JP2013054213A - Method for manufacturing optical transmission line fixing member including through-electrode - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical transmission line fixing member that includes through-electrodes, can be electrically connected with a photoelectric conversion element array member, and serves as an electronic component, and to provide an optical transmission line fixing member that includes through-electrodes, into which optical transmission lines can be easily inserted, and that can align the optical transmission lines with high accuracy.SOLUTION: A substrate 1 includes first through-holes and second through-holes formed therein in a thickness direction. With openings on both sides of the second through-holes covered, a conductive material is disposed on side walls of the first through-holes by electrolytic plating to form through-electrodes 10. A conductive material is disposed on at least one side of the substrate by electrolytic plating to form wiring parts 20 to be electrically connected with the through-electrodes, thereby manufacturing an optical transmission line fixing member 100. The optical transmission line fixing member 100 is laminated on a photoelectric conversion element array member 150 including plural photoelectric conversion elements 151 and wiring parts 157 on one side of a substrate 155 by inserting optical transmission lines 110 into the second through-holes.

Description

The present invention relates to an optical transmission line fixing member that fixes an optical transmission line such as an optical fiber, an optical waveguide, and an optical waveguide. In particular, the present invention relates to a method for manufacturing an optical transmission line fixing member having a through electrode.

Along with the spread of broadband, high-capacity high-speed communication networks using optical fibers have been built both in Japan and overseas, and have spread to ordinary homes. In communication using an optical fiber, a connection module including a member in which an array of photoelectric conversion elements is formed and a member that fixes a plurality of optical fibers is required.

The core diameter of the optical fiber is extremely thin, tens of micrometers. Therefore, in order to construct high-precision optical communication, a high-precision connection between an optical fiber and an array of photoelectric conversion elements that convert optical signals into electrical signals Is very important in the connection module. Such a connection is realized by a member for fixing a highly aligned optical fiber (hereinafter referred to as an optical transmission line fixing member).

As such an optical transmission line fixing member, Patent Document 1 discloses that the optical axis of the optical fiber and the optical axis of the planar optical waveguide are inclined at an inclination angle θ with respect to the vertical direction of the optical axis. An optical transmission line in which an optical fiber having an end face and a planar optical waveguide inclined at substantially the same angle as the inclination angle θ with respect to the direction perpendicular to the optical axis are fixed between the glass member and the silicon substrate A securing member is disclosed.

Further, in Patent Document 2, an optical transmission line fixing member provided with an alignment hole and an alignment hole are provided in order to realize the alignment of the optical axis and the distance between the optical fiber and the photoelectric conversion element simultaneously and with high accuracy. In the connection module including the photoelectric conversion element array member, it is disclosed that an alignment ball is provided between the optical transmission line fixing member and the photoelectric conversion element array member so as to be fitted into the opening of each alignment hole. Has been.

JP 2007-177751 A JP 2007-17809 A

Even in such an optical module, high functionality by high-density mounting is desired. However, the two-dimensional mounting of each member in the surface direction is reaching its limit, and in order to realize higher functionality There is a need for a three-dimensional mounting structure in which members are mounted in a direction perpendicular to the direction. However, the conventional optical transmission line fixing member only has a function of fixing an optical transmission line such as an optical fiber, and it has been difficult to achieve higher functionality. In addition, since an optical transmission line such as an optical fiber is very thin, it is difficult for the conventional optical transmission line fixing member to pass the optical transmission line through the member itself.

The present invention solves the above-described problems, and provides an optical transmission line fixing member including a through electrode that can be electrically connected to a photoelectric conversion element array member and functions as an electronic component. In addition, the present invention provides an optical transmission line fixing member including a through electrode that can be easily inserted into the optical transmission line and can be aligned with high accuracy.

According to an embodiment of the present invention, the step of preparing a substrate in which the first through hole and the second through hole are formed along the thickness direction, and the openings on both sides of the second through hole are blocked. In the state, an electroplating step of disposing a conductive material on the side wall of the first through hole by electroplating, and disposing the conductive material by electrolytic plating on at least one side of the substrate and electrically connecting to the through electrode And a step of forming a wiring portion to be provided. A method for manufacturing an optical transmission line fixing member having a through electrode is provided.

