JP2013061280A - X-ray inspection device, control method of x-ray inspection device, program for controlling x-ray inspection device, and computer readable recording medium having the program stored therein - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an X-ray inspection device that prevents a reduction in inspection accuracy and inspection speed.SOLUTION: A processing for an X-ray inspection device to recognize an artifact includes: a step for obtaining a tomographic image S1 from a reconstructed image in an imaging condition 1 (S510); a step for obtaining a tomographic image S2 from a reconstructed image in an imaging condition 2 (S520); a step for calculating a difference between the tomographic images (S1-S2) (S530); and a step for determining the absolute value of the difference equal to or more than a threshold to be an artifact (S540).

Description

  The present invention relates to control of an X-ray inspection apparatus, and more particularly to a technique for improving the accuracy of X-ray inspection.

  In an image captured with X-rays (perspective image), the degree of absorption of X-rays (absorption coefficient) can be obtained as an image. The distribution of the absorption coefficient of interest can be obtained as two-dimensional or three-dimensional data (hereinafter simply referred to as “reconstructed image”) by reconstruction processing using a plurality of fluoroscopic images, and the absorption coefficient distribution in a two-dimensional space. An image obtained from the above is particularly referred to as a “tomographic image”. Artifacts occur as noise peculiar to the reconstructed image. Artifact is a phenomenon that appears as if an object is present at a position where no object actually exists, and hinders pass / fail judgment and calculation of a tomographic position in an inspection. In order to achieve the inspection speed necessary for in-line automatic inspection, it is necessary to reduce the number of images to be captured and shorten the imaging time. However, if the number of captured images is reduced, artifacts may be mixed into the image, and inspection accuracy may be reduced.

  In order to reduce artifacts, for example, Japanese Unexamined Patent Application Publication No. 2010-99303 (Patent Document 1) discloses a technique for extracting metal accurate shapes to reduce metal artifacts ([Summary] [Problems] ]reference). Specifically, “The X-ray CT apparatus transmits X-ray irradiation apparatus 1 that irradiates the subject with X-rays while rotating around the subject, and transmitted through the subject while rotating around the subject. An X-ray imaging device 2 that detects X-rays and an image processing device 4 that processes an image obtained from the X-ray imaging device 2 to obtain three-dimensional voxel data of the subject. A two-dimensional projection image is acquired from the X-ray imaging device 2 for each rotation angle of the beam irradiation device 1 and the X-ray imaging device 2, the projection image is binarized, and the binarized projection image is converted for each rotation angle. In this case, the backprojection voxel data is generated by three-dimensional backprojection by simple backprojection to a three-dimensional space on the calculation "(see [Solution] in [Summary]). .

JP 2010-99303 A

  According to the technique disclosed in Patent Document 1, back projection processing and projection processing are performed, image processing is performed on the image after the projection processing, back projection is performed again, an image obtained by back projection, and the original The reconstructed image is synthesized.

  However, according to the technique disclosed in Patent Document 1, since the back projection process is performed, a time longer than the time required for the normal reconstruction process is required, so the inspection speed is reduced. For this reason, for example, an X-ray inspection using such a technique may not be applied to an inspection requiring speed, such as an in-line inspection.

  Therefore, there is a need to quickly recognize artifacts. The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an X-ray inspection apparatus in which the inspection accuracy is improved without reducing the inspection speed. An object according to another aspect is to provide a control method of an X-ray inspection apparatus so that inspection accuracy is improved without reducing inspection speed. An object according to another aspect is to provide a program for controlling the X-ray inspection apparatus so that the inspection accuracy is improved without reducing the inspection speed. Still another object of the present invention is to provide a computer-readable recording medium storing a program for controlling an X-ray inspection apparatus so that inspection accuracy is improved without reducing inspection speed.

  According to an embodiment, an X-ray inspection apparatus is provided for performing an image reconstruction process on an inspection target region by receiving X-rays transmitted through the inspection target region of an object with a plurality of detection surfaces. The This X-ray inspection apparatus includes an object moving mechanism for moving the position of an object in the X-ray inspection apparatus, an X-ray source for irradiating the object with X-rays, and an X-ray transmitted through the inspection target region. An X-ray detector for picking up an image, a detector moving mechanism for moving the X-ray detector, and a control means for controlling the operation of the X-ray inspection apparatus. The control means provides a target obtained by reconstructing an X-ray image received by each detection surface based on each projection image obtained by imaging a target according to each of a plurality of imaging conditions using X-rays. Artifact recognition means for recognizing artifacts from the reconstructed image of the object, and specific information acquisition means for acquiring information for specifying the artifacts recognized by the artifact recognition means.

  Preferably, the control means obtains an inspection image from which recognized artifacts are removed from a projection image obtained by X-ray imaging of an object of the same type as the object based on information for specifying Inspection image acquisition means for performing the operation.

  Preferably, the artifact recognizing unit reconstructs the first image of the object from a plurality of images obtained by imaging the object a plurality of times according to the first imaging condition among the plurality of imaging conditions. Reconstructing a second image of an object from a plurality of images obtained by imaging the object a plurality of times in accordance with a first reconstruction means and a second imaging condition among the plurality of imaging conditions Second reconstruction means, and extraction means for extracting artifacts based on the first image and the second image.

  Preferably, the X-ray inspection apparatus further includes display means for displaying a reconstructed image including the recognized artifact.

  Preferably, the X-ray inspection apparatus has an input unit for receiving an input of an imaging condition different from the imaging condition from which the reconstructed image including the recognized artifact is obtained, and a memory for storing the input different imaging condition Means. The control means includes inspection means for controlling the X-ray source, the X-ray detector, the object moving mechanism, and the detector moving mechanism so as to image the object using different imaging conditions.

  Preferably, the display unit displays the recognized artifact and the normal image corresponding to the part constituting the target object in a distinguishable manner.

  Preferably, the information for specifying includes any one of position information in the reconstructed image of the recognized artifact, a threshold value of luminance for determining the quality of the object, and an imaging condition in which the artifact is not recognized.

  According to another embodiment, the control of the X-ray inspection apparatus for executing the image reconstruction processing of the inspection target region by receiving X-rays transmitted through the inspection target region of the target object with a plurality of detection surfaces A method is provided. The X-ray inspection apparatus includes an object moving mechanism for moving the position of the object in the X-ray inspection apparatus, an X-ray source for irradiating the object with X-rays, and X-rays transmitted through the inspection target region. An X-ray detector for imaging and a detector moving mechanism for moving the X-ray detector are provided. In the control method, the X-ray inspection apparatus reconstructs an X-ray image received by each detection surface based on each projection image obtained by imaging an object according to each of a plurality of imaging conditions using X-rays. The step of recognizing the artifact from the reconstructed image of the object obtained by doing the above, and the step of the X-ray inspection apparatus acquiring information for identifying the recognized artifact.

  Preferably, the control method removes recognized artifacts from a projection image obtained by X-ray imaging of an object of the same type as the object based on information for specifying by the X-ray inspection apparatus. The method further includes the step of obtaining the inspection image.

  Preferably, the step of recognizing the artifact reconstructs the first image of the object from a plurality of images obtained by imaging the object a plurality of times according to the first imaging condition among the plurality of imaging conditions. A step, a step of reconstructing a second image of the object from a plurality of images obtained by imaging the object a plurality of times according to a second imaging condition of the plurality of imaging conditions, and the first image And extracting an artifact based on the second image.

