JP2013041862A - Desktop soldering apparatus with pre-heating function - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a desktop soldering apparatus with a pre-heating function, capable of increasing a pre-heating effect, product quality, and productivity, without adding a new heat source device for pre-heating or increasing capacity of the apparatus.SOLUTION: A desktop soldering apparatus comprises: a solder tank 1, arranged inside a casing 9, for storing molten solder S heated by a heater; and a lifting mechanism 4 for lifting a holding base 45 which supports a substrate 52, between a lower end position where the substrate 52 is immersed in the molten solder S which is circulated by a pump 31 and jet-flowed from a discharge port 17c of a jet nozzle 17 protruded upward from the upper position of the solder tank 1 and an upper end position apart from the jet-flowed molten solder S. In the desktop soldering apparatus, a heat insulating member 6 covers a wall surface 1a which forms the solder tank 1 so as to make a passage R for which the wall surface 1a becomes a single passage wall, and a fan F is arranged at the entrance side of the passage R so that air supplied in the passage R by the fan F is heated with heat coming from the solder tank 1, becomes hot wind, and blows on a bottom surface 52a of the substrate supported by the holding base 45.

Description

  The present invention relates to a portable soldering apparatus for a desktop with preheating.

In general, electronic components are mounted on a printed circuit board or the like by applying a flux to the substrate, preheating (preheating) with a preheater, and then applying to a soldering apparatus.
Since such preheating activates the flux and improves the quality of soldering to electronic components and helps improve the quality, various inventions of soldering devices including the preheating have been proposed (for example, Patent Documents 1 to 3). 3).

JP 2003-318530 A JP 2005-167001 A Japanese Patent Laid-Open No. 11-46058

However, all of the conventional soldering apparatuses including Patent Documents 1 to 3 are large-scale automated equipment, and cannot be applied to portable desktop soldering apparatuses. All of the conventional soldering devices are continuous automation devices for mass production, and in small-lot production with a very small number of prototypes and boards, the boards are assembled into the equipment one by one and soldered. It was difficult to provide a tabletop soldering apparatus that repeatedly removes. In addition, every conventional soldering apparatus has its own preheating heat source device for providing a preheating process, and accordingly, the apparatus space is increased and the apparatus cost is increased.
On the other hand, the present applicant has previously proposed a portable type soldering apparatus (Japanese Patent Laid-Open No. 10-126049), but including this, the conventional products of the desktop soldering apparatus are equipped with a preheating device. Did not exist. Because it is a small lot production device with a very small number of prototypes and substrates, conventionally, instead of preheating, the flux-coated substrate is allowed to stand for a period of time and air-dried to remove solvents such as IPA in the flux, The solderability of the parts was improved. However, even if it is a desktop soldering device for a small variety of products, the method of leaving it for a long time to blow off the solvent such as IPA in the flux increases the tact time and causes a decrease in productivity. Furthermore, in recent years, lead-free solder has been used due to environmental problems, and its melting point tends to increase, and even a desktop soldering device has been urged to preheat at about 200 ° C. Also, regarding the flux, water flux that is friendly to the human body and the environment has been studied, and if it is allowed to stand for a while and the aqueous solvent in the flux is blown away by air drying, it differs from conventional flux using alcohol. Longer time was required, and the tact time was increased accordingly, leading to a decline in productivity.

  SUMMARY OF THE INVENTION The present invention solves the above-described problems, and is a desktop soldering device that can effectively perform preheating without newly adding a preheating heat source device and without particularly increasing the device capacity. An object of the present invention is to provide a desktop soldering apparatus with preheating that leads to quality improvement and productivity improvement.