In the method for manufacturing an optical transmission line fixing member according to one embodiment of the present invention, a conductive material is disposed on at least one side of the side wall of the first through hole and the substrate in a state where the openings on both sides of the second through hole are closed. By including the electrolytic plating step to be performed, it is possible to form a through electrode in which a conductive material is disposed on the side wall of the second through hole, and a wiring portion that is electrically connected to the through electrode. For this reason, the first through hole functions as a jig that aligns and fixes the optical transmission path with high accuracy, and the wiring portion is a through hole that functions as an electronic component that enables electrical connection with the photoelectric conversion element array member. An optical transmission line fixing member provided with an electrode can be provided.

The conductive material may be disposed along a side wall of the first through hole so as to have a hollow structure having openings on both sides of the substrate.

In the method for manufacturing an optical transmission line fixing member according to an embodiment of the present invention, the conductive material is not completely filled in the first through hole, and the conductive material is disposed along the side wall of the first through hole. It is possible to reduce the manufacturing time and manufacturing cost while ensuring the conductivity of the through electrode.

The conductive material disposed on the side wall of the first through hole and the conductive material disposed on one side of the substrate may be formed simultaneously.

In the method for manufacturing an optical transmission line fixing member according to one embodiment of the present invention, the conductive material disposed on the side wall of the first through hole and the conductive material disposed on one side of the substrate are subjected to the same electrolytic plating step. By forming the through electrode, the through electrode and the wiring portion can be formed at the same time, so that the manufacturing time and manufacturing cost can be reduced.

You may further provide the process of forming the taper part from which the diameter of the opening part of the one side of the said 2nd through-hole becomes larger than the diameter of the said 2nd through-hole inside the said board | substrate.

The method for manufacturing an optical transmission line fixing member according to an embodiment of the present invention forms a tapered portion in which the diameter of the opening on one side of the second through hole is larger than the diameter of the second through hole inside the substrate. An optical transmission line fixing member provided with a through electrode that makes it easy to insert the optical transmission line into the second through-hole at the tapered portion, and aligns and fixes the optical transmission line with high precision at the second through-hole portion inside the substrate. Can be provided.

The conductive material may be formed in a thin film on the side wall of the first through hole.

The method for manufacturing an optical transmission line fixing member according to an embodiment of the present invention does not completely fill the first through hole with the conductive material but forms the conductive material in a thin film on the side wall of the first through hole. It is possible to reduce the manufacturing time and manufacturing cost while ensuring the conductivity of the through electrode.

ADVANTAGE OF THE INVENTION According to this invention, the optical transmission line fixing member provided with the penetration electrode which enables an electrical connection with a photoelectric conversion element array member and functions as an electronic component is provided.

It is a figure explaining the optical transmission line fixing member 100 of this invention which concerns on one Embodiment. It is sectional drawing which shows a mode that the optical transmission line fixing member 100 of this invention which concerns on one Embodiment was connected to the photoelectric conversion element array member 150. FIG. It is a schematic diagram explaining the manufacturing method of the optical transmission line fixing member 100 of this invention which concerns on one Embodiment. It is a schematic diagram explaining the manufacturing method of the optical transmission line fixing member 100 of this invention which concerns on one Embodiment. It is a schematic diagram explaining the manufacturing method of the optical transmission line fixing member 100 of this invention which concerns on one Embodiment. It is a schematic diagram explaining the manufacturing method of the optical transmission line fixing member 100 of this invention which concerns on one Embodiment. It is a SEM image of the optical transmission line fixing member 200 of this invention which concerns on one Example, (a) is the photograph which image | photographed the taper part 231 of the through-hole 230 from diagonally upward, (b) is an optical transmission line fixing member. It is 200 cross-sectional photographs. It is a SEM image of the optical transmission line fixing member 900 of the reference example, (a) is a photograph of the tapered portion 931 of the through-hole 930 taken obliquely from above, and (b) is a cross-sectional photograph of the optical transmission line fixing member 900. is there. It is the photograph which image | photographed the through-hole for fixing the optical transmission line of this invention which concerns on one Example from the upper direction with the optical microscope.

