross-sectional shape of the hole may be a star shape.

  In the contact pin connection structure according to the first aspect, the cross-sectional shape of the contact pin may be a star shape.

  In the contact pin connection structure according to the first aspect, the center of the contact pin may be provided eccentric to the center of the hole.

  The contact pin connection structure according to the first aspect may include a support rib that supports the contact pin protruding from the hole.

  In the contact pin connection structure according to the first aspect, the contact pin connection structure may include a bank that surrounds the hole and receives the conductive paste flowing out of the hole.

  In the contact pin connection structure according to the first aspect, the contact pin may be a hollow contact pin, and may include a conductive paste filled in the hollow portion.

The contact pin connection method according to the second aspect of the present invention includes:
(A) providing a hollow contact pin made of a conductive material;
(B) attaching one end of the contact pin to the tip of the dispenser;
(C) Depressurizing the inside of the dispenser, depressurizing the hollow portion of the contact pin, and sucking the conductive paste into the hollow portion of the contact pin;
(D) providing a pin support for supporting the contact pin at the bottom of the hole formed in the insulating layer provided on the conductive pattern;
(E) inserting the other end of the contact pin into the hole formed in the insulating layer, and supporting the other end of the contact pin with the pin support portion;
(F) Pressurizing the inside of the dispenser, pressurizing the hollow portion of the contact pin, and injecting the conductive paste sucked into the hollow portion of the contact pin into the hole formed in the insulating layer. When,
(G) curing the conductive paste to obtain an electrical connection between the contact pin and the conductive pattern via the cured conductive paste;
including.

The contact pin connection method according to the third aspect of the present invention includes:
(A) providing a hollow contact pin made of a conductive material;
(B) providing a dispenser filled with conductive paste;
(C) attaching one end of the contact pin to the tip of the dispenser;
(D) pressurizing the inside of the dispenser and injecting the conductive paste inside the dispenser into the hollow portion of the contact pin;
(E) providing a pin support for supporting the contact pin at the bottom of the hole formed in the insulating layer provided on the conductive pattern;
(F) inserting the other end of the contact pin into the hole formed in the insulating layer, and supporting the other end of the contact pin with the pin support portion;
(G) further pressurizing the inside of the dispenser to inject the conductive paste from the hollow portion of the contact pin into the hole formed in the insulating layer;
(H) curing the conductive paste to obtain an electrical connection between the contact pin and the conductive pattern via the cured conductive paste;
including.

The contact pin connection method according to the fourth aspect of the present invention includes:
(A) providing a hollow contact pin made of a conductive material;
(B) attaching one end of the contact pin to the tip of the dispenser;
(C) providing a pin support for supporting the contact pin at the bottom of the hole formed in the insulating layer provided on the conductive pattern;
(D) injecting a conductive paste into the holes formed in the insulating layer;
(E) inserting the other end of the contact pin into the hole formed in the insulating layer, and supporting the other end of the contact pin with the pin support portion;
(F) Depressurizing the inside of the dispenser, depressurizing the hollow portion of the contact pin, and sucking the conductive paste in the hole into the hollow portion of the contact pin;
(G) curing the conductive paste to obtain an electrical connection between the contact pin and the conductive pattern via the cured conductive paste;
Contact pin connection method including

In the contact pin connection method according to any one of the second to fourth aspects, the insulating layer is adhered onto the conductive pattern with an adhesive,
The conductive paste may include a solvent that can dissolve the adhesive. In this case, the step of injecting the conductive paste into the hole dissolves the adhesive at the bottom of the hole with the solvent contained in the conductive paste, so that the conductive paste becomes the conductive pattern. Then, an electrical connection between the contact pin and the conductive pattern can be obtained through the cured conductive paste.

  In the contact pin connection method according to any one of the second to fourth aspects, in the step of injecting the conductive paste into the hole, the conductive paste is inserted into the hole. It may overflow to the surroundings. As a result, not only the electrical connection but also the mechanical connection can be stabilized.

