JP2013030281A - Member for operation switch, key panel, electronic apparatus, and method for manufacturing member for operation switch - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a member for an operation switch having a concealing layer capable of sufficiently permeating laser light, and a light shielding layer capable of restraining a by-product.SOLUTION: A member of an operation switch has a concealing layer 30, and a light shielding layer 40. The concealing layer 30 is formed of a material with permeability for permeating laser light of a predetermined wavelength, and deteriorates visibility when the light shielding layer 40 is seen from a surface side of the concealing layer 30 in comparison with the transparent material. The light shielding layer 40 is formed of a material for further improving light permeability than that before radiation when the laser light is radiated from the surface side of the concealing layer 30, and for further restraining at least one of gas and soot than when at least one of carbon and iron oxide is contained as a material. A laser light radiation portion of the light shielding layer 40 is modified by radiating the laser light from the surface side of the concealing layer 30. By this modification, a display part 42 for further improving light permeability in a visible light region than at other portions of the light shielding layer 40 is formed.

Description

  The present invention relates to an operation switch member, a key panel, an electronic device, and a method for manufacturing the operation switch member.

  Some operation switch members include a concealing layer, as shown in Patent Document 1, for example. In this patent document 1, when the internal light source is turned off, the display (first display unit, etc.) attached to the display member due to the presence of the concealing layer cannot be viewed from the operation surface side. . On the other hand, when the internal light source is turned on and the amount of light is increased, the light is transmitted through the concealing layer, and the display (first display unit and the like) attached to the display member can be viewed from the operation surface side. .

JP 2009-301887 A

  By the way, in the configuration shown in the above-mentioned Patent Document 1, it is difficult to form a display on a display member (hereinafter referred to as a light shielding layer) after assembling the operation switch member. That is, when laser light is irradiated from the operation surface side in order to form a display of a letter or the like on the light shielding layer, the shielding layer absorbs the laser light and a predetermined component in the shielding layer reacts, and the internal light source Even in the off state, the display is recognized from the operation surface side. For this reason, the concealing layer cannot perform the function of concealing the display when the internal light source is turned off, and the quality of the operation switch member is deteriorated.

  Further, when a display is formed by irradiating the light shielding layer with a laser beam, a by-product (for example, gas, soot, etc.) originating from the light shielding layer may be generated. In such a by-product, for example, when gas is generated, problems such as a rise in the operation surface side occur. In addition, when wrinkles occur in the by-product, the impression is that the display is dirty. That is, such a problem results in a deterioration in the quality of the operation switch member.

  The present invention has been made in view of the above circumstances, and includes a concealing layer capable of satisfactorily transmitting laser light and a light shielding layer capable of suppressing the generation of by-products. It is an object of the present invention to provide an operation switch member that can achieve at least one, a key panel and an electronic device using the operation switch member, and a method of manufacturing the operation switch member.

  The above-mentioned subject is achieved by the following present invention. That is, the operation switch member of the present invention has a concealing layer and a light shielding layer disposed on the back side of the concealing layer, and the concealing layer is made of a material having transparency that transmits laser light of a predetermined wavelength. In addition to being formed, the visibility when the light shielding layer is viewed from the surface side of the concealing layer is reduced as compared with the transparent material.

  Further, according to another aspect of the operation switch member of the present invention, in addition to the above-described invention, the light-shielding layer is more light transmissive than when irradiated with laser light from the surface side of the concealing layer. The material to be improved is formed of a material that suppresses the generation of at least one of gas and soot compared to the case of containing at least one of carbon and iron oxide as a material, and further on the surface side of the concealing layer Due to the laser light irradiation, the laser light irradiation part in the light shielding layer is altered, and a display unit is formed that improves the light transmittance in the visible light region as compared with other parts of the light shielding layer due to the alteration. It is preferable.

  Further, in another aspect of the operation switch member of the present invention, in addition to the above-described invention, it is preferable that the laser beam having a predetermined wavelength is a 1064 nm laser beam.

  In addition to the above-described inventions, the other aspect of the operation switch member of the present invention is a C.I. I. Pigment blue 15, C.I. I. Pigment red 149, C.I. I. Pigment red 144, C.I. I. Pigment yellow 12, C.I. I. Pigment black 1, C.I. I. Pigment violet 23, C.I. I. Pigment orange 5, C.I. I. Among the pigment greens 7, the organic pigment comprising at least one and / or the masking layer has a total content of iron oxide and carbonaceous powder contained in the masking layer of more than 0% by weight and not more than 30%. It is preferable that

  Further, according to another aspect of the operation switch member of the present invention, in addition to the above-described inventions, the light shielding layer is formed of In, Sn, In-Sn alloy or Al, and the film thickness is 0.02 μm to It is preferably within the range of 0.3 μm.

  Further, according to another aspect of the operation switch member of the present invention, in addition to each of the above-described inventions, the concealing layer and the light-shielding layer further improve the adhesion between them and have transparency. 1 transparent resin layer is provided, and a colored layer colored with a color material component is disposed on the surface of the light shielding layer opposite to the surface on the side of the concealing layer, and between the light shielding layer and the colored layer. It is preferable that a second transparent resin layer having improved transparency as well as adhesion between them is provided.

  Moreover, it is preferable that another invention is a key panel provided with each invention of the member for operation switches mentioned above.

  Moreover, it is preferable that other invention is an electronic device provided with each invention of the member for operation switches mentioned above.

  Further, the method for producing an operation switch member according to another aspect of the present invention is a production method for producing an operation switch member having a masking layer and a light shielding layer disposed on the back side of the masking layer, The surface of the masking layer is formed of a material having transparency that transmits laser light of a predetermined wavelength, and the visibility when viewing the light shielding layer side from the surface of the masking layer compared to the transparent material is improved. A concealment layer forming step for forming a concealment layer to be reduced, and when the back surface side of the concealment layer is irradiated with laser light from the front surface side of the concealment layer, the light transmittance is improved as compared with before irradiation, and carbon and oxidation Non-translucent light-shielding layer that suppresses generation of at least one of gas and soot as compared with the case where at least one of iron is included as a material is formed by physical vapor deposition of In, Sn, In—Sn alloy, or Al. Method or spatter The light-shielding layer forming step formed by the mask, and by irradiating a part of the light-shielding layer with laser light from the surface side of the concealment layer, the irradiated part is altered to make visible light more than other parts of the light-shielding layer. An operation switch member is manufactured by performing a laser light irradiation step of forming a display portion that improves light transmittance in the region.

  According to the present invention, the laser beam can be transmitted satisfactorily by the masking layer, and the generation of by-products can be suppressed even if the laser beam transmitted through the masking layer is irradiated by the light shielding layer.