In order to achieve the above object, the gist of the invention described in claim 1 is that a solder tank (1) for storing molten solder (S) heated by a heater (2) is provided in a casing (9), and The molten solder (S) is circulated by a pump (31), and the holding stand (45) is added to the molten solder (S) jetted from the discharge port (17c) of the jet nozzle (17) protruding above the solder tank (1). Elevating mechanism (4) that raises and lowers the holding table (45) between the lower end position where the through hole (52h) of the substrate (52) supported by the substrate (52) is immersed and the upper end position away from the molten solder (S) that flows. In a tabletop soldering apparatus provided with a heat-retaining member (6) covering the wall surface (1a) forming the solder bath (1), the wall surface (1a) is a flow path (one flow wall surface) ( R) and a fan (F) is provided on the inlet side of the flow path (R), and the air supplied into the flow path (R) by the fan (F) is heated by the heat from the solder bath. The lower surface (52 of the substrate (52) supported by the holding table (45) becomes hot air A desktop soldering apparatus with preheat, characterized in that it is sprayed onto a).
According to a second aspect of the present invention, there is provided a preheated desktop soldering apparatus according to the first aspect, wherein the heat retaining member (6) forming the outlet (R2) of the flow path (R) is a front wall portion of the solder bath (1) ( 11) and a guide wall (71) is provided between the heat retaining member (6) and the front plate (91) of the casing (9), and further, an upper portion of the guide wall (71). Is formed in the swash plate portion (71a) inclined rearward upward, and the air supplied into the flow path (R) by the fan (F) becomes hot air, and the outlet (R2) of the flow path Then, it is guided to the guide wall (71) and sprayed to the lower surface (52a) of the substrate (52) supported by the holding base (45). According to a third aspect of the present invention, there is provided a desktop soldering apparatus with preheating according to the first or second aspect, wherein a region of the front plate (91) side in which the solder tank (1) is disposed in the casing (9), and the casing ( In 9), a partition wall (72) partitioning into a rear plate (92) side region where a motor (32) for driving the pump (31) is disposed and standing in the casing (9), and the partition A hole (72a) is provided in the wall (72), and the fan (F) is provided so that the air suction port of the fan (F) is aligned with the hole (72a). According to a fourth aspect of the present invention, there is provided a preheated tabletop soldering apparatus according to the first to third aspects, wherein the tank body (1B) of the solder tank (1) has a plate-like bottom (10), front wall (11), and rear wall. A rectangular box with an upper surface consisting of a wall portion (12) and both side wall portions (13, 14), and the flow path (R) on the wall surface (1a) side at the central portion of the rear wall portion (12). An inlet (R1) is provided, and a flow path (R) that splits into two hands is provided along the rear wall (12) from the inlet (R1) in both horizontal and left and right directions. After reaching the both side walls (13, 14) respectively, proceed to the horizontal front direction along both side walls (13, 14) to reach the front wall (11), and further along the front wall (11) Proceeding in the horizontal direction, the both flow paths (R) gather at the central part of the front wall part (11), and the outlet of the flow path (R) (on the wall surface (1a) side at the central part ( R2) is provided.

(Function)
As in the first aspect of the present invention, a flow path (R) whose wall surface (1a) is a single flow path wall surface is provided, and a fan (F) is provided on the inlet side of the flow path (R). The air supplied into the flow path (R) by the heat from the solder tank (1) becomes hot air and blows to the lower surface (52a) of the substrate (52) supported by the holding base (45). If it attaches, even if it is a desktop soldering apparatus, it can be made into the desktop soldering apparatus with a preheat using the heat | fever of a soldering iron. It becomes a preheating and soldering device and contributes to quality improvement. And since the heat | fever of a solder tank is utilized for the heat source for hot air, the heat source apparatus for preheating is not newly required.
As in the second aspect of the invention, a guide wall (71) is erected between the heat retaining member (6) and the front plate (91) of the casing (9), and the upper portion of the guide wall (71) is further provided. When it is formed on the swash plate part (71a) inclined backwards upward, the hot air emitted from the channel is blown well to the lower surface (52a) of the substrate (52) supported by the holding base (45). It comes to attach.
As in the invention of claim 3, the front plate (91) side region in which the solder tub (1) is arranged in the casing (9), and a motor for driving the pump (31) by the casing (9) ( 32) is arranged on the rear plate (92) side region, and a partition wall (72) partitioning into the casing (9), and an opening (72a) is provided in the partition wall (72). When the fan (F) is provided so that the air inlet of the fan (F) is aligned with the opening (72a), the fan not only serves to send preheat supply air but also generates a motor. Also useful for heat removal.
As in the invention of claim 4, a flow path (R) that is divided into two hands is provided along the rear wall portion (12) from the entrance (R1) in both horizontal and left and right directions. After reaching both side walls (13, 14), proceed along the horizontal front side along both side walls (13, 14) to reach the front wall (11), and further horizontally along the front wall (11). The two flow paths (R) are gathered at the central portion of the front wall portion (11), and the outlet (R2) of the flow passage (R) on the wall surface (1a) side at the central portion. ) Is provided, the heat conduction area from the soldering iron becomes very large and can be preheated at about 200 ° C., and even when lead-free or aqueous flux is used, it can be sufficiently handled.

  The preheated tabletop soldering apparatus of the present invention is a portable, compact tabletop soldering apparatus that realizes preheating, which has been considered difficult, at a relatively low cost without installing a new heat source device. Moreover, preheating with high-temperature hot air is possible, and it is compatible with recent lead-free and aqueous fluxes, and exhibits excellent effects in quality stability and productivity improvement.

