JP2013069829A - Multilayer electronic component - Google Patents

Multilayer electronic component Download PDF

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JP2013069829A
JP2013069829A JP2011206872A JP2011206872A JP2013069829A JP 2013069829 A JP2013069829 A JP 2013069829A JP 2011206872 A JP2011206872 A JP 2011206872A JP 2011206872 A JP2011206872 A JP 2011206872A JP 2013069829 A JP2013069829 A JP 2013069829A
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coil
conductor
laminate
conductor pattern
electronic component
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JP5926913B2 (en
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Eiji Iso
英治 磯
Yutaka Noguchi
裕 野口
Makoto Yamamoto
誠 山本
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Toko Inc
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Toko Inc
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Abstract

PROBLEM TO BE SOLVED: To solve such problems that it is required to lead out both ends of a coil to the bottom face of a laminate through vias when terminals are formed only on the bottom face of a laminate, and that when terminals are formed over the bottom face and the side surface of a laminate, the terminal becomes thin at a corner where the bottom face and the side surface of a laminate intersect, and is divided into a portion formed on the bottom face of a laminate and a portion formed on the side surface of a laminate thus causing disconnection or increase in DC resistance.SOLUTION: An insulator layer and a conductor pattern are laminated, and a circuit element is formed in the laminate. At a corner of the laminate where the bottom face and the side surface intersect, a conductor is formed to expose the surface to the corner. An electrode for connection with the conductor is formed on the side surface of the laminate. Both ends of the circuit element are connected with the electrode on the side surface of the laminate, and a terminal is formed by the conductor and the electrode.

Description

本発明は、絶縁体層と導体パターンが積層された積層体内部に回路素子が形成され、この回路素子が積層体の外表面に形成された端子に接続された積層型電子部品に関するものである。   The present invention relates to a multilayer electronic component in which a circuit element is formed inside a laminate in which an insulator layer and a conductor pattern are laminated, and the circuit element is connected to a terminal formed on the outer surface of the laminate. .

従来の電子部品に、図１４と図１５に示す様に、絶縁体層１４１と導体パターン１４２を積層して、これらの積層体内にコイルが形成され、積層体の外表面に端子１４４を形成した積層型電子部品がある。
この種の電子部品が実装される電子機器では、小型化に伴って実装基板とその上部基板やシールドケース等との距離が小さくなっている。この様な電子機器の実装基板に従来の電子部品を実装した場合、上部基板やシールドケースと電子部品の上面に形成された端子が接触し、上部基板やシールドケースとの間でショートしやすかった。
この様な問題を解決するために、図１６（Ａ）に示す様に積層体の底面にのみ端子１６４を形成する（例えば、特許文献１を参照。）か、又は、図１６（Ｂ）に示す様に積層体の底面と側面に渡って端子１６４を形成する（例えば、特許文献２を参照。）ことが行われている。 As shown in FIGS. 14 and 15, an insulator layer 141 and a conductor pattern 142 are laminated on a conventional electronic component, and a coil is formed in these laminates, and a terminal 144 is formed on the outer surface of the laminate. There are stacked electronic components.
In an electronic device on which this type of electronic component is mounted, the distance between the mounting substrate and the upper substrate, the shield case, and the like is reduced with the miniaturization. When a conventional electronic component is mounted on a mounting board of such an electronic device, the terminal formed on the upper surface of the upper substrate or the shield case and the upper surface of the electronic component is in contact, and it is easy to short-circuit between the upper substrate or the shield case. .
In order to solve such a problem, the terminal 164 is formed only on the bottom surface of the stacked body as shown in FIG. 16A (see, for example, Patent Document 1) or as shown in FIG. As shown, terminals 164 are formed across the bottom and side surfaces of the laminate (see, for example, Patent Document 2).

特開2007-12920号公報Japanese Unexamined Patent Publication No. 2007-12920 特開2006-114626号公報JP 2006-114626 A

しかしながら、積層体の底面にのみ端子を形成した従来の電子部品においては、積層体内部の構造が複雑になり、コイルの両端を貫通ビアにて積層体の底面に引き出す必要があった。また、積層体の底面と側面に渡って端子を形成した従来の電子部品においては、コイルの巻軸が実装面と平行になり、低背化した場合、磁束通過面積が小さくなり、特性が劣化するという問題があった。さらに、積層体の底面と側面に渡って端子を形成した従来の電子部品においては、積層体の底面と側面が交差する角部分で端子の厚みが薄くなって、端子が積層体の底面に形成された部分と積層体の側面に形成された部分とに分断され易く、断線が発生したり、直流抵抗が上昇したりするという問題があった。   However, in the conventional electronic component in which the terminal is formed only on the bottom surface of the multilayer body, the structure inside the multilayer body becomes complicated, and it is necessary to draw both ends of the coil to the bottom surface of the multilayer body with through vias. In addition, in conventional electronic components in which terminals are formed across the bottom and side surfaces of the laminate, when the coil winding axis is parallel to the mounting surface and the height is lowered, the magnetic flux passage area is reduced and the characteristics deteriorate. There was a problem to do. Furthermore, in the conventional electronic component in which the terminal is formed across the bottom surface and the side surface of the laminate, the terminal thickness is reduced at the corner portion where the bottom surface and the side surface of the laminate intersect, and the terminal is formed on the bottom surface of the laminate. There is a problem in that breakage is easily generated and a direct current resistance is increased because the portion is easily divided into the formed portion and the portion formed on the side surface of the laminate.

本発明は、端子が積層体の底面に形成された部分と側面に形成された部分との間で断線したり、直流抵抗が上昇したりすることのない積層型電子部品を提供することを目的とする。   An object of the present invention is to provide a multilayer electronic component in which a terminal is not disconnected or a direct current resistance is not increased between a portion formed on the bottom surface of a multilayer body and a portion formed on a side surface. And

本発明は、絶縁体層と導体パターンを積層し、積層体内に回路素子が形成され、回路素子が積層体の外表面に形成された端子に接続された積層型電子部品において、積層体の底面と側面が交差する角部に、その表面が角部に露出する導電体を形成し、積層体の側面に導電体と接続する電極を形成して端子とする。   The present invention relates to a multilayer electronic component in which an insulator layer and a conductor pattern are laminated, a circuit element is formed in the laminate, and the circuit element is connected to a terminal formed on the outer surface of the laminate. A conductor whose surface is exposed at the corner is formed at the corner where the side and the side intersect, and an electrode connected to the conductor is formed on the side of the laminate to form a terminal.