It is a schematic cross section which shows an example of the member for operation switches of this embodiment, (A) shows the state before irradiation of a laser beam, (B) shows the state after irradiation of a laser beam. It is a top view which shows a mode when the member for operation switches in FIG. 1 is visually recognized, (A) shows what is visually recognized under daylight, (B) shows what is visually recognized under backlight. It is a schematic cross section which shows the other example of the member for operation switches of this embodiment. It is a schematic cross section which shows the other example of the member for operation switches of this embodiment. It is a schematic cross section which shows the other example of the member for operation switches of this embodiment. It is a top view which shows a mode when the member for operation switches in FIG. 5 is visually recognized, (A) shows what is visually recognized under daylight, (B) shows what is visually recognized under backlight. It is a schematic cross section which shows the other example of the member for operation switches of this embodiment. It is a top view which shows a mode when the member for operation switches in FIG. 7 is visually recognized, (A) shows what is visually recognized under daylight, (B) shows what is visually recognized under backlight. It is a schematic cross section which shows the other example of the member for operation switches of this embodiment. It is a figure which shows the other example of the member for operation switches of this embodiment, and is a figure which shows a mode that the semi-finished product of the member for operation switches is formed in a three-dimensional shape. It is a figure which shows the other example of the member for operation switches of this embodiment, and is a figure which shows a mode that the semi-finished product of the member for operation switches is adhere | attached on a mold print, and it forms in a three-dimensional shape. It is an external view which shows an example of the electronic device of this embodiment.

(Operation switch member and manufacturing method thereof)
The operation switch member of the present embodiment has a concealing layer and a light shielding layer disposed on the back side of the concealing layer, and the concealing layer is formed of a material having transparency that transmits laser light of a predetermined wavelength. In addition, it is characterized in that the visibility when the light shielding layer is viewed from the surface side of the concealing layer is lowered as compared with the transparent material.

  Further, in the operation switch member of the present embodiment, the light shielding layer is a material that improves the light transmittance when irradiated with laser light from the surface side of the concealing layer than before irradiation. The light shielding layer is formed of a material that suppresses the generation of at least one of gas and soot as compared with the case of containing at least one of iron as a material, and is further irradiated with laser light from the surface side of the concealing layer. The laser beam irradiation site in the laser beam is altered, and a display portion that improves the light transmittance in the visible light region as compared with other portions of the light shielding layer is formed by the alteration.

  More specifically, the concealing layer is basically a layer having a light transmittance lower than that of a transparent layer, for example, translucent. This concealing layer has a transmission property that allows laser light of a predetermined wavelength to pass therethrough, for example, similarly to an optical filter that transmits light of a predetermined wavelength. On the other hand, for light having a wavelength in the visible light region, by absorbing or reflecting the light, the light shielding layer side opposite to the light shielding layer side can be visually recognized from the surface side of the concealing layer (the operation surface side of the key top). Reduces visibility. Therefore, when the light source is arranged on the back side of the light shielding layer (the side opposite to the side where the key top is located in the light shielding layer), when the light source is turned off, the light shielding layer is formed from the operation surface side. It is difficult to see the side. On the other hand, when the light source is turned on and light is emitted from the light source, the light passes through the display portion and further passes through the concealing layer. Here, since only the light transmitted through the display unit reaches the concealing layer, the user can recognize the design corresponding to the display unit from the operation surface side.

  For this reason, if the semi-finished product configured as described above is irradiated with laser light of a predetermined wavelength from the surface side of the concealing layer (the operation surface side of the key top), a display unit is formed, and the operation switch The member is completed. Here, the light shielding layer is formed of a material that suppresses the generation of at least one of gas and soot as compared with the case where at least one of carbon and iron oxide is included as a material, so that the display portion is formed. Therefore, generation of gas and soot can be suppressed even when laser light having a predetermined wavelength is irradiated. Then, by suppressing the generation of gas due to the laser beam irradiation described above, it is possible to suppress the occurrence of a problem such that the operation surface side of the key top swells. In addition, since the generation of wrinkles due to the above-described laser light irradiation is suppressed, it is possible to prevent the display unit from becoming dirty and deteriorating in quality.

  If the light transmittance of the display part of the light shielding layer is improved relative to the area other than the display part of the light shielding layer, the light transmittance of the transparent area is recognized as translucent to the naked eye. It may be possible.

  Also, conventionally, before forming the operation switch member, a display portion corresponding to a desired pattern is formed on the light shielding layer with laser light, and the light transmittance in the display portion is improved compared to other portions of the light shielding layer. I am letting. Therefore, conventionally, for example, it is impossible to stock up a large amount of semi-finished products before the transparent region is formed, so laser etching is performed from the side opposite to the side where the key top is arranged in the light shielding layer. A transparent region was formed, and then an operation switch member was formed through a process such as printing. Conventionally, it is difficult to form a display unit corresponding to a pattern according to the language of each country while suppressing the generation of gas and soot. In particular, gas is recognized as a bulge on the operation surface side of the key top, and soot is recognized as dirt on the display unit, both of which cause defects. However, since the light shielding layer is made of a material that suppresses the generation of at least one of gas and soot as compared with the case where at least one of carbon and iron oxide is included as a material, in order to form the display portion Even when laser light having a predetermined wavelength is irradiated, generation of gas and soot can be suppressed. As a result, after the laser light irradiation, which is conventionally required, the bulge of the operation surface of the key top can be pushed into the surface side opposite to the operation surface side (non-operation surface side) using a mold. A process becomes unnecessary. Further, the process of removing the soot is not necessary.

  As a result, if a semi-finished product with the necessary layers laminated as an operation switch member is prepared, laser processing can be performed when there is a request from a user who assembles a product such as an electronic device using the operation switch member. The operation switch member on which the display unit corresponding to the language or the like of each region is formed can be shipped to the user simply by carrying out the operation. That is, the operation switch member of the present embodiment can be manufactured and shipped in a short period of time according to a request from the user. In addition, a semi-finished product which is a finished product only by laser processing can form a display portion corresponding to any region by laser processing. For this reason, compared with the case where a finished product that has been laser processed by prospective production is stocked, the stock risk can be greatly reduced when the stocked semi-finished product is processed by laser processing.

  In addition, since the display portion corresponding to the local language or the like can be formed later by laser processing, it is possible to produce a large amount of semi-finished products without the display portion at a time. Thereby, production efficiency can be greatly improved.

  FIG. 1 is a schematic cross-sectional view showing an example of the operation switch member of the present embodiment, and shows the most basic layer structure. In the following description, the operation surface side of the key top 20 will be described as the front surface side and the opposite side as the back surface side as necessary. However, the relationship between the front surface and the back surface also in each layer other than the key top 20 Is the same.

  The operation switch member 10 </ b> A (10) shown in FIG. 1 has a layer configuration in which a concealing layer 30 and a light shielding layer 40 are laminated in this order on the non-operation surface 20 </ b> B of the key top 20. As shown in FIG. 1A, the display portion 42 is not formed in the light shielding layer 40 before the irradiation with the laser beam having a predetermined wavelength. However, as shown in FIG. After the laser beam irradiation, the display unit 42 is formed. The display unit 42 is a partial region of the light shielding layer 40, but the display unit 42 has a higher light transmittance in the visible light region than other portions of the light shielding layer 40, thereby providing transparency. Yes.

  A circuit board P is disposed on the back side of the light shielding layer 40, and a light source L capable of emitting light having a predetermined wavelength in the visible light region is disposed on the circuit board P. Further, the circuit board P is provided with a dome-shaped member M, a fixed contact (not shown), and a conductive portion (not shown). For example, the dome-shaped member M made of a conductive member such as metal is arranged in an inverted bowl shape and is in contact with a fixed contact (not shown) of the circuit board P. Further, a presser S is provided in a portion of the light shielding layer 40 that faces the dome-shaped member M. The pressing element S may be provided integrally with the light shielding layer 40, but may be provided separately.