  According to the contact pin connection structure and connection method of the present invention, the pin support portion is provided at the bottom of the hole formed in the insulating layer on the conductive pattern, and the contact pin inserted into the hole is supported. As a result, the contact pin does not directly press the conductive pattern. As described above, the conductive pattern is provided on the back side of the base film. Therefore, as seen from the front side of the base film, most of the back side is backed up by resin such as an insulating layer and pin support part, so the occurrence of cracks in the base film when external pressure is applied from the front side is suppressed. it can. Moreover, in the surface of a base film, it can suppress that the location corresponding to the hole of a back surface side swells, and can obtain a favorable external appearance. Furthermore, when a contact pin is inserted into the hole from the back side, the contact pin is supported by the pin support portion formed in the hole, so that the pin mark remains on the base film, the base film breaks, or in some cases Problems such as contact pins penetrating the base film can be suppressed. In addition, since the ratio of the resin at the bottom of the hole increases by providing the pin support portion at the bottom of the hole, the influence of the shrinkage difference between the base film and the molding resin around the bottom of the hole can be reduced. Thereby, in the surface of a base film, it can suppress that the location corresponding to the hole of a back surface side swells, and can obtain a favorable external appearance.

2 is a cross-sectional view of a contact pin connection structure according to Embodiment 1. FIG. (A) is a see-through | perspective perspective view which shows an example of the shape of a pin support part, (b) is sectional drawing along the bb 'line | wire when the front-end | tip of the contact pin of (a) is inserted in a hole. (C) is a cross-sectional view along the line aa ′ when the tip of the contact pin of (a) is inserted into the hole, and (d) is the tip of the contact pin of (a). It is a top view at the time of inserting in a hole. (A)-(e) is a top view which shows the various examples of the shape of a pin support part. It is sectional drawing of the connection structure of a contact pin in case a pin support part is a taper shape. (A) is sectional drawing which shows that the cross section of a contact pin is star shape, (b) is a front view of the contact pin which has the cross section of (a), (c) is (a) It is sectional drawing which shows that the cross section of the contact pin of another example is a star shape with few unevenness | corrugations, (d) is a front view of the contact pin which has the cross section of (c). It is a top view which shows the example by which the center of a contact pin is eccentrically arrange | positioned with respect to the center of an elliptical hole. (A) And (b) is a perspective view which shows an example of the support rib which supports the part protruded from the hole of the contact pin, (c) is supporting the part protruded from the hole of two adjacent contact pins. It is a perspective view which shows the example which has arrange | positioned two support ribs to parallel. It is sectional drawing which shows the embankment provided around the hole which inserted the contact pin. It is a schematic sectional drawing which shows the connection structure using a hollow contact pin. (A) is a top view of the connection structure of another example using a hollow contact pin, (b) is sectional drawing along the aa line of (a), (c) is ( It is sectional drawing along the bb line of a). (A) is the schematic which shows the edge part of the flexible lead frame which integrated the some hollow contact pin with the flexible insulating member, (b) is sectional drawing of (a), (c) is the perspective view seen from the upper direction at the time of inserting the flexible lead frame of (a) in the hole, (d) is sectional drawing of (c). (A) is sectional drawing of the edge part of the flexible lead frame of an example different from FIG.11 (b), (b) is sectional drawing at the time of inserting the flexible lead frame of (a) into the hole. (A)-(d) is a flowchart of the connection method of the contact pin which concerns on Embodiment 2. FIG. (A)-(c) is a flowchart of the connection method of the contact pin which concerns on Embodiment 3. FIG. (A)-(d) is a flowchart of the connection method of the contact pin which concerns on Embodiment 4. FIG. (A) And (b) is a flowchart of the connection method of the contact pin which concerns on Embodiment 5. FIG.

  The contact pin connection structure and connection method according to the present invention will be described below with reference to the accompanying drawings. In the drawings, substantially the same members are denoted by the same reference numerals.

(Embodiment 1)
FIG. 1 is a schematic cross-sectional view showing a contact pin connection structure according to Embodiment 1 of the present invention. In this contact pin connection structure, the contact pin 2 made of a conductive material is inserted into the hole 9 provided in the insulating layer 8 on the conductive pattern 6, and the contact pin 2 is the conductive pattern 6 and the conductive paste 4. It is electrically connected via silver paste. This contact pin 2 connection structure is characterized in that a pin support portion 11 provided at the bottom of the hole 9 is provided. The end of the contact pin 2 inserted into the hole 9 is supported by the pin support portion 11 at the bottom of the hole 9. On the other hand, the contact pin 2 is electrically connected to the conductive pattern 6 through the conductive paste 4 at one end. As the conductive paste 4, for example, a silver paste can be used. The conductive pattern 6 may be a two-dimensional pattern. Alternatively, the conductive pattern 6 may be a three-dimensional pattern.

