JP2013042080A - Apparatus for manufacturing electronic component, and method for manufacturing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for manufacturing an electrode of a desired shape with high efficiency without producing air accumulation in the electrode.SOLUTION: An electrode formation section includes: a paste tank 3 in which a conductive paste 2 is stored; two guide rollers 4a and 4b that rotate in the arrow A direction; a coating belt 5 that is stretched around the guide rollers 4a and 4b and cyclically runs in the arrow B direction; and a layer thickness adjustment member 6 disposed near one of the guide rollers 4a. A paste layer 7 is formed on an upper surface of the coating belt 5. A component body 1 held by a first holding member 8 is conveyed in the direction Cin synchronization with the traveling speed of the coating belt 5. An end portion 1a of the component body 1 comes in contact with the paste layer 7 and is immersed in the paste layer 7, thereby the end portion 1a is coated with the conductive paste.

Description

  The present invention relates to an electronic component manufacturing apparatus and an electronic component manufacturing method, and more specifically, an electronic component manufacturing apparatus such as a multilayer ceramic electronic component in which an electrode is formed at an end of a component element body, and an electronic component manufacturing method About.

  In an electronic component such as a multilayer ceramic electronic component, external electrodes are usually formed at both ends of a component body that is a ceramic sintered body. Various methods for forming the external electrode have been proposed.

  For example, in Patent Document 1, a belt is provided to endlessly circulate around a drive roller or the like, and the belt is passed through a paste tank containing electrode paste in the middle of the circulation. Apply a paste on the surface side to form a paste layer with a set thickness, and press and dip one side of the material bar into the paste layer at the horizontal position of the belt on which the paste layer is formed. Prepare to apply the paste to the set width, let the belt that has finished applying the paste to the material bar pass through the strainer above the paste tank, scrape the paste on the belt surface and remove foreign matter in the scraped paste In the meantime, there has been proposed an electrode application means for chip-type electronic components which is returned to the paste tank.

  In Patent Document 1, a belt is wound endlessly on a driving roller, a paste layer is formed on the belt surface, and one end surface of the component body is pressed and immersed in the paste layer at a horizontal position of the belt on which the paste layer is formed. The paste is applied to the end face. Moreover, in this patent document 1, while passing a belt through a paste tank and adjusting the layer thickness of a paste with a squeegee, the paste layer of uniform thickness is formed in the belt surface.

JP 09-283111 A (Claim 1)

However, in Patent Document 1, when the conductive paste is applied to the end portion of the component body, the end portion is immersed in the paste layer from the vertical direction with respect to the belt. Therefore, the following (1) to (3) There was a problem as shown in. That is,
(1) For example, in the case of a multilayer ceramic capacitor, a ceramic green sheet on which a paste layer is formed is laminated, and this is sandwiched and pressure-bonded with a ceramic green sheet on which no paste layer is formed, thereby producing a chip molded product. The chip molded product is fired to form a component body in which internal electrodes are embedded. In this case, since the shrinkage rate during firing differs between the paste layer serving as the internal electrode and the ceramic green sheet serving as the ceramic layer, the end surface 101a of the component body 101 has a concave shape as shown in FIG. It becomes.

  And in patent document 1, as shown in FIG.7 (b), as for the component element | base_body 101, the end surface 101a is perpendicular | vertical as shown by the arrow b with respect to the paste layer 103 on the belt 102 which runs in the arrow a direction. Since it is immersed from the direction, the air 104 is trapped inside the concave end surface 101a, and an air pocket is easily generated. For this reason, as shown in FIG. 7C, when the component body 101 is pulled up in the direction of the arrow c, the air 104 is pushed downward, and as a result, as shown in FIG. If air 104 remains in the substrate and is subjected to a drying process in a subsequent process, the air may burst and the quality may be deteriorated.

(2) In Patent Document 1, as shown by an arrow b in FIG. 8A, the component body 111 is immersed in the paste layer 103 from the vertical direction, and as shown by an arrow c in FIG. 8B. Since the component element body 111 is pulled up in the vertical direction, the interface between the end surface 111a of the component element body 111 and the paste layer 103 may be in a vacuum state. For this reason, the paste layer 103 is spread over the entire end surface 111a. It becomes difficult to adhere.