本発明は、絶縁体層と導体パターンを積層し、積層体内に回路素子が形成され、回路素子が積層体の外表面に形成された端子に接続された積層型電子部品において、積層体の底面と側面が交差する角部に、その表面が角部に露出する導電体を形成し、積層体の側面に導電体と接続する電極を形成して端子とするので、断線が発生したり、直流抵抗が上昇したりするのを防止できる。   The present invention relates to a multilayer electronic component in which an insulator layer and a conductor pattern are laminated, a circuit element is formed in the laminate, and the circuit element is connected to a terminal formed on the outer surface of the laminate. The conductor whose surface is exposed at the corner is formed at the corner where the side and the side intersect, and the electrode connected to the conductor is formed on the side of the laminated body as a terminal. It is possible to prevent the resistance from increasing.

本発明の積層型電子部品の第１の実施例を示す分解斜視図である。1 is an exploded perspective view showing a first embodiment of a multilayer electronic component of the present invention. 本発明の積層型電子部品の第１の実施例を示す斜視図である。1 is a perspective view showing a first embodiment of a multilayer electronic component according to the present invention. 本発明の積層型電子部品の第１の実施例を示す断面図である。It is sectional drawing which shows the 1st Example of the multilayer electronic component of this invention. 本発明の積層型電子部品の第２の実施例を示す斜視図である。It is a perspective view which shows the 2nd Example of the multilayer electronic component of this invention. 本発明の積層型電子部品の第３の実施例を示す分解斜視図である。It is a disassembled perspective view which shows the 3rd Example of the multilayer electronic component of this invention. 本発明の積層型電子部品の第３の実施例を示す斜視図である。It is a perspective view which shows the 3rd Example of the multilayer electronic component of this invention. 本発明の積層型電子部品の第３の実施例を示す断面図である。It is sectional drawing which shows the 3rd Example of the multilayer electronic component of this invention. 本発明の積層型電子部品の第４の実施例を示す斜視図である。It is a perspective view which shows the 4th Example of the multilayer electronic component of this invention. 本発明の積層型電子部品の第５の実施例を示す分解斜視図である。It is a disassembled perspective view which shows the 5th Example of the multilayer electronic component of this invention. 本発明の積層型電子部品の第５の実施例を示す斜視図である。It is a perspective view which shows the 5th Example of the multilayer electronic component of this invention. 本発明の積層型電子部品の第６の実施例を示す斜視図である。It is a perspective view which shows the 6th Example of the multilayer electronic component of this invention. 本発明の積層型電子部品の第７の実施例を示す分解斜視図である。It is a disassembled perspective view which shows the 7th Example of the multilayer electronic component of this invention. 本発明の積層型電子部品の第８の実施例を示す分解斜視図である。It is a disassembled perspective view which shows the 8th Example of the multilayer electronic component of this invention. 従来の積層型電子部品の分解斜視図である。It is a disassembled perspective view of the conventional multilayer electronic component. 従来の積層型電子部品の斜視図である。It is a perspective view of the conventional multilayer electronic component. 従来の別の積層型電子部品の断面図である。It is sectional drawing of another conventional multilayer electronic component.

本発明の積層型電子部品は、絶縁体層と導体パターンを積層し、絶縁体層間の導体パターンを接続して、積層体内にコイルが形成される。また、この積層体は、底面と側面が交差する角部に、その表面が角部に沿って露出する導電体が形成される。さらに、この積層体の側面と底面には導電体に接続される電極がそれぞれ形成される。そして、コイルの両端が積層体の側面に引き出されて積層体の側面に形成された電極に接続される。この様にして積層体の底面と側面が交差する角部にその表面が露出した導電体と積層体の側面と底面にそれぞれ形成された電極によって端子が形成される。
従って、本発明の積層型電子部品は、従来の様に積層体の底面と側面が交差する角部で端子の厚みが薄くなることがなく、積層体の底面に形成された電極と積層体の側面に形成された電極が導電体によって確実に接続される。また、本発明の積層型電子部品は、積層体の角部にその表面が角部に沿って露出する様に導電体が形成されるので、導電体を積層体内のデッドスペースの必要最小限のスペースに形成することができ、その分磁性体を形成するスペースを増加させたり、コイルによって発生する磁束の交錯する量を低減して交流抵抗を低減させたりすることができ、コイルの電気的特性の劣化を防止できる。 In the multilayer electronic component of the present invention, an insulator layer and a conductor pattern are laminated, and a conductor pattern between the insulator layers is connected to form a coil in the laminate. Further, in this laminated body, a conductor whose surface is exposed along the corner is formed at the corner where the bottom surface and the side surface intersect. Furthermore, electrodes connected to the conductor are respectively formed on the side surface and the bottom surface of the laminate. Then, both ends of the coil are drawn out to the side surface of the laminated body and connected to the electrodes formed on the side surface of the laminated body. In this way, a terminal is formed by the conductor whose surface is exposed at the corner where the bottom surface and the side surface of the multilayer body intersect and the electrode formed on each of the side surface and the bottom surface of the multilayer body.
Therefore, the multilayer electronic component of the present invention does not reduce the thickness of the terminal at the corner portion where the bottom surface and the side surface of the multilayer body intersect as in the prior art. The electrodes formed on the side surfaces are securely connected by the conductor. Further, in the multilayer electronic component of the present invention, the conductor is formed at the corner of the multilayer body so that the surface is exposed along the corner, so that the conductor has the minimum necessary dead space in the multilayer body. It can be formed in a space, and accordingly, the space for forming a magnetic material can be increased, or the amount of magnetic flux generated by the coil can be reduced to reduce the AC resistance. Can be prevented.