  Preferably, the control method of the X-ray examination apparatus further includes a step of displaying a reconstructed image including the recognized artifact.

  Preferably, the control method includes a step in which the X-ray inspection apparatus receives an input of an imaging condition different from the imaging condition from which the reconstructed image including the recognized artifact is obtained, and the X-ray inspection apparatus receives the different imaging The step of storing the conditions and the X-ray inspection apparatus control the X-ray source, the X-ray detector, the object moving mechanism, and the detector moving mechanism so that the object is imaged using different imaging conditions. A step.

  Preferably, the step of displaying includes the step of displaying the recognized artifact and the normal image corresponding to the part constituting the object in a distinguishable manner.

  Preferably, the information for specifying includes any one of position information in the reconstructed image of the recognized artifact, a threshold value of luminance for determining the quality of the object, and an imaging condition in which the artifact is not recognized.

  According to another embodiment, an X-ray inspection apparatus for performing an image reconstruction process of an inspection target region is controlled by receiving X-rays transmitted through the inspection target region of the object with a plurality of detection surfaces. A program for doing this is provided. The X-ray inspection apparatus includes an object moving mechanism for moving the position of the object in the X-ray inspection apparatus, an X-ray source for irradiating the object with X-rays, and X-rays transmitted through the inspection target region. An X-ray detector for imaging and a detector moving mechanism for moving the X-ray detector are provided. The program reconstructs an X-ray image received by each detection surface based on each projection image obtained by imaging an object in accordance with each of a plurality of imaging conditions using X-rays in the X-ray inspection apparatus. The step of recognizing the artifact and the step of acquiring information for specifying the recognized artifact are executed from the reconstructed image of the object obtained by the above.

  Preferably, the program removes recognized artifacts from a projection image obtained by X-ray imaging an object of the same type as the object based on information for specifying the X-ray inspection apparatus. The step of acquiring the inspection image is further executed.

  Preferably, the step of recognizing the artifact reconstructs the first image of the object from a plurality of images obtained by imaging the object a plurality of times according to the first imaging condition among the plurality of imaging conditions. A step, a step of reconstructing a second image of the object from a plurality of images obtained by imaging the object a plurality of times according to a second imaging condition of the plurality of imaging conditions, and the first image And extracting an artifact based on the second image.

  Preferably, the program further causes the X-ray examination apparatus to execute a step of displaying a reconstructed image including the recognized artifact.

  Preferably, the program receives, in the X-ray inspection apparatus, an input of an imaging condition different from the imaging condition from which the reconstructed image including the recognized artifact is obtained, and a step of storing the input different imaging condition; The step of controlling the X-ray source, the X-ray detector, the object moving mechanism, and the detector moving mechanism is further executed so as to image the object using different imaging conditions.

  Preferably, the step of displaying includes the step of displaying the recognized artifact and the normal image corresponding to the part constituting the object in a distinguishable manner.

  Preferably, the information for specifying includes any one of position information in the reconstructed image of the recognized artifact, a threshold value of luminance for determining the quality of the object, and an imaging condition in which the artifact is not recognized.

  According to still another embodiment, a computer-readable recording medium storing any of the programs described above is provided.

  In an X-ray inspection according to a certain aspect, artifacts are recognized in advance from an image to be inspected at the stage of teaching prior to the inspection. In the inspection stage, an object is inspected after recognizing artifacts by imaging under higher-speed imaging conditions. Thereby, the inspection accuracy can be improved without reducing the inspection speed.

  The above and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the present invention taken in conjunction with the accompanying drawings.

2 is a block diagram showing a hardware configuration of an X-ray inspection apparatus 100. FIG. It is a figure showing the principle which an artifact generate | occur | produces when carrying out X-ray inspection of the workpiece | work 20. FIG. It is a flowchart showing the process for recognizing an artifact when the X-ray inspection apparatus 100 which concerns on this Embodiment images the workpiece | work 20 on two conditions. It is a flowchart showing the process performed when the workpiece | work 20 is imaged previously according to N imaging conditions in order to recognize an artifact. It is a flowchart showing the detail of the process which recognizes an artifact. It is a figure showing the case where an artifact is recognized by comparing the image obtained by reconstructing from a different number of projection (projection) images. It is a figure showing the state which derived | led-out the difference of the tomographic image in order to recognize an artifact. It is a figure showing the aspect which compares edge strength in order to recognize an artifact. It is a figure showing the state where the image of the regular pattern corresponding to the structure of a test subject and the artifact are mixed in the image obtained by X-ray imaging. It is a figure showing the setting of the binarization threshold value set about the case where the image acquired by X-ray imaging includes the artifact and the case where it does not include. It is a figure showing the threshold value set according to each of the presence or absence of an artifact. It is a figure showing the imaging condition information added according to the presence or absence of an artifact. It is a flowchart showing the process in the case of changing the imaging number. It is a flowchart showing the process which the X-ray inspection apparatus 100 performs when changing an irradiation angle and imaging. It is a figure showing the positional relationship of the artifact and inspection object which generate | occur | produce when an irradiation angle is 45 degree | times. It is a figure showing the positional relationship of the artifact and inspection object which generate | occur | produce when an irradiation angle is 30 degree | times. It is a flowchart showing a part of process performed when the X-ray inspection apparatus 100 changes an imaging position (azimuth angle). 2 is a diagram illustrating the concept of azimuth angle in X-ray inspection apparatus 100. FIG. It is a figure showing the image acquired when the azimuth | direction angle is 0 degree | times. It is a figure showing the image acquired when the azimuth | direction angle is 45 degree | times. It is a flowchart showing a part of a series of processes which X-ray inspection apparatus 100 which has a display function of a window performs. It is a figure showing the aspect of the confirmation and correction of the window displayed by the X-ray inspection apparatus. It is a figure showing the aspect of the display in case the X-ray inspection apparatus 100 displays a window. It is a figure showing the initial state which X-ray inspection apparatus 100 displayed the window. It is a figure showing the state by which the pasting of the window was corrected. FIG. 11 is a block diagram showing a hardware configuration of a computer system 2600.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same parts are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed description thereof will not be repeated.

[Hardware configuration]
With reference to FIG. 1, the structure of the X-ray inspection apparatus 100 which concerns on embodiment of this invention is demonstrated. FIG. 1 is a block diagram illustrating a hardware configuration of the X-ray inspection apparatus 100.

  The X-ray inspection apparatus 100 includes a control device 110, an X-ray source 10, a stage 18, a displacement meter 19, an X-ray detector 23, an orthogonal type biaxial robot arm 22.1, and a detector support. A unit 22.2, a detector control mechanism 60, an image acquisition mechanism 61, a displacement meter control mechanism 62, a stage control mechanism 63, and an X-ray source control mechanism 64;

  The control device 110 includes a calculation unit 70, a main storage unit 80, an auxiliary storage unit 81, an input unit 40, and an output unit 50. On the stage 18, a work 20 to be inspected is arranged.

  As a scanning X-ray source, the X-ray source 10 outputs X-rays with an axis passing through the X-ray focal point as a central axis. The X-ray source 10 is controlled by an X-ray source control mechanism 64. The X-ray source control mechanism 64 controls the output of the electron beam. Specifically, the X-ray source control mechanism 64 receives designation of an X-ray focal position and X-ray energy (tube voltage, tube current) from the calculation unit 70. The X-ray energy varies depending on the configuration of the workpiece 20.