  According to the connection structure of the contact pin 2, the pin support portion 11 is provided at the bottom of the hole 9 formed in the insulating layer 8 on the conductive pattern 6 to support the contact pin 2 inserted into the hole 9. For this reason, the contact pin 2 is not directly in contact with the conductive pattern 6 at the bottom of the hole 9 or is supported by the pin support portion 11 even if it is partially in contact, so that it directly presses the conductive pattern. There is no. As a result, as viewed from the base film 5 provided on the surface of the conductive pattern 6, most of the back surface side is backed up by the resin such as the insulating layer 8 and the pin support portion 11, so that external pressure is applied from the surface side The occurrence of cracks in the base film 5 can be suppressed. Moreover, in the surface of the base film 5, it can suppress that the location corresponding to the hole 9 of a back surface side swells, and can obtain a favorable external appearance. Furthermore, when the contact pin 2 is inserted into the hole 9 from the back surface side, the contact pin 2 is supported by the pin support portion 11 formed in the hole 9, so that the pin film remains on the base film 5. 5 can be broken, and problems such as the contact pin 2 penetrating the conductive pattern 6 and the base film 5 can be suppressed. Further, by providing the pin support portion 11 at the bottom of the hole 9, the proportion of the resin 8, 11 at the bottom of the hole 9 increases. Therefore, the influence of the shrinkage difference between the base film 5 and the molding resin 8 around the bottom of the hole 9 can be reduced. Thereby, in the surface of the base film 5, it can suppress that the location corresponding to the hole 9 of a back surface side swells, and can obtain a favorable external appearance.

Next, possible modifications of the contact pin 2 connection structure will be described.
FIG. 2A is a perspective view showing an example of the shape of the pin support portion 11, and FIG. 2B is a diagram of b− when the tip of the contact pin of FIG. 2A is inserted into the hole 9. FIG. 2C is a cross-sectional view taken along the line aa ′ when the tip of the contact pin 2 in FIG. 2A is inserted into the hole 9. FIG. 2 (d) is a plan view when the tip of the contact pin 2 of FIG. 2 (a) is inserted into the hole 9. 2B, by injecting the conductive paste 4 into the gap between the hole 9 and the contact pin 2, the contact pin 2 and the conductive pattern 6 are electrically connected via the conductive paste 4. Can be connected.

Moreover, the shape of the uneven | corrugated | grooved part of the pin support part 11 is not restricted to the case of FIG. 2, Various shapes can be used.
FIGS. 3A to 3E are plan views showing various examples of the shape of the pin support portion 11. 3A to 3E, the hatched portion is the pin support portion 11, and the white portion is a concave portion, and the conductive paste 4 is filled in the concave portion.
In addition, it is good also considering the front-end | tip shape of the contact pin 2 as a shape corresponding to the uneven | corrugated | grooved part of the pin support part 11. FIG. Specifically, an uneven portion may be provided on the tip shape of the contact pin 2 so as to be fitted to the uneven portion of the pin support portion 11. The pin support part 11 and the contact pin 2 can be fixed by fitting the uneven shape of the pin support part 11 and the uneven part at the tip of the contact pin 2 to each other. As a result, the contact pin 2 can be reliably supported by the pin support portion 11.

Further, the pin support portion 11 may include a tapered portion in which at least a part of the inner surface of the hole 9 is inclined toward the bottom.
FIG. 4 is a cross-sectional view of the connection structure of the contact pin 2 when the pin support portion 11 has a tapered shape. In this contact pin connection structure, as shown in FIG. 4, the insulating layer 8 is tapered at the bottom of the hole 9, and the contact pin 2 is supported by this tapered portion. In this case, the pin support portion 11 corresponds to the tapered portion of the insulating layer 8.

The cross-sectional shape of the hole 9 may be a star shape. Alternatively, the cross-sectional shape of the contact pin 2 may be a star shape.
5A is a cross-sectional view showing that the cross section of the contact pin 2 has a star shape, and FIG. 5B is a front view of the contact pin 2 having the cross section of FIG. 5A. FIG. 5C is a cross-sectional view showing that the cross-section of the contact pin 2 as an example different from that in FIG. 5A is a star shape with less unevenness, and FIG. It is a front view of the contact pin 2 which has the cross section of c).
As shown in FIG. 5, a gap can be provided between the hole 9 and the contact pin 2 by making the cross-sectional shape of the contact pin 2 into a star shape. By this gap, air can escape from the contact formation point with the conductive pattern 6 at the bottom of the hole 9, and the conductive paste 4 can be filled into the bottom of the hole 9, so that the contact pin 2 and the conductive pattern 6 can be electrically connected. Can be possible.