  With such a configuration, when the operation surface 20A side of the key top 20 is pushed in, the pusher S pushes the dome-shaped member M and buckles the dome-shaped member M. As a result, on the front side surface of the circuit board P, the conductive portion (not shown) disposed inside the dome-shaped member M and the dome-shaped member M are brought into conduction, and the switch is turned on. On the other hand, when the depression of the key top 20 is released, due to the restoring force of the dome-shaped member M, the conductive portion (not shown) and the dome-shaped member M are brought into a non-conductive state. That is, the switch is turned off.

  Further, the light source L can be turned on without being synchronized with the ON / OFF of the switch or with the ON / OFF of the switch. When the light source L is turned on, the user can visually recognize a predetermined design by the contour shape of the display unit 42. The operation switch member 10A (10) does not include the circuit board P including the light source L and the dome-shaped member M. However, the operation switch member 10A (10) may include the circuit board P. Further, the concept of the operation switch member 10A (10) may or may not include the above-described presser S.

  Here, in a state where the light source L is not turned on and light is irradiated from the outside of the operation switch member 10A (10) (under the daylight), the user can visually recognize from the operation surface 20A side (surface side). A simple shape is shown in FIG. Further, FIG. 2B shows a shape that the user can visually recognize from the operation surface 20A side (front surface side) in a state where the light source L is turned on (under the backlight). As is clear from FIGS. 2A and 2B, under the backlight where the light source L is lit, the display unit 42 (shown by hatching) is not visible (difficult to visually recognize) under the daylight where the light source L is not lit. (Part) is visible.

  In addition, from the viewpoint of ensuring the scratch resistance of the operation surface 20A and ensuring adhesion between members and layers, other layers may be provided on the operation switch member 10A shown in FIG. 1 as necessary. it can. This will be described below. Further, in the description based on each of the following drawings, for the sake of simplification of description, a case where the display unit 42 is formed by irradiation with laser light having a predetermined wavelength will be described.

  FIG. 3 is a schematic cross-sectional view showing an example of the operation switch member of the present embodiment. In FIG. 3, the same components as those shown in FIG. Here, the operation switch member 10B (10) shown in FIG. 3 includes a protective layer 50, a key top 20, a concealing layer 30, a light shielding layer 40, an adhesive layer 60, and a base sheet 70 in this order. It has a layered structure. The protective layer 50 described above has a role of covering the operation surface 20A of the key top 20 and protecting the key top 20, and is made of a transparent material. The protective layer 50 covers the operation surface 20A and the side surface 20C of the key top 20. The adhesive layer 60 has a role of bonding the base sheet 70 to the light shielding layer 40.

  When the operation switch member 10B (10) shown in FIG. 3 is visually recognized, the state becomes the same as that shown in FIG. That is, in the state under daylight where the light source L is not turned on, the user can visually recognize the state shown in FIG. 2A from the operation surface 20A side (front surface side). Moreover, in the state under the backlight where the light source L is lit, the user can visually recognize the state shown in FIG.

  FIG. 4 is a schematic cross-sectional view showing another example of the operation switch member of the present embodiment. In FIG. 4, the same components as those shown in FIG. Here, the operation switch member 10C (10) shown in FIG. 4 differs from the operation switch member 10B shown in FIG. 3 in the following points. That is, in the operation switch member 10 </ b> C (10), the base buffer layer 80 (undercoat) is provided between the masking layer 30 and the light shielding layer 40. Further, an intermediate buffer layer 90 (middle coat) is provided between the light shielding layer 40 and the adhesive layer 60. Further, a colored layer 100 is provided on the surface of the intermediate buffer layer 90 opposite to the light shielding layer 40.

  Among the above, the base buffer layer 80 has transparency in order to visually recognize the light shielding layer 40. Similarly, the intermediate buffer layer 90 also has transparency in order to visually recognize the colored layer 100. When the base buffer layer 80 is provided between the masking layer 30 and the light shielding layer 40, adhesion between the masking layer 30 and the light shielding layer 40 can be improved. Similarly, when the intermediate buffer layer 90 is provided between the light shielding layer 40 and the colored layer 100, the adhesion between the light shielding layer 40 and the colored layer 100 can be improved.

  The visual recognition of the operation switch member 10C (10) shown in FIG. 4 is the same as that shown in FIG.

  FIG. 5 is a schematic cross-sectional view showing another example of the operation switch member of the present embodiment. In FIG. 4, the same components as those shown in FIG. Here, the operation switch member 10D (10) shown in FIG. 4 is different from the operation switch member 10B shown in FIG. 3 in that the concealing layer 30 is provided with a colored portion 32.

  The coloring portion 32 is provided in a portion of the concealing layer 30 on the key top 20 side. However, the colored portion 32 is not limited to the configuration provided in the portion on the key top 20 side of the masking layer 30, and may be configured to be provided in the portion on the key top 20 side of the protective layer 50. The colored portion 32 is provided without penetrating the masking layer 30. That is, the concealing layer 30 is also present on the back side (the light shielding layer 40 side) of the colored portion 32. For this reason, even when viewed through the colored portion 32, the back surface side (the light shielding layer 40 side) of the colored portion 32 is hardly visible. On the other hand, the colored portion 32 is provided so that the light transmitted through the display portion 42 is transmitted through the colored portion 32 when the light source L is lit, similarly to the other portions of the masking layer 30.

  The colored portion 32 is a colored portion so that it can be distinguished from other portions of the masking layer 30. Therefore, in a state where the light source is turned off, the user can visually recognize a predetermined design including the coloring unit 32. However, the colored portion 32 is not limited to the case where the other portions of the masking layer 30 can be distinguished by coloring, and even if the colored portion 32 is the same color as the other portions of the masking layer 30, the colored portion If the light absorption / reflection at 32 is different from other parts and can be distinguished from the other parts of the masking layer 30, it is included in the colored part 32 here.

  In the operation switch member 10D (10) in FIG. 5, the coloring portion 32 is 1 in the thickness direction of the operation switch member 10D (the direction from the operation surface 20A toward the circuit board P; the Z direction in FIG. 5). The two display portions 42 are provided at the same position. In addition, it is not restricted to such the same position, When the member 10D (10) for operation switches is seen from the operation surface 20A side, you may provide the colored part 32 in the state which covers the display part 42 completely.

  When the operation switch member 10D (10) shown in FIG. 5 is visually recognized, the state shown in FIG. 6 is obtained. That is, in the state under daylight where the light source L is not turned on, the user can visually recognize the state shown in FIG. 6A from the operation surface 20A side (front side). That is, although the colored part 32 can be visually recognized, the display part 42 cannot be visually recognized (it is difficult to visually recognize). On the other hand, in the state under the backlight where the light source L is lit, the user can visually recognize the state shown in FIG. That is, in FIG. 6B, since the light transmitted through the display portion 42 is transmitted to the colored portion 32, the colored portion 32 (the display portion 42 on the left side of FIG. 6B) can be visually recognized. It becomes. In addition, the concealing layer 30 makes it possible to visually recognize the display unit 42 (the display unit 42 on the right side in FIG. 6B) that cannot be viewed under daylight (it is difficult to view). In FIG. 6B, since the colored portion 32 and the left display portion 42 in FIG. 6B are in the same position in the thickness direction, the colored portion 32 can be visually recognized under the daylight and under the backlight. Although the shape does not change, the visible color or the like may be changed by the overlap of the display unit 42 and the coloring unit 32.

