JP2013057098A - Plating current density distribution measurement device and plating current density distribution measurement method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a unit that achieves accurate measurement of in-plane distribution of a plating current density in a cathode plate.SOLUTION: The plating current density distribution measurement device includes: a plating bath; an anode and a member to be plated that are at least partially disposed under the surface of a plating solution contained in the plating bath; a first current measuring body comprising a first insulator and a first measurement electrode formed on one surface of the first insulator and disposed so that the first insulator faces a part of the surface to be plated of the member to be plated; a plating power supply; a first wiring for electrically connecting an anode terminal of the plating power supply to the anode; a second wiring for electrically connecting a cathode terminal of the plating power supply to the member to be plated; a third wiring for electrically connecting the cathode terminal of the plating power supply to the first measurement electrode so that the first measurement electrode and the member to be plated form a parallel relationship; and a first current measurement device disposed in the third wiring.

Description

The present invention relates to a plating current density distribution measuring apparatus and a plating current density distribution measuring method.
In the present invention, the plating current density distribution is a surface to be plated on the member to be plated when a voltage is applied between the anode and the member to be plated in the plating solution (hereinafter referred to as “surface to be plated”). Also means the distribution of the plating current density (unit: A / dm ² ) in the surface to be plated.

  When plating with a new composition or the shape of the member to be plated is a new shape, the characteristics required for the plating (specifically, plating thickness, plating appearance, adhesion) In order to control the properties within a suitable range, it is necessary to optimize plating conditions such as plating current density, stirring speed and plating solution temperature.

  As a simple test for setting such optimum plating conditions, a hull cell test is well known. In an apparatus for performing a hull cell test (hull cell test apparatus), a voltage is applied between an anode plate forming an anode and a cathode plate (corresponding to a member to be plated) disposed obliquely with respect to the anode plate. Is applied to evaluate the state of plating deposited on the cathode plate and set appropriate plating conditions.

  Here, since the anode plate and the cathode plate are disposed obliquely, the relative positional relationship between each position of the surface of the cathode plate facing the anode plate and the anode plate is determined by the plating solution of the cathode plate. It changes along the direction parallel to the liquid level. In addition, when performing plating while stirring the plating solution, since the bottom surface of the plating tank is trapezoidal, the degree of the plating solution flow at each position on the surface of the cathode plate facing the anode plate is different. There are many.

  Therefore, when a voltage is applied between the anode plate and the cathode plate, the plating current density at each position on the surface of the cathode plate facing the anode plate is different, and plating deposited under different plating conditions at each position on the cathode plate can get. Thus, by evaluating the deposition state (plating thickness, appearance, etc.) at each position of plating on the obtained cathode plate, suitable plating conditions can be found.

Since this Hull cell test apparatus is small and simple, various improvements have been made in order to reproduce the plating conditions in the actual process.
For example, in Patent Document 1, a rod-shaped cathode member is used in place of the cathode plate so as to reproduce high-speed electroplating required in hoop plating, plating on electric wires, and the like, and a mechanism that can rotate around the central axis is used. A plating test apparatus is disclosed.

Japanese Patent No. 3185191

  In the above-mentioned Hull Cell test equipment and its improved equipment, the plating current density distribution on the cathode plate reflects the plating deposition state that changes based on fluctuations in the plating current density, instead of directly measuring the plating current density. It has been evaluated by measuring plating characteristics such as plating thickness, which change as a substitute characteristic.

However, in such an evaluation method, if the evaluation items used as substitute characteristics have not changed or the amount of change is small for plating deposited at different positions on the surface to be plated on the cathode plate, There is a problem that it is recognized that the plating current density is substantially the same at the position. That is, even if a variation in plating current density that does not appear as a change in the evaluated plating characteristics may cause a change in the plating characteristics that was not evaluated, this cannot be recognized. When the plating characteristics not evaluated are plating characteristics that cannot be recognized at the test stage, such as long-term corrosion resistance, products with plating whose plating characteristics are not controlled will be mass-produced, and a large number of defective products will be produced at a later date. May need to be recovered from the market.
For this reason, a means for directly evaluating the distribution of the plating current density in the cathode plate has been desired.

  In view of such a technical background, an object of the present invention is to provide a measuring apparatus and a measuring method that can directly measure the in-plane distribution of plating current density in a cathode plate.