Hereinafter, a method for manufacturing an optical transmission line fixing member having a through electrode according to the present invention will be described with reference to the drawings. However, the method of manufacturing an optical transmission line fixing member having a through electrode according to the present invention can be implemented in many different modes, and is limited to the description of the embodiments and examples shown below. It is not something. Note that in the drawings referred to in this embodiment mode and examples, the same portions or portions having similar functions are denoted by the same reference numerals, and repetitive description thereof is omitted.

Since the conventional optical transmission line fixing member such as Patent Document 1 has an optical transmission line such as an optical fiber arranged in a direction perpendicular to the thickness direction of the substrate, the optical transmission line fixing member positively functions as an electronic component. It was difficult to perform such processing. The present inventor has arranged the optical transmission path in a direction parallel to the thickness direction of the substrate, thereby bringing the optical transmission path fixing member and the photoelectric conversion element array member into surface contact, and providing an optical transmission path fixing member provided with a wiring portion. The inventors have conceived of realizing electrical connection between the photoelectric conversion element array member and the photoelectric conversion element array member, resulting in the invention. Furthermore, the present inventor provides electrical conduction to the surface of the optical transmission line fixing member opposite to the surface on which the wiring portion is provided by disposing the through electrode on the optical transmission line fixing member, The idea was to improve functionality as an electronic component.

(Optical transmission line fixing member)
The optical transmission line fixing member according to this embodiment includes a substrate, a through-hole electrode having a hollow structure that is perforated along the thickness direction of the substrate, and a conductive material is disposed on the side wall, and along the thickness direction of the substrate. And a through hole for fixing the optical transmission line, and a wiring portion disposed on one side of the substrate and electrically connected to the through electrode.

FIG. 1 is a schematic view of an optical transmission line fixing member 100 (hereinafter referred to as an optical transmission line fixing member 100) provided with a through electrode according to an embodiment of the present invention. FIG. 1A is a perspective view of the optical transmission line fixing member 100, and FIG. 1B is a cross-sectional view of the optical transmission line fixing member 100 taken along a chain line X-X ′ in FIG. The optical transmission path fixing member 100 includes a through electrode 10, a wiring portion 20 electrically connected to the through electrode 10, and a through hole 30 for fixing an optical transmission path in the substrate 1.

As shown in FIG. 1B, the through electrode 10 is not completely filled with the conductive material 21, and only the thin film-shaped conductive material 21 is provided along the side wall of the through hole. It has a hollow structure in which both sides of the substrate are open. By having such a configuration, the through electrode 10 can reduce the time and manufacturing cost for manufacturing while ensuring the conductivity on both surfaces of the optical transmission line fixing member 100.

Further, as shown in FIG. 1B, in the optical transmission line fixing member 100, the through hole 30 for fixing the optical transmission line has a tapered portion in which the diameter of the opening on one side is larger than the diameter inside the substrate 1. 31 is provided. The tapered portion 31 is a structure for facilitating insertion of the optical transmission path into the through hole 30. The through hole 30 preferably has a diameter slightly larger than the diameter of the optical transmission path in order to function as a jig for aligning and fixing the optical transmission path with high accuracy. The diameter of the through hole 30 may be about 110% of the diameter of the optical transmission path, for example. Moreover, in the taper part 31, it is easy to insert an optical transmission line by setting the diameter of the opening on the side where the insertion of the optical transmission line is started to a value of about 150% to 300% of the diameter of the through hole 30. can do. In order to further facilitate the insertion of the optical transmission line, it is preferable that the tapered portion 31 includes a portion where the diameter is gradually increased and has a convex curved surface toward the outside of the substrate 1. It is preferable that the part where the diameter gradually increases is 2/3 or less of the entire depth value of the through hole.

(Optical module)
An optical module includes a through electrode formed along a thickness direction of a substrate and a plurality of through holes for fixing the optical transmission channel, and an optical transmission channel having wiring portions electrically connected to the through electrode on both sides of the substrate A fixing member and a photoelectric conversion element array member having a plurality of photoelectric conversion elements and wiring portions on one side of the substrate are laminated, and the wiring portion of the optical transmission path and the wiring portion of the photoelectric conversion element array member are bumped. The plurality of through holes are arranged at positions corresponding to the plurality of photoelectric conversion elements. An optical transmission line is inserted into each of the plurality of through holes.