FIG. 2 is a schematic cross-sectional side view of the preheated tabletop soldering apparatus of the present invention. FIG. 2 is a schematic plan view taken along the line II-II in FIG. FIG. 3 is a schematic front sectional view taken along the line III-III in FIG. 1. FIG. 4 is a schematic front sectional view in which the rod of the air cylinder is retracted from the state of FIG. 3 and the through hole of the substrate is immersed in the molten solder at the discharge port. It is principal part sectional drawing of FIG. It is a disassembled perspective view which forms the surroundings of the flow-path inlet side of FIG. 1, FIG. 2 with a heat retention member. FIG. 3 is an explanatory perspective view in which the periphery of the flow path inlet of FIGS. FIG. 3 is an explanatory perspective view in which the periphery of the channel outlet in FIGS. 1 and 2 is formed by a heat retaining member.

  Hereinafter, the desktop soldering apparatus with preheating according to the present invention will be described in detail. 1 to 8 show one embodiment of a preheated tabletop soldering apparatus (hereinafter also simply referred to as “soldering apparatus”) according to the present invention. FIG. 1 is a schematic side sectional view, and FIG. Fig. 3 is a sectional view taken along the line III-III in Fig. 1 and is a schematic front sectional view. Fig. 4 is a diagram illustrating the state in which the rod of the air cylinder is retracted from the state shown in Fig. FIG. 5 is a cross-sectional view of a main part of FIG. 3, and FIGS. 6 to 8 are explanatory views of forming the flow path of FIGS. 1 and 2 with a heat insulating member. In addition, in each figure, in order to make drawing easy to understand, hatching of a cross-sectional display is partially omitted including caging, and in FIG. 6 to FIG.

The soldering apparatus includes a solder bath 1, a heater 2, a pump 31, a motor 32, an elevating mechanism 4, a heat retaining member 6, a fan F, and a casing 9.
A solder tank 1 for storing the molten solder S heated by the heater 2 is provided in the casing 9. The molten solder S is circulated by a pump 31, and the substrate 52 supported by the holding table 45 by the elevating mechanism 4 is supplied to the molten solder S jetted from the discharge port 17 c of the jet nozzle 17 protruding above the solder tank 1. The through-hole 52h moves up and down between the lower end position of FIG. 4 where it is immersed and the upper end position of FIG. In the present invention, the worker is usually standing in front of the soldering apparatus, and the front view of FIG. 3 is the front side, the front side, the back side of the paper, the rear side, the rear side, the upper side of the page, and the left side of the page. The left side, the right side of the page is called the right side, and the vertical direction of the page including the left and right horizontal lines is called the horizontal direction.

  The casing 9 is a box-shaped container having a rectangular shape in plan view as shown in FIGS. The horizontally disposed bottom plate 90 is provided with the solder tank 1 near the front plate 91, a space is secured between the solder tank 1 and the rear plate 92, and a motor for driving the pump 31 is provided in the space. It is assumed that 32 is arranged. The front plate 91, the rear plate 92, and both side plates 93 and 94 surround the periphery of the bottom plate 90 to accommodate the solder tank 1, the motor 32, and the like. The rear plate 92 is raised, bent at the upper edge thereof, and an upper plate 95 is extended forward. Further, a swash plate 96 extends from the upper plate 95 to cover the motor 32. A pump cover 97 is provided to cover the upper side of the pump 31 from the swash plate 96, while the front plate 91 is inclined upward at the upper part to become an inclined plate 911, and a horizontal rod 912 is moved backward from the upper edge of the inclined plate. Overhang. An upper surface opening is formed between the horizontal rod 912 and the pump cover 97, and the jet nozzle 17 of the solder tank 1 is disposed in the opening.