The present invention provided to solve the above problems is as follows.
(1) Plating tank; anode and member to be plated at least partly disposed below the surface of the plating solution contained in the plating tank; formed on the first insulator and one surface thereof A first current measuring body provided with the first electrode for measurement and disposed so that the first insulator faces a part of a surface of the member to be plated that is plated; A first wiring that electrically connects the anode terminal of the plating power source and the anode; a second wiring that electrically connects the cathode terminal of the plating power source and the member to be plated; A third wiring for electrically connecting the cathode terminal and the first measurement electrode so that the first measurement electrode and the member to be plated are in a parallel relationship; and on the third wiring Comprising first current measuring means arranged on Plating current density distribution measuring apparatus.

  (2) a second insulator and a second measurement electrode formed on one surface thereof, wherein the second measurement electrode and the first measurement electrode are not in contact with each other; A second measurement electrode disposed so that the second insulator faces the surface of the member to be plated; the cathode terminal of the plating power source and the second measurement electrode; A fourth wiring electrically connecting the second measuring electrode, the first measuring electrode, and the member to be plated so as to form a parallel relationship; and a second wiring disposed on the fourth wiring. The apparatus according to (1), further comprising a current measuring unit.

  (3) The apparatus according to (1) or (2), further including an arrangement adjusting unit that enables the first current measurement body to be arranged at a plurality of positions on the surface to be plated. .

  (4) A method for measuring a plating current density distribution on a surface of a member to be plated when a voltage is applied between the anode in the plating solution and the member to be plated, the plating A measuring electrode is disposed on a part of the surface to which the plating is applied via an insulator, the anode and the anode terminal of the plating power source are electrically connected, and the member to be plated and the measuring electrode are Electrically connected to the cathode terminal of the plating power source so as to have a parallel relationship, applying a voltage from the plating power source, measuring the plating current flowing through the measurement electrode, and based on the measured plating current A method for measuring a plating current density distribution, comprising obtaining information relating to a plating current density of a portion where the measurement electrode is disposed on a surface to be plated.

  The “information relating to the plating current density” includes not only the plating current density but also the measured current value. If the area of the portion where the measurement electrode is disposed on the surface to be plated is constant, the current value can be handled equivalent to the plating current density.

  (5) A plurality of the measurement electrodes are prepared, the plurality of measurement electrodes are arranged in non-contact with each other on different portions of the surface to be plated, and the plating current flowing through the plurality of measurement electrodes is individually determined. The measurement method according to (4), wherein measurement is performed to obtain information on plating current density in each of different portions on the surface to be plated.

  (6) Measure plating currents at a plurality of positions on the surface to be plated using one measurement electrode by changing the arrangement of the surface to be plated of the measurement electrode. And the measuring method as described in said (4) or (5) which obtains the information which concerns on the plating current density in each of the said some position.

  According to said invention, the in-plane distribution of the plating current in the surface where the plating of the member to be plated is performed is directly obtained. Accordingly, it is possible to set the plating conditions such as the plating current density more precisely than in the past.

It is a figure which shows notionally the structure of the plating current density distribution measuring apparatus which concerns on 1st embodiment of this invention. It is a figure which shows notionally the structure of the plating current density distribution measuring apparatus which concerns on 2nd embodiment of this invention. 3 is a graph showing the temporal variation of the plating current measured in Example 1. It is sectional drawing (b) in the AA cross section of the front view (a) which shows the shape of the to-be-plated member used in Example 2, and a front view. It is a figure which shows notionally the arrangement | positioning (a) of the 1st countersink side, and the arrangement | positioning (a) of the 2nd countersink side about the electric current measurement body made to adhere to the to-be-plated member used in Example 2. is there. 3 is a graph showing the temporal variation of the plating current measured in Example 1.

A plating current density distribution measuring apparatus according to an embodiment of the present invention will be described below.
FIG. 1 is a diagram conceptually showing the configuration of the plating current density distribution measuring apparatus according to the first embodiment of the present invention.

  The plating current density distribution measuring apparatus 100 according to this embodiment includes a plating tank 1 and an anode 2 that is at least partially disposed below the liquid level of a plating solution that is accommodated in the plating tank 1 when used and a plating target. A member 3 is provided. The material of the anode 2 is arbitrary as long as it has electroconductivity, and the shape is also arbitrary. The material of the member 3 to be plated is arbitrary as long as it has electrical conductivity, and its shape is also arbitrary. The relative arrangement of the anode 2 and the member to be plated 3 is also arbitrary. In FIG. 1, the anode 2 and the member to be plated 3 are arranged to face each other so that the distance between them is constant, but the anode 2 is inclined with respect to the member to be plated 3 as in the Hull cell test apparatus. It may be arranged in a state.

