JP2013065616A - Circuit module and circuit module manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit module by which a spacer can be easily aligned.SOLUTION: A circuit module 10 comprises a switching element 11, and a driver substrate 13 having a signal line 18 laminated on an upper face 10a of the switching element 11 via a spacer 12 and electrically connected to the switching element 11. A through hole 16 extending in a lamination direction is formed on the spacer 12, and the signal line 18 is electrically connected to the switching element 11 through the inside of the through hole 16. In this manner, in the circuit module 10, the signal line 18 is inserted in the through hole 16 of the spacer 12, and therefore, the spacer 12 can be aligned. For example, necessity for aligning the spacer 12 with a jig every time when sizes of the spacer 12 and the switching element 11 vary can be reduced.

Description

  The present invention relates to a circuit module and a circuit module manufacturing method.

  Conventionally, as a technique related to a circuit module, for example, a semiconductor device described in Patent Document 1 is known. In this semiconductor device, a semiconductor element such as a MOS transistor or a bipolar transistor is disposed in an active region of a semiconductor layer. Further, in this semiconductor device, a non-active region in which no semiconductor element is disposed is surrounded by the active region, and a heat radiation electrode is formed in the semiconductor layer through a contact hole on the non-active region. Thermal destruction due to self-heating is prevented.

JP 2008-182122 A

  By the way, as described above, in a circuit module, for example, if it has a structure with a built-in driver, it is desirable to install a circuit board in the immediate vicinity of an electronic component such as a switching element. Substrates may be stacked. In this case, since it is necessary to accurately align the spacer with the electronic component using a jig, whenever the size of the spacer or the electronic component changes, a jig corresponding to the size of the spacer or the like is required. The Therefore, it may be difficult to align the spacers.

  Then, this invention makes it a subject to provide the circuit module which can perform alignment of a spacer easily, and the manufacturing method of a circuit module.

  In order to solve the above-described problems, a circuit module according to the present invention includes an electronic component, and a circuit board that is laminated on the surface of the electronic component via a spacer and has a signal line that is electrically connected to the electronic component. The spacer is formed with a through hole extending along the stacking direction of the electronic component and the circuit board, and the signal line is electrically connected to the electronic component through the through hole. .

  In this circuit module, the position of the spacer can be adjusted by inserting a signal line through the through hole of the spacer. For example, even if the size of the spacer or electronic component changes, the spacer is aligned with a jig each time. The need to do so can be reduced. That is, the spacer can be easily aligned.

  The main surface of the circuit board on the electronic component side is provided with a connection portion containing a signal line so as to protrude toward the electronic component side. The connection portion is fitted in the through hole, and the electronic component It is preferable to be electrically connected to a signal pad provided on the surface. As a result, the connection portion is fitted in the through hole and electrically connected to the signal pad, so that the signal line can be electrically connected to the electronic component and the spacer can be aligned at the same time.

  The spacer is electrically connected to an electrode pad provided on the surface of the electronic component, and the spacer is preferably provided with a bus bar. As described above, when the spacer is electrically connected and mounted on the electrode pad of the electronic component, it is highly necessary to install the spacer in a predetermined place. It is particularly effective. For example, the bus bar provided in the spacer constitutes an output bus bar if it is an element of the upper arm, and constitutes an N bus bar if it is an element of the lower arm.

  Further, as a configuration that preferably exhibits the above-described effects, specifically, a configuration in which the electronic component is a semiconductor element, a substrate, or a bus bar can be given.

  In addition, another circuit board different from the circuit board is provided, and the electronic component is provided on one main surface of the other circuit board, and the other main surface side of the other circuit board includes the other circuit board. It is preferable that a cooling unit for cooling the circuit board is provided. Thereby, an electronic component can be suitably radiated and cooled.

  The circuit module manufacturing method according to the present invention includes an electronic component, a spacer having a through hole stacked on the electronic component and extending in the stacking direction, and stacked on the spacer and electrically connected to the electronic component. A circuit board having a signal line, and a manufacturing method for manufacturing a circuit module, wherein a circuit board is stacked on a surface of an electronic component through a spacer, and the signal line is passed through the through hole to the electronic component. And a connecting step for electrical connection.

  In this method of manufacturing a circuit module, for example, even if the size of the spacer or the electronic component changes, the necessity of aligning the spacer with a jig each time can be reduced. That is, the spacer can be easily aligned.

  At this time, the main surface of the circuit board on the electronic component side is provided with a connection portion containing the signal line so as to protrude toward the electronic component side. It is preferable to electrically connect to a signal pad provided on the surface of the component. As described above, by fitting the connecting portion in the through hole and electrically connecting the signal pad, the signal line can be electrically connected to the electronic component, and at the same time, the spacer can be aligned.