  Accordingly, when the component body 111 is pulled up at a high speed, as shown in FIG. 8C, the paste is not applied to the entire end face, and there is a possibility that a portion where the electrode 112 is not formed in the end face 111a may occur. For this reason, in Patent Document 1, it is necessary to pull up the component element body 111 at a low speed so that the electrode 112 wraps around the entire end face, which is inferior in productivity.

(3) In Patent Document 1, as shown in FIG. 9A, the component body 121 is indicated by an arrow b in a state where the belt 101 having the paste layer 103 formed on the surface is circulated in the direction of the arrow a. It is pressed and immersed in the paste layer 103 from the vertical direction. For this reason, the paste layer 103 is dammed by the pressure immersion of the component element body 101 into the paste layer 103, and as shown in FIG. 9B, the thickness of the electrode 122 may be non-uniform.

  The present invention has been made in view of such circumstances, and an electronic component manufacturing apparatus and an electronic component manufacturing apparatus capable of manufacturing an electrode having a desired shape with high efficiency without causing air accumulation in the electrode. An object is to provide a manufacturing method.

  In order to achieve the above object, an electronic component manufacturing apparatus according to the present invention includes an electrode application processing unit that applies an electroconductive paste to an end portion of a component body formed in a substantially rectangular parallelepiped shape to form an electrode. An apparatus for manufacturing an electronic component, wherein the electrode formation processing unit is formed with a plurality of guide rollers to be rotated and a paste layer containing conductive powder formed on the surface, and is wound around the plurality of guide rollers. The component body held by the holding member, having an application belt that circulates between the guide rollers, and a holding member that holds the component body and conveys it in the same direction as the traveling direction of the paste layer. The end of the contact member is in contact with the paste layer during conveyance of the holding member, and an electrode is formed on the end of the component body.

  In the electronic component manufacturing apparatus of the present invention, the electrode formation processing unit includes a paste tank that stores the conductive paste, and a layer thickness adjusting member that adjusts a layer thickness of the paste layer formed on the coating belt. The coating belt is immersed in the conductive paste stored in the paste tank and the conductive paste is attached thereto, and the paste layer is formed of the conductive paste attached to the coating belt. It is preferable that the layer thickness is adjusted by the thickness adjusting member.

  Furthermore, the electronic component manufacturing apparatus of the present invention includes an electrode finishing processing unit that performs shape finishing of the electrode formed with the electrode by the electrode forming processing unit, and the electrode finishing processing unit includes a conveyance direction of the holding member and It has a scraping roller that rotates in the same direction, and it is preferable that a part of the paste adhering to the end face of the electrode is scraped off by the scraping roller.

  In the electronic component manufacturing apparatus of the present invention, it is preferable that the holding member is conveyed in the same direction as the traveling direction of the paste layer in synchronization with the traveling speed of the coating belt.

  In the electronic component manufacturing apparatus of the present invention, it is preferable that the electrode formation processing unit includes a lifting unit that lifts and lowers the coating belt.

  In the electronic component manufacturing apparatus according to the present invention, it is preferable that a plurality of the lifting means are provided.

  The electronic component manufacturing method according to the present invention is a method for manufacturing an electronic component including a paste application step in which an electrode is formed by applying a conductive paste to an end of a component body formed in a substantially rectangular parallelepiped shape. In the paste coating step, a paste layer made of a conductive paste is formed on the surface of the coating belt, the coating belt is caused to travel in a predetermined direction, and the component body is moved in the same direction as the coating belt. The electrode is formed by conveying the sheet body in synchronization with the traveling speed, bringing the end of the component element body into contact with the paste layer during the conveyance, and applying the conductive paste to the end part of the component element body. It is characterized by.

  Moreover, it is preferable that the manufacturing method of the electronic component of this invention includes the electrode finishing process which scrapes off a part of paste adhering to the end surface of the said electrode with a scraping roller.

  In the electronic component manufacturing method of the present invention, it is preferable that the paste application step raises and lowers the application belt to bring the end of the component element body into contact with the paste layer.