The solder tank 1 is provided with a tank body 1B for storing the molten solder S, and further, the horizontally long cylindrical portion is provided so that the molten solder S in the tank body 1B is circulated by the pump 31 and the circulating molten solder S is jetted from the discharge port 17c. 15, a vertical cylinder portion 16, and a jet nozzle 17. The tank body 1B is a rectangular box container with an upper surface comprising a plate-like bottom 10, a front wall 11, a rear wall 12, and both side walls 13, 14, and an outer gutter 1g is formed outward from the upper edge of each part. Extend.
A horizontally long tube portion 15 made of a square tube is placed horizontally, and its one end side tube port is closed with the rear wall portion 12 near the bottom portion 10, and from here, the other end side tube port is made parallel to the bottom portion 10 and both side wall portions 13 and 14. Is arranged near the front wall 11. The other end side cylinder port is closed with a lid 15d, and a discharge side port 15b is provided on the upper surface of the horizontally long cylindrical part 15 near the lid 15d, while a suction side port 15a is provided on the lower surface of the horizontally long cylinder part 15 near the rear wall part 12, A pump hole 15c is provided on the upper surface of the horizontally long cylindrical portion 15 located above the suction side port 15a. The discharge side port 15 b is arranged in the opening on the lower end side of the vertical cylinder part 16, and the vertical cylinder part 16 stands on the horizontally long cylinder part 15. The jet nozzle 17 attached to the vertical cylinder portion 16 with the lower side connection portion 17a overlapped is provided such that the jet cylinder portion 17b protrudes upward of the solder tank 1. The jet nozzle 17 can be detachably attached to the vertical cylinder portion 16, and various types of jet nozzles 17 are prepared according to the substrate 52.
Then, the support shaft of the pump 31 is inserted into the pump hole 15c, and the impeller 31a attached to the tip end portion of the support shaft is arranged in the horizontally long cylindrical portion 15, and the pump 31 operates to suck from the suction side port 15a. The molten solder S is jetted from the discharge port 17c of the jet tube portion 17b through the horizontally long tube portion 15, the discharge side port 15b, and the vertically placed tube portion 16 as indicated by the white arrows in FIG.

The heater 2 is a heat source that heats and maintains the molten solder S in the solder bath 1, and here, as shown in FIGS. Two are arranged so as to be sandwiched between the materials M.
As described above, the pump 31 circulates the molten solder S in the solder tank 1. In this embodiment, the pump 31 is installed near the rear wall portion 12 in the solder tank 1, and the motor for driving the pump 31 is used. 32 is installed outside the solder tank 1 and near the rear plate 92 in the casing 9. The pulley 33 fixed to the motor 32 and the pulley 34 fixed to the pump 31 are wound by a belt 35, and the rotation of the motor 32 causes the impeller 31a of the pump 31 disposed in the horizontally long cylindrical portion 15 to rotate, so that the jet cylinder portion The molten solder S is jetted from the discharge port 17c of 17b.
The elevating mechanism 4 includes an air cylinder 4a as an actuator and a holding base 45. Air cylinders 4 a are respectively provided near both side wall portions 93 and 94 in the casing 9. Both air cylinders 4a stand up, and a frame-shaped holding base 45 horizontally disposed so as to cross over the casing 9 is fixed to the tip of a rod 42 extending upward from the cylinder body 41 (FIG. 3).

The heat retaining member 6 is attached as a heat insulating member to the wall surface 1a of the bath body 1B related to the solder bath 1 so that the molten solder S heated by the heater 2 can be maintained.
However, in the present invention, the heat retaining member 6 and the wall surface 1a of the tank body 1B are utilized, and the fan F is further provided so that the substrate back surface 52 coated with the flux can be preheated. A heat retaining member 6 covering the wall surface 1a forming the bath body 1B of the solder bath 1 is provided with a flow path R in which the wall surface 1a becomes one flow wall surface, and a fan F ( Here, a motor fan) is provided, and the air supplied into the flow path R by the fan F is turned into hot air by the heat from the solder bath 1 and blown to the lower surface 52a of the substrate 52 supported by the holding table 45. To.

For example, the heat retaining member 6 includes a plurality of mat-like inner layer members 6a and mat-like outer layer members 6b (this embodiment). As shown in FIGS. 6 and 7, the back surfaces of the inner layer members 6 a that are vertically adjacent to each other are brought into contact with the wall surface 1 a, and the opposite end surfaces 6 a ₁ are spaced apart in the vertical direction so that a void k is formed. . By laminating the front side of the interior member 6a further outer member 6b is a lid on the front side opening port k ₁ of the cavity k, the channel R is provided.

Specifically, to separate the opposing side end face 6a ₁ according to the two of the inner layer 6a in the vertical direction, and is interposed Tanhashira inner member 6a' at both ends of both the inner layer 6a is formed in a square frame with. The both ends in the horizontal direction of the inner layer member 6a related to the square frame and the short column inner layer member 6a ′ are protruded outward from the left and right sides of the rear wall portion 12, and the square frame is attached to the surface 1a of the rear wall portion 12. A portion of the rear wall portion 12 surrounded by the square frame is exposed to the rear side and becomes a void k. The surface side opening port k ₁ of the space k, the outer layer member 6b is integrally laminated to the inner layer 6a with a lid. The board size of the rectangular outer layer member 6b is equal to the size of the square frame, and a through hole serving as the flow path inlet R1 is formed in the outer layer member 6b. An inlet R1 of the flow path R is provided in the outer layer member 6b on the wall surface 1a side at the central portion of the rear wall 12 related to the tank body 1B.
Further, in the both side wall portions 13 and 14, to separate the opposing side end face 6a ₁ according to the two of the inner member 6a adjacent to each other in the vertical, and to form a cavity k for the channel R, the both side wall portions 13 , 14 on the surface 1a. And outer layer members 6b on the surface side opening port k ₁ of the voids k are integrated laminated on both the inner layer 6a with a lid.
Thus, a flow path R that is divided into two hands is provided along the rear wall portion 12 from the entrance R1 and the two flow paths R that are divided into two hands change the direction after reaching the side wall portions 13 and 14, respectively. (Arrow of FIG. 7), it progresses in the horizontal front direction along both side wall parts 13 and 14, and goes to the front wall part 11. FIG.