Further, the center of the contact pin 2 may be provided eccentric to the center of the hole 9.
FIG. 6 is a plan view showing an example in which the center of the contact pin 2 is eccentrically arranged with respect to the center of the elliptical hole 9.
As shown in FIG. 6, by arranging the center of the contact pin 2 eccentrically with respect to the center of the hole 9, a gap can be provided between the contact pin 2 and the hole 9. The conductive paste 4 is injected into this gap. Since this gap serves as an escape path for air from the bottom of the hole 9, an electrical connection between the contact pin 2 and the conductive pattern 6 can be easily generated.

Further, a support rib 26 that supports the contact pin 2 protruding from the hole 9 may be provided.
7 (a) and 7 (b) are perspective views showing an example of a support rib 26 that supports a portion protruding from the hole 9 of the contact pin 2, and FIG. 7 (c) shows two adjacent contacts. It is a perspective view which shows the example which has arrange | positioned two support ribs 26 which support the part protruded from the hole 9 of the pin 2 in parallel.
As shown in FIGS. 7A and 7B, by providing the support ribs 26, the contact pins 2 protruding from the holes 9 can be stably supported. Further, as shown in FIG. 7C, the two support ribs 26 are arranged so that the respective contact pins 2 do not face each other, whereby the conductivity that flows out from the gaps between the respective holes 9 and the contact pins 2 is obtained. It is possible to prevent the paste 4 from flowing into the other hole 9 and short-circuiting. In addition, by arranging the support ribs 26 in this way, it is possible to have the same function as the embankment 28 described later.

Further, the bank may have a bank 28 provided around the hole 9 and receiving the conductive paste 4 flowing out from the hole 9.
FIG. 8 is a cross-sectional view showing the dike 28 provided around the hole 9 into which the contact pin 2 is inserted.
As shown in FIG. 8, the conductive paste 4 flowing out from the hole 9 can be received by providing the bank 28 around the hole 9. Thereby, a short circuit with the adjacent contact pin 2 can be prevented.

Moreover, the contact pin 2 is a hollow contact pin, and may include the conductive paste 4 filled in the hollow portion.
FIG. 9 is a schematic cross-sectional view showing a connection structure 10 using a hollow contact pin 2. In this contact pin connection structure, a hollow contact pin 2 made of a conductive material is inserted into a hole 9 provided in an insulating layer 8 on the conductive pattern 6, and the contact pin 2 is electrically connected to the conductive pattern 6. Has been. In the connection structure of the contact pin 2, for example, a silver paste is filled as the conductive paste 4 in the hollow portion of the contact pin 2 that faces one end of the contact pin 2. The contact pin 2 is electrically connected to the conductive pattern 6 through the silver paste 4 at one end. A conductive pattern 6 is provided on the base film 5, and an insulating layer 8 having adhesiveness is bonded on the conductive pattern 6. In this case, the conductive pattern 6 and the insulating layer 8 can be adhered without using an adhesive. A pin support portion 11 that supports the contact pin 2 is provided at the bottom of the hole 9 formed in the insulating layer 8 provided on the conductive pattern 6.

  FIG. 10A is a plan view of a contact pin connection structure 10a according to Modification 1 of Embodiment 1, and FIG. 10B is a cross-sectional view taken along line aa in FIG. (c) is sectional drawing along the bb line of (a). The contact pin connection structure of this modification 1 is different from that of FIG. 9 in that an adhesive layer 7 is provided between the conductive pattern 6 and the insulating layer 8. Further, as shown in the plan view of FIG. 10A and the cross-sectional view taken along the line bb of FIG. 10C, the air vent groove 3 that allows air to escape when the conductive paste 4 is guided to the bottom of the hole 9. It differs in that it is provided. The conductive layer 6 may be exposed by removing the adhesive layer 7 in a pattern at the bottom of the hole 9. Alternatively, as shown in a fourth embodiment to be described later, the adhesive layer 7 is dissolved by including a solvent for dissolving the adhesive layer 7 in the conductive paste 4 so that the conductive pattern 6 is exposed at the bottom of the hole 9. You may let them.

  According to the contact pin connection structures 10 and 10a, the electrical connection between the contact pin 2 and the conductive pattern 6 can be secured by the silver paste 4 injected into the hollow portion of the contact pin 2. Moreover, even if the shape of the contact pin 2 and the hole 9 is minimized, the silver paste is filled in the hollow portion of the contact pin 2 by injecting or sucking the silver paste as the conductive paste 4 using a dispenser or the like. be able to. Furthermore, by injecting the silver paste 4 filled in the hollow portion of the contact pin 2 into the hole 9, air such as bubbles existing at the bottom of the hole 9 can be pushed out and discharged from the hole 9. Thereby, the accumulation of air between the conductive pattern 6 and the silver paste 4 or between the silver paste 4 and the contact pin 2 can be surely eliminated, and the problem of contact failure can be solved.