  According to the electronic component manufacturing apparatus of the present invention, the electrode formation processing unit has a plurality of guide rollers to be rotated and a paste layer containing conductive powder formed on the surface, and is wound around the plurality of guide rollers. And the application belt that circulates between the guide rollers, and the holding member that holds the component element body and conveys the same in the same direction as the traveling direction of the paste layer, and is held by the holding member The end of the element body is in contact with the paste layer during conveyance of the holding member, and an electrode is formed on the end of the component element body, so that the component element body and the application belt run in the same direction, The end of the component body contacts the coating belt. That is, since the edge of the component element body gradually contacts the paste layer from the side surface side of the component element element, the air reservoir formed on the end surface of the component element element is pushed out, and the air reservoir is left in the electrode. It can be suppressed from occurring. Further, even when the component body is separated from the paste layer, the holding member can be separated while being conveyed in the traveling direction of the coating belt, whereby the paste can be applied substantially uniformly over the entire end surface, and the desired electrode can be applied. Can be formed.

  The electrode formation processing unit includes a paste tank that stores the conductive paste, and a film thickness adjusting member that adjusts a film thickness of a paste layer formed on the coating belt. The conductive paste is soaked in the conductive paste stored in a paste tank and the conductive paste adhered to the coating belt is adjusted in layer thickness by the layer thickness adjusting member. Thus, a paste layer having a desired thickness can be formed, whereby an electrode can be formed so that a so-called folded dimension on the side surface side of the component element body also becomes a desired dimension.

  The electrode finishing processing unit further includes an electrode finishing processing unit configured to finish the shape of the electrode formed by the electrode forming processing unit, and the electrode finishing processing unit includes a scraping roller that rotates in the same direction as the conveyance direction of the holding member. A part of the paste adhering to the end face of the electrode is scraped off by the scraping roller, so that an electronic component finished to have a desired electrode thickness can be easily obtained.

  Further, the holding member is conveyed in the same direction as the traveling direction of the paste layer while being synchronized with the traveling speed of the coating belt, so that the coating belt and the holding member are synchronized with each other from the horizontal direction while the component belt is synchronized. The end is immersed in the paste layer. Accordingly, since the application time is between the component bodies being conveyed between the guide rollers, it is possible to sufficiently ensure the application time. In addition, while one holding member is transported between the guide rollers, another holding member can be sequentially inserted into the electrode forming processing section, so that the conductive paste can be applied at high speed without reducing the coating speed. Thus, productivity can be improved.

  Furthermore, when the electrode formation processing unit has an elevating means for elevating and lowering the coating belt, the paste layer and the end of the component body are run while the end of the component body is immersed. The same effect as described above can be obtained without adjusting the moving speed of the holding member and the coating belt.

  In addition, by providing a plurality of the lifting means, the contact time between the paste layer and the end of the component element body can be easily adjusted, and an electrode having a desired dimension can be easily formed.

  According to the method for manufacturing an electronic component of the present invention, the paste coating step includes forming a paste layer made of a conductive paste on the surface of the coating belt, causing the coating belt to travel in a predetermined direction, and the component body. Is conveyed in the same direction as the coating belt in synchronization with the traveling speed of the coating belt, the end of the component element body is brought into contact with the paste layer during the conveyance, and the conductive member is connected to the end of the component element body. Since the electrode is formed by applying the functional paste, the end portion of the component element body gradually contacts the paste layer from the side surface side of the component element element. Therefore, the air pocket formed on the end face of the component element body is pushed out, and the occurrence of the air pool in the electrode can be suppressed. Further, even when the component body is separated from the paste layer, it can be separated while being conveyed in the traveling direction of the coating belt, and therefore, the paste can be applied substantially uniformly over the entire end surface to form a desired electrode. It becomes possible. In addition, since the component body can be applied to the paste layer in contact with the paste layer until it is separated from the coating belt, electrode formation can be performed without reducing the coating speed, thereby reducing productivity. Nor.

  Further, by including an electrode finishing step of scraping off a part of the paste adhering to the end face of the electrode with a scraping roller, an electronic component finished to have a desired electrode thickness can be easily obtained.

  In the paste applying step, the paste is lifted up and down to bring the end of the component body into contact with the paste layer, so that the end of the component body is immersed in the same manner as described above. The layer and the end of the component body can be run in synchronization with each other, and the same effect as described above can be obtained. In addition, it is possible to easily adjust the contact time between the paste layer and the end of the component body, and it is possible to easily form an electrode having a desired dimension.