Further, the two of the inner layer 6a also adjacent the upper and lower as in Fig. 8 in the front wall portion 11 side, arranged horizontally as opposed end face 6a ₁ is separated, and the short at both ends of both the inner layer 6a The column inner layer member 6a ′ is erected and interposed to form a square frame. Here, the defect 6a ₀ at the center in the longitudinal direction of the upper inner member 6a provided to a square-shaped frame. The both ends in the horizontal direction of the inner layer member 6a related to the square frame and the short column inner layer member 6a ′ are respectively protruded outward on the left and right sides of the rear wall portion 12, and the square frame is attached to the surface 1a of the rear wall portion 12. A portion of the front wall portion 11 surrounded by the square frame is exposed to the front side and becomes a void k. The surface side opening port k ₁ of the space k, the outer layer member 6b is integrally laminated to the inner layer 6a with a lid. The board size of the rectangular outer layer member 6b is equal to the size of the rectangular frame, and a through hole serving as the flow path outlet R2 is formed in the outer layer member 6b. The channel outlet R2 is provided by cutting out the center of the upper edge side of the rectangular disk-shaped outer layer member 6b into a concave shape.
Thus, the flow path R that is divided into two in both the horizontal and left and right directions is provided from the flow path inlet R1 along the rear wall portion 12, and the two flow paths R that are divided into two hands are respectively changed in direction after reaching the side wall portions 13 and 14, respectively. , Proceeding in the horizontal front direction along the side wall portions 13 and 14 to reach the front wall portion 11, further changing the direction, proceeding in the horizontal direction along the front wall portion 11, and gathering at the central portion of the front wall portion 11, The preheating channel R connected to the channel outlet R2 provided in the outer layer member 6b on the wall surface 1a side is formed at the central portion. The heat retaining member 6 and the wall surface 1a form a flow path R having a rectangular cross section. Each part of the wall surface 1a forming the flow path R is formed on the front wall portion 11, the side wall portions 13 and 14, and the rear wall portion 12 of the molten solder liquid surface S2 stored in the bag main body 1B from near the bottom portion 10. Since the heat conduction area is increased up to the vicinity of the height, the air passing through the flow path R can be smoothly transferred to the temperature of the molten solder S.

The fan F is installed on the flow path inlet R1 side, and the air supplied into the flow path R by the fan F from the solder tank 1 in which the temperature is maintained at 200 ° C. or higher through the wall surface 1a (heat Conduction) becomes hot air around 200 ° C., and the hot air is blown out to the lower surface 52a of the substrate 52 supported by the holding table 45 through the flow path outlet R2. The melting point of solder is 183 ° C., and the melting point of lead-free solder is about 219 ° C.
In this embodiment, the partition is divided into a front plate 91 side region in which the solder tank 1 is disposed in the casing 9 and a rear plate 92 side region in which the motor 32 for driving the pump 31 is disposed in the casing 9. A wall 72 stands in the casing 9 (FIG. 1). This is to protect the motor 32 from heat that becomes a high temperature region on the solder tank 1 side. And the opening part 72a is provided in the partition wall 72, and the fan F is installed so that the air inlet of the fan F may be united with this opening part 72a. The partition wall 72 becomes a mounting plate for the fan F. The fan F sucks heat generated by the motor 32 and serves to cool the motor 32. At the same time, the heat is effectively used for preheating.

  Further, as described above, the heat retaining member 6 that forms the flow path outlet R2 is provided on the front wall 11 side of the solder tank 1, but in this embodiment, the heat retaining member 6 and the casing 9 on the front wall 11 side are provided. A guide wall 71 that partitions the front plate 91 is erected. The guide wall 71 is formed on a swash plate portion 71a that is close to the heat retaining member 6 on the front wall portion 11 side, stands upright in parallel with the wall surface of the front wall portion 11, and further tilts the upper portion of the guide wall 71 upward. 1 and 2, the air supplied into the flow path R by the fan F as shown by the arrows in FIG. 1 and FIG. 2 is supplied with heat from the soldering iron 1 and becomes hot air, and is guided from the flow path outlet R2 to the guide wall 71. Thus, the air is blown to the lower surface 52a of the substrate 52 supported by the holding table 45.