  According to the present invention, it is possible to easily align the spacers.

1 is a schematic exploded perspective view showing a circuit module according to an embodiment of the present invention. It is a partial cross section figure along the II-II line of FIG. It is a circuit diagram which shows an example of the circuit which the circuit module of FIG. 1 comprises. (A) is a schematic exploded perspective view which shows the switching element and spacer which concern on a modification, (b) is a schematic disassembled perspective view which shows the switching element and spacer which concern on another modification.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, the same reference numerals are used for the same or corresponding elements, and duplicate descriptions are omitted.

  1 is a schematic exploded perspective view showing a circuit module according to an embodiment of the present invention, FIG. 2 is a partial cross-sectional view taken along line II-II in FIG. 1, and FIG. 3 is configured by the circuit module in FIG. It is a circuit diagram which shows an example of a circuit. As shown in FIGS. 1 and 2, the circuit module 10 of the present embodiment is mounted on a vehicle such as an automobile, and constitutes, for example, a part of an inverter circuit or a converter circuit. The circuit module 10 here is premised on a structure with a built-in driver, and constitutes the circuit shown in FIG.

  The circuit module 10 includes a switching element (electronic component, semiconductor element) 11, a spacer 12, and a driver board (circuit board) 13, which are stacked in this order. The switching element 11 has a rectangular parallelepiped chip shape, and for example, an IGBT (Insulated Gate Bipolar Transistor) element is used. The switching element 11 includes a signal pad 14 provided in a central rectangular region on the upper surface (front surface) 11a, and an electrode pad 15 on the emitter side provided in a rectangular annular region around the signal pad 14 on the upper surface 11a. ,have.

  The spacer 12 has a rectangular parallelepiped outer shape, and is formed of, for example, a conductive material. The outer shape of the spacer 12 is formed to match the outer shape of the electrode pad 15 when viewed from the stacking direction (the vertical direction in the figure). The spacer 12 is formed with a through hole 16 extending in the stacking direction. In other words, the spacer 12 has a through-hole 16 that extends straight from the center of the upper surface 12a along the stacking direction and reaches the lower surface 12b. The through hole 16 has a rectangular cross section larger than the signal pad 14 when viewed from the stacking direction. A bus bar 17 protrudes from the side surface of the spacer 12. The bus bar 17 configures the output bus bar 4 when the circuit module 10 is an element of the upper arm 2, for example, and configures the N bus bar 5 when the circuit module 10 is an element of the lower arm 3, for example (see FIG. 3).

  The spacer 12 is laminated on the upper surface 11 a of the switching element 11 so that the lower surface 12 b thereof coincides with the electrode pad 15, and the signal pad 14 is exposed from the through hole 16. At this time, the lower surface 12 b of the spacer 12 is electrically connected to the electrode pad 15 via the solder 21 x, whereby the spacer 12 is fixed to the switching element 11.

  The driver board 13 has a rectangular plate shape and has a plurality (here, four) of signal lines 18. The signal line 18 is for transmitting a gate drive signal, for example, and is provided on the upper surface 13a of the driver substrate 13 so as to extend toward the center. In addition, a connecting portion 19 as a protruding portion (protruding structure) in which the signal line 18 is incorporated is provided at the center of the lower surface (main surface on the switching element 11 side) 13 b of the driver substrate 13. The main surface of the driver substrate 13 is a surface whose normal direction is the direction along the thickness direction of the driver substrate 13 and is a surface that intersects (orthogonally) the side surface along the thickness direction.

  The connecting portion 19 has an outer shape corresponding to the through hole 16 of the spacer 12. The connecting portion 19 here has a rectangular outer shape that is substantially equal to the through-hole 16 when viewed from the stacking direction so as to be fitted and held in the through-hole 16. Further, the connecting portion 19 protrudes downward by the same degree as the vertical thickness of the spacer 12. As a result, the signal line 18 extends downward in the connection portion 19.

  The driver board 13 has a connecting portion 19 inserted into the through hole 16 of the spacer 12 and is fitted on the upper surface 12 a of the spacer 12. The tip of the connecting portion 19 is electrically connected to the signal pad 14, and the signal line 18 is electrically connected to the switching element 11.