It is a perspective view which shows an example of a component element body. It is principal part sectional drawing which shows one Embodiment (1st Embodiment) of the manufacturing apparatus of the electronic component which concerns on this invention. It is other principal part sectional drawing of the said 1st Embodiment. It is a perspective view which shows an example of the electronic component manufactured with the manufacturing apparatus of the electronic component which concerns on this invention. It is a manufacturing process figure which shows the manufacturing process of an electronic component. It is principal part sectional drawing of 2nd Embodiment of the manufacturing apparatus of the electronic component which concerns on this invention. It is a figure for demonstrating the subject (the 1) of patent document 1. FIG. It is a figure for demonstrating the subject (the 2) of patent document 1. FIG. It is a figure for demonstrating the subject (the 3) of patent document 1. FIG.

  Next, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view showing an example of a component body for a multilayer ceramic capacitor used in the manufacturing apparatus of the present invention.

The component body 1 is formed of a sintered body obtained by firing a laminated body in which a plurality of ceramic layers mainly composed of BaTiO ₃ or the like and internal electrode layers (not shown) containing Ag or the like are alternately laminated. It is formed into a shape. The plurality of internal electrode layers are alternately exposed on one end surface or the other end surface so as to be electrically connected to an external electrode.

  And using the manufacturing apparatus of this invention, both end part 1a, 1b of the component element | base_body 1, ie, end surface 21a, 21b, and four side surfaces (henceforth a "side surface folding part") 22a near these end surfaces 21a, 21b. 22b, external electrodes are formed.

  FIG. 2 is a structural cross-sectional view showing an embodiment (first embodiment) of an electrode formation processing unit which is a main part of the electronic component manufacturing apparatus according to the present invention.

  The electrode formation processing unit of the manufacturing apparatus includes a paste tank 3 in which the conductive paste 2 is stored, two guide rollers 4a and 4b that are rotationally driven in the direction of arrow A, and a guide roller 4a and a guide roller 4b. And a coating belt 5 that circulates in the direction of arrow B and a blade 6 that is disposed in the vicinity of one guide roller 4a.

  In the present embodiment, the coating belt 5 is formed by impregnating a material such as glass fiber or aramid fiber with a fluororesin in a cross shape, whereby durability is good and sufficient between the guide rollers 4a and 4b. Tension can be applied, thereby suppressing vibration during conveyance.

  Then, the coating belt 5 is immersed in the conductive paste 2 so that the conductive paste 2 is attached, and the layer thickness of the conductive paste 2 is adjusted by the blade 6 to form the paste layer 7 on the upper surface of the coating belt 5. Is done. As described above, the external electrodes are formed on the end portions 1a and 1b of the component body 1, that is, the end surfaces 21a and 21b, and the side surface folded portions 22a and 22b, so that the application is applied to the side surface folded portions 22a and 22b. The thickness of the paste layer 7 is adjusted by the blade 6 so that the length becomes a predetermined dimension.

  The conductive paste 2 contains a binder resin and an organic solvent in addition to the conductive powder. The conductive powder is not particularly limited. For example, a base metal material such as Cu or Ni can be preferably used.

  In addition, the manufacturing apparatus includes a first holding member 8 that travels in the horizontal direction in synchronization with the coating belt 5 that circulates in the direction of arrow B.

  The 1st holding member 8 has the adhesion surface 8a, and the end surface 21b of the component base body 1 for electrode formation is affixed on this adhesion surface 8a. That is, the adhesive surface 8a is for attaching the component body 1, and therefore, the configuration thereof is not particularly limited as long as it has adhesiveness. For example, a double-sided tape may be attached, or a silicone elastic body may be impregnated with an adhesive. Moreover, a foaming adhesive tape may be used, and when such a foaming adhesive tape is used, the component body 1 can be easily detached from the first holding member 8 by foaming with heat. it can.

  The first holding member 8 is slidably attached to the rail-like member, holds the component body 1 while synchronizing with the traveling speed of the coating belt 5, and the traveling direction (arrows) of the first paste layer 7. (Direction B).