Alternatively, a flexible lead frame 30 in which a plurality of hollow contact pins are integrated with a flexible insulating member may be used.
FIG. 11A is a schematic view showing an end portion of a flexible lead frame 30 in which a plurality of hollow contact pins are integrated with a flexible insulating member, and FIG. 11 (c) is a perspective view seen from above when the flexible lead frame 30 of FIG. 11 (a) is inserted into the hole 9, and FIG. 11 (d) is a perspective view of FIG. It is sectional drawing of c).
In FIGS. 11A, 11C and 11D, three contact pins are integrated into one flexible lead frame 30, but not limited to this, two or more contact pins are integrated. May be. In this way, by using the flexible lead frame 30 in which a plurality of contact pins are integrated, a plurality of contact pins can be connected simultaneously.

  Furthermore, as shown in FIG. 11D, a bank 28 is provided between each hole 9 into which each contact pin is inserted. The conductive paste 4 flowing out from the hole 9 can be received by the bank 28, and a short circuit with an adjacent contact pin can be prevented.

Note that the flexible lead frame 30 is not limited to the connection at the top of each contact pin as in FIG. 11 (b), but is connected at the middle portion of each contact pin as in FIG. 12 (a). You may do it.
12A is a cross-sectional view of an end portion of a flexible lead frame 30a different from FIG. 11B, and FIG. 12B is a diagram illustrating the insertion of the flexible lead frame 30a of FIG. FIG.

(Embodiment 2)
FIGS. 13A to 13D are flowcharts of contact pin connection methods according to Embodiment 2 of the present invention.
(A) A hollow contact pin 2 made of a conductive material is prepared (FIG. 13A).
(B) One end of the hollow contact pin 2 is attached to the tip of the dispenser 12 (FIG. 13A). In addition, although the figure has shown the dispenser which has piston 14 as the dispenser 12, it is not necessarily restricted to this. In the case of the dispenser 12 having the piston 14, the inside can be depressurized or pressurized by moving the piston 14 up and down. As a type other than the piston, as shown in FIGS. 14A to 14C, a dispenser of a type that pressurizes and depressurizes by injecting and sucking air can also be used.
Moreover, when attaching the contact pin 2 to the dispenser 12, you may attach using the adapter 16 as shown to Fig.13 (a), for example. Alternatively, the contact pin 2 may be directly attached to the tip of the dispenser 12. The shape and material of the adapter 16 are not particularly limited.
(C) The inside of the dispenser 12 is decompressed, the hollow part of the contact pin is decompressed, and the silver paste 4 is sucked into the hollow part of the contact pin 2 (FIG. 13B). In the figure, the piston 14 is pulled up to decompress the inside, and the silver paste 4 is sucked. In this case, the silver paste 4 may be sucked up to the hollow portion of the contact pin 2, and the silver paste 4 may not be sucked above the adapter 16 portion. This facilitates repeated use of the dispenser 12 and prevents the inside of the dispenser 12 from being stained with silver paste.
(D) A pin support portion 11 for supporting the contact pin 2 is provided at the bottom of the hole 9 formed in the insulating layer 8 provided on the conductive pattern 6 (FIG. 13C).
(E) The other end of the hollow contact pin 2 is inserted into the hole 9 formed in the insulating layer 8, and the other end of the contact pin 2 is supported by the pin support portion 11 (FIG. 13C). The conductive pattern 6 is not a single layer, but is laminated in the order of the base film 5, the conductive pattern 6, the adhesive layer 7, and the insulating layer 8. That is, the conductive pattern 6 is provided on the base film 5, and the insulating layer 8 is bonded onto the conductive pattern 6 via the adhesive layer 7. This laminated structure may be appropriately changed according to a necessary configuration. For example, an adhesive layer may be provided between the base film 5 and the conductive pattern 6. Further, a resin layer may be used instead of the base film 5.
(F) The inside of the dispenser 12 is pressurized, the hollow part of the contact pin 2 is pressurized, and the silver paste sucked into the hollow part of the contact pin 2 is injected into the hole 9 formed in the insulating layer 8 (FIG. 13 (c)). In the figure, the piston 14 is pushed down to pressurize the inside, and the silver paste 4 in the hollow portion is sprayed toward the bottom of the hole 9. As shown in FIG. 13 (d), it is preferable to fill the silver paste 4 to the periphery of the hole 9 by further pushing down the piston 14 and spraying the silver paste 4 toward the bottom of the hole 9. Thereby, the bubbles 22 accumulated at the bottom of the hole 9 can be discharged to the top (FIG. 13 (d)).
(G) The silver paste 4 is cured to obtain an electrical connection between the contact pin 2 and the conductive pattern 6 through the cured silver paste 4.
The connection structure of the contact pin 2 can be obtained by the above.