  FIG. 7 is a schematic cross-sectional view showing another example of the operation switch member of the present embodiment. In FIG. 7, the same components as those shown in FIG. The operation switch member 10E (10) illustrated in FIG. 7 is different from the operation switch member 10D (10) illustrated in FIG. 6 in the positions where the coloring portion 32 and the display portion 42 are provided. That is, in the operation switch member 10E (10) shown in FIG. 7, the colored portion 32 does not exist at the same position as the display portion 42 in the thickness direction (Z direction) of the operation switch member 10E.

  When such an operation switch member 10E (10) is visually recognized, a state shown in FIG. 8 is obtained. That is, in the state under daylight where the light source L is not turned on, the user can visually recognize the state shown in FIG. 8A from the operation surface 20A side (front side). That is, although the colored part 32 can be visually recognized, the display part 42 cannot be visually recognized (it is difficult to visually recognize). On the other hand, in the state under the backlight where the light source L is lit, the user can visually recognize the state shown in FIG. That is, since the colored portion 32 is not located at the same position as the display portion 42 (not overlapping) in the thickness direction (Z direction), the light emitted from the light source L is blocked by the light blocking layer 40 and does not reach the colored portion 32. Therefore, the colored part 32 cannot be visually recognized (it is difficult to visually recognize). On the other hand, in the state under the backlight, the light emitted from the light source L passes through the display unit 42 and further passes through the concealing layer 30. Thereby, the display part 42 in a state where it cannot be visually recognized under daylight (it is difficult to visually recognize) by the concealment layer 30 becomes visible.

  FIG. 9 is a schematic cross-sectional view showing another example of the operation switch member of the present embodiment. In FIG. 9, the same components as those shown in FIG. The operation switch member 10F (10) shown in FIG. 9 is different from the operation switch member 10D (10) shown in FIG. 5 in the stacking order. That is, in the operation switch member 10F (10), the protective layer 50, the concealing layer 30, the base buffer layer 80 (undercoat), the light shielding layer 40, the intermediate layer from the protective layer side to the back surface side (circuit board P side). The buffer layer 90 (middle coat), the colored layer 100, the base buffer layer 80, the key top 20, the adhesive layer 60, and the base sheet 70 are laminated in this order.

  That is, on the operation surface 20A side of the key top 20, the protective layer 50, the masking layer 30, the base buffer layer 80 (undercoat), the light shielding layer 40, the intermediate buffer layer 90 (middle coat), the colored layer 100, and the base buffer layer 80. Are stacked in this order. Therefore, on the operation surface 20A side of the key top 20, a desired design (decoration) is applied.

  The positional relationship in the thickness direction (Z direction) of the colored portion 32 in the masking layer 30 and the display portion 42 in the light shielding layer 40 is the same as that of the operation switch member 10D (10) shown in FIG. Is omitted.

  The protective layer 50 covers the operation surface 20A side and the side surface 20C of the key top 20. In the configuration shown in FIG. 9, since the protective layer 50 to the base buffer layer 80 described above are stacked on the key top 20 on the side away from the operation surface 20A, the surface side of the protective layer 50 (the circuit board P and the circuit board P). And the side surface of each layer from the protective layer 50 to the base buffer layer 80, and further covers the side surface 20C.

  The visual recognition of the operation switch member 10F (10) shown in FIG. 9 is the same as that shown in FIG.

  When manufacturing the operation switch member 10 of the present embodiment described above, the masking layer forming step of forming the masking layer 30 on the non-operation surface 20B side of the keytop 20 and the keytop 20 with respect to the masking layer 30 are performed. When the laser beam having a predetermined wavelength is irradiated from the operation surface 20A side of the key top 20 to the reverse side opposite to the above, the light transmittance is improved as compared with that before irradiation, and at least of carbon and iron oxide Non-translucent light-shielding layer 40 that suppresses generation of at least one of gas and soot as compared with the case where one is included as a material is formed by physical vapor deposition or sputtering of In, Sn, In-Sn alloy, or Al. And at least a light shielding layer forming step to be formed.

  In addition to these three steps, it is preferable to implement a protective layer forming step for forming the protective layer 50 on the operation surface 20A side of the key top 20 in accordance with the layer configuration of the operation switch member 10. Further, it is preferable to perform a base buffer layer forming step of forming the base buffer layer 80 on the back surface side of the masking layer 30 or the front surface side of the light shielding layer 40. In addition, it is preferable to perform an intermediate buffer layer forming step of forming the intermediate buffer layer 90 on the back surface side of the light shielding layer 40. Moreover, it is preferable to implement the colored layer formation process which forms the colored layer 100 in the back surface side of the intermediate | middle buffer layer 90. FIG. Moreover, it is preferable to implement the contact bonding layer formation process which forms the contact bonding layer 60 in the back surface side of the colored layer 100. FIG.

  Then, after at least the concealing layer forming step and the light shielding layer forming step, a predetermined region (that is, a portion that can become the display unit 42) of the light shielding layer 40 from the operation surface 20A side of the key top 20 is predetermined. A laser irradiation step of irradiating laser light having a wavelength of is performed. Then, thermal energy is applied to the laser light irradiation portion of the light shielding layer 40, and the irradiation portion of the light shielding layer 40 is altered by the application of the thermal energy. Sex is imparted. Thereby, the display part 42 is formed.

  Here, the light-shielding layer 40 is a material that improves the light transmissivity when irradiated with laser light having a predetermined wavelength, and includes at least one of carbon and iron oxide as a material. It is made of a material that suppresses the generation of at least one of gas and soot rather than the case. Therefore, it is possible to form the display unit 42 by changing the quality of the irradiated portion of the laser beam having a predetermined wavelength while suppressing the generation of gas and soot.

  As described above, the light transmittance in the visible light region is improved, and the display unit 42 with transparency is formed. This laser irradiation process is a substantial final process when the operation switch member 10 is manufactured, and is necessary as the operation switch member 10 in a state immediately before the execution of the laser irradiation process (semi-finished product state). The layer structure is in a completed state.

  Further, when manufacturing the operation switch member 10, the following may be performed. This is shown in FIG. That is, after producing the semi-finished product H (before laser processing) of the operation switch member 10 having the layer structure of any of FIGS. 1, 3 to 5, 7 or 9, the semi-finished product H As shown in FIG. 10 (A), it is installed between the mold convex mold 201 and the mold concave mold 202 of the drawing mold apparatus 200. After that, as shown in FIG. 10B, the mold convex mold 201 and the mold concave mold 202 are abutted, and the semi-finished product H is formed so as to follow the shape of the space (cavity) formed when they are abutted. Drawing process. By this drawing process, the semi-finished product H becomes in a state having a protruding portion H1 protruding toward the mold concave mold 202, and the back side of the protruding portion H1 becomes a recessed portion H2.