  And the 1st external electrode 9a is formed in the edge part 1a of the component element | base_body 1 as follows.

That is, the component body 1 held by the first holding member 8 is conveyed in the direction of the arrow C ₁ while synchronizing with the traveling speed of the application belt 5. Then, one end 1a of the component element body 1 comes into contact with the paste layer 7 and is immersed in the paste layer 7, whereby the conductive paste is applied to the end 1a. In this case, the end portion 1 a of the component element body 1 gradually contacts the paste layer 7 from the side surface side of the component element body 1. Therefore, the air pocket formed on the end surface 21a of the component element body 1 is pushed out, and the occurrence of the air pool can be suppressed.

Component body 1, as shown by the arrow C _2, away while being conveyed in the direction of travel in the same direction of the application belt 5. As a result, the conductive paste is applied substantially uniformly over the entire end surface 21a to form the first external electrode 9a.

  Moreover, since the paste layer 7 is formed with a desired thickness by the blade 6, the first external electrode 9a can be formed so that the side folded portion 22a of the component element body 1 has a desired dimension.

  The end face 21a of the component base body 1 is pressed against the coating belt 5, and the influence of vibration that may occur during operation of the coating belt 5 is avoided as much as possible by pressing the end face 21a with the coating belt 5 in this way. ing.

  Thus, in this electrode formation processing part, while synchronizing the traveling speed of the coating belt 5 and the conveying speed of the first holding member 8, the component body 1 is immersed in the paste layer from the horizontal direction at the end 1a, It contacts with the paste layer 7 until it is separated from the coating belt 5, and the conductive paste is applied to the end portion 1a. Therefore, it is possible to secure a sufficient application time, and it is possible to apply the conductive paste uniformly to the end face 21a at a high speed without reducing the application speed, thereby improving productivity.

  After the first external electrode 9a is formed on the end 1a of the component element body 1 in this way, the first external electrode 9a is subjected to an electrode finishing process, and the end face shape of the first external electrode 9a is formed. Is maintained.

  FIG. 3 is a sectional view of the structure in the electrode finishing section of the manufacturing apparatus of the present invention.

  That is, the electrode finishing processing unit of the manufacturing apparatus includes a scraping roller 10 that is rotationally driven in the direction of arrow D, a second paste tank 11 that accommodates part of the paste scraped by the scraping roller 10, And a squeegee 12 for cleaning the paste adhering to the scraping roller 10. The material of the scraping roller 10 is not particularly limited, but is preferably formed of a soft resin or a metal having good scraping accuracy so as not to damage the component body 1.

In the thus formed electrode finishing unit, as shown a first holding member 8 in the arrow E ₁ direction, it is conveyed in the same direction as the rotation direction of the scraping roller 10, the bottom surface of the first external electrodes 9a is contacted with a scraping roller 10, scraping a part of the paste which is excessively attached refers away from scraping roller 10 as it is conveyed in the arrow E ₂ direction, the end faces of the first external electrode 9a film Maintain the thickness to the specified thickness.

  A part of the paste adhering to the scraping roller 10 is scraped off and cleaned by the squeegee 12.

  Thereafter, the component body 1 is inverted, and the electrode forming process and the electrode finishing process are performed on the other end 1b as described above.

  FIG. 4 is a perspective view of the multilayer ceramic capacitor manufactured as described above. The multilayer ceramic capacitor 13 includes both end portions 1a and 1b (end surfaces 21a and 21b and side folded portions 22a, 22b), first and second external electrodes 9a and 9b are formed.

  FIG. 5 is a manufacturing process diagram showing all manufacturing processes showing the entire electronic device manufacturing apparatus according to the present invention.

  That is, in the component body supply step, as shown in FIG. 5A, the end surfaces 21b of the plurality of component bodies 1 are attached to the adhesive surface 8a of the first holding member 8 slidably attached to the rail-like member. Are held, thereby aligning the plurality of component bodies 1 and transporting the first holding member 8 to the first paste application step shown in FIG. 5B.

  On the other hand, the first paste application step includes the electrode formation processing unit described above, and a paste layer 7 is formed in advance on the upper surface of the application belt 5 facing the first holding member 8. That is, the coating belt 5 running in the direction of arrow B is immersed in the conductive paste 2 to attach the conductive paste 2 to the coating belt 7, and the conductive paste 2 attached to the coating belt 7 with the blade 6. As a result, the paste layer 7 is formed on the upper surface of the coating belt 7.