A mask jig 51 and a substrate 52 are horizontally mounted and fixed on the upper surface of the holding table 45 so as to fill the frame. The lead 531 of the electronic component 53 is inserted into the through hole 52 h of the substrate 52, and the electronic component 53 such as a connector is disposed on the substrate 52. Through the hole 51h of the mask jig 51 and the frame of the holding table 45, the leads 531 and the through holes 52h on the substrate lower surface 52a side are exposed downward, and the electronic component 53 is in a state where flux is applied to the exposed portions. Is placed on the mask jig 51. This exposed portion is disposed opposite to the molten surface S1 of the molten solder S that jets from the discharge port 17c.
1, the rod 42 related to the air cylinder 4a is in an extended state (advancing state) as shown in FIG. 3, and the lead 531 on the lower surface side of the substrate 52 and the periphery of the through hole 52h are at the upper end position away from the molten solder S to be jetted. . The holding table 45, the mask jig 51, and the substrate 52 are configured to cover the upper surface opening between the horizontal rod 912 and the pump cover 97, but there is a slight gap between the outer periphery of the holding table 45 and the rod 42. In this extended state, the holding table 45, the mask jig 51, and the substrate 52 are positioned above the upper surface opening and the jet nozzle 17. Therefore, after the fan F rotates and the hot air that has reached the flow path outlet R2 is blown to the lower surface 52a of the substrate 52 supported by the holding table 45, the substrate lower surface 52a is preheated to activate the flux, and then the gap or the like It diffuses through (Fig. 1).
When the preheating is performed for the necessary time, the fan F stops and the rod 42 contracts (retracts). Due to the contraction of the rod 42, the molten solder S in the discharge port 17c is in the lower end position where the through hole 52h of the substrate 52 is immersed, and soldering around the lead 531 is performed. The pre-heating time (rod 42 extension time), soldering time (rod 42 contraction time), and the like are appropriately set on the control touch panel 84. When the start button 81 is pressed, the above series of operations is performed by sequence control.

That is, a series of preheating and soldering operations are performed, for example, as follows using this preheating desktop soldering apparatus.
While the molten solder S of the soldering iron 1 is kept at a predetermined temperature and the rod 42 is in the advanced state, the operator first sets the electronic component mounting substrate 52 coated with flux on the mask jig 51 (FIG. 1). Next, the start button 81 is pressed. Then, the fan F is rotated by the sequence control, and the air supplied to the flow path inlet R1 by the fan becomes hot air while the flow path is in progress, and is blown to the substrate lower surface 52a as indicated by the black arrow in FIG. When the preheating is completed for a predetermined time, the fan F stops. At the same time, the rod 42 is retracted by the operation of the air cylinder 4a, and the substrate 52 is lowered to the lower end position where the through hole 52h is immersed in the molten solder S jetted from the discharge port 17c, and soldering is performed. Since the preheating is sufficient, the solderability is good. When the time required for soldering elapses, the rod 42 advances by the operation of the air cylinder 4a, the substrate 52 moves away from the molten solder S at the discharge port 17c, returns to the initial position, and a series of preheating and soldering operations. Is completed. Thereafter, the operator simply removes and collects the substrate 52 that has been preheated and soldered. The operator simply removes the substrate 52 after the electronic component mounting substrate 52 is set on the mask jig 51, the start button 81 is switched on, preheating, and soldering is completed. The above series of preheating and soldering operations are automated.

  In the figure, reference numeral 18 is a tray for guiding the molten solder S overflowing from the jet nozzle 17 to the tank body 1B, reference numeral 9d is a leg, reference numeral 80 is a power switch, reference numeral 82 is a jet switch, reference numeral 83 is a jet level switch, and reference numeral 51b is Locking pieces for attaching the substrate 52 to the mask jig 51, reference numerals 93f and 94f are inner flanges provided on the upper edges of the side standing plates 93 and 94, reference numeral MK is a shielding plate, and reference numeral SL is an air intake slit.

  Unlike the continuous automatic device, the preheated tabletop soldering device configured in this way is a tabletop type device that solders the substrates 52 one by one, but is a soldering device having a preheating function. It is very useful for improving quality and productivity. Conventionally, manual work for processing prototypes and small lots one by one, and Japanese Patent Application Laid-Open No. 10-126049, the solvent such as IPA in the flux was volatilized over time by exposing to the air, but there are few Even if it is a small lot, the production tact time becomes very long, and if the number of the substrates 52 increases, the productivity is greatly lowered and the quality varies. On the other hand, with this preheating soldering apparatus, the preheating process can be performed at a high temperature, and the flux can be quickly dried and activated, so that the soldering property to the lead 531 is improved and the production tact is shortened. In addition to quality improvement and quality stability. The vaporized component in the flux is evaporated by preheating, and the lead 531 of the electronic component 53 inserted into the through hole 52h is soldered cleanly to the substrate 52. Since it can be preheated at a high temperature, it can sufficiently handle the latest lead-free and aqueous fluxes.