  The workpiece 20 is carried into the stage 18. The stage 18 is configured as an XYZ stage, for example, and can be moved to an arbitrary position. The stage 18 moves, for example, according to a circular or linear trajectory. In another aspect, the stage 18 may be configured to place the workpiece 20 at a position for inspection by moving in one direction like a belt conveyor.

  The displacement meter 19 measures the distance to the upper surface of the workpiece 20. The measured distance data is input to the displacement meter control mechanism 62.

  The robot arm 22.1 and the detector support unit 22.2 move the X-ray detector 23 to a designated position based on a signal from the detector control mechanism 60 as an X-ray detector driving unit. For example, the robot arm 22.1 and the detector support unit 22.2 are configured as an XYθ operation mechanism that can drive the X-ray detector 23 with XYθ degrees of freedom.

  Note that the configuration for driving the X-ray detector 23 is not limited to the above configuration, and is a configuration that enables movement in the XY direction or θ rotation in the XY plane. Any device having the same function as the movement of 23 may be used.

  Further, the detector control mechanism 60 sends the position information of the X-ray detector 23 at that time to the calculation unit 70.

  The X-ray detector 23 is a two-dimensional X-ray detector that detects and images X-rays output from the X-ray source 10 and transmitted through the workpiece 20. For example, the X-ray detector 23 is a CCD (Charge Coupled Device) camera, I.D. It is an I (Image Intensifier) tube and a space-efficient FPD (Flat Panel Detector). The X-ray detector 23 is desirably highly sensitive so that it can be used for in-line inspection, and may be a direct conversion type FPD using CdTe.

  The input unit 40 receives an instruction input from the user of the X-ray inspection apparatus 100. The input unit 40 is realized by, for example, a keyboard, a mouse, a touch panel, a wireless communication interface, or the like used in a known computer system.

  The output unit 50 outputs the input inspection conditions, inspection results, and the like to the outside. The output unit 50 is realized, for example, as a monitor device that displays an X-ray image or the like configured by the calculation unit 70. In another aspect, the output unit 50 is realized as an interface that outputs an image signal.

  The detector control mechanism 60 controls the position and operation of the X-ray detector 23 according to a command from the calculation unit 70. Specifically, the detector control mechanism 60 transmits a signal for moving the X-ray detector 23 to a designated position to the robot arm 22.1 and the detector support unit 22.2.

  The image acquisition mechanism 61 controls acquisition of image data from the X-ray detector 23. Specifically, the image acquisition mechanism 61 detects X-rays according to a command from the calculation unit 70 and acquires a projection image.

  Based on the output from the displacement meter 19, the displacement meter control mechanism 62 adjusts the height of the reference plane of the workpiece 20 during X-ray fluoroscopic imaging.

  The stage control mechanism 63 moves the stage 18 to a position designated for X-ray imaging based on a command from the calculation unit 70.

  The X-ray source control mechanism 64 controls the X-ray irradiation direction, irradiation angle, and intensity of the X-ray source 10.

  The calculation unit 70 controls the operation of each unit based on a program (not shown) stored in the main storage unit 80, shooting conditions, and other control data, and executes predetermined calculation processing.

  The main storage unit 80 is a recording medium that can hold data and programs in a nonvolatile manner, and is realized by, for example, a hard disk device, a flash memory, or the like.

  The auxiliary storage unit 81 is a recording medium that can temporarily hold data and programs, and is realized by, for example, a RAM (Random Access Memory).

  In one aspect, the arithmetic unit 70 reconstructs an X-ray image received by each detection surface based on each projection image obtained by imaging an object according to each of a plurality of imaging conditions using X-rays. Artifacts are recognized from the reconstructed image of the object obtained by this. The calculation unit obtains information for specifying the recognized artifact.

  In another aspect, the image acquisition mechanism 61 performs an inspection in which recognized artifacts are removed from a projection image obtained by X-ray imaging of an object of the same type as the object based on information for specifying. Acquire images.

  In another aspect, the computing unit serves as the first reconstruction unit from a plurality of images obtained by imaging the object a plurality of times according to the first imaging condition among the plurality of imaging conditions. The second image of the object is reconstructed from a plurality of images obtained by reconstructing one image and imaging the object a plurality of times according to the second imaging condition among the plurality of imaging conditions as a second reconstruction unit. Are reconstructed, and artifacts are extracted based on the first image and the second image.

  In another aspect, the output unit 50 is realized as a monitor device and displays a reconstructed image including the recognized artifact.

  In one aspect, the monitor device displays the recognized artifact and a normal image corresponding to a part constituting the target object in a distinguishable manner.

  Here, the information for specifying is, for example, any one of position information in the reconstructed image of the recognized artifact, a luminance threshold value for determining the quality of the object, and an imaging condition in which the artifact is not recognized, Alternatively, a combination of two or more may be used.

[Principle of artifact generation]
With reference to FIG. 2, the principle of artifact generation in the X-ray examination will be described. FIG. 2 is a diagram showing the principle that artifacts occur when X-ray inspection is performed on the workpiece 20.

  Since the X-ray inspection apparatus 100 according to the present embodiment obtains a reconstructed image of the workpiece 20 using a plurality of X-ray captured images, the X-ray detector 23, the workpiece 20, and the X-ray source 10 are relatively The actual position changes sequentially. In FIG. 2, in order to explain the principle of artifact generation, it is assumed that the relative positions of the X-ray detector 23 and the X-ray source 10 change with the position of the workpiece 20 as the center.

  In one aspect, the positional relationship among the X-ray source 10, the workpiece 20, and the X-ray detector 23 is defined as, for example, the X-ray focal position 220, the workpiece 20, and the position 250 of the X-ray detector 23. . At this time, the X-rays emitted from the X-ray source 10 are output from the X-ray focal position 220, pass through the workpiece 20 in the reconstruction range 240, and are detected by the X-ray detector 23 at the position 250. At this time, for example, artifacts 210, 211, 212, 213, 214, and 215 can be detected by the X-ray detector 23 in addition to the images corresponding to the inspection objects 230, 231, and 232 included in the workpiece 20.

  In another aspect, when the X-ray source 10 is located at the X-ray focal position 221, the X-ray irradiated from the X-ray source 10 passes through the workpiece 20 and is at the position 251. 23 receives light. Also in this case, the artifacts 210, 211, 212, 213, 214, and 215 can be recognized by the X-ray detector 23 in addition to the inspection objects 230, 231, and 232 due to the presence of the substrates 161 and 260.

[Technology]
The technical idea in the present embodiment is as follows. First, at the stage of teaching (so-called teaching), X-ray imaging is performed under a plurality of imaging conditions in order to recognize artifacts. Here, the imaging conditions include the number of images to be captured, X-ray exposure time, imaging angle (projection angle, azimuth angle), tube current, and tube voltage. Artifact recognition is realized by, for example, image differences, edge strength comparisons, comparisons of regions and pattern shapes included in images, and the like.