  The circuit module 10 includes a circuit board 20 (another circuit board). The circuit board 20 is electrically connected and fixed to the lower surface 11b as the collector side of the switching element 11 via the solder 21y. That is, the switching element 11 is provided on the upper surface (one main surface) 20 a of the circuit board 20. The circuit board 20 constitutes a so-called thermal mass in the circuit module 10, and for example, a ceramic substrate such as a DBC substrate or a DBA substrate is used. A cooling unit 22 for cooling the circuit board 20 is connected to the lower surface (the other main surface) 20b of the circuit board 20 via an electrical insulator. The main surface of the circuit board 20 is a surface whose normal direction is the direction along the thickness direction of the circuit board 2 and is a surface that intersects (orthogonally) the side surface along the thickness direction.

  Further, a bus bar 23 projects from the side surface of the circuit board 20. The bus bar 23 constitutes the P bus bar 6 when the circuit module 10 is an element of the upper arm 2, for example, and constitutes the output bus bar 4 when the circuit module 10 is an element of the lower arm 3, for example (see FIG. 3).

  In manufacturing such a circuit module 10, when the driver substrate 13 is installed on the switching element 11 via the spacer 12, first, the through hole 16 of the spacer 12 is positioned on the signal pad 14. After aligning the position of the spacer 12 (so that the signal pad 14 is exposed in the through hole 16), the spacer 12 is joined to the electrode pad 15 on the upper surface 11a of the switching element 11 via the solder 21x.

  At the same time, the connecting portion 19 of the driver board 13 is inserted into the through hole 16 of the spacer 12 and fitted, and the driver board 13 is attached to the spacer 12. In this state, the connecting portion 19 is joined to the signal pad 14 by reflow. As described above, the switching element 11, the spacer 12, and the driver substrate 13 are electrically connected and fixed while being aligned with each other.

  By the way, conventionally, when the spacer 12 is mounted on the switching element 11 (especially on the electrode pad 15), it is necessary to install the spacer 12 at a predetermined position without any deviation. Therefore, a dedicated jig for alignment is usually used. It needs to be adjusted. Therefore, for example, in a combination in which the size of the switching element 11 changes such as a difference between running (inverter) and step-up (converter) or a difference between small capacity, medium capacity, and large capacity, the size of the switching element 11 or the spacer 12 is Because of the various differences, it is necessary to prepare a jig separately for alignment.

  On the other hand, in this embodiment, as described above, the position of the spacer 12 is adjusted by inserting the connecting portion 19 in which the signal line 18 is built into the through hole 16 of the spacer 12. Therefore, it is possible to reduce the necessity of aligning the spacer 12 with a jig, and it is possible to easily align the spacer 12. As a result, for example, in the circuit module 10, it is possible to suitably prevent the positional deviation among the switching element 11, the spacer 12, and the driver substrate 13. In addition, since the alignment can be easily performed only by providing the through hole 16 in the spacer 12, the configuration of the spacer 12 can be simplified.

  Further, according to the prior art, the alignment (positioning) is generally performed twice when the signal line 18 of the driver board 13 is joined and when the jig is installed. For example, after the position of the switching element 11 is determined and bonded first, the spacer 12 is positioned using the recognition mark of the switching element 11. Separately, alignment for connecting the signal line 18 is performed once again using the recognition mark on the switching element 11.

  On the other hand, in the present embodiment, as described above, the signal line 18 and the switching element 11 are electrically connected at the same time by fitting the connection portion 19 in the through hole 16 and electrically connecting to the signal pad 14. The spacer 12 can be aligned (the spacer 12 arrives at a predetermined position on the switching element 11). That is, the alignment of the signal line 18 and the spacer 12 can be performed simultaneously by only one alignment.

  FIG. 4 is a schematic exploded perspective view showing a switching element and a spacer according to a modification. As illustrated in FIG. 4, even if the sizes of the switching element 11 and the spacer 12 are changed, the size of the signal pad 14 is not changed. Therefore, in this embodiment, the size of the connection part 19 does not change, and consequently the size of the through hole 16 does not change. That is, in this embodiment, versatility in alignment can be improved.

  As a result, as described above, when the size of the switching element 11 is changed, the spacer 12 is changed and the jig is changed. In the present embodiment, the through hole 16 is changed even if the size of the spacer 12 is changed. Since the connection portion 19 of the driver board 13 is not changed and the size of the driver board 13 is not changed, only one (one type) connection portion 19 can be used.

  In the present embodiment, as described above, the spacer 12 is electrically connected to the electrode pad 15 of the switching element 11, and the bus bar 17 is provided on the spacer 12. When the spacer 12 is electrically connected and mounted on the electrode pad 15 of the switching element 11 as described above, it is highly necessary to install the spacer 12 at a predetermined location, and therefore the spacer 12 is easily aligned. The above effect is particularly effective. The bus bar 17 provided on the spacer 12 can constitute an output bus bar if it is an element of the upper arm, and can constitute an N bus bar if it is an element of the lower arm.