以下、本発明の積層型電子部品の実施例を図１乃至図１３を参照して説明する。
図１は本発明の積層型電子部品の第１の実施例を示す分解斜視図、図２は本発明の積層型電子部品の第１の実施例を示す斜視図、図３は本発明の積層型電子部品の第１の実施例を示す断面図である。
図１乃至図３において、１１Ａ〜１１Ｅは絶縁体層、１２Ａ〜１２Ｃは導体パターンである。
絶縁体層１１Ａ〜１１Ｅは磁性体、非磁性体、誘電体等の絶縁体を用いて形成される。また、導体パターン１２Ａ〜１２Ｃは、銀、銀系、金、金系、白金等の金属材料をペースト状にした導体ペーストを用いて形成される。
絶縁体層１１Ａには、長手方向の両端部の中央に切り欠きが形成され、この切り欠き内に導体が充填されて導電体１３Ａと導電体１３Ｂが形成される。導電体１３Ａと導電体１３Ｂはその表面が絶縁体層１１Ａの表裏面と長手方向の側面に露出する。
絶縁体層１１Ｂの表面には、コイル用導体パターン１２Ａが形成される。このコイル用導体パターン１２Ａは１ターン未満分が形成される。コイル用導体パターン１２Ａの一端は絶縁体層１１Ｂの長手方向の側面まで引き出される。
絶縁体層１１Ｃの表面には、コイル用導体パターン１２Ｂが形成される。このコイル用導体パターン１２Ｂは１ターン未満分が形成される。コイル用導体パターン１２Ｂの一端は絶縁体層１１Ｃのスルーホール内の導体を介してコイル用導体パターン１２Ａの他端に接続される。
絶縁体層１１Ｄの表面には、コイル用導体パターン１２Ｃが形成される。このコイル用導体パターン１２Ｃは１ターン未満分が形成される。コイル用導体パターン１２Ｃの一端は絶縁体層１１Ｄのスルーホール内の導体を介してコイル用導体パターン１２Ｂの他端に接続される。コイル用導体パターン１２Ｃの他端は絶縁体層１１Ｄの長手方向の側面まで引き出される。この様にコイル用導体パターン１２Ａ、コイル用導体パターン１２Ｂ、コイル用導体パターン１２Ｃを螺旋状に接続することによりコイルが形成される。
この絶縁体層１１Ｄ上には絶縁体層１１Ｅが積層される。
この様に絶縁体層１１Ａ〜１１Ｅとコイル用導体パターン１２Ａ〜１２Ｃが積層された積層体は、底面と長手方向の側面が交差する角部に、その表面が角部に沿って露出する導電体１３Ａ、１３Ｂが形成される。この積層体には、図２、図３に示す様に、底面に電極１４Ａ１と電極１４Ｂ１が、長手方向の側面に電極１４Ａ２と電極１４Ｂ２がそれぞれ形成される。この電極１４Ａ１と電極１４Ａ２は導電体１３Ａによって接続されて端子が形成される。また、電極１４Ｂ１と電極１４Ｂ２は導電体１３Ｂによって接続されて端子が形成される。
そして、コイルの一端を構成するコイル用導体パターン１２Ａの一端が電極１４Ａ２に、コイルの他端を構成するコイル用導体パターン１２Ｃの他端が電極１４Ｂ２にそれぞれ接続されることにより、コイルが電極１４Ａ１、１４Ａ２、導電体１３Ａによって構成される端子と電極１４Ｂ１、１４Ｂ２、導電体１３Ｂによって構成される端子間に接続される。 Embodiments of the multilayer electronic component of the present invention will be described below with reference to FIGS.
FIG. 1 is an exploded perspective view showing a first embodiment of the multilayer electronic component of the present invention, FIG. 2 is a perspective view showing the first embodiment of the multilayer electronic component of the present invention, and FIG. It is sectional drawing which shows the 1st Example of a type | mold electronic component.
1 to 3, 11A to 11E are insulator layers, and 12A to 12C are conductor patterns.
The insulator layers 11A to 11E are formed using an insulator such as a magnetic material, a non-magnetic material, or a dielectric material. The conductor patterns 12A to 12C are formed using a conductor paste in which a metal material such as silver, silver-based, gold, gold-based, or platinum is pasted.
Insulator layer 11A has a notch formed at the center of both ends in the longitudinal direction, and a conductor is filled in the notch to form conductor 13A and conductor 13B. The surfaces of the conductors 13A and 13B are exposed on the front and back surfaces of the insulator layer 11A and the side surfaces in the longitudinal direction.
A coil conductor pattern 12A is formed on the surface of the insulator layer 11B. The coil conductor pattern 12A is formed for less than one turn. One end of the coil conductor pattern 12A is drawn to the side surface in the longitudinal direction of the insulating layer 11B.
A coil conductor pattern 12B is formed on the surface of the insulator layer 11C. The coil conductor pattern 12B is formed for less than one turn. One end of the coil conductor pattern 12B is connected to the other end of the coil conductor pattern 12A via a conductor in the through hole of the insulator layer 11C.
A coil conductor pattern 12C is formed on the surface of the insulator layer 11D. The coil conductor pattern 12C is formed for less than one turn. One end of the coil conductor pattern 12C is connected to the other end of the coil conductor pattern 12B through a conductor in the through hole of the insulator layer 11D. The other end of the coil conductor pattern 12C is drawn to the side surface in the longitudinal direction of the insulating layer 11D. Thus, the coil is formed by connecting the coil conductor pattern 12A, the coil conductor pattern 12B, and the coil conductor pattern 12C in a spiral shape.
An insulator layer 11E is stacked on the insulator layer 11D.
In this way, the laminated body in which the insulator layers 11A to 11E and the coil conductor patterns 12A to 12C are laminated is a conductor whose surface is exposed along the corner at the corner where the bottom surface and the side surface in the longitudinal direction intersect. 13A and 13B are formed. As shown in FIGS. 2 and 3, the laminate is formed with electrodes 14A1 and 14B1 on the bottom surface and electrodes 14A2 and 14B2 on the side surfaces in the longitudinal direction. The electrode 14A1 and the electrode 14A2 are connected by a conductor 13A to form a terminal. Further, the electrode 14B1 and the electrode 14B2 are connected by a conductor 13B to form a terminal.
Then, one end of the coil conductor pattern 12A constituting one end of the coil is connected to the electrode 14A2, and the other end of the coil conductor pattern 12C constituting the other end of the coil is connected to the electrode 14B2. , 14A2, and a terminal constituted by the conductor 13A and a terminal constituted by the electrodes 14B1, 14B2 and the conductor 13B.