  The plating current density distribution measuring apparatus 100 according to this embodiment is a laminate including a first insulator 5 and a first measurement electrode 6 formed on one surface thereof as a member for measuring a plating current. The first current measuring body 7 is provided. And this 1st electric current measurement body 7 is arrange | positioned so that the 1st insulator 5 may oppose the surface (to-be-plated surface) 4 to which the 1st insulator 5 is plated of the to-be-plated member 3. FIG. The In a preferred embodiment, the first insulator 5 is attached to the surface to be plated 4 directly or indirectly by adhesive means or the like. When the first insulator 5 is directly attached to the surface 4 to be plated, the first insulator 5 is preferably made of an adhesive.

  The material of the first insulator 5 is not limited as long as it is an insulating material. The material of the first measuring electrode 6 is not limited as long as it is a conductive material, but it is preferably made of the same material as that constituting the surface 4 to be plated.

  Although the thickness of the 1st electric current measurement body 7 is not limited, The thinner is so preferable. When it is excessively thick, the current density in the surface 4 to be plated and the first measuring electrode 6 of the first current measuring body 7 in the portion where the first insulator 5 of the first current measuring body 7 faces. The difference from the plating current density becomes remarkable, and the measurement accuracy of the plating current by the first current measuring body 7 is lowered.

  The projected area of the first current measuring body 7 on the surface to be plated is not limited, but since this projected area is the grid size of the plating current density distribution, it is preferably as small as possible to ensure the measurement accuracy in that area. .

  The plating current density distribution measuring apparatus 100 according to the present embodiment also includes a second current measuring body 8 arranged on the plated surface 4 with the same configuration as the first current measuring body 7. The second measurement electrode provided in the second current measurement body 8 is not in contact with the first measurement electrode 6. When these electrodes come into contact with each other, the potential with respect to the anode becomes the same, and the plating current density distribution cannot be measured.

  The plating current density distribution measuring apparatus 100 having the above arrangement in the plating tank 1 includes a plating power source 9. The plating power source includes an anode terminal 10 for outputting a positive voltage and a cathode terminal 11 for outputting a negative voltage, and voltage application at least in direct current is possible. The rated current and rated voltage are arbitrary and should be set according to the test conditions.

  The anode terminal 10 of the plating power source 9 is electrically connected to the anode 2 through a first wiring 12 made of a conductor. On the other hand, the cathode terminal 11 is electrically connected to the member to be plated 3 by a second wiring 13 made of a conductor. Furthermore, the cathode terminal 11 includes a first measurement electrode 6 provided in the first current measurement body 7, a member to be plated 3, and a first measurement electrode 6 by a third wiring 14 made of a conductor. Are electrically connected to form a parallel relationship.

  With this configuration, the plating current that should flow to the portion of the surface to be plated 4 facing the first insulator 5 flows through the first measurement electrode 6 and the third wiring 14. Accordingly, it is possible to measure the plating current that should flow through the portion of the surface to be plated 4 facing the first insulator 5 by the first current measuring means 15 disposed on the third wiring 14. Since the projected area of the first current measuring body 7 on the plated surface 4 is known, the first insulator 5 on the plated surface 4 is obtained by dividing the measured plating current by the projected area. It is possible to directly determine the plating current density in the portion facing the surface. Since the projected area is known, the current value measured by the first current measuring means 15 may be used as a substitute value for the plating current density.

  Moreover, the plating current density distribution measuring apparatus 100 according to the present embodiment includes a cathode terminal 11 of the plating power source 9 and a second measurement electrode provided in the second current measurement body 8 as a second measurement electrode, A fourth wiring 16 that electrically connects the first measuring electrode 6 and the member to be plated 3 so as to form a parallel relationship is provided. A second current measuring unit 17 is disposed on the fourth wiring 16, and the second current measuring unit 17 includes a second current measuring unit 8 on the surface to be plated 4. It is possible to measure the plating current that should flow in the portion facing the insulator independently of the first current measuring body 7. Since the projected area of the second current measuring body 8 onto the surface to be plated 4 is also known, the portion of the surface to be plated 4 facing the second insulator from the plating current measured by the second current measuring means 17 The plating current density can be obtained directly. If the projected areas of the first and second current measuring bodies 7 and 8 on the surface to be plated 4 are the same, the two current values measured by the first and second current measuring means 15 and 17 are used. Is equal to the ratio of the plating current density at the portion where the insulators of the respective current measuring bodies face each other.