  According to this contact pin connection method, the inside of the dispenser 12 is pressurized, and the silver paste 4 filled in the hollow portion of the contact pin 2 is injected into the hole 9, so that the shape of the hole 9 and the contact pin 2 is minimized. Even then, the silver paste 4 can be injected into the holes 9. Further, by injecting the silver paste injected into the hollow portion of the contact pin 2 into the hole 9, air such as bubbles 22 existing at the bottom of the hole 9 can be pushed out and discharged from the hole 9. Thereby, the accumulation of air between the conductive pattern 6 and the silver paste 4 or between the silver paste 4 and the contact pin 2 can be surely eliminated, and the problem of contact failure can be solved.

(Embodiment 3)
14 (a) to 14 (c) are flowcharts of contact pin connection methods according to Embodiment 3 of the present invention.
(A) A hollow contact pin 2 made of a conductive material is prepared (FIG. 14A).
(B) A dispenser 12 filled with the silver paste 4 is prepared (FIG. 14A). Unlike the dispenser of FIG. 14, the dispenser 12 shown in FIG. 14 (a) is a dispenser of a type that controls pressurization or decompression in the dispenser by injecting or sucking air instead of a piston. Note that a gas such as nitrogen, carbon dioxide, or helium may be used instead of air.
(C) One end of the hollow contact pin 2 is attached to the tip of the dispenser 12 (FIG. 14B). In this case as well, the adapter 16 is used in the same manner as described above, but may be directly connected.
(D) The inside of the dispenser 12 is pressurized, and the silver paste 4 inside the dispenser 12 is injected into the hollow portion of the contact pin 2 (FIG. 14B). Pressurization is performed by air injection.
(E) A pin support portion 11 for supporting the contact pin 2 is provided at the bottom of the hole 9 formed in the insulating layer 8 provided on the conductive pattern 6 (FIG. 14B).
(F) The other end of the hollow contact pin 2 is inserted into the hole 9, and the other end of the contact pin 2 is supported by the pin support portion 11 (FIG. 14B). FIG. 14B shows a case where the above steps (c) to (f) are continuously performed.
(G) The inside of the dispenser 12 is further pressurized, and the silver paste 4 is injected from the hollow portion of the contact pin 2 into the hole 9 formed in the insulating layer 8 (FIG. 14C).
(H) The silver paste 4 is cured to obtain an electrical connection between the contact pin 2 and the conductive pattern 6 through the cured silver paste 4.
The connection structure of the contact pin 2 can be obtained by the above.

  According to this contact pin connection method, the inside of the dispenser 12 is pressurized, and the silver paste 4 filled in the hollow portion of the contact pin 2 is injected into the hole 9, so that the shape of the hole 9 and the contact pin 2 is minimized. Even then, the silver paste 4 can be injected into the holes 9. Furthermore, by injecting the silver paste injected into the hollow portion of the contact pin 2 into the hole 9, air such as bubbles existing at the bottom of the hole 9 can be pushed out and discharged from the hole 9. Thereby, the accumulation of air between the conductive pattern 6 and the silver paste 4 or between the silver paste 4 and the contact pin 2 can be surely eliminated, and the problem of contact failure can be solved.

(Embodiment 4)
15 (a) to 15 (d) are flowcharts of contact pin connection methods according to Embodiment 4 of the present invention.
(A) A hollow contact pin 2 made of a conductive material is prepared (FIG. 15A).
(B) One end of the contact pin 2 is attached to the tip of the dispenser 12 (FIG. 15A).
(C) A pin support portion 11 for supporting the contact pin 2 is provided at the bottom of the hole 9 formed in the insulating layer 8 provided on the conductive pattern 6 (FIG. 15B).
(D) Next, the silver paste 4 is injected into the holes 9 (FIG. 15B). This contact pin 2 connection method is different from the contact pin connection method according to the second and third embodiments in that the silver paste 4 is injected into the holes 9 in advance.
(E) The other end of the contact pin 2 is inserted into the hole 9 formed in the insulating layer 8, and the other end of the contact pin 2 is supported by the pin support portion 11 (FIG. 15C).
(F) The inside of the dispenser 12 is depressurized, the hollow portion of the contact pin 2 is depressurized, and a part of the silver paste 4 in the hole 9 is sucked into the hollow portion of the contact pin 2 (FIG. 15 (d)). In this contact pin connection method, compared with the contact pin connection method according to the second and third embodiments, the hollow portion of the silver paste 4 contact pin 2 filled in the hole 9 in addition to the step (c). It is different in the point to suck.
(G) The silver paste 4 is cured to obtain an electrical connection between the contact pin 2 and the conductive pattern 6 through the cured silver paste 4.
The connection structure of the contact pin 2 can be obtained by the above.