図４は本発明の積層型電子部品の第２の実施例を示す斜視図である。
絶縁体層とコイル用導体パターンを図１の様に積層して積層体が形成され、絶縁体層間のコイル用導体パターンを螺旋状に接続して、積層体内にコイルが形成される。また、この積層体は、底面と長手方向の側面が交差する角部に、その表面が露出する導電体４３Ａ、４３Ｂが形成される。
この様に形成された積層体には、底面に電極４４Ａ１と電極４４Ｂ１が、長手方向の側面に電極４４Ａ２と電極４４Ｂ２がそれぞれ形成される。電極４４Ａ２と電極４４Ｂ２はその幅が積層体の長手方向の側面の幅とほぼ等しくなる様に形成される。この電極４４Ａ１と電極４４Ａ２は導電体４３Ａによって接続されて端子が形成される。また、電極４４Ｂ１と電極４４Ｂ２は導電体４３Ｂによって接続されて端子が形成される。
そして、コイルの一端が電極４４Ａ２に、コイルの他端が電極４４Ｂ２にそれぞれ接続されることにより、コイルが電極４４Ａ１、４４Ａ２、導電体４３Ａによって構成される端子と電極４４Ｂ１、４４Ｂ２、導電体４３Ｂによって構成される端子間に接続される。 FIG. 4 is a perspective view showing a second embodiment of the multilayer electronic component of the present invention.
A laminate is formed by laminating the insulator layer and the coil conductor pattern as shown in FIG. 1, and the coil conductor pattern between the insulator layers is spirally connected to form a coil in the laminate. Further, in this laminated body, conductors 43A and 43B whose surfaces are exposed are formed at corners where the bottom surface and the side surface in the longitudinal direction intersect.
In the laminated body thus formed, the electrode 44A1 and the electrode 44B1 are formed on the bottom surface, and the electrode 44A2 and the electrode 44B2 are formed on the side surface in the longitudinal direction. The electrode 44A2 and the electrode 44B2 are formed so that the width thereof is substantially equal to the width of the side surface in the longitudinal direction of the laminate. The electrodes 44A1 and 44A2 are connected by a conductor 43A to form a terminal. The electrode 44B1 and the electrode 44B2 are connected by a conductor 43B to form a terminal.
Then, one end of the coil is connected to the electrode 44A2, and the other end of the coil is connected to the electrode 44B2, so that the coil is formed by the terminals constituted by the electrodes 44A1, 44A2 and the conductor 43A and the electrodes 44B1, 44B2 and the conductor 43B. Connected between configured terminals.