  Further, even in the case of a desktop soldering apparatus with preheating that processes the substrates 52 one by one, after the flux-coated electronic component mounting substrate 52 is set on the mask jig 51, the preheating and the heating can be performed only by pressing the start button 81. A series of operations up to the subsequent soldering are quickly performed, and after completion, the rod 42 is immediately extended, and the substrate 52 is separated from the jet nozzle 17 and returns to the initial position set on the mask jig 51. It is possible. The work by the operator is also extremely easy. If the electronic component mounting substrate 52 coated with flux is set on the mask jig 51 and the start button 81 is pressed, the preheating and soldering are efficiently performed by sequence control, and then the rod 42 advances. Then, since it moves away from the molten solder S and returns to the initial position, it is only necessary to take out this finished substrate. It does not require any special techniques or skills for the operator, and it simply repeats (1) board setting, (2) turning on the start button 81, and (3) taking out the finished product (1) to (3). High quality products can be obtained stably.

  Moreover, in the tabletop soldering apparatus, the heat retaining member 6 covering the wall surface 1a forming the solder bath 1 is provided with a flow path R in which the wall surface 1a becomes one flow wall surface, and the molten solder S is stored. Since the preheating is performed by effectively using the heat of the solder tank 1 to be preheated, it is possible to effectively perform the preheating without newly adding a preheating heat source device and without particularly increasing the capacity of the apparatus. Preheating can be performed only by newly providing the fan F on the inlet R1 side of the flow path R, and the cost of the apparatus is not so high.

In addition, a heat retaining member 6 that forms the flow path outlet R2 is provided on the front wall portion 11 side of the solder bath 1, and a guide wall 71 is erected between the heat retaining member 6 and the front plate 91 of the casing 9. Further, when the upper portion of the guide wall 71 is formed in the swash plate portion 71a inclined rearwardly upward, the hot air from the flow path outlet R2 is well guided to the guide wall 71 and supported by the holding table 45. Since it can spray to 52a efficiently, the activation of the flux by preheating advances more smoothly.
And the partition wall 72 which divides | segments into the front plate 91 side area | region where the solder tank 1 is distribute | arranged in the casing 9, and the rear plate 92 side area | region where the motor 32 which drives the pump 31 by this casing 9 is arrange | positioned. When the fan F is provided so as to stand in the casing 9 and the partition wall 72 is provided with an opening 72a and the air suction port of the fan F is aligned with the opening 72a, the motor 32 generates the air. Since the fan F sucks heat, the fan F is useful not only for preheating but also for removing heat generated by the motor 32.

When the heat retaining member 6 that forms the flow path inlet R1 is provided on the rear wall 12 side of the solder tank 1, the air sent to the flow path inlet R1 by the fan F is as shown in FIGS. Since it reaches the flow path outlet R2 while being in direct contact with the wall portion 12, the side wall portions 13 and 14, and the wall surface 1a of the front wall portion 11, heat transfer by heat conduction from the solder bath 1 can be effectively performed, and preheating is performed. The necessary temperature can be obtained.
Furthermore, the tank body 1B of the solder tank 1 is a rectangular box with an upper surface comprising a plate-like bottom 10, a front wall 11, a rear wall 12, and both side walls 13, 14, and a central portion of the rear wall 12 is formed. A flow path inlet R1 is provided on the wall surface 1a side, and a flow path R that splits into two hands is provided from the inlet R1 along the rear wall 12 in both left and right horizontal directions. After reaching the both side wall portions 13 and 14 respectively, proceed in the horizontal direction along the both side wall portions 13 and 14 to reach the front wall portion 11, further change the direction and proceed in the horizontal direction along the front wall portion 11. When the two flow paths R gather at the central portion of the front wall 11 and the outlet R2 of the flow path R is provided on the wall surface 1a side at the central portion, the outer periphery of the rectangular box of the solder tank 1 Since it faces the flow path outlet R2 from the flow path inlet R1 so as to surround the side surface, the wall surface 1a of the solder tank 1 and the There a thermal conduction time of contact can take enough, the temperature can be surely obtained required preheating.