  According to this contact pin connection method, since the silver paste 4 filled in the hole 9 is sucked into the hollow portion of the contact pin 2, even if the shape of the hole 9 and the contact pin 2 is minimized, the silver paste 4 fills the hollow portion of the contact pin 2. Silver paste 4 can be injected. Further, by sucking air such as bubbles existing at the bottom of the hole 9 into the hollow portion of the contact pin 2, the silver paste 4 and the contact pin between the conductive pattern 6 and the silver paste 4 or at the bottom of the hole 9. 2 can be reliably eliminated and the problem of contact failure can be solved.

(Embodiment 5)
FIGS. 16A and 16B are schematic views showing an outline of a contact pin connection method according to the fifth embodiment. This contact pin connection method is characterized in that a silver paste 4 mixed with a solvent capable of dissolving an adhesive 7 for bonding the conductive pattern 6 and the insulating layer 8 is used as the silver paste 4. Thereby, it is not necessary to print the adhesive layer 7 provided on the conductive pattern 6 with a punching pattern in which a corresponding portion connected to the contact pin 2 is opened, and the adhesive layer 7 can be printed with a solid pattern. When using a punching pattern, there is no adhesive layer between the conductive pattern 6 and the insulating layer 8 and there is a portion that does not adhere, but since the adhesive layer 7 can be printed with a solid pattern, there is no adhesive layer. Generation of non-adhered parts can be eliminated.

In the fifth embodiment, the characteristic part in relation to the print pattern of the adhesive layer 7 will be described in more detail.
As described above, the conductive pattern 6 and the insulating layer 8 thereon are bonded by the adhesive layer 7. The adhesive layer 7 is patterned on the conductive pattern 6 by printing. Therefore, in order to open a part where the part of the conductive pattern 6 and the contact pin 2 are electrically connected, it is necessary to print the adhesive layer 7 in a punched pattern where the connection part with the contact pin 2 is opened. It was.

  However, if the portion without the adhesive layer 7 such as a punching pattern is provided so wide, there may be a portion where the conductive pattern 6 and the insulating layer 8 are not sufficiently bonded at a portion other than the hole 9. On the other hand, when the punching pattern is not sufficient, the adhesive layer 7 is interposed between the contact pin 2 and the conductive pattern 6, so that there may be insufficient conduction between them.

  According to the contact pin connection method according to the fifth embodiment, even if the adhesive layer 7 is printed in a solid pattern and the adhesive layer 7 is also present at the bottom of the hole 9, it is included in the silver paste 4. The adhesive layer 7 at the bottom of the hole 9 is dissolved by the solvent to be electrically connected to the conductive pattern 6 (FIG. 16A). In this case, since the region 24 in which the adhesive layer 7 is dissolved by the solvent contained in the silver paste 4 is limited to the peripheral portion at the bottom of the hole 9, the adhesion between the insulating layer 8 and the conductive pattern 6 should be kept good. (FIG. 16B).

  According to the contact pin connection structure and connection method of the present invention, it is useful when an ordinary contact pin is electrically connected to a conductive pattern. In particular, the conductive pattern is useful when, for example, electrical connection is made with a contact pin to a conductive pattern such as an antenna used in portable terminals in recent years or an electrostatic capacitively coupled power transmission pattern.