図５は本発明の積層型電子部品の第３の実施例を示す分解斜視図、図６は本発明の積層型電子部品の第３の実施例を示す斜視図、図７は本発明の積層型電子部品の第３の実施例を示す断面図である。
絶縁体層５１Ａには、長手方向の両端部の中央に切り欠きが形成されると共に、この切り欠きに連なり幅方向に延在する貫通孔が形成され、この切り欠きと貫通孔内に導体が充填されて導電体５３Ａと導電体５３Ｂが形成される。導電体５３Ａと導電体５３Ｂはその表面が絶縁体層５１Ａの表裏面と長手方向の側面に露出する。
絶縁体層５１Ｂには、長手方向の両端部の中央に切り欠きが形成され、この切り欠き内に導体が充填されて導電体５３Ａと導電体５３Ｂが形成される。導電体５３Ａと導電体５３Ｂはその表面が絶縁体層５１Ｂの表裏面と長手方向の側面に露出する。
絶縁体層５１Ｃの表面には、コイル用導体パターン５２Ａが形成される。このコイル用導体パターン５２Ａの一端は絶縁体層５１Ｃの長手方向の側面まで引き出される。
絶縁体層５１Ｄの表面には、コイル用導体パターン５２Ｂが形成される。このコイル用導体パターン５２Ｂの一端は絶縁体層５１Ｄのスルーホール内の導体を介してコイル用導体パターン５２Ａの他端に接続される。
絶縁体層５１Ｅの表面には、コイル用導体パターン５２Ｃが形成される。このコイル用導体パターン５２Ｃの一端は絶縁体層５１Ｅのスルーホール内の導体を介してコイル用導体パターン５２Ｂの他端に接続される。コイル用導体パターン５２Ｃの他端は絶縁体層５１Ｅの長手方向の側面まで引き出される。この様にコイル用導体パターン５２Ａ、コイル用導体パターン５２Ｂ、コイル用導体パターン５２Ｃを螺旋状に接続することによりコイルが形成される。
この絶縁体層５１Ｅ上には絶縁体層５１Ｆが積層される。
この様に絶縁体層５１Ａ〜５１Ｆとコイル用導体パターン５２Ａ〜５２Ｃが積層された積層体は、底面と長手方向の側面が交差する角部に、その表面が露出する導電体５３Ａと導電体５３Ｂが形成される。導電体５３Ａと導電体５３Ｂは、積層体の底面に露出している部分に積層体の底面の幅方向に幅を広げた部分が形成される。この積層体には、図６、図７に示す様に、長手方向の側面に電極５４Ａと電極５４Ｂがそれぞれ形成される。電極５４Ａは導電体５３Ａに接続される。また、電極５４Ｂは導電体５３Ｂに接続される。
そして、コイルの一端を構成するコイル用導体パターン５２Ａの一端が電極５４Ａに、コイルの他端を構成するコイル用導体パターン５２Ｃの他端が電極５４Ｂにそれぞれ接続されることにより、コイルが電極５４Ａ、導電体５３Ａによって構成される端子と電極５４Ｂ、導電体５３Ｂによって構成される端子間に接続される。 FIG. 5 is an exploded perspective view showing a third embodiment of the multilayer electronic component of the present invention, FIG. 6 is a perspective view showing the third embodiment of the multilayer electronic component of the present invention, and FIG. It is sectional drawing which shows the 3rd Example of a type | mold electronic component.
The insulator layer 51A has a notch formed at the center of both end portions in the longitudinal direction, and a through hole extending in the width direction connected to the notch, and a conductor is formed in the notch and the through hole. The conductor 53A and the conductor 53B are formed by filling. The surfaces of the conductors 53A and 53B are exposed on the front and back surfaces of the insulator layer 51A and the side surfaces in the longitudinal direction.
The insulator layer 51B has a notch formed at the center of both end portions in the longitudinal direction, and a conductor is filled in the notch to form a conductor 53A and a conductor 53B. The surfaces of the conductors 53A and 53B are exposed on the front and back surfaces of the insulator layer 51B and the side surfaces in the longitudinal direction.
A coil conductor pattern 52A is formed on the surface of the insulator layer 51C. One end of the coil conductor pattern 52A is drawn to the side surface in the longitudinal direction of the insulating layer 51C.
A coil conductor pattern 52B is formed on the surface of the insulating layer 51D. One end of the coil conductor pattern 52B is connected to the other end of the coil conductor pattern 52A via a conductor in the through hole of the insulator layer 51D.
A coil conductor pattern 52C is formed on the surface of the insulator layer 51E. One end of the coil conductor pattern 52C is connected to the other end of the coil conductor pattern 52B through a conductor in the through hole of the insulator layer 51E. The other end of the coil conductor pattern 52C is drawn to the side surface in the longitudinal direction of the insulating layer 51E. In this manner, the coil conductor pattern 52A, the coil conductor pattern 52B, and the coil conductor pattern 52C are spirally connected to form a coil.
An insulator layer 51F is laminated on the insulator layer 51E.
Thus, the laminated body in which the insulator layers 51A to 51F and the coil conductor patterns 52A to 52C are laminated has the conductors 53A and 53B whose surfaces are exposed at the corners where the bottom surfaces and the side surfaces in the longitudinal direction intersect. Is formed. In the conductor 53A and the conductor 53B, a portion whose width is increased in the width direction of the bottom surface of the multilayer body is formed in a portion exposed on the bottom surface of the multilayer body. As shown in FIGS. 6 and 7, an electrode 54 </ b> A and an electrode 54 </ b> B are respectively formed on the side surfaces in the longitudinal direction of the laminate. The electrode 54A is connected to the conductor 53A. The electrode 54B is connected to the conductor 53B.
Then, one end of the coil conductor pattern 52A constituting one end of the coil is connected to the electrode 54A, and the other end of the coil conductor pattern 52C constituting the other end of the coil is connected to the electrode 54B. And a terminal constituted by the conductor 53A and the electrode 54B and a terminal constituted by the conductor 53B.

図８は本発明の積層型電子部品の第４の実施例を示す斜視図である。
絶縁体層とコイル用導体パターンを図５の様に積層して積層体が形成され、絶縁体層間のコイル用導体パターンを螺旋状に接続して、積層体内にコイルが形成される。また、この積層体は、底面と長手方向の側面が交差する角部に、その表面が露出する導電体８３Ａと導電体８３Ｂが形成される。導電体８３Ａと導電体８３Ｂは、積層体の底面に露出している部分に積層体の底面の幅方向に幅を広げた部分が形成される。
この様に形成された積層体には、長手方向の側面に電極８４Ａと電極８４Ｂが形成される。電極８４Ａと電極８４Ｂはその幅が積層体の長手方向の側面の幅とほぼ等しくなる様に形成される。
そして、コイルの一端が電極８４Ａに、コイルの他端が電極８４Ｂにそれぞれ接続されることにより、コイルが電極８４Ａ、導電体８３Ａによって構成される端子と電極８４Ｂ、導電体８３Ｂによって構成される端子間に接続される。 FIG. 8 is a perspective view showing a fourth embodiment of the multilayer electronic component of the present invention.
The insulator layer and the coil conductor pattern are laminated as shown in FIG. 5 to form a laminate, and the coil conductor patterns between the insulator layers are spirally connected to form a coil in the laminate. Further, in this laminated body, conductors 83A and conductors 83B whose surfaces are exposed are formed at corners where the bottom surface and the side surface in the longitudinal direction intersect. In the conductor 83A and the conductor 83B, a portion that is widened in the width direction of the bottom surface of the multilayer body is formed in a portion exposed on the bottom surface of the multilayer body.
In the laminated body thus formed, the electrode 84A and the electrode 84B are formed on the side surface in the longitudinal direction. The electrode 84A and the electrode 84B are formed so that the width thereof is substantially equal to the width of the side surface in the longitudinal direction of the laminate.
Then, one end of the coil is connected to the electrode 84A and the other end of the coil is connected to the electrode 84B, so that the coil is a terminal constituted by the electrode 84A and the conductor 83A and a terminal constituted by the electrode 84B and the conductor 83B. Connected between.