  In the present embodiment, as described above, the switching element 11 is provided on the upper surface 20 a of the circuit board 20, and the cooling unit 22 is provided on the lower surface 20 b side of the circuit board 20. In this case, in addition to the above-described effect of easily aligning the spacer 12, the effect of suitably radiating and cooling the switching element 11 is exhibited.

  When the driver board 13 is installed in the immediate vicinity of the switching element 11, the driver board 13 is installed on the upper side of the switching element 11. A configuration is required. In this regard, in the present embodiment, the signal line 18 can be joined to the switching element 11 by the connecting portion 19 on the lower surface 13 b of the driver substrate 13.

  Incidentally, when the switching element 11 and the driver substrate 13 are connected, if a current path such as a tape bond or a wire bond is used, it is necessary to avoid the central portion of the upper surface 11 a of the switching element 11. Therefore, for the switching element 11 in which the signal pad 14 is centrally arranged on the upper surface 11a, the current path of the present embodiment by the spacer 12 and the bus bar 17 is preferable to the current path by tape bonding or wire bonding.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments. The present invention can be modified without departing from the scope described in the claims or applied to other embodiments. May be.

  For example, although the said embodiment is provided with the switching element 11 as an electronic component, it is not limited to this. The electronic component may be, for example, another semiconductor element, a substrate such as a circuit board, or a bus bar.

  Moreover, in the said embodiment, seeing from the lamination direction, the through-hole 16 is made into the rectangular cross section, and the connection part 19 is made into the rectangular external shape. The shapes of the through hole 16 and the connecting portion 19 are not limited. For example, when a circular outer shape or a polygonal outer shape connection portion 19 is fitted to the through hole 16 having a circular cross section, or a circular outer shape or a polygon outer shape is connected to the through hole 16 having a polygonal cross section. The part 19 may be fitted.

  Moreover, in the said embodiment, although the upper surface 20a of the circuit board 20 was made into one main surface and the lower surface 20b was made into the other main surface, it is good also considering the lower surface 20b as one main surface and making the upper surface 20a into the other main surface. .

  DESCRIPTION OF SYMBOLS 10 ... Circuit module, 11 ... Switching element (electronic component, semiconductor element), 11a ... Surface, 12 ... Spacer, 13 ... Driver board | substrate (circuit board), 13b ... Bottom surface (main surface by the side of the electronic component of a circuit board), 14 Signal pad, 15 Electrode pad, 16 Through-hole, 17 Bus bar, 18 Signal line, 19 Connection, 20 Circuit board (other circuit board), 20a Upper surface (one main surface), 20b ... lower surface (the other main surface), 22 ... cooling part.

Claims (7)

Electronic components,
A circuit board having a signal line laminated on the surface of the electronic component via a spacer and electrically connected to the electronic component;
The spacer is formed with a through hole extending along the stacking direction of the electronic component and the circuit board,
The circuit module, wherein the signal line is electrically connected to the electronic component through the through hole. The main surface of the circuit board on the electronic component side is provided with a connection portion containing the signal line so as to protrude to the electronic component side,
The circuit module according to claim 1, wherein the connection portion is fitted in the through hole and is electrically connected to a signal pad provided on the surface of the electronic component. The spacer is electrically connected to an electrode pad provided on the surface of the electronic component,
The circuit module according to claim 1, wherein the spacer is provided with a bus bar.   The circuit module according to claim 1, wherein the electronic component is a semiconductor element, a substrate, or a bus bar. A circuit board other than the circuit board is provided,
The electronic component is provided on one main surface of the other circuit board,
The circuit module according to any one of claims 1 to 4, wherein a cooling section for cooling the other circuit board is provided on the other main surface side of the other circuit board. . An electronic component; a spacer having a through hole stacked on the electronic component and extending in a stacking direction; and a circuit board having a signal line stacked on the spacer and electrically connected to the electronic component. A manufacturing method for manufacturing a circuit module comprising:
A laminating step of laminating the circuit board on the surface of the electronic component via the spacer;
And a connection step of electrically connecting the signal line to the electronic component through the through hole. The main surface of the circuit board on the electronic component side is provided with a connection portion containing the signal line so as to protrude to the electronic component side,
The circuit module manufacturing method according to claim 6, wherein, in the connecting step, the connecting portion is fitted into the through hole and electrically connected to a signal pad provided on the surface of the electronic component.

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