  Thereafter, by changing the imaging condition in which the artifact is recognized, the inspection condition used in the actual inspection stage is changed. The change in the imaging condition includes, for example, a change in the number of images to be taken, a change in the X-ray exposure time, a change in the imaging angle (projection angle and azimuth), a change in tube current value, a change in tube voltage value, and the like. Changes in inspection conditions include selection of inspection range or tomography, change of pass / fail judgment threshold of the inspection object, change of image processing contents during pass / fail judgment, and reconstruction for obtaining a three-dimensional image from a fluoroscopic image Including algorithm change, resolution change in reconstruction, imaging condition change, and the like.

  More specifically, in the workpiece 20 such as a semiconductor substrate, artifacts occur depending on the state of the back surface of the substrate and the presence or absence of a heat sink. Therefore, before the in-line inspection is performed, the X-ray inspection apparatus 100 recognizes artifacts in advance, and imaging conditions under which the reconstructed image obtained when the recognized artifact position information, luminance, and artifacts are recognized are obtained. Is identified. Thereafter, when an in-line inspection of the mass-produced product of the workpiece 20 is performed, a reconstructed image is acquired from the projection image in consideration of position information, brightness, and imaging conditions specified in advance, and an X-ray inspection is executed.

  This makes it easy to obtain a projection image that does not include artifacts (noise images), thereby improving inspection accuracy and eliminating the need for processing to remove artifacts again, thereby preventing a decrease in inspection speed. .

  In addition, it is generally difficult to set imaging conditions that are necessary and sufficient for inspection and have a short inspection time (small number of images), but refer to the imaging conditions under which a projection image having recognized artifacts was obtained. By setting the imaging conditions in this manner, it is possible to determine the imaging conditions necessary and sufficient to obtain a projection image that does not include artifacts. Thereby, prolongation of the inspection time is prevented, and the labor of the user of the X-ray inspection apparatus 100 is reduced.

[Artifact recognition]
Next, artifact recognition processing will be described with reference to FIGS. FIG. 3 is a flowchart showing a process for recognizing an artifact when the X-ray inspection apparatus 100 according to the present embodiment images the workpiece 20 under two conditions.

  In step S310, the X-ray inspection apparatus 100 drives the stage control mechanism 63 to carry the substrate including the workpiece 20 into a predetermined position.

  In step S320, the X-ray inspection apparatus 100 captures an image with X-rays while controlling the image acquisition mechanism 61 and the detector control mechanism 60 in accordance with a preset first imaging condition stored in the main storage unit 80. Run.

  In step S330, the X-ray inspection apparatus 100 executes imaging of the workpiece 20 by X-rays in accordance with a preset second imaging condition stored in the main storage unit 80.

  In step S340, the arithmetic unit 70, based on the data acquired from the image acquisition mechanism 61 and temporarily stored in the auxiliary storage unit 81 according to the first imaging condition, from the image obtained. The image of the workpiece 20 is reconstructed.

  In step S350, the arithmetic unit 70 similarly reconstructs an image of the workpiece 20 using data obtained according to the second imaging condition sent from the X-ray detector 23 via the image acquisition mechanism 61. To do.

  In step S500, the arithmetic unit 70 executes an artifact recognition process described later. When this processing is executed, artifacts that may occur when the workpiece 20 is subjected to X-ray inspection are recognized in advance.

  FIG. 4 is a flowchart showing a process executed when the workpiece 20 is imaged in advance according to N imaging conditions in order to recognize the artifact. The same steps as those described above are denoted by the same step numbers. Therefore, those descriptions will not be repeated.

  In step S410, the X-ray inspection apparatus 100 executes the X-ray imaging of the workpiece 20 in accordance with the Nth imaging condition.

  In step S420, the arithmetic unit 70 reconstructs an image of the workpiece 20 using data obtained by imaging in accordance with the Nth imaging condition. Thereafter, the calculation unit 70 executes an artifact recognition process (step S500).

[Artifact recognition]
FIG. 5 is a flowchart showing details of processing for recognizing artifacts. Artifacts are recognized as a result of discriminating normal images (for example, images of parts and formed patterns) and artifacts by comparing a plurality of images, for example. As a method for comparing images, a general image processing method is used. Examples of the image processing method include, but are not limited to, a difference (luminance difference), luminance dispersion, edge extraction, edge strength, pattern matching, and the like.

  In step S510, the calculation unit 70 acquires a tomographic image (S1) from the image obtained by reconstructing according to the first imaging condition stored in the main storage unit 80.

  In step S520, the calculation unit 70 acquires a tomographic image (S2) from the image reconstructed by imaging according to the second imaging condition stored in the main storage unit 80.

In step S530, the calculation unit 70 calculates a difference (S1-S2) between tomographic images.
In step S540, the arithmetic unit 70 compares the absolute value of the difference obtained by the calculation with a predetermined threshold value, and if the absolute value is equal to or greater than the threshold value, the portion included in the image is used as an artifact. ,recognize. Thereafter, the process returns to the main process.

  A method for recognizing artifacts in the X-ray inspection apparatus 100 will be described with reference to FIGS. FIG. 6 is a diagram illustrating a case where an artifact is recognized by comparing images obtained by reconstructing from different numbers of projection images. Specifically, artifacts are recognized by acquiring tomographic images in the workpiece 20 and comparing the acquired tomographic images. Note that imaging conditions for recognizing artifacts are not limited to the number of images used for reconstruction. For example, an X-ray irradiation angle, an azimuth angle (position) at which X-rays are irradiated, a raw substrate (a substrate before component mounting) ).

  For example, the image (A) is a diagram showing a tomographic image (S1) obtained by photographing the workpiece 20 in accordance with the first imaging condition (the number of captured images is 16). The image (B) is a diagram showing a tomographic image (S2) reconstructed by imaging in accordance with the second imaging condition (for example, 32 imaging images). In this case, the artifact is recognized by calculating the difference between the luminance value of the tomographic image (S1) and the luminance value of the tomographic image (S2).

  As for the number of images to be captured, a large number (32 in the above example) is taken as the first image capturing condition, and 32 sheets are used for a small number of images (16 in the above example) as the second image capturing condition. 16 projection images may be selected from these projection images. For example, every other image may be selected from a plurality of projection images. This eliminates the need for imaging to acquire 16 X-ray captured images as the second imaging condition.

  FIG. 7 is a diagram illustrating a state in which a difference between tomographic images is derived in order to recognize an artifact. Specifically, the image shown in FIG. 7 is obtained by calculating the difference between the tomographic image (S1) and the tomographic image (S2). For example, since the brightness value of the area 710 is larger than a preset threshold value, the calculation unit 70 of the X-ray inspection apparatus 100 recognizes that the area 710 has an artifact.

  In the case of calculating the difference between tomographic images, in the example shown in FIG. 7, a position with high brightness (corresponding to a white pixel) corresponds to an artifact position (pixel). Here, the difference ΔI in pixel values is defined, for example, as in the following equation.

ΔI = | I ₁ −I ₂ |
I ₁ : Pixel value of the first imaging condition I ₂ : Pixel value of the second imaging condition FIG. 8 is a diagram illustrating an aspect in which the edge strengths are compared in order to recognize the artifact.

  For example, in a certain situation, when artifacts remain in 32 CT (Computed Tomography) tomographic images, it is difficult to visually determine the artifact. However, for example, by comparing the edge intensities of 16 CT tomographic images and 32 CT tomographic images, it is possible to determine whether or not it is an artifact. That is, the artifact does not actually exist in the workpiece 20, and therefore, when the number of images used to reconstruct an image (the number of projection images) increases, the portion becomes “thin” and the edge strength decreases. Tend to be.