FIG. 2 is a cross-sectional view showing a state where the optical transmission line fixing member 100 according to one embodiment of the present invention is connected to the photoelectric conversion element array member 150. For example, the photoelectric conversion element array member 150 has a structure in which a support substrate 155 supports an array member 153 in which the photoelectric conversion elements 151 are disposed. Further, the photoelectric conversion element array member 150 includes a wiring portion 157 on the connection surface with the optical transmission line fixing member 100. The optical transmission path 110 is inserted into the through hole 30 from the tapered portion 31 of the optical transmission path fixing member 100 and fixed. An adhesive or the like may be used for fixing the optical transmission line 110. The optical transmission path 110 is connected to the photoelectric conversion element 151 disposed in the photoelectric conversion element array member 150, and transmits and receives an optical signal to and from the photoelectric conversion element 151.

The photoelectric conversion element 151 is an element that converts an optical signal and an electrical signal, and a known element can be used. Although not shown, the photoelectric conversion element 151 and the wiring portion 157 are electrically connected. Further, the photoelectric conversion element array member 150 may include a through electrode, and an electric signal from the photoelectric conversion element 151 may be taken out from the back surface of the photoelectric conversion element array member 150. In the present embodiment, the wiring part 20 disposed on the optical transmission line fixing member 100 and the wiring part 157 disposed on the photoelectric conversion element array member 150 are electrically connected via the bumps 170. Can do. By having such a configuration, in the present embodiment, for example, an electrical signal from the photoelectric conversion element 151 can be taken out from the photoelectric conversion element array member 150 via the optical transmission line fixing member 100, and The electric signal input through the optical transmission line fixing member 100 can be supplied from the photoelectric conversion element 151 to the optical transmission line 110 as an optical signal.

The optical transmission line fixing member 100 according to the present embodiment is provided with a tapered portion 31 for inserting the optical transmission line 110 on the surface opposite to the surface of the substrate 1 on which the wiring portion 20 is formed. The optical transmission line 110 does not directly touch the wiring unit 20 when the transmission line 110 is inserted. Therefore, when the optical transmission line 110 is inserted into the through hole 30, damage to the wiring part 20 due to the optical transmission line 110 can be prevented.

As described above, the optical transmission line fixing member according to the present embodiment can be electrically connected to the photoelectric conversion element array member, and the optical transmission line fixing member can function as an electronic component. Moreover, the optical transmission line fixing member according to the present embodiment can be easily inserted into the optical transmission line and can be aligned with high accuracy.

(Production method)
A method for manufacturing the optical transmission line fixing member 100 according to the embodiment of the present invention described above will be described below. For manufacturing the optical transmission line fixing member of the present invention, known semiconductor manufacturing methods and materials can be used. In particular, MEMS manufacturing methods and materials can be suitably used. 3 to 6 are schematic views illustrating a method for manufacturing the optical transmission line fixing member 100. FIG.

A substrate 1 for the optical transmission line fixing member 100 is prepared. The substrate 1 fixes an optical transmission path to be inserted and serves as an interposer core. Although there is no restriction | limiting in the thickness of the board | substrate 1, it considers a handleability and it is preferable to set it as the range of 100 micrometers-800 micrometers, for example. In the present embodiment, the substrate 1 is not particularly limited, but a semiconductor substrate such as silicon, silicon carbide, and gallium arsenide, an insulating substrate such as glass, sapphire, quartz, and resin can be used. In particular, it is preferable to use a silicon substrate suitable for fine processing by dry etching (FIG. 3A).