Then, the first paste coating step, the first holding member 8, the first holding member 8 is conveyed in the arrow C ₁ direction in synchronism with circulation driving of the application belt 7, paste layer 7 and the component element One end 1a of 1 is brought into contact with the paste layer 7. That is, the end portion 1a is brought into contact with the paste layer 7 and immersed from the horizontal direction, thereby forming the first external electrode 9a.

Then, to convey the first holding member 8 in the arrow C ₂ direction, is moved away from the coating belt 7, carrying the first holding member 8 to the first electrode finishing process.

In the first electrode finishing step, as shown in FIG. 5 (c), to carry the first holding member 8 in the arrow E ₁ direction, is contacted with a scraping roller 10 of the bottom surface of the first external electrodes 9a, scraping a part of the paste which is excessively attached, so as to have a predetermined thickness performs shape maintenance of the first external electrodes 9a, transports the first holding member 8 in the arrow E ₂ direction. A part of the paste adhering to the scraping roller 10 is scraped off and cleaned by the squeegee 12.

  Next, in the first drying step, as shown in FIG. 5 (d), the organic solvent contained in the first external electrode 9a is heated by using a heating means such as a far-infrared heater or a hot air heating device. Vaporize and dry.

  In the subsequent component body inversion step, as shown in FIG. 5E, the first holding member 8 holding the component body 1 is inverted by an appropriate method.

  Then, in the component body transfer step, the component body 1 is transferred to the second holding member 8 ′ as shown in FIG. 5 (f). Similar to the first holding member 8, the second holding member 8 ′ has an adhesive surface 8 a ′ and is slidably attached to the rail-shaped member, and the component body 1 is attached to the first holding member 8. To the second holding member 8 '. That is, the component main body 1 is detached from the first holding member 8, the first external electrode 9 a is attached to the adhesive surface 8 a ′ of the second holding member 8 ′, and the component body 1 is attached to the second holding member. 8 '. Then, the second holding member 8 'is driven, and the component body 1 is conveyed to the second paste application step.

  As shown in FIG. 5G, the second paste application step has a second electrode formation processing section, which is substantially the same as the first electrode formation processing section.

  That is, the second electrode formation processing unit is wound around a plurality of guide rollers 4a ′ and 4b ′ that are driven to rotate in synchronization with the arrow A ′ direction, and between the guide rollers 4a ′ and the guide rollers 4b ′. A coating belt 5 ′ that circulates in the direction of arrow B ′, a second paste tank 3 ′ in which conductive paste 2 ′ is stored, and a blade 6 ′ disposed in the vicinity of one guide roller 4 a ′. A first paste layer 7 'is formed on the upper surface of the coating belt 5'.

Then, the second holding member 8 ′ is conveyed in the direction of the arrow C ₁ ′ in synchronization with the circulation of the coating belt 5 ′ on which the paste layer 7 ′ is formed, and the other end surface of the paste layer 7 ′ and the component main body 1 is transferred. Contact 1b. Then, the second external electrode 9 b is formed at the end 1 b, and thereby external electrodes 9 a and 9 b are formed at both ends 1 a and 1 b of the component element body 1. Next, the second holding member 8 'is conveyed in the direction of the arrow C ₂ ', separated from the coating belt 5 ', and the second holding member 8' is conveyed to the second electrode finishing step.

  As shown in FIG. 5 (h), the second electrode finishing step has a second electrode finishing processing section, substantially the same as the first electrode finishing processing section.

  That is, the second electrode finishing processing section is a scraping roller 10 ′ that is rotationally driven in the direction of arrow D ′, and a second paste tank 11 ′ that receives a part of the paste scraped by the scraping roller 10 ′. And a squeegee 12 'for cleaning a part of the paste adhering to the scraping roller 10'.

Then, the second holding member 8 ′ is conveyed in the direction of the arrow E ₁ ′, the end surface of the second external electrode 9 b is brought into contact with the scraping roller 10 ′, and a part of the pasted paste is scraped off. The shape of the end face of the second external electrode 9b is adjusted to a predetermined thickness. A part of the paste adhering to the scraping roller 10 'is scraped off and cleaned by the squeegee 12'.