  The image 800 is an image obtained by taking an X-ray image of the workpiece 20. It is assumed that the image 800 includes a region 840 in which it is required to determine whether or not the image is an artifact. For example, when the value of the tomographic position (Z) is 5 pixels, as shown in the image 811, the image corresponding to the region 840 appears to include an artifact. On the other hand, the image 821 when the tomographic position (Z) is 40 pixels in the region can be determined as a normal pattern surface included in the work 20 because the edge strength is larger than a preset threshold value. That is, in the graph representing the relationship between the tomographic position and the edge strength, the difference between the edge strengths of the 16 CT tomographic images in the region 810 corresponding to the image 811 and the 32 CT tomographic images is based on a preset threshold value. Is also greatly calculated. On the other hand, as shown in the region 820, the difference in edge strength of the CT tomographic image near the tomographic position (Z = 40 pixels) is smaller than the difference in edge strength in the region 810. Therefore, as shown in the image 821, the calculation unit 70 determines that the region 840 is a normal pattern surface.

[Add location information]
With reference to FIG. 9, addition of position information related to artifact recognition in the X-ray inspection apparatus 100 according to the present embodiment will be described. FIG. 9 is a diagram illustrating a state in which an image of a regular pattern corresponding to the configuration of the inspection object and artifacts are mixed in an image obtained by X-ray imaging.

  As shown in FIG. 9A, in one aspect, the image 961 can include an artifact 900 in addition to the regular pattern. At this time, since the windows 910 and 911 include the artifact 900, these windows 910 and 911 are not adopted as the objects of the image inspection. On the other hand, since the window 912 does not include artifacts, the window 912 is adopted as an object for image inspection.

  Referring to FIG. 9B, in another aspect, image 962 can include a pattern of part 920 and artifact 901. Here, since the window 921 and the window 922 do not include artifacts, the windows 921 and 922 are employed as the objects of image inspection. On the other hand, since the window 930 includes the artifact 901, the window 930 is not employed as an image inspection target.

  Referring to FIG. 9C, an image 963 may include an artifact 902 in addition to the part pattern image. At this time, since the windows 940 and 941 displayed in the image 963 do not include artifacts, they are employed as inspection targets. On the other hand, since the windows 950 and 951 include the artifact 902, they are not adopted as inspection targets.

That is, in one aspect, whether or not to adopt the inspection target window (position) is realized as follows, for example.
(1) Set the position of the pattern (2) Set the contour of the component (3) Set the solder of the electrode part with low luminance By adding such position information, for example, the inspection target (wiring pattern, It is possible to prevent erroneous recognition of part contours, thin electrodes, etc.) as artifacts.

  In addition, since only windows that do not include artifacts are employed as inspection targets, high-speed processing in image inspection is realized.

[Add luminance information]
With reference to FIG. 10, the addition of luminance information in X-ray inspection apparatus 100 according to the present embodiment will be described. FIG. 10 is a diagram illustrating the binarization threshold setting that is set when the image obtained by X-ray imaging includes and does not include an artifact.

  In one aspect, the binarization threshold value used for determining the region of the workpiece 20 and the luminance of the determination value can be corrected. For example, (1) the reference and position of the binarization threshold value of the solder ball can be corrected. In addition, (2) the brightness of the threshold value for determining the quality of the lead back filter can be corrected.

Referring to FIG. 10A, an image 1001 includes an image 1010 corresponding to a pattern. In addition, the image 1001 displays windows 1011, 1012, 1013, and 1014 assigned in accordance with a predetermined rule. Each image has a luminance (I _a , I _b , I _c , I _d ). At this time, the threshold value for binarization is defined as in Expression 1030, for example.

Referring to FIG. 10B, an image 1002 may include an artifact 1015. Artifact 1015 has, for example, luminance _If . In this case, the binarization threshold is defined as in Expression 1040.

  With reference to FIG. 11, the addition of luminance information in X-ray inspection apparatus 100 according to the present embodiment will be further described. FIG. 11 is a diagram illustrating threshold values set in accordance with the presence or absence of artifacts. The state (A) represents a cross section of a part of the workpiece 20 when no artifact is present. The state (B) represents a cross section of a part of the workpiece 20 when an artifact is present.

As shown in the state (A), in one aspect, each image of the solder 1110 attached to the substrate and the lead 1111 is recognized. At this time, the luminance distribution is shown as a line profile, for example, as a graph 1130. In this case, for example, twice the luminance value (I _a ) at _a place where solder does not exist (x = 0) is used as the threshold value I _th for the quality determination.

As shown in the state (B), in another aspect, an artifact 1120 may be included in the X-ray captured image. In this case, the presence of the artifact 1120 can increase the brightness value of the captured image. The luminance distribution is represented as a graph 1140, for example. In this case, for example, the threshold value (I _th ) for the pass / fail judgment can be expressed as 2 (I _a ′ −I _f ).

[Add shooting condition information]
With reference to FIG. 12, the aspect which adds imaging condition information for the recognition of the artifact in the X-ray inspection apparatus 100 which concerns on this Embodiment is demonstrated. FIG. 12 is a diagram illustrating imaging condition information added according to the presence or absence of artifacts.

  Specifically, in a certain situation, imaging conditions that are not affected by artifacts are calculated. For example, (1) X-ray irradiation angle and azimuth angle for imaging that does not include (small) artifacts are selected for the inspection target. (2) The number of images not affected by the artifact is selected as the number of images to be captured.

  Thereby, it is possible to set an imaging condition that can reduce artifacts without increasing the number of images to be captured. Even when the number of images to be captured is increased, the minimum number of images necessary for inspection can be set as the number of images to be captured. The imaging condition information to be added is not limited to “number of images to be captured”, and a combination of two or more of the number of images to be captured, an irradiation angle, and an azimuth angle may be used.

More specifically, the state (A) represents a state where an artifact is recognized in a part that needs to be inspected. Specifically, windows 1220 and 1210 include artifact 1230. In this case, with respect to the imaging conditions, the number of images to be captured is defined as a number smaller than a predetermined number, the irradiation angle (φ ₁ ) is defined, and the azimuth angle (θ ₁ ) is defined.

The state (B) is a diagram showing a mode in which the artifact is not displayed because the artifact has moved to another fault. At this time, as the imaging conditions, the number of images to be captured is set to a number smaller than a predetermined number as in the state (A), the irradiation angle (φ ₂ ) is defined, and the azimuth angle (θ ₁ ) is defined. ing.

The state (C) represents a state in which the position of the artifact is shifted and is not included in the window. At this time, the number of images and the irradiation angle are the same values as the number of images and the irradiation angle in the state (A). However, for the irradiation angle, the azimuth angle (θ ₂ ) is used instead of the azimuth angle (θ ₁ ).

  The state (D) represents a state in which the brightness of the artifact 1250 is smaller than the brightness of the artifact 1230 shown in the state (A). At this time, the irradiation angle and the azimuth angle are the same as the irradiation angle and azimuth angle used in the state (A). However, the number of captured images is defined as an image capturing condition that is larger than the number of captured images used in the state (A).