A resist 51 is applied on both surfaces of the substrate 1 (FIG. 3B) to form a mask 53 and a mask 53 '. The silicon substrate 1 is etched using the mask 53 until the mask 53 ′ formed on the opposite side is exposed (FIG. 3C), and the through hole 15 for the through electrode 10 and the through hole for fixing the optical transmission line A through hole 35 to be 30 is formed. What is necessary is just to set the diameter of the through-hole 15 suitably according to a specification, for example, it is good also as the range of 10 micrometers-200 micrometers. The diameter of the through hole 35 may be set larger than the diameter of the optical transmission line to be inserted. Thereafter, the mask 53 and the mask 53 'are removed, and the substrate 1 provided with the through holes 15 and the through holes 35 is obtained (FIG. 3D). For etching, DRIE (Deep Reactive Ion Etching) can be suitably used. In the present embodiment, since the MEMS manufacturing technique as described above is used, the positional accuracy and processing accuracy of the through hole 15 and the through hole 35 are high. Therefore, the alignment of the optical transmission path fixed to the through hole 30 can be made highly accurate.

Subsequently, a film-like resist 51 called a so-called photosensitive dry film resist is laminated on both surfaces of the substrate 1 in which the through holes 15 and the through holes 35 are formed (FIG. 4A), and a conductive material is applied by photolithography. A mask 53 and a mask 53 ′ are formed by opening the positions to be disposed (FIG. 4B). Here, the mask 53 is for forming the tapered portion 31 of the through hole 30, and is formed at the position of the through hole 35 so as to have a diameter of about 150% to 300% of the diameter of the through hole 30. .

Dry etching is performed on the surface of the substrate 1 on which the mask 53 'is formed (FIG. 4C). In the present embodiment, in order to further facilitate the insertion of the optical transmission line, the tapered portion 31 is formed so as to include a portion that gradually increases in diameter and to be convex toward the outside of the substrate 1. It is preferable to irradiate ions anisotropically while using an isotropic etching gas. The tapered portion 31 can be formed by controlling such a balance between isotropic property and anisotropy.

In etching using a normal isotropic etching gas, an undercut is formed under the mask, and an isotropic etching surface having a convex curved surface is formed inside the substrate in a cross-sectional view. On the other hand, for example, when the directivity of the etchant is increased, an etching surface with high illegality close to vertical is formed in a cross-sectional view. It can be seen that the etched surface changes by controlling the directivity of the etchant. Therefore, by controlling the directivity of the etchant to realize a state in which the anisotropic component is richer than the isotropic component, the curved surface includes a portion that gradually expands and has a convex shape outside the substrate. Thus, the tapered portion 31 can be formed. It is preferable that the part where the diameter gradually increases is 2/3 or less of the entire depth value of the through hole.

For example, it can be realized by using sulfur hexafluoride (SF ₆ ) or the like as an isotropic etching gas and by increasing the high-frequency power and increasing the pressure (low vacuum condition) compared to normal DRIE. . By adjusting these conditions and the processing time, the tapered portion 31 having a desired curvature can be formed. The mask 53 and the mask 53 ′ are removed from the substrate 1 in which the tapered portion 31 is formed in the through hole 35 (FIG. 4D). The opening diameter on the optical transmission line insertion side of the through hole 35 expanded in diameter by the tapered portion 31 is formed to be about 150% to 300% of the diameter of the through hole 35.

Next, an insulating film (for example, SiO ₂ ) 3 is formed on the substrate 1 by thermal oxidation or CVD (FIG. 5A). Although there is no restriction | limiting in the thickness of the insulating film 3, It is good to set so that desired electrical insulation may be obtained, for example, it is good to set it as the range of 0.1 micrometer-2 micrometers. The substrate 1 on which the insulating film 3 is formed forms a seed layer 61 for subsequent electrolytic plating (FIG. 5B). As the seed layer 61, a layer in which a barrier layer (also serving as an adhesion layer) and a conductive layer are stacked, a layer in which the conductive layer is a single layer, or the like can be used. Ti, TiN, Cr, or the like can be used as the barrier layer (also serving as an adhesion layer). As the conductive layer, Cu, Au, or the like can be used. Typically, the seed layer 61 can be composed of a Ti layer on the substrate 1 side and a Cu layer (hereinafter referred to as Cu / Ti layer), a Cu layer / TiN layer, a Cu / Cr layer, or the like thereon. Although there is no restriction | limiting in the thickness of the seed layer 61, For example, it is good to set it as the range of 0.1 micrometer-1 micrometer. Depending on the thickness of the substrate 1, the seed layer 61 may be formed from both sides of the opening of the through hole 15 in order to form the seed layer 61 on the entire side wall of the through hole 15. The film formation method of the seed layer 61 can be appropriately selected from vacuum film formation methods such as PVD and sputtering.