  Next, the second holding member 8 'is transported to the second drying step, and is heated using heating means such as a far-infrared heater and a hot air heating device as shown in FIG. The organic solvent contained in the second external electrode 9b is volatilized and dried.

  Then, in the electronic component discharging step, as shown in FIG. 5 (j), the multilayer ceramic capacitor 13 held by the second holding member 8 'is detached from the second holding member 8' and put into the tank 14. Accommodate.

  As described above, according to the present embodiment, the paste layers 7a and 7a ′ composed of the conductive pastes 2 and 2 ′ are applied in the first and second paste application steps (FIGS. 5B and 5G). Formed on the surface of the belt 5, 5 ′, the application belt 5, 5 ′ is run in the directions of arrows B, B ′, and the component body 1 is placed in the same direction as the application belt 5, 5 ′. 5 ′ is conveyed in synchronism with the traveling speed, the end portions 1a and 1b of the component body 1 are brought into contact with the paste layers 7 and 7 ′ during the conveyance, and the end portions 1a and 1b of the component body 1 are electrically conductive. Since the electrodes 2 are formed by applying the pastes 2 and 2 ', the end portions 1a and 1b of the component element body 1 gradually come into contact with the paste layers 7 and 7' from the side surfaces of the component element elements 1 and 1a. . Therefore, the air pockets formed on the end surfaces 21a and 21b of the component body 1 are pushed out, and the occurrence of air pools in the first and second external electrodes 9a and 9b can be suppressed. Further, the component body 1 can be separated from the paste layers 7 and 7 ′ while being conveyed in the traveling direction of the application belts 5 and 5 ′. Therefore, the paste can be applied substantially uniformly over the entire end surfaces 21 a and 21 b. Thus, the desired first and second external electrodes 9a and 9b can be formed. Moreover, since the component body 1 can be applied in contact with the paste layers 7 and 7 'until it is separated from the application belts 5 and 5', electrode formation can be performed without reducing the application speed. And productivity is not reduced.

  In the electrode finishing step (FIGS. 5C and 5H), a part of the paste adhering to the outer surfaces of the first and second external electrodes 9a and 9b is scraped by the scraping rollers 10 and 10 ′. Therefore, the multilayer ceramic capacitor 13 whose end face is finished to a desired electrode thickness can be easily obtained.

  FIG. 6 is a structural cross-sectional view showing a second embodiment of an electrode formation processing section in the electronic component manufacturing apparatus of the present invention.

  That is, in the second embodiment, three elevating stages 15a, 15b, and 15c are provided in a cavity defined on the back side of the surface on which the paste layer 7 of the coating belt 5 is formed.

In this second embodiment, like the first embodiment, component element 1 held by the first holding member 8, in synchronization with the running speed of the coating belt 5, the arrow C ₁ direction Be transported. When the first holding member 8 reaches above the coating belt 5, for example, the elevating member 15b is moved up and down by a driving device (not shown) to contact the component body 1, and the component body 1 is a paste layer. while immersed in 7 transported in the arrow C ₂ direction component element 1 is separated from the application belt 5. Therefore, as in the first embodiment, the air reservoir formed on the end surface 21a of the component element body 1 is pushed out, and the occurrence of the air reservoir can be suppressed. Since the component body 1 can be separated while being conveyed in the traveling direction of the coating belt 5, the paste is applied substantially uniformly over the entire end face 21a, thereby forming the first external electrode 9a. Further, since the component body 1 can apply the paste in contact with the paste layer 7 until it is separated from the application belt 5, it is possible to secure a sufficient application time, and the end face without reducing the application speed. It becomes possible to apply the conductive paste uniformly to 21a at a high speed, and the productivity is not lowered.

  In the second embodiment, the contact time of the component body 1 to the paste layer 7 can be controlled by controlling the lift time and the lift state of the lift members 15a to 15c. There is no need to adjust the contact time between the body 1 and the paste layer 7 by the conveying speed of the holding member and the traveling speed of the coating belt, and the first and second external electrodes 9a and 9b having the desired dimensions without reducing productivity. Can be formed.

