JP2013045893A5 - - Google Patents

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Publication number
JP2013045893A5
JP2013045893A5 JP2011182711A JP2011182711A JP2013045893A5 JP 2013045893 A5 JP2013045893 A5 JP 2013045893A5 JP 2011182711 A JP2011182711 A JP 2011182711A JP 2011182711 A JP2011182711 A JP 2011182711A JP 2013045893 A5 JP2013045893 A5 JP 2013045893A5
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JP
Japan
Prior art keywords
hole
electronic device
coating layer
cavity
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011182711A
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English (en)
Japanese (ja)
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JP2013045893A (ja
JP5773153B2 (ja
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Priority to JP2011182711A priority Critical patent/JP5773153B2/ja
Priority claimed from JP2011182711A external-priority patent/JP5773153B2/ja
Publication of JP2013045893A publication Critical patent/JP2013045893A/ja
Publication of JP2013045893A5 publication Critical patent/JP2013045893A5/ja
Application granted granted Critical
Publication of JP5773153B2 publication Critical patent/JP5773153B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011182711A 2011-08-24 2011-08-24 電子装置およびその製造方法、並びに発振器 Expired - Fee Related JP5773153B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011182711A JP5773153B2 (ja) 2011-08-24 2011-08-24 電子装置およびその製造方法、並びに発振器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011182711A JP5773153B2 (ja) 2011-08-24 2011-08-24 電子装置およびその製造方法、並びに発振器

Publications (3)

Publication Number Publication Date
JP2013045893A JP2013045893A (ja) 2013-03-04
JP2013045893A5 true JP2013045893A5 (enrdf_load_stackoverflow) 2014-08-21
JP5773153B2 JP5773153B2 (ja) 2015-09-02

Family

ID=48009565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011182711A Expired - Fee Related JP5773153B2 (ja) 2011-08-24 2011-08-24 電子装置およびその製造方法、並びに発振器

Country Status (1)

Country Link
JP (1) JP5773153B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106687407B (zh) * 2014-06-16 2019-06-18 埃普科斯股份有限公司 微电子封装和制造微电子封装的方法
JP2016138778A (ja) 2015-01-27 2016-08-04 セイコーエプソン株式会社 電子デバイス、圧力センサー、高度計、電子機器および移動体
US10662055B2 (en) 2017-04-27 2020-05-26 Seiko Epson Corporation MEMS element, sealing structure, electronic device, electronic apparatus, and vehicle

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4808971B2 (ja) * 2005-01-13 2011-11-02 日本電信電話株式会社 微細構造体の製造方法
JP5207547B2 (ja) * 2009-04-06 2013-06-12 太陽誘電株式会社 電子デバイスおよびその製造方法

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