2 Contact pin 3 Air vent groove 4 Conductive paste 5 Base film 6 Conductive pattern 7 Adhesive layer 8 Insulating layer 9 Hole 10, 10a Connection structure 11 Pin support 12 Dispenser 14 Piston 16 Adapter 18 Air 22 Bubble 24 Area 26 Support rib 28 Embankment 30, 30a Lead frame

Claims (15)

A conductive pattern;
An insulating layer provided on the conductive pattern;
A contact pin made of a conductive material inserted in a hole provided in the insulating layer, the contact pin being electrically connected to the conductive pattern at the bottom of the hole;
A pin support for supporting the contact pin at the bottom of the hole;
A conductive paste electrically connecting the contact pin and the conductive pattern at the bottom of the hole;
Contact pin connection structure with   The contact pin is inserted into a hole formed in an insulating layer provided on the conductive pattern, and the contact pin and the conductive pattern are electrically connected via the conductive paste at the bottom of the hole. The contact pin connection structure according to claim 1.   The contact pin according to claim 1, wherein the contact pin has an uneven portion that fits with an uneven portion of the pin support portion, and the pin support portion fits the contact pin and fixes the contact pin. Connection structure.   The contact pin connection structure according to claim 1, wherein the pin support portion includes a tapered portion in which at least a part of an inner surface of the hole is inclined toward a bottom.   The contact pin connection structure according to claim 1, wherein a cross-sectional shape of the hole is a star shape.   The contact pin connection structure according to claim 1, wherein a cross-sectional shape of the contact pin is a star shape.   The contact pin connection structure according to claim 1, wherein a center of the contact pin is eccentrically provided with respect to a center of the hole.   The contact pin connection structure according to claim 1, further comprising a support rib that supports the contact pin protruding from the hole.   The contact pin connection structure according to claim 1, further comprising an embankment that is provided so as to surround the hole and receives the conductive paste flowing out of the hole.   The contact pin connection structure according to claim 1, wherein the contact pin is a hollow contact pin, and includes a conductive paste filled in the hollow portion. (A) providing a hollow contact pin made of a conductive material;
(B) attaching one end of the contact pin to the tip of the dispenser;
(C) Depressurizing the inside of the dispenser, depressurizing the hollow portion of the contact pin, and sucking the conductive paste into the hollow portion of the contact pin;
(D) providing a pin support for supporting the contact pin at the bottom of the hole formed in the insulating layer provided on the conductive pattern;
(E) inserting the other end of the contact pin into the hole formed in the insulating layer, and supporting the other end of the contact pin with the pin support portion;
(F) Pressurizing the inside of the dispenser, pressurizing the hollow portion of the contact pin, and injecting the conductive paste sucked into the hollow portion of the contact pin into the hole formed in the insulating layer. When,
(G) curing the conductive paste to obtain an electrical connection between the contact pin and the conductive pattern via the cured conductive paste;
Contact pin connection method including (A) providing a hollow contact pin made of a conductive material;
(B) providing a dispenser filled with conductive paste;
(C) attaching one end of the contact pin to the tip of the dispenser;
(D) pressurizing the inside of the dispenser and injecting the conductive paste inside the dispenser into the hollow portion of the contact pin;
(E) providing a pin support for supporting the contact pin at the bottom of the hole formed in the insulating layer provided on the conductive pattern;
(F) inserting the other end of the contact pin into the hole formed in the insulating layer, and supporting the other end of the contact pin with the pin support portion;
(G) further pressurizing the inside of the dispenser to inject the conductive paste from the hollow portion of the contact pin into the hole formed in the insulating layer;
(H) curing the conductive paste to obtain an electrical connection between the contact pin and the conductive pattern via the cured conductive paste;
Contact pin connection method including (A) providing a hollow contact pin made of a conductive material;
(B) attaching one end of the contact pin to the tip of the dispenser;
(C) providing a pin support for supporting the contact pin at the bottom of the hole formed in the insulating layer provided on the conductive pattern;
(D) injecting a conductive paste into the holes formed in the insulating layer;
(E) inserting the other end of the contact pin into the hole formed in the insulating layer, and supporting the other end of the contact pin with the pin support portion;
(F) Depressurizing the inside of the dispenser, depressurizing the hollow portion of the contact pin, and sucking the conductive paste in the hole into the hollow portion of the contact pin;
(G) curing the conductive paste to obtain an electrical connection between the contact pin and the conductive pattern via the cured conductive paste;
Contact pin connection method including The insulating layer is adhered on the conductive pattern by an adhesive,
The conductive paste includes a solvent capable of dissolving the adhesive,
The step of injecting the conductive paste into the hole dissolves the adhesive at the bottom of the hole by the solvent contained in the conductive paste, and the conductive paste reaches the conductive pattern; The contact pin connection method according to any one of claims 11 to 13, wherein an electrical connection between the contact pin and the conductive pattern is obtained via a cured conductive paste.   The contact pin connection method according to claim 11, wherein the step of injecting the conductive paste into the hole causes the conductive paste to overflow around the hole.

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