  The first current measuring means 15 and the second current measuring means 17 may be ammeters or may be composed of a shunt resistor and a voltage measuring means.

  Although the plating current density distribution measuring apparatus 100 according to this embodiment includes two current measuring bodies as described above, there may be one current measuring body or three or more current measuring bodies. When there are a plurality of current measuring bodies, the plating current density distribution on the surface to be plated 4 can be measured by a single plating, which is preferable.

  Moreover, if it measures using a several electric current measurement body, the time fluctuation of the plating current of the different position in the to-be-plated surface 4 can be measured simultaneously. In the conventional means for evaluating the current density distribution on the surface to be plated (for example, the hull cell test), as described above, the plating current density distribution is evaluated by measuring the characteristics (film thickness, appearance, etc.) of the deposited plating. Therefore, the information regarding the plating current density distribution obtained is limited. For example, when the plating current density distribution is evaluated based on the thickness and appearance of the obtained plating, the influence of the plating current density at the initial stage of plating is almost eliminated by plating that is subsequently deposited. On the other hand, if the time variation of the plating current is simultaneously measured using a plurality of current measuring bodies on the surface 4 to be plated as described above, the variation in the plating current density at the initial stage of plating at a certain position on the surface 4 to be plated. Can be evaluated in a comparable manner with other positions. Therefore, for example, when a plating current density is excessively high at a certain position in the initial stage of plating, the plating state of the plating deposited after that is appropriate, so from the viewpoint of plating thickness and appearance, Even when there is no change in position, it is possible to know that there is a possibility that the adhesion of the plating may be lowered if plating is performed under the plating conditions related to the position.

Subsequently, a plating current density distribution measuring apparatus according to a second embodiment of the present invention will be described.
FIG. 2 is a diagram conceptually showing the configuration of the plating current density distribution measuring apparatus according to the second embodiment of the present invention.

  The basic configuration of the plating current density distribution measuring apparatus 200 according to the second embodiment of the present invention is the same as that of the plating current density distribution measuring apparatus 100 according to the first embodiment of the present invention. Explained.

  Although the plating current density distribution measuring apparatus 100 according to the first embodiment of the present invention includes the first and second current measuring bodies 7 and 8, the plating current density distribution measuring apparatus 200 according to the second embodiment is the first. Only one current measurement body 7 is provided and the second current measurement 8 is not provided.

  On the other hand, the plating current density distribution measuring apparatus 200 according to the second embodiment enables the first current measuring body 7 to be arranged at different positions on the surface to be plated. Arrangement adjusting means 20 is provided. In FIG. 2, the arrangement adjustment is made up of an arm having the first current measuring body 7 attached to the tip thereof, and driving means (such as a motor) for moving the arm in a direction parallel to the surface of the plating solution in the plating tank. Means 20 are shown by way of example. It is preferable that the arrangement adjusting means 20 can change the position where the first current measuring body 7 is arranged two-dimensionally or three-dimensionally. By doing so, it is possible to arrange the first current measurement body 7 at an arbitrary position on the surface to be plated.

  The first current measuring body 7 is moved on the surface to be plated using the arrangement adjusting means 20 provided in the plating current density distribution measuring apparatus 200 according to the second embodiment, and the current is measured by the first current measuring means at each position. Is measured, the plating current density distribution on the surface to be plated can be measured even if the plating current density distribution measuring apparatus 200 has only one first current measuring body 7.

  In the plating current density distribution measuring apparatus 200 according to the second embodiment, the first current measurement body 7 does not adhere to the surface to be plated and is held by the arrangement adjusting means 20 so that it is relative to the surface to be plated. It is preferable that the general arrangement is fixed. Also in this case, the first measuring electrode 7 in the first current measuring body 7 has the first insulator between the surface to be plated, and the total amount of plating current in the first measuring electrode is It should flow through the third wiring 14 and be measured by the first current measuring means 15.

  It is preferable that the arrangement of the first current measuring body 7 on the surface to be plated can be changed by the arrangement adjusting means 20 during the plating process (while voltage is applied by the plating power source).