  Next, after releasing the butting of the mold convex mold 201 and the mold concave mold 202, as shown in FIG. 10C, an injection molding machine 210 is used to apply a resin such as a thermoplastic resin to the hollow portion H2. Fill. Then, for example, when a resin such as a thermoplastic resin is cured after a predetermined time has elapsed, as shown in FIG. 10D, an operation switch member 10 having a core H3 in which the resin is solidified is formed in the depression H2. Is possible. That is, through each process as shown in FIG. 10, it becomes possible to produce a three-dimensional operation switch member 10 instead of a planar shape, and decorate the three-dimensional operation switch member 10. Can be applied.

  Further, when the operation switch member 10 is created, the following may be performed. That is, after producing the semi-finished product H (before laser processing) of the operation switch member 10 having the layer structure of any of FIGS. 1, 3 to 5, 7 or 9, the semi-finished product H 11 may be bonded to the mold print 220 as shown in FIG. Here, the mold print 220 is formed in a three-dimensional shape by being provided with irregularities (in FIG. 11, the convex portions 221 are provided). Therefore, by bonding the semi-finished product H to the mold print 220 as shown in FIG. 11, it becomes possible to manufacture the operation switch member 10 having a three-dimensional shape instead of a planar shape, and for the three-dimensional operation switch. It becomes possible to decorate the member 10.

  Here, when creating the operation switch member 10, first, the concealment layer 30 is formed on the non-operation surface 20 </ b> B of the key top 20. The concealing layer 30 is formed by applying predetermined components as described later, for example, screen printing, gravure printing, pad printing, or various coater coatings such as spray coating, curtain coater coating, roll coater coating, and the like. It is formed on the non-operation surface 20B.

  Thereafter, a base buffer layer 80 is formed on the masking layer 30 as necessary. Then, the light shielding layer 40 is formed on the masking layer 30 or the base buffer layer 80. Here, the light shielding layer 40 is made of In (indium), Sn (tin), In-Sn alloy (indium tin alloy) or Al (aluminum), for example, PVD method (Physical Vapor Deposition; typified by sputtering). It is formed into a thin film by a growth method. Note that the light-shielding layer 40 in a thin film equivalent to the PVD method may be formed by a CVD method (Chemical Vapor Deposition) typified by plasma CVD.

  And after forming the light shielding layer 40, the laminated body in which the intermediate | middle buffer layer 90 and the colored layer 100 were formed as needed is obtained. Next, the base sheet 70 is bonded to the surface of the laminate opposite to the side where the key top 20 is located to form the adhesive layer 60, so that at least the key top 20, the concealing layer 30, A semi-finished product in which the light shielding layers 40 are laminated in this order is obtained. Note that the protective layer 50 may be formed on the operation surface 20 </ b> A side of the key top 20 as necessary before or after the formation of the concealing layer 30.

  And the laser beam of a predetermined wavelength is irradiated from the side in which the key top 20 was provided among this semi-finished product. Then, a laser beam having a predetermined wavelength is transmitted through the key top 20 and the concealing layer 30 and is irradiated and absorbed in a partial region of the light shielding layer 40. And in the area | region where a laser beam is irradiated and absorbed, the site | part changes in quality and the display part 42 to which transparency was provided by the quality change is formed.

As laser light having a predetermined wavelength used for laser processing, (1) the concealing layer 30 transmits (that is, the concealing layer 30 hardly absorbs), and (2) the light shielding layer 40 absorbs. (3) It is necessary to at least suppress the generation of gas and soot in the light shielding layer 40 to be irradiated. Examples of the laser light having such a wavelength (laser light having a predetermined wavelength) include a YAG laser having a center wavelength of 1064 nm and a YVO ₄ laser, which are laser light in the infrared region.

However, the laser light having a predetermined wavelength is not limited to the above-described YAG laser and YVO ₄ laser, and various laser light satisfying the above conditions (1) to (3) can be used. .

-Key top-
Next, details of each layer of the operation switch member 10 of this embodiment illustrated in FIGS. 1, 3 to 5, 7 and 9 will be described more specifically. The key top 20 has a shape that can be recognized as one key as illustrated in FIG. 1 or the like, or a shape that can be recognized as a plurality of keys (a plurality of convex portions corresponding to individual key portions are provided on one sheet) The shape and the material are not particularly limited, but generally a block-shaped resin having a semi-circular shape, a semi-elliptical shape, a trapezoidal shape, or the like is used. A plurality of base sheets 70 may be provided on one side. The key top 20 can be produced by, for example, injection molding or mold transfer using a UV curable resin.

  The key top 20 needs to be made of a material that transmits the laser beam having the predetermined wavelength described above. As a material (resin material) used for manufacturing the key top 20, for example, a PC resin (polycarbonate) is used. Resin), ABS resin (acrylonitrile / butadiene / styrene copolymer resin), PMMA resin (polymethyl methacrylate resin), PBT resin (polybutylene terephthalate resin), PA resin (polyamide resin), PVC resin (polyvinyl chloride resin), An epoxy resin etc. are mentioned. Among these, PVC resin (polyvinyl chloride resin) and epoxy resin can freely change the hardness by changing the amount of plasticizer added. Moreover, urethane acrylate etc. are mentioned as UV curable resin. Moreover, the key top 20 needs to have translucency. Here, in the present specification, “translucency” means that the transmittance with respect to light having a wavelength in the visible light region (about 400 to 800 nm) is 5% or more. The transmittance is preferably 10% or more, and more preferably 20% or more.

-Concealment layer-
The concealing layer 30 needs to conceal the layer laminated on the back side under the daylight where the light source L is not turned on. The property which makes it difficult to visually recognize the part 42 is required. Further, the concealing layer 30 needs to transmit the light emitted from the light source L under the backlight where the light source L is lit so that the display unit 42 is visible.

  As such a thing, what does not contain inorganic pigments and inorganic fillers, such as iron oxide and carbonaceous powder, which are highly reactive to laser light of a predetermined wavelength. Further, even if the shielding layer 30 contains iron oxide having high reactivity with laser light having a predetermined wavelength, the content ratio needs to be greater than 0 wt% and not more than 30 wt%. It is preferable that it is below wt%. Further, even if the concealing layer 30 includes a carbonaceous powder highly reactive with laser light having a predetermined wavelength, the content ratio needs to be greater than 0 wt% and not greater than 30 wt%, It is preferable that it is 10 weight% or less.

  Further, as the concealing layer 30, organic pigments described below, that is, Pigment Blue 15 (transmission color: blue to green), Pigment Red 149 (transmission color: red), Pigment Red 144 (transmission color: red), Pigment Yellow 12 (Transparent color: Yellow), Pigment Black 1 (Transparent color: Black), Pigment Violet 23 (Transparent color: Purple), Pigment Orange 5 (Transparent color: Orange), Pigment Green 7 (Transparent color: Green) Is preferred. In addition, the content rate of an organic pigment should just exist in the range of 20 weight%-90 weight%, and it is especially preferable that it exists in the range of 40 weight%-80 weight%.

  Dyes can also be used. In addition, as these organic pigments, azo type and polycyclic type are preferable.

  In addition, the inorganic pigment, the inorganic filler, the organic pigment, the organic dye, and the like described above may include a plurality of listed components in one layer (single layer). Alternatively, the masking layer 30 may be formed by stacking a plurality of layers each composed of a different single component. Moreover, it is also possible to freely set the shade (design color) of the concealment layer 30 when illuminated by the light source L by appropriately selecting these components or adjusting the blending components.