[Control structure]
With reference to FIG. 13, another process for recognizing artifacts in the X-ray inspection apparatus 100 will be described. FIG. 13 is a flowchart showing a process for changing the number of captured images. The same steps as those described above are denoted by the same step numbers. Therefore, those descriptions will not be repeated.

  In step S1310, control device 110 obtains 32 projection images (projected images) by controlling detector control mechanism 60, image acquisition mechanism 61, stage control mechanism 63, and X-ray source control mechanism 64. Therefore, the imaging process is executed 32 times.

  In step S1320, operation unit 70 reconstructs the image of work 20 using the 32 images obtained by imaging.

  In step S1330, calculation unit 70 selects 16 images from the 32 images obtained in step S1310, and reconstructs the image of workpiece 20 using the selected images. Here, the selection of 16 images is performed, for example, by selecting an even-numbered or odd-numbered image among the 32 images. Thereafter, the calculation unit 70 executes an artifact recognition process (step S500).

  FIG. 14 is a flowchart showing a process executed by the X-ray inspection apparatus 100 when imaging is performed by changing the irradiation angle.

  In step S1410, the control device 110 controls the X-ray source control mechanism 64 and the stage control mechanism 63 to adjust the position so that the angle irradiated from the X-ray source 10 is 45 degrees. X-ray imaging of the workpiece 20 is executed.

  In step S1420, the control device 110 controls the detector control mechanism 60, the image acquisition mechanism 61, the stage control mechanism 63, and the X-ray source control mechanism 64 so that the irradiation angle from the X-ray source 10 to the workpiece 20 is increased. The angle is changed to 30 degrees, and imaging of the workpiece 20 is executed according to the changed condition.

  In step S1430, calculation unit 70 reconstructs an image of work 20 using an image obtained under the condition of an irradiation angle of 45 degrees.

  In step S1440, calculation unit 70 reconstructs an image of work 20 using an image obtained under the condition of an irradiation angle of 30 degrees. Thereafter, the calculation unit 70 executes an artifact recognition process (step S500).

[Generation of artifacts]
Here, with reference to FIG. 15 and FIG. 16, generation | occurrence | production of the artifact according to an irradiation angle is demonstrated. FIG. 15 is a diagram illustrating the positional relationship between artifacts generated when the irradiation angle is 45 degrees and the inspection target. FIG. 16 is a diagram illustrating a positional relationship between artifacts generated when the irradiation angle is 30 degrees and the inspection target.

  Referring to FIG. 15, in one aspect, inspection objects 230, 231, and 232 included in workpiece 20 are arranged between substrate 261 and substrate 260. At this time, X-rays irradiated at an irradiation angle of 45 degrees are transmitted through the inspection objects 230, 231, and 232, and artifacts 210, 211, 212, 213, 214, and 215 are detected by the X-ray detector 23.

  Referring to FIG. 16, when the irradiation angle is 30 degrees, X-rays transmitted through inspection objects 230, 231, and 232 are received by X-ray detector 23, and artifacts 1610, 1611, 1612, 1613, 1614 and 1615 can be detected by the X-ray detector 23.

  That is, as apparent from FIGS. 15 and 16, since the position where the artifact can occur is changed by changing the X-ray irradiation angle, an image reconstructed from the projection image obtained by changing the irradiation angle is compared. This makes it possible to recognize artifacts.

[Change imaging position]
A mode of changing the imaging position (azimuth angle) will be described with reference to FIGS. FIG. 17 is a flowchart showing a part of processing executed when the X-ray inspection apparatus 100 changes the imaging position (azimuth angle). The same steps as those described above are denoted by the same step numbers. Therefore, those descriptions are not repeated.

  In step S1710, control device 110 executes 16 X-ray imaging at a preset imaging position (azimuth angle A).

  In step S1720, control device 110 executes 16 X-ray imagings under conditions of imaging azimuth angles (B) preset as different azimuth angles.

  In step S1730, the arithmetic unit 70 reconstructs the image of the workpiece 20 using the 16 projection images obtained in step S1710.

  In step S1740, the calculation unit 70 reconstructs the image of the workpiece 20 at the imaging position (B) using the 16 projection images obtained in step S1720. Thereafter, the calculation unit 70 executes an artifact recognition process (step S500).

  FIG. 18 is a diagram illustrating the concept of the azimuth angle in the X-ray inspection apparatus 100. FIG. 18A is a diagram showing the position of the X-ray detector 23 and the position of the imaging field of view 1810 when the X-ray inspection apparatus 100 captures a predetermined number of images starting from an azimuth angle of 0 degrees. . Specifically, the X-ray detector 23 moves on the X-ray detector trajectory 1830. At this time, the imaging field of view 1810 rotates and moves in the same direction on the imaging field of view 1820 having the X-ray source 10 as a concentric circle. In the example shown in FIG. 18A, four positions for imaging are specified, but the locations of the X-ray detector 23 and the imaging visual field 1810 are limited to the numbers specified from FIG. Absent.

  FIG. 18B is a diagram showing the positions of the X-ray detector 23 and the imaging visual field 1810 when the azimuth angle is 45 degrees in the X-ray inspection apparatus 100.

  Similarly, the X-ray detector 23 and the imaging visual field 1810 move on their respective circumferential trajectories, and X-ray imaging is performed at each position. As apparent from FIGS. 18A and 18B, since different angles are used as starting points, when an artifact is recognized according to the azimuth, the artifact is obtained by obtaining the difference. The presence or absence of can be recognized.

  The artifact occurrence position will be described with reference to FIGS. 19 and 20. FIG. 19 is a diagram showing an image obtained when the azimuth angle is 0 degree. FIG. 20 is a diagram illustrating an image obtained when the azimuth angle is 45 degrees.

  Referring to FIG. 19A, when the work 20 is viewed from above, inspection objects 1900, 1903, 1902, 1901 such as ball solder included in the work 20 and artifacts 1910, 1911, 1912, 1913 are recognized. .

  With reference to FIG. 19B, when the inspection objects 1920 and 1921 are viewed from the side, artifacts 1930 and 1931 can be detected by the arithmetic unit 70, respectively.

  Referring to FIG. 20, when an azimuth angle of 45 degrees is used as a starting point, when work 20 is viewed from above, inspection objects 1901, 1902, 1903, 1900 included in work 20 are further images with artifacts 2010. Is recognized by the arithmetic unit 70. At this time, as shown in FIG. 20B, when the work 20 is viewed from the side, the inspection objects 1920 and 1921 are recognized, and the artifact is not recognized. On the other hand, as shown in FIG. 20C, when the position viewed from the side is changed, artifacts 2020 and 2021 can be recognized.

  With reference to FIG. 21, the display of the window to the user will be described. FIG. 21 is a flowchart showing a part of a series of processes executed by X-ray inspection apparatus 100 having a window display function. The same steps as those described above are denoted by the same step numbers. Therefore, those descriptions are not repeated.

In step S2110, operation unit 70 displays a window on output unit 50.
In step S 2120, calculation unit 70 receives an input of a confirmation result or correction instruction for the displayed window based on an input given via input unit 40. Thereafter, the calculation unit 70 stores the corrected information in the main storage unit 80.

  Therefore, with reference to FIG. 22, confirmation and correction of the window will be described. FIG. 22 is a diagram showing a manner of confirming and correcting a window displayed by X-ray inspection apparatus 100.