A film-like resist 51 called a so-called photosensitive dry film resist is laminated on both surfaces of the substrate 1 on which the seed layer 61 is formed (FIG. 5C), and the position where the conductive material is disposed is opened by photolithography. A mask 55 is formed (FIG. 5D). Here, the mask 55 is for forming the wiring part 20 by disposing the thin-film conductive material 21 on the side surface of the through electrode 10. Electrolytic plating for supplying power to the seed layer 61 is performed to dispose the conductive material 21 on the side wall of the through hole 15 and the substrate 1, thereby forming the through electrode 10 and the wiring portion 20 (FIG. 6A). As the conductive material 21, for example, copper (Cu), gold (Au), or the like can be used. Of these, copper (Cu) is preferable because of its low material cost. Although the conductive material may be disposed so as to fill the through hole 15, it is preferable in terms of production efficiency that the thin film-shaped conductive material 21 is disposed along the side wall of the through hole 15. Although there is no restriction | limiting in the thickness of the electrically conductive material 21, For example, it is good to set it as the thin film form of the range of 1 micrometer-20 micrometers. Preferably, a thin film in the range of 5 μm to 15 μm is used.

The arrangement of the conductive material 21 on the side wall of the through hole 15 and the substrate 1 may be performed in separate steps, but the production efficiency is improved by performing the same electrolytic plating step. In addition, since the conductive material 21 is disposed on the side wall of the through hole 15 and the substrate 1 in the same electrolytic plating process, the thickness of each conductive material has substantially the same value. Thereafter, the mask 55 is removed from the substrate 1 (FIG. 6B). By doing in this way, the through-hole 30 for optical transmission line fixation in which the electrically conductive material 21 is not arrange | positioned is formed. In the present embodiment, the example of the through hole 30 in which the seed layer 61 is formed in the through hole 35 is shown, but the through hole for fixing the optical transmission line of the optical transmission line fixing member 100 according to the present invention is an optical transmission line. It suffices if the transmission path can be aligned and fixed with high accuracy, and the seed layer 61 need not be formed.

If necessary, a multilayer wiring layer (not shown) is further formed on the substrate 1 to obtain the optical transmission line fixing member 100. A multilayer wiring layer (not shown) can be formed using a known build-up wiring forming technique. A multilayer wiring layer (not shown) may be formed on both sides of the substrate 1. Furthermore, an electrode pad or the like can be arbitrarily produced.

As described above, the method for manufacturing an optical transmission line fixing member according to the present embodiment enables an electrical connection with the photoelectric conversion element array member, and an optical transmission line fixing member including a through electrode that functions as an electronic component. Can be provided. Moreover, the optical transmission line fixing member according to the present embodiment can provide an optical transmission line fixing member including a through electrode that can be easily inserted into the optical transmission line and can be aligned with high accuracy.

About the manufacturing method of the optical-transmission-path fixing member provided with the penetration electrode which concerns on this invention mentioned above, the principal part of invention is demonstrated in detail using an Example.

A first through hole for forming a through electrode was formed as a rectangular opening of 150 μm × 160 μm and a second through hole for fixing an optical fiber was formed as a circular opening of φ90 μm on a silicon substrate having a thickness of 500 μm by DRIE. A dry film resist (manufactured by Nichigo Morton) was laminated on both sides of the silicon substrate, and the periphery of the second through hole was opened by photolithography. The opening of the dry film resist was φ180 μm. Using this dry film resist as a mask, etching was performed using SF ₆ as an isotropic etching gas.