-Light shielding layer-
As described above, the light-shielding layer 40 includes the non-light-transmissive light-shielding layer 40 that suppresses generation of at least one of gas and soot as compared with the case where at least one of carbon and iron oxide is included as a material. , Sn, In—Sn alloy or Al is formed by, for example, a PVD method represented by sputtering.

  Here, the light shielding layer 40 is a continuous metal film (so-called solid film) to which a metallic gloss is imparted. The thickness of the light shielding layer 40 in this case is not particularly limited as long as it has a light shielding property against light in the visible light region and suppresses the generation of by-products. However, it is a continuous metal film (solid film) having light shielding properties, transparency is provided by irradiation with laser light of a predetermined wavelength, and the display unit 42 can be satisfactorily formed while suppressing the generation of by-products. In consideration of the fact, it is usually preferably in the range of 0.02 μm to 1.5 μm, more preferably in the range of 0.02 μm to 0.3 μm. By setting the film thickness to 0.02 μm or more, sufficient light shielding properties are provided. When the film thickness is about 1.5 μm or less, sufficient transparency is imparted by irradiation with laser light having a predetermined wavelength.

  In addition, when the film thickness of the light shielding layer 40 is thin, the light shielding property with respect to light in the visible light region is not sufficient as described above. On the other hand, when the thickness of the light shielding layer 40 is large, it is considered that there is an influence of the generation of by-products when the laser light is irradiated. For example, as described above, it is considered that there is a problem that the amount of soot is increased or the amount of gas generated is increased. Therefore, the thickness of the light shielding layer 40 is preferably within the above range. In addition, even if the metal film of the light shielding layer 40 is vaporized and then cooled to room temperature, the gas itself is considered to be almost gone, but once the gas is generated, a cavity is formed inside the operation switch member 10, If it becomes large, even if it cools, it is thought that it will not return to the state without the cavity. For this reason, it is preferable that the amount of gas generated is small. For this reason, the thickness of the light shielding layer 40 is preferably within the above range.

-Protective layer-
Although the formation method of the protective layer 50 is not specifically limited, For example, it can form using well-known printing methods, such as offset printing, screen printing, pad printing, or a well-known coating method. As the protective layer 50, a known material can be used as long as it has the same translucency as the key top 20 and can improve the mechanical and chemical durability of the surface of the operation switch member 10. In forming the protective layer 50, for example, a solution obtained by dissolving a transparent resin material such as urethane acrylate in a solvent, a known hard coat agent, or the like can be used. The thickness of the protective layer 50 is preferably within a range of 5 μm to 30 μm, and more preferably within a range of 10 μm to 25 μm, from a practical viewpoint such as ensuring improvement in mechanical and chemical durability.

-Adhesive layer-
The adhesive layer 60 may be either formed by curing of an adhesive or constituted by a double-sided tape. As an adhesive, for example, a cyanoacrylate adhesive, an epoxy adhesive, an acrylic adhesive, a urethane adhesive, a silicone adhesive, an ultraviolet curable adhesive, or a visible light curable adhesive may be used. it can.

  As described above, a double-sided tape can be used as the adhesive layer 60. The double-sided tape is one in which an adhesive is applied to both sides of a base material, and as the base material, a resin such as paper, cloth, or PET can be used. As the pressure-sensitive adhesive, acrylic, silicone, rubber or the like can be used.

-Base sheet-
As the base sheet 70, a sheet formed in advance can be used. Even if a presser (projection) is provided in advance on the surface opposite to the surface to be bonded to the member on the key top 20 side. Good. When a pressing element is provided, the operation switch member 10 can be used as a push button switch member. As a material constituting the base sheet 70, for example, a silicone resin, a urethane resin, a polyester resin, polyethylene terephthalate (PET), or the like can be used.

−Base buffer layer−
The under buffer layer 80 can be formed by using a known printing method such as offset printing, screen printing, pad printing, or a known coating method, for example. The base buffer layer 80 has the same translucency as the key top 20, and is formed using a solution in which a transparent resin material capable of obtaining such translucency is dissolved in a solvent. Various hard plastics can be adopted as the base buffer layer 80. Examples of such hard plastics include PC resin (polycarbonate resin), PMMA resin (polymethyl methacrylate resin), PVC resin (polychlorinated). Vinyl resin) and epoxy resin. Among these, PVC resin (polyvinyl chloride resin) and epoxy resin can freely change the hardness by changing the amount of plasticizer added.

  Further, the base buffer layer 80 can be formed by coating an uncured ultraviolet curable resin and then curing it by irradiating with ultraviolet rays, or by heating and curing after coating a thermosetting resin. . As an ultraviolet curable resin, what added the photoinitiator etc. to the main ingredient containing a photopolymerization type prepolymer and a monomer can be used. Further, as the ultraviolet curable resin, in addition to the above, a filler, an antioxidant, a reaction accelerator, a reaction inhibitor, a stabilizer, a colorant, and the like may be blended as necessary. As the main component of the ultraviolet curable resin, monomers and / or oligomers such as acrylic, methacrylic, styrene, unsaturated polyester, polyester polyol, polyester ether, urethane, silicone, epoxy or phenol, Monomers and / or oligomers of these derivatives, or a mixture of a plurality of these can be used. Moreover, as a thermosetting resin, a polyimide resin, an epoxy resin, etc. can be used, for example.

-Intermediate buffer layer-
The intermediate buffer layer 90 can be formed, for example, by coating an uncured ultraviolet curable resin and then curing it by irradiating with ultraviolet rays, or by heating and curing after coating a thermosetting resin. . As an ultraviolet curable resin, what added the photoinitiator etc. to the main ingredient containing a photopolymerization type prepolymer and a monomer can be used. Further, as the ultraviolet curable resin, in addition to the above, a filler, an antioxidant, a reaction accelerator, a reaction inhibitor, a stabilizer, a colorant, and the like may be blended as necessary. As the main component of the ultraviolet curable resin, monomers and / or oligomers such as acrylic, methacrylic, styrene, unsaturated polyester, polyester polyol, polyester ether, urethane, silicone, epoxy or phenol, Monomers and / or oligomers of these derivatives, or a mixture of a plurality of these can be used. Moreover, as a thermosetting resin, a polyimide resin, an epoxy resin, etc. can be used, for example.

-Colored layer-
In the coloring layer 100, the formation method is not particularly limited, and for example, a known printing method such as offset printing, screen printing, or pad printing can be used. Here, the colored layer 100 is mainly composed of a color material component and a resin component, and is formed using ink in which these components are dissolved in a solvent. Here, as the color material component, known pigments and dyes can be used, and besides these, a metallic flake, a glittering inorganic pigment obtained by coating the surface of flake glass with metal and / or metal oxide, and the like can also be used. In addition, the thickness of the colored layer 100 is preferably 1.0 μm or more, and more preferably 1.5 μm or more, from a practical viewpoint such as ensuring the color density of the display unit 42 to improve design and visibility. Moreover, the upper limit of the thickness of the colored layer 100 is not particularly limited, but is practically preferably 10 μm or less. Further, the colored layer 100 in this embodiment has a light-transmitting property. Therefore, the transmittance of light in the visible light region of the colored layer 100 is preferably in the range of 10% to 60%.