  As shown in FIG. 22A, in one aspect, the workpiece 20 includes solder balls and other inspection objects 2220, 2221, and 2222 and a pattern 2230 between the substrates 2210 and 2240.

  As shown in FIG. 22B, for example, 16 images are captured as projection images in a certain situation. As a result, the image 2250 includes artifacts 2260 in addition to the regular images 2251, 2252, 2253, 2254, 2255, 2256, 2257, 2258, 2259, 2261.

  When 32 projected images are used as the number of captured images, as shown in FIG. 22C, in addition to the regular images 2271, 2272, 2273, 2274, 2275, 2276, 2277, 2278, 2279, 2281 Thus, an artifact 2270 having a reduced luminance is displayed.

[Show window]
A window display will be described with reference to FIG. FIG. 23 is a diagram showing a display mode when X-ray inspection apparatus 100 displays a window.

  Referring to FIG. 23A, an image 2310 includes artifacts 2320 and 2322 in addition to images 2311, 2312, 2313, 2314, 2315, 2316, 2317, 2318, 2319, and 2321 representing regular patterns. In each image, windows 2311, 2312, 2313, 2314, 2315, 2316, 2317, 2318, 2319, 2340, 2341, and 2342 are displayed. At this time, the windows 2340 and 2342 are displayed by, for example, dotted lines in a manner different from the other windows. This makes it easy to distinguish between a window including an artifact and a window including a normal image.

  Referring to FIG. 23B, an image 2350 includes windows 2361, 2362, 2363, 2364, 2365, 2366, 2367, 2368, 2369, 2370, 2371, 2372. Here, the windows 2361, 2362, 2363, 2364, 2365, 2366, 2367, 2368, 2369 are displayed as windows including images representing regular patterns, and are distinguished from other windows. For example, window 2372 is displayed with a dotted line because it includes artifact 2360. Note that the display mode is not limited to practice and dotted lines. For example, even for the same type of line, a window including a regular image may be distinguished from a window including an artifact by changing the thickness of the line or changing the color of the line.

[Check and modify window]
Next, window confirmation and correction will be described with reference to FIGS. FIG. 24 is a diagram illustrating an initial state in which the X-ray inspection apparatus 100 displays a window. FIG. 25 is a diagram illustrating a state where the pasting of the window is corrected.

  Referring to FIG. 24, in one aspect, X-ray inspection apparatus 100 may display a window by mistake. That is, the window may be displayed when the window should not be displayed, and conversely, the window may not be displayed for an image that needs to be displayed. In the example shown in FIG. 24, a window of an image corresponding to a normal ball may not be displayed. For example, images 2460 and 2461 are images representing regular patterns (for example, balls), but no windows are displayed in these images. Therefore, it is necessary to display a window. On the other hand, the windows 2111, 2121 are represented by line types different from the line types of the window 2451 including the normal image as the windows including the artifacts 2410, 2420, respectively. The window 2431 is displayed as a window including a regular pattern 2430.

  Referring to FIG. 25, windows 2511 and 2521 can be manually added by the user of X-ray inspection apparatus 100 as windows corresponding to regular part images 2460 and 2461. The X-ray inspection apparatus 100 holds the added window as information in the main storage unit 80, so that the setting state of the window can be used for the X-ray image inspection in the subsequent inspection.

[Effect of the embodiment]
As described above, the X-ray inspection apparatus 100 according to the present embodiment recognizes artifacts in advance using a sample product and identifies the artifacts before performing in-line inspection of a plurality of inspection objects of the same type. Is stored in advance. The information includes, for example, information for specifying the position of the artifact (for example, coordinate values, shape data), luminance of the artifact, imaging conditions in which the artifact is recognized (for example, an azimuth angle at which imaging is performed), and the like. Including. Thereafter, the X-ray inspection apparatus 100 uses an image obtained by X-ray imaging in consideration of information for identifying artifacts when performing in-line inspection of the same type of inspection object as the sample product. An inspection image from which artifacts are removed is acquired. In this way, even if in-line inspection is performed using an imaging condition that does not include artifacts, a decrease in inspection accuracy is prevented. In addition, since the inspection image can be acquired with the minimum necessary number of shots, a decrease in the inspection speed can be prevented.

[Computer system configuration]
The control mechanism of the X-ray inspection apparatus 100 according to the above-described embodiment can be realized using a computer system having a known configuration.

  A computer system 2600 that implements the control mechanism of the X-ray inspection apparatus 1000 will be described with reference to FIG. FIG. 26 is a block diagram showing a hardware configuration of computer system 2600.

  The computer system 2600 includes, as main components, a CPU 1 that executes a program, a mouse 2 and a keyboard 3 that receive input of instructions from a user of the computer system 2600, data generated by execution of a program by the CPU 1, or a mouse 2 Alternatively, a RAM 4 that stores data input via the keyboard 3 in a volatile manner, a hard disk 5 that stores data in a nonvolatile manner, an optical disk drive device 6, a monitor 8, and a communication IF (Interface) 9 are provided. Each component is connected to each other by a bus. A CD-ROM 9 and other optical disks are mounted on the optical disk drive 6.

  The processing in the computer system 2600 is realized by software executed by each hardware and the CPU 1. Such software may be stored in the hard disk 5 in advance. The software may be stored in a CD-ROM 9 or other computer-readable information recording medium and distributed as a program product. Alternatively, the software may be provided as a program product that can be downloaded by an information provider connected to the Internet or other networks. Such software is read from the information recording medium by the optical disk drive 6 or other data reading device or downloaded via the communication IF 7 and then temporarily stored in the hard disk 5. The software is read from the hard disk 5 by the CPU 1 and stored in the RAM 4 in the form of an executable program. The CPU 1 executes the program.

  Each component constituting the computer system 2600 shown in FIG. 26 is a general component. Therefore, it can be said that the essential part of the present invention is the software stored in the RAM 4, the hard disk 5, the CD-ROM 9, or other information recording medium, or the software that can be downloaded via the network. Since the operation of each hardware of computer system 1200 is well known, detailed description will not be repeated.

  Information recording media are not limited to CD-ROMs, FDs (Flexible Disks), and hard disks, but are magnetic tapes, cassette tapes, optical disks (MO (Magnetic Optical Discs) / MDs (Mini Discs) / DVDs (Digital Versatile Discs). ), IC (Integrated Circuit) card (including memory card), optical card, mask ROM, EPROM (Electronically Programmable Read-Only Memory), EEPROM (Electronically Erasable Programmable Read-Only Memory), flash ROM, etc. It may be a medium that carries the program in a fixed manner.

  Here, the program may include not only a program that can be directly executed by the CPU 1 but also a program in a source program format, a compressed program, an encrypted program, and the like.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  1 CPU, 2 mouse, 3 keyboard, 4 RAM, 5 hard disk, 6 optical disk drive, 8 monitor, 9 ROM, 18 stage, 19 displacement meter, 20 work, 22.1 robot arm, 22.2 detector support, 23 X-ray detector, 40 input unit, 50 output unit, 60 detector control mechanism, 61 image acquisition mechanism, 62 displacement meter control mechanism, 63 stage control mechanism, 64 X-ray source control mechanism, 70 calculation unit, 80 main memory Part, 81 auxiliary storage part, 100,1000 X-ray inspection apparatus, 110 control apparatus, 1810 imaging visual field, 1820 imaging visual field trajectory, 1830 X-ray detector trajectory.