図９は本発明の積層型電子部品の第５の実施例を示す分解斜視図、図１０は本発明の積層型電子部品の第５の実施例を示す斜視図である。
絶縁体層９１Ａには、長手方向の両端部に絶縁体層９１Ａの幅と同じ幅の導電体９３Ａと導電体９３Ｂが形成される。
絶縁体層９１Ｂには、長手方向の両端部の中央に切り欠きが形成され、この切り欠き内に導体が充填されて導電体９３Ａと導電体９３Ｂが形成される。導電体９３Ａと導電体９３Ｂはその表面が絶縁体層９１Ｂの表裏面と長手方向の側面に露出する。
絶縁体層９１Ｃの表面には、コイル用導体パターン９２Ａが形成される。このコイル用導体パターン９２Ａの一端は絶縁体層９１Ｃの長手方向の側面まで引き出される。
絶縁体層９１Ｄの表面には、コイル用導体パターン９２Ｂが形成される。このコイル用導体パターン９２Ｂの一端は絶縁体層９１Ｄのスルーホール内の導体を介してコイル用導体パターン９２Ａの他端に接続される。
絶縁体層９１Ｅの表面には、コイル用導体パターン９２Ｃが形成される。このコイル用導体パターン９２Ｃの一端は絶縁体層９１Ｅのスルーホール内の導体を介してコイル用導体パターン９２Ｂの他端に接続される。コイル用導体パターン９２Ｃの他端は絶縁体層９１Ｅの長手方向の側面まで引き出される。この様にコイル用導体パターン９２Ａ、コイル用導体パターン９２Ｂ、コイル用導体パターン９２Ｃを螺旋状に接続することによりコイルが形成される。
この絶縁体層９１Ｅ上には絶縁体層９１Ｆが積層される。
この様に絶縁体層９１Ａ〜９１Ｆとコイル用導体パターン９２Ａ〜９２Ｃが積層された積層体は、底面と長手方向の側面が交差する角部に、その表面が露出する導電体９３Ａと導電体９３Ｂが形成される。導電体９３Ａと導電体９３Ｂは、積層体の底面に露出している部分の幅が積層体の底面の幅と同じになる様に形成される。この積層体には、図１０に示す様に、長手方向の側面に電極９４Ａと電極９４Ｂがそれぞれ形成される。電極９４Ａは導電体９３Ａに接続される。また、電極９４Ｂは導電体９３Ｂに接続される。
そして、コイルの一端を構成するコイル用導体パターン９２Ａの一端が電極９４Ａに、コイルの他端を構成するコイル用導体パターン９２Ｃの他端が電極９４Ｂにそれぞれ接続されることにより、コイルが電極９４Ａ、導電体９３Ａによって構成される端子と電極９４Ｂ、導電体９３Ｂによって構成される端子間に接続される。 FIG. 9 is an exploded perspective view showing a fifth embodiment of the multilayer electronic component of the present invention, and FIG. 10 is a perspective view showing the fifth embodiment of the multilayer electronic component of the present invention.
In the insulator layer 91A, conductors 93A and 93B having the same width as that of the insulator layer 91A are formed at both ends in the longitudinal direction.
The insulator layer 91B has a notch formed at the center of both end portions in the longitudinal direction, and a conductor is filled in the notch to form a conductor 93A and a conductor 93B. The surfaces of the conductors 93A and 93B are exposed on the front and back surfaces of the insulator layer 91B and the side surfaces in the longitudinal direction.
A coil conductor pattern 92A is formed on the surface of the insulating layer 91C. One end of the coil conductor pattern 92A is drawn to the side surface in the longitudinal direction of the insulating layer 91C.
A coil conductor pattern 92B is formed on the surface of the insulating layer 91D. One end of the coil conductor pattern 92B is connected to the other end of the coil conductor pattern 92A via a conductor in the through hole of the insulator layer 91D.
A coil conductor pattern 92C is formed on the surface of the insulator layer 91E. One end of the coil conductor pattern 92C is connected to the other end of the coil conductor pattern 92B through a conductor in the through hole of the insulator layer 91E. The other end of the coil conductor pattern 92C is drawn to the side surface in the longitudinal direction of the insulating layer 91E. Thus, a coil is formed by connecting the coil conductor pattern 92A, the coil conductor pattern 92B, and the coil conductor pattern 92C in a spiral shape.
An insulator layer 91F is stacked on the insulator layer 91E.
Thus, the laminated body in which the insulator layers 91A to 91F and the coil conductor patterns 92A to 92C are laminated has the conductors 93A and 93B whose surfaces are exposed at the corners where the bottom surfaces and the side surfaces in the longitudinal direction intersect. Is formed. The conductors 93A and 93B are formed so that the width of the portion exposed at the bottom surface of the stacked body is the same as the width of the bottom surface of the stacked body. In this laminate, as shown in FIG. 10, electrodes 94A and 94B are formed on the side surfaces in the longitudinal direction. The electrode 94A is connected to the conductor 93A. The electrode 94B is connected to the conductor 93B.
Then, one end of the coil conductor pattern 92A constituting one end of the coil is connected to the electrode 94A, and the other end of the coil conductor pattern 92C constituting the other end of the coil is connected to the electrode 94B. And a terminal constituted by the conductor 93A and the terminal constituted by the electrode 94B and the conductor 93B.

図１１は本発明の積層型電子部品の第６の実施例を示す斜視図である。
絶縁体層とコイル用導体パターンを図９の様に積層して積層体が形成され、積層体内にコイルが形成される。また、この積層体は、底面と長手方向の側面が交差する角部に、その表面が露出する導電体１１３Ａと導電体１１３Ｂが形成される。導電体１１３Ａと導電体１１３Ｂは、積層体の底面に露出している部分に積層体の底面の幅方向に幅を広げた部分が形成される。
この様に形成された積層体には、長手方向の側面に電極１１４Ａと電極１１４Ｂが形成される。電極１１４Ａと電極１１４Ｂはその幅が積層体の長手方向の側面の幅とほぼ等しくなる様に形成される。
そして、コイルの一端が電極１１４Ａに、コイルの他端が電極１１４Ｂにそれぞれ接続されることにより、コイルが電極１１４Ａ、導電体１１３Ａによって構成される端子と電極１１４Ｂ、導電体１１３Ｂによって構成される端子間に接続される。 FIG. 11 is a perspective view showing a sixth embodiment of the multilayer electronic component of the present invention.
The insulator layer and the coil conductor pattern are laminated as shown in FIG. 9 to form a laminate, and a coil is formed in the laminate. Further, in this laminated body, the conductor 113A and the conductor 113B whose surfaces are exposed are formed at the corners where the bottom surface and the side surface in the longitudinal direction intersect. In the conductor 113A and the conductor 113B, a portion whose width is increased in the width direction of the bottom surface of the multilayer body is formed in a portion exposed on the bottom surface of the multilayer body.
In the laminated body thus formed, the electrode 114A and the electrode 114B are formed on the side surface in the longitudinal direction. The electrodes 114A and 114B are formed so that the width thereof is substantially equal to the width of the side surface in the longitudinal direction of the laminate.
Then, one end of the coil is connected to the electrode 114A and the other end of the coil is connected to the electrode 114B, so that the coil is a terminal constituted by the electrode 114A and the conductor 113A, and a terminal constituted by the electrode 114B and the conductor 113B. Connected between.