  Further, the colored layer 100 may have the same configuration as the concealment layer 30 described above. That is, the colored layer 100 may be formed using the same ink as the above-described masking layer 30, and the thickness of the colored layer 100 may be the same as that of the above-described masking layer 30. When the colored layer 100 is formed in this way, the color played by the hiding layer 30 is more emphasized.

(Key panel and electronic equipment)
The key panel of the present embodiment includes at least the operation switch member 10 of the present embodiment. Here, in the present specification, the “key panel” refers to an operation panel having an operation switch. The key panel may be a key panel that operates by pressing a key part, or may be a key panel (so-called touch panel) that operates by touching the key part. Further, the key panel may be provided integrally with the electronic device main body to be operated by the switch operation, or physically provided separately from the electronic device main body to be operated by the switch operation. It may be a thing. In the latter case, the key panel and the electronic device may be a wired type, or the key panel and the electronic device may be a wireless type capable of exchanging signals by infrared communication or the like. Good. The use of the electronic device of the present embodiment is not particularly limited as long as the electronic device has the above-described key panel integrally with the main body of the electronic device.

  An example of such an electronic device is illustrated in FIG. FIG. 12 is an external view showing an example of the electronic apparatus of the present embodiment, specifically a diagram showing a mobile phone. A cellular phone 300 shown in FIG. 12 includes a display portion 302 and a main body portion 304 having a key panel provided with the operation switch member 10 of the present embodiment.

  Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to the following examples. Further, in the following description, the case where the protective layer 50 is formed on the operation surface 20A of the key top 20 is described. However, in Example 1 to Comparative Example 1, the protective layer is formed on the operation surface 20A of the key top 20. Evaluation was performed for both the case of forming 50 and the case of not forming the protective layer 50.

Example 1
An operation switch member 10B having the layer configuration shown in FIG. 1 was produced by the following procedure. First, an ultraviolet curable acrylic resin (UV resin) is coated on the operation surface 20A of the key top 20 (made of polycarbonate resin (PC resin), thickness 0.5 mm), and irradiated with ultraviolet rays to have a thickness of 10.0 μm. A protective layer 50 was formed. Next, on the non-operation surface 20B of the key top 20, C.I. I. Pigment blue 15 and C.I. I. The masking layer 30 was formed with ink containing Pigment Black 1. The ink solvent was acrylic resin, and the thickness of the formed concealing layer 30 was 5 μm. Further, the light transmittance of the concealing layer 30 was 7%, the transmitted color was blue, and the reflected color was black.

  Next, an ultraviolet curable acrylic resin (UV resin) was applied onto the masking layer 30 and irradiated with ultraviolet rays to form a base buffer layer 80 (undercoat) having a thickness of 10.0 μm. Next, a light shielding layer 40 made of Al was formed on the base buffer layer 80 by PVD. The thickness of the light shielding layer 40 at this time was 0.1 μm. Further, an ultraviolet curable acrylic resin (UV resin) was coated on the light shielding layer 40, and an intermediate buffer layer 90 (middle coat) having a thickness of 10.0 μm was formed by irradiating with ultraviolet rays.

  Subsequently, the colored layer 100 was formed on the intermediate buffer layer 90. The colored layer 100 was formed using the same ink as the above-described hiding layer 30, and the thickness and light transmittance of the formed colored layer 100 were the same as those of the hiding layer 30. Furthermore, the base sheet 70 was bonded to the colored layer 100 via an adhesive layer 60 formed by application of a cyanoacrylate adhesive. The base sheet 70 is made of silicone rubber having a thickness of 0.5 mm. Moreover, the thickness of the adhesive layer 60 by application | coating of a cyanoacrylate type adhesive was 50.0 micrometers.

Subsequently, a laser beam was irradiated from the key top 20 side of this semi-finished product, laser processing was performed, and the display unit 42 was formed. Thus, an operation switch member 10B having the layer configuration shown in FIG. 4 was obtained. In laser processing, a YVO ₄ laser (wavelength 1064 nm) was used as the laser light source, the laser power was set to 3 W, and the beam diameter was set to 0.06 mm.

(Example 2)
Example 2 is the same as Example 1 except for the hiding layer 30, the light shielding layer 40, and the colored layer 100. Here, in Example 2, the concealing layer 30 was formed by performing screen printing on the non-operation surface 20B of the key top 20, but in this screen printing, C.I. I. Pigment red 149 and C.I. I. The masking layer 30 was formed with ink containing Pigment Black 1. The thickness of the masking layer 30 was 5 μm. Further, the light transmittance of the concealing layer 30 was 7%, the transmitted color was red, and the reflected color was black. The colored layer 100 is also formed using the same ink as the masking layer 30, and the thickness and light transmittance of the colored layer 100 are the same as those of the masking layer 30.

  In Example 2, the light shielding layer 40 made of Sn was formed on the base buffer layer 80 by PVD. At this time, the thickness of the light shielding layer 40 made of Sn was 0.02 μm.

(Example 3)
Example 3 is the same as Example 1 except for the hiding layer 30, the light shielding layer 40, and the colored layer 100. Here, in Example 3, the concealing layer 30 was formed by performing screen printing on the non-operation surface 20B of the key top 20, but in this screen printing, C.I. I. Pigment yellow 12 and C.I. I. The masking layer 30 was formed with ink containing Pigment Black 1. The thickness of the masking layer 30 was 5 μm. Further, the light transmittance of the concealing layer 30 was 7%, the transmitted color was yellow, and the reflected color was black. The colored layer 100 is also formed using the same ink as the masking layer 30, and the thickness and light transmittance of the colored layer 100 are the same as those of the masking layer 30.

  In Example 3, the light shielding layer 40 made of In was formed on the base buffer layer 80 by PVD. At this time, the thickness of the light shielding layer 40 made of In was 0.02 μm.

Example 4
Example 4 is the same as Example 1 except for the hiding layer 30, the light shielding layer 40, and the colored layer 100. Here, in Example 4, the concealing layer 30 was formed by screen printing on the non-operation surface 20B of the key top 20, but in this screen printing, C.I. I. Pigment Green 7 and C.I. I. The masking layer 30 was formed with ink containing Pigment Black 1. The thickness of the masking layer 30 was 5 μm. Further, the light transmittance of the concealing layer 30 was 7%, the transmitted color was green, and the reflected color was black. The colored layer 100 is also formed using the same ink as the masking layer 30, and the thickness and light transmittance of the colored layer 100 are the same as those of the masking layer 30.

  In Example 4, the light shielding layer 40 made of an In—Sn alloy was formed on the base buffer layer 80 by PVD. At this time, the thickness of the light shielding layer 40 made of the In—Sn alloy was 0.02 μm.

(Example 5)
Example 5 is the same as Example 1 except for the hiding layer 30 and the light shielding layer 40. Here, in Example 5, the masking layer 30 was formed by performing screen printing on the non-operation surface 20B of the key top 20, but in this screen printing, the masking layer 30 was made of ink containing titanium oxide as a pigment. Formed. The thickness of the masking layer 30 was 5 μm. Further, the light transmittance of the masking layer 30 was 7%, the transmitted color was white, and the reflected color was white. The colored layer 100 is also formed using the same ink as that of the masking layer 30, and the thickness of the colored layer 100 and the light transmittance are the same as those of the masking layer 30.