Claims (22)

An X-ray inspection apparatus for performing a reconstruction process of an image of the inspection target area by receiving X-rays transmitted through the inspection target area of the object with a plurality of detection surfaces,
An object moving mechanism for moving the position of the object in the X-ray inspection apparatus;
An X-ray source for irradiating the object with X-rays;
An X-ray detector for imaging X-rays transmitted through the region to be inspected;
A detector moving mechanism for moving the X-ray detector;
Control means for controlling the operation of the X-ray inspection apparatus,
The control means includes
Based on each projection image obtained by imaging an object according to each of a plurality of imaging conditions using X-rays, the object obtained by reconstructing an X-ray image received by each detection surface Artifact recognition means for recognizing artifacts from the reconstructed image;
An X-ray examination apparatus comprising: specific information acquisition means for acquiring information for specifying an artifact recognized by the artifact recognition means. The control means includes
Inspection for acquiring an inspection image from which the recognized artifact is removed from a projection image obtained by X-ray imaging of the same type of object as the object based on the information for specifying The X-ray inspection apparatus according to claim 1, further comprising image acquisition means. The artifact recognition means includes
A first reconstruction for reconstructing a first image of the object from a plurality of images obtained by imaging the object a plurality of times according to a first imaging condition of the plurality of imaging conditions Means,
A second reconstruction for reconstructing a second image of the object from a plurality of images obtained by imaging the object a plurality of times according to a second imaging condition of the plurality of imaging conditions Means,
The X-ray inspection apparatus according to claim 1, further comprising an extraction unit configured to extract the artifact based on the first image and the second image.   The X-ray inspection apparatus according to claim 1, further comprising display means for displaying a reconstructed image including the recognized artifact. Input means for receiving an input of an imaging condition different from the imaging condition from which the reconstructed image including the recognized artifact is obtained;
Storage means for storing different input imaging conditions,
The control means includes
Including inspection means for controlling the X-ray source, the X-ray detector, the object moving mechanism, and the detector moving mechanism so as to image the object using the different imaging conditions; The X-ray inspection apparatus in any one of Claims 1-4.   The X-ray inspection apparatus according to claim 1, wherein the display unit displays the recognized artifact and a normal image corresponding to a part constituting the object in a distinguishable manner. The information for specifying is
Position information in the reconstructed image of the recognized artifact;
A luminance threshold for determining the quality of the object;
The X-ray inspection apparatus according to claim 1, comprising any one of imaging conditions in which artifacts are not recognized. A method of controlling an X-ray inspection apparatus for performing a reconstruction process of an image of the inspection target region by receiving X-rays transmitted through the inspection target region of the target by a plurality of detection surfaces,
The X-ray inspection apparatus
An object moving mechanism for moving the position of the object in the X-ray inspection apparatus;
An X-ray source for irradiating the object with X-rays;
An X-ray detector for imaging X-rays transmitted through the region to be inspected;
A detector moving mechanism for moving the X-ray detector,
The control method is:
The X-ray inspection apparatus reconstructs an X-ray image received by each detection surface based on each projection image obtained by imaging an object according to each of a plurality of imaging conditions using X-rays. Recognizing artifacts from the reconstructed image of the object obtained by:
The X-ray inspection apparatus includes a step of acquiring information for specifying the recognized artifact.   Based on the information for specifying, the X-ray inspection apparatus is for inspection in which the recognized artifact is removed from a projection image obtained by imaging an object of the same type as the object. The method for controlling an X-ray inspection apparatus according to claim 8, further comprising a step of acquiring an image. Recognizing the artifact comprises:
Reconstructing a first image of the object from a plurality of images obtained by imaging the object a plurality of times in accordance with a first imaging condition of the plurality of imaging conditions;
Reconstructing a second image of the object from a plurality of images obtained by imaging the object a plurality of times according to a second imaging condition of the plurality of imaging conditions;
The method for controlling an X-ray inspection apparatus according to claim 8, further comprising: extracting the artifact based on the first image and the second image.   The method for controlling an X-ray inspection apparatus according to claim 8, further comprising a step of displaying a reconstructed image including the recognized artifact. The X-ray inspection apparatus accepting an input of an imaging condition different from an imaging condition from which a reconstructed image including the recognized artifact is obtained;
The X-ray inspection apparatus storing different input imaging conditions;
The X-ray inspection apparatus controls the X-ray source, the X-ray detector, the object moving mechanism, and the detector moving mechanism so as to image the object using the different imaging conditions. The method for controlling an X-ray inspection apparatus according to claim 8, further comprising a step.   The X-ray according to claim 8, wherein the displaying includes displaying the recognized artifact and a normal image corresponding to a part constituting the object in a distinguishable manner. Control method of inspection device. The information for specifying is
Position information in the reconstructed image of the recognized artifact;
A luminance threshold for determining the quality of the object;
The method for controlling an X-ray inspection apparatus according to claim 8, comprising any one of imaging conditions in which artifacts are not recognized. A program for controlling an X-ray inspection apparatus for performing an image reconstruction process of an image of the inspection target region by receiving X-rays transmitted through the inspection target region of the object with a plurality of detection surfaces. ,
The X-ray inspection apparatus
An object moving mechanism for moving the position of the object in the X-ray inspection apparatus;
An X-ray source for irradiating the object with X-rays;
An X-ray detector for imaging X-rays transmitted through the region to be inspected;
A detector moving mechanism for moving the X-ray detector,
The program is stored in the X-ray inspection apparatus.
Based on each projection image obtained by imaging an object according to each of a plurality of imaging conditions using X-rays, the object obtained by reconstructing an X-ray image received by each detection surface Recognizing artifacts from the reconstructed image;
And a step of obtaining information for identifying the recognized artifact. The program is stored in the X-ray inspection apparatus.
Acquiring a test image from which the recognized artifact is removed from a projection image obtained by X-ray imaging of the same type of target as the target based on the information for specifying The program according to claim 15, wherein the program is executed. Recognizing the artifact comprises:
Reconstructing a first image of the object from a plurality of images obtained by imaging the object a plurality of times in accordance with a first imaging condition of the plurality of imaging conditions;
Reconstructing a second image of the object from a plurality of images obtained by imaging the object a plurality of times according to a second imaging condition of the plurality of imaging conditions;
The program according to claim 15 or 16, comprising: extracting the artifact based on the first image and the second image.   The program according to any one of claims 15 to 17, further causing the X-ray inspection apparatus to execute a step of displaying a reconstructed image including the recognized artifact. The program is stored in the X-ray inspection apparatus.
Receiving an input of an imaging condition different from the imaging condition from which the reconstructed image including the recognized artifact is obtained;
Storing different input imaging conditions;
Further controlling the X-ray source, the X-ray detector, the object moving mechanism, and the detector moving mechanism so as to image the object using the different imaging conditions. The program according to any one of claims 15 to 18.   The program according to any one of claims 15 to 18, wherein the displaying step includes a step of displaying the recognized artifact and a normal image corresponding to a part constituting the object in a distinguishable manner. The information for specifying is
Position information in the reconstructed image of the recognized artifact;
A luminance threshold for determining the quality of the object;
The program according to any one of claims 15 to 20, including any of imaging conditions in which artifacts are not recognized.   A computer-readable recording medium storing the program according to any one of claims 15 to 21.