Example 1
Using a water tank (B-55 Hull Cell (Registered Trademark) parallel type water tank) manufactured by Yamamoto Metal Testing Co., Ltd., an anode made of pure zinc of 70 mm × 65 mm (thickness 2 mm), and 100 mm × 65 mm (thickness 0. 2 mm) of the phosphor-deoxidized copper C1220 was placed in the water tank so that one of the long sides was in contact with the bottom surface of the water tank.

No. 1 is used for this member to be plated. Six current measuring bodies 1 to 6 were attached. Specifically, each current measurement body was arranged so that the center of each current measurement body was at the next position with respect to the upper end of the proximal short piece on the anode of the member to be plated.
No. 1: 26 mm vertically downward (hereinafter abbreviated as “downward”) from the reference point of the member to be plated, and a direction away from the short piece on the anode proximal side in the horizontal direction (hereinafter abbreviated as “rightward”). ) 6mm
No. 2: 26 mm downward from the reference point, 48 mm rightward
No. 3: 26 mm downward from the reference point, 90 mm to the right
No. 4: 59mm downward from the reference point, 6mm right
No. 5: 59 mm downward from the reference point, 48 mm rightward
No. 6: 59mm downward from the reference point, 90mm rightward
No. 1 and 4 amperometric bodies are most proximal to the anode; 3 and 6 were most distal to the anode. In any of the current measuring bodies, the measuring electrode is made of phosphorous deoxidized copper C1220, and the dimensions are 12 mm × 12 mm (thickness 0.3 mm). Nitoms T4200).

  About these electric current measurement bodies and to-be-plated members, it connected to the terminal for cathodes of a plating power source (YPP-15100A made by Yamamoto Sekin Tester Co., Ltd., the same shall apply hereinafter) so as to be parallel in electrical circuit. . The anode was also connected to the anode terminal of the plating power source. An ammeter was placed between each current measurement body and the cathode terminal so that the plating current flowing through each current measurement body could be measured.

  267 ml of zinc plating solution (Metas FZ996 series zinc plating standard composition manufactured by Yuken Industry Co., Ltd.) was poured into the water tank.

  A rod-shaped stirrer having a major axis of 30 mm is disposed at a position on the bottom surface of the water tank 40 mm away from the center of the bottom of the anode arranged at a predetermined position in the water tank toward the member to be plated in the normal direction of the anode. The daughter was rotated at 100 rpm to stir the plating solution.

  After confirming that the temperature of the plating solution was maintained at 40 ° C., a voltage was applied from the plating power source so as to maintain a current of 2 A, and the plating current was measured for 180 seconds from the start of application.

  The result is shown in FIG. As shown in FIG. 3, the No. High current values were measured in the 1 and 4 amperometric bodies. In addition, reflecting the influence of stirring of the plating solution appropriately, No. The plating current in No. 4 is no. It became higher than the plating current in 1. The current value appropriately reflecting the distance from the anode and the influence of the agitation of the plating solution was also measured in the current measurement bodies at other positions.

(Example 2)
A member obtained by processing a free-cutting brass round bar (C3604) and having a shape shown in FIG. 4 was a member to be plated. The dimensions of the member to be plated were as follows.
Outer diameter: 64mm
Wall thickness: 18mm
One counterbore: diameter 42mm, depth 8mm
The other counterbore part: diameter 42mm, depth 4mm
Through hole: Hole diameter 10mm

The member to be plated was placed in a substantially rectangular parallelepiped plating tank having a bottom surface of 112 mm × 82 mm so that the central axis of the through hole was parallel to the short axis of the bottom surface of the plating tank. Details of the arrangement of the member to be plated in the plating tank were as follows.
Distance between central axis and bottom of through hole: 45mm
The distance between the end face provided with one counterbore and the side face of the plating tank facing this end face (hereinafter referred to as “side face 1”): 32 mm
Distance between the central axis of the through-hole and the side surface of the plating tank parallel to this: 56 mm

  Here, on the member to be plated, there are four (No. 5 to 8) current measurement bodies (measurement electrodes made of phosphorous deoxidized copper C1220 having an outer diameter of 5 mm and a thickness of 0.3 mm) on one countersink portion side. And 4 (No. 1 to 4) current measuring bodies are attached in the arrangement as shown in FIG. 5 on the other countersink side. I let you. It should be noted that, in the plating tank, No. 2 is placed in a plane parallel to the bottom surface of the plating tank including the center line of the through hole of the member to be plated. These measurement electrodes were arranged so that the centers of the measurement electrodes 1 to 3 and 5 to 7 were located. No. The measurement electrodes 4 and 8 were arranged in the plating tank so that the centers of these electrodes were located in a plane perpendicular to the bottom surface of the plating tank including the center line of the through hole of the member to be plated.