  Further, in Example 5, the light shielding layer 40 made of Al was formed on the base buffer layer 80 by PVD. At this time, the thickness of the light shielding layer 40 made of Al was 0.1 μm.

(Comparative Example 1)
Also in the comparative example 1, it is the same as that of Example 1 except the masking layer 30. FIG. Here, in Comparative Example 1, the masking layer 30 was formed by performing screen printing on the non-operation surface 20B of the key top 20, but in this screen printing, the masking layer 30 was made of ink containing titanium oxide as a pigment. Formed. The thickness of the masking layer 30 was 5 μm. Further, the light transmittance of the concealing layer 30 was 7%, the transmitted color was black, and the reflected color was black. The colored layer 100 is also formed using the same ink as that of the masking layer 30, and the thickness of the colored layer 100 and the light transmittance are the same as those of the masking layer 30.

(Comparative Example 2)
Also in the comparative example 2, it is the same as that of Example 1 except the light shielding layer 40. FIG.

  In Comparative Example 2, the light shielding layer 40 was formed by screen printing on the base buffer layer 40 with an ink containing carbon as a pigment. The thickness of the light shielding layer 40 at this time was 5 μm.

(Evaluation)
About the member for operation switches of each Example and a comparative example, the display part 42 which can confirm all visually clearly was formed. Table 1 shows the results of evaluating the light shielding properties and the generation of by-products for the operation switch members of the examples and comparative examples. In any of the operation switch members of Examples and Comparative Examples, it was confirmed that the light transmittance of the display unit 42 irradiated with the laser light was improved so as to transmit the illumination light.

  In addition, the evaluation method and evaluation criteria of each evaluation item shown in Table 1 are as follows.

-Light shielding property-
Regarding the light shielding property, whether or not the irradiated part in the concealing layer 30 has the light shielding property even after the surface of the key switch side of the operation switch member is visually observed in a room under fluorescent lamp illumination and irradiated with the laser beam. Evaluated whether or not. The evaluation criteria are as follows.
A: The irradiated part has a light-shielding property without being changed by laser light irradiation.
B: Although it can be confirmed that the light-shielding property is inferior due to the alteration, it is greatly reduced as compared with the comparative example, and is a level that cannot be visually recognized unless particular attention is paid.
C: It is a level at which it can be visually recognized that the light-shielding property is inferior due to alteration without particular attention.

-Generation of by-products-
Regarding the generation of by-products, visually observe the key top side of the operation switch member to confirm the generation of gas (occurrence of blistering), and visually observe whether or not wrinkles are generated. Even after the irradiation, it was evaluated whether or not the irradiation site in the masking layer 30 had a light shielding property. The evaluation criteria are as follows.
A: The occurrence of swelling and wrinkles are hardly visible by visual inspection.
B: Although the occurrence of blistering and / or wrinkles is slightly visible, it is greatly reduced compared to the comparative example, and is a level that cannot be visually recognized unless special care is taken.
C: A level at which occurrence of blistering and / or wrinkles can be visually recognized without particular attention.

DESCRIPTION OF SYMBOLS 10, 10A-10F ... Operation switch member 20 ... Key top 20A ... Operation surface 20B ... Non-operation surface 20C ... Side surface 30 ... Concealment layer 32 ... Colored part 40 ... Light shielding layer 42 ... Display part 50 ... Protective layer 60 ... Adhesive layer 70 ... Base sheet 80 ... Base buffer layer 90 ... Intermediate buffer layer 100 ... Colored layer 200 ... Mold device 201 ... Mold convex mold 202 ... Mold concave mold 210 ... Injection molding machine 220 ... Mold print 221 ... Convex portion 300 ... Mobile Telephone 302 ... Display part 304 ... Main part H ... Semi-finished product H1 ... Projection H2 ... Part H3 ... Core part L ... Light source M ... Dome-shaped member P ... Circuit board S ... Presser

Claims (9)

A shielding layer, and a light shielding layer disposed on the back side of the shielding layer,
The concealing layer is formed of a material having transparency that transmits laser light of a predetermined wavelength, and the visibility when the light shielding layer is viewed from the surface side of the concealing layer is reduced as compared with a transparent material. Let
An operation switch member characterized by that. The operation switch member according to claim 1,
The light-shielding layer is a material that improves light transmittance more than before irradiation when the laser light is irradiated from the surface side of the concealing layer, and is made of at least one of carbon and iron oxide. Is formed from a material that suppresses the generation of at least one of gas and soot, compared to the case of including as,
Further, irradiation of the laser light from the surface side of the concealing layer alters the laser light irradiation site in the light shielding layer, and the alteration causes light transmission in the visible light region more than other parts of the light shielding layer. A display unit is formed to improve the rate,
An operation switch member characterized by that. The operation switch member according to claim 1 or 2,
The laser beam of the predetermined wavelength is a 1064 nm laser beam,
An operation switch member characterized by that. The operation switch member according to any one of claims 1 to 3,
The concealing layer includes C.I. I. Pigment blue 15, C.I. I. Pigment red 149, C.I. I. Pigment red 144, C.I. I. Pigment yellow 12, C.I. I. Pigment black 1, C.I. I. Pigment violet 23, C.I. I. Pigment orange 5, C.I. I. The pigment green 7 contains at least one organic pigment and / or the shielding layer has a total content of iron oxide and carbonaceous powder contained in the shielding layer of more than 0% by weight and more than 30%. Is
An operation switch member characterized by that. The operation switch member according to any one of claims 1 to 3,
The light shielding layer is formed of In, Sn, In—Sn alloy or Al, and the film thickness thereof is in the range of 0.02 μm to 0.3 μm.
An operation switch member characterized by that. The operation switch member according to any one of claims 1 to 4,
Between the concealing layer and the light shielding layer, a first transparent resin layer having a light-transmitting property and improving the adhesion between them is provided,
A colored layer colored by a color material component is disposed on the back side of the light shielding layer,
Between the light-shielding layer and the colored layer, a second transparent resin layer having a translucency is provided while improving adhesion between them.
An operation switch member characterized by that.   A key panel comprising the operation switch member according to claim 1. An operation switch member according to any one of claims 1 to 7, further comprising:
A light source is provided on the back side of the light shielding layer.
An electronic device characterized by that. A manufacturing method for manufacturing a member for an operation switch having a shielding layer and a light shielding layer disposed on a back surface side of the shielding layer,
When the light shielding layer side is seen from the surface side of the concealing layer compared to a transparent material, and is formed on the surface side of the concealing layer from a material having transparency that transmits laser light of a predetermined wavelength A concealing layer forming step of forming the concealing layer to reduce the visibility of
When the back surface side of the concealing layer is irradiated with the laser light from the surface side of the concealing layer, the light transmittance is improved as compared to before irradiation, and at least one of carbon and iron oxide is added. The light-shielding layer is formed by physical vapor deposition or sputtering of In, Sn, In-Sn alloy or Al, which is a non-translucent light-shielding layer that suppresses the generation of at least one of gas and soot as compared with the case of including as a material. A layer forming step;
Laser light is applied to a part of the light shielding layer from the surface side of the concealing layer, and the irradiated part is altered, so that the light transmittance in the visible light region is higher than the other part of the light shielding layer. A laser beam irradiation step for forming a display unit for improving
To produce a member for an operation switch.

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