図１２は本発明の積層型電子部品の第７の実施例を示す分解斜視図である。
絶縁体層１２１Ａには、長手方向の両端部に複数の切り欠きが形成され、この切り欠き内に導体が充填されて複数の導電体１２３Ａと複数の導電体１２３Ｂが形成される。複数の導電体１２３Ａ、１２３Ｂはそれぞれ絶縁体層１２１Ａの表裏面と長手方向の側面に露出する。
絶縁体層１２１Ｂの表面には、コイル用導体パターン１２２Ａが形成される。このコイル用導体パターン１２２Ａの一端は絶縁体層１２１Ｂの長手方向の側面まで引き出される。
絶縁体層１２１Ｃの表面には、コイル用導体パターン１２２Ｂが形成される。コイル用導体パターン１２２Ｂの一端はコイル用導体パターン１２２Ａの他端に接続される。
絶縁体層１２１Ｄの表面には、コイル用導体パターン１２２Ｃが形成される。コイル用導体パターン１２２Ｃの一端はコイル用導体パターン１２２Ｂの他端に接続される。コイル用導体パターン１２２Ｃの他端は絶縁体層１２１Ｄの長手方向の側面まで引き出される。この様にコイル用導体パターンを螺旋状に接続することによりコイルが形成される。
この絶縁体層１２１Ｄ上には絶縁体層１２１Ｅが積層される。
この様に絶縁体層とコイル用導体パターンが積層された積層体は、底面と長手方向の側面が交差する角部に、その表面が角部に沿って露出する導電体１２３Ａ、１２３Ｂが形成される。この積層体の底面には複数の導電体１２３Ａに接続される電極と複数の導電体１２３Ｂに接続される電極が形成される。また、積層体の長手方向の側面には複数の導電体１２３Ａに接続される電極と複数の導電体１２３Ｂに接続される電極が形成される。
そして、コイルの一端を構成するコイル用導体パターン１２２Ａの一端が導電体１２３Ａに接続された積層体の側面の電極に、コイルの他端を構成するコイル用導体パターン１２２Ｃの他端が導電体１２３Ｂに接続された積層体の側面の電極にそれぞれ接続されることにより、コイルが端子間に接続される。 FIG. 12 is an exploded perspective view showing a seventh embodiment of the multilayer electronic component of the present invention.
The insulator layer 121A has a plurality of cutouts at both ends in the longitudinal direction, and a conductor is filled in the cutouts to form a plurality of conductors 123A and a plurality of conductors 123B. The plurality of conductors 123A and 123B are exposed on the front and back surfaces of the insulator layer 121A and the side surfaces in the longitudinal direction, respectively.
A coil conductor pattern 122A is formed on the surface of the insulator layer 121B. One end of the coil conductor pattern 122A is drawn to the side surface in the longitudinal direction of the insulating layer 121B.
A coil conductor pattern 122B is formed on the surface of the insulator layer 121C. One end of the coil conductor pattern 122B is connected to the other end of the coil conductor pattern 122A.
A coil conductor pattern 122C is formed on the surface of the insulator layer 121D. One end of the coil conductor pattern 122C is connected to the other end of the coil conductor pattern 122B. The other end of the coil conductor pattern 122C is drawn to the side surface in the longitudinal direction of the insulating layer 121D. Thus, a coil is formed by connecting the coil conductor patterns in a spiral.
An insulator layer 121E is stacked on the insulator layer 121D.
In the laminated body in which the insulator layer and the coil conductor pattern are laminated in this manner, conductors 123A and 123B whose surfaces are exposed along the corners are formed at the corners where the bottom surface and the side surface in the longitudinal direction intersect. The An electrode connected to the plurality of conductors 123A and an electrode connected to the plurality of conductors 123B are formed on the bottom surface of the stacked body. In addition, electrodes connected to the plurality of conductors 123A and electrodes connected to the plurality of conductors 123B are formed on the side surfaces in the longitudinal direction of the stacked body.
The coil conductor pattern 122A constituting one end of the coil has one end connected to the electrode on the side surface of the laminate connected to the conductor 123A, and the other end of the coil conductor pattern 122C constituting the other end of the coil is the conductor 123B. The coil is connected between the terminals by being respectively connected to the electrodes on the side surfaces of the laminate connected to.