Etching was performed under the following conditions.
[Etching conditions]
Gas flow rate: 500sccm
Processing pressure: 2-3 Pa
RF power supply: 600W
Processing time: 15 minutes

A tapered portion was formed as described above. FIG. 7 is a scanning electron microscope (SEM) image of the optical transmission line fixing member 200 according to the example, and FIG. 7A is a photograph of the tapered portion 231 of the through hole 230 taken obliquely from above ( b) is a cross-sectional photograph of the optical transmission line fixing member 200. It can be seen that a processed surface similar to the etched surface by isotropic etching appears from the surface of the etched silicon substrate 1 to a depth of about 20 μm to 30 μm. This area is referred to as a first area 231a. At a deeper position of the through hole 230 than the first region 231a, the shape includes a part that gradually increases in diameter and is convex toward the outside of the substrate. This area is referred to as a second area 231b. In the second region 231b, the opening on the side where the etching is started has a diameter of about φ180 μm, includes a portion that gradually increases in diameter as shown in the figure, and has a shape that is convex toward the outside of the substrate. I can confirm.

(Reference example)
As a reference example, the etching treatment time was 5 minutes under the same conditions as in the example. It is a SEM image of the optical transmission line fixing member 900 of the reference example, (a) is a photograph of the tapered portion 931 of the through-hole 930 taken obliquely from above, and (b) is a cross-sectional photograph of the optical transmission line fixing member 900. is there. Compared with the example, in the reference example, the etched surface in which the etching was performed has a processed surface similar to the anisotropic etching, and the first region 931a has a shape having a corner portion by the etching. An edge 931c is observed at the boundary between the region 931a and the second region 931b. Moreover, in the 2nd area | region 231b, the hole diameter is comparable and the site | part which expands gradually is not observed notably.

FIG. 9 is a photograph of the through hole taken from above with an optical microscope. In the optical transmission line fixing member 200 of the embodiment, since the surfaces of the first region 231a and the second region 231b of the tapered portion 231 are smoothly connected, when the through hole 230 is observed from above, the first region 231a The boundary of the second region 231b is not observed as an edge. On the other hand, in the optical transmission line fixing member 900 of the reference example, an annular line is observed at the boundary between the first region 931a and the second region 931b of the tapered portion 931, and it can be seen that an edge 931c exists. Therefore, in the optical transmission line fixing member 200 of the embodiment, since the tapered portion 231 has the shape as described above, the inserted optical fiber is guided into the through hole 230 using the tapered portion 231 as a guide, and easily It is considered that an optical fiber can be inserted.

1: Substrate, 10: Through electrode, 15: Through hole, 20: Wiring part, 21: Conductive material, 30: Through hole, 31: Tapered part, 35: Through hole, 51: Resist, 53: Mask, 53 ′: Mask: 55: Mask, 61: Seed layer, 100: Optical transmission path fixing member, 110: Optical transmission path, 150: Photoelectric conversion element array member, 151: Photoelectric conversion element, 153: Array member, 155: Support substrate, 157 : Wiring part, 170: Bump, 200: Optical transmission line fixing member, 230: Through hole, 231: Tapered part, 231a: First region, 231b: Second region, 900: Optical transmission line fixing member, 930: Through hole 931: Tapered portion, 931a: first region, 931b: second region, edge: 931c

Claims (5)

Preparing a substrate in which a first through hole and a second through hole are formed along a thickness direction;
An electrolytic plating step of forming a through electrode by disposing a conductive material on the side wall of the first through hole by electrolytic plating in a state where the openings on both sides of the second through hole are closed;
Disposing a conductive material on at least one side of the substrate by electrolytic plating to form a wiring portion electrically connected to the through electrode;
The manufacturing method of the optical-transmission-path fixing member provided with the penetration electrode characterized by comprising. 2. The through electrode according to claim 1, wherein the conductive material is disposed along a side wall of the first through hole so as to form a hollow structure having openings on both sides of the substrate. Manufacturing method of optical transmission line fixing member. 3. The through electrode according to claim 1, wherein the conductive material disposed on the side wall of the first through hole and the conductive material disposed on one side of the substrate are formed simultaneously. A manufacturing method of an optical transmission line fixing member provided. 4. The method according to claim 1, further comprising a step of forming a tapered portion in which a diameter of an opening on one side of the second through hole is larger than a diameter of the second through hole inside the substrate. A manufacturing method of an optical transmission line fixing member provided with the penetration electrode according to one. The method of manufacturing an optical transmission line fixing member having a through electrode according to claim 4, wherein the conductive material is formed in a thin film shape on a side wall of the first through hole.