  The current measuring body and the member to be plated were connected to the cathode terminal of the plating power source while all of them were parallel in electrical circuit. The two anodes were also connected to the anode terminal of the plating power source. An ammeter was placed between each current measurement body and the cathode terminal so that the plating current flowing through each current measurement body could be measured.

  After confirming that the temperature of the plating solution was maintained at 40 ° C., a voltage was applied from the plating power source so as to maintain a current of 5 A, and the plating current was measured for 150 seconds from the start of application. During the voltage application, the plating solution was not stirred.

  The result is shown in FIG. As shown in FIG. 6, the No. High current values were measured in 4 and 8 amperometric bodies. In addition, No. which is expected to have a low current value theoretically. A low current value was measured in 6 current measuring bodies. No. Since 1 and 5 are close in the arrangement in the water tank, a very similar tendency of fluctuation of the current value was obtained.

(2) a second insulator and a second measurement electrode formed on one surface thereof, wherein the second measurement electrode and the first measurement electrode are not in contact with each other; A second current measuring body arranged so that the second insulator faces the surface of the member to be plated; the cathode terminal of the plating power source and the second measuring electrode; A fourth wiring electrically connecting the second measuring electrode, the first measuring electrode, and the member to be plated so as to form a parallel relationship; and a second wiring disposed on the fourth wiring. The apparatus according to (1), further comprising a current measuring unit.

(3) The apparatus according to (1) or (2), further including an arrangement adjusting unit that enables the first current measurement body to be arranged at an arbitrary position on the surface to be plated. .

Claims (6)

Plating tank;
An anode and a member to be plated, at least a portion of which is disposed below the liquid surface of the plating solution stored in the plating tank;
A first insulator and a first measuring electrode formed on one surface thereof are provided so that the first insulator is opposed to a part of the surface to be plated of the member to be plated. A first amperometric body disposed;
Plating power supply;
First wiring for electrically connecting the anode terminal of the plating power source and the anode;
A second wiring for electrically connecting the cathode terminal of the plating power source and the member to be plated;
A third wiring for electrically connecting the cathode terminal of the plating power source and the first measurement electrode so that the first measurement electrode and the member to be plated are in a parallel relationship; and A plating current density distribution measuring apparatus comprising a first current measuring means disposed on the third wiring. A member to be plated, comprising a second insulator and a second measurement electrode formed on one surface thereof, wherein the second measurement electrode and the first measurement electrode are not in contact with each other. A second measuring electrode arranged so that the second insulator faces the surface to be plated with;
The cathode terminal of the plating power source and the second measurement electrode are electrically connected so that the second measurement electrode, the first measurement electrode, and the member to be plated form a parallel relationship. The apparatus according to claim 1, further comprising: a fourth wiring; and second current measuring means disposed on the fourth wiring.   The apparatus according to claim 1, further comprising an arrangement adjusting unit that enables the first current measurement body to be arranged at a plurality of positions on a surface to be plated. When a voltage is applied between an anode in a plating solution and a member to be plated, a method of measuring a plating current density distribution on a surface to be plated of the member to be plated,
An electrode for measurement is arranged through an insulator on a part of the surface to be plated,
Electrically connecting the anode and the anode terminal of the plating power source;
Electrically connecting the plated member and the measurement electrode to the cathode terminal of the plating power source so that they have a parallel relationship;
Apply a voltage from the plating power source, measure the plating current flowing through the measurement electrode,
A method for measuring a plating current density distribution, wherein information relating to a plating current density of a portion where the measurement electrode is arranged on a surface to be plated is obtained based on the measured plating current.   Prepare a plurality of measurement electrodes, place the plurality of measurement electrodes in non-contact with each other on different parts of the surface to be plated, and individually measure the plating current flowing through the plurality of measurement electrodes. The measurement method according to claim 4, wherein information relating to a plating current density in each of different portions of the surface to be plated is obtained.   By changing the arrangement of the surface to be plated of the measurement electrode, using one measurement electrode, the plating current is measured at a plurality of positions on the surface to be plated, The measurement method according to claim 4 or 5, wherein information relating to a plating current density at each of the plurality of positions is obtained.

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