図１３は本発明の積層型電子部品の第８の実施例を示す分解斜視図である。
絶縁体層１３１Ａ、１３１Ｂには、長手方向の両端部に絶縁体層１３１Ａの幅と同じ幅の導電体１３３Ａと導電体１３３Ｂが形成される。
絶縁体層１３１Ｃの表面には、コイル用導体パターン１３２Ａが形成される。このコイル用導体パターン１３２Ａの一端は絶縁体層１３１Ｃの長手方向の側面まで引き出される。
絶縁体層１３１Ｄの表面には、コイル用導体パターン１３２Ｂが形成される。このコイル用導体パターン１３２Ｂの一端はコイル用導体パターン１３２Ａの他端に接続される。
絶縁体層１３１Ｅの表面には、コイル用導体パターン１３２Ｃが形成される。このコイル用導体パターン１３２Ｃの一端はコイル用導体パターン１３２Ｂの他端に接続される。コイル用導体パターン１３２Ｃの他端は絶縁体層１３１Ｅの長手方向の側面まで引き出される。この様にコイル用導体パターンを螺旋状に接続することによりコイルが形成される。
この絶縁体層１３１Ｅ上には絶縁体層１３１Ｆが積層される。
この様に絶縁体層とコイル用導体パターンが積層された積層体は、底面と長手方向の側面が交差する角部に、その表面が露出する導電体１３３Ａと導電体１３３Ｂが形成される。導電体９３Ａと導電体９３Ｂは、積層体の底面に露出している部分の幅が積層体の底面の幅と同じになる様に、積層体の側面に露出している部分の幅が積層体の側面の幅と同じになる様に形成される。この積層体には、長手方向の側面に電極がそれぞれ形成される。
そして、コイルの一端を構成するコイル用導体パターン１３２Ａの一端が導電体１３３Ａに接続された電極に、コイルの他端を構成するコイル用導体パターン１３２Ｃの他端が導電体１３３Ｂに接続された電極にそれぞれ接続されることにより、コイルが端子間に接続される。 FIG. 13 is an exploded perspective view showing an eighth embodiment of the multilayer electronic component of the present invention.
In the insulator layers 131A and 131B, conductors 133A and 133B having the same width as the insulator layer 131A are formed at both ends in the longitudinal direction.
A coil conductor pattern 132A is formed on the surface of the insulator layer 131C. One end of the coil conductor pattern 132A is drawn to the side surface in the longitudinal direction of the insulating layer 131C.
A coil conductor pattern 132B is formed on the surface of the insulator layer 131D. One end of the coil conductor pattern 132B is connected to the other end of the coil conductor pattern 132A.
A coil conductor pattern 132C is formed on the surface of the insulating layer 131E. One end of the coil conductor pattern 132C is connected to the other end of the coil conductor pattern 132B. The other end of the coil conductor pattern 132C is drawn to the side surface in the longitudinal direction of the insulator layer 131E. Thus, a coil is formed by connecting the coil conductor patterns in a spiral.
An insulator layer 131F is laminated on the insulator layer 131E.
In the laminated body in which the insulator layer and the coil conductor pattern are laminated in this way, conductors 133A and 133B whose surfaces are exposed are formed at corners where the bottom surface and the side surface in the longitudinal direction intersect. The conductor 93A and the conductor 93B have the width of the portion exposed on the side surface of the laminate such that the width of the portion exposed on the bottom surface of the laminate is the same as the width of the bottom surface of the laminate. It is formed to be the same as the width of the side surface. In this laminate, electrodes are formed on the side surfaces in the longitudinal direction.
Then, one end of the coil conductor pattern 132A constituting one end of the coil is connected to an electrode connected to the conductor 133A, and the other end of the coil conductor pattern 132C constituting the other end of the coil is connected to the conductor 133B. Are connected to each other, the coil is connected between the terminals.

以上、本発明の積層型電子部品の実施例を述べたが、本発明はこの実施例に限られるものではない。例えば、導電体を積層体の底面と幅方向の側面が交差する角部に露出させる様に形成してもよい。また、第１の実施例と第７の実施例において、長手方向の両端部に切り欠きが形成され、この切り欠き内に導体が充填されて導電体が形成された絶縁体層が複数積層されてもよい。   The embodiment of the multilayer electronic component of the present invention has been described above, but the present invention is not limited to this embodiment. For example, the conductor may be formed so as to be exposed at a corner where the bottom surface of the multilayer body and the side surface in the width direction intersect. Further, in the first and seventh embodiments, notches are formed at both ends in the longitudinal direction, and a plurality of insulator layers in which conductors are formed by filling the notches with conductors are laminated. May be.

１１Ａ〜１１Ｅ 絶縁体層
１２Ａ〜１２Ｃ 導体パターン 11A-11E Insulator layers 12A-12C Conductor pattern

Claims (3)

絶縁体層と導体パターンを積層し、積層体内に回路素子が形成され、該回路素子が該積層体の外表面に形成された端子に接続された積層型電子部品において、
該積層体の底面と側面が交差する角部に、その表面が該角部に露出する導電体を形成し、
該積層体の側面に該導電体と接続する電極を形成して端子としたことを特徴とする積層型電子部品。 In a laminated electronic component in which an insulating layer and a conductor pattern are laminated, a circuit element is formed in the laminated body, and the circuit element is connected to a terminal formed on the outer surface of the laminated body.
At the corner where the bottom and side surfaces of the laminate intersect, a conductor whose surface is exposed at the corner is formed,
A multilayer electronic component comprising a terminal formed by forming an electrode connected to the conductor on a side surface of the multilayer body. 絶縁体層と導体パターンを積層し、積層体内に回路素子が形成され、該回路素子が該積層体の外表面に形成された端子に接続された積層型電子部品において、
該積層体の底面と側面が交差する角部に、その表面が該角部に露出する導電体を形成し、
該積層体の側面と底面に該導電体と接続する電極をそれぞれ形成して端子としたことを特徴とする積層型電子部品。 In a laminated electronic component in which an insulating layer and a conductor pattern are laminated, a circuit element is formed in the laminated body, and the circuit element is connected to a terminal formed on the outer surface of the laminated body.
At the corner where the bottom and side surfaces of the laminate intersect, a conductor whose surface is exposed at the corner is formed,
A multilayer electronic component comprising: a terminal formed by forming electrodes connected to the conductor on the side and bottom surfaces of the multilayer body. 前記回路素子が前記積層体の側面に引き出され、前記積層体の側面に形成された前記電極に接続された請求項１又は請求項２に記載の積層型電子部品。   The multilayer electronic component according to claim 1, wherein the circuit element is drawn out to a side surface of the multilayer body and connected to the electrode formed on the side surface of the multilayer body.
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* Cited by examiner, † Cited by third party
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