In addition, the heat retaining member 6 includes a plurality of mat-like inner layer members 6a and mat-like outer layer members 6b, and the back surfaces of the inner layer members 6a adjacent to each other in the vertical direction are brought into contact with the wall surface 1a and the opposite side end surfaces thereof the 6a ₁ is separated in the vertical direction as the cavity k is formed by further outer member 6b are stacked on the front side of the inner layer member 6a with a lid on the front side opening port k ₁ of the voids k If the flow path R is provided, the formation of the flow path R is facilitated. Since the flow path R can be formed by removing a part of the portion where the inner layer member 6a is filled, the flow path R can be produced without increasing the capacity of the apparatus, and the desktop soldering apparatus with preheating can be made compact. Furthermore, since the flow path R can be formed by the heat retaining member 6 from which a part of the inner layer member 6a is omitted and the wall surface 1a of the tank body 1B, a new duct for the flow path R or the like is not required.
As described above, the desktop soldering apparatus with preheating exhibits the excellent effects described above and is extremely useful.

  The present invention is not limited to those shown in the above-described embodiment, and various modifications can be made within the scope of the present invention depending on the purpose and application. The shape, size, number, material, material, etc. of the solder bath 1, heater 2, pump 31, lifting mechanism 4, mask jig 51, substrate 52, heat retaining member 6, guide wall 71, partition wall 72, casing 9 etc. It can select suitably according to a use.

1 Solder bath 1a Wall surface (surface)
DESCRIPTION OF SYMBOLS 10 Bottom part 11 Front wall part 12 Rear wall part 13,14 Side wall part 17 Jet nozzle 17c Discharge port 2 Heater 52 Substrate 52a The lower surface of a substrate (substrate lower surface)
52h Through hole 6 Thermal insulation member 71 Guide wall 71a Swash plate portion 72 Partition wall 71a Opening portion 9 Casing 91 Front plate 92 Rear plate F Fan R Channel R1 Inlet (channel inlet)
R2 outlet (channel outlet)
S Molten solder

Claims (4)

A solder tank (1) for storing the molten solder (S) heated by the heater (2) is provided in the casing (9), and the molten solder (S) is circulated by a pump (31). 1) The lower end where the through hole (52h) of the substrate (52) supported by the holding base (45) is immersed in the molten solder (S) jetted from the discharge port (17c) of the jet nozzle (17) protruding upward In the tabletop soldering apparatus provided with an elevating mechanism (4) for elevating the holding base (45) between the position and the upper end position away from the jetted molten solder (S),
The heat retaining member (6) covering the wall surface (1a) forming the solder tank (1), and provided with a flow path (R) in which the wall surface (1a) becomes one flow wall surface, and the flow path A fan (F) is provided on the inlet side of (R), and the air supplied into the flow path (R) by the fan (F) becomes hot air due to heat from the solder bath (1), and A desktop soldering apparatus with preheating, characterized in that it sprays onto a lower surface (52a) of a substrate (52) supported by a holding base (45). The heat retaining member (6) forming the outlet (R2) of the flow path (R) is provided on the front wall (11) side of the solder bath (1), and the heat retaining member (6) and the casing ( A guide wall (71) is erected between the front plate (91) of 9), and the upper portion of the guide wall (71) is formed as a swash plate portion (71a) inclined backwards upward. The air supplied into the flow path (R) by the fan (F) becomes hot air and is guided from the outlet (R2) of the flow path to the guide wall (71), and the holding table (45) The table-top soldering apparatus with preheating according to claim 1, wherein the soldering is performed on the lower surface (52a) of the substrate (52) supported by the head. The front plate (91) side region where the solder tub (1) is disposed in the casing (9), and the motor (32) that drives the pump (31) in the casing (9) are disposed. A partition wall (72) partitioning into the vertical plate (92) side region and the casing (9) is erected in the casing (9), and the partition wall (72) is provided with an opening portion (72a), the opening portion ( The desktop soldering apparatus with preheat according to claim 1 or 2, wherein the fan (F) is provided so that the air suction port of the fan (F) is aligned with 72a). The tank body (1B) of the solder tank (1) is a rectangular box having an upper surface opening comprising a plate-shaped bottom (10), front wall (11), rear wall (12), and both side walls (13, 14). In the body, an inlet (R1) of the flow path (R) is provided on the wall surface (1a) side at the central portion of the rear wall (12), and the rear wall (12) from the inlet (R1). ) Along the horizontal left and right directions, and a bifurcated flow path (R) is provided. , 14) proceeding in the horizontal front direction to reach the front wall portion (11), further proceeding in the horizontal direction along the front wall portion (11), and the both flow paths (R) are connected to the front wall portion (11). 4) at the central part of the flow path (R) at the central part, the outlet (R2) of the flow path (R) is provided on the wall surface (1a) side. Desktop soldering equipment with preheating.

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