  The present invention is not limited to the above embodiment. In the above embodiment, the first and second holding members 8 and 8 'have the adhesive surfaces 8a and 8a' on the surface, but they may be formed of a long tape. By driving the tape in synchronization with the coating belts 5 and 5 'of the first and second electrode formation processing sections, it becomes possible to further improve productivity.

  In the above embodiment, the multilayer ceramic capacitor is exemplified as an electronic component. However, the multilayer ceramic capacitor can be widely applied to an electronic component having an external electrode. For example, a single plate type ceramic capacitor, a coil component, an LC composite Needless to say, the present invention can be similarly applied to parts, piezoelectric parts, and the like.

  Even if the electrode is formed at the end of the component body, no air is trapped inside, and the desired electrode can be uniformly and substantially uniformly formed on the end face.

DESCRIPTION OF SYMBOLS 1 Component body 1a, 1b End part 2, 2 'Conductive paste 4a, 4b, 4a', 4b 'Guide roller 5, 5' Coating belt 6, 6 'Blade (layer thickness adjustment member)
7, 7 'paste layer 8 first holding member (holding member)
8 'second holding member (holding member)
9a First external electrode (electrode)
9b Second external electrode (electrode)
10, 10 'scraping roller 11, 11' first paste tank (paste tank)
15 Elevating stage (elevating member)

Claims (9)

An electronic component manufacturing apparatus including an electrode formation processing unit that forms an electrode by applying a conductive paste to an end portion of a component body formed in a substantially rectangular parallelepiped shape,
A plurality of guide rollers that are rotationally driven by the electrode formation processing unit;
A coating layer containing a conductive powder is formed on the surface, and is applied between the plurality of guide rollers and circulates between the guide rollers.
A holding member that holds the component element body and conveys it in the same direction as the traveling direction of the paste layer;
An electronic component, wherein an end portion of the component element body held by the holding member is in contact with the paste layer during conveyance of the holding member, and an electrode is formed at the end portion of the component element body. Manufacturing equipment. The electrode formation processing unit includes a paste tank that stores the conductive paste, and a layer thickness adjusting member that adjusts a layer thickness of the paste layer formed on the coating belt,
The coating belt is immersed in the conductive paste stored in the paste tank so that the conductive paste is adhered thereto, and the conductive paste adhered to the coating belt is adjusted by adjusting the layer thickness. The apparatus for manufacturing an electronic component according to claim 1, wherein the layer thickness is adjusted by a member. An electrode finishing processing unit for finishing the shape of the electrode formed by the electrode forming processing unit,
The electrode finishing processing unit has a scraping roller that rotates in the same direction as the conveying direction of the holding member, and a part of the paste adhering to the end face of the electrode is scraped off by the scraping roller. The electronic component manufacturing apparatus according to claim 1 or 2.   The electronic component manufacturing method according to any one of claims 1 to 3, wherein the holding member is conveyed in the same direction as a traveling direction of the paste layer while being synchronized with a traveling speed of the coating belt. apparatus.   The said electrode formation process part has a raising / lowering means to raise / lower the said application belt, The manufacturing apparatus of the electronic component in any one of Claim 1 thru | or 3 characterized by the above-mentioned.   5. The electronic component manufacturing apparatus according to claim 4, wherein a plurality of said lifting means are provided. A method of manufacturing an electronic component including a paste application step of applying an electrically conductive paste to an end portion of a component body formed in a substantially rectangular parallelepiped shape and forming an electrode,
In the paste application step, a paste layer made of the conductive paste is formed on the surface of the application belt, the application belt is run in a predetermined direction, and the component body is placed in the same direction as the application belt. Conveying in synchronization with the traveling speed, bringing the end of the component element body into contact with the paste layer during the conveyance, and applying the conductive paste to the end of the component element body to form an electrode. A method for manufacturing an electronic component.   8. The method of manufacturing an electronic component according to claim 7, further comprising an electrode finishing step of scraping off a part of the paste adhering to the outer surface of the electrode with a scraping roller.   9. The method of manufacturing an electronic component according to claim 7, wherein the paste application step raises and lowers the application belt to bring an end portion of the component element body into contact with